High-speed connector

Abstract

The invention provides a high-speed connector, and particularly relates to the field of electric connectors, the high-speed connector comprises an insulating shell, a plurality of grounding frames arranged in the insulating shell and signal terminals arranged in the grounding frames, the grounding frames comprise a plurality of shielding spaces separated from the interior, and the signal terminals are arranged in the shielding spaces. According to the invention, the interior of the grounding frame is divided into a plurality of shielding spaces, and the signal terminals are separately arranged in each shielding space, so that the mutual crosstalk among the signal terminals can be reduced, and the transmission speed is improved.

Description

Technical Field

[0001] The present invention relates to the field of electrical connectors, and particularly to a high-speed connector. Background Art

[0002] A high-speed connector is a connector used to transmit high-speed signals or high-frequency signals. In order to achieve a high transmission rate of the high-speed connector, such as above 448 Gbps, it is necessary to ensure the signal integrity of the high-speed connector as much as possible. Some traditional high-speed connectors cannot meet this requirement because mutual crosstalk occurs between the signal receiving terminals and the signal transmitting terminals, resulting in the inability to reach the required transmission rate. Summary of the Invention

[0003] In order to solve the problem that the mutual crosstalk between signal terminals leads to a reduction in the transmission rate, the present invention proposes a high-speed connector.

[0004] The present invention is achieved through the following technical solutions:

[0005] The present invention proposes that the high-speed connector includes an insulating housing, at least one grounding frame disposed in the insulating housing, and signal terminals disposed in the grounding frame. The grounding frame includes a plurality of shielded spaces separated internally, and several of the signal terminals are respectively disposed in each of the shielded spaces in a separated manner.

[0006] Further, at least one first mounting groove is provided on the inner side of the insulating housing, and a grounding frame is provided on each of the upper and lower sides of each first mounting groove.

[0007] Further, the grounding frame includes an outer grounding plate, an inner grounding plate, and a partition grounding plate disposed between the outer grounding plate and the inner grounding plate. A plurality of the partition grounding plates are disposed between the outer grounding plate and the inner grounding plate and are respectively in close contact with the outer grounding plate and the inner grounding plate, and separate a plurality of shielded spaces between the outer grounding plate and the inner grounding plate.

[0008] Further, the partition grounding plate includes a body portion, a first connecting arm extending from one side of the body portion, and a second connecting arm extending from the other side of the body portion. A first grounding portion that is bent outward toward the center is formed on one side of the first connecting arm, and a second grounding portion that extends forward or backward is formed on one side of the second connecting arm.

[0009] Further, the outer grounding plate is disposed on the side of the partition grounding plate away from the center, and an avoidance space corresponding to the signal terminal is provided on the side of the outer grounding plate close to the first grounding portion.

[0010] Further, the signal terminal includes a bent portion, a first docking arm extending from one side of the bent portion, and a second docking arm extending from the other side of the bent portion. A first elastic arm extending toward the first grounding portion and into the avoidance space is formed on one side of the first docking arm, and a first welding portion extending toward the second grounding portion is formed on one side of the second docking arm.

[0011] Further, the signal terminal includes a receiving terminal pair and a transmitting terminal pair, and the receiving terminal pair and the transmitting terminal pair are sequentially arranged in each adjacent shielding space.

[0012] Further, a plurality of wafers are further arranged inside the shielding space, and the plurality of wafers are arranged on the signal terminal and fix the receiving terminal pair and the transmitting terminal pair.

[0013] Further, four second mounting grooves are further arranged on the side between the two first mounting grooves in the insulating housing, and a low-speed pin is mounted in each second mounting groove.

[0014] Further, a third mounting groove is arranged between the four second mounting grooves, and a power pin is mounted in the third mounting groove.

[0015] Advantages of the present invention:

[0016] (1) The high-speed connector proposed by the present invention uses the internal part of the grounding frame to partition a plurality of shielding spaces, and the signal terminals are partitioned and arranged in each shielding space, which can reduce the mutual crosstalk between the signal terminals, thereby improving the transmission speed.

[0017] (2) The high-speed connector proposed by the present invention uses the grounding frame to fix the signal terminals, making the signal terminals modular, and different grounding frames can be replaced according to actual situations to expand the signal terminals, with higher flexibility. Description of the drawings

[0018] Figure 1 is the overall structure diagram of the high-speed connector of the present invention;

[0019] Figure 2 is the exploded view of the high-speed connector of the present invention;

[0020] Figure 3 is the structure diagram of the grounding frame and signal terminal of the upper part of the high-speed connector of the present invention;

[0021] Figure 4 is the structure diagram of the grounding frame and signal terminal of the lower part of the high-speed connector of the present invention;

[0022] Figure 5 is the structure diagram of the signal terminal and partitioned ground plate of the high-speed connector of the present invention;

[0023] Figure 6 Rear structure diagram of the insulating housing of the high-speed connector of the present invention;

[0024] In the figure: insulating housing 1, first mounting groove 11, second mounting groove 12, third mounting groove 13, grounding frame 2, outer grounding plate 21, partition grounding plate 22, body portion 221, first connecting arm 212, second connecting arm 213, first grounding portion 214, second grounding portion 215, inner grounding plate 23, low-speed pin 3, power pin 4, signal terminal 5, bending portion 51, first docking arm 52, second docking arm 53, first elastic arm 54, first welding portion 55, wafer 6;

[0025] The realization, functional characteristics and advantages of the present invention will be further described in conjunction with embodiments with reference to the accompanying drawings. Specific embodiments

[0026] In order to more clearly and completely illustrate the technical solution of the present invention, the present invention will be further described below with reference to the accompanying drawings.

[0027] Please refer to Figures 1-6 , the present invention provides a high-speed connector including an insulating housing 1, at least one grounding frame 2 disposed in the insulating housing 1, and signal terminals 5 disposed in the grounding frame 2. The grounding frame 2 includes a plurality of shielded spaces separated internally, and several signal terminals 5 are respectively disposed in each shielded space in a separated manner.

[0028] In the specific embodiment, when the signal terminal 5 transmits a signal, signal crosstalk is likely to occur, which will reduce the transmission rate of the high-speed connector. The present invention uses the interior of the grounding frame 2 to separate a plurality of non-communicating shielded spaces, and then installs each signal terminal 5 into each shielded space respectively, and uses the grounding frame 2 to isolate the interference of the signal terminals 5 to improve the transmission rate.

[0029] Furthermore, at least one first mounting groove 11 is provided on the inner side of the insulating housing 1, and a grounding frame 2 is provided on each of the upper and lower sides of each first mounting groove 11.

[0030] In the specific embodiment, taking two mounting grooves as an example, a grounding frame 2 is provided on each of the upper and lower sides of the two mounting grooves in the insulating housing 1. The grounding frame 2 at the top and the grounding frame 2 at the bottom have similar structures, and a plurality of signal terminals 5 are fixed in each grounding frame 2.

[0031] Further, the grounding frame 2 includes an outer grounding plate 21, an inner grounding plate 23, and a partition grounding plate 22 disposed between the outer grounding plate 21 and the inner grounding plate 23. A plurality of partition grounding plates 22 are disposed between the outer grounding plate 21 and the inner grounding plate 23 and are respectively in close contact with the outer grounding plate 21 and the inner grounding plate 23, and a plurality of shielding spaces are separated between the outer grounding plate 21 and the inner grounding plate 23.

[0032] In a specific embodiment, clamping portions are provided at both the top and bottom of the partition grounding plate 22, through grooves are provided on both the outer grounding plate 21 and the inner grounding plate 23, and the clamping portions of the partition grounding plate 22 are inserted into the corresponding through grooves to complete the fixation. The signal terminals 5 are located between the outer grounding plate 21 and the inner grounding plate 23 and are separated by the partition grounding plate 22 to prevent crosstalk between the signal terminals 5.

[0033] Further, the partition grounding plate 22 includes a main body portion 221, a first connecting arm 212 extending from one side of the main body portion 221, and a second connecting arm 213 extending from the other side of the main body portion 221. A first grounding portion 214 that is bent outward toward the center is formed on one side of the first connecting arm 212, and a second grounding portion 215 that extends forward or backward is formed on one side of the second connecting arm 213.

[0034] In a specific embodiment, the main body portion 221 is bent at a right angle, and the bottom and left side of the main body portion 221 are respectively connected to the first connecting arm 212 and the second connecting arm 213; at the top of the first installation groove 11, the end of the first connecting arm 212 of the grounding frame 2 forms an arc-shaped and upwardly bent first grounding portion 214, and at the same time, the end of the second connecting arm 213 forms a second docking grounding portion extending backward; at the bottom of the first installation groove 11, the end of the first connecting arm 212 of the grounding frame 2 forms an arc-shaped and downwardly bent first grounding portion 214, and at the same time, the end of the second connecting arm 213 of the second connecting arm 213 forms a second docking grounding portion extending forward. In the present invention, the signal terminals 5 are installed in the grounding frame 2 to avoid crosstalk, and at the same time, by using the integrated grounding frame 2, the grounding frame 2 can be selected and replaced to expand the signal terminals 5, and the configuration is more flexible.

[0035] In one embodiment, four L-shaped grounding frames 2 arranged in a 2*2 pattern are respectively installed in the first installation groove 11, and the lengths of the first connecting arm 212 and the second connecting arm 213 of the top grounding frame 2 are smaller than those of the bottom grounding frame 2, so that the first grounding portions 214 of the top and bottom grounding frames 2 are vertically aligned while the second grounding portions 215 are horizontally aligned.

[0036] Further, the outer grounding plate 21 is disposed on the side of the partition grounding plate 22 away from the center, and an avoidance space corresponding to the signal terminal 5 is provided on the side of the outer grounding plate 21 close to the first grounding portion 214.

[0037] In a specific embodiment, the outer ground plates 21 are respectively arranged at the top and bottom of the top partition ground plate 22. When the signal terminals 5 are docked, the external interface is inserted into the signal terminals 5, causing the signal terminals 5 to deform within the avoidance space. When the interfaces are separated, the signal terminals 5 will return to their original state.

[0038] Further, the signal terminal 5 includes a bent portion 51, a first docking arm 52 extending from one side of the bent portion 51, and a second docking arm 53 extending from the other side of the bent portion 51. A first elastic arm 54 extending toward the first grounding portion 214 side into the avoidance space is formed on one side of the first docking arm 52, and a first welding portion 55 extending toward the second grounding portion 215 is formed on one side of the second docking arm 53.

[0039] In a specific embodiment, the bent portion 51 is provided with a first docking arm 52 extending leftward and a second docking arm 53 extending downward. The first elastic arm 54 formed on the first docking arm 52 is used to dock with the external interface, and the first welding portion 55 is welded to the circuit board.

[0040] In one embodiment, the signal terminals 5 and the grounding frame 2 are in one-to-one correspondence. The first docking arm 52 and the second docking arm 53 of the top signal terminal 5 are longer than those of the bottom signal terminal 5, so that the first elastic arms 54 of the top signal terminal 5 and the bottom signal terminal 5 are vertically aligned while the first welding portions 55 are horizontally aligned.

[0041] Further, the signal terminal 5 includes a receiving terminal pair and a transmitting terminal pair, and the receiving terminal pair and the transmitting terminal pair are sequentially arranged in each adjacent shielding space.

[0042] In a specific embodiment, the receiving terminal pair includes two horizontally parallel receiving terminals, and the transmitting terminal includes two horizontally parallel transmitting terminals. Using the partition ground plate 22 to separate the receiving terminal pair and the transmitting terminal pair can minimize crosstalk between the terminals and improve the transmission speed.

[0043] In one embodiment, it is also possible to select to install the receiving terminal pair and the transmitting terminal pair in different shielding spaces of the same grounding frame 2 or in the shielding spaces of different grounding frames 2 according to the actual situation.

[0044] Further, a plurality of wafers 6 are also arranged inside the shielding space. The plurality of wafers 6 are arranged on the signal terminals 5 and fix the receiving terminal pair and the transmitting terminal pair.

[0045] In a specific embodiment, the wafer 6 wraps the receiving terminal pair or the signal terminal pair, and the wafer 6 is used to fix the paired receiving terminals or transmitting terminals.

[0046] Furthermore, four second mounting grooves 12 are provided on the side between the two first mounting grooves 11 in the insulating housing 1, and a low-speed pin 3 is installed in each second mounting groove 12.

[0047] In a specific embodiment, second mounting grooves 12 arranged in a 2×2 pattern are provided at the middle position between the two first mounting grooves 11 of the insulating housing 1. The low-speed pins 3 are fixed in the second mounting grooves 12, and one end of each low-speed pin 3 extends out of the insulating housing 1.

[0048] Furthermore, a third mounting groove 13 is provided between the four second mounting grooves 12, and a power supply pin 4 is installed in the third mounting groove 13.

[0049] In a specific embodiment, the third mounting groove 13 is provided at the central position of the four second mounting grooves 12, and one end of the power supply pin 4 extends out of the insulating housing 1.

[0050] Certainly, the present invention may have many other embodiments. Based on this embodiment, other embodiments obtained by those of ordinary skill in the art without any creative work belong to the scope protected by the present invention.

Claims

1. A high-speed connector, characterized in that, It includes an insulating housing, at least one grounding frame disposed within the insulating housing, and signal terminals disposed within the grounding frame. The grounding frame includes a plurality of shielding spaces separated internally, and several of the signal terminals are separately disposed in each of the shielding spaces.

2. The high-speed connector according to claim 1, wherein At least one first mounting groove is provided on the inner side of the insulating housing, and a grounding frame is provided on each of the upper and lower sides of each first mounting groove.

3. The high-speed connector according to claim 2, wherein The grounding frame includes an outer grounding plate, an inner grounding plate, and a partition grounding plate disposed between the outer grounding plate and the inner grounding plate. A plurality of the partition grounding plates are disposed between the outer grounding plate and the inner grounding plate and are respectively in close contact with the outer grounding plate and the inner grounding plate, and separate a plurality of shielding spaces between the outer grounding plate and the inner grounding plate.

4. The high-speed connector according to claim 3, characterized in that, The partition grounding plate includes a body portion, a first connecting arm extending from one side of the body portion, and a second connecting arm extending from the other side of the body portion. A first grounding portion bent outward toward the center is formed on one side of the first connecting arm, and a second grounding portion extending forward or backward is formed on one side of the second connecting arm.

5. The high-speed connector according to claim 4, wherein The outer grounding plate is disposed on the side of the partition grounding plate away from the center, and an avoidance space corresponding to the signal terminal is provided on the side of the outer grounding plate close to the first grounding portion.

6. The high-speed connector according to claim 5, characterized in that The signal terminal includes a bent portion, a first docking arm extending from one side of the bent portion, and a second docking arm extending from the other side of the bent portion. A first elastic arm extending toward the first grounding portion and into the avoidance space is formed on one side of the first docking arm, and a first welding portion extending toward the second grounding portion is formed on one side of the second docking arm.

7. The high-speed connector according to claim 6, characterized in that, The signal terminal includes a receiving terminal pair and a transmitting terminal pair, and the receiving terminal pair and the transmitting terminal pair are sequentially disposed in each adjacent shielding space.

8. The high-speed connector according to claim 7, wherein A plurality of wafers are further provided inside the shielding space, and the plurality of wafers are disposed on the signal terminals and fix the receiving terminal pair and the transmitting terminal pair.

9. The high-speed connector according to claim 1, characterized in that, Four second mounting grooves are further provided on the side between the two first mounting grooves in the insulating housing, and a low-speed pin is mounted in each second mounting groove.

10. The high-speed connector according to claim 9, wherein, A third mounting groove is provided between the four second mounting grooves, and a power pin is mounted in the third mounting groove.

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