Electronic device heat dissipation device, electric cabinet and air conditioner

Abstract

The invention relates to the technical field of electronic device heat dissipation, and provides an electronic device heat dissipation device, an electric cabinet and an air conditioner. The invention provides a heat dissipation device for an electronic device. The heat dissipation device comprises the electronic device, a phase change unit and a liquid cooling unit, the phase change unit is connected with the electronic device, comprises a phase change material and can absorb heat released when the electronic device is started and stopped; the liquid cooling unit comprises at least one liquid cooling pipe, the side wall of the liquid cooling pipe is connected with the phase change unit, and the liquid cooling pipe can dissipate heat of the phase change unit through a liquid cooling working medium in the liquid cooling pipe. According to the heat dissipation device for the electronic device, the defect of transient thermal load when the electronic device is started and stopped in an existing heat dissipation technology is overcome through the unique design. The introduction of the phase change unit can rapidly absorb the heat released at the moment of starting and stopping the electronic device, the heat conductivity coefficient of the phase change material is low, and the phase change material plays a role of heat buffering, so that the heat is prevented from rapidly flowing back to the electronic device, and the device is prevented from being damaged due to rapid temperature rise.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation for electronic devices, and particularly to a heat dissipation device for electronic devices, an electric control box, and an air conditioner. Background Art

[0002] With the rapid development of modern electronic technology, the integration degree and power density of electronic devices have been continuously improved, resulting in an increasing amount of heat generated during their operation. Especially at the moment when an electronic device starts and stops, the heat generation will increase sharply, and this phenomenon is called transient thermal load. This transient thermal load poses higher requirements on the heat dissipation system of electronic devices because they need to effectively handle a large amount of heat within an extremely short time to prevent the device from overheating, thereby affecting its performance and lifespan.

[0003] However, existing heat dissipation technologies, especially the traditional air-cooling and liquid-cooling systems, have obvious deficiencies in dealing with this transient thermal load. The air-cooling system relies on natural convection or forced convection of air for heat dissipation, but its heat transfer efficiency is relatively low, and its effect is limited in a closed or semi-closed space. Although the liquid-cooling system improves the heat dissipation efficiency through the circulation of liquid, its response speed is still limited by the hydrodynamic characteristics. Especially in the case of a rapidly changing thermal load, the heat exchange efficiency and response speed of the liquid-cooling system often cannot meet the requirements. Summary of the Invention

[0004] The present invention provides a heat dissipation device for electronic devices, an electric control box, and an air conditioner to solve the technical problem that the existing heat dissipation device has a slow response speed and cannot meet the sudden increase in heat generation when an electronic device starts and stops.

[0005] The present invention provides a heat dissipation device for electronic devices, including: an electronic device, a phase change unit, and a liquid-cooling unit; the phase change unit is connected to the electronic device, the phase change unit includes a phase change material, and can absorb the heat released by the electronic device when starting and stopping; the liquid-cooling unit includes at least one liquid-cooling tube, the side wall of the liquid-cooling tube is connected to the phase change unit, and the liquid-cooling tube can dissipate heat to the phase change unit by the liquid-cooling working medium therein.

[0006] According to an embodiment of the present invention, it further includes a housing, the housing has an accommodation cavity and at least one setting port communicating with the accommodation cavity; the electronic device and the phase change unit are arranged in the accommodation cavity; the liquid-cooling tube extends into the accommodation cavity through the setting port.

[0007] According to an embodiment of the present invention, the liquid-cooling unit further includes at least one heat dissipation fin, the heat dissipation fin is arranged on the liquid-cooling tube and is in contact with both the liquid-cooling tube and the phase change unit simultaneously.

[0008] According to an embodiment of the present invention, there are multiple heat dissipation fins, and the multiple heat dissipation fins are arranged at intervals along the extending direction of the liquid-cooling tube.

[0009] According to an embodiment of the present invention, the liquid cooling pipe includes a first liquid cooling pipe and a second liquid cooling pipe; at least one of the electronic devices is located between the first liquid cooling pipe and the second liquid cooling pipe.

[0010] According to an embodiment of the present invention, it further includes a temperature sensor, a circulation unit and a controller; the temperature sensor is located in the accommodation cavity and can detect the temperature of the phase change unit; the circulation unit has a flow channel; the controller is connected to the temperature sensor and the circulation unit, and the controller can control the circulation unit in a state where the temperature is greater than a preset value, so that the circulation unit can return the liquid phase change material located in the accommodation cavity to the accommodation cavity through the flow channel for forced convection.

[0011] According to an embodiment of the present invention, the circulation unit includes a first communication pipe, a circulation pump and a second communication pipe; the housing further has a first connection port and a second connection port that can communicate with the accommodation cavity; one end of the first communication pipe communicates with the first connection port, and the other end of the first communication pipe communicates with the inlet of the circulation pump; one end of the second communication pipe communicates with the outlet of the circulation pump, and one end of the second communication pipe communicates with the second connection port.

[0012] According to an embodiment of the present invention, there are two setting ports, namely a first setting port and a second setting port; the liquid cooling pipe includes a first section, a second section and a third section that are sequentially connected; the first section is located outside the housing, and the end of the first section is arranged at the first setting port; the second section is located in the accommodation cavity and is connected to the phase change unit, one end of the second section communicates with the end of the first section, and the other end of the second section communicates with the end of the third section; the third section is located outside the housing, and the end of the third section is arranged at the second setting port; the first communication pipe is in surface contact with the first section; the second communication pipe is in surface contact with the second section.

[0013] The present invention provides an electric control box, including: an electronic device heat dissipation device as described in the above embodiment.

[0014] The present invention provides an air conditioner, including: an electronic device heat dissipation device as described in the above embodiment; or, an electric control box as described in the above embodiment.

[0015] The features and advantages of the electronic device heat dissipation device, electric control box and air conditioner of the present invention are: The heat dissipation device for electronic devices of the present invention solves the deficiency of the existing heat dissipation technology in dealing with the transient heat load during the start and stop of electronic devices through a unique design. The introduction of the phase change unit can quickly absorb the heat released by the electronic device at the moment of start and stop. Since the phase change material itself has a low thermal conductivity, it acts as a heat buffer, avoiding the rapid reflux of heat to the electronic device, thereby preventing the device from being damaged due to a sharp increase in temperature. At the same time, the liquid cooling unit is equipped with at least one liquid cooling pipe, and through the liquid cooling working medium flowing in the pipe, the heat stored in the phase change unit is effectively conducted out, achieving fast and efficient heat dissipation. This design not only improves the heat dissipation efficiency but also speeds up the heat dissipation response speed, ensuring that when the electronic device faces a transient heat load, heat can be dissipated in a timely manner, thereby protecting the performance of the device and extending its service life. Through this heat dissipation device, we have not only solved the problem of slow response speed but also provided a safer and more stable operating environment for electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 is a three-dimensional schematic diagram of the heat dissipation device for electronic devices of the present invention in one embodiment.

[0018] Figure 2 is an exploded view of the heat dissipation device for electronic devices of the present invention in one embodiment.

[0019] Figure 3 is a top view of the heat dissipation device for electronic devices of the present invention in one embodiment.

[0020] Figure 4 is a cross-sectional view of the heat dissipation device for electronic devices of the present invention along the A-A direction.

[0021] Figure 5 is a three-dimensional schematic diagram of the heat dissipation device for electronic devices of the present invention in another embodiment.

[0022] Figure 6 is Figure 5 a cross-sectional view in one direction.

[0023] Figure 7 is a three-dimensional schematic diagram of the heat dissipation device for electronic devices of the present invention in yet another embodiment.

[0024] Reference Signs: 100, Electronic device; 200, Phase change unit; 300, Liquid cooling unit; 310, Liquid cooling pipe; 311, First liquid cooling pipe; 312, Second liquid cooling pipe; 320, Heat dissipation fin; 400, Housing; 410, Accommodation cavity; 420, Installation port; 500, Circulation unit; 510, First connecting pipe; 520, Circulation pump; 530, Second connecting pipe. Detailed implementation mode

[0025] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present invention without making creative efforts fall within the scope of protection of the present invention.

[0026] In the description of this embodiment, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this embodiment and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this embodiment.

[0027] In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of this embodiment, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0028] In this embodiment, unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this embodiment can be understood according to specific circumstances.

[0029] In an embodiment of the present invention, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.

[0030] Figures 1 to 7 Shown are a heat dissipation device for electronic devices, an electric control box and an air conditioner provided by the present invention. As can be seen from the figure, the present invention provides a heat dissipation device for electronic devices, including: an electronic device 100, a phase change unit 200 and a liquid cooling unit 300; the phase change unit 200 is connected to the electronic device 100, and the phase change unit 200 includes a phase change material that can absorb the heat released by the electronic device 100 during startup and shutdown; the liquid cooling unit 300 includes at least one liquid cooling pipe 310, the side wall of the liquid cooling pipe 310 is connected to the phase change unit 200, and the liquid cooling pipe 310 can dissipate heat from the phase change unit 200 by means of the liquid cooling working medium therein.

[0031] In specific implementation, the heat dissipation device for electronic devices of the present invention solves the deficiency of the existing heat dissipation technology in dealing with the transient heat load during startup and shutdown of the electronic device 100 through a unique design. The introduction of the phase change unit 200 can quickly absorb the heat released by the electronic device 100 at the moment of startup and shutdown. Since the phase change material itself has a low thermal conductivity, it acts as a heat buffer, avoiding the rapid return of heat to the electronic device 100, thereby preventing the device from being damaged due to a sharp increase in temperature. At the same time, the liquid cooling unit 300 is equipped with at least one liquid cooling pipe 310, and through the liquid cooling working medium flowing in the pipe, the heat stored in the phase change unit 200 is effectively conducted out, realizing fast and efficient heat dissipation. This design not only improves the heat dissipation efficiency but also speeds up the heat dissipation response speed, ensuring that when the electronic device 100 faces a transient heat load, the heat can be dissipated in time, thereby protecting the performance of the device and extending its service life. Through this heat dissipation device, we not only solve the problem of slow response speed but also provide a safer and more stable operating environment for the electronic device 100.

[0032] In this embodiment, the phase change material may be paraffin wax.

[0033] According to an embodiment of the present invention, it further includes a housing 400, the housing 400 has a receiving cavity 410 and at least one setting port 420 that can communicate with the receiving cavity 410; the electronic device 100 and the phase change unit 200 are arranged in the receiving cavity 410; the liquid cooling pipe 310 extends into the receiving cavity 410 through the setting port 420.

[0034] In specific implementation, the housing 400 is designed with a receiving cavity 410, and the receiving cavity 410 is specifically used to place the electronic device 100 and the phase change unit 200. In addition, at least one setting port 420 is provided on the housing 400, and the function of these setting ports 420 is to enable the liquid cooling pipe 310 to smoothly extend into the receiving cavity 410. Such a design allows the electronic device 100 and the phase change unit 200 to be safely installed in a closed space, providing physical protection for the electronic device 100, and at the same time ensuring that the liquid cooling pipe 310 can effectively contact the phase change unit 200 for heat exchange.

[0035] According to an embodiment of the present invention, the liquid cooling unit 300 further includes at least one heat dissipation fin 320, and the heat dissipation fin 320 is arranged on the liquid cooling pipe 310 and contacts both the liquid cooling pipe 310 and the phase change unit 200 at the same time.

[0036] In specific implementation, the phase change unit 200 is a structural member made of a phase change material. Such a design allows the phase change material to undergo a phase change when absorbing the heat released by the electronic device 100, thereby realizing heat storage and delayed release. In addition, the structure of the liquid cooling unit 300 is also enhanced. It not only includes at least one liquid cooling pipe 310, but also includes at least one heat dissipation fin 320. These heat dissipation fins 320 are directly arranged on the liquid cooling pipe 310 and extend into the interior of the phase change unit 200 to directly contact the phase change material. Such a design significantly increases the contact area between the liquid cooling pipe 310 and the phase change material, thereby improving the heat exchange efficiency and accelerating the heat transfer process from the electronic device 100 to the phase change unit 200 and then from the phase change unit 200 to the liquid cooling system.

[0037] According to an embodiment of the present invention, there are a plurality of heat dissipation fins 320, and the plurality of heat dissipation fins 320 are arranged at intervals along the extending direction of the liquid cooling pipe 310.

[0038] In specific implementation, the method of arranging a plurality of heat dissipation fins 320 at intervals along the extending direction of the liquid cooling pipe 310 further increases the contact area with the phase change material and improves the heat exchange efficiency.

[0039] According to an embodiment of the present invention, there are two liquid cooling pipes 310, including a first liquid cooling pipe 311 and a second liquid cooling pipe 312; at least one electronic device 100 is located between the first liquid cooling pipe 311 and the second liquid cooling pipe 312.

[0040] In specific implementation, the design of the liquid cooling pipe 310 adopts two independent liquid cooling pipes 310, namely the first liquid cooling pipe 311 and the second liquid cooling pipe 312. These two liquid cooling pipes 310 are arranged in parallel, and the electronic device 100 is exactly located in the middle position between them. The advantage of this layout is that it can cool the electronic device 100 from two directions simultaneously, thereby more effectively dispersing the heat generated by the device during operation. In this way, the heat dissipation device not only improves the heat dissipation efficiency, but also may achieve a more balanced temperature distribution through the coordinated work of the two liquid cooling pipe paths, further reducing the operating temperature of the device and enhancing the overall performance of the heat dissipation system and the stability of the electronic device 100. This design concept reflects an in-depth understanding of the heat dissipation requirements of the electronic device 100 and the application of innovative solutions.

[0041] According to an embodiment of the present invention, a plurality of heat dissipation fins 320 are respectively sleeved on the first liquid cooling pipe 311 and the second liquid cooling pipe 312; the plurality of heat dissipation fins 320 are respectively in surface contact with the first liquid cooling pipe 311 and the second liquid cooling pipe 312.

[0042] In specific implementation, a plurality of heat dissipation fins 320 are designed on each liquid cooling pipe 310. These heat dissipation fins 320 are respectively sleeved on the outer surfaces of the first liquid cooling pipe 311 and the second liquid cooling pipe 312 and are in direct contact with the pipe surface. Such a design significantly increases the heat dissipation area, and the direct contact between the heat dissipation fins 320 and the liquid cooling pipe 310 further improves the heat conduction efficiency, ensuring that heat can be transferred from the phase change unit 200 to the liquid cooling pipe 310 faster, and then the heat is carried away through the flow of the liquid cooling working medium.

[0043] According to an embodiment of the present invention, it further includes a temperature sensor, a circulation unit 500 and a controller; the temperature sensor is located in the accommodation cavity 410 and can detect the temperature of the phase change unit 200; the circulation unit 500 has a flow channel; the controller is connected to the temperature sensor and the circulation unit 500, and the controller can control the circulation unit 500 in a state where the temperature is greater than a preset value, so that the circulation unit 500 can return the liquid phase change material located in the accommodation cavity 410 to the accommodation cavity 410 through the flow channel for forced convection.

[0044] In specific implementation, the temperature sensor is placed inside the accommodation cavity 410 and is responsible for monitoring the temperature of the phase change unit 200 in real time. Once the detected temperature exceeds the preset safety threshold, the controller will respond immediately and activate the circulation unit 500. The circulation unit 500 is internally designed with a flow channel, enabling the liquid phase change material to circulate inside and outside the accommodation cavity 410. The role of the controller is to intelligently adjust the working state of the circulation unit 500 according to the feedback of the temperature sensor. When the temperature rises, it promotes the circulation of the phase change material in the flow channel, realizes forced convection, and accelerates heat dissipation. This intelligent heat dissipation management mechanism not only improves the heat dissipation efficiency but also can dynamically adjust the heat dissipation strategy according to the actual heat load change, ensuring the temperature stability of the electronic device 100 under various working conditions, thereby effectively extending the service life of the device and guaranteeing the continuous stability of its performance.

[0045] According to an embodiment of the present invention, the circulation unit 500 includes a first connecting pipe 510, a circulation pump 520, and a second connecting pipe 530; the housing 400 is further provided with a first connection port and a second connection port that can communicate with the accommodation cavity 410; one end of the first connecting pipe 510 communicates with the first connection port, and the other end of the first connecting pipe 510 communicates with the inlet of the circulation pump 520; one end of the second connecting pipe 530 communicates with the outlet of the circulation pump 520, and one end of the second connecting pipe 530 communicates with the second connection port.

[0046] In specific implementation, the circulation unit 500 is composed of a first connecting pipe 510, a circulation pump 520, and a second connecting pipe 530, forming a complete fluid circulation system. The design of the circulation unit 500 allows the phase change material to circulate inside and outside the accommodation cavity 410 to achieve more efficient heat exchange. Specifically, the housing 400 is designed with a first connection port and a second connection port, which are respectively connected to the first connecting pipe 510 and the second connecting pipe 530, thus forming a closed loop with the inlet and outlet of the circulation pump 520. One end of the first connecting pipe 510 is connected to the first connection port, and the other end is connected to the inlet of the circulation pump 520, while one end of the second connecting pipe 530 is connected to the outlet of the circulation pump 520, and the other end is connected to the second connection port. Such a configuration ensures that the phase change material can be pumped out from the accommodation cavity 410 under the drive of the circulation pump 520, pressurized by the circulation pump 520, and then returned to the accommodation cavity 410, forming a continuous flow, strengthening the heat dissipation effect. Through this design, the heat dissipation device can respond more intelligently and dynamically to the heat load change of the electronic device 100, improving the heat dissipation efficiency and the reliability of the system.

[0047] According to an embodiment of the present invention, the first connecting pipe 510 and the second connecting pipe 530 are located above the housing 400 and are arranged at an angle in the horizontal direction.

[0048] In specific implementation, the layout design of the first connecting pipe 510 and the second connecting pipe 530 shows uniqueness. These two connecting pipes are both cleverly arranged above the housing 400, and they are arranged at a certain angle along the horizontal direction, and this design can be vertical or inclined. A significant advantage of this layout is that when the circulation pump 520 stops working, due to the action of gravity, the phase change material (such as paraffin) will automatically flow back into the accommodating cavity 410. This self-flow-back characteristic avoids the solidification of the phase change material in the connecting pipe, thereby preventing the damage that the circulation pump 520 may suffer when starting up next time due to the solidification of the material. This design not only improves the reliability of the system but also reduces the maintenance cost because it reduces the possibility of the circulation pump 520 needing to be repaired due to material blockage or solidification. Through this intelligent layout, the heat dissipation device can operate more safely and efficiently, ensuring the stable heat dissipation of the electronic device 100 under various working conditions.

[0049] According to an embodiment of the present invention, there are two setting ports 420, namely a first setting port and a second setting port; the liquid cooling pipe 310 includes a first section, a second section, and a third section that are connected in sequence; the first section is located outside the housing 400, and the end of the first section is arranged at the first setting port; the second section is located in the accommodating cavity 410 and is connected to the phase change unit 200, one end of the second section communicates with the end of the first section, and the other end of the second section communicates with the end of the third section; the third section is located outside the housing 400, and the end of the third section is arranged at the second setting port; the first connecting pipe 510 is in surface contact with the first section; the second connecting pipe 530 is in surface contact with the second section.

[0050] In specific implementation, its design feature is that there are two setting ports 420, namely a first setting port and a second setting port. These two setting ports 420 are respectively located at two different parts of the housing 400 to realize the connection between the liquid cooling pipe 310 and the external environment. The liquid cooling pipe 310 is composed of three sequentially connected sections: the first section is located outside the housing 400, and its end is connected to the first setting port to facilitate the entry of the liquid cooling working medium; the second section is located in the accommodating cavity 410 and is directly connected to the phase change unit 200 to ensure the heat exchange efficiency with the electronic device 100; the third section is also located outside the housing 400, and its end is connected to the second setting port, enabling the liquid cooling working medium to flow out of the system smoothly. In addition, the first connecting pipe 510 is in contact with the first section of the liquid cooling pipe 310, and the second connecting pipe 530 is in contact with the second section of the liquid cooling pipe 310. This design can perform liquid cooling heat dissipation on the phase change materials in the first connecting pipe 510 and the second connecting pipe 530 through the liquid cooling pipe 310, further improving the heat dissipation efficiency.

[0051] In summary, through a series of innovative designs, the present invention significantly improves the heat dissipation efficiency and the thermal stability of the system. Among them, by setting the shape of the heat dissipation fins 320 (or conformal fins) to match the shape of the electronic device 100, or by adopting a design method of increasing the surface area of the heat dissipation fins 320 to set the structure of the heat dissipation fins 320. And the design of the housing 400 (or potting tooling) can not only meet the good thermal conductivity of the metal material, but also take into account the electromagnetic safety requirements and provide a choice of non-metal materials. The filling of the phase change material provides an additional heat capacity reserve, which can quickly absorb and store the additional heat in the startup and shutdown phases, and then slowly release it during the stable operation phase to maintain the internal temperature stable.

[0052] The key innovation points of the present invention include: 1. The use of phase change material as a heat capacity reserve unit to quickly respond to changes in heat load.

[0053] 2. The integrated design of the liquid cooling pipe 310 and the heat dissipation fins 320 to optimize the heat exchange efficiency by increasing the contact area.

[0054] 3. The personalized design of the length of the heat dissipation fins 320, customized according to the shape and heat generation area of the heat generating device, to achieve efficient heat dissipation.

[0055] These innovation points bring the following advantages: 1. Enhanced dynamic heat load buffering ability, effectively avoiding device overheating and damage.

[0056] 2. Improved heat exchange efficiency, achieved by increasing the contact area and optimizing the design of the heat dissipation fins 320.

[0057] 3. Enhanced intelligent adaptability, dynamically adjusted according to the actual heat generation characteristics and working conditions of the device, to achieve precise and efficient thermal management.

[0058] In addition, the present invention also considers various alternative solutions, such as different forms of heat dissipation fin 320 design, diversified layout of the liquid cooling pipe 310, selection of pipes of any shape, application of different phase change materials, and diversified connection means.

[0059] The present invention provides an electric control box, including: an electronic device heat dissipation device as described in the above embodiment.

[0060] During specific implementation, the specific structure, working principle and beneficial effects of the electronic device heat dissipation device are the same as those in the above embodiment, and will not be elaborated here.

[0061] The present invention provides an air conditioner, including: an electronic device heat dissipation device as described in the above embodiment; or, an electric control box as described in the above embodiment.

[0062] In specific implementation, the specific structure, working principle and beneficial effects of the electronic device heat dissipation device or the electronic control box are the same as those of the above embodiments, and will not be elaborated here.

[0063] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "mode", "specific mode", or "some modes" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or mode are included in at least one embodiment or mode of the embodiments of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or mode. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or modes. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or modes described in this specification and the features of different embodiments or modes.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device for an electronic device, characterized in that, Comprising: An electronic device (100), a phase change unit (200), and a liquid cooling unit (300); The phase change unit (200) is connected to the electronic device (100), and the phase change unit includes a phase change material that can absorb the heat released by the electronic device (100) during startup and shutdown; The liquid cooling unit (300) includes at least one liquid cooling pipe (310), the side wall of the liquid cooling pipe (310) is connected to the phase change unit (200), and the liquid cooling pipe (310) can dissipate heat from the phase change unit (200) by means of the liquid cooling working medium therein.

2. The electronic device heat dissipation device according to claim 1, wherein It further includes a housing (400), the housing (400) has a receiving cavity (410) and at least one setting port (420) that can communicate with the receiving cavity (410); The electronic device (100) and the phase change unit (200) are arranged in the receiving cavity (410); The liquid cooling pipe (310) extends into the receiving cavity (410) through the setting port (420).

3. The electronic device heat dissipation device according to claim 2, wherein The liquid cooling unit (300) further includes at least one heat dissipation fin (320), the heat dissipation fin (320) is arranged on the liquid cooling pipe (310) and is in contact with both the liquid cooling pipe (310) and the phase change unit (200) at the same time.

4. The electronic device heat dissipation device according to claim 3, wherein There are multiple heat dissipation fins (320), and the multiple heat dissipation fins (320) are arranged at intervals along the extending direction of the liquid cooling pipe (310).

5. The electronic device heat dissipation device according to claim 2 or 4, wherein The liquid cooling pipe (310) includes a first liquid cooling pipe (311) and a second liquid cooling pipe (312); At least one of the electronic devices (100) is located between the first liquid cooling pipe (311) and the second liquid cooling pipe (312).

6. The heat dissipation device for an electronic device according to any one of claims 3 to 5, characterized in that, It further includes a temperature sensor, a circulation unit (500), and a controller; The temperature sensor is located in the receiving cavity (410) and can detect the temperature of the phase change unit (200); The circulation unit (500) has a flow channel; The controller is connected to the temperature sensor and the circulation unit (500), and the controller can control the circulation unit (500) in a state where the temperature is greater than a preset value, so that the circulation unit (500) can return the liquid phase change material located in the receiving cavity (410) back to the receiving cavity (410) through the flow channel for forced convection.

7. The electronic device heat dissipation device according to claim 6, wherein The circulation unit (500) includes a first connecting pipe (510), a circulation pump (520), and a second connecting pipe (530); The housing (400) further has a first connection port and a second connection port that can communicate with the receiving cavity (410); One end of the first connecting pipe (510) communicates with the first connection port, and the other end of the first connecting pipe (510) communicates with the inlet of the circulation pump (520); One end of the second connecting pipe (530) is connected to the outlet of the circulation pump (520), and one end of the second connecting pipe (530) is connected to the second connection port.

8. The electronic device heat dissipation device according to claim 7, wherein There are two of the setting ports (420), namely a first setting port and a second setting port respectively; The liquid cooling pipe (310) includes a first section, a second section and a third section connected in sequence; the first section is located outside the housing (400), and the end of the first section is arranged at the first setting port; the second section is located in the accommodation cavity (410) and is connected to the phase change unit (200), one end of the second section is connected to the end of the first section, and the other end of the second section is connected to the end of the third section; the third section is located outside the housing (400), and the end of the third section is arranged at the second setting port; The first connecting pipe (510) is in surface contact with the first section; The second connecting pipe (530) is in surface contact with the second section.

9. An electric control box, characterized in that, Comprising: The electronic device heat dissipation device according to any one of claims 1 to 8.

10. An air conditioner, characterized in that, Comprising: The electronic device heat dissipation device according to any one of claims 1 to 8; Or, The electric control box according to claim 9.

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