Heat dissipation enhanced current sensor housing

Abstract

The application provides a heat dissipation enhanced current sensor shell, which comprises an inner shell and an outer shell, the inner shell forms a wire through hole, an installation cavity for placing a PCB is formed between the inner shell and the outer shell, a plurality of copper-aluminum composite heat pipes along the wire direction are arranged on the outer shell, the heat pipes are filled with nanofluid, a copper nail array with a density higher than 36 / cm 2 per square centimeter is arranged on the outer shell and penetrates the heat pipes, the copper nail array is in contact with the PCB, a fin array is arranged on the heat pipes and is distributed along the wire direction, each fin unit of the fin array is bifurcated at 90°, each fin unit is provided with a honeycomb unit, a shape memory alloy sheet is embedded in each honeycomb hole of the honeycomb unit, a top cover covering the heat pipes and the fin array is arranged on the outer shell, air inlets and air outlets are formed at two ends of the top cover along the wire direction, a venturi is arranged at the air inlet, and a Helmholtz resonator is arranged at the air outlet.

Description

Technical Field

[0001] This invention relates to the field of current sensor technology, and in particular to a heat-dissipating enhanced current sensor housing. Background Technology

[0002] The heat dissipation problem of current sensors is mainly caused by internal power consumption and material properties. When current flows through the conductors inside a current sensor, Joule heating is generated, and this heat generation is proportional to the square of the current and the resistance value. Under high-current conditions, even low-resistance manganese copper materials will generate significant heat. Especially in open-loop Hall effect sensors, high-frequency current passing through the magnetic core generates eddy currents, causing a sharp rise in the core temperature.

[0003] The reason for the heat dissipation defects in current sensors is that some sensor designs do not fully consider heat dissipation requirements, such as small heat sink area and inappropriate selection of thermally conductive materials, resulting in the inability to dissipate heat quickly. More critically, the existing heat dissipation holes adopt a linear array layout, inducing a "through-draft" effect. PIV testing shows that 80% of the airflow does not flow through the heat-generating element but passes directly through the housing. Summary of the Invention

[0004] The present invention aims to solve the above-mentioned technical problems by providing a heat-dissipating enhanced current sensor housing.

[0005] The technical solution of this invention is a heat-dissipating enhanced current sensor housing, comprising an inner housing and an outer housing. The inner housing forms a wire through-hole, and a mounting cavity for placing a PCB board is formed between the inner housing and the outer housing. The outer housing is provided with a plurality of copper-aluminum composite heat pipes along the wire direction, and the heat pipes are filled with nanofluid. The outer housing is also provided with a device penetrating the heat pipes and having a density higher than 36 particles / cm³. 2 The heat pipe has a copper nail array that contacts the PCB board. A fin array is distributed along the wire direction on the heat pipe. Each fin unit of the fin array branches at 90°, and each fin unit has a honeycomb unit. A shape memory alloy sheet is embedded within each honeycomb hole of the honeycomb unit. The alloy sheet unfolds at 55°C to form a spiral airflow guiding surface. The outer casing has a top cover covering the heat pipe and the fin array. An air inlet and an air outlet are formed at both ends of the top cover along the wire direction, respectively. The branching direction of the fin units faces the air outlet. The air inlet has a Venturi tube, and the air outlet has a Helmholtz resonant cavity with a gradually expanding opening at its end.

[0006] In one embodiment, the heat pipes are configured as three, each with a diameter of 6 mm.

[0007] In one embodiment, the nanofluid is a mixture of 15% alumina nanoparticles and 85% ethanol.

[0008] In one implementation, the spacing between adjacent fin units gradually increases along the direction from the air inlet to the air outlet.

[0009] In one implementation, the edges of the fin unit are serrated fractals.

[0010] In one implementation, the cellular cells of the cellular unit are arranged non-uniformly, and the cellular cell density in the core area is greater than that in the edge area.

[0011] In one embodiment, a thermally conductive silicone grease layer is provided at the bottom of the heat pipe where it connects to the copper nail array.

[0012] In one embodiment, the alloy sheet is a nickel-titanium shape memory alloy sheet, and the thickness of the alloy sheet is 0.1 mm.

[0013] In one embodiment, the Helmholtz resonant cavity includes a cuboid cavity and a neck channel connecting the cuboid cavity and the air outlet, and the gradually expanding opening is connected to the cuboid cavity.

[0014] The advantages of this invention compared to existing technologies are that the heat dissipation-enhanced current sensor housing redesigns the heat flow transfer path, establishing a three-stage conduction path from the heat-generating element → copper nail array → heat pipe → fin array, and also establishing a convection path from the acceleration section → honeycomb labyrinth → resonant cavity. The synergistic heat dissipation effect of the conduction and convection paths is manifested in the fact that when airflow passes through the fin array between the inlet and outlet, the 90° bifurcation of the fin units causes the fin array to form a fishbone shape. Therefore, when the airflow contacts one branch of a fin unit, it deflects to the branch of an adjacent fin unit. The airflow direction between the two fin arrays is zigzag, avoiding the "through draft" phenomenon. Furthermore, the honeycomb units begin to function when the temperature exceeds 55°C. The zigzag airflow direction is altered because the formation of the spiral guide surface allows some airflow to pass through the honeycomb holes. A significant number of honeycomb holes are located on the convection path, forming a honeycomb labyrinth effect, greatly increasing the effective contact area between the air and the fin array. Therefore, this heat-enhanced current sensor housing achieves significantly improved heat dissipation performance compared to traditional current sensor housings through the coordinated heat dissipation of heat conduction and convection, combined with a dynamically adjustable structure, forming an adaptive thermal management system. Attached Figure Description

[0015] Figure 1 A schematic diagram of the structure of the heat-dissipating enhanced current sensor housing provided in an embodiment of the present invention;

[0016] Figure 2 A first partial cross-sectional view of a heat-enhanced current sensor housing provided for an embodiment of the present invention;

[0017] Figure 3 A second partial cross-sectional view of a heat-enhanced current sensor housing provided in an embodiment of the present invention;

[0018] Figure 4 A third partial cross-sectional view of the heat-enhancing current sensor housing provided in an embodiment of the present invention;

[0019] Figure 5 This is a schematic diagram of the structure of the finned unit and the honeycomb unit provided in the embodiments of the present invention.

[0020] In the diagram: 1. Inner shell; 2. Outer shell; 3. Wiring hole; 4. Mounting cavity; 5. Heat pipe; 6. Copper nail array; 7. Fin array; 8. Fin unit; 9. Honeycomb unit; 10. Honeycomb hole; 11. Alloy sheet; 12. Spiral guide surface; 13. Top cover; 14. Air inlet; 15. Air outlet; 16. Venturi tube; 17. Helmholtz resonant cavity; 18. Gradually expanding opening; 19. Cuboid cavity; 20. Neck channel. Detailed Implementation

[0021] The above and other embodiments and advantages of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0022] In one implementation, such as Figures 1 to 5 As shown.

[0023] The heat-enhanced current sensor housing provided in this embodiment includes an inner housing 1 and an outer housing 2. The inner housing 1 forms a wire through-hole 3, and a mounting cavity 4 for placing a PCB board is formed between the inner housing 1 and the outer housing 2. The outer housing 2 is provided with a plurality of copper-aluminum composite heat pipes 5 along the wire direction. The heat pipes 5 are filled with nanofluid. The outer housing 2 is also provided with through-heat pipes 5 and a density higher than 36 particles / cm³. 2 The copper nail array 6 contacts the PCB board. The heat pipe 5 has a fin array 7 distributed along the wire direction. Each fin unit 8 of the fin array 7 is bifurcated at 90° and each fin unit 8 has a honeycomb unit 9. Each honeycomb hole 10 of the honeycomb unit 9 is embedded with a shape memory alloy sheet 11. The alloy sheet 11 unfolds at 55°C to form a spiral guide surface 12. The outer shell 2 has a top cover 13 covering the heat pipe 5 and the fin array 7. The top cover 13 forms an air inlet 14 and an air outlet 15 at both ends along the wire direction. The bifurcated direction of the fin unit 8 faces the air outlet 15. The air inlet 14 is equipped with a Venturi tube 16. The air outlet 15 is equipped with a Helmholtz resonant cavity 17. The end of the Helmholtz resonant cavity 17 is equipped with a gradually expanding opening 18.

[0024] In this embodiment, the heat dissipation-enhanced current sensor housing has a redesigned heat transfer path. Since the copper pin array 6 is in contact with the PCB board, a three-stage conduction path is established: heat-generating element → copper pin array 6 → heat pipe 5 → fin array 7. The copper-aluminum composite heat pipe 5 serves as the main channel, forming a fishbone shape with the fin array 7 extending on both sides. Furthermore, due to the inclusion of the Venturi tube 16 and the Helmholtz resonant cavity 17, a convection path is established: acceleration section → honeycomb labyrinth → resonant cavity. The synergistic heat dissipation effect of the conduction and convection paths is manifested in the fact that when the airflow passes through the section of fin array 7 between the air inlet 14 and the air outlet 15, the 90° bifurcation of the fin units 8 causes the fin array 7 to form a fishbone shape. Therefore, when the airflow contacts one branch of the fin unit 8, it will deflect to the adjacent branch of another fin unit 8. The airflow direction between the two fin arrays 7 is zigzag, avoiding a "through draft" phenomenon. Furthermore, when the temperature exceeds 55°C, the honeycomb unit 9 begins to function. Figure 5 As shown, the alloy sheet 11 unfolds at 55°C to form a spiral guide surface 12. Therefore, when the temperature is above 55°C, the zigzag direction of the airflow is changed. Because of the formation of the spiral guide surface 12, some airflow can pass through the honeycomb holes 10. A considerable number of honeycomb holes 10 are located on the convection path, forming a honeycomb labyrinth effect, which greatly increases the effective contact area between the air and the fin array 7. The Helmholtz resonant cavity 17 can absorb the high-order harmonics generated by the airflow, reduce the airflow pulsation energy, and improve the airflow stability.

[0025] Therefore, this heat-enhanced current sensor housing achieves significantly improved heat dissipation performance compared to traditional current sensor housings through the coordinated heat dissipation of heat conduction and convection, combined with a dynamically adjustable structure, forming an adaptive thermal management system.

[0026] In one embodiment, the heat-enhanced current sensor housing has three heat pipes 5, each with a diameter of 6 mm.

[0027] In this embodiment, three heat pipes (central and symmetrically arranged on both sides) cover the heat source along the long axis of the casing, splitting the concentrated heat flow into three independent transmission paths to avoid overloading a single heat pipe and ensure uniform temperature distribution. The 6mm diameter matches the casing height limitation.

[0028] In one embodiment, the nanofluid of the heat-enhancing current sensor housing is a mixture of 15% alumina nanoparticles and 85% ethanol.

[0029] In this embodiment, the copper-aluminum composite heat pipe 5 utilizes nanoparticles to enhance heat transfer, resulting in a thermal conductivity increase of over 50% compared to pure ethanol. A concentration of 15% achieves a better balance between fluidity and enhanced thermal conductivity, as excessively high concentrations can lead to particle agglomeration, while excessively low concentrations result in insufficient heat transfer enhancement.

[0030] In one implementation, such as Figure 3 As shown.

[0031] The heat-enhancing current sensor housing provided in this embodiment has a spacing between adjacent fin units 8 that gradually increases along the direction from the air inlet 14 to the air outlet 15.

[0032] In this embodiment, this configuration achieves velocity gradient control. The small spacing at the inlet increases the shear force of the velocity boundary layer, improving the near-wall heat transfer coefficient, while the large spacing at the outlet reduces flow resistance and avoids pressure drop accumulation. The increased air temperature along the convection path leads to volume expansion; the increased spacing compensates for the required cross-sectional area of ​​the airflow, preventing localized overheating.

[0033] In one implementation, such as Figure 5 As shown.

[0034] The heat-enhancing current sensor housing provided in this embodiment has a serrated fractal edge on the edge of its fin unit 8.

[0035] In this embodiment, this configuration disrupts the boundary layer, with the sharp serrated edges periodically disturbing the airflow and forcibly stripping the laminar boundary layer, thereby increasing the Nusselt number of the heat transfer surface. Each serration generates two pairs of counter-rotating micro-vortices, increasing the vortex density and enhancing heat transfer at the gas-solid interface. The fractal structure disperses the concentrated heat flow into multi-level branched paths, reducing the standard deviation of the fin surface temperature and eliminating localized hot spots.

[0036] In one implementation, such as Figure 5 As shown.

[0037] The heat-enhancing current sensor housing provided in this embodiment has a non-uniform arrangement of the honeycomb cells 9, and the density of the honeycomb cells 10 in the core area is greater than that in the edge area.

[0038] In this embodiment, this configuration enables heat flux density matching. The high-density honeycomb structure in the core area increases the heat exchange area, compensating for the heat flux density in areas of concentrated heat generation, while the low density in the edge area avoids ineffective pressure drop. Furthermore, the density gradient forms a gradually narrowing flow channel, extending the airflow residence time and enhancing convective heat transfer.

[0039] In one embodiment, a thermally conductive silicone grease layer is provided at the bottom of the heat pipe 5 where it is connected to the copper nail array 6.

[0040] In this embodiment, the thermal grease layer has a certain degree of viscosity, which serves both to connect the copper nail array 6 to the PCB board and to conduct heat.

[0041] In one embodiment, the alloy sheet 11 is a nickel-titanium shape memory alloy sheet, and the thickness of the alloy sheet 11 is 0.1 mm.

[0042] In this embodiment, the nickel-titanium shape memory alloy sheet fills the honeycomb holes 10, almost completely blocking them when not unfolded. When unfolded, it forms a spiral guide surface 12, changing the direction of airflow.

[0043] In one embodiment, the Helmholtz resonant cavity 17 of the heat-enhancing current sensor housing includes a cuboid cavity 19 and a neck channel 20 connecting the cuboid cavity 19 and the air outlet 15, with a gradually widening opening 18 connected to the cuboid cavity 19.

[0044] In this embodiment, a trumpet-shaped, gradually expanding opening 18 is provided at the end of the Helmholtz resonant cavity 17. After the airflow is modulated by the resonant cavity, it exits the shell in a laminar flow form through this opening and is directly connected to the external environment. A guide lip extends from the outer edge of the opening to avoid backflow disturbance.

[0045] The specific embodiments described above further illustrate the inventive purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. In particular, it should be noted that any modifications, equivalent substitutions, or improvements made by those skilled in the art within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A heat sink enhanced current sensor housing, characterized by, The application relates to a heat dissipation device for a power cable, which comprises an inner shell and an outer shell, the inner shell forms a wire through hole, an installation cavity for placing a PCB board is formed between the inner shell and the outer shell, a plurality of copper-aluminum composite heat pipes are arranged on the outer shell along the wire direction, the heat pipes are filled with nanofluid, a copper nail array with a density higher than 36 / cm2 is further arranged on the outer shell and penetrates through the heat pipes, the copper nail array is in contact with the PCB board, a fin array is arranged on the heat pipes along the wire direction, each fin unit of the fin array is bifurcated by 90 DEG, a honeycomb unit is arranged on each fin unit, a shape memory alloy sheet is embedded in each honeycomb hole of the honeycomb unit, the alloy sheet is unfolded to form a spiral flow guide surface at 55 DEG C, and the memory alloy sheet in the honeycomb hole can block the honeycomb hole when the temperature is lower than 55 DEG C, a top cover covering the heat pipes and the fin array is arranged on the outer shell, air inlets and air outlets are formed at two ends of the top cover along the wire direction, the bifurcated direction of the fin unit is opposite to the air outlet, a Venturi tube is arranged on the air inlet, a Helmholtz resonance cavity is arranged on the air outlet, and a gradually expanding opening is arranged at the tail end of the Helmholtz resonance cavity.

2. The heat dissipation enhanced current sensor housing according to claim 1, wherein, The heat pipes are arranged in three, and the diameter of each heat pipe is 6 mm.

3. The heat dissipation enhanced current sensor housing according to claim 1, wherein, The nanofluid is a mixture of 15% aluminum oxide nanoparticles and 85% ethanol.

4. The heat-dissipation-enhanced current sensor housing according to claim 1, wherein, The interval between each adjacent fin unit gradually increases along the direction from the air inlet to the air outlet.

5. The heat dissipation enhanced current sensor housing according to claim 4, wherein, The edges of the fin unit are zigzag fractals.

6. The heat-dissipation-enhanced current sensor housing according to claim 1, wherein, Each honeycomb hole of the honeycomb unit is arranged in a non-uniform manner, and the honeycomb hole density of the core area is greater than that of the edge area.

7. The heat-dissipation enhanced current sensor housing according to claim 1, wherein, A heat-conducting silicone grease layer is arranged at the bottom of the heat pipe and connected with the copper nail array.

8. The heat-dissipation enhanced current sensor housing according to claim 1, wherein, The alloy sheet is a nickel-titanium shape memory alloy sheet, and the thickness of the alloy sheet is 0.1 mm.

9. The heat-dissipation enhanced current sensor housing according to claim 1, wherein, The Helmholtz resonance cavity comprises a cuboid cavity and a neck channel connecting the cuboid cavity and the air outlet, and the gradually expanding opening is connected to the cuboid cavity.

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