Wafer transmission system based on R-theta configuration robot and assembling method thereof

Abstract

The invention relates to the field of semiconductor manufacturing equipment, in particular to a wafer transmission system based on an R-theta configuration robot and an assembling method of the wafer transmission system. Comprising a robot and a wafer cabin. The robot comprises a main shaft, the main shaft is connected with an arm mechanism, the arm mechanism comprises arms of a series connection structure, and any one of the arms is in direct or transmission connection with the main shaft; the plurality of wafer cabins are used for taking and placing wafers and are arranged around the robot, and the arms are driven by the main shaft to carry out interpolation actions of entering and exiting the wafer cabins; the number of the arm mechanisms is multiple, and the multiple arm mechanisms are rotationally connected with the execution end of the main shaft along the same vertical axis. The two independent arm mechanisms capable of moving at the same time are arranged on the same vertical axis of the main shaft, so that the system can execute picking and placing operation of two wafers in parallel. Compared with a traditional single-arm system, the time required for processing the same number of wafers is greatly shortened, and the throughput of the system is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing equipment, and particularly to a wafer transfer system based on an R-θ configuration robot and its assembly method. Background Art

[0002] In the field of semiconductor manufacturing, wafer transfer robots based on the R-θ configuration are widely used for efficient and precise handling of wafers between processing equipment and storage chambers. Traditional such systems generally include a multi-joint arm mechanism driven by a rotating main shaft, and multiple groups of wafer storage chambers arranged around the robot. The arm mechanism, driven by the main shaft, realizes the pick-and-place operation of wafers through the interpolation movement of each joint.

[0003] However, the existing single-arm mechanism design has the following problems: 1. The single arm can only perform pick-and-place operations on one wafer chamber at a time. When multiple chambers need to be processed, they must be executed sequentially, which limits the overall throughput of the system.

[0004] 2. The structural design of the arm mechanism often limits its service range. Especially when the spacing between a group of parallel chambers is relatively close, the arm tries to enter a chamber on the non-same side. For example, when the left arm tries to enter the right chamber, the arm joints or end effectors are extremely likely to physically collide with the chamber door or structure of the adjacent chamber, resulting in the inability to enter some chamber positions, which requires the movement range of the arm to match the layout of the wafer chambers.

[0005] 3. When trying to increase the number of arms to improve efficiency, the traditional design is prone to movement interference between the arms, and will increase the complexity, weight and inertia of the system, posing higher requirements for drive and control. Summary of the Invention

[0006] The object of the present invention is to provide a wafer transfer system based on an R-θ configuration robot and its assembly method to solve the problem of low handling efficiency of wafer manipulators in the prior art.

[0007] The technical solution of the present invention is: A wafer transfer system based on an R-θ configuration robot, comprising: A robot, including a main shaft, the main shaft is connected with an arm mechanism, the arm mechanism includes an arm in a series structure, and any one of the arms is directly or transmission-connected with the main shaft; Wafer chambers, for wafer pick-and-place and arranged around the robot in multiple numbers, and the arm performs interpolation movements in and out of the wafer chambers driven by the main shaft; The arm mechanism is provided with multiple numbers, and the multiple arm mechanisms are rotationally connected to the execution end of the main shaft along the same vertical axis.

[0008] Preferably, the arm at least includes a first arm, a second arm, and a third arm: one end of the first arm is rotatably connected to the main shaft; one end of the second arm is rotatably connected to the end of the first arm away from the main shaft; one end of the third arm is rotatably connected to the end of the second arm away from the first arm; The first arms in multiple arm mechanisms are stacked, and there is a heightening pad in one of the arm mechanisms, so that the third arms in multiple arm mechanisms are at the same height.

[0009] Preferably, the second arm has a length dimension shorter than that of the first arm. When a pair of the first arms are in an open state, the projections of the movement paths of a pair of the second arms on the same horizontal plane do not coincide.

[0010] Preferably, it is set that: the central axis where the third arm is located is the first axis; a reference circle with the center at the midpoint of the main shaft and the radius being the difference between the length dimensions of the first arm and the second arm; the connecting end of the second arm and the third arm forms an interpolation line tangent to the reference circle during interpolation movement; and when the end of the third arm away from the second arm enters the wafer picking position of the corresponding wafer chamber, the interpolation line forms a deflection angle with the first axis; The deflection angle enables any arm mechanism to perform an interpolation action on any wafer chamber.

[0011] Preferably, it is set that the distance between the wafer picking position and the main shaft is R1; the distance between the two rotating ends of the first arm connecting the main shaft and the second arm is L1; the distance between the two rotating ends of the second arm connecting the first arm and the third arm is L2; the distance between the rotating connecting end of the third arm connecting the second arm and its wafer picking center is L3; the deflection angle is Phi; and Phi = arcsin((L1 - L2) / (R1 - L3)).

[0012] Preferably, the main shaft is provided with a first drive shaft and a second drive shaft corresponding to any arm mechanism, and the first drive shaft and the second drive shaft have the same axis in the vertical direction; the first drive shaft can drive the first arm to rotate around the axis where the first drive shaft is located, and the second drive shaft is sequentially connected to the second arm and the third arm through a transmission mechanism.

[0013] Preferably, the transmission mechanism includes a first pulley, the first pulley is coaxially fixed with the second drive shaft and is connected to a second pulley through a synchronous belt. The second pulley is arranged at the end of the first arm away from the main shaft and has a third pulley coaxially arranged with the second pulley and arranged at the end of the second arm connecting the first arm. The third pulley is connected to a fourth pulley through a synchronous belt, and the fourth pulley is arranged at the rotating connection end of the second arm and the third arm and is fixed to the third arm.

[0014] Preferably, a bend is formed at one end of the third arm close to the second arm, so that the third arm is configured as a third main arm and a third sub-arm, and the third main arm and the third sub-arm have a fixed relative position; Wherein, the first axis serves as the central axis of the third main arm, and the central axis of the third sub-arm coincides with the interpolation line at the wafer picking position.

[0015] Preferably, the third sub-arm has at least one side wall parallel to its own central axis, and the side wall is configured as an assembly positioning surface; There is a positioning fixture, and the positioning fixture has a positioning end surface that can abut against the assembly positioning surface. When a pair of assembly positioning surfaces abut against the positioning end surface, a pair of the third main arms (131) form an included angle of 2phi.

[0016] An assembly method for a wafer transfer system based on an R-θ configuration robot includes the following steps: Step 1: Align the central axes of a pair of first arms, and the non-connected ends of the pair of first arms are away from each other; Step 2: Align the central axes of a pair of second arms, and the non-connected ends of the pair of second arms are close to each other; Step 3: Place the positioning fixture and adjust the third arm so that the assembly positioning surfaces of a pair of third sub-arms abut against the positioning end surfaces on both sides of the positioning fixture, so that an included angle of 2phi is formed between a pair of third main arms.

[0017] Compared with the prior art, the advantages of the present invention are: (1) By arranging two independent and simultaneously movable arm mechanisms on the same vertical axis of the main shaft, the system can perform the picking and placing operations of two wafers in parallel. Compared with the traditional single-arm system, the time required to process the same number of wafers is greatly shortened, and the system throughput is significantly improved.

[0018] (2) The design that the second arm is shorter than the first arm, combined with the open state of the first arm, ensures that the two second arms can perform a 360-degree non-interfering rotational movement on the same horizontal plane, and the projection of their movement paths does not overlap.

[0019] (3) By defining a reference circle (radius |L1 - L2|) and setting that when the end of the third arm reaches the wafer picking position, the interpolation line formed by the connection end of the second and third arms and the first axis (the central axis of the third arm) needs to form a specific deflection angle Phi (Phi = arcsin((L1 - L2) / (R1 - L3))), this design fundamentally solves the collision problem when the arm enters wafer chambers at different positions. The existence of the deflection angle ensures that the arm mechanism can enter any position safely and without collision, including wafer chambers at "non - same side" where collisions are likely to occur in traditional designs, and perform interpolation actions, eliminating service blind spots.

[0020] (4) The rotation of all arms is directly driven by the drive shaft or transmitted through a synchronous pulley mechanism, and the power ultimately comes from two co - axial first drive shafts and second drive shafts on the main shaft. This design avoids installing independent heavy motors at each joint, significantly reducing the overall weight and moment of inertia of the arm mechanism. Brief Description of the Drawings

[0021] The present invention will be further described below in conjunction with the drawings and embodiments: Figure 1 Structural diagram of the wafer transfer system based on the R - θ configuration robot according to the present invention; Figure 2 Structural diagram of the arm mechanism according to the present invention; Figure 3 Schematic diagram of one wafer picking method of the wafer transfer system based on the R - θ configuration robot according to the present invention; Figure 4 Schematic diagram of the wafer picking completion of the wafer transfer system based on the R - θ configuration robot according to the present invention; Figure 5 Schematic diagram of other wafer picking methods of the wafer transfer system based on the R - θ configuration robot according to the present invention; Figure 6 Structural diagram of the transmission mechanism according to the present invention; Figure 7 For Figure 1 Enlarged view at B in Figure 8 Structural diagram of some embodiments of the present invention; Figure 9 For Figure 8 Enlarged view at A in Figure 10 Structural diagram of the third arm in some embodiments of the present invention; Figure 11 Schematic diagram of the interference between the arm and the hatch in the prior art according to the present invention; Wherein: 1. Arm mechanism, 11. First arm, 12. Second arm, 13. Third arm, 131. Third main arm, 132. Third sub - arm, 133. Assembly positioning surface, 2. Wafer chamber, 3. Raising pad, 4. First axis, 5. Reference circle, 6. Interpolation line, 7. Transmission mechanism, 71. First pulley, 72. Second pulley, 73. Third pulley, 74. Fourth pulley, 8. Positioning fixture, 100. Wafer. Detailed implementation mode

[0022] The terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more, unless otherwise clearly defined.

[0023] In the present application, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0024] The following will further elaborate on the content of the present invention in conjunction with specific embodiments: As Figure 1 shown, a wafer 100 transfer system based on an R - θ configuration robot includes a robot for picking and placing wafers 100 and a wafer chamber 2 for storing wafers 100.

[0025] Among them, the robot includes a main shaft, the main shaft is arranged in the vertical direction, the top end of the main shaft serves as an execution end and is connected with an arm mechanism 1. The arm mechanism 1 includes a plurality of arms in a series structure, and any one of the plurality of arms is directly or transmission - connected to the main shaft. A plurality of groups of wafer 100 chambers are arranged around the robot, and among them, at least one group has a different spacing between wafer 100 chambers from that of other groups. The arm is driven by the main shaft to perform an interpolation movement for entering and exiting the wafer chamber 2 to pick and place wafers 100.

[0026] To improve the efficiency of picking and placing the wafer 100, two arm mechanisms 1 are provided in this application. The two arm mechanisms 1 are rotationally connected to the execution end of the main shaft along the same vertical axis, enabling each arm mechanism 1 to perform interpolation actions for picking and placing the wafer 100 simultaneously.

[0027] Specifically, as shown in Figure 2 , the arm at least includes a first arm 11, a second arm 12, and a third arm 13. One end of the first arm 11 is rotationally connected to the main shaft; one end of the second arm 12 is rotationally connected to the end of the first arm 11 away from the main shaft; one end of the third arm 13 is rotationally connected to the end of the second arm 12 away from the first arm 11.

[0028] The first arms 11 in the two arm mechanisms 1 are stacked. Therefore, in this embodiment, a heightening pad 3 is provided at the end where the second arm 12 is connected to the first arm 11. The setting of the heightening pad 3 makes the two third arms 13 for picking and placing the wafer 100 at the same height.

[0029] Moreover, in this embodiment, the second arm 12 has a length dimension shorter than that of the first arm 11. With this setting, when a pair of first arms 11 are in an open state, that is, when the distance between the ends of a pair of first arms 11 away from the main shaft is the largest, any second arm 12 can rotate 360 degrees around its rotational connection end with the first arm 11. The projections of the movement paths of a pair of second arms 12 on the same horizontal plane do not overlap, that is, the movement of one second arm 12 does not interfere with the movement of the other second arm 12. As shown in Figures 3 - 5 , further enabling the two arm mechanisms 1 to simultaneously perform interpolation movements on two adjacent and parallel wafer chambers 2.

[0030] In the prior art, the same arm mechanism 1 can only perform an interpolation action on one of a group of parallel wafer chambers 2. Taking Figure 11 as an example, when the arm mechanism 1 on the left performs an interpolation action for picking and placing the wafer 100 on a group of wafer chambers 2 above it, it can only enter the wafer chamber 2 on its same side (left). When this arm mechanism 1 attempts to enter the wafer chamber 2 on its right, its arm will collide with the door of the wafer chamber 2 on the right.

[0031] To solve this problem, the following parameters are set in this application: As shown in Figure 1 , Figure 2 and Figure 7 , the central axis where the third arm 13 is located is the first axis 4; Taking the midpoint of the main shaft as the center of the circle, a reference circle 5 is formed with the difference between the length dimensions of the first arm 11 and the second arm 12 as the radius; The connecting end of the second arm 12 and the third arm 13 forms an interpolation line 6 tangent to the reference circle 5 during interpolation movement; and when the end of the third arm 13 away from the second arm 12 enters the wafer picking position of the corresponding wafer chamber 2, the interpolation line 6 forms a deflection angle with the first axis 4. The existence of this deflection angle enables any arm mechanism 1 to perform interpolation actions on wafer chambers 2 at any position.

[0032] Specifically, set the distance between the wafer picking position and the main shaft as R1; the distance between the two rotating ends of the first arm 11 connecting the main shaft and the second arm 12 is L1; the distance between the two rotating ends of the second arm 12 connecting the first arm 11 and the third arm 13 is L2; the distance between the rotating connection end of the third arm 13 connecting the second arm 12 and its wafer picking center is L3; the deflection angle is Phi; and Phi = arcsin((L1 - L2) / (R1 - L3)).

[0033] To reduce the weight of the arm mechanism 1, the rotating connection ends of the first arm 11 and the second arm 12 and the rotating connection ends of the second arm 12 and the third arm 13 are both connected by transmission, and the power driving their operation all comes from the main shaft. Specifically, the main shaft is provided with a first drive shaft and a second drive shaft corresponding to any arm mechanism 1, and the first drive shaft and the second drive shaft have the same axis in the vertical direction. The first drive shaft can drive the first arm 11 to rotate around the axis where the first drive shaft is located, and the second drive shaft is sequentially connected to the second arm 12 and the third arm 13 through a transmission mechanism 7.

[0034] Combined Figure 2 and Figure 6 As shown, the transmission mechanism 7 includes a first pulley 71, and the first pulley 71 is coaxially fixed to the second drive shaft, so that the second drive shaft can drive the first arm to operate. And the first pulley 71 is connected to a second pulley 72 through a synchronous belt. The second pulley 72 is arranged at the end of the first arm 11 away from the main shaft, and there is a third pulley 73 which is coaxial with the second pulley 72 and is arranged at the end of the second arm 12 connecting the first arm 11. At the same time, the second pulley 72 is fixed to the second arm 12, thereby driving the second arm 12 to move while the first arm 11 moves. The third pulley 73 is coaxial with the second pulley 72 and is fixed to the first arm 11. The third pulley 73 is connected to a fourth pulley 74 through a synchronous belt. The fourth pulley 74 is arranged at the rotating connection end of the second arm 12 and the third arm 13 and is fixed to the third arm 13, thereby driving the third arm 13 to move while the second arm 12 moves.

[0035] Therefore, during the interpolation movement of the robot for the wafer chamber 2, the movements of the first arm 11, the second arm 12, and the third arm 13 are all synchronized and interrelated.

[0036] In this embodiment, as Figures 8 - 10 shown, a bend is formed at one end of the third arm 13 close to the second arm 12, so that it is configured as a third main arm 131 and a third sub-arm 132, and the third main arm 131 and the third sub-arm 132 have a fixed relative position. Among them, the first axis 4 serves as the central axis of the third main arm 131, and the central axis of the third sub-arm 132 coincides with the interpolation line 6 in the sheet taking position. Further, the third sub-arm 132 has at least one side wall parallel to its own central axis, and this side wall is configured as an assembly positioning surface 133; when a pair of third arms 13 have the same orientation, the assembly positioning surfaces 133 on the third arms 13 are oppositely arranged.

[0037] During the assembly process, starting from the main shaft, and in the order of connection of each arm, each arm is gradually adjusted. The present application adopts the following steps for assembly: Step 1: As Figure 8 , Figure 9 shown, the central axes of a pair of first arms 11 are made to coincide, and the non-connected ends of the pair of first arms 11 are far away from each other.

[0038] Step 2: The central axes of a pair of second arms 12 are made to coincide, and the non-connected ends of the pair of second arms 12 are close to the non-connected ends of the first arms 11; thus far, the central axes of the pair of first arms 11 and the pair of second arms 12 are all in the same plane passing through the central axis of the main shaft.

[0039] Step 3: Adjust a pair of third arms 13 so that the assembly positioning surface 133 of the third sub-arm 132 is perpendicular to the central axis of the first arm 11 or the second arm 12, so that an angle of 2phi is formed between the pair of third main arms. At this time, the pair of assembly positioning surfaces 133 are parallel to each other. Taking Figure 8 , Figure 9 as an example, in the actual application scenario, in order to avoid movement interference between a pair of third arms, there is a distance between the assembly positioning surfaces 133 on the pair of third arms. In this case, in order to ensure the parallelism of the pair of assembly positioning surfaces 133, as Figure 9 shown, the present application is provided with a positioning fixture 8. The positioning fixture 8 with two parallel positioning end faces is abutted between the pair of third arms 13, and the two assembly positioning surfaces 133 are attached to the pair of parallel positioning end faces on the positioning fixture 8, and then the assembly of the arm mechanism 1 is completed.

[0040] During the assembly process of a traditional arm, in order to achieve reference positioning, pin holes are generally drilled at corresponding positions on different arms, and a pin shaft is passed through the pin holes on different arms, so that the corresponding arms form a preset included angle to achieve assembly positioning. However, drilling pin holes easily forms stress concentration points on the arm. Under long-term high-frequency movement, cracks or even the risk of fracture may occur at the edges of the pin holes due to fatigue stress. At the same time, each arm adopts an independent pin shaft positioning method, and the assembly fit between the two is poor. During the positioning process of the pin shaft and the pin hole, if the cooperation precision between the pin shaft and the pin hole is high, it will cause excessive insertion and extraction force of the pin shaft on the pin hole, resulting in damage, especially at the inner wall of the pin hole. If the cooperation precision between the pin shaft and the pin hole is low, the damage to the arm itself is small, but the assembly precision is even lower. Furthermore, based on the high-precision requirements of wafer handling robots in the semiconductor industry, in this application, the structure of the third arm 13 is deformed to form an assembly positioning surface 133, which better meets the requirements of actual application scenarios. It not only abandons the limitation of the movement range but also improves the assembly precision.

[0041] The above embodiments are only used to illustrate the technical concept and features of the present invention, and their purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it accordingly, and it cannot be used to limit the protection scope of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention.

Claims

1. Wafer (100) transfer system based on an R-θ configuration robot, characterized in that Including: A robot, including a main shaft, the main shaft is connected with an arm mechanism (1), the arm mechanism (1) includes an arm with a series structure, and any one of the arms is directly or transmission-connected with the main shaft; A wafer chamber (2) for picking and placing wafers (100) and arranged around the robot in multiple numbers, and the arm performs an interpolation movement of entering and exiting the wafer chamber (2) driven by the main shaft; The arm mechanism (1) is arranged in multiple numbers, and the multiple arm mechanisms (1) are rotationally connected to the execution end of the main shaft along the same vertical axis.

2. The wafer (100) transfer system based on the R-θ configuration robot according to claim 1, wherein, The arm at least includes a first arm (11), a second arm (12) and a third arm (13): one end of the first arm (11) is rotationally connected with the main shaft; one end of the second arm (12) is rotationally connected with the end of the first arm (11) far from the main shaft; one end of the third arm (13) is rotationally connected with the end of the second arm (12) far from the first arm (11); The first arms (11) in the multiple arm mechanisms (1) are stacked, and there is a heightening pad (3) in one of the arm mechanisms (1), so that the third arms (13) in the multiple arm mechanisms (1) are at the same height.

3. The wafer (100) transfer system based on an R-θ configuration robot according to claim 2, wherein, The second arm (12) has a length dimension shorter than that of the first arm (11). When a pair of the first arms (11) are in an open state, the projections of the movement paths of a pair of the second arms (12) do not coincide on the same horizontal plane.

4. The wafer (100) transfer system based on the R-θ configuration robot according to claim 3, characterized in that, It is set that: the central axis where the third arm (13) is located is the first axis (4); a reference circle (5) is a circle with the center at the midpoint of the main shaft and the radius being the difference between the length dimensions of the first arm (11) and the second arm (12); the connecting end of the second arm (12) and the third arm (13) forms an interpolation line (6) tangent to the reference circle (5) during the interpolation movement; and when the end of the third arm (13) far from the second arm (12) enters the wafer picking position of the corresponding wafer chamber (2), the interpolation line (6) forms a deflection angle with the first axis (4); The deflection angle enables any arm mechanism (1) to perform an interpolation movement on any wafer chamber (2).

5. The wafer (100) transfer system based on the R-θ configuration robot according to claim 4, characterized in that, It is set that the distance between the wafer picking position and the main shaft is R1; the distance between the two rotating ends of the first arm (11) respectively connecting the main shaft and the second arm (12) is L1; the distance between the two rotating ends of the second arm (12) respectively connecting the first arm (11) and the third arm (13) is L2; the distance between the rotating connecting end of the third arm (13) connecting the second arm (12) and its wafer picking center is L3; the deflection angle is Phi; and Phi = arcsin((L1 - L2) / (R1 - L3)).

6. The wafer (100) transfer system based on the R-θ configuration robot according to claim 4, characterized in that, The main shaft is provided with a first drive shaft and a second drive shaft corresponding to any arm mechanism (1), and the first drive shaft and the second drive shaft have the same axis in the vertical direction; the first drive shaft can drive the first arm (11) to rotate around the axis where the first drive shaft is located, and the second drive shaft is sequentially connected to the second arm (12) and the third arm (13) through a transmission mechanism (7).

7. The wafer (100) transfer system based on the R-θ configuration robot according to claim 6, characterized in that, The transmission mechanism (7) includes a first pulley (71). The first pulley (71) is coaxially fixed to the second drive shaft and is connected to a second pulley (72) through a synchronous belt. The second pulley (72) is arranged at one end of the first arm (11) away from the main shaft and has a third pulley (73) that is coaxial with the second pulley (72) and is arranged at the end of the second arm (12) connecting to the first arm (11); meanwhile, the second pulley (72) is connected to the second arm (12); the third pulley (73) is coaxial with the second pulley (72) and is connected to the first arm (11); the third pulley (73) is connected to a fourth pulley (74) through a synchronous belt, and the fourth pulley (74) is arranged at the rotational connection end of the second arm (12) and the third arm (13) and is fixed to the third arm (13).

8. The wafer (100) transfer system based on the R-θ configuration robot according to claim 7, characterized in that, One end of the third arm (13) close to the second arm (12) is formed with a bend, so that the third arm (13) is configured as a third main arm (131) and a third sub - arm (132), and the third main arm (131) and the third sub - arm (132) have a fixed relative position; Wherein, the first axis (4) serves as the central axis of the third main arm (131), and in the sheet - taking position, the central axis of the third sub - arm (132) coincides with the interpolation line (6).

9. The wafer (100) transfer system based on an R-θ configuration robot according to claim 8, characterized in that, The third sub - arm (132) has at least one side wall parallel to its own central axis, and this side wall is configured as an assembly positioning surface (133); There is a positioning fixture (8). The positioning fixture (8) has a positioning end surface that can abut against the assembly positioning surface. When a pair of assembly positioning surfaces abut against the positioning end surface, a pair of the third main arms (131) form an included angle of 2phi.

10. An assembly method for a wafer (100) transfer system based on an R-θ configuration robot, characterized in that, It includes the following steps: Step 1: Coincide the central axes of a pair of first arms (11), and the non - connected ends of a pair of first arms (11) are far away from each other; Step 2: Coincide the central axes of a pair of second arms (12), and the non - connected ends of a pair of second arms (12) are close to each other; Step 3: Place the positioning fixture (8) and adjust the third arm (13) so that the assembly positioning surfaces (133) of a pair of third sub - arms (132) abut against the positioning end surfaces on both sides of the positioning fixture (8), so that an included angle of 2phi is formed between a pair of third main arms (131).

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