High-density semiconductor laser heat dissipation device

Abstract

The invention relates to a high-density semiconductor laser heat dissipation device, which comprises a laser shell and a cover plate which are encircled to form a cooling working medium flowing area, a micro-channel heat dissipation structure is arranged on the side, close to the cover plate, of the laser shell and comprises a first shell groove and a micro-channel groove formed in the bottom of the first shell groove, a plurality of micro-rib columns are arranged in the micro-channel groove in an array mode, and the micro-rib columns arranged in the array mode form one or more micro-channel areas. The side, close to the laser shell, of the cover plate is provided with step-shaped press-fit bosses, heat insulation grooves, diversion grooves, drainage grooves, a cooling working medium inlet cavity and a cooling working medium outlet cavity, the press-fit bosses correspond to the micro-channel areas in position, and the cooling working medium inlet cavity and the cooling working medium outlet cavity are separated through the heat insulation grooves. And the cooling working medium inlet cavity and the cooling working medium outlet cavity are respectively communicated with the diversion groove and the drainage groove. According to the heat dissipation device, the heat dissipation problem of high heat flux of the high-power semiconductor laser is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and particularly relates to a heat dissipation device for a high-density semiconductor laser. Background Art

[0002] With the rapid development of industrial processing, communication, medical, and scientific research fields, the demand for power of semiconductor lasers is continuously increasing. However, with the continuous increase in the power density of semiconductor lasers, the high heat generated during their operation has a more significant impact on the performance and lifespan of the lasers. Therefore, how to dissipate heat efficiently has become a key issue in the research and development of semiconductor laser technology.

[0003] In existing laser devices, the damage and power decline of the pump source are generally caused by uneven heat dissipation structures or large thermal resistance between the heat dissipation unit and the heat source, resulting in insufficient heat dissipation efficiency. In the prior art, a heat pipe or a water-cooling heat dissipation technology with a cold head is usually used to dissipate heat from the entire pump source. However, due to the limitations of passive heat dissipation itself and large thermal resistance, the heat exchange effect is very limited. And the pump source is the core component of the semiconductor laser, and the damage of the pump source will lead to the paralysis of the entire semiconductor laser, seriously affecting its normal operation. Summary of the Invention

[0004] Aiming at at least one of the problems in the prior art, such as low heat exchange efficiency of the semiconductor laser heat dissipation module, decrease in laser output power caused by too high temperature of the semiconductor laser chip, fluctuation of output wavelength, and reduction of beam quality, the present invention provides a heat dissipation device for a high-density semiconductor laser.

[0005] The object of the present invention can be achieved by the following technical solutions:

[0006] A heat dissipation device for a high-density semiconductor laser includes a laser housing and a cover plate, and the two enclose a cooling working medium flow region;

[0007] On one side of the laser housing close to the cover plate, there is a microchannel heat dissipation structure, and the microchannel heat dissipation structure includes a first housing groove, and one or more microchannel grooves provided at the bottom of the first housing groove. A number of micro rib columns are arranged in an array in the microchannel grooves, and the array of a number of the micro rib columns forms an array micro rib region;

[0008] On one side of the cover plate close to the laser housing, there are one or more stepped pressing bosses, heat insulation grooves, one or more shunt grooves, one or more drainage grooves, a cooling working medium inlet chamber and a cooling working medium outlet chamber formed on the surface of the cover plate. The pressing bosses correspond to the positions of the array micro-rib regions respectively. The heat insulation grooves separate the cooling working medium inlet chamber and the cooling working medium outlet chamber. The cooling working medium inlet chamber and the cooling working medium outlet chamber are respectively communicated with one or more shunt grooves and one or more drainage grooves.

[0009] Furthermore, a cooling working medium inlet and a cooling working medium outlet are also provided on the cover plate, and they are respectively communicated with the cooling working medium inlet chamber and the cooling working medium outlet chamber; both the cooling working medium inlet and the cooling working medium outlet are equipped with cooling working medium inlet and outlet connectors.

[0010] Furthermore, on the side of the laser housing facing away from the cover plate, there is a second housing groove. At the bottom of the second housing groove, there are one or more laser chip placement platforms, one or more transition platforms, one or more optical device placement platforms and an optical device placement area. Among them, the laser chip placement platforms are used to place laser chips, and the optical device placement platforms and the optical device placement area are used to place optical devices and adjust the optical path. The micro-channel groove is directly below the laser chip placement platform.

[0011] Furthermore, multiple laser chip placement platforms are distributed in a stepped manner at the bottom of the second housing groove. Each laser chip placement platform has a top surface, and one or more laser chips can be accommodated in the limited space of this top surface; that is to say, on the side of the laser housing facing away from the cover plate, there is a second housing groove, and at the bottom of the second housing groove, there are multiple laser chip placement platforms distributed in a stepped manner. Each laser chip placement platform has a top surface, and one or more laser chips can be accommodated in the limited space of this top surface;

[0012] Multiple transition platforms are distributed in a stepped manner at the bottom of the second housing groove and are adjacent to the laser chip placement platforms. Each transition platform has a top surface, and this top surface is flush with or lower than the top surface of the laser chip placement platform;

[0013] Multiple optical device placement platforms are distributed in a stepped manner at the bottom of the second housing groove and are adjacent to the transition platforms. Each optical device placement platform has a top surface, and this top surface is flush with or lower than the top surface of each platform of the laser chip placement platform, and one or more optical devices can be accommodated in its limited space;

[0014] The optical device placement areas are distributed in a stepped manner at the bottom of the groove of the second housing. The optical device placement areas have one or more platforms or grooves, each platform or groove has a flat surface, and one or more optical devices can be accommodated within the limited space of each flat surface.

[0015] Further, one or more optical fiber ports and optical fiber fixing ports are provided on the side surface of the laser housing, which are used for placing and fixing optical fibers respectively;

[0016] A connector is provided on the side surface of the laser housing for powering the laser chip. Among them, the surface of the connector is made of ceramic or other insulating materials, and the solid part inside is made of copper or other conductive materials, serving as the first electrode and the second electrode to supply power to the laser chip;

[0017] One or more extending structures are provided on the side surface of the laser housing. The extending structures are formed on the outer wall surface of the side surface of the laser housing and are provided with housing mounting holes, and the housing mounting holes are threaded through holes or non-threaded through holes;

[0018] The microchannel groove is provided at the bottom of the groove of the first housing and is directly below the laser chip placement platform. The microchannel groove has a plurality of stepped bottom surfaces, and the mapped projection of the limited space of each bottom surface on the laser chip placement platform includes one or more platform top surfaces of the laser chip placement platform and is located directly below them.

[0019] Further, the micro rib columns are formed on one or more bottom surfaces of the microchannel groove and are directly below one or more platform top surfaces of the laser chip placement platform;

[0020] The shapes of the horizontal cross-section and the vertical cross-section of the micro rib columns are rectangular, rounded rectangular, S-shaped, T-shaped, Z-shaped, I-shaped, arc-shaped, circular, semi-circular, triangular, trapezoidal, parallelogram-shaped, elliptical, droplet-like or polygonal;

[0021] The length and width of the micro rib columns parallel to the bottom surface of the microchannel groove are between 10 micrometers and 10 millimeters, and the height perpendicular to the bottom surface of the microchannel groove is between 10 micrometers and 10 millimeters;

[0022] The intervals between adjacent two micro rib columns or between the micro rib columns near the inner wall of the microchannel groove and the inner wall of the microchannel groove form microchannels, and the spacing is between 1 micrometer and 10 centimeters; the arrangement of the micro rib columns is in-line or staggered arrangement.

[0023] Further, the pressing bosses are formed on the surface of the cover plate and are directly above the array micro rib area. The pressing bosses have one or more platforms, each platform has a length, a width and a height, and there is a distance between each platform and the platform;

[0024] An interval area between each platform of the pressing boss is alternately provided with one or more flow dividing grooves and one or more flow guiding grooves to serve as a cooling path for the cooling working medium in the direction perpendicular to the plane of the platform of the pressing boss;

[0025] The flow dividing grooves and the flow guiding grooves are formed on the surface of the cover plate, and have a bottom surface. Each bottom surface of the flow dividing grooves and the flow guiding grooves has a length, a width and a depth, and corresponds to the interval area between two adjacent array micro-rib areas; the one or more flow dividing grooves communicate on one side thereof to form a cooling working medium inlet chamber; the one or more flow guiding grooves communicate on one side thereof to form a cooling working medium outlet chamber;

[0026] Each platform of the pressing boss has a top surface, and each top surface is attached to the upper surface of the micro-rib column and jointly forms a micro-channel with the micro-rib column;

[0027] The attachment manner between the top surface of each platform in the pressing boss and the micro-rib column is direct abutment, that is, the attachment between metal surfaces, or an elastic gasket is placed in the middle and then the two are fully attached.

[0028] Further, the heat insulation groove is formed on the surface of the cover plate and is located between the cooling working medium inlet chamber and the cooling working medium outlet chamber;

[0029] The cooling working medium inlet is formed on the surface of the cover plate and penetrates through the cover plate entity to form an opening, and communicates with the cooling working medium inlet chamber; the cooling working medium outlet is formed on the surface of the cover plate and penetrates through the cover plate entity to form an opening, and communicates with the cooling working medium outlet chamber; the cooling working medium inlet and the cooling working medium outlet are threaded through holes or non-threaded through holes;

[0030] The cooling working medium inlet and outlet joint can be a pagoda joint, a quick plug, a flange joint or an external thread joint, etc.;

[0031] The connection manner between the cooling working medium inlet and the cooling working medium outlet and the cooling working medium inlet and outlet joint is threaded connection, welding, clamping or sealant connection.

[0032] Further, the material of the laser shell and the cover plate is any one of copper, aluminum, aluminum alloy, stainless steel, copper-aluminum alloy, magnesium alloy, aluminum oxide, aluminum nitride, silicon nitride, gallium nitride, silicon carbide or silicon, plastic, resin or glass.

[0033] Further, the connection manner between the laser shell and the cover plate is any one of threaded connection, welding connection, snap connection and riveting connection;

[0034] When the connection mode between the laser housing and the cover plate is a threaded connection, the heat dissipation device further includes a sealing gasket, screws and an O-ring. A plurality of cover plate mounting holes, which are threaded holes, are provided around the microchannel groove on the back surface of the laser housing. On the bottom surface of the first housing groove on the back surface of the laser housing, there are first fixing base columns and second fixing base columns with raised structures, which are formed on the bottom surface of the first housing groove and have threaded holes in the internal solid area. The cover plate is provided with a plurality of fixing holes, which are formed on the surface of the cover plate and penetrate through. The fixing holes correspond to the cover plate mounting holes in size and position one by one. The fixing holes are threaded through holes or non-threaded through holes. The sealing gasket is attached between the bottom surface of the first housing groove and the surface of the cover plate, and is provided with one or more through ports. The O-ring is pressed between the top surface of the first fixing base column and the cover plate. The O-ring is correspondingly sized with the first fixing base column.

[0035] When the connection mode between the laser housing and the cover plate is welding, a welding contact surface is provided between the laser housing and the cover plate, and welding is carried out by one or more of fusion welding, pressure welding, brazing, and special welding.

[0036] When the connection mode between the laser housing and the cover plate is snap connection, a sealing gasket and an O-ring are provided between the laser housing and the cover plate for sealing. The laser housing and the cover plate are provided with corresponding snap structures, such as hooks and slots.

[0037] When the connection mode between the laser housing and the cover plate is riveting connection, a sealing gasket and an O-ring are provided between the laser housing and the cover plate for sealing. The laser housing and the cover plate are provided with corresponding through holes for placing rivets to achieve riveting fixation.

[0038] Compared with the prior art, the present invention provides a high-density semiconductor laser heat dissipation device, which can be applied to the heat dissipation requirements of CPU / GPU, various chips, electronic devices and equipment. The device integrates a microchannel composed of micro rib columns through the laser housing, reduces the thermal resistance between the laser chip and the microchannel, enhances the heat transfer efficiency, and at the same time, the design of the multi-channel loop provides a heat dissipation path for each laser chip. Through the forced convection heat transfer effect of the cooling working medium in the microchannel, the overall heat dissipation capacity and thermal stability are greatly improved. The microchannel has the advantages of small volume, light weight, high heat transfer efficiency, etc., and has great advantages in the process of strengthening heat transfer, and solves the heat dissipation problem of high heat flux density of high-power semiconductor lasers. Description of the Drawings

[0039] Figure 1 It is a schematic structural diagram of the laser heat dissipation device in the present invention;

[0040] Figure 2 It is an exploded view of the laser heat dissipation device in the present invention;

[0041] Figure 3 Schematic diagram of the back structure of the laser housing in the present invention;

[0042] Figure 4 Top view schematic diagram of the back structure of the laser housing in the present invention;

[0043] Figure 5 Detailed structure diagram of part A of the microchannel groove in the present invention;

[0044] Figure 6 Schematic diagram of the front structure of the laser housing in the present invention;

[0045] Figure 7 Top view schematic diagram of the front structure of the laser housing in the present invention;

[0046] Figure 8 Perspective schematic diagram of the laser housing structure in the present invention;

[0047] Figure 9 For Figure 7 Structural cross-sectional view of the A-A cutting line;

[0048] Figure 10 For Figure 7 Structural cross-sectional view of the B-B cutting line;

[0049] Figure 11 For Figure 7 Structural cross-sectional view of the C-C cutting line;

[0050] Figure 12 Schematic diagram of the back structure of the cover plate in the present invention;

[0051] Figure 13 Top view schematic diagram of the front structure of the cover plate in the present invention;

[0052] Figure 14 Top view schematic diagram of the back structure of the cover plate in the present invention;

[0053] Figure 15 Schematic diagram of the structure of the sealing gasket in the present invention;

[0054] Figure 16 Schematic diagram of the structure of the O-ring in the present invention;

[0055] Figure 17 For Figure 14 Structural cross-sectional view of the D-D cutting line;

[0056] Figure 18 Structural cross-sectional view of the A-A cutting line of the combined structure of the laser housing - sealing gasket - cover plate in the present invention;

[0057] Figure 19Perspective view of the laser housing-sealing gasket-cover combination structure in the present invention;

[0058] Figure 20 is Figure 1 Schematic structural view of another laser heat dissipation device of the present invention as shown;

[0059] Figure 21 is Figure 20 explosion schematic view of;

[0060] Figure 22 is Figure 20 schematic view of the back structure of the laser housing of;

[0061] Figure 23 is Figure 20 schematic view of the back structure of the cover of;

[0062] Figure 24 Schematic view of the optional micro-rib column structure in the present invention;

[0063] Figure 25 Schematic view of the arrangement of micro-rib columns in the present invention;

[0064] As indicated by the reference numerals in the figure: 100 - laser housing; 200 - sealing gasket; 300 - cover; 400 - screw; 500 - cooling medium inlet and outlet joint; 600 - O-ring; 110 - first housing groove; 111 - first fixing base column; 112 - second fixing base column; 113 - cover mounting hole; 120 - microchannel groove; 130 - extension structure; 131 - housing mounting hole; 140 - array micro-rib region; 141 - micro-rib column; 150 - second housing groove; 151 - laser chip placement platform; 152 - transition platform; 153 - optical device placement platform; 160 - optical device placement area; 170 - optical fiber fixing port; 180 - optical fiber port; 190 - connector; 210 - first through hole; 220 - second through hole; 230 - third through hole; 310 - cooling medium outlet chamber; 311 - cooling medium outlet; 320 - fixing hole; 330 - heat insulation groove; 340 - cooling medium inlet chamber; 350 - pressing boss; 341 - cooling medium inlet; 361 - first diversion groove; 362 - second diversion groove; 363 - third diversion groove; 364 - fourth diversion groove; 371 - first drainage groove; 372 - second drainage groove; 373 - third drainage groove; 374 - fourth drainage groove. Detailed implementation mode

[0065] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation manners and specific operation processes are given, but the protection scope of the present invention is not limited to the following embodiments.

[0066] In the description of the invention, it should be understood that the orientation or positional relationships such as "upper", "lower", "left", "right", "inner", "outer", "length", "width", "depth", "thickness", "front", "back", "left side", "right side", etc. are all based on the positions shown in the drawings, and are only for the convenience of description and simplification, and do not limit that the device or element must have a specific orientation, structure or operation mode. Therefore, the expressions related to the positional relationships in the drawings are only for illustrative purposes and should not be regarded as a limitation to the present invention. Those of ordinary skill in the art can reasonably understand the meanings of the above terms according to specific circumstances.

[0067] In addition, the terms "first" and "second" are only used to distinguish different features, and do not indicate their relative importance, nor imply the specific quantity of the technical features. Therefore, the features including "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" and "several" generally refer to two or more, unless otherwise clearly defined. Additionally, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection, or an indirect connection through an intermediate medium, or the communication inside two elements, etc. Those of ordinary skill in the art can reasonably understand the applicable meanings of the above terms in the present invention according to specific circumstances.

[0068] To solve at least one of the problems in the prior art such as the low heat exchange efficiency of the semiconductor laser cooling module, the decrease in the laser output power caused by the overhigh temperature of the semiconductor laser chip, the fluctuation of the output wavelength, and the reduction of the beam quality, the present invention provides a high-density semiconductor laser cooling device, including a laser housing 100 and a cover plate 300, which together enclose a cooling working medium flow region;

[0069] On one side of the laser housing 100 close to the cover plate 300, a microchannel heat dissipation structure is provided, and the microchannel heat dissipation structure includes: a first housing groove 110, and one or more microchannel grooves 120 provided at the bottom of the first housing groove 110. A plurality of micro rib columns 141 are arrayed in the microchannel grooves 120, and the plurality of arrayed micro rib columns 141 form an array micro rib region 140;

[0070] One side of the cover plate 300 near the laser housing 100 is provided with one or more stepped pressing bosses 350, a heat insulation groove 330, one or more diverter grooves, one or more drainage grooves, a cooling medium inlet chamber 340 and a cooling medium outlet chamber 310 formed on the surface of the cover plate 300, the pressing bosses 350 respectively correspond to the positions of the array micro-rib areas 140, the heat insulation groove 330 separates the cooling medium inlet chamber 340 and the cooling medium outlet chamber 310, and the cooling medium inlet chamber 340 and the cooling medium outlet chamber 310 are respectively connected to one or more diverter grooves 360 and one or more drainage grooves 370.

[0071] In some embodiments of the present invention, the cover plate 300 is further provided with a cooling medium inlet 341 and a cooling medium outlet 311, which are respectively connected to the cooling medium inlet chamber 340 and the cooling medium outlet chamber 310; the cooling medium inlet 341 and the cooling medium outlet 311 are both installed with cooling medium inlet and outlet joints 500; the cooling medium inlet 341 and the cooling medium outlet 311 can both be used as the inlet or outlet of the cooling medium.

[0072] In some embodiments of the present invention, a second shell groove 150 is provided on the side of the laser housing 100 facing away from the cover plate 300, and one or more laser chip placement platforms 151, one or more transition platforms 152, one or more optical device placement platforms 153 and an optical device placement area 160 are provided at the bottom of the second shell groove 150, wherein the laser chip placement platform 151 is used to place the laser chip, the optical device placement platform 153 and the optical device placement area 160 are used to place the optical device and adjust the optical path, and the microchannel groove 120 is located directly below the laser chip placement platform 151.

[0073] In some embodiments of the present invention, a plurality of laser chip placement platforms 151 are distributed in a stepped manner at the bottom of the second shell groove 150, and each of the laser chip placement platforms 151 has a top surface, and one or more laser chips can be accommodated in the limited space of the top surface; that is, a second shell groove 150 is provided on the side of the laser housing 100 away from the cover plate 300, and a plurality of laser chip placement platforms 151 are distributed in a stepped manner at the bottom of the second shell groove 150, and each of the laser chip placement platforms 151 has a top surface, and one or more laser chips can be accommodated in the limited space of the top surface.

[0074] In some embodiments of the present invention, a plurality of the transition platforms 152 are distributed in a stepped manner at the bottom of the second housing groove 150 and adjacent to the laser chip placement platform 151. Each of the transition platforms 152 has a top surface, which is flush with or lower than the top surface of the laser chip placement platform 151;

[0075] In some embodiments of the present invention, a plurality of the optical device placement platforms 153 are distributed in a stepped manner at the bottom of the second housing groove 150 and adjacent to the transition platforms 152. Each of the optical device placement platforms 153 has a top surface, which is flush with or lower than the top surface of each platform of the laser chip placement platform 151, and can accommodate one or more optical devices within its limited space;

[0076] In some embodiments of the present invention, the optical device placement area 160 is distributed in a stepped manner at the bottom of the second housing groove 150. The optical device placement area 160 has one or more platforms or grooves, and each platform or groove has a flat surface. One or more optical devices can be accommodated within the limited space of each flat surface.

[0077] In some embodiments of the present invention, one or more optical fiber ports 180 and optical fiber fixing ports 170 are provided on the side surface of the laser housing 100, which are used for placing and fixing optical fibers respectively;

[0078] In some embodiments of the present invention, a connector 190 is provided on the side surface of the laser housing 100, which is used to power the laser chip; wherein, the surface of the connector 190 is made of ceramic or other insulating materials, and the internal solid part is made of copper or other conductive materials, serving as the first electrode and the second electrode to supply power to the laser chip;

[0079] In some embodiments of the present invention, one or more extension structures 130 are provided on the side surface of the laser housing 100. The extension structures 130 are formed on the outer wall surface of the side surface of the laser housing 100, and a housing mounting hole 131 is provided. The housing mounting hole 131 is a threaded through hole or a non-threaded through hole;

[0080] In some embodiments of the present invention, the microchannel groove 120 is provided at the bottom of the first housing groove 110 and directly below the laser chip placement platform 151. The microchannel groove 120 has a plurality of stepped bottom surfaces, and the mapped projection of the limited space of each bottom surface on the laser chip placement platform 151 includes one or more platform top surfaces of the laser chip placement platform 151 and is located directly below them.

[0081] In some embodiments of the present invention, the micro rib columns 141 are formed on one or more bottom surfaces of the microchannel groove 120 and directly below one or more platform top surfaces of the laser chip placement platform 151;

[0082] In some embodiments of the present invention, the shapes of the horizontal cross-section and the vertical cross-section of the micro rib columns 141 are rectangular, rounded rectangular, S-shaped, T-shaped, Z-shaped, I-shaped, arc-shaped, circular, semi-circular, triangular, trapezoidal, parallelogram-shaped, elliptical, water-droplet-like, or polygonal, etc.;

[0083] In some embodiments of the present invention, the length and width of the micro rib columns 141 parallel to the bottom surface of the microchannel groove 120 are between 10 micrometers and 10 millimeters, and the height perpendicular to the bottom surface of the microchannel groove 120 is between 10 micrometers and 10 millimeters;

[0084] In some embodiments of the present invention, the intervals between two adjacent micro rib columns 141 or between the micro rib columns 141 near the inner wall of the microchannel groove 120 and the inner wall of the microchannel groove 120 form microchannels, and the distance therebetween is between 1 micrometer and 10 centimeters; the arrangement of the micro rib columns 141 is in-line or staggered arrangement.

[0085] In some embodiments of the present invention, the pressing boss 350 is formed on the surface of the cover plate 300 and is directly above the array micro rib region 140. The pressing boss 350 has one or more platforms, each platform having a length, a width, and a height, and a distance is left between each platform and another platform;

[0086] In some embodiments of the present invention, one or more flow dividing grooves 360 and one or more flow guiding grooves 370 are alternately arranged in the interval regions between each platform of the pressing boss 350 to serve as the cooling path for the cooling working medium in the direction perpendicular to the plane of the platform of the pressing boss 350;

[0087] In some embodiments of the present invention, the flow dividing grooves 360 and the flow guiding grooves 370 are formed on the surface of the cover plate 300, and they have bottom surfaces. The bottom surface of each flow dividing groove 360 and each flow guiding groove 370 has a length, a width, and a depth, and corresponds to the interval region between two adjacent array micro rib regions 140; the one or more flow dividing grooves 360 communicate on one side thereof to form a cooling working medium inlet chamber 340; the one or more flow guiding grooves 370 communicate on one side thereof to form a cooling working medium outlet chamber 310;

[0088] In some embodiments of the present invention, each platform of the pressing boss 350 has a top surface, and each top surface fits against the upper surface of the micro rib column 141 to jointly form a microchannel with the micro rib column 141;

[0089] In some embodiments of the present invention, the fitting manner between the top surface of each platform of the pressing boss 350 and the micro rib column 141 is direct abutment, that is, the fitting between metal surfaces, or an elastic gasket is placed in the middle and then the two are fully fitted.

[0090] In some embodiments of the present invention, the heat insulation groove 330 is formed on the surface of the cover plate 300 and is located between the cooling working fluid inlet chamber 340 and the cooling working fluid outlet chamber 310;

[0091] In some embodiments of the present invention, the cooling working fluid inlet 341 is formed on the surface of the cover plate 300 and penetrates through the cover plate 300 entity to form an opening, and is communicated with the cooling working fluid inlet chamber 340; the cooling working fluid outlet 311 is formed on the surface of the cover plate 300 and penetrates through the cover plate 300 entity to form an opening, and is communicated with the cooling working fluid outlet chamber 310; the cooling working fluid inlet 341 and the cooling working fluid outlet 311 are threaded through holes or non-threaded through holes;

[0092] In some embodiments of the present invention, the cooling working fluid inlet and outlet joint 500 can be a taper joint, a quick plug, a flange joint or an external thread joint, etc.;

[0093] In some embodiments of the present invention, the connection manners of the cooling working fluid inlet 341 and the cooling working fluid outlet 311 with the cooling working fluid inlet and outlet joint 500 are thread connection, welding, clamping or sealant connection.

[0094] In some embodiments of the present invention, the materials of the laser housing 100 and the cover plate 300 are copper, aluminum, aluminum alloy, stainless steel, copper-aluminum alloy, magnesium alloy, aluminum oxide, aluminum nitride, silicon nitride, gallium nitride, silicon carbide, silicon, plastic, resin or glass; the cooling working fluid introduced during the use of the heat dissipation device is water, ethylene glycol mixture, liquid nitrogen, molten salt solution, oil-based coolant or fluoride coolant.

[0095] In some embodiments of the present invention, the connection manner between the laser housing 100 and the cover plate 300 is any one of threaded connection, welded connection, snap connection and riveted connection;

[0096] When the connection mode between the laser housing 100 and the cover plate 300 is a threaded connection, the heat dissipation device further includes a sealing gasket 200, a screw 400, and an O-ring 600. A plurality of cover plate mounting holes 113 are provided around the microchannel groove 120 on the back surface of the laser housing 100, and they are threaded holes. On the bottom surface of the first housing groove 110 on the back surface of the laser housing 100, there are a first fixing base post 111 and a second fixing base post 112 with a raised structure, which are formed on the bottom surface of the first housing groove 110 and have threaded holes in the internal solid area. The cover plate 300 is provided with a plurality of fixing holes 320, which are formed on the surface of the cover plate 300 and penetrate through. The fixing holes 320 correspond to the cover plate mounting holes 113 in size and position one by one. The fixing holes 320 are threaded through holes or non-threaded through holes. The sealing gasket 200 is attached between the bottom surface of the first housing groove 110 and the surface of the cover plate 300, and it is provided with one or more through ports. The O-ring 600 is pressed between the top surface of the first fixing base post 111 and the cover plate 300. The O-ring 600 is correspondingly sized with the first fixing base post 111.

[0097] When the connection mode between the laser housing 100 and the cover plate 300 is welding, a welding contact surface is provided between the laser housing 100 and the cover plate 300, and welding is performed by one or more of fusion welding, pressure welding, brazing, and special welding.

[0098] When the connection mode between the laser housing 100 and the cover plate 300 is snap connection, a sealing gasket 200 and an O-ring 600 are provided between the laser housing 100 and the cover plate 300 for sealing. The laser housing 100 and the cover plate 300 are provided with corresponding snap structures, such as hooks and slots.

[0099] When the connection mode between the laser housing 100 and the cover plate 300 is riveting connection, a sealing gasket 200 and an O-ring 600 are provided between the laser housing 100 and the cover plate 300 for sealing. The laser housing 100 and the cover plate 300 are provided with corresponding through holes for placing rivets to achieve riveting fixation.

[0100] In the first embodiment, a threaded connection mode is adopted, and a high-density semiconductor laser heat dissipation device, as Figure 1 、 2 shown, includes a laser housing 100, a sealing gasket 200, a cover plate 300, a screw 400, a cooling medium inlet and outlet joint 500, and an O-ring 600;

[0101] The described sealing gasket 200 is pressed between the laser housing 100 and the cover plate 300; the cooling working fluid inlet and outlet joint 500 is installed through the cooling working fluid inlet 341 and the cooling working fluid outlet 311 on the cover plate 300, serving as the working fluid inlet and the working fluid outlet of the semiconductor laser respectively;

[0102] The described O-ring 600 is pressed between the first fixed base post 111 and the cooling working fluid inlet chamber 340; the O-ring 600 is correspondingly sized with the first fixed base post 111;

[0103] Preferably, the cooling working fluid inlet and outlet joint 500 can be a flare fitting, a quick connector, an external thread joint, a flange joint, etc.;

[0104] Such as Figure 3 、 4 As shown in Figure 5, a first housing groove 110 is provided on the back of the laser housing 100, and a microchannel groove 120 is provided on the bottom surface of the first housing groove 110, directly below the laser chip placement platform 151; a number of micro rib columns 141 are arranged in an array on the bottom surface of the microchannel groove 120 to form a microchannel;

[0105] Furthermore, the microchannel groove 120 is formed on the bottom surface of the first housing groove 110 and is directly below the laser chip placement platform 151. It has one or more bottom surfaces, each bottom surface having a length, a width, and a depth relative to the parallel bottom surface of the first housing groove 110, and forming a stepped structure. The projected mapping of the limited space of each bottom surface on the laser chip placement platform 151 includes one or more platform top surfaces of the laser chip placement platform 151 and is directly below them.

[0106] Preferably, the first housing groove 110 and the microchannel groove 120 are integrally formed when manufacturing the laser housing 100.

[0107] Furthermore, the micro rib columns 141 are directly below one or more platform top surfaces of the laser chip placement platform 151 and are formed on one or more bottom surfaces of the microchannel groove 120.

[0108] Preferably, the shapes of the horizontal cross-section and the vertical cross-section of the micro rib columns 141 can be rectangular, rounded rectangular, S-shaped, T-shaped, Z-shaped, I-shaped, arc-shaped, circular, semi-circular, triangular, trapezoidal, parallelogram-shaped, elliptical, droplet-like, and polygonal, etc.

[0109] Preferably, the length and width of the micro rib columns 141 parallel to the bottom surface of the microchannel groove 120 are between 10 microns and 10 millimeters, and the height perpendicular to the bottom surface of the microchannel groove 120 is between 10 microns and 10 millimeters.

[0110] Furthermore, the intervals between the micro-rib columns 141 form micro-channels.

[0111] Preferably, the width of the micro-channel is between 1 micrometer and 10 centimeters.

[0112] Preferably, the arrangement of the micro-rib columns 141 is in-line or staggered arrangement.

[0113] Preferably, the micro-rib columns 141 are integrally formed when manufacturing the laser housing 100.

[0114] Furthermore, a plurality of cover plate mounting holes 113, which are threaded holes, are provided around the micro-channel groove 120 on the back surface of the laser housing 100.

[0115] Preferably, on the bottom surface of the first housing groove 120 on the back surface of the laser housing 100, there are provided a first fixing base column 111 and a second fixing base column 112 with a raised structure, which are formed in a region where the base entity of the bottom surface of the first housing groove 120 is thinner and correspond to the positions of the cover plate mounting holes 113, and internally have threaded holes opened.

[0116] Preferably, the structures of the first fixing base column 111 and the second fixing base column 112 can be cylinders, prisms, square columns, frustums of cones, frustums of pyramids, trapezoidal platforms, etc.

[0117] Preferably, one or more threaded holes are provided on the first fixing base column 111 and the second fixing base column 112.

[0118] Preferably, the number and positions of the cover plate mounting holes 113 can be freely set according to actual requirements.

[0119] Preferably, the sizes and positions of the first fixing base column 111 and the second fixing base column 112 can be freely set according to actual requirements.

[0120] Preferably, the first fixing base column 111 and the second fixing base column 112 are optional structures, not essential structures.

[0121] Such as Figure 6 、 7As shown, the laser housing 100 is the main body of the entire heat dissipation device. A second housing groove 150 is provided on the front surface. A laser chip placement platform 151, a transition platform 152, an optical device placement platform 153, and an optical device placement area 160 are provided on the bottom surface of the second housing groove 150. The laser chip placement platform 151 is used to place the laser chip. The optical device placement platform 153 and the optical device placement area 160 are used to place optical devices, which are used to adjust the optical path and converge the light source onto the optical fiber. A fiber optic port 180 and a fiber optic fixing port 170 are provided on the side surface of the laser housing 100, which are used to place the optical fiber and fix the optical fiber respectively. A connector 190 is provided on the side surface of the laser housing 100.

[0122] Preferably, the function of the transition platform 152 is to fill the area between the laser chip placement platform 151 and the optical device placement platform 153, so that the distance h of each plane of the laser chip placement platform 151 and the microchannel groove 120 perpendicular to the bottom surface of the laser chip placement platform 151 can be less than the height difference between the laser chip placement platform 151 and the optical device placement platform 153, so as to reduce the thermal resistance. At the same time, the area of the microchannel groove 120 can include the laser chip placement platform 151 to improve the heat exchange effect.

[0123] Preferably, the connector is a separate device. The surface is made of ceramic or other insulating materials, and the solid part inside is made of copper or other conductive materials, which is used to supply power to the laser chip and prevent current from flowing through the entire laser housing.

[0124] Preferably, one or more extension structures 130 are provided on the side surface of the laser housing, which are formed on the outer wall surface of the side surface of the laser housing, and a housing mounting hole 131 is provided; the housing mounting hole 131 is a threaded through hole or a non-threaded through hole.

[0125] Preferably, the extension structure 130 and the housing mounting hole 131 are optional structures, and their quantity and position can be freely set according to requirements.

[0126] As Figure 8 shown, the microchannel groove 120 is located directly below the laser chip placement platform 151; the array micro-rib region 140 is provided directly below each platform of the laser chip placement platform 151, and the cooling working fluid flows through the array micro-rib region 140 to achieve heat exchange.

[0127] Preferably, for better refrigeration effect, the area size of the microchannel groove 120 can be larger than the area size of the laser chip placement platform 151.

[0128] Preferably, the distance between adjacent two array micro-rib regions corresponds to the width of the flow splitting groove or the flow guiding groove on the cover plate 300.

[0129] Preferably, as Figure 9 , shown in FIGS. 10 and 11, the distance h between the top surface of each platform of the laser chip placement platform 151 and the bottom surface of the microchannel groove 120 is between 10 micrometers and 10 millimeters.

[0130] Preferably, the height difference between the top surfaces of the platforms of the laser chip placement platform 151 is between 10 micrometers and 10 millimeters; the height difference between the top surfaces of the platforms of the transition platform 152 is between 10 micrometers and 10 millimeters; and the height difference between the top surfaces of the platforms of the optical device placement platform 153 is between 10 micrometers and 10 millimeters.

[0131] As Figure 12 , 13 , shown in FIGS. 13 and 14, the pressing boss 350 is formed on the surface of the cover plate 300 and has one or more platforms. Each platform has a length, width and height relative to the surface of the cover plate 300 parallel thereto and forms a stepped structure. There is a distance between each platform and the platforms, forming an interval region;

[0132] The interval regions between each platform of the pressing boss 350 are alternately provided with diversion grooves 360 and drainage grooves 370, which serve as the cooling paths for the cooling working fluid in the direction perpendicular to the plane of the platform of the pressing boss 350;

[0133] The diversion grooves 360 and drainage grooves 370 are formed on the surface of the cover plate 300 and have a bottom surface. The bottom surface of each diversion groove 360 and drainage groove 370 has a length, width and depth relative to the surface of the cover plate 300 parallel thereto; one or more of the diversion grooves 360 communicate on one side to form a cooling working fluid inlet chamber 340; one or more of the drainage grooves 370 communicate on one side to form a cooling working fluid outlet chamber 310;

[0134] The cooling working fluid inlet 341 is formed on the surface of the cover plate 300, penetrates through the entity of the cover plate 300 to form an opening, and communicates with the cooling working fluid inlet chamber 340; the cooling working fluid outlet 311 is formed on the surface of the cover plate 300, penetrates through the entity of the cover plate 300 to form an opening, and communicates with the cooling working fluid outlet chamber 310;

[0135] The cover plate 300 is provided with a plurality of fixing holes 320, which are formed on the surface of the cover plate and penetrate through.

[0136] Preferably, the pressing boss 350 corresponds in size to the array micro-rib region 140 and is pressed directly above the array micro-rib region 140.

[0137] Preferably, each platform of the pressing boss 350 closely adheres to the upper surface of the micro-rib column 141.

[0138] Preferably, the fitting manner between the top surface of each platform of the pressing boss 350 and the micro rib column 141 can be the fitting between metal surfaces, or an elastic gasket can be placed in the middle to make them fit fully.

[0139] Preferably, the heat insulation groove 330 is formed on the surface of the cover plate 300, which has a bottom surface with length, width and depth, and is located between the cooling working medium inlet chamber 340 and the cooling working medium outlet chamber 310.

[0140] Preferably, the cooling working medium inlet 341 is a threaded through hole or a non-threaded through hole.

[0141] Preferably, the cooling working medium outlet 311 is a threaded through hole or a non-threaded through hole.

[0142] Preferably, the fixing holes 320 correspond to the cover plate mounting holes 113 in size and position one by one.

[0143] Preferably, the fixing holes 320 are threaded through holes or non-threaded through holes.

[0144] Preferably, the position and number of the fixing holes can be freely set according to actual requirements.

[0145] Such as Figure 15 、 16 As shown, the sealing gasket 200 fits between the bottom surface of the first housing groove 110 and the surface of the cover plate 300, and is provided with one or more through holes, and the area of the microchannel groove 120 should be included in the space of one or more of its through holes to ensure the sealing of the overall heat dissipation device.

[0146] Preferably, the sealing gasket 200 is provided with a first through hole 210 corresponding to the microchannel groove 120, a second through hole 220 corresponding to the first fixing base column 111, and a third through hole 230 corresponding to the cover plate mounting hole 113.

[0147] Preferably, the first through hole 210 is the same size as the microchannel groove 120; the second through hole 220 is the same size as the first fixing base column 111; the third through hole 230 is the same size as the cover plate mounting hole 113.

[0148] Preferably, the size and number of the first through hole 210, the second through hole 220 and the third through hole 230 can be freely set according to requirements.

[0149] Preferably, the O-ring 600 is pressed between the top surface of the first fixing base column 111 and the cover plate 300; the O-ring 600 is correspondingly set in size with the first fixing base column 111.

[0150] As Figure 17 shown, the shunt channels 360 specifically include a first shunt channel 361, a second shunt channel 362, a third shunt channel 363, and a fourth shunt channel 364; the drainage channels 370 specifically include a first drainage channel 371, a second drainage channel 372, a third drainage channel 373, and a fourth drainage channel 374.

[0151] Preferably, the shunt channels 360 at all levels and the drainage channels 370 at all levels are located directly below the area between two adjacent array micro-rib regions 140, and their sizes are correspondingly set.

[0152] Preferably, the number of the shunt channels 360 can be freely set according to requirements.

[0153] Preferably, the number of the drainage channels 370 can be freely set according to requirements.

[0154] Preferably, the materials of the laser housing and the cover plate can be copper, aluminum, aluminum alloy, stainless steel, copper-aluminum alloy, magnesium alloy, alumina, aluminum nitride, silicon nitride, gallium nitride, silicon carbide, silicon, plastic, resin, or glass, etc.

[0155] Preferably, the materials of the sealing gasket 200 and the O-ring 600 can be nitrile rubber, silicone rubber, fluororubber, silicone rubber, ethylene propylene rubber, ethylene propylene diene monomer rubber, nitrile rubber, chloroprene rubber, polyurethane rubber, polytetrafluoroethylene, flexible graphite, polyimide, etc.

[0156] Preferably, the cooling working medium introduced during the use of the heat dissipation device can be water, ethylene glycol mixture, liquid nitrogen, molten salt solution, oil-based coolant, or fluoride coolant, etc.

[0157] In the second embodiment, a welding connection method is adopted, as Figures 20 - 23 shown. Compared with the first embodiment, in the second embodiment, the cover plate mounting holes 113 around the microchannel groove 120 on the back of the laser housing 100 are removed, the first fixing base column 111 and the second fixing base column 112 are removed, the sealing gasket 200 and the O-ring 600 are not required, and the fixing holes 320 around the pressing boss 350 of the cover plate 300 are removed.

[0158] A filler metal is provided between the laser housing 100 and the cover plate 300 and the connection is achieved by brazing; the sealing of the heat dissipation device must be ensured during welding. It should be noted that when brazing the laser housing 100 and the cover plate 300, sufficient space should be ensured around the bottom surface of the first housing groove 110 and the back of the cover plate 300 to prevent the filler metal from falling into the microchannel groove 120, the cooling working medium outlet chamber 310, and the cooling working medium inlet chamber 340.

[0159] Next, the connection method of Embodiment 1 will be described. First, the sealing gasket 200 is attached to the back surface of the laser housing 100, and the O-ring 600 is attached to the upper surface of the first fixing base column 111. Then, the cover plate 300 is placed on the sealing gasket 200, and the O-ring 600 is pressed between the cover plate 300 and the upper surface of the first fixing base column 111 to ensure that the fluid does not flow out from the fixing hole 320. The sealing gasket 200 is pressed between the cover plate 300 and the back surface of the laser housing 100 to ensure the overall sealing performance. Finally, the screw 400 passes through the fixing hole 320 of the cover plate 300 and the cover plate mounting hole 113 of the laser housing 100 for connection, ensuring that the tightening pressure of the screw 400 is uniform, the cover plate 300 is parallel to the laser housing 100, and each pressing boss 350 is flatly attached to the micro rib 141.

[0160] Next, the connection method of Embodiment 2 will be described. First, clean the bottom surface of the first housing groove 110 and the back surface of the cover plate 300. Then, fix the laser housing 100 using a fixture, evenly apply the brazing material around the bottom surface of the first housing groove 110, heat the brazing material, and finally press the cover plate 300 flatly on the bottom surface of the first housing groove 110 to ensure that each pressing boss 350 is flatly attached to the micro rib 141.

[0161] Next, the working path of the cooling working fluid in Embodiment 1 and Embodiment 2 will be described. As Figure 18 shown, the cooling working fluid flows into the cooling working fluid inlet chamber 340 from the cooling working fluid inlet 341 through the cooling working fluid inlet joint 500, and then is divided into the first diversion groove 342, the second diversion groove 343, the third diversion groove 344, and the fourth diversion groove 345. Then, the cooling working fluid flows into the gap between the array micro rib regions 140 perpendicular to the bottom surface of the microchannel groove 120, and then flows through the micro rib columns 141. Among them, the fluid in the first diversion groove 342 is divided into the first drainage groove 312 and the second drainage groove 313, the fluid in the second diversion groove 343 is divided into the second drainage groove 313 and the third drainage groove 314, the fluid in the third diversion groove 344 is divided into the third drainage groove 314 and the fourth drainage groove 315, and the fluid in the fourth diversion groove 345 flows through the array micro rib region 140 into the fourth drainage groove 315. Finally, the fluids in the first drainage groove 312, the second drainage groove 313, the third drainage groove 314, and the fourth drainage groove 315 converge into the cooling working fluid outlet chamber 310 and then flow out from the cooling working fluid outlet 311.

[0162] On the other hand, the first diversion groove 342, the array micro-rib region 140 and the first drainage groove 312 together form a fluid circuit; the first diversion groove 342, the array micro-rib region 140 and the second drainage groove 313 together form a fluid circuit; the second diversion groove 343, the array micro-rib region 140 and the second drainage groove 313 together form a fluid circuit; the second diversion groove 343, the array micro-rib region 140 and the third drainage groove 314 together form a fluid circuit; the third diversion groove 344, the array micro-rib region 140 and the third drainage groove 314 together form a fluid circuit; the third diversion groove 344, the array micro-rib region 140 and the fourth drainage groove 315 together form a fluid circuit; the fourth diversion groove 345, the array micro-rib region 140 and the fourth drainage groove 315 together form a fluid circuit.

[0163] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention in other forms. Any person skilled in the art may use the technical content disclosed above to make changes or modifications into equivalent embodiments with equivalent changes. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the technical solution content of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. A heat dissipation device for a high-density semiconductor laser, characterized in that It comprises a laser housing (100) and a cover plate (300), which together form a cooling medium flow area; A microchannel heat dissipation structure is provided on one side of the laser housing (100) near the cover plate (300), the microchannel heat dissipation structure comprising a first housing groove (110), one or more microchannel grooves (120) arranged at the bottom of the first housing groove (110), a plurality of micro-rib columns (141) arranged in an array on the bottom surface of the microchannel groove (120), and the plurality of micro-rib columns (141) arranged in an array form an array micro-rib region (140); One side of the cover plate (300) close to the laser housing (100) is provided with one or more stepped pressing bosses (350), a heat insulation groove (330), one or more diverter grooves (360), one or more drainage grooves (370), a cooling medium inlet chamber (340) and a cooling medium outlet chamber (310) formed on the surface of the cover plate (300); the pressing bosses (350) respectively correspond to the positions of the array micro-rib regions (140); the heat insulation groove (330) separates the cooling medium inlet chamber (340) and the cooling medium outlet chamber (310); the cooling medium inlet chamber (340) and the cooling medium outlet chamber (310) are respectively connected to the one or more diverter grooves (360) and the one or more drainage grooves (370).

2. The high-density semiconductor laser heat dissipation device according to claim 1, wherein The cover plate (300) is also provided with a cooling medium inlet (341) and a cooling medium outlet (311), which are respectively connected to the cooling medium inlet chamber (340) and the cooling medium outlet chamber (310); the cooling medium inlet (341) and the cooling medium outlet (311) are both provided with cooling medium inlet and outlet joints (500).

3. The heat dissipation device for a high-density semiconductor laser according to claim 1, characterized in that, A second housing groove (150) is provided on a side of the laser housing (100) facing away from the cover plate (300); a plurality of laser chip placement platforms (151) distributed in a stepped manner are provided at the bottom of the second housing groove (150); each of the laser chip placement platforms (151) has a top surface; and one or more laser chips can be accommodated within a limited space of the top surface.

4. The high-density semiconductor laser heat dissipation device according to claim 3, wherein The microchannel groove (120) is arranged at the bottom of the first housing groove (110) and is located directly below the laser chip placement platform (151). The microchannel groove (120) has a plurality of stepped bottom surfaces, and the limited space of each bottom surface includes one or more platform top surfaces of the laser chip placement platform (151) in the projection of the laser chip placement platform (151) and is located directly below the platform top surfaces.

5. A high-density semiconductor laser heat dissipation device according to claim 3, characterized in that: The micro-ribs (141) are formed on one or more bottom surfaces of the micro-channel groove (120) and are located directly below the top surfaces of one or more platforms of the laser chip placement platform (151); The cross-sectional shape of the micro-rib columns (141) is one of a rectangle, a rounded rectangle, an S shape, a T shape, a Z shape, an I shape, an arc shape, a circle, a semi-circle, a triangle, a trapezoid, a parallelogram, an ellipse, a water-droplet-like shape, or a polygon.

6. The high-density semiconductor laser heat dissipation device according to claim 1, wherein The interval between two adjacent micro-rib columns (141) or between the micro-rib column (141) near the inner wall of the micro-channel groove (120) and the inner wall of the micro-channel groove (120) forms a micro-channel; the arrangement of the micro-rib columns (141) is in-line arrangement or staggered arrangement.

7. The high-density semiconductor laser heat dissipation device according to claim 1, wherein The pressing boss (350) is formed on the surface of the cover plate (300) and is directly above the array micro-rib region (140). The pressing boss (350) has one or more platforms, each platform having a length, a width, and a height, and there is a distance between each platform and each other; One or more flow-dividing grooves (360) and one or more flow-guiding grooves (370) are alternately arranged in the interval region between each platform of the pressing boss (350) to serve as the cooling path for the cooling working fluid in the direction perpendicular to the plane of the platform of the pressing boss (350); The flow-dividing grooves (360) and the flow-guiding grooves (370) are formed on the surface of the cover plate (300), and they have bottom surfaces. The bottom surface of each flow-dividing groove (360) and each flow-guiding groove (370) has a length, a width, and a depth, and corresponds to the interval region between two adjacent array micro-rib regions (140); the one or more flow-dividing grooves (360) are connected on one side to form a cooling working fluid inlet chamber (340); the one or more flow-guiding grooves (370) are connected on one side to form a cooling working fluid outlet chamber (310); The fitting manner between the top surface of each platform of the pressing boss (350) and the micro-rib column (141) is in direct contact, or an elastic gasket is placed in the middle and then the two are fitted.

8. The high-density semiconductor laser heat dissipation device according to claim 1, wherein The heat insulation groove (330) is formed on the surface of the cover plate (300) and is located between the cooling working fluid inlet chamber (340) and the cooling working fluid outlet chamber (310); The cooling working fluid inlet (341) is formed on the surface of the cover plate (300) and penetrates through the entity of the cover plate (300) to form an opening, and is connected to the cooling working fluid inlet chamber (340); the cooling working fluid outlet (311) is formed on the surface of the cover plate (300) and penetrates through the entity of the cover plate (300) to form an opening, and is connected to the cooling working fluid outlet chamber (310); the cooling working fluid inlet (341) and the cooling working fluid outlet (311) are threaded through holes or non-threaded through holes.

9. The high-density semiconductor laser heat dissipation device according to claim 1, wherein The connection manner between the laser housing (100) and the cover plate (300) is any one of threaded connection, welding connection, snap connection, and riveting connection; When the connection mode between the laser housing (100) and the cover plate (300) is a threaded connection, the heat dissipation device further includes a sealing gasket (200), screws (400) and an O-ring (600). A plurality of cover plate mounting holes (113), which are threaded holes, are arranged around the microchannel groove (120) on the back surface of the laser housing (100). On the bottom surface of the first housing groove (110) on the back surface of the laser housing (100), there are a first fixed base post (111) and a second fixed base post (112) with a convex structure, which are formed on the bottom surface of the first housing groove (110) and have threaded holes in the internal solid area. The cover plate (300) is provided with a plurality of fixing holes (320), which are formed on the surface of the cover plate (300) and penetrate through. The fixing holes (320) correspond to the cover plate mounting holes (113) in size and position one by one. The fixing holes (320) are threaded through holes or non-threaded through holes. The sealing gasket (200) is attached between the bottom surface of the first housing groove (110) and the surface of the cover plate (300), and is provided with one or more through ports. The O-ring (600) is pressed between the top surface of the first fixed base post (111) and the cover plate (300). The O-ring (600) is arranged corresponding to the first fixed base post (111) in size. When the connection mode between the laser housing (100) and the cover plate (300) is a welding connection, a welding contact surface is provided between the laser housing (100) and the cover plate (300), and welding is carried out by one or more of fusion welding, pressure welding, brazing and special welding. When the connection mode between the laser housing (100) and the cover plate (300) is a snap connection, the laser housing (100) and the cover plate (300) are provided with corresponding snap structures, such as hooks and slots. When the connection mode between the laser housing (100) and the cover plate (300) is a riveting connection, the laser housing (100) and the cover plate (300) are provided with corresponding through holes for placing rivets to achieve riveting fixation.

10. The heat dissipation device for a high-density semiconductor laser according to claim 9, characterized in that, When the laser housing (100) and the cover plate (300) are connected by a threaded connection, a snap connection or a riveting connection, a sealing gasket (200) and an O-ring (600) are provided between the laser housing (100) and the cover plate (300).

Images