Silicon wafer processing equipment and method for back-pressed silicon pressure sensitive chip

Abstract

The invention relates to the technical field of silicon wafer processing, in particular to silicon wafer processing equipment and method for a back-pressed silicon pressure sensitive chip, the silicon wafer processing equipment comprises conveying equipment and silicon wafer monomers, the conveying equipment is provided with a plurality of lower end flat plates, a plurality of upper end cover plates, a pushing plate and a plurality of rotating shielding plates, one lower-end flat plate, one upper-end cover plate and one rotary shielding plate form a group, and the lower-end flat plate and the pushing plate are both of a straight plate body structure; and the driving mechanism is arranged on one side of the conveying equipment, and the driving mechanism is used for driving the pushing plate to move transversely and vertically. When the silicon wafer single bodies are processed, the arc-shaped shielding block abuts against the arc-shaped end of the conveying belt in parallel, meanwhile, the rotating shielding plate is driven to rotate towards the conveying equipment, the silicon wafer single bodies are pushed to the lower end flat plate through the pushing plate, one silicon wafer single body is independently placed in a limited mode, and the situation that the silicon wafer single bodies are stacked together, so that the silicon wafer single bodies are stacked together is avoided. And the pressure detection performance of the silicon wafer monomer below is influenced.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer processing, and particularly relates to a silicon wafer processing device and method for a back-pressure silicon pressure-sensitive chip. Background Art

[0002] A pressure sensor is a device or apparatus that can sense a pressure signal and convert the pressure signal into an available output electrical signal according to a certain rule, and a pressure sensor usually consists of a pressure-sensitive element and a signal processing unit.

[0003] In the prior art, a pressure chip processing feeding and discharging device disclosed in CN113808984B is mostly adopted. This technology includes a base, a collection box, a palletizing assembly, and an ion blower assembly. Side plates are installed on both sides of the top of the base, two groups of transmission rollers are installed inside the side plates, a collection box is installed on one side of the base, a palletizing assembly is installed inside the collection box, and a gear disc is installed inside the palletizing assembly. In this technology, a belt is installed on one side of a linear motor, and the chip can be guided to slide down slowly through the belt, and then the chip is palletized one by one through a hydraulic telescopic rod, which can increase the stability of chip palletizing, make the chips neater during palletizing, and can avoid damage to the chips due to impact during palletizing. However, there are still problems in the use process due to structural limitations in the above technology: After the existing silicon wafer pressure chips are processed, the silicon wafer pressure chips are conveyed to the stacking place through a conveyor belt, and the stacking place is located below the conveyor belt, so that the silicon wafer pressure chips fall to the stacking place in a free-fall manner, which is extremely easy to cause damage to the silicon wafer pressure chips. If the stacking place is flush with the conveyor belt for conveying, due to the arc end at the end of the conveyor belt, there is a gap between the stacking place and the conveyor belt, which is likely to cause the silicon wafer pressure chips to be stuck in the gap. Moreover, during the existing stacking process, multiple silicon wafer pressure chips are stacked together, which makes the weights of multiple silicon wafer pressure chips concentrate on the silicon wafer pressure chip at the bottom. And the silicon wafer pressure chips generate different resistance values due to different pressure deformations, so that the silicon wafer pressure chip at the bottom is in a pressure deformation state for a long time. When it is taken out and installed later, the silicon wafer pressure chip is not easy to return to the initial state, resulting in a relatively slow induction of the silicon wafer pressure chip to pressure changes, and thus affecting the pressure detection performance of the silicon wafer pressure chip. Summary of the Invention

[0004] The purpose of the present invention is to solve the problem in the prior art that multiple silicon wafer pressure chips are stacked together through a conveyor belt, which affects the pressure detection performance of the silicon wafer pressure chip at the bottom, and to propose a silicon wafer processing device and method for a back-pressure silicon pressure-sensitive chip.

[0005] In order to achieve the above-mentioned object, the present invention adopts the following technical solution: a silicon wafer processing device for a back-pressured silicon pressure sensitive chip, comprising a conveying device and a silicon wafer monomer, wherein the conveying device is provided with: A plurality of lower flat plates, a plurality of upper cover plates, a push plate and a plurality of rotating shield plates, wherein one lower flat plate, one upper cover plate and one rotating shield plate form a group, the lower flat plate and the push plate are both straight plate structures, the upper cover plate is an L-shaped plate structure, and the rotating shield plate is a semi-I-shaped plate structure; A driving mechanism, which is arranged on one side of the conveying device and is used to drive the push plate to move horizontally and vertically; The adjusting mechanism is arranged on one side of the conveying device, and the adjusting mechanism is used to adjust the opening and closing state between a lower end flat plate, an upper end cover plate and a rotating shield plate.

[0006] Preferably, the driving mechanism comprises: A first vertical drive, a first transverse drive and a connecting long rod, wherein the first vertical drive is arranged at the rear end of the conveying equipment, the first transverse drive is installed in the first vertical drive, one end of the connecting long rod is installed in the first transverse drive, and the other end of the connecting long rod is fixedly connected to the pushing plate.

[0007] Preferably, the adjustment mechanism comprises: A second vertical drive, a second transverse drive, a first installation chamber and a second installation chamber, wherein the second vertical drive is arranged at the right end of the conveying equipment, the second transverse drive is installed in the second vertical drive, the first installation chamber is installed in the second transverse drive, and the upper end of the second installation chamber is fixedly connected to the upper end of the first installation chamber.

[0008] Preferably, the adjustment mechanism further comprises: A first vertical groove, an upward moving plate, a first long plate and a third vertical driver, the first vertical groove is opened through the outside of the first installation room, multiple upward moving plates are slidably mounted in a first vertical groove, and the upward moving plate is a Z-shaped plate structure, the third vertical driver is arranged in the first installation room, one of the first long plates is installed in the third vertical driver, and one first long plate is fixedly connected to multiple upward moving plates.

[0009] Preferably, the adjustment mechanism further comprises: A driving motor and a rotating shaft, wherein a plurality of the driving motors are fixedly installed in a first installation chamber, a plurality of the rotating shafts are rotatably installed in a first installation chamber, and one end of a rotating shaft is fixedly connected to an output end of a driving motor, and the other end of a rotating shaft is fixedly connected to a rotating shield.

[0010] Preferably, the adjusting mechanism further includes: A second vertical groove, an arc-shaped shielding block, and a vertical plate. The second vertical groove is penetrated and opened on the outside of the second installation chamber. A plurality of the arc-shaped shielding blocks are all arc-shaped block structures. Two of the vertical plates are symmetrically and fixedly installed at both ends of one arc-shaped shielding block, and a plurality of vertical plates on the same side are all slidably sleeved in one second vertical groove.

[0011] Preferably, the adjusting mechanism further includes: A second long plate, a fourth vertical driver, and a fixed horizontal plate. The fourth vertical driver is arranged in the second installation chamber. One of the second long plates is installed in the fourth vertical driver, and one of the second long plates is fixedly connected to a plurality of vertical plates. Two ends of a plurality of the fixed horizontal plates are respectively fixedly connected to the outside of the first installation chamber and the outside of the second installation chamber.

[0012] Preferably, the adjusting mechanism further includes: A vertical connecting rod and an avoidance groove. Two ends of one of the vertical connecting rods are respectively fixedly connected to a lower-end flat plate and a fixed horizontal plate. Two of the avoidance grooves are symmetrically opened on both sides of one of the fixed horizontal plates. Two of the vertical plates are movably sleeved in the two avoidance grooves.

[0013] A method for a silicon wafer processing device of a back-pressure silicon pressure-sensitive chip, comprising the following steps: Step S1: When the processing of a single silicon wafer is completed, start the conveying device to move the single silicon wafer towards the first installation chamber, and then start the second vertical driver and the second horizontal driver to move the first installation chamber and the second installation chamber vertically and horizontally, so that the lowermost arc-shaped shielding block is in parallel contact with the conveying device; Step S2: Then start the third vertical driver to move a plurality of upward moving plates upward, and at the same time start the driving motor to rotate the rotating shielding plate towards the conveying device until the rotating shielding plate is in a vertical state; Step S3: Then start the first vertical driver and the first horizontal driver to push the single silicon wafer onto the lowermost lower-end flat plate with a pushing plate, and then move the upward moving plate downward so that the upper-end cover plate is in contact with the single silicon wafer. Thus, the upper and lower deformation surfaces and the four side surfaces of the single silicon wafer are all limited. Then, let a plurality of arc-shaped shielding blocks located above move to the conveying device one by one, and repeat the above operations to limit and place a plurality of single silicon wafers on a plurality of lower-end flat plates one by one.

[0014] Compared with the prior art, the present invention has the following advantages: 1. When the processing of a single silicon wafer is completed in the present invention, the arc-shaped shielding block is made to be in parallel contact with the arc-shaped end of the conveyor belt to fill the gap between the arc-shaped end of the conveyor belt and the lower flat plate. Thereby, on one hand, it prevents the single silicon wafer from getting stuck in this gap, and on the other hand, it avoids damage to the single silicon wafer caused by the stacking operation in the form of free fall. Then, the upper moving plate is driven to move upward, and at the same time, the rotating shielding plate is driven to rotate towards the conveying device until the rotating shielding plate is in a vertical state. Then, the single silicon wafer is pushed onto the lower flat plate through the pushing plate, and the upper moving plate is moved downward so that the upper cover plate abuts against the single silicon wafer, so as to place a single silicon wafer in a separate limit position, avoiding the influence on the pressure detection performance of the lower single silicon wafer due to the stacking of multiple single silicon wafers together.

[0015] 2. When it is necessary to take out a single silicon wafer in the present invention, first, the first installation chamber is moved away from the conveying device, the upper moving plate is moved upward, and the arc-shaped shielding block is moved downward. At the same time, the rotating shielding plate is driven to rotate away from the conveying device until the rotating shielding plate is in a horizontal state. Thus, the limit state of the single silicon wafer is quickly released, and then the single silicon wafer is pushed to the rotating shielding plate through the pushing plate, so as to facilitate the automatic removal of the single silicon wafer from the lower flat plate. At the same time, the three side faces of the rotating shielding plate are used to limit the single silicon wafer to avoid deflection when taking out the single silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of a silicon wafer processing device for a back-pressure silicon pressure-sensitive chip proposed by the present invention; Figure 2 is a front cross-sectional schematic view of a silicon wafer processing device for a back-pressure silicon pressure-sensitive chip proposed by the present invention Figure 1 ; Figure 3 In the present invention Figure 2 is an enlarged schematic view of part A; Figure 4 is a front cross-sectional schematic view of a silicon wafer processing device for a back-pressure silicon pressure-sensitive chip proposed by the present invention Figure 2 ; Figure 5 In the present invention Figure 4 is an enlarged schematic view of part B; Figure 6 is a rear cross-sectional schematic view of a silicon wafer processing device for a back-pressure silicon pressure-sensitive chip proposed by the present invention Figure 1 ; Figure 7 In the present invention Figure 6 is an enlarged schematic view of part C; Figure 8 is a rear cross-sectional schematic view of a silicon wafer processing device for a back-pressure silicon pressure-sensitive chip proposed by the present invention Figure 2 ; Figure 9Schematic diagram of the vertical plate and vertical connecting rod structure of the silicon wafer processing equipment for a back-pressure silicon pressure-sensitive chip proposed by the present invention; Figure 10 Schematic diagram of the lower flat plate and fixed cross plate structure of the silicon wafer processing equipment for a back-pressure silicon pressure-sensitive chip proposed by the present invention; Figure 11 Schematic diagram of the arc-shaped shielding block structure of the silicon wafer processing equipment for a back-pressure silicon pressure-sensitive chip proposed by the present invention; Figure 12 Schematic diagram of the upward moving plate structure of the silicon wafer processing equipment for a back-pressure silicon pressure-sensitive chip proposed by the present invention; Figure 13 Schematic diagram of the rotating shielding plate structure of the silicon wafer processing equipment for a back-pressure silicon pressure-sensitive chip proposed by the present invention.

[0017] In the figure: 1. Conveying equipment; 2. Silicon wafer monomer; 3. Lower flat plate; 4. Upper cover plate; 5. Pushing plate; 6. First vertical driver; 7. First horizontal driver; 8. Connecting long rod; 9. Second vertical driver; 10. Second horizontal driver; 11. First installation chamber; 12. Second installation chamber; 13. First vertical groove; 14. Upward moving plate; 15. First long plate; 16. Third vertical driver; 17. Driving motor; 18. Rotating shaft; 19. Rotating shielding plate; 20. Second vertical groove; 21. Arc-shaped shielding block; 22. Vertical plate; 23. Second long plate; 24. Fourth vertical driver; 25. Fixed cross plate; 26. Vertical connecting rod; 27. Avoidance groove. Detailed implementation manners

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0019] Refer to Figures 1 - 13 , a silicon wafer processing equipment for a back-pressure silicon pressure-sensitive chip, including a conveying equipment 1 and a silicon wafer monomer 2, and as shown in the attached Figure 2 and the attached Figure 3As shown, the conveying device 1 is a conveyor belt structure. Multiple lower flat plates 3, multiple upper cover plates 4, a pushing plate 5, and multiple rotating shutter plates 19 are arranged at the conveying device 1. One lower flat plate 3, one upper cover plate 4, and one rotating shutter plate 19 form a group. Both the lower flat plate 3 and the pushing plate 5 are straight plate structures, the upper cover plate 4 is an L-shaped plate structure, and the rotating shutter plate 19 is a semi-I-shaped plate structure. When a single silicon wafer 2 is located on a lower flat plate 3, the space between an upper cover plate 4, a rotating shutter plate 19, and a lower flat plate 3 is closed to limit the upper and lower deformation surfaces and the four side surfaces of a single silicon wafer 2, thereby preventing the single silicon wafer 2 from moving freely and avoiding the influence of multiple stacked single silicon wafers 2 on the pressure detection performance; and the attachment Figure 1 and attachment Figure 2 The three groups of lower flat plates 3, upper cover plates 4, and rotating shutter plates 19 shown are only for illustrative purposes, and multiple groups of lower flat plates 3, upper cover plates 4, and rotating shutter plates 19 can be provided to facilitate the placement of multiple single silicon wafers 2; Moreover, a driving mechanism is also arranged at the conveying device 1. The driving mechanism is arranged on one side of the conveying device 1 and is used to drive the pushing plate 5 to move horizontally and vertically, so as to push the single silicon wafer 2 to the lower flat plate 3; an adjusting mechanism, the adjusting structure is arranged on one side of the conveying device 1, and the adjusting mechanism is used to adjust the opening and closing state between a lower flat plate 3, an upper cover plate 4, and a rotating shutter plate 19. When the space between a lower flat plate 3, an upper cover plate 4, and a rotating shutter plate 19 is closed, a single silicon wafer 2 is placed in a limited state, and when the space between a lower flat plate 3, an upper cover plate 4, and a rotating shutter plate 19 is open, the limited state of a single silicon wafer 2 is released.

[0020] Preferably, the driving mechanism includes a first vertical driver 6, a first horizontal driver 7, and a connecting long rod 8. The first vertical driver 6 is arranged at the rear end of the conveying device 1, and the first vertical driver 6 is composed of a first vertical slide rail and a first vertical cylinder. The first horizontal driver 7 is fixedly connected to the first vertical cylinder, and the first horizontal driver 7 is slidably sleeved in the first vertical slide rail. The first horizontal driver 7 is composed of a first horizontal slide rail and a first horizontal cylinder. One end of the connecting long rod 8 is fixedly connected to the first horizontal cylinder, and one end of the connecting long rod 8 is slidably sleeved in the first horizontal slide rail. The other end of the connecting long rod 8 is fixedly connected to the pushing plate 5, and the pushing plate 5 is moved closer to the conveying device 1 through the first vertical driver 6 and the first horizontal driver 7, so as to facilitate the pushing plate 5 to push the single silicon wafer 2 on the conveying device 1 to the lower flat plate 3.

[0021] The adjusting mechanism includes a second vertical drive 9, a second transverse drive 10, a first installation chamber 11 and a second installation chamber 12. The second vertical drive 9 is arranged at the right end of the conveying device 1, and the second vertical drive 9 is composed of a second vertical slide rail and a second vertical cylinder. The second transverse drive 10 is fixedly connected to the second vertical cylinder, and the second transverse drive 10 is slidably mounted in the second vertical slide rail, and the second transverse drive 10 is composed of a second transverse slide rail and a second transverse cylinder. At the same time, the first installation chamber 11 is fixedly connected to the second transverse cylinder, and the first installation chamber 11 is slidably mounted in the second transverse slide rail, as shown in the attached figure. Figure 1 As shown, the first installation chamber 11 is located at the rear end of the conveying device 1, while the second installation chamber 12 is located at the front end of the conveying device 1, and the upper end of the second installation chamber 12 is fixedly connected to the upper end of the first installation chamber 11 through a transverse long plate and is in an inverted U shape, and the first installation chamber 11 and the second installation chamber 12 are moved closer to or away from the conveying device 1 through the second vertical drive 9 and the second transverse drive 10.

[0022] Preferably, the adjustment mechanism also includes a first vertical slot 13, an upper moving plate 14, a first long plate 15 and a third vertical driver 16. The first vertical slot 13 is opened through the outside of the first installation chamber 11. Multiple upper moving plates 14 are slidably mounted in a first vertical slot 13, and the upper moving plate 14 is a Z-shaped plate structure. The third vertical driver 16 is arranged in the first installation chamber 11, and the third vertical driver 16 is composed of a third vertical slide rail and a third vertical cylinder. The first vertical slot 13 and the third vertical slide rail are respectively located on the outside and inside of the first installation chamber 11. A first long plate 15 is fixedly connected to the third vertical cylinder, and the first long plate 15 is slidably mounted in the third vertical slide rail. Multiple upper moving plates 14 extend into the first installation chamber 11 through the first vertical slot 13 and are fixedly connected to a first long plate 15. Then, the multiple upper moving plates 14 are vertically moved through the third vertical driver 16.

[0023] The adjusting mechanism also includes a driving motor 17, a rotating shaft 18, a second vertical slot 20, an arc-shaped shielding block 21 and a vertical plate 22. A plurality of driving motors 17 are fixedly installed in a first installation chamber 11. A plurality of rotating shafts 18 are installed in a first installation chamber 11 through and through, and one end of a rotating shaft 18 is fixedly connected to an output end of a driving motor 17, and the other end of a rotating shaft 18 is fixedly connected to a rotating shield plate 19, and the rotating shield plate 19 is rotated by the driving motor 17. The driving motor 17 is a servo motor, and the rotating shield plate 19 can be self-locked in a static position by the self-locking function of the servo motor. The second vertical slot 20 is opened through the outside of the second installation chamber 12, and as shown in the attached Figure 3As shown, multiple arc-shaped shielding blocks 21 are all arc-shaped block structures. When the arc-shaped shielding block 21 abuts against the conveying device 1 in parallel, the arc-shaped shielding block 21 abuts against the arc-shaped end of the conveyor belt to fill the gap between the arc-shaped end of the conveyor belt and the lower flat plate 3. On the one hand, it prevents the single silicon wafer 2 from being stuck in this gap, and on the other hand, it avoids damage to the single silicon wafer 2 caused by stacking operations in a free-fall manner. Two vertical plates 22 are symmetrically and fixedly installed at both ends of an arc-shaped shielding block 21, and multiple vertical plates 22 on the same side are all slidably sleeved in a second vertical groove 20.

[0024] Preferably, the adjusting mechanism further includes a second long plate 23, a fourth vertical driver 24, a fixed horizontal plate 25, a vertical connecting rod 26, and an avoidance groove 27. The fourth vertical driver 24 is arranged in the second installation chamber 12, and the fourth vertical driver 24 is composed of a fourth vertical slide rail and a fourth vertical cylinder. The second vertical groove 20 and the fourth vertical slide rail are respectively located outside and inside the second installation chamber 12. A second long plate 23 is fixedly connected to the fourth vertical cylinder, and the second long plate 23 is slidably sleeved in the fourth vertical slide rail. A second long plate 23 is fixedly connected to multiple vertical plates 22, and the fourth vertical driver 24 is used to move the multiple vertical plates 22 vertically. Both ends of multiple fixed horizontal plates 25 are respectively fixedly connected to the outside of the first installation chamber 11 and the outside of the second installation chamber 12. As shown in the attached Figure 9 and attached Figure 10 figure, both ends of a vertical connecting rod 26 are respectively fixedly connected to the middle of a lower flat plate 3 and the middle of a fixed horizontal plate 25, and then the lower flat plate 3 is installed to avoid interfering with the downward movement of the two vertical plates 22 and an arc-shaped shielding block 21. Two avoidance grooves 27 are symmetrically opened on both sides of a fixed horizontal plate 25. When the two vertical plates 22 and an arc-shaped shielding block 21 move downward, the two vertical plates 22 are movably sleeved in the two avoidance grooves 27, thus avoiding the two vertical plates 22.

[0025] It should be specifically noted that when a lower flat plate 3, an upper cover plate 4, and a rotating shielding plate 19 are in a closed state, as shown in the attached Figure 3 figure, the upper and lower deformation surfaces of the single silicon wafer 2 are respectively limited by the lower end surface of the upper cover plate 4 and the upper end surface of the lower flat plate 3, and the four side surfaces of the single silicon wafer 2 are respectively limited by the side end surfaces of the upper cover plate 4 and the three side end surfaces of the rotating shielding plate 19, thus completing the overall limitation of the single silicon wafer 2 and sealing the single silicon wafer 2 at the same time to prevent the single silicon wafer 2 from being contaminated by external dust. When the single silicon wafer 2 needs to be taken out, first move the first installation chamber 11 and the second installation chamber 12 away from the conveying device 1 to avoid interfering with the downward movement of the arc-shaped shielding block 21. Then, move the upper cover plate 4 and the arc-shaped shielding block 21 away from the lower flat plate 3 in sequence, and drive the rotating shielding plate 19 to rotate to a horizontal state with the lower flat plate 3, so as to facilitate pushing the single silicon wafer 2 to the rotating shielding plate 19 through the pushing plate 5, and then taking out the single silicon wafer 2.

[0026] Preferably, a method for a silicon wafer processing device of a back-pressure silicon pressure-sensitive chip includes the following steps: Step S1: When the single silicon wafer 2 is processed, start the conveying device 1 to move the single silicon wafer 2 towards the first installation chamber 11, and then start the second vertical driver 9 and the second horizontal driver 10 to move the first installation chamber 11 and the second installation chamber 12 vertically and horizontally, so that the lowermost arc-shaped shielding block 21 abuts against the conveying device 1 in parallel; Step S2: Then start the third vertical driver 16 to move multiple upward moving plates 14 upward, and at the same time start the driving motor 17 to rotate the rotating shutter 19 towards the conveying device 1 until the rotating shutter 19 is in a vertical state; Step S3: Then start the first vertical driver 6 and the first horizontal driver 7 to push the single silicon wafer 2 to the lowermost lower flat plate 3 by the pushing plate 5, and then move the upward moving plates 14 downward so that the upper cover plate 4 abuts against the single silicon wafer 2. Thus, the upper and lower deformation surfaces and the four side surfaces of the single silicon wafer 2 are all limited. Then, let the multiple arc-shaped shielding blocks 21 above move to the conveying device 1 one by one, and repeat the above operation to limit and place multiple single silicon wafers 2 on multiple lower flat plates 3 one by one.

[0027] The functional principle of the present invention can be elaborated through the following operation mode: When the single silicon wafer 2 is processed, place the single silicon wafer 2 on the conveying device 1, start the conveying device 1 to move the single silicon wafer 2 towards the first installation chamber 11, and then start the second vertical driver 9 and the second horizontal driver 10 to move the first installation chamber 11 and the second installation chamber 12 vertically and horizontally. As shown in the attached Figure 2 and the attached Figure 3 figure, make the lowermost arc-shaped shielding block 21 abut against the conveying device 1 in parallel; Then start the third vertical driver 16 and drive the first long plate 15 upward. The first long plate 15 drives multiple upward moving plates 14 upward. At the same time, start the driving motor 17 to drive the output end of the driving motor 17 to drive the rotating shutter 19 to rotate towards the conveying device 1 through the rotating shaft 18 until the rotating shutter 19 is in a vertical state; Then start the first vertical driver 6 and the first horizontal driver 7, and move the pushing plate 5 vertically and horizontally through the connecting long rod 8 so that the pushing plate 5 moves to the conveying device 1, then push the single silicon wafer 2 to the lowermost lower flat plate 3, and move the upward moving plates 14 downward so that the upper cover plate 4 abuts against the single silicon wafer 2. Thus, the upper and lower deformation surfaces and the four side surfaces of the single silicon wafer 2 are all limited. Then, let the multiple arc-shaped shielding blocks 21 above move to the conveying device 1 one by one, and repeat the above operation to limit and place multiple single silicon wafers 2 on multiple lower flat plates 3 one by one.

[0028] As described above, it is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes, shall be covered by the protection scope of the present invention.

Claims

1. A silicon wafer processing device for a back-pressure silicon pressure-sensitive chip, comprising a conveying device (1) and a single silicon wafer (2), characterized in that, The conveying device (1) is provided with: A plurality of lower flat plates (3), a plurality of upper cover plates (4), a push plate (5) and a plurality of rotating shield plates (19), wherein one lower flat plate (3), one upper cover plate (4) and one rotating shield plate (19) form a group, the lower flat plate (3) and the push plate (5) are both straight plate structures, the upper cover plate (4) is an L-shaped plate structure, and the rotating shield plate (19) is a semi-I-shaped plate structure; A driving mechanism, the driving mechanism being arranged on one side of the conveying device (1), and being used to drive the pushing plate (5) to move horizontally and vertically; An adjustment mechanism, wherein the adjustment structure is arranged on one side of the conveying device (1), and the adjustment mechanism is used to adjust the opening and closing state between a lower end flat plate (3), an upper end cover plate (4) and a rotating shield plate (19).

2. The silicon wafer processing equipment for a back-pressure silicon pressure-sensitive chip according to claim 1, characterized in that, The driving mechanism comprises: A first vertical drive (6), a first transverse drive (7) and a connecting rod (8), wherein the first vertical drive (6) is arranged at the rear end of the conveying device (1), the first transverse drive (7) is installed in the first vertical drive (6), one end of the connecting rod (8) is installed in the first transverse drive (7), and the other end of the connecting rod (8) is fixedly connected to the pushing plate (5).

3. The silicon wafer processing equipment for a back-pressure silicon pressure-sensitive chip according to claim 2, characterized in that, The regulating mechanism comprises: A second vertical drive (9), a second transverse drive (10), a first installation chamber (11) and a second installation chamber (12), wherein the second vertical drive (9) is arranged at the right end of the conveying device (1), the second transverse drive (10) is installed in the second vertical drive (9), the first installation chamber (11) is installed in the second transverse drive (10), and the upper end of the second installation chamber (12) is fixedly connected to the upper end of the first installation chamber (11).

4. The silicon wafer processing equipment for a back-pressure silicon pressure-sensitive chip according to claim 3, characterized in that, The regulating mechanism also includes: A first vertical groove (13), an upward moving plate (14), a first long plate (15) and a third vertical driver (16), wherein the first vertical groove (13) is opened through the outside of the first installation chamber (11), a plurality of upward moving plates (14) are slidably mounted in one first vertical groove (13), and the upward moving plate (14) is a Z-shaped plate structure, the third vertical driver (16) is arranged in the first installation chamber (11), one of the first long plates (15) is installed in the third vertical driver (16), and one first long plate (15) is fixedly connected to a plurality of upward moving plates (14).

5. The silicon wafer processing equipment for a back-pressure silicon pressure-sensitive chip according to claim 4, characterized in that, The regulating mechanism also includes: A driving motor (17) and a rotating shaft (18), wherein a plurality of the driving motors (17) are fixedly mounted in a first mounting chamber (11), a plurality of the rotating shafts (18) are rotatably mounted through the first mounting chamber (11), one end of a rotating shaft (18) is fixedly connected to an output end of a driving motor (17), and the other end of a rotating shaft (18) is fixedly connected to a rotating shield (19).

6. The silicon wafer processing equipment for a back-pressure silicon pressure-sensitive chip according to claim 5, characterized in that, The regulating mechanism also includes: A second vertical groove (20), an arc-shaped shielding block (21) and a vertical plate (22), the second vertical groove (20) is penetrated and opened on the outer side of the second installation chamber (12), and a plurality of the arc-shaped shielding blocks (21) are all arc-shaped block structures. Two of the vertical plates (22) are symmetrically and fixedly installed at both ends of an arc-shaped shielding block (21), and a plurality of vertical plates (22) on the same side are all slidably sleeved in a second vertical groove (20).

7. The silicon wafer processing equipment for a back-pressure silicon pressure-sensitive chip according to claim 6, characterized in that, The adjusting mechanism further includes: A second long plate (23), a fourth vertical driver (24) and a fixed horizontal plate (25). The fourth vertical driver (24) is arranged in the second installation chamber (12). A second long plate (23) is installed in the fourth vertical driver (24), and a second long plate (23) is fixedly connected to a plurality of vertical plates (22). Both ends of a plurality of the fixed horizontal plates (25) are respectively fixedly connected to the outer side of the first installation chamber (11) and the outer side of the second installation chamber (12).

8. The silicon wafer processing equipment for a back-pressure silicon pressure-sensitive chip according to claim 7, characterized in that, The adjusting mechanism further includes: A vertical connecting rod (26) and an avoidance groove (27). Both ends of a vertical connecting rod (26) are respectively fixedly connected to a lower end flat plate (3) and a fixed horizontal plate (25). Two of the avoidance grooves (27) are symmetrically opened on both sides of a fixed horizontal plate (25), and two of the vertical plates (22) are movably sleeved in the two avoidance grooves (27).

9. A method for a silicon wafer processing device of a back-pressure silicon pressure-sensitive chip according to any one of claims 1-8 above, characterized in that, Including the following steps: Step S1: When the silicon wafer monomer (2) is processed, start the conveying device (1) to move the silicon wafer monomer (2) towards the first installation chamber (11), and then start the second vertical driver (9) and the second horizontal driver (10) to move the first installation chamber (11) and the second installation chamber (12) vertically and horizontally, so that the lowermost arc-shaped shielding block (21) abuts against the conveying device (1) in parallel; Step S2: Then start the third vertical driver (16) to move a plurality of upward moving plates (14) upward, and at the same time start the driving motor (17) to rotate the rotating shielding plate (19) towards the conveying device (1) until the rotating shielding plate (19) is in a vertical state; Step S3: Then start the first vertical driver (6) and the first horizontal driver (7) to push the silicon wafer monomer (2) to the lowermost lower end flat plate (3) by the pushing plate (5), and then move the upward moving plate (14) downward so that the upper end cover plate (4) abuts against the silicon wafer monomer (2). Thus, the upper and lower deformation surfaces and the four side surfaces of the silicon wafer monomer (2) are all limited. Then move the arc-shaped shielding blocks (21) above one by one to the conveying device (1) and repeat the above operation to limit and place a plurality of silicon wafer monomers (2) one by one on a plurality of lower end flat plates (3).

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