Audio power amplifier, electronic equipment and intelligent cabin

Abstract

The invention provides an audio power amplifier, electronic equipment and an intelligent cockpit, the audio power amplifier comprises a data bus interface, a pulse code modulation data route, at least one power amplification module and at least one loudspeaker, the data bus interface comprises a first integrated circuit built-in audio I2S bus interface and a time division multiplexing TDM module, and the power amplification module comprises a first integrated circuit built-in audio I2S bus interface and a second integrated circuit built-in audio I2S bus interface. The pulse code modulation data router comprises a second integrated circuit built-in audio I2S bus interface and at least one time division multiplexing TDM time slot module, the first integrated circuit built-in audio I2S bus interface is connected with the second integrated circuit built-in audio I2S bus interface, and the TDM time slot module is connected with the at least one time division multiplexing TDM time slot module. And the second integrated circuit built-in audio I2S bus interface and the at least one time division multiplexing TDM time slot module are respectively connected with the at least one power amplification module in a one-to-one manner. According to the invention, the hardware cost can be reduced while the spatial audio effect is achieved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of audio intelligent power amplifiers, and in particular, to an audio power amplifier, an electronic device, and an intelligent cockpit. Background Art

[0002] With the development of communication technology, the development of electronic devices or other terminals has gradually facilitated the lives of users. For example, data of one channel can be output through a single-output audio intelligent power amplifier. However, outputting data of one channel cannot meet the spatial audio solution. Since spatial audio requires at least two channels of audio data for the left and right channels to be output, when meeting the requirements of spatial audio, the number of audio intelligent power amplifiers needs to be increased, resulting in an increase in hardware costs. Summary of the Invention

[0003] The present disclosure aims to at least partly solve one of the technical problems in the related art.

[0004] To this end, the first object of the present disclosure is to propose an audio power amplifier to achieve the spatial audio effect while reducing hardware costs.

[0005] The second object of the present disclosure is to propose an electronic device.

[0006] The third object of the present disclosure is to propose an intelligent cockpit.

[0007] To achieve the above object, an audio power amplifier according to an embodiment of the first aspect of the present disclosure includes a data bus interface, a pulse code modulation data router, at least one power amplification module, and at least one speaker. The data bus interface includes a first Inter-IC Sound (I2S) bus interface and a Time Division Multiplexing (TDM) module. The pulse code modulation data router includes a second I2S bus interface for integrated circuits and at least one TDM time slot module. Wherein:

[0008] The first I2S bus interface for integrated circuits is connected to the second I2S bus interface for integrated circuits. The TDM module is respectively connected to the at least one TDM time slot module. The second I2S bus interface for integrated circuits and the at least one TDM time slot module are respectively connected to the at least one power amplification module in a one-to-one manner. The at least one power amplification module is connected to the at least one speaker in a one-to-one manner.

[0009] Optionally, the at least one power amplification module includes at least one Class D Amplifier Modulator sub-module and at least one Class D Power Stage sub-module. The second integrated circuit has a built-in audio I2S bus interface, and the at least one time-division multiplexing TDM time slot module is connected to the at least one Class D Amplifier Modulator sub-module in a one-to-one manner. The at least one Class D Amplifier Modulator sub-module is connected to the at least one Class D Power Stage sub-module in a one-to-one manner. The at least one Class D Power Stage sub-module is connected to the at least one speaker in a one-to-one manner.

[0010] Optionally, a first quantity is the same as a second quantity of the at least one Class D modulator, where the first quantity is the total quantity of the built-in audio I2S bus of the first integrated circuit, the built-in audio I2S bus of the second integrated circuit, and the at least one time-division multiplexing TDM time slot module.

[0011] Optionally, the built-in audio I2S bus interface of the second integrated circuit includes a built-in audio I2S bus sub-interface of the first integrated circuit and a built-in audio I2S bus sub-interface of the second integrated circuit. The integrated circuit built-in audio I2S bus interface is connected to one end of the built-in audio I2S bus sub-interface of the first integrated circuit and one end of the built-in audio I2S bus sub-interface of the second integrated circuit respectively. The other end of the built-in audio I2S bus sub-interface of the first integrated circuit is connected to a first power amplification module in the at least one power amplification module. The other end of the built-in audio I2S bus sub-interface of the second integrated circuit is connected to a second power amplification module in the at least one power amplification module. The at least one time-division multiplexing TDM time slot module is connected to at least one third power amplification module in the at least one power amplification module in a one-to-one manner.

[0012] Optionally, the audio power amplifier further includes at least one high-speed Digital Signal Processor (DSP) core module. The at least one high-speed Digital Signal Processor DSP core module is connected to the pulse code modulation data routing. The high-speed Digital Signal Processor DSP core module is configured to determine an impedance based on the obtained voltage value and current value, and determine a temperature based on a temperature rise coefficient.

[0013] Optionally, the audio power amplifier further includes at least one analog-to-digital converter (ADC) speaker monitoring module. One end of the at least one ADC speaker monitoring module is connected to the output end of the at least one power amplification module, and the other end of the at least one ADC speaker monitoring module is connected to the pulse code modulation data routing. Any one of the at least one ADC speaker monitoring modules is used to determine the state of the speaker by the voltage value and current value of the speaker of the any one of the ADC speaker monitoring modules.

[0014] Optionally, the audio power amplifier further includes a boost module, and the boost module is connected to the connection line between the pulse code modulation data routing and the at least one power amplification module.

[0015] Optionally, the audio power amplifier further includes a control bus interface, and the audio power amplifier is connected to the bus through the control bus interface.

[0016] To achieve the above object, an embodiment of the second aspect of the present disclosure provides an electronic device, and the electronic device includes the audio power amplifier described in the first aspect above.

[0017] To achieve the above object, an embodiment of the third aspect of the present disclosure provides an intelligent cockpit, and the intelligent cockpit includes the audio power amplifier described in the first aspect above.

[0018] The audio power amplifier provided by the present disclosure includes a data bus interface, a pulse code modulation data routing, at least one power amplification module, and at least one speaker. The data bus interface includes a first integrated circuit built-in audio I2S bus interface and a time division multiplexing (TDM) module. The pulse code modulation data routing includes a second integrated circuit built-in audio I2S bus interface and at least one TDM time slot module. Wherein: the first integrated circuit built-in audio I2S bus interface is connected to the second integrated circuit built-in audio I2S bus interface, the TDM module is respectively connected to the at least one TDM time slot module, the second integrated circuit built-in audio I2S bus interface and the at least one TDM time slot module are respectively connected to the at least one power amplification module in a one-to-one manner, and the at least one power amplification module is connected to the at least one speaker in a one-to-one manner. Therefore, by configuring the internal structure of an audio power amplifier, multi-channel audio data can be output from different speakers, achieving the effect of spatial audio, and multi-channel audio output can be realized without increasing the number of audio power amplifiers, which can reduce the hardware cost.

[0019] Additional aspects and advantages of the present disclosure will be given in part in the following description, become apparent in part from the following description, or be learned by practice of the present disclosure. Description of the Drawings

[0020] The above-mentioned and / or additional aspects and advantages of the present disclosure will become apparent and be readily understood from the following description of embodiments in conjunction with the accompanying drawings, where:

[0021] Figure 1 is a background schematic diagram of an audio power amplifier provided by an embodiment of the present disclosure;

[0022] Figure 2 is an exemplary schematic diagram of an audio power amplifier provided by an embodiment of the present disclosure;

[0023] Figure 3 is an exemplary schematic diagram of an audio power amplifier provided by an embodiment of the present disclosure;

[0024] Figure 4 is an exemplary schematic diagram of an electronic device provided by an embodiment of the present disclosure;

[0025] Figure 5 is an exemplary schematic diagram of an electronic device provided by an embodiment of the present disclosure;

[0026] Figure 6 is an exemplary schematic diagram of an intelligent cockpit provided by an embodiment of the present disclosure. Detailed Description of the Embodiments

[0027] Embodiments of the present disclosure will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present disclosure and should not be construed as limiting the present disclosure.

[0028] Figure 1 is a background schematic diagram of an audio power amplifier provided by an embodiment of the present disclosure. As Figure 1As shown in the figure, the audio power amplifier includes a data bus interface, a pulse code modulation data router, a class-D amplification modulator, a class-D power stage circuit, a speaker, an analog-to-digital converter, a DSP core module, and a boost module. Among them, a data bus interface is connected to a pulse code modulation data router, and the pulse code modulation data router and the boost module are respectively connected to a class-D amplification modulator. A class-D amplification modulator is connected to a class-D power stage circuit, a class-D power stage circuit is connected to a speaker, an analog-to-digital converter is connected to the connection line between a class-D power stage circuit and a speaker, and a DSP core module is connected to a pulse code modulation data router. Among them, in a spatial audio scenario with multiple speaker requirements, for example, by adding an audio power amplifier in an electronic device and increasing the number of speakers, the sound output of different channels can be realized to achieve the effect of spatial audio. However, in this process, the number of audio power amplifiers needs to be increased and accessories need to be added, resulting in an increase in hardware costs.

[0029] The audio power amplifier according to an embodiment of the present disclosure will be described below with reference to the accompanying drawings.

[0030] Figure 2 FIG. is an example schematic diagram of an audio power amplifier provided by an embodiment of the present disclosure.

[0031] To solve this problem, the embodiment of the present disclosure provides an audio power amplifier to reduce the hardware cost while achieving the spatial audio effect, such as Figure 2 As shown in the figure, the audio power amplifier includes: a data bus interface, a pulse code modulation data router, at least one power amplification module, and at least one speaker. The data bus interface includes a first integrated circuit built-in audio I2S bus interface and a time-division multiplexing TDM module. The pulse code modulation data router includes a second integrated circuit built-in audio I2S bus interface and at least one time-division multiplexing TDM time slot module, where:

[0032] The first integrated circuit built-in audio I2S bus interface is connected to the second integrated circuit built-in audio I2S bus interface. The time-division multiplexing TDM module is respectively connected to at least one time-division multiplexing TDM time slot module. The second integrated circuit built-in audio I2S bus interface and at least one time-division multiplexing TDM time slot module are respectively connected to at least one power amplification module in a one-to-one manner. At least one power amplification module is connected to at least one speaker in a one-to-one manner. Therefore, by configuring the internal structure of an audio power amplifier, multiple-channel audio data can be output from different speakers to achieve the effect of spatial audio. Multi-channel audio output can be realized without increasing the number of audio power amplifiers, and the hardware cost can be reduced.

[0033] Among them, the audio power amplifier can be, for example, a class-D audio power amplifier (Smart PA). Among them, the audio power amplifier can be used to drive a speaker to provide a high-power audio signal. Among them, the audio power amplifier in the embodiments of the present disclosure does not specifically refer to a certain fixed audio power amplifier. For example, when the number of each device in the audio power amplifier changes, the audio power amplifier can also change accordingly.

[0034] Among them, in one embodiment of the present disclosure, the data bus interface can be, for example, the data bus interface of the audio power amplifier. The data bus interface can be, for example, a Serial port (I2S / TDM). The data bus interface can be used to transmit audio data of the I2S and / or TDM types. For example, the data bus interface can be used to transmit audio data of the I2S type, and can also be used to transmit audio data of the TDM type, and can simultaneously transmit audio data of the I2S and TDM types. The embodiments of the present disclosure do not limit this.

[0035] In some embodiments, Pulse Code Modulation, abbreviated as PCM, is a digital signal generated by sampling, quantizing, and encoding a continuously varying analog signal. The Pulse Code Modulation data routing can be, for example, routing audio data, separating audio data of different channels, and sending it to the corresponding power amplifier module.

[0036] According to some embodiments, the number of power amplifier modules can be, for example, at least one. Among them, the power amplifier module can achieve gain through signal amplification and drive a speaker to emit sound. The power amplifier module does not specifically refer to a certain fixed module. For example, when the various sub-modules included in the power amplifier module change, the power amplifier module can also change accordingly.

[0037] In some embodiments, the speaker can be used to output an audio signal. The speaker does not specifically refer to a certain fixed speaker. For example, when the type of the speaker changes, the speaker can also change accordingly. Among them, for example, the specific speaker to be used and the corresponding power amplifier module can be determined according to the usage function scenario.

[0038] In some embodiments, the first integrated circuit built-in audio I2S bus interface can be, for example, the I2S bus interface included in the data bus interface. The "first" in the first integrated circuit built-in audio I2S bus interface is used to distinguish it from the other integrated circuit built-in audio I2S bus interfaces, and does not specifically refer to a certain fixed integrated circuit built-in audio I2S bus interface.

[0039] In some embodiments, the second integrated circuit built-in audio I2S bus interface can be, for example, the I2S bus interface included in the pulse code modulation data routing. The second in the second integrated circuit built-in audio I2S bus interface is used to distinguish it from the other integrated circuit built-in audio I2S bus interfaces and does not specifically refer to a certain fixed integrated circuit built-in audio I2S bus interface.

[0040] Figure 3 FIG. is an exemplary schematic diagram of a power amplifier provided by an embodiment of the present disclosure. Among them:

[0041] Among them, in an embodiment of the present disclosure, at least one power amplification module includes at least one class-D amplification modulation sub-module and at least one class-D power circuit sub-module. The second integrated circuit built-in audio I2S bus interface and at least one time-division multiplexing TDM time slot module are respectively connected to at least one class-D amplification modulation sub-module in a one-to-one manner. At least one class-D amplification modulation sub-module is connected to at least one class-D power circuit sub-module in a one-to-one manner. At least one class-D power circuit sub-module is connected to at least one speaker in a one-to-one manner.

[0042] In some embodiments, for example, one power amplification module can include one class-D amplification modulation sub-module and one class-D power circuit sub-module. That is to say, the third quantity of the power amplification module, the fourth quantity of the class-D amplification modulation sub-module, and the fifth quantity of the class-D power circuit sub-module are the same. Among them, each quantity can be determined according to the sound source type corresponding to the electronic device and / or the requirements of the spatial audio effect, for example.

[0043] Among them, in an embodiment of the present disclosure, the first quantity is the same as the second quantity of at least one class-D amplifier modulator, where the first quantity is the total quantity of the first integrated circuit built-in audio I2S bus, the second integrated circuit built-in audio I2S bus, and at least one time-division multiplexing TDM time slot module.

[0044] In some embodiments, the first quantity can be, for example, the total quantity of the first integrated circuit built-in audio I2S bus, the second integrated circuit built-in audio I2S bus, and at least one time-division multiplexing TDM time slot module, and this first quantity does not specifically refer to a certain fixed quantity. For example, when the spatial audio effect changes, this first quantity can also change accordingly. For example, when the electronic device changes, this first quantity can also change accordingly.

[0045] According to some embodiments, for example, the first integrated circuit built-in audio I2S bus is connected to one class-D amplifier modulator, the second integrated circuit built-in audio I2S bus is connected to one class-D amplifier modulator, and one time-division multiplexing TDM time slot module is connected to one class-D amplifier modulator. For example, the time-division multiplexing TDM time slot module and the class-D amplifier modulator are connected in a one-to-one manner.

[0046] Among them, in an embodiment of the present disclosure, the second integrated circuit built-in audio I2S bus interface includes a first integrated circuit built-in audio I2S bus sub-interface and a second integrated circuit built-in audio I2S bus sub-interface. The integrated circuit built-in audio I2S bus interface is respectively connected to one end of the first integrated circuit built-in audio I2S bus sub-interface and one end of the second integrated circuit built-in audio I2S bus sub-interface. The other end of the first integrated circuit built-in audio I2S bus sub-interface is connected to the first power amplification module in at least one power amplification module, and the other end of the second integrated circuit built-in audio I2S bus sub-interface is connected to the second power amplification module in at least one power amplification module. At least one time-division multiplexing TDM time slot module is connected to at least one third power amplification module in at least one power amplification module in a one-to-one manner.

[0047] Among them, in an embodiment of the present disclosure, the audio power amplifier further includes at least one high-speed digital signal processor DSP core module. At least one high-speed digital signal processor DSP core module is connected to the pulse code modulation data routing. The high-speed digital signal processor DSP core module is used to determine the impedance based on the obtained voltage value and current value, and determine the temperature according to the temperature rise coefficient.

[0048] According to some embodiments, a speaker protection algorithm (LouDSPeaker protection algorithm: speaker protection algorithm) can be integrated in the high-speed digital signal processor DSP core module (DSP core). The name of this algorithm is not limited. For example, the name of this algorithm can also be called the speaker protection algorithm, etc. Among them, the speaker protection algorithm can obtain the real-time impedance through the obtained voltage and current values, and then obtain the real-time temperature according to the temperature rise coefficient, so as to achieve temperature protection and improve the service life of the speaker. Among them, the high-speed digital signal processor DSP core module can also implement signal enhancement and speaker equalization algorithms, etc.

[0049] Among them, in an embodiment of the present disclosure, the audio power amplifier further includes at least one analog-to-digital converter ADC speaker monitoring module. One end of at least one analog-to-digital converter ADC speaker monitoring module is connected to the output end of at least one power amplification module, and the other end of at least the analog-to-digital converter ADC speaker monitoring module is connected to the pulse code modulation data routing. Any one of the at least one analog-to-digital converter ADC speaker monitoring module is used to determine the state of the speaker based on the voltage value and current value of the speaker of any one of the analog-to-digital converter ADC speaker monitoring modules.

[0050] According to some embodiments, an analog-to-digital converter (ADC) speaker monitoring module can be used to detect a speaker, for example, and voltage and current can be measured through this module.

[0051] Among them, in one embodiment of the present disclosure, the audio power amplifier further includes a boost module, and the boost module is connected to the connection line between the pulse code modulation data routing and at least one power amplification module. The boost module is used to provide a voltage that meets the voltage requirements for at least one power amplification module.

[0052] Among them, in one embodiment of the present disclosure, the audio power amplifier further includes a control bus interface, and the audio power amplifier is connected to the bus through the control bus interface. Among them, the I2C / SPI control bus (control port) is the control bus interface of the SmartPA, and the Smart PA is connected to the bus for enabling and process control of the electronic device.

[0053] Figure 4 Schematic diagram of an example of an electronic device provided by an embodiment of the present disclosure. As Figure 4 shown, the electronic device can be a smart phone, for example. Among them, the system on chip (Application-Specific, Soc) is the acpu chip of the smart phone, and the DSP processing module is integrated on the acpu main chip. The DSP needs to process the audio data transmitted from the upper layer and send the processed audio data to the Smart PA through the I2S data bus. After being processed by the power amplification module of the Smart PA, it is played and output by the speaker spk. Among them, in the embodiment of the present disclosure, the smart phone can output the data of the left and right channels from two speakers respectively through a Smart PA to achieve a stereo spatial audio effect.

[0054] Figure 5 Schematic diagram of an example of an electronic device provided by an embodiment of the present disclosure. As Figure 5 shown, the electronic device can be a tablet (portable android device, Pad), for example. The difference between a pad and a smart phone can be that the pad requires a larger number of speakers. In some embodiments, for example, a solution that requires four speakers is adopted, and the Smart PA needs to be configured with 4 output ports. Among them, the data can be transmitted from the APCU to the Smart PA through the tdm bus for 4 channels of data, and then the data of 4 channels are respectively output from the 4 output ports of a Smart PA.

[0055] It should be noted that the electronic device includes but is not limited to the above two types. For example, the electronic device may include any type of electronic device that uses a speaker. The embodiments of the present disclosure do not limit this.

[0056] Figure 6 This is an example schematic diagram of an intelligent cockpit provided by the embodiments of the present disclosure. As Figure 6 shown, the audio sources required for the intelligent cockpit need to support more diverse types. In addition to ordinary two-channel audio sources, it also needs to support audio sources such as 2.1, 5.1, and 7.1 channels. Therefore, more speakers are required. The 7.1-channel audio source with the most channels has 8 different channel data, and 8 channels of different channel sound data can be output through an intelligent power amplifier to achieve the spatial audio effect.

[0057] The collection, storage, use, processing, transmission, provision, and disclosure of the user's personal information involved in the present disclosure and other processing are all in compliance with the provisions of relevant laws and regulations and do not violate public order and good customs.

[0058] It should be noted that the personal information from users should be collected for legal and reasonable purposes and should not be shared or sold outside of these legal uses. In addition, such collection / sharing should be carried out after obtaining the informed consent of the users, including but not limited to notifying the users to read the user agreement / user notice before using the function and signing an agreement / authorization including authorizing the relevant user information. In addition, any necessary steps should be taken to protect and safeguard access to such personal information data and ensure that others with access to the personal information data comply with their privacy policies and procedures.

[0059] The present disclosure anticipates providing embodiments that allow users to selectively block the use or access of personal information data. That is, the present disclosure anticipates providing hardware and / or software to prevent or block access to such personal information data. Once the personal information data is no longer needed, the risk can be minimized by restricting data collection and deleting the data. In addition, when applicable, personal identifiers are removed from such personal information to protect the privacy of users.

[0060] In the description of the foregoing embodiments, the descriptions referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0061] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0062] Any process or method description, whether in a flowchart or otherwise described herein, can be understood to represent a module, segment, or portion of code including one or more executable instructions for implementing a customized logic function or process, and the scope of the preferred embodiments of the present disclosure includes additional implementations, where the functions may be performed in a substantially simultaneous manner or in the reverse order according to the functions involved, rather than in the order shown or discussed, which should be understood by those skilled in the art to which the embodiments of the present disclosure pertain.

[0063] The logic and / or steps represented in the flowchart or otherwise described herein can be considered, for example, a definable sequence list of executable instructions for implementing logical functions, which can be specifically implemented in any computer-readable medium for use by an instruction execution system, apparatus, or device (such as a computer-based system, a system including a processor, or other systems that can fetch and execute instructions from the instruction execution system, apparatus, or device), or used in conjunction with these instruction execution systems, apparatus, or devices. For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device. More specific examples (non-exhaustive list) of computer-readable media include the following: electrical connection parts with one or more wirings (electronic devices), portable computer disk cartridges (magnetic devices), random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), fiber optic devices, and portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium can even be paper or other suitable media on which the program can be printed, because the program can be obtained electronically, for example, by optically scanning the paper or other media, followed by editing, interpretation, or other appropriate processing if necessary, and then stored in a computer memory.

[0064] It should be understood that various parts of the present disclosure can be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or a combination of the following techniques known in the art can be used: discrete logic circuits having logic gate circuits for implementing logical functions on data signals, application-specific integrated circuits having appropriate combinational logic gate circuits, programmable gate arrays (PGA), field-programmable gate arrays (FPGA), etc.

[0065] Those of ordinary skill in the art of this technology can understand that all or part of the steps carried by the method of implementing the above embodiments can be completed by a program instructing relevant hardware, and the program can be stored in a computer-readable storage medium. When the program is executed, it includes one or a combination of the steps of the method embodiments.

[0066] In addition, in each embodiment of the present disclosure, each functional unit may be integrated into one processing module, or each unit may exist physically alone, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. When the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0067] The above-mentioned storage medium may be a read-only memory, a magnetic disk, an optical disc, etc. Although the embodiments of the present disclosure have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present disclosure. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present disclosure.

Claims

1. An audio power amplifier, characterized in that, Comprising a data bus interface, pulse code modulation data routing, at least one power amplification module, and at least one speaker, wherein the data bus interface includes a first integrated circuit built-in audio I2S bus interface and a time division multiplexing TDM module, and the pulse code modulation data routing includes a second integrated circuit built-in audio I2S bus interface and at least one time division multiplexing TDM time slot module, where: The first integrated circuit built-in audio I2S bus interface is connected to the second integrated circuit built-in audio I2S bus interface, the time division multiplexing TDM module is respectively connected to the at least one time division multiplexing TDM time slot module, the second integrated circuit built-in audio I2S bus interface and the at least one time division multiplexing TDM time slot module are respectively connected to the at least one power amplification module in a one-to-one manner, and the at least one power amplification module is connected to the at least one speaker in a one-to-one manner.

2. The audio power amplifier according to claim 1, characterized in that, Wherein, The at least one power amplification module includes at least one class-D amplification modulation sub-module and at least one class-D power circuit sub-module. The second integrated circuit built-in audio I2S bus interface and the at least one time division multiplexing TDM time slot module are respectively connected to the at least one class-D amplification modulation sub-module in a one-to-one manner. The at least one class-D amplification modulation sub-module is connected to the at least one class-D power circuit sub-module in a one-to-one manner, and the at least one class-D power circuit sub-module is connected to the at least one speaker in a one-to-one manner.

3. The audio power amplifier according to claim 2, wherein, Wherein, A first quantity is the same as a second quantity of the at least one class-D amplifier modulator, where the first quantity is the total quantity of the first integrated circuit built-in audio I2S bus, the second integrated circuit built-in audio I2S bus, and the at least one time division multiplexing TDM time slot module.

4. The audio power amplifier according to claim 1, wherein Wherein, The second integrated circuit built-in audio I2S bus interface includes a first integrated circuit built-in audio I2S bus sub-interface and a second integrated circuit built-in audio I2S bus sub-interface. The integrated circuit built-in audio I2S bus interface is respectively connected to one end of the first integrated circuit built-in audio I2S bus sub-interface and one end of the second integrated circuit built-in audio I2S bus sub-interface. The other end of the first integrated circuit built-in audio I2S bus sub-interface is connected to a first power amplification module among the at least one power amplification module, and the other end of the second integrated circuit built-in audio I2S bus sub-interface is connected to a second power amplification module among the at least one power amplification module. The at least one time division multiplexing TDM time slot module is connected to at least one third power amplification module among the at least one power amplification module in a one-to-one manner.

5. The audio power amplifier according to claim 1, characterized in that, Wherein, The audio power amplifier further includes at least one high-speed digital signal processor DSP core module. The at least one high-speed digital signal processor DSP core module is connected to the pulse code modulation data routing. The high-speed digital signal processor DSP core module is configured to determine impedance based on the obtained voltage value and current value, and determine temperature based on the temperature rise coefficient.

6. The audio power amplifier according to claim 1, wherein Wherein, The audio power amplifier further includes at least one analog-to-digital converter (ADC) speaker monitoring module. One end of the at least one ADC speaker monitoring module is connected to the output end of the at least one power amplification module, and the other end of the at least one ADC speaker monitoring module is connected to the pulse code modulation data routing. Any one of the at least one ADC speaker monitoring modules is used to determine the state of the speaker by the voltage value and current value of the speaker of the any one ADC speaker monitoring module.

7. The audio power amplifier according to claim 6, characterized in that, The audio power amplifier further includes a boost module, and the boost module is connected to the connection line between the pulse code modulation data routing and the at least one power amplification module.

8. The audio power amplifier according to claim 5, characterized in that The audio power amplifier further includes a control bus interface, and the audio power amplifier is connected to the bus through the control bus interface.

9. An electronic device, characterized in that, The electronic device includes the audio power amplifier according to any one of claims 1 to 8.

10. An intelligent cockpit, characterized in that, The intelligent cockpit includes the audio power amplifier according to any one of claims 1 to 8.

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