Multi-size compatible wafer inspection calibrator

Abstract

The invention discloses a multi-size compatible wafer inspection calibrator. The multi-size compatible wafer inspection calibrator comprises a calibrator body; the calibration unit comprises a connecting shaft connected to the base through a bearing, a swing arm is installed on the connecting shaft, the two ends of the swing arm are rotationally connected with connecting rods through rotating shafts, and the ends, away from the swing arm, of the connecting rods are rotationally connected with movable tables through rotating shafts; first positioning tables are mounted on the sides, close to each other, of the penetrating sections of the two movable tables, and first positioning plates are mounted on the first positioning tables; second positioning tables are installed on the sides, away from each other, of the penetrating sections of the two movable tables, and second positioning plates are installed on the second positioning tables. Through a rotary connecting mechanism of the swing arm, the connecting rod and the movable table, the distance between the first positioning plate and the second positioning plate can be synchronously adjusted, the deviation problem of an existing single-shaft driving mode is avoided, and accurate centering and positioning of wafer carrier rings of different sizes are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer inspection calibrators, and more specifically, to a multi-size compatible wafer inspection calibrator. Background Art

[0002] A wafer is the basic material for manufacturing semiconductor chips. After being processed into grains, various circuit element structures can be fabricated, and then an integrated circuit product with specific electrical functions can be formed. In the wafer processing process, cutting is an essential process. Before cutting the wafer, the outer periphery of the carrier film needs to be fixed to the wafer patch ring first, and then the carrier film is bonded to the wafer. Subsequently, the chips on the wafer are scribed and cut to perform a preliminary separation of the wafer.

[0003] Existing inspection and calibration equipment has significant limitations in adapting to different sizes of wafer carrier rings. Due to the fixed sizes of the positioning structure and support components of traditional equipment, it cannot be flexibly adjusted to adapt to different sizes of wafer carrier rings, resulting in poor versatility of the equipment and difficulty in quickly and accurately adjusting according to the actual size of the wafer carrier ring. Specifically, when it is necessary to fix and calibrate a larger-size wafer carrier ring, the positioning component may not be able to effectively clamp it, resulting in the wafer carrier ring shifting during the processing; for a smaller-size wafer carrier ring, the excessive spacing of the positioning components may not provide sufficient support and fixing force, greatly limiting the applicable range of the wafer processing equipment and making it difficult to meet the actual needs of co-line production of multi-size wafers in modern semiconductor manufacturing.

[0004] In addition, during the semiconductor manufacturing process, the wafer needs to be placed on the calibrator through a transfer device. The mechanical structure and transfer path of the wafer transfer equipment limit the support layout of the calibrator. To avoid interference with the robotic arm or conveyor device of the wafer transfer equipment and ensure smooth transfer of the wafer, no support can be set at the position of the calibrator on the transfer path. This causes unstable phenomena such as jitter when the wafer is scribed and cut on the calibrator due to lack of sufficient support, affecting the processing accuracy and product quality. Summary of the Invention

[0005] The present invention aims to provide a multi-size compatible wafer inspection calibrator to solve the technical problems that existing equipment cannot be flexibly adjusted to adapt to different sizes of wafer carrier rings due to the fixed sizes of the positioning structure and support components, and that no support can be set at the position of the calibrator on the transfer path, resulting in unstable phenomena such as jitter when the wafer is scribed and cut on the calibrator due to lack of sufficient support, affecting the processing accuracy and product quality.

[0006] Some embodiments of the present invention provide a multi-size compatible wafer inspection calibrator, including: A calibrator body, the calibrator body includes a base, and a fence is installed on the base; A calibration unit, the calibration unit comprising a connecting shaft connected to the base by a bearing, a swing arm mounted on the connecting shaft, both ends of the swing arm being rotatably connected to a connecting rod via a rotating shaft, and one end of the connecting rod away from the swing arm being rotatably connected to a movable platform via a rotating shaft, the movable platform extending through the enclosure to the outer surface of the enclosure, the movable platform passing through a section of the enclosure to form a through section; A first positioning platform is installed on one side of the through section of the two groups of movable platforms that are close to each other, and a first positioning plate is installed on the first positioning platform. The two groups of the first positioning plates are used to clamp and position the first wafer carrier ring; A second positioning platform is installed on one side of the two groups of movable platform penetration sections that are far away from each other. A second positioning plate is installed on the second positioning platform. The two groups of the second positioning plates are used to clamp and position the second wafer carrier ring.

[0007] In one embodiment, fixed frames are symmetrically installed on both sides of the interior of the enclosure, and a carrying frame is installed on the fixed frame, the carrying frame corresponds to the position of the movable table, a first carrying platform is installed on the side close to the carrying frame, the first carrying platform is used to carry and support the first wafer carrier ring, and a second carrying platform is installed on the side away from the carrying frame, the second carrying platform is used to carry and support the second wafer carrier ring.

[0008] In one embodiment, bearings on the first positioning plate and the second positioning plate are connected to multiple sets of rotating shafts, guide rollers are installed on the rotating shafts, and a pressing unit is provided inside the rotating shafts. The pressing unit cooperates with the rotating shafts to press and fix the first wafer carrier ring and the second wafer carrier ring.

[0009] In one embodiment, the pressing unit includes a through opening opened inside the rotating shaft, a movable shaft is slidably connected in the through opening, and a connecting arm is installed on the movable shaft, a pressure rod is also installed on the connecting arm, and a rubber pad is installed on the end of the pressure rod away from the connecting arm, connecting plates are symmetrically arranged on both sides below the first positioning plate and the second positioning plate, the movable shaft is fixedly connected to the corresponding connecting plates, and a first inclined block is installed on the close end of each two groups of connecting plates, and a second inclined block is arranged on the first inclined block.

[0010] In one embodiment, push rods are symmetrically arranged inside the first positioning plate and the second positioning plate, and a plurality of push rods are slidably connected to the inside of the first positioning plate and the second positioning plate, respectively. The second tilting block is fixedly connected to the push rods, and the first positioning plate and the second positioning plate are respectively provided with grooves for the second tilting block to slide. Abutment blocks are installed at one end of the plurality of push rods close to the first bearing platform and the second bearing platform.

[0011] In one embodiment, movable support units are provided on both the first carrier and the second carrier. The movable support unit includes first support platforms respectively installed on both sides of the first carrier and the second carrier. A second support platform is slidably connected inside the first support platform. An expansion airbag is installed inside the first support platform, and the opposite ends of the expansion airbag are fixedly connected to the second support platform. A tee pipe is installed at the adjacent ends of the expansion airbag, and a connecting pipe is installed on the tee pipe.

[0012] In one embodiment, a movable slot is formed at one end of the second support platform away from the first support platform, and a movable plate is arranged above the movable slot. A third inclined block is installed on one side of the movable plate close to the movable slot, and a fourth inclined block abuts against one side of the third inclined block. A pull rope is installed on the fourth inclined block.

[0013] In one embodiment, the pull rope passes through the second support platform and extends into the interior of the expansion airbag. A limiting frame is installed inside the expansion airbag, and the limiting frame is slidably connected to the pull rope.

[0014] In one embodiment, guide slots are formed on both sides inside the movable slot, and guide blocks are installed inside the guide slots. The guide blocks are fixedly connected to the fourth inclined block.

[0015] In one embodiment, multiple groups of guide posts are installed on one side of the movable plate close to the movable slot. Guide grooves adapted to the guide posts are formed on the second support platform. The guide grooves are slidably connected to the guide posts, and a second spring is further arranged on the guide posts.

[0016] Compared with the prior art, the beneficial effects of the present invention are at least as follows: Through the rotational connection mechanism of the swing arm, connecting rod and movable platform, the first positioning plate and the second positioning plate can synchronously adjust the distance, avoiding the deviation problem of the traditional single-axis driving method, and realizing the precise centering and positioning of wafer carrier rings of different sizes. The first positioning plate and the second positioning plate can be adapted to wafer carrier rings with a large diameter difference, greatly improving the adaptation efficiency of multi-size wafer carrier rings. Moreover, the expansion airbag is inflated and deflated through the connecting pipe to drive the second support platform to slide inside the first support platform, so that the support diameter can be continuously adjusted within a large range. When the second support platform is fully extended, the pull rope is tightened to drive the fourth inclined block to squeeze the third inclined block, causing the movable plate to rise to contact the lower surface of the wafer carrier ring, supporting the wafer carrier ring and improving the stability of the support process. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a three-dimensional structural schematic diagram of a wafer inspection and calibration device in the first embodiment of the present invention; Figure 2 is a hidden three-dimensional structural schematic diagram of a cover plate in the first embodiment of the present invention Figure 1; Figure 3 is a schematic diagram of the hidden three-dimensional structure of a cover plate in the first embodiment of the present invention Figure 2 ; Figure 4 is a top view structural schematic diagram of a wafer inspection and calibration device in the first embodiment of the present invention; Figure 5 is a three-dimensional structure schematic diagram of a wafer inspection and calibration device in the second embodiment of the present invention; Figure 6 is a schematic diagram of the hidden three-dimensional structure of a first wafer carrier ring and a second wafer carrier ring in the second embodiment of the present invention; Figure 7 is a partial three-dimensional structure schematic diagram of a calibration unit and a movable support unit in the second embodiment of the present invention Figure 1 ; Figure 8 is a partial three-dimensional structure schematic diagram of a pressing unit in the second embodiment of the present invention; Figure 9 is a partial three-dimensional structure schematic diagram of a calibration unit and a movable support unit in the second embodiment of the present invention Figure 2 ; Figure 10 is a partial three-dimensional sectional structure schematic diagram of a movable support unit in the second embodiment of the present invention; Figure 11 is a structural schematic diagram of the connection part between a pull rope and a limit frame in the second embodiment of the present invention; Figure 12 is a structural schematic diagram of the connection part between a third inclined block, a fourth inclined block and a pull rope in the second embodiment of the present invention.

[0018] Description of reference numerals: 111, base; 112, enclosure; 113, cover plate; 114, first wafer carrier ring; 115, second wafer carrier ring; 211, connecting shaft; 212, swing arm; 213, connecting rod; 214, movable platform; 215, first positioning platform; 216, first positioning plate; 217, second positioning platform; 218, second positioning plate; 219, cylinder; 220, push plate; 221, fixed frame; 222, carrier frame; 223, first carrier platform; 224, second carrier platform; 225, slideway; 226, rotating shaft; 227, guide roller; 311. movable shaft; 312. connecting arm; 313. pressure rod; 314. rubber pad; 315. connecting plate; 316. first spring; 317. first tilting block; 318. second tilting block; 319. push rod; 320. abutment block; 411. first support platform; 412. second support platform; 413. telescopic airbag; 414. three-way pipe; 415. connecting pipe; 416. movable groove; 417. movable plate; 418. third tilting block; 419. fourth tilting block; 420. pull rope; 421. limit frame; 422. guide column; 423. second spring. DETAILED DESCRIPTION

[0019] The subject matter described herein will now be discussed with reference to example embodiments. It should be understood that the discussion of these embodiments is only to enable those skilled in the art to better understand and implement the subject matter described herein, and the functions and arrangements of the elements discussed may be changed without departing from the scope of protection of the contents of this specification. Each example may omit, replace or add various processes or components as needed. In addition, the features described relative to some examples may also be combined in other examples.

[0020] according to Figure 1 As shown, an embodiment of the present invention provides a multi-size compatible wafer inspection calibrator, including: a calibrator body, a first wafer carrier ring 114 and a second wafer carrier ring 115; and a calibration unit for positioning and calibrating the first wafer carrier ring 114 and the second wafer carrier ring 115.

[0021] The calibrator body includes a base 111 , and a surrounding plate 112 is installed on the base 111 , and a cover plate 113 is installed on the surrounding plate 112 .

[0022] In one embodiment, according to the attached Figure 2 To Attachment Figure 4 As shown, the calibration unit includes a connecting shaft 211 connected to a base 111 by a bearing, and a swing arm 212 is installed on the connecting shaft 211. Both ends of the swing arm 212 are rotatably connected to a connecting rod 213 through a rotating shaft, and the end of the connecting rod 213 away from the swing arm 212 is rotatably connected to a movable platform 214 through a rotating shaft.

[0023] It should be understood that in this embodiment, when driving one set of movable platforms 214 to move, the swing arm 212, the connecting rod 213 and the movable platform 214 are rotationally connected. By driving the connecting rod 213 to drive the swing arm 212 to rotate, the two sets of movable platforms 214 move inwards or outwards simultaneously and synchronously, so as to facilitate adjusting the distance between the movable platforms 214 and also facilitate the centering and positioning operation in subsequent work.

[0024] Among them, the movable platform 214 extends through the enclosure plate 112 to the outer surface of the enclosure plate 112. The section of the movable platform 214 passing through the enclosure plate 112 forms a through section, and the enclosure plate 112 is provided with a slot adapted to the movable platform 214. In this embodiment, by slidingly connecting the movable platform 214 with the slot, it is convenient for the through section to pass through the slot and move within the slot, and the through section is limited in movement by the slot. Moreover, a cylinder 219 is installed on the base 111, and a push plate 220 is installed at the telescopic end of the cylinder 219. One set of movable platforms 214 is fixedly connected to the push plate 220. In this embodiment, when driving the cylinder 219 to perform telescopic movement, the cylinder 219 drives one set of movable platforms 214 to move through the push plate 220. By the rotational connection of the swing arm 212, the connecting rod 213 and the movable platform 214, the connecting rod 213 is driven to drive the swing arm 212 to rotate, so that the two sets of movable platforms 214 move inwards or outwards simultaneously and synchronously.

[0025] In addition, on the sides of the through sections of the two sets of movable platforms 214 close to each other, a first positioning platform 215 is installed, and a first positioning plate 216 is installed on the first positioning platform 215. The two first positioning plates 216 are used for clamping and positioning the first wafer carrier ring 114. On the sides of the through sections of the two sets of movable platforms 214 far from each other, a second positioning platform 217 is installed, and a second positioning plate 218 is installed on the second positioning platform 217. The two second positioning plates 218 are used for clamping and positioning the second wafer carrier ring 115.

[0026] Specifically, according to the attached Figure 3 and the attached Figure 4 As shown, on both sides inside the enclosure plate 112, fixing frames 221 are symmetrically installed, and a bearing frame 222 is installed on the fixing frames 221. The bearing frame 222 corresponds to the position of the movable platform 214. On the side of the bearing frame 222 close to each other, a first bearing platform 223 is installed, and the first bearing platform 223 is used for bearing and supporting the first wafer carrier ring 114. On the side of the bearing frame 222 far from each other, a second bearing platform 224 is installed, and the second bearing platform 224 is used for bearing and supporting the second wafer carrier ring 115.

[0027] It should be noted that a sliding groove 225 for the first positioning platform 215 to move is also provided inside the carrier 222; in this embodiment, due to the arrangement of the sliding groove 225, when the movable platform 214 moves, the first positioning platform 215 can move normally, avoiding interference from the carrier 222 during its movement.

[0028] In summary, by rotatably connecting the swing arm 212, the connecting rod 213 and the movable platform 214, the positions of the first positioning plate 216 and the second positioning plate 218 can be synchronously adjusted, so that the first positioning plate 216 and the second positioning plate 218 approach or move away from each other, thereby facilitating the adaptation to the first wafer carrier ring 114 and the second wafer carrier ring 115, and the first positioning plate 216 and the second positioning plate 218 can adapt to the first wafer carrier ring 114 and the second wafer carrier ring 115 with a large difference in size specifications; and by rotatably connecting the swing arm 212, the connecting rod 213 and the movable platform 214, the distance between the first positioning plate 216 and the second positioning plate 218 can also be finely adjusted, so as to adapt to a variety of wafer carrier rings with different sizes based on the sizes of the first wafer carrier ring 114 and the second wafer carrier ring 115, thus achieving multi-size compatibility.

[0029] Further, according to the attached Figure 5 and the attached Figure 8 As shown, a plurality of rotating shafts 226 are connected to the bearings on the first positioning plate 216 and the second positioning plate 218, and guide rollers 227 are installed on the rotating shafts 226. In this embodiment, the guide rollers 227 on the first positioning plate 216 and the second positioning plate 218 are connected to the bearings through the rotating shafts 226, and when contacting the first wafer carrier ring 114 and the second wafer carrier ring 115, the sliding friction is converted into rolling friction, reducing the contact stress during the positioning process, avoiding scratching the edges of the first wafer carrier ring 114 and the second wafer carrier ring 115, and also being able to perform positioning calibration on the edges of the first wafer carrier ring 114 and the second wafer carrier ring 115.

[0030] In another embodiment, according to the attached Figure 8 As shown, a pressing unit is provided inside the rotating shaft 226 for pressing and fixing the first wafer carrier ring 114 and the second wafer carrier ring 115, avoiding offset and dislocation of the first wafer carrier ring 114 and the second wafer carrier ring 115 during processing.

[0031] According to the attached Figure 8As shown in the figure, the pressing unit includes a through port opened inside the rotating shaft 226. An active shaft 311 is slidably connected inside the through port. A connecting arm 312 is installed on the active shaft 311. A pressing rod 313 is also installed on the connecting arm 312. A rubber pad 314 is installed at one end of the pressing rod 313 away from the connecting arm 312. Connecting plates 315 are symmetrically arranged on both sides below the first positioning plate 216 and the second positioning plate 218. The active shaft 311 is fixedly connected to the corresponding connecting plate 315. First inclined blocks 317 are installed at one end where every two groups of connecting plates 315 are close to each other. A second inclined block 318 is arranged on the first inclined block 317.

[0032] Specifically, push rods 319 are symmetrically arranged inside the first positioning plate 216 and the second positioning plate 218. And a plurality of push rods 319 are respectively slidably connected inside the first positioning plate 216 and the second positioning plate 218. The second inclined block 318 is fixedly connected to the push rod 319. Notches for the second inclined block 318 to slide are respectively opened on the first positioning plate 216 and the second positioning plate 218. Contact blocks 320 are installed at one end of multiple groups of push rods 319 close to the first bearing platform 223 and the second bearing platform 224.

[0033] It should be understood that when the movable table 214 drives the first positioning plate 216 or the second positioning plate 218 to approach each other, the contact blocks 320 respectively abut against the first bearing platform 223 and the second bearing platform 224. By squeezing the contact blocks 320, the contact blocks 320 drive the push rods 319 to move, so that the second inclined block 318 slides on the first inclined block 317.

[0034] When the second inclined block 318 slides along the inclined surface of the first inclined block 317, a downward component force is generated, squeezing the connecting plate 315 to drive the active shaft 311 to move downward. The active shaft 311 drives the pressing rod 313 to press downward through the connecting arm 312, so that the rubber pad 314 contacts the upper surface of the wafer carrier ring with a certain elastic pressure (such as 5 - 10 N), forming elastic pressing, and pressing and clamping the first wafer carrier ring 114 or the second wafer carrier ring 115.

[0035] Among them, a first spring 316 is provided on each group of active shafts 311 close to the first inclined block 317. One ends of multiple groups of first springs 316 are respectively installed on the first positioning plate 216 and the second positioning plate 218, and the other ends of multiple groups of first springs 316 are installed on the connecting plate 315. In this embodiment, through the setting of the first spring 316, it is convenient to assist the connecting plate 315 to reset and release the pressing and fixing of the rubber pad 314 on the first wafer carrier ring 114 or the second wafer carrier ring 115.

[0036] Furthermore, the inside of the rubber pad 314 is hollow. When the thicknesses of the first wafer carrier ring 114 or the second wafer carrier ring 115 are different, elastic deformation occurs in the hollow state of the rubber pad 314, enabling it to adapt to the first wafer carrier ring 114 and the second wafer carrier ring 115 with different thicknesses.

[0037] In yet another embodiment, according to the attached Figure 6 and the attached Figure 7 As shown, movable support units are provided on both the first carrier platform 223 and the second carrier platform 224.

[0038] According to the attached Figure 10 and the attached Figure 11 As shown, the movable support unit includes first support platforms 411 respectively installed on both sides of the first carrier platform 223 and the second carrier platform 224. A second support platform 412 is slidably connected inside the first support platform 411. A telescopic airbag 413 is installed inside the first support platform 411. One end of the telescopic airbag 413 away from each other is fixedly connected to the second support platform 412. One end of the telescopic airbag 413 close to each other is installed with a three-way pipe 414, and a connecting pipe 415 is installed on the three-way pipe 414. The connecting pipe 415 passes through the first carrier platform 223 and the second carrier platform 224 respectively and extends to the outer surfaces of the first carrier platform 223 and the second carrier platform 224.

[0039] It should be understood that when the telescopic airbag 413 is inflated through the connecting pipe 415, the airbag expands and pushes the second support platform 412 to slide outwards from inside the first support platform 411, expanding the support range. When deflated, the telescopic airbag 413 contracts, and the second support platform 412 retracts under its own gravity or external pulling force. This process realizes synchronous inflation and deflation of multiple telescopic airbags 413 through the three-way pipe 414, ensuring the movement consistency of the support platforms on both sides. Among them, parameters such as the inflation pressure of the telescopic airbag can be determined according to actual needs. Exemplarily, the inflation pressure of the telescopic airbag can be set to 0.2 - 0.5 MPa, which can drive the second support platform to expand outwards by 10 - 30 mm, and the support diameter range can cover 150 - 300 mm.

[0040] It should be noted that during operation, the connecting pipe 415 is connected to an external air supply device through a connecting hose to realize the injection and extraction of gas inside the connecting pipe 415.

[0041] In yet another embodiment, according to the attached Figure 12 As shown, a movable groove 416 is formed at one end of the second support platform 412 away from the first support platform 411, and a movable plate 417 is arranged above the movable groove 416. A third inclined block 418 is installed on one side of the movable plate 417 close to the movable groove 416, and a fourth inclined block 419 abuts against one side of the third inclined block 418.

[0042] Among them, a pulling rope 420 is installed on the fourth inclined block 419. The pulling rope 420 passes through the second support platform 412 and extends into the interior of the telescopic airbag 413. A limiting frame 421 is installed inside the telescopic airbag 413, and the limiting frame 421 is slidably connected to the pulling rope 420.

[0043] It should be noted that when the second support platform 412 is moved out of the first support platform 411, the pulling rope 420 is limited under the restraint of the limiting frame 421. When the first support platform 411 is fully unfolded, the pulling rope 420 is in a taut state at this time. The pulling rope 420 pulls the fourth inclined block 419 to move, and the fourth inclined block 419 squeezes the third inclined block 418. Under the action of the inclined surface, the movable plate 417 is jacked up. Among them, a silica gel pad is provided on the movable plate 417 to assist in supporting the first wafer carrier ring 114 or the second wafer carrier ring 115.

[0044] Specifically, guide grooves are formed on both sides inside the movable groove 416, and guide blocks are installed inside the guide grooves. The guide blocks are fixedly connected to the fourth inclined block 419. In this embodiment, through the arrangement of the guide grooves and the guide blocks, the fourth inclined block 419 is limited, so that it moves stably inside the movable groove 416, and the movable plate 417 can rise stably.

[0045] Furthermore, a plurality of guide posts 422 are installed on one side of the movable plate 417 close to the movable groove 416. Guide grooves adapted to the guide posts 422 are formed on the second support platform 412. The guide grooves are slidably connected to the guide posts 422. A second spring 423 is also provided on the guide posts 422. One end of the second spring 423 is fixedly connected to the guide groove, and the other end of the second spring 423 is fixedly connected to the guide post 422. In this embodiment, through the arrangement of the guide posts 422 and the second spring 423, the movable plate 417 can be reset, and a restraint force is provided when rising, so that it rises more stably.

[0046] The above describes the embodiments of the specific implementation manner, but this embodiment is not limited to the above specific implementation manner. The above specific implementation manner is only illustrative and not restrictive. Under the inspiration of this embodiment, those of ordinary skill in the art can also make many forms, all of which fall within the protection scope of this embodiment.

Claims

1. A multi-size compatible wafer inspection calibrator for positioning and calibrating a first wafer carrier ring and a second wafer carrier ring, characterized in that, include: A calibrator body, the calibrator body comprising a base, and a surrounding plate is installed on the base; A calibration unit, the calibration unit comprising a connecting shaft connected to the base by a bearing, a swing arm mounted on the connecting shaft, both ends of the swing arm being rotatably connected to a connecting rod via a rotating shaft, and one end of the connecting rod away from the swing arm being rotatably connected to a movable platform via a rotating shaft, the movable platform extending through the enclosure to the outer surface of the enclosure, the movable platform passing through a section of the enclosure to form a through section; A first positioning platform is installed on one side of the through section of the two groups of movable platforms that are close to each other, and a first positioning plate is installed on the first positioning platform. The two groups of the first positioning plates are used to clamp and position the first wafer carrier ring; A second positioning platform is installed on one side of the two groups of movable platform penetration sections that are far away from each other. A second positioning plate is installed on the second positioning platform. The two groups of the second positioning plates are used to clamp and position the second wafer carrier ring.

2. The multi-size compatible wafer inspection calibrator according to claim 1, wherein Fixed frames are symmetrically installed on both sides of the interior of the enclosure, and a carrying frame is installed on the fixed frame. The position of the carrying frame corresponds to that of the movable table. A first carrying platform is installed on the side close to the carrying frame, and the first carrying platform is used to carry and support the first wafer carrier ring. A second carrying platform is installed on the side away from the carrying frame, and the second carrying platform is used to carry and support the second wafer carrier ring.

3. A multi-size compatible wafer inspection calibrator according to claim 2, characterized in that, The first positioning plate and the second positioning plate are connected to multiple sets of rotating shafts with bearings, the rotating shafts are equipped with guide rollers, and a pressing unit is provided inside the rotating shafts. The pressing unit cooperates with the rotating shafts to press and fix the first wafer carrier ring and the second wafer carrier ring.

4. A multi-size compatible wafer inspection calibrator according to claim 3, wherein, The pressing unit includes a through opening opened inside the rotating shaft, a movable shaft is slidably connected in the through opening, a connecting arm is installed on the movable shaft, a pressure rod is also installed on the connecting arm, a rubber pad is installed on the end of the pressure rod away from the connecting arm, connecting plates are symmetrically arranged on both sides below the first positioning plate and the second positioning plate, the movable shaft is fixedly connected to the corresponding connecting plates, a first tilting block is installed on the close end of each two groups of connecting plates, and a second tilting block is arranged on the first tilting block.

5. A multi-size compatible wafer inspection calibrator according to claim 4, characterized in that, Push rods are symmetrically arranged inside the first positioning plate and the second positioning plate, and the plurality of push rods are slidably connected to the inside of the first positioning plate and the second positioning plate respectively. The second tilting block is fixedly connected to the push rods, and the first positioning plate and the second positioning plate are respectively provided with grooves for the second tilting block to slide. Abutment blocks are installed at one end of the plurality of push rods close to the first bearing platform and the second bearing platform.

6. A multi-size compatible wafer inspection calibrator according to claim 2, characterized in that, Both the first supporting platform and the second supporting platform are provided with a movable supporting unit, and the movable supporting unit includes a first supporting platform respectively installed on both sides of the first supporting platform and the second supporting platform, the first supporting platform is slidably connected to the second supporting platform inside, a telescopic airbag is installed inside the first supporting platform, the end of the telescopic airbag that is away from the second supporting platform is fixedly connected, the end of the telescopic airbag that is close to the telescopic airbag is installed with a three-way pipe, and a connecting pipe is installed on the three-way pipe.

7. A multi-size compatible wafer inspection calibrator according to claim 6, characterized in that, One end of the second support platform away from the first support platform is provided with a movable groove, above the movable groove is provided with a movable plate, on one side of the movable plate close to the movable groove is installed a third inclined block, one side of the third inclined block abuts against a fourth inclined block, and a pulling rope is installed on the fourth inclined block.

8. A multi-size compatible wafer inspection calibrator according to claim 7, characterized in that, The pulling rope passes through the second support platform and extends into the interior of the telescopic airbag, and a limiting frame is installed inside the telescopic airbag, and the limiting frame is slidably connected with the pulling rope.

9. A multi-size compatible wafer inspection calibrator according to claim 7, characterized in that, Guide grooves are opened on both sides inside the movable groove, and guide blocks are installed inside the guide grooves, and the guide blocks are fixedly connected with the fourth inclined block.

10. A multi-size compatible wafer inspection calibrator according to claim 7, characterized in that, Multiple groups of guide columns are installed on one side of the movable plate close to the movable groove, guide grooves adapted to the guide columns are opened on the second support platform, the guide grooves are slidably connected with the guide columns, and a second spring is further arranged on the guide columns.

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