Device for automatic edge searching and positioning and thickness measurement of wafer

Abstract

The invention discloses a device for wafer automatic edge searching positioning and thickness measurement, which comprises a mounting rack, a horizontal moving assembly, a vertical moving assembly, a driving motor, a wafer suction cup, a laser micrometer and a thickness measurement mechanism, and is characterized in that the horizontal moving assembly is arranged on the mounting rack, and the vertical moving assembly is arranged on a moving mechanism of the horizontal moving assembly; the driving motor is installed on a moving mechanism of the vertical moving assembly. The wafer suction cup is arranged on the top of the rotating shaft. The two sides of the wafer suction cup are respectively provided with a wafer placing strip, and the laser micrometer and the thickness measuring mechanism are both installed on the installation frame. The wafer edge searching and positioning device has the technical effects that wafers of various sizes can be compatible, automatic edge searching and positioning of the wafers can be realized, and the centers of the wafers and the positions of the cut edges or the grooves of the wafers can be quickly determined; meanwhile, the laser micrometer and the wafer suction cup are matched for use, so that the positioning precision is greatly improved; by arranging the thickness measuring mechanism, one device can measure the thickness of the wafer at the same time, and space and cost can be saved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer center confirmation and thickness measurement, and particularly relates to a device for automatic edge finding and positioning and thickness measurement of wafers. Background Art

[0002] Semiconductor technology is accelerating its penetration into traditional industries such as healthcare, energy, and agriculture, providing support for the intelligent and digital transformation of these industries. The third-generation semiconductor materials represented by silicon carbide (SiC) and gallium nitride (GaN) are developing rapidly, showing significant advantages in high-temperature, high-frequency, and high-power application scenarios, and are gradually being widely applied in related fields. At the same time, there are situations where wafers of multiple specifications such as 4 inches, 6 inches, 8 inches, and 12 inches are produced on the same production line. In the process of chip manufacturing, the consistency of wafer size has an important impact on the subsequent manufacturing process. Therefore, in the manufacturing process of wafers, the self-center positioning and thickness measurement of wafers become the key. The wafer positioning devices in the prior art usually adopt a clamping style, resulting in the need for a clamping mold for wafers of different diameter sizes, with poor compatibility, complex structure, difficult to guarantee accuracy, unable to determine the direction of the wafer after positioning, unable to be directly used in combination with wafer manufacturing equipment, and the existing mechanism cannot perform thickness measurement simultaneously. Summary of the Invention

[0003] Therefore, the present invention provides a device for automatic edge finding and positioning and thickness measurement of wafers to solve the above problems in the prior art.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] According to a first aspect of the present invention, a device for automatic edge finding and positioning and thickness measurement of wafers includes a mounting frame, a horizontal moving component, a vertical moving component, a driving motor, a wafer suction cup, a laser micrometer, and a thickness measurement mechanism. The horizontal moving component is arranged on the mounting frame, the vertical moving component is installed on the moving mechanism of the horizontal moving component, the driving motor is installed on the moving mechanism of the vertical moving component, and the rotation axis of the driving motor is arranged vertically upward. The wafer suction cup is arranged at the top of the rotation axis. On both sides of the wafer suction cup, there is a wafer placement strip respectively. The wafer placement strips are arranged along the horizontal moving direction of the horizontal moving component, and the two wafer placement strips are symmetrically arranged along the axis of the wafer suction cup.

[0006] The laser micrometer and the thickness measuring mechanism are both installed on the mounting frame, and are both located above the vertical moving component, and are both located at the end of the horizontal moving direction of the horizontal moving component. The laser micrometer is used to measure and determine the edge position information of the wafer during its rotation, and use the edge position information of the wafer to stop the wafer at a fixed angle so that the offset of the entire center of the wafer is located in the horizontal moving direction of the horizontal moving component, and at the same time determine the horizontal moving distance required for the wafer suction cup to move to the center of the wafer; the thickness measuring mechanism is used to measure the thickness of the wafer.

[0007] Furthermore, the laser micrometer comprises a signal transmitting end and a signal receiving end, a gap is provided between the signal transmitting end and the signal receiving end, and the signal transmitting end and the signal receiving end are installed opposite to each other.

[0008] Further, the thickness measuring mechanism comprises a second telescopic cylinder and a displacement sensor, the second telescopic cylinder is arranged on the mounting frame, and the telescopic rod of the second telescopic cylinder is arranged vertically downward;

[0009] The displacement sensor includes an upper contact point and a lower contact point, wherein the lower contact point is arranged on the mounting frame, and the lower contact point and the top of the wafer placement bar are located in the same plane; the upper contact point is located above the lower contact point, and the upper contact point is installed on the telescopic rod of the second telescopic cylinder.

[0010] Furthermore, the horizontal moving assembly includes a screw module, a slide rail and a horizontal moving plate, there are two slide rails, and the two slide rails are respectively arranged parallel to each other along the length direction of the mounting frame; the horizontal moving plate is slidably set on the slide rail, the screw module is installed on the mounting frame, and the screw module is used to drive the horizontal moving plate to move along the slide rail.

[0011] Furthermore, the screw module includes a servo motor, a screw nut and a screw body, the servo motor is arranged on the mounting frame, the screw body and the slide rail are arranged parallel to each other, the output shaft of the servo motor is transmission-connected to the screw body, the screw nut is threadedly connected to the screw body, and the screw nut is installed on the horizontal moving plate.

[0012] Further, the vertical moving assembly comprises a first telescopic cylinder, a lifting platform and a mounting plate, the first telescopic cylinder is mounted on the horizontal moving plate, and the telescopic rod of the first telescopic cylinder is arranged vertically upward;

[0013] The mounting plate is arranged on the horizontal moving plate. A guide rail is provided on the mounting plate. The guide rail is arranged vertically. The lifting table is slidably connected to the guide rail, and the lifting table is located above the horizontal moving plate. The telescopic rod of the first telescopic cylinder is connected to the lifting table.

[0014] Further, the mounting frame includes a lower support plate, an upper support plate and a column. The upper support plate is arranged above the lower support plate. A plurality of the columns are provided between the upper support plate and the lower support plate.

[0015] Further, a strip-shaped hole is provided on the upper support plate. The strip-shaped hole is arranged along the length direction of the upper support plate and penetrates through the upper support plate. The two wafer placement strips are respectively arranged in parallel on both sides of the strip-shaped hole.

[0016] Further, it further includes a side plate and a shock pad. The side plate is arranged between the upper support plate and the lower support plate. A plurality of the shock pads are provided at the bottom of the lower support plate.

[0017] Further, an arc step is provided at the top of the wafer placement strip. The arc step is used to realize the manual positioning and placement of the wafer.

[0018] The present invention has the following advantages: The horizontal moving component, the vertical moving component, the driving motor, the wafer suction cup and the laser micrometer are used in cooperation with each other, which can be compatible with wafers of various sizes, can realize the rapid automatic edge finding and positioning of the wafer, and can quickly determine the center of the wafer itself and the position of the wafer cutting edge or groove; at the same time, the cooperation of the laser micrometer and the wafer suction cup is used to replace the existing mechanical clamping for wafer positioning, which greatly improves the positioning accuracy; by setting the thickness measuring mechanism, a device can simultaneously measure the thickness of the wafer, which can save space and cost. Description of the Drawings

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings described below are only exemplary. For those of ordinary skill in the art, without creative efforts, other implementation drawings can also be obtained according to the provided drawings.

[0020] The structures, ratios, sizes, etc. illustrated in this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limited conditions under which the present invention can be implemented. Therefore, they do not have technical essence. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in the present invention.

[0021] Figure 1 The first perspective view after removing the side plates of a device for automatic edge finding, positioning and thickness measurement of wafers provided in some embodiments of the present invention.

[0022] Figure 2 The second perspective view after removing the side plates of a device for automatic edge finding, positioning and thickness measurement of wafers provided in some embodiments of the present invention.

[0023] Figure 3 The third perspective view after removing the side plates of a device for automatic edge finding, positioning and thickness measurement of wafers provided in some embodiments of the present invention.

[0024] Figure 4 The partial structural schematic diagram after removing the side plates of a device for automatic edge finding, positioning and thickness measurement of wafers provided in some embodiments of the present invention.

[0025] Figure 5 The first perspective view of a device for automatic edge finding, positioning and thickness measurement of wafers provided in some embodiments of the present invention.

[0026] Figure 6 The second perspective view of a device for automatic edge finding, positioning and thickness measurement of wafers provided in some embodiments of the present invention.

[0027] Figure 7 The structural schematic diagram of the mechanism installed on the upper support plate of a device for automatic edge finding, positioning and thickness measurement of wafers provided in some embodiments of the present invention.

[0028] Figure 8 The structural schematic diagram of the mechanism installed on the lower support plate of a device for automatic edge finding, positioning and thickness measurement of wafers provided in some embodiments of the present invention.

[0029] In the figure: 1. Lower support plate, 2. Horizontal moving plate, 3. First telescopic cylinder, 4. Driving motor, 5. Wafer suction cup, 6. Upper support plate, 7. Wafer placement strip, 8. Laser micrometer, 9. Second telescopic cylinder, 10. Displacement sensor, 11. Rotating shaft, 12. Strip-shaped hole, 13. Lead screw module, 14. Column, 15. Slide rail, 16. Shock pad, 17. Side plate, 18. Arc step, 19. Servo motor, 20. Lead screw nut, 21. Lead screw body, 22. Mounting plate, 23. Guide rail, 24. Lifting table. Detailed implementation manners

[0030] The following specific embodiments illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0031] Embodiment 1

[0032] As Figures 1 to 8 shown, a device for automatic edge finding and positioning and thickness measurement of wafers in the first aspect embodiment of the present invention includes a mounting frame, a horizontal moving assembly, a vertical moving assembly, a driving motor 4, a wafer suction cup 5, a laser micrometer 8, and a thickness measuring mechanism. The horizontal moving assembly is arranged on the mounting frame, the vertical moving assembly is installed on the moving mechanism of the horizontal moving assembly, the driving motor 4 is a DDR motor (direct drive rotary motor), the driving motor 4 is installed on the moving mechanism of the vertical moving assembly, and the rotating shaft 11 of the driving motor 4 is arranged vertically upward. The wafer suction cup 5 is arranged at the top of the rotating shaft 11. The device rotating shaft uses a DDR motor and is directly connected to the rotating shaft 11, simplifying the transmission mechanism, making the measurement accuracy higher and the stability stronger. On both sides of the wafer suction cup 5, there is respectively a wafer placement strip 7. The wafer placement strip 7 is arranged along the horizontal moving direction of the horizontal moving assembly, and the two wafer placement strips 7 are symmetrically arranged along the axis of the wafer suction cup 5. At the top of each wafer placement strip 7, there is an arc step 18. The outer contour of the arc step 18 is adapted to the outer contour of the wafer. The arc steps 18 on the two wafer placement strips 7 together form a wafer positioning and placement station. After placing the wafer on the tops of the two wafer placement strips 7 and fitting the edge of the wafer to the arc step 18, the manual positioning and placement of the wafer can be realized, and the center of the wafer can be roughly on the symmetry line of the two wafer placement strips 7. Specifically, at the top of each wafer placement strip 7, there are multiple arc steps 18. The multiple arc steps 18 are arranged in sequence along the length direction of the wafer placement strip 7. The radian of each arc step 18 is different, and the radian of each arc step 18 is set according to wafers of different sizes. Each arc step 18 is used to place a wafer under a certain fixed size.

[0033] The laser micrometer 8 and the thickness measuring mechanism are both installed on the mounting frame. The laser micrometer 8 and the thickness measuring mechanism are both located above the vertical moving assembly, and both the laser micrometer 8 and the thickness measuring mechanism are located at the end of the horizontal moving direction of the horizontal moving assembly. The laser micrometer 8 is used to measure and determine the edge position information of the wafer during rotation, and use the edge position information of the wafer to stop the wafer at a fixed angle so that the offset of the overall center of the wafer is located in the horizontal moving direction of the horizontal moving assembly (corresponding to the X-axis direction), and at the same time determine the horizontal moving distance required for the wafer chuck 5 to move to the center of the wafer.

[0034] The specific principle of the laser micrometer 8 to determine the center of the wafer itself using the edge position information of the wafer is as follows: The wafer chuck 5 drives the wafer to move to the preset position of the center of the wafer of the corresponding specification. At this time, the outer contour of the wafer is just within the detection range of the laser micrometer 8. The wafer chuck 5 drives the wafer to rotate. The laser micrometer 8 uses the CCD measurement method to scan multiple points (at least three points) on the outer contour of the wafer, and uses the three-point method to confirm the center of the circle to calculate and determine the actual center coordinates of the wafer through the coordinate positions of the sampling points. Then, the included angle between the line connecting the actual center coordinates of the wafer and the rotation axis of the wafer chuck 5 and the X-axis direction is obtained, and the wafer chuck 5 is rotated by the corresponding angle to rotate the actual center of the wafer onto the X-axis. Subsequently, the wafer chuck 5 releases the vacuum, releases the wafer on the wafer placement strip 7, then the wafer chuck 5 moves along the X-axis direction so that the center of the wafer chuck 5 is coaxial with the center of the wafer. Finally, the wafer chuck 5 rises and adsorbs the wafer, and the concentric positioning of the wafer and the wafer chuck 5 can be completed.

[0035] After the center positioning of the wafer is completed, the wafer chuck 5 drives the wafer back to the preset position of the wafer of the corresponding specification. The wafer chuck 5 drives the wafer to rotate, and the laser micrometer 8 scans the outer periphery of the wafer to determine the position of the flat or notch of the wafer through the change of the outer periphery position of the wafer.

[0036] The thickness measuring mechanism is used to measure the thickness of the wafer.

[0037] In this embodiment, it should be noted that the horizontal moving assembly is used to realize the movement of the wafer chuck 5 in the X-axis direction, and the vertical moving assembly is used to realize the movement of the wafer chuck 5 in the Z-axis direction. The wafer chuck 5 adds movement in the Z direction. Through the pick-and-place action and combined with the horizontal movement in the X direction, the center alignment can be realized. Compared with the alignment by moving in the X / Y direction, the structure is simple and easy to adjust. After the adjustment is completed, the wafer and the wafer chuck 5 can be made concentric, which is convenient for reducing the influence of the large concentricity error when the subsequent manipulator picks and places the wafer; by adding the X-axis horizontal movement axis of the wafer chuck 5, wafers of various specifications and sizes can be compatible; the wafer chuck 5 adds movement in the Z direction, which can realize the compatibility of multiple specifications and sizes during manual wafer placement.

[0038] The working principle of the entire device is as follows: In the initial state, the vertical moving component descends, lowering the driving motor 4 together with the wafer suction cup 5 so that the wafer suction cup 5 is located below the wafer placement bar 7. The wafer is placed manually or using a robotic arm on the wafer positioning placement station on the wafer placement bar 7. Then, the horizontal moving component is used to move the wafer suction cup 5 directly below the wafer. The vertical moving component rises to lift the wafer suction cup 5, and at the same time, the wafer suction cup 5 sucks vacuum to adsorb and fix the wafer. The vertical moving component continues to rise to move the wafer above the wafer placement bar 7. The horizontal moving component moves the wafer suction cup 5 horizontally towards the laser micrometer 8 until the edge of the wafer on the wafer suction cup 5 moves to the measurement station of the laser micrometer 8. Then, the driving motor 4 drives the wafer suction cup 5 to rotate through the rotating shaft 11. The laser micrometer 8 performs multi-point detection on the edge position of the wafer, detects the offset of multiple points relative to the rotating shaft 11, and adjusts the wafer center offset to the horizontal moving direction of the horizontal moving component according to the offset. Then, the wafer suction cup 5 breaks the vacuum, and at the same time, the vertical moving component descends to place the wafer on the wafer placement bar 7. Immediately afterwards, based on the known horizontal offset of the wafer center, the horizontal moving component is used to horizontally move the wafer suction cup 5 by the corresponding horizontal offset of the wafer center to reach directly below the wafer center. Then, the vertical moving component is used to rise, and the wafer suction cup 5 rises in a vacuum-sucking state to adsorb and fix the wafer. At this time, it can be ensured that the wafer center is consistent with the center of the wafer suction cup 5. Finally, the horizontal moving component horizontally moves the wafer suction cup 5 so that the wafer is in the measurement station of the thickness measurement mechanism, and the thickness of the wafer can be measured.

[0039] The technical effects achieved in this embodiment are as follows: The horizontal moving component, the vertical moving component, the driving motor 4, the wafer suction cup 5, and the laser micrometer 8 cooperate with each other and can be compatible with wafers of various sizes. It can achieve rapid automatic edge finding and positioning of the wafer, and can quickly determine the center of the wafer itself and the position of the wafer cutting edge or groove. At the same time, the cooperation of the laser micrometer 8 and the wafer suction cup 5 is used instead of the existing mechanical clamping for wafer positioning, greatly improving the positioning accuracy. By setting up the thickness measurement mechanism, a single device can simultaneously measure the thickness of the wafer, saving space and cost.

[0040] Embodiment 2

[0041] As Figures 1 to 8 shown, another device for wafer automatic edge finding and positioning and thickness measurement provided in this embodiment has a structure including all the contents of Embodiment 1. Only the different parts will be described below.

[0042] In this embodiment, the laser micrometer 8 is a CCD laser micrometer. The laser micrometer 8 includes a signal transmitting end and a signal receiving end. There is a gap between the signal transmitting end and the signal receiving end, and the signal transmitting end and the signal receiving end are installed opposite to each other. Specifically, the signal transmitting end is located directly above the signal receiving end, and the height of the gap between the signal transmitting end and the signal receiving end is 10 mm to 20 mm. The wafer is moved into this gap by the horizontal moving component. By driving the rotation of the wafer by the driving motor 4 and the wafer chuck 5, and picking up and placing the wafer by the vertical moving component and the wafer chuck 5, the center of the wafer can be positioned.

[0043] In this embodiment, it should be noted that the thickness measuring mechanism includes a second telescopic cylinder 9 and a displacement sensor 10. The second telescopic cylinder 9 is arranged on the mounting frame, and the telescopic rod of the second telescopic cylinder 9 is arranged vertically downward.

[0044] The displacement sensor 10 includes an upper contact point and a lower contact point. The lower contact point is arranged on the mounting frame, and the lower contact point and the top of the wafer placement strip 7 are in the same plane; the upper contact point is located above the lower contact point, and the upper contact point is installed on the telescopic rod of the second telescopic cylinder 9. There is an 8-mm gap between the upper contact point and the lower contact point. The wafer is moved into this gap by the horizontal moving component. The wafer is placed on the lower contact point of the sensor by the vertical moving component. The upper contact point contacts the upper surface of the wafer through the telescopic movement of the second telescopic cylinder 9, and then the thickness of the wafer can be measured.

[0045] Embodiment 3

[0046] As Figures 1 to 8 shown, another device for automatic edge finding and positioning and thickness measurement of wafers provided in this embodiment has a structure including all the contents of Embodiment 1. Only the different parts will be described below.

[0047] In this embodiment, the horizontal moving component includes a lead screw module 13, a slide rail 15 and a horizontal moving plate 2. There are two slide rails 15, and the two slide rails 15 are arranged parallel to each other along the length direction of the mounting frame; the horizontal moving plate 2 is slidably arranged on the slide rail 15. The lead screw module 13 is installed on the mounting frame, and the lead screw module 13 is used to drive the horizontal moving plate 2 to reciprocate along the slide rail 15, so as to arbitrarily change the distance between the wafer and the laser micrometer and the thickness measuring mechanism, and can be compatible with the positioning measurement of wafers with sizes from 6 inches to 12 inches.

[0048] In this embodiment, it should be noted that the lead screw module 13 includes a servo motor 19, a lead screw nut 20, and a lead screw body 21. The servo motor 19 is arranged on the mounting frame. The lead screw body 21 is arranged parallel to the slide rail 15, and the lead screw body 21 is arranged along the symmetry line of the two slide rails 15. The output shaft of the servo motor 19 is drivingly connected to one end of the lead screw body 21, and the other end of the lead screw body 21 is rotationally connected to the mounting frame through a mounting seat. The lead screw nut 20 is threadedly connected to the lead screw body 21, and the lead screw nut 20 is mounted on the horizontal moving plate 2. During use, the servo motor 19 can drive the horizontal moving plate 2 to perform a linear reciprocating motion along the slide rail 15 by controlling the forward or reverse rotation of the lead screw body 21.

[0049] Further, the vertical moving assembly includes a first telescopic cylinder 3, a lifting table 24, and a mounting plate 22. The first telescopic cylinder 3 is mounted on the horizontal moving plate 2, and the telescopic rod of the first telescopic cylinder 3 is vertically upward;

[0050] The mounting plate 22 is arranged on the horizontal moving plate 2. A guide rail 23 is provided on the mounting plate 22, and the guide rail 23 is vertically arranged. The lifting table 24 is slidably connected to the guide rail 23, and the lifting table 24 is located above the horizontal moving plate 2. The telescopic rod of the first telescopic cylinder 3 is connected to the lifting table 24. The driving motor 4 is mounted on the lifting table 24. During use, the first telescopic cylinder 3 can drive the lifting table 24 to perform a reciprocating motion in the vertical direction by controlling the telescopic movement of the telescopic rod.

[0051] The technical effect achieved by this embodiment is that the horizontal moving assembly and the vertical moving assembly have simple structures and can accurately control the horizontal movement and vertical lifting of the wafer chuck 5.

[0052] Embodiment 4

[0053] As Figures 1 to 8 shown, another device for automatic wafer edge finding, positioning, and thickness measurement provided in this embodiment has a structure including all the contents of Embodiment 1. Only the different parts will be described below.

[0054] In this embodiment, the mounting frame includes a lower support plate 1, an upper support plate 6, and columns 14. The upper support plate 6 is arranged directly above the lower support plate 1. Both the upper support plate 6 and the lower support plate 1 are rectangular, and the upper support plate 6 and the lower support plate are arranged parallel to each other. A plurality of columns 14 are provided between the upper support plate 6 and the lower support plate 1. The two ends of each column 14 are respectively connected to the upper support plate 6 and the lower support plate 1; specifically, the number of columns 14 is four, and the four columns 14 are arranged in a rectangular distribution;

[0055] The upper support plate 6 is provided with a strip-shaped hole 12. The strip-shaped hole 12 is arranged along the length direction of the upper support plate 6 and penetrates through the upper support plate 6. Two wafer placement strips 7 are respectively arranged parallel to each other on both sides of the strip-shaped hole 12;

[0056] The upper support plate 6 and the lower support plate 1 form a double-layer structure. The horizontal moving assembly is installed on the top of the lower support plate 1, the vertical moving assembly is located between the lower support plate 1 and the upper support plate 6, and the laser micrometer 8 and the thickness measuring mechanism are both installed on the upper support plate 6.

[0057] In this embodiment, it should be noted that there are also side plates 17 and shock pads 16. The side plates 17 are arranged between the upper support plate 6 and the lower support plate 1. The side plates 17 enclose a chamber between the upper support plate 6 and the lower support plate 1. The column 14, the horizontal moving assembly and the vertical moving assembly are located in this chamber. For the convenience of maintenance, a cabinet door can be opened on the side plates 17. By arranging the side plates 17, the overall structure is more regular; a plurality of shock pads 16 are provided at the bottom of the lower support plate 1. Specifically, the number of shock pads 16 is four, and the four shock pads 16 are respectively arranged at the four corners of the bottom of the lower support plate 1. By arranging the shock pads 16, the whole device has shock absorption performance and can further ensure the detection accuracy.

[0058] Although the present invention has been described in detail above with general descriptions and specific embodiments, on the basis of the present invention, some modifications or improvements can be made, which are obvious to those skilled in the art. Therefore, these modifications or improvements made without departing from the spirit of the present invention all fall within the scope of protection required by the present invention.

[0059] The terms such as "upper", "lower", "left", "right", "middle" and the like cited in this specification are only for the convenience of clear description and are not used to limit the scope of implementation of the present invention. The change or adjustment of their relative relationship, without substantial change in technical content, should also be regarded as the scope of implementation of the present invention.

Claims

1. An apparatus for automatic edge finding and positioning and thickness measurement of a wafer, characterized in that, It includes a mounting frame, a horizontal moving component, a vertical moving component, a driving motor (4), a wafer chuck (5), a laser micrometer (8) and a thickness measuring mechanism. The horizontal moving component is arranged on the mounting frame. The vertical moving component is installed on the moving mechanism of the horizontal moving component. The driving motor (4) is installed on the moving mechanism of the vertical moving component, and the rotating shaft (11) of the driving motor (4) is vertically upward. The wafer chuck (5) is arranged at the top of the rotating shaft (11). On both sides of the wafer chuck (5), there is a wafer placement strip (7) respectively. The wafer placement strip (7) is arranged along the horizontal moving direction of the horizontal moving component, and the two wafer placement strips (7) are symmetrically arranged along the axis of the wafer chuck (5). The laser micrometer (8) and the thickness measuring mechanism are both installed on the mounting frame. The laser micrometer (8) and the thickness measuring mechanism are both located above the vertical moving component, and both are located at the end of the horizontal moving direction of the horizontal moving component. The laser micrometer (8) is used to measure and determine the edge position information of the wafer during rotation, and use the edge position information of the wafer to stop the wafer at a fixed angle so that the offset of the overall center of the wafer is located in the horizontal moving direction of the horizontal moving component, and at the same time determine the horizontal moving distance required for the wafer chuck (5) to move to the center of the wafer. The thickness measuring mechanism is used to measure the thickness of the wafer.

2. The device for automatic edge finding, positioning and thickness measurement of a wafer according to claim 1, characterized in that, The laser micrometer (8) includes a signal transmitting end and a signal receiving end. There is a gap between the signal transmitting end and the signal receiving end, and the signal transmitting end and the signal receiving end are oppositely installed.

3. A device for automatic edge finding, positioning and thickness measurement of a wafer according to claim 1, characterized in that, The thickness measuring mechanism includes a second telescopic cylinder (9) and a displacement sensor (10). The second telescopic cylinder (9) is arranged on the mounting frame, and the telescopic rod of the second telescopic cylinder (9) is vertically downward. The displacement sensor (10) includes an upper contact point and a lower contact point. The lower contact point is arranged on the mounting frame, and the lower contact point and the top of the wafer placement strip (7) are in the same plane. The upper contact point is located above the lower contact point, and the upper contact point is installed on the telescopic rod of the second telescopic cylinder (9).

4. A device for automatic edge finding, positioning and thickness measurement of a wafer according to claim 1, wherein, The horizontal moving component includes a lead screw module (13), a slide rail (15) and a horizontal moving plate (2). There are two slide rails (15), and the two slide rails (15) are arranged parallel to each other along the length direction of the mounting frame. The horizontal moving plate (2) is slidably arranged on the slide rail (15). The lead screw module (13) is installed on the mounting frame, and the lead screw module (13) is used to drive the horizontal moving plate (2) to move along the slide rail (15).

5. The device for automatic edge finding, positioning and thickness measurement of a wafer according to claim 4, wherein The lead screw module (13) includes a servo motor (19), a lead screw nut (20) and a lead screw body (21). The servo motor (19) is arranged on the mounting bracket. The lead screw body (21) is arranged parallel to the slide rail (15). The output shaft of the servo motor (19) is in transmission connection with the lead screw body (21). The lead screw nut (20) is in threaded connection with the lead screw body (21), and the lead screw nut (20) is mounted on the horizontal moving plate (2).

6. The device for automatic edge finding, positioning and thickness measurement of a wafer according to claim 4, wherein The vertical moving assembly includes a first telescopic cylinder (3), a lifting platform (24) and a mounting plate (22). The first telescopic cylinder (3) is mounted on the horizontal moving plate (2), and the telescopic rod of the first telescopic cylinder (3) is arranged vertically upward; The mounting plate (22) is arranged on the horizontal moving plate (2). A guide rail (23) is provided on the mounting plate (22). The guide rail (23) is arranged vertically. The lifting platform (24) is slidably connected with the guide rail (23), and the lifting platform (24) is located above the horizontal moving plate (2). The telescopic rod of the first telescopic cylinder (3) is connected with the lifting platform (24).

7. The device for automatic edge finding, positioning and thickness measurement of a wafer according to claim 1, characterized in that, The mounting bracket includes a lower support plate (1), an upper support plate (6) and columns (14). The upper support plate (6) is arranged above the lower support plate (1), and a plurality of the columns (14) are provided between the upper support plate (6) and the lower support plate (1).

8. A device for automatic edge finding, positioning and thickness measurement of a wafer according to claim 7, characterized in that, A strip-shaped hole (12) is provided on the upper support plate (6). The strip-shaped hole (12) is arranged along the length direction of the upper support plate (6) and penetrates through the upper support plate (6). Two wafer placement strips (7) are respectively arranged in parallel on both sides of the strip-shaped hole (12).

9. The device for automatic edge finding, positioning and thickness measurement of a wafer according to claim 8, wherein, It further includes side plates (17) and shock pads (16). The side plates (17) are arranged between the upper support plate (6) and the lower support plate (1), and a plurality of the shock pads (16) are provided at the bottom of the lower support plate (1).

10. The device for automatic edge finding, positioning and thickness measurement of a wafer according to claim 1, wherein, An arc step (18) is provided at the top of the wafer placement strip (7), and the arc step (18) is used for manual positioning and placement of the wafer.

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