Cold plates, cooling systems and electronic equipment

Abstract

The present application relates to the field of heat dissipation technology, and discloses a cold plate, a cooling system, and an electronic device, comprising a cold plate body and at least one heat conductor, wherein a liquid cooling cavity is provided in the cold plate body; a first surface is provided on the cold plate body, and at least a portion of the first surface is used for contacting a heating element; at least one heat conductor is provided in the liquid cooling cavity, and the heat conductor is connected to a portion corresponding to the first surface in the liquid cooling cavity and extends in a direction away from the first surface, thereby effectively improving heat dissipation efficiency.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a cold plate, a cooling system and an electronic device. Background Art

[0002] In related technologies, with the continuous development of electronic equipment, its power density is increasing, which puts higher requirements on heat dissipation technology. In related technologies, cold plate heat dissipation is a heat dissipation technology that uses a metal plate (cold plate) to contact the heating element and uses fluid (such as water, oil or other heat dissipation media) to flow through the cold plate to remove heat. As an efficient heat dissipation method, it has gradually been widely used.

[0003] However, the contact area between the cold plate and the heating element is limited, which cannot effectively improve the heat dissipation efficiency. Summary of the Invention

[0004] The present application provides a cold plate, a cooling system and an electronic device, which can effectively improve heat dissipation efficiency.

[0005] In a first aspect, the present application provides a cold plate comprising a cold plate body and at least one heat conductor, wherein a liquid cooling cavity is provided in the cold plate body; a first surface is provided on the cold plate body, and the first surface is at least partially used to contact a heating element; at least one heat conductor is provided in the liquid cooling cavity, and the heat conductor is connected to a portion corresponding to the first surface in the liquid cooling cavity, and extends in a direction away from the first surface.

[0006] In a second aspect, the present application further provides a cooling system, comprising: the cold plate in the first aspect.

[0007] In a third aspect, the present application further provides an electronic device, comprising: the cold plate in the first aspect, or the cooling system in the second aspect.

[0008] Beneficial effects: The present application provides a cold plate, a cooling system and an electronic device, which adopts a liquid cooling cavity set in the cold plate body, and a plurality of heat conductive parts are set in the liquid cooling cavity. The heat conductive parts extend in a direction away from the first surface, and can transmit the heat generated by the heating element in a direction perpendicular to the first surface within the liquid cooling cavity. The heat conductive parts increase the contact area with the heat dissipation medium, increase the heat exchange rate between the heat and the heat dissipation medium, and thus improve the heat dissipation efficiency of the cold plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the specific implementation methods of this application or the technical solutions in related technologies, the following is a brief introduction to the drawings required for use in the specific implementation methods or related technical descriptions. Obviously, the drawings described below are some implementation methods of this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0010] Figure 1 This is an isometric view of a cold plate according to an embodiment of the present application;

[0011] Figure 2 An axial side view of a cold plate with the top cover removed according to an embodiment of the present application;

[0012] Figure 3 This is an axial side view of a jet assembly in a cold plate according to an embodiment of the present application;

[0013] Figure 4 This is an axial side view of a jet plate in a cold plate according to an embodiment of the present application;

[0014] Figure 5 This is an axial side view of a heat conducting member in a cold plate according to an embodiment of the present application;

[0015] Figure 6 A top view of a cold plate with the top cover removed according to an embodiment of the present application;

[0016] Figure 7 A top view of another cold plate with the top cover removed according to an embodiment of the present application;

[0017] Figure 8 A top view of another cold plate with the top cover removed according to an embodiment of the present application;

[0018] Figure 9 A top view of a cold plate according to an embodiment of the present application;

[0019] Figure 10 for Figure 9 Cross-sectional view at AA in the middle;

[0020] Figure 11 for Figure 9 A cross-sectional view of another structure at AA in the middle;

[0021] Figure 12 for Figure 9 A cross-sectional view of another structure at AA in the middle;

[0022] Figure 13 This is a structural schematic diagram of a cold plate body in a cold plate according to an embodiment of the present application.

[0023] Description of reference numerals:

[0024] 1. Cold plate body; 2. Heat conducting parts; 3. Fluidic components;

[0025] 11. Liquid cooling chamber; 12. First surface; 13. Second soaking chamber; 14. Liquid inlet; 15. Liquid outlet; 16. Base plate; 17. Side wall shell; 171. Wall plate; 18. Top cover;

[0026] 111. Static pressure chamber; 112. Flow channel chamber;

[0027] 21. First soaking chamber; 22. Fins;

[0028] 31. Jet hole; 32. Jet face; 33. Jet plate. DETAILED DESCRIPTION

[0029] To make the purpose, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of this application.

[0030] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0031] In related technologies, with the continuous development of electronic equipment, its power density is increasing, which puts higher requirements on heat dissipation technology. In related technologies, cold plate heat dissipation is a heat dissipation technology that uses a metal plate (cold plate) to contact the heating element and uses fluid (such as water, oil or other heat dissipation media) to flow through the cold plate to remove heat. As an efficient heat dissipation method, it has gradually been widely used.

[0032] However, the contact area between the cold plate and the heating element is limited, which cannot effectively improve the heat dissipation efficiency.

[0033] In order to solve the above technical problems, the present application provides a cold plate, a cooling system and an electronic device, which can effectively improve the heat dissipation efficiency.

[0034] The following combination Figures 1 to 13 , describing the embodiments of the present application.

[0035] According to an embodiment of the present application, on the one hand, a cold plate is provided, such as Figures 1 to 6 As shown, it includes a cold plate body 1 and at least one heat conducting member 2, and the specific solution is as follows.

[0036] like Figure 2 As shown, the cold plate body 1 is a metal cavity, such as a copper cavity or an aluminum cavity, or a composite cavity, specifically, a silicon carbide particle reinforced aluminum-based composite cavity; a liquid cooling cavity 11 is provided in the cold plate body 1; a first surface 12 is provided on the cold plate body 1, and the first surface 12 is at least partially used to contact the heating element; specifically, the cold plate body 1 is connected and fixed to the electronic device (such as a server motherboard, etc.) through multiple connecting parts (such as locking screws, etc.).

[0037] like Figure 2 As shown, the heat conducting member 2 can be one or more. Specifically, the heat conducting member 2 can be a heat conducting metal block, such as a copper block, an aluminum block, etc. The specific shape of the heat conducting member 2 can be any shape such as a cuboid, a cylinder, a triangular pyramid, etc. The heat conducting member 2 is arranged in the liquid cooling cavity 11, and the heat conducting member 2 is connected to the portion corresponding to the first surface 12 in the liquid cooling cavity 11 by welding or integral molding, and extends in a direction away from the first surface 12.

[0038] Specifically, when there are multiple heat-conducting members 2 , the multiple heat-conducting members 2 are arranged in the liquid-cooling chamber 11 in any arrangement, such as a circular array, a rectangular array, etc.

[0039] In the specific use process, such as Figures 1 to 6As shown, the data processing module in the server is used as the heating element, and the cold plate body 1 is fixed to the main board of the server by means of locking screws, so that the first surface 12 and the data processing module are pressed together. Of course, thermal grease can be provided between the first surface 12 and the data processing module to enhance the heat transfer efficiency; the cold plate body 1 is provided with a liquid inlet 14 and a liquid outlet 15 to communicate with the heat dissipation medium generating device.

[0040] In the specific work process, such as Figure 2 As shown, the heat generated by the data processing module during operation is transferred to the first surface 12 and then extends in the direction of the liquid cooling cavity 11. The heat conductor 2 conducts the heat in a direction perpendicular to the first surface 12, and the heat conductor 2 exchanges heat with the liquid cooling medium in the liquid cooling cavity 11.

[0041] In this embodiment, Figures 1 to 6 As shown, a liquid cooling cavity 11 is provided in the cold plate body 1, and a plurality of heat conducting members 2 are provided in the liquid cooling cavity 11. The heat conducting members 2 extend in a direction away from the first surface 12, and can transmit the heat generated by the heating element in a direction perpendicular to the first surface 12 within the liquid cooling cavity 11. The heat conducting members 2 increase the contact area with the heat dissipation medium, increase the heat exchange rate between the heat and the heat dissipation medium, and thus improve the heat dissipation efficiency of the cold plate.

[0042] In one embodiment, Figure 2 and Figure 3 As shown, the cold plate further includes at least one jet component 3, which is arranged in the liquid cooling cavity 11 by welding or bonding. Figure 3 As shown, the jet assembly 3 is provided with a plurality of jet holes 31 , and the jet holes 31 face toward the heat conducting element 2 .

[0043] Specifically, the jet component 3 may be a metal plate or a plastic plate with holes. In a specific solution, the jet component 3 may be arranged at a liquid inlet 14 of the liquid cooling chamber 11 .

[0044] The diameter of the jet hole 31 is 0.5 mm to 2.5 mm, and can be any one of 0.5 mm, 1 mm, 1.5 mm, 2 mm and 2.5 mm or a range between any two values, and is preferably 1 mm.

[0045] The principle is as follows: the heat dissipation medium is directly sprayed through the jet hole 31 onto the surface of the heat conductor 2. The high-speed fluid directly impacts the surface of the heat conductor 2, forming a very thin velocity boundary layer on the impacted surface. Therefore, it can generate extremely strong convective heat transfer capacity locally. The local convective heat transfer coefficient is nearly 10 times higher than that of the skived tooth cold plate, but the convective heat transfer coefficient gradually decreases as it moves away from the center of the jet; the liquid flow state in the jet area is turbulent, and the fluid flow state between the skived teeth away from the jet area is laminar.

[0046]

[0047]

[0048] The first formula above ( ) is the calculation formula for the local convective heat transfer coefficient in turbulent scenarios. The second formula ( ) is the calculation formula for the local convective heat transfer coefficient in the laminar flow scenario, where h1 and h2 are the convective heat transfer coefficients, Nu is the Nusselt number, Re is the Reynolds number, and Pr is the Prandtl number, three dimensionless physical quantities; in the laminar flow scenario, D is the gap between the shovel teeth; in the turbulent flow scenario, D is the aperture of the jet hole 31, H is the jet distance, λ is the thermal conductivity, and r is the distance from the jet face to the surface of the heat conductor.

[0049] The calculation formula for convective heat conduction is: Q=h·S1·ΔT.

[0050] In the formula, Q is the chip power consumption, h is the convection heat transfer coefficient, S1 is the convection heat transfer area, and ΔT is the temperature difference between the center temperature of the chip surface and the water inlet temperature. Under certain conditions of power consumption, convection heat transfer area, and water inlet temperature, increasing the local convection heat transfer coefficient will reduce the center temperature of the chip surface and achieve a good heat dissipation effect. The solution proposed in this application has a higher convection heat transfer coefficient than the conventional skived tooth cold plate.

[0051] In the specific use process, such as Figure 2 As shown, the heat dissipation medium entering the liquid cooling chamber 11 forms a jet after passing through the jet assembly 3, and is sprayed vertically at high speed to the outer surface of the heat conductor 2, forming a local high-intensity impact flow. The jet impact will form an extremely thin fluid boundary layer in the impact area (stagnation area), significantly reducing thermal resistance and enhancing heat transfer efficiency (the heat transfer coefficient can be several times higher than that of traditional convection).

[0052] In this embodiment, Figure 2 and Figure 3 As shown, a jet assembly 3 is provided in the liquid cooling chamber 11, and the jet holes 31 on the jet assembly 3 face the heat conducting member 2, so that at least part of the heat dissipation medium forms a high-speed jet to impact the surface of the heat conducting member 2, thereby enhancing the heat exchange rate between the heat dissipation medium and the conducting body and improving the heat exchange efficiency.

[0053] In one embodiment, Figure 2 As shown, the jet assembly 3 separates the liquid cooling chamber 11 into a static pressure chamber 111 and a flow channel chamber 112, and the heat conducting member 2 is at least partially located in the flow channel chamber 112; Figure 2 As shown, the cold plate body 1 is provided with at least one liquid inlet 14 and at least one liquid outlet 15 , the static pressure cavity 111 is communicated with the liquid inlet 14 of the heat dissipation medium, and the flow channel cavity 112 is communicated with the liquid outlet 15 of the heat dissipation medium.

[0054] Specifically, a specific structure is: Figure 2 As shown, the jet assembly 3 extends in a direction away from the first surface 12 to separate the liquid cooling chamber 11 into a static pressure chamber 111 and a flow channel chamber 112; the side-by-side direction of the static pressure chamber 111 and the flow channel chamber 112 is parallel to the first surface 12; the heat conducting member 2 can be completely located in the flow channel chamber 112, of course, it can also be partially located in the flow channel chamber 112 and partially located in the static pressure chamber 111.

[0055] Another specific structure is: not shown in the figure, the jet component 3 extends in a direction parallel to the first surface 12 (that is, the main surface of the jet component 3 is parallel to the first surface 12), dividing the liquid cooling chamber 11 into a static pressure chamber 111 and a flow channel chamber 112, and the side-by-side direction of the static pressure chamber 111 and the flow channel chamber 112 is perpendicular to the first surface 12; the heat conductor 2 can be completely located in the flow channel chamber 112, of course, it can also be partially located in the flow channel chamber 112 and partially located in the static pressure chamber 111.

[0056] like Figure 8 As shown, when a portion of the heat conducting member 2 is located in the flow channel cavity 112 and the other portion is located in the static pressure cavity 111, the portion of the heat conducting member 2 located in the static pressure cavity 111 performs convection heat exchange with the heat dissipation medium, and at least the portion of the heat conducting member 2 located in the flow channel cavity 112 corresponds to the jet hole 31 on the jet assembly 3 to form a jet zone for jet heat exchange, and also a portion of the heat conducting member 2 performs convection heat exchange with the heat dissipation medium located in the flow channel cavity 112.

[0057] In this embodiment, Figure 2 and Figure 8 As shown, the liquid cooling chamber 11 is divided into a static pressure chamber 111 and a flow channel chamber 112 by using a jet component 3, which can increase the area of ​​the jet component 3, thereby increasing the jet area of ​​the jet component 3 to the heat conductor 2, to expand the jet heat dissipation area, thereby further improving the heat exchange efficiency.

[0058] In a specific embodiment, Figure 2 As shown, there are multiple heat-conducting members 2, specifically, the number of heat-conducting members 2 is 1 to 8, and the number of heat-conducting members 2 is preferably any value among 2, 3, 4, 5, 6 and 7 or a range between any two values, and more preferably 4 or 5; the shape of the heat-conducting member 2 is a rectangular parallelepiped; the multiple heat-conducting members 2 are arranged at intervals, specifically, the distance between the heat-conducting members 2 is 10 mm to 30 mm, and can be any value among 12 mm, 14 mm, 16 mm, 18 mm, 20 mm, 22 mm and 24 mm or a range between any two values.

[0059] like Figure 3 and Figure 4 As shown, the jet assembly 3 has a plurality of jet surfaces 32, such as Figure 4As shown, each jet surface 32 is provided with a plurality of jet holes 31; Figure 2 As shown, at least one surface of the heat conducting member 2 located in the flow channel cavity 112 is arranged parallel to a jet surface portion 32 .

[0060] In a specific structure, multiple heat-conducting parts 2 are located in the fluid cavity, the jet component 3 is a separate component, and is planar. The jet component 3 is provided with multiple spaced jet surfaces 32 along the direction in which the heat-conducting parts 2 are spaced apart. The flow guide body is close to the surface of the jet component 3 and is arranged parallel to a jet surface 32.

[0061] In another specific structure, such as Figure 2 As shown, a protrusion is provided on the jet component 3, and the protrusion is located between the two heat-conducting members 2. A jet surface portion 32 is provided on the protrusion to be arranged parallel to any one of the two opposite surfaces of the two heat-conducting members 2.

[0062] In this embodiment, Figure 2 As shown, multiple heat-conducting members 2 are used, and at least one surface of the heat-conducting member 2 located in the flow channel cavity 112 is arranged parallel to a jet surface portion 32 , which has a simple structure and is easy to manufacture.

[0063] In one embodiment, Figure 2 and Figure 6 As shown, the plurality of heat conducting members 2 are arranged at intervals along the first direction, and the first direction is arranged parallel to the first surface 12 , that is, the plurality of heat conducting members 2 are arranged at intervals in a row along the first direction.

[0064] It should be noted that any two heat conducting members 2 can be arranged in parallel (meaning the surfaces of the two heat conducting members 2 that are close to each other are parallel) or in a cross-arrangement (meaning the surfaces of the two heat conducting members 2 that are close to each other are arranged at an angle that is less than 90°).

[0065] Preferably, the first direction is perpendicular to the flow direction of the heat dissipation medium in the liquid cavity.

[0066] In this embodiment, Figure 2 and Figure 6 As shown, a plurality of heat conducting members 2 are arranged at intervals along the first direction, and the first direction is arranged parallel to the first surface 12, which can reduce the flow resistance of the heat dissipation medium, reduce the driving force, and reduce energy consumption.

[0067] In one embodiment, Figure 7As shown, the jet component 3 is spaced apart from the plurality of heat-conducting parts 2. Specifically, the distance between the jet component 3 and the heat-conducting part 2 can be arranged according to the space of the liquid flow cavity; the distance between the jet component 3 and the heat-conducting part 2 can be any one of 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, and 6 mm or a range between any two values, preferably 4 mm.

[0068] like Figure 7 As shown, two jet surfaces 32 are arranged at intervals between at least one group of adjacent two heat-conducting members 2. In a specific structure, a protrusion is provided on the jet component 3, and the protrusion is in a cross shape. The protrusion is located between the two heat-conducting members 2, and two jet surfaces 32 are provided on the protrusion, which are respectively arranged parallel to the two opposite surfaces on the two heat-conducting members 2.

[0069] It should be noted that, two spaced jet surfaces 32 are provided between at least one group of adjacent two heat-conducting parts 2, which means that at least two spaced jet surfaces 32 are provided between at least one group of adjacent two heat-conducting parts 2, or two spaced jet surfaces 32 are provided between two groups of adjacent two heat-conducting parts 2; or more preferably, two spaced jet surfaces 32 are provided between any two adjacent heat-conducting parts 2.

[0070] In the specific use process, such as Figure 6 As shown, the heat dissipation medium introduced into the static pressure chamber 111 is ejected through the jet hole 31 on the jet surface portion 32 to form a high-pressure water column, which enters the flow channel chamber 112 and is ejected toward the opposite sides between two adjacent heat-conducting members 2 to perform heat exchange contact with the two sides of the heat-conducting members 2 along the first direction, and then is discharged from the liquid outlet 15.

[0071] In this embodiment, Figure 6 As shown, the jet assembly 3 is arranged at intervals with multiple heat-conducting parts 2, and two spaced jet surfaces 32 are provided between at least one group of adjacent two heat-conducting parts 2 to jet toward the two adjacent side surfaces of the two adjacent heat-conducting parts 2, which can increase the jet area and improve the heat exchange efficiency, and can avoid the problem of uneven heat dissipation of the cold plate due to the gradual increase in temperature from the liquid inlet 14 side to the liquid outlet 15 side.

[0072] In one embodiment, Figure 8As shown, the jet assembly 3 includes a plurality of jet plates 33, each of which is provided with a plurality of jet surfaces 32, and the plurality of jet plates 33 are spaced apart along a first direction, and the two ends of the jet plates 33 along the first direction are respectively connected to the side surfaces of the two heat-conducting members 2 by welding or bonding, wherein the side surface of the heat-conducting member 2 refers to the side surface of the heat-conducting member 2 that is perpendicular to the first surface 12; in any two adjacent jet plates 33, the two ends of the two jet plates 33 that are close to each other along the first direction are connected to the same heat-conducting member 2; wherein, two spaced-apart jet surfaces 32 are provided between any two adjacent heat-conducting members 2.

[0073] Specifically, such as Figure 8 As shown, the jet plate 33 is a plate having multiple bending surfaces, and the three bending surfaces form a convex portion, which is located between two adjacent heat-conducting parts 2. Among the three bending surfaces, two oppositely arranged bending surfaces are each provided with a jet surface portion 32, which is respectively arranged parallel to the two heat-conducting parts 2.

[0074] It should be noted that, between two heat-conducting parts 2 connected to the same jet plate 33, one heat-conducting part 2 or multiple heat-conducting parts 2 can be set, wherein two spaced jet surfaces 32 can be set between at least one group of adjacent two heat-conducting parts 2. Preferably, two spaced jet surfaces 32 are set between any two adjacent heat-conducting parts 2.

[0075] It should also be noted that the end of the jet plate 33 along the first direction can be connected to the side of the heat conductor 2 along the first direction, or the end of the jet plate 33 along the first direction can be connected to the surface or edge of the heat conductor 2 facing the static pressure chamber 111.

[0076] In this embodiment, Figure 8 As shown, the jet assembly 3 includes a plurality of jet plates 33, each of which is provided with a plurality of jet surfaces 32. The plurality of jet plates 33 are spaced apart along a first direction, and the two ends of the jet plate 33 along the first direction are respectively connected to the side surfaces of the two heat-conducting members 2. This can simplify the structure and make the jet plate 33 a universal part. By assembling it with different numbers of heat-conducting members 2, it can match cold plates of different sizes.

[0077] In one embodiment, Figure 2 and Figure 13 As shown, among the multiple heat conducting members 2 , the heat conducting members 2 located at both ends along the first direction form a part of the wall surface of the cold plate body 1 , that is, both walls of the cold plate body 1 along the first direction are heat conducting members 2 .

[0078] In this embodiment, Figure 2 and Figure 13As shown, the heat conducting members 2 at both ends along the first direction among the multiple heat conducting members 2 are arranged to form a part of the wall surface of the cold plate body 1. This can fully utilize the space of the cold plate to arrange more heat conducting members 2, thereby improving the heat dissipation performance of the cold plate.

[0079] In one embodiment, not shown in the figure, the heat conducting member 2 located at both ends along the first direction is provided with a first heat dissipating fin group on the outer surface of the cold plate body 1. Specifically, the first heat dissipating fin group includes a plurality of first heat dissipating fins. The plurality of first heat dissipating fins can be arranged according to the cooling airflow in the environment in which the cold plate is located to facilitate the passage of the cooling airflow, thereby improving the heat dissipation efficiency.

[0080] During specific use, the interior of the liquid cooling cavity 11 exchanges heat with the heat dissipation medium (including jet heat dissipation medium) flowing in the liquid cooling cavity 11 through the heat conducting member 2 combined with the portion of the liquid cooling cavity 11 corresponding to the first surface 12. The outer side of the heat conducting member 2, which serves as the wall surface of the cold plate body 1, exchanges heat with the cooling airflow through the first heat dissipation fin group to reduce the temperature.

[0081] In this embodiment, a first heat dissipation fin group is provided on the outer surface of the cold plate body 1 at the heat conducting member 2 located at both ends along the first direction to compensate for the defect of small contact area between the heat conducting member 2 serving as the wall of the cold plate body 1 and the heat dissipation medium inside the liquid cooling cavity 11, thereby improving the heat dissipation uniformity of various parts of the cold plate.

[0082] In one embodiment, Figure 9 and Figure 11 As shown, the heat conducting member 2 is a heat spreader, in which a first heat spreader cavity 21 is provided. The first heat spreader cavity 21 extends in a direction away from the first surface 12. Specifically, the heat spreader is a vacuum cavity with a microstructure on the inner wall.

[0083] In the specific use process, such as Figure 9 and Figure 11 As shown, when heat is conducted from the portion corresponding to the first surface 12 on the cold plate body 1 to the evaporation zone of the first heat soaking chamber 21 (i.e., the portion of the first heat soaking chamber 21 close to the first surface 12), the phase change medium in the first heat soaking chamber 21 begins to vaporize after being heated in a low vacuum environment. At this time, it absorbs heat energy and expands rapidly in volume. The gaseous phase change medium quickly fills the entire first heat soaking chamber 21. When the gaseous phase change medium contacts a relatively cold area, it condenses and releases the heat accumulated during evaporation through condensation. The condensed liquid phase change medium returns to the evaporation zone through the microstructured capillary channels. This process will be repeated in the first heat soaking chamber 21.

[0084] In this embodiment, Figure 9 and Figure 11As shown, the heat conducting member 2 is used as a heat spreader, and a first heat spreader cavity 21 is provided inside the heat conducting member 2. The first heat spreader cavity 21 extends in a direction away from the first surface 12, which can improve the heat conduction capacity of the heat conducting member 2 in a direction away from the first surface 12, thereby improving the heat exchange rate between the heat conducting member 2 and the heat dissipation medium in the liquid cooling cavity 11, thereby improving the heat dissipation efficiency of the cold plate.

[0085] In one embodiment, Figure 9 and Figure 11 As shown, a second heat-absorbing chamber 13 is provided at the portion of the cold plate body 1 that contacts the heat-generating component, that is, a second heat-absorbing chamber 13 is provided in the portion corresponding to the first surface 12 of the cold plate body 1; specifically, the second heat-absorbing chamber 13 is in the shape of a rectangular parallelepiped or a cylinder.

[0086] In the specific use process, such as Figure 9 and Figure 11 As shown, when heat is conducted from the heating element to the portion corresponding to the first surface 12 of the cold plate body 1, the phase change medium in the evaporation zone of the second heat-absorbing chamber 13 (i.e., the portion of the second heat-absorbing chamber 13 close to the first surface 12) begins to vaporize after being heated in a low vacuum environment. At this time, it absorbs heat energy and expands rapidly in volume. The gaseous phase change medium quickly fills the entire second heat-absorbing chamber 13. When the gaseous phase change medium contacts a relatively cold area, it condenses and releases the heat accumulated during evaporation through condensation. The condensed liquid phase change medium returns to the evaporation zone through the microstructured capillary channel. This process will be repeated in the second heat-absorbing chamber 13.

[0087] In this embodiment, Figure 9 and Figure 11 As shown, the portion of the cold plate body 1 that contacts the heat-generating component is provided with a second heat-absorbing chamber 13, which can increase the heat transfer rate between the heat-generating element and the corresponding portion of the first surface 12 on the cold plate body 1, thereby increasing the heat exchange rate per unit time between the heat-conducting member 2 and the heat dissipation medium in the liquid cooling chamber 11, thereby improving the heat dissipation efficiency of the cold plate.

[0088] In one embodiment, Figure 9 and Figure 12 As shown, the first heat-absorbing chamber 21 is connected to the second heat-absorbing chamber 13. In a specific structure, the heat-conducting member 2 and the portion corresponding to the first surface 12 of the cold plate body 1 are manufactured through an integrated molding process.

[0089] Specifically, the first heat equalizing chamber 21 and the second heat equalizing chamber 13 are connected through a plurality of air holes (that is, the portion where the first heat equalizing chamber 21 and the second heat equalizing chamber 13 are connected is provided with at least one air hole). Alternatively, the portion of the first heat equalizing chamber 21 close to the first surface 12 is open, and the portion of the second heat equalizing chamber 13 away from the first surface 12 and connected to the first heat equalizing chamber 21 is open (that is, the first heat equalizing chamber 21 and the second heat equalizing chamber 13 are directly connected through a large opening).

[0090] In the specific use process, such as Figure 9 and Figure 12 As shown, when heat is conducted from the heating element to the portion corresponding to the first surface 12 on the cold plate body 1, the phase change medium in the evaporation zone of the second heat-absorbing chamber 13 (i.e., the portion of the second heat-absorbing chamber 13 close to the first surface 12) begins to vaporize after being heated in a low vacuum environment. At this time, it absorbs heat energy and expands rapidly in volume. The gaseous phase change medium quickly fills the entire second heat-absorbing chamber 13 and is immediately transferred to the first heat-absorbing chamber 21. When the gaseous phase change medium contacts a relatively cold area in the first heat-absorbing chamber 21, condensation occurs and the heat accumulated during evaporation is released through condensation. The condensed liquid phase change medium returns to the evaporation zone of the second heat-absorbing chamber 13 through the microstructured capillary channel. This process is repeated between the first heat-absorbing chamber 21 and the second heat-absorbing chamber 13.

[0091] In this embodiment, Figure 9 and Figure 12 As shown, the first heat-absorbing chamber 21 is directly connected to the second heat-absorbing chamber 13, so that the phase change medium in the second heat-absorbing chamber 13 can be directly transferred to the first heat-absorbing chamber 21 after vaporization, so as to enhance the heat transfer speed between the heating element and the heat-conducting part 2, and enhance the heat exchange speed between the heat-conducting part 2 and the heat dissipation medium in the liquid cooling chamber 11, thereby improving the cooling effect of the cold plate on the heating element.

[0092] In one embodiment, not shown in the figure, the cold plate body 1 is provided with a plurality of liquid inlets 14 connected to the static pressure chamber 111, and the plurality of liquid inlets 14 are evenly distributed on the positions corresponding to the static pressure chamber 111 on the cold plate body 1, that is, the static pressure chamber 111 transports heat dissipation medium into the static pressure chamber 111 through the liquid inlets 14 at multiple positions; the cold plate body 1 is provided with a plurality of liquid outlets 15 connected to the flow channel chamber 112, and the plurality of liquid outlets 15 are evenly distributed on the positions corresponding to the flow channel chamber 112 on the cold plate body 1, that is, the flow channel chamber 112 transports heat dissipation medium to the outside through the liquid outlets 15 at multiple positions.

[0093] Specifically, the number of liquid inlets 14 is 2 to 6, and can be any value among 3, 4 and 5, or a range between any two values; the number of liquid outlets 15 is 2 to 6, and can be any value among 3, 4 and 5, or a range between any two values.

[0094] During specific use, multiple liquid inlets 14 are connected to the output port of the heat dissipation medium generating device, and multiple liquid outlets 15 are connected to the input port of the heat dissipation medium generating device. The heat dissipation medium enters the static pressure chamber 111 from the liquid inlets 14 at multiple different positions, which can improve the pressure uniformity at various locations in the static pressure chamber 111. The heat dissipation medium flows out of the flow channel chamber 112 from the liquid outlets 15 at multiple different positions, which can improve the pressure uniformity at various locations in the flow channel chamber 112, thereby ensuring that the jet flow rate at various locations of the jet assembly 3 is the same, that is, ensuring the uniformity of heat dissipation of each heat conductor 2.

[0095] In this embodiment, a plurality of liquid inlets 14 communicating with the static pressure chamber 111 are provided on the cold plate body 1, and the plurality of liquid inlets 14 are evenly distributed on the portions of the cold plate body 1 corresponding to the static pressure chamber 111; a plurality of liquid outlets 15 communicating with the flow channel chamber 112 are provided on the cold plate body 1, and the plurality of liquid outlets 15 are evenly distributed on the portions of the cold plate body 1 corresponding to the flow channel chamber 112, which can improve the pressure uniformity of the heat dissipation medium at various locations in the static pressure chamber 111 and the pressure uniformity of the heat dissipation medium at various locations in the flow channel chamber 112, thereby ensuring the same jet flow rate at various locations of the jet assembly 3, that is, ensuring the uniformity of heat dissipation of each heat-conducting member 2, thereby ensuring the uniformity of heat dissipation and temperature of the cold plate.

[0096] In one embodiment, Figure 5 and Figure 10 As shown, fins 22 are provided on at least part of the outer surface of the heat conductor 2. Specifically, the fins 22 are in any one of cylindrical, elliptical and diamond-shaped shapes, or other shapes as long as they can increase the contact area with the heat dissipation medium.

[0097] In this embodiment, by providing fins 22 on the surface of the heat conducting member 2 , the convection area with the heat dissipation medium can be increased, the heat exchange rate can be increased, and the heat dissipation efficiency of the cold plate can be improved.

[0098] In one embodiment, Figure 5 and Figure 10 As shown, fins 22 are provided on at least part of the surface of the heat conductor 2 facing the jet surface 32. In a specific structure, fins 22 are provided on all parts of the heat conductor 2 facing the jet surface 32. In this embodiment, the provision of the fins 22 can enhance the heat exchange efficiency between the heat conductor 2 and the jet.

[0099] In one embodiment, the distance between the surface of the heat conductor 2 facing the jet surface 32 and the jet surface 32 is 2 to 6 times the diameter of the jet hole 31 on the jet surface 32. Specifically, the distance between the surface of the heat conductor 2 facing the jet surface 32 and the jet surface 32 can be any one of 2 times, 2.5 times, 3 times, 3.5 times, 4 times, 4.5 times, 5 times, 5.5 times and 6 times the diameter of the jet hole 31 on the jet surface 32, or a range between any two values; preferably, the distance between the surface of the heat conductor 2 facing the jet surface 32 and the jet surface 32 is 3.5 to 4.5 times the diameter of the jet hole 31 on the jet surface 32. More preferably, the distance between the surface of the heat conductor 2 facing the jet surface 32 and the jet surface 32 is 4 times the diameter of the jet hole 31 on the jet surface 32.

[0100] Specifically, the diameter of the jet hole 31 is generally 1 mm, and the distance between the jet surface portion 32 and the heat conducting member 2 is 2 mm to 6 mm. Preferably, the distance between the jet surface portion 32 and the heat conducting member 2 is 4 mm.

[0101] In this embodiment, the distance between the surface of the heat conductor 2 facing the jet surface 32 and the jet surface 32 is 2 to 5 times the diameter of the jet hole 31 on the jet surface 32. Within this range, the heat exchange rate between the heat dissipation medium and the heat conductor 2 through the jet is high.

[0102] In one embodiment, Figure 13 As shown, the cold plate body 1 includes a base plate 16, a side wall shell 17 and a top cover 18. Specifically, the base plate 16, the side wall shell 17 and the top plate are made of copper, aluminum and any other heat-conducting materials; the side wall shell 17 is open on both sides perpendicular to the first surface 12, and the base plate 16 and the top cover 18 are respectively sealed by welding or bonding. The heat-conducting member 2 is connected to the base plate 16 by welding, and the first surface 12 is located on the base plate 16, that is, the base plate 16, the side wall shell 17 and the top cover 18 form a liquid cooling chamber 11.

[0103] Specifically, such as Figure 13 As shown, the side wall shell 17 includes two heat-conducting members 2 and two wall plates 171 , and the two wall plates 171 are connected through the two heat-conducting members 2 .

[0104] In this embodiment, Figure 13 As shown, the cold plate body 1 includes a base plate 16, a side wall shell 17 and a top cover 18. The side wall shell 17 is open on both sides perpendicular to the first surface 12. The base plate 16 and the top cover 18 respectively cover the two openings. The heat conducting member 2 is connected and arranged on the base plate 16. The structure is simple and easy to manufacture.

[0105] In one embodiment, not shown in the figure, the top cover 18 is spaced apart from the end of the heat conductor 2 away from the first surface 12, which can increase the contact area between the end of the heat conductor 2 away from the first surface 12 and the heat dissipation medium, thereby improving the heat dissipation efficiency.

[0106] In one embodiment, Figure 11 As shown, the top cover 18 is arranged in contact with the end of the heat conductor 2 away from the first surface 12. Not shown in the figure, the surface of the top cover 18 located outside the liquid cooling chamber 11 is provided with a second heat dissipation fin group. Specifically, the second heat dissipation fin group includes a plurality of second heat dissipation fins. The plurality of second heat dissipation fins can be arranged according to the cooling airflow in the environment in which the cold plate is located to facilitate the passage of the cooling airflow, thereby improving the heat dissipation efficiency.

[0107] In this embodiment, a second heat dissipation fin group is provided on the portion of the top cover 18 outside the liquid cooling chamber 11 , which can enhance the heat dissipation effect on the end of the heat conducting member 2 away from the first surface 12 .

[0108] In one embodiment, a cold plate is provided, such as Figures 1 to 6 As shown, it includes a cold plate body 1 and at least one heat conducting member 2, and the specific solution is as follows.

[0109] like Figure 2 As shown, the cold plate body 1 is a metal cavity, such as a copper cavity or an aluminum cavity, or a composite cavity, specifically, a silicon carbide particle reinforced aluminum-based composite cavity; a liquid cooling cavity 11 is provided in the cold plate body 1; a first surface 12 is provided on the cold plate body 1, and the first surface 12 is at least partially used to contact the heating element; specifically, the cold plate body 1 is connected and fixed to the electronic device (such as a server motherboard, etc.) through multiple connecting parts (such as locking screws, etc.).

[0110] like Figure 2 As shown, specifically, the heat conducting member 2 can be a heat conducting metal block, such as a copper block, an aluminum block, etc., and the specific shape of the heat conducting member 2 can be any shape such as a cuboid, a cylinder, a triangular pyramid, etc.; the heat conducting member 2 is arranged in the liquid cooling cavity 11, and the heat conducting member 2 is connected to the portion corresponding to the first surface 12 in the liquid cooling cavity 11 by welding or integral molding, and extends in a direction away from the first surface 12.

[0111] More specifically, Figure 2 and Figure 3 As shown, the cold plate further includes at least one jet component 3, which is arranged in the liquid cooling cavity 11 by welding or bonding. Figure 3 As shown, the jet assembly 3 is provided with a plurality of jet holes 31 , and the jet holes 31 face toward the heat conducting element 2 .

[0112] Specifically, the jet component 3 may be a metal plate or a plastic plate with holes. In a specific solution, the jet component 3 may be arranged at a liquid inlet 14 of the liquid cooling chamber 11 .

[0113] The diameter of the jet hole 31 is 0.5 mm to 2.5 mm, and can be any one of 0.5 mm, 1 mm, 1.5 mm, 2 mm and 2.5 mm or a range between any two values, and is preferably 1 mm.

[0114] More specifically, Figure 2 As shown, the jet assembly 3 separates the liquid cooling chamber 11 into a static pressure chamber 111 and a flow channel chamber 112, and the heat conducting member 2 is at least partially located in the flow channel chamber 112; Figure 2 As shown, the cold plate body 1 is provided with at least one liquid inlet 14 and at least one liquid outlet 15 , the static pressure cavity 111 is communicated with the liquid inlet 14 of the heat dissipation medium, and the flow channel cavity 112 is communicated with the liquid outlet 15 of the heat dissipation medium.

[0115] The specific structure is: Figure 2 As shown, the jet assembly 3 extends in a direction away from the first surface 12 to separate the liquid cooling chamber 11 into a static pressure chamber 111 and a flow channel chamber 112; the side-by-side direction of the static pressure chamber 111 and the flow channel chamber 112 is parallel to the first surface 12; the heat conducting member 2 can be completely located in the flow channel chamber 112, of course, it can also be partially located in the flow channel chamber 112 and partially located in the static pressure chamber 111.

[0116] More specifically, Figure 2 As shown, there are multiple heat-conducting members 2, specifically, the number of heat-conducting members 2 is 1 to 8, and the number of heat-conducting members 2 is preferably any value among 2, 3, 4, 5, 6 and 7 or a range between any two values, and more preferably 4 or 5; the shape of the heat-conducting member 2 is a rectangular parallelepiped; the multiple heat-conducting members 2 are arranged at intervals, specifically, the distance between the heat-conducting members 2 is 10 mm to 30 mm, and can be any value among 12 mm, 14 mm, 16 mm, 18 mm, 20 mm, 22 mm and 24 mm or a range between any two values.

[0117] like Figure 3 and Figure 4 As shown, the jet assembly 3 has a plurality of jet surfaces 32, such as Figure 4 As shown, each jet surface 32 is provided with a plurality of jet holes 31; Figure 2 As shown, at least one surface of the heat conducting member 2 located in the flow channel cavity 112 is arranged parallel to a jet surface portion 32 .

[0118] In specific structures, such as Figure 2As shown, a protrusion is provided on the jet component 3, and the protrusion is located between the two heat-conducting members 2. A jet surface portion 32 is provided on the protrusion to be arranged parallel to any one of the two opposite surfaces of the two heat-conducting members 2.

[0119] More specifically, Figure 2 and Figure 6 As shown, the plurality of heat conducting members 2 are arranged at intervals along the first direction, and the first direction is arranged parallel to the first surface 12 , that is, the plurality of heat conducting members 2 are arranged at intervals in a row along the first direction.

[0120] It should be noted that any two heat conducting members 2 can be arranged in parallel (meaning the surfaces of the two heat conducting members 2 that are close to each other are parallel) or in a cross-arrangement (meaning the surfaces of the two heat conducting members 2 that are close to each other are arranged at an angle that is less than 90°).

[0121] Preferably, the first direction is perpendicular to the flow direction of the heat dissipation medium in the liquid cavity.

[0122] More specifically, Figure 2 and Figure 13 As shown, among the multiple heat conducting members 2 , the heat conducting members 2 located at both ends along the first direction form a part of the wall surface of the cold plate body 1 , that is, both walls of the cold plate body 1 along the first direction are heat conducting members 2 .

[0123] More specifically, Figure 9 and Figure 11 As shown, the heat conducting member 2 is a heat spreader, in which a first heat spreader cavity 21 is provided. The first heat spreader cavity 21 extends in a direction away from the first surface 12. Specifically, the heat spreader is a vacuum cavity with a microstructure on the inner wall.

[0124] More specifically, Figure 9 and Figure 11 As shown, a second heat-absorbing chamber 13 is provided at the portion of the cold plate body 1 that contacts the heat-generating component, that is, a second heat-absorbing chamber 13 is provided in the portion corresponding to the first surface 12 of the cold plate body 1; specifically, the second heat-absorbing chamber 13 is in the shape of a rectangular parallelepiped or a cylinder.

[0125] More specifically, Figure 9 and Figure 12 As shown, the first heat-absorbing chamber 21 is connected to the second heat-absorbing chamber 13. In a specific structure, the heat-conducting member 2 and the portion corresponding to the first surface 12 of the cold plate body 1 are manufactured through an integrated molding process.

[0126] Specifically, the first heat equalizing chamber 21 and the second heat equalizing chamber 13 are connected through a plurality of air holes (that is, the portion where the first heat equalizing chamber 21 and the second heat equalizing chamber 13 are connected is provided with at least one air hole). Alternatively, the portion of the first heat equalizing chamber 21 close to the first surface 12 is open, and the portion of the second heat equalizing chamber 13 away from the first surface 12 and connected to the first heat equalizing chamber 21 is open (that is, the first heat equalizing chamber 21 and the second heat equalizing chamber 13 are directly connected through a large opening).

[0127] More specifically, Figure 5 and Figure 10 As shown, fins 22 are provided on at least part of the outer surface of the heat conductor 2. Specifically, the fins 22 are in any one of cylindrical, elliptical and diamond-shaped shapes, or other shapes as long as they can increase the contact area with the heat dissipation medium.

[0128] More specifically, Figure 5 and Figure 10 As shown, fins 22 are provided on at least part of the surface of the heat conductor 2 facing the jet surface 32. In a specific structure, fins 22 are provided on all parts of the heat conductor 2 facing the jet surface 32. In this embodiment, the provision of the fins 22 can enhance the heat exchange efficiency between the heat conductor 2 and the jet.

[0129] More specifically, the distance between the surface of the heat conductor 2 facing the jet surface 32 and the jet surface 32 is 2 to 6 times the diameter of the jet hole 31 on the jet surface 32. Specifically, the distance between the surface of the heat conductor 2 facing the jet surface 32 and the jet surface 32 can be any one of 2 times, 2.5 times, 3 times, 3.5 times, 4 times, 4.5 times, 5 times, 5.5 times and 6 times the diameter of the jet hole 31 on the jet surface 32, or a range between any two values; preferably, the distance between the surface of the heat conductor 2 facing the jet surface 32 and the jet surface 32 is 3.5 to 4.5 times the diameter of the jet hole 31 on the jet surface 32. Even more preferably, the distance between the surface of the heat conductor 2 facing the jet surface 32 and the jet surface 32 is 4 times the diameter of the jet hole 31 on the jet surface 32.

[0130] Specifically, the diameter of the jet hole 31 is generally 1 mm, and the distance between the jet surface portion 32 and the heat conducting member 2 is 2 mm to 6 mm. Preferably, the distance between the jet surface portion 32 and the heat conducting member 2 is 4 mm.

[0131] More specifically, Figure 13As shown, the cold plate body 1 includes a base plate 16, a side wall shell 17 and a top cover 18. Specifically, the base plate 16, the side wall shell 17 and the top plate are made of copper, aluminum and any other heat-conducting materials; the side wall shell 17 is open on both sides perpendicular to the first surface 12, and the base plate 16 and the top cover 18 are respectively sealed by welding or bonding. The heat-conducting member 2 is connected to the base plate 16 by welding, and the first surface 12 is located on the base plate 16, that is, the base plate 16, the side wall shell 17 and the top cover 18 form a liquid cooling chamber 11.

[0132] Specifically, such as Figure 13 As shown, the side wall shell 17 includes two heat-conducting members 2 and two wall plates 171 , and the two wall plates 171 are connected through the two heat-conducting members 2 .

[0133] More specifically, Figure 11 As shown, the top cover 18 is arranged in contact with the end of the heat conducting member 2 away from the first surface 12 .

[0134] In the above solution, there are four heat conductors 2 , the diameter of the jet hole 31 is 1 mm, and the distance between the surface of the heat conductor 2 facing the jet surface 32 and the jet surface 32 is four times the diameter of the jet hole 31 on the jet surface 32 .

[0135] The above scheme is simulated with the following variables: the distance between the surface of the heat conductor 2 facing the jet surface 32 and the jet surface 32 is 2 times, 3 times, 4 times, 5 times and 6 times the diameter of the jet hole 31 on the jet surface 32.

[0136] Specifically, the temperature of the heat dissipation medium (water) at the liquid inlet 14 is 35°C, the heating element is a chip, the power consumption is 500W, the flow rate of the heat dissipation medium is 1LPM, the diameter of the jet hole 31 is 1mm, and the simulation software adopts flotherm (a set of electronic system heat dissipation simulation software). The results are shown in Table 1.

[0137] Table 1

[0138]

[0139] Table 1 shows that the chip temperature is lowest when the distance between the surface of the heat conductor 2 facing the jet surface 32 and the jet surface 32 is four times the diameter of the jet hole 31 on the jet surface 32. That is, the heat dissipation efficiency of the cold plate is optimal when the distance between the surface of the heat conductor 2 facing the jet surface 32 and the jet surface 32 is four times the diameter of the jet hole 31 on the jet surface 32.

[0140] The above solution was simulated again, with the comparison example being: a standard heat pipe radiator, specifically Cu base (copper base) + 5 heatpipes (5 heat pipes) + Al Fin (aluminum fins). The number of aluminum fins is 51, the thickness is 0.3mm, and the fin spacing is 1.56mm.

[0141] Specifically, the temperature of the heat dissipation medium (water) at the liquid inlet 14 is 35°C, the heating element is a chip, the power consumption is 500W, the flow rate of the heat dissipation medium is 1LPM, and the simulation software uses flotherm. The results are shown in Table 2.

[0142] Table 2

[0143]

[0144] As can be seen from Table 2, the temperature of the chip cooled by the cold plate in the present application is 4.7°C lower than that of the chip cooled by the standard heat pipe radiator, which reflects the technical effect of the high heat dissipation efficiency of the cold plate in the present application.

[0145] In summary, the present application proposes a cold plate that breaks through the height limitation of conventional cold plates, greatly increases the heat transfer coefficient while increasing the heat dissipation area, and improves the heat dissipation capacity by more than 30% compared with the traditional skived tooth cold plate; at the same time, it solves the problem of uneven temperature distribution upstream and downstream on the surface of the traditional skived tooth cold plate, optimizes the temperature distribution on the contact surface between the cold plate and the chip, and optimizes the temperature uniformity; and the jet impact will wash away the deposits between the skived teeth, effectively solving the problem of blockage in the cold plate flow channel.

[0146] According to an embodiment of the present application, in a second aspect, a cooling system is provided, comprising at least one cold plate according to the first aspect.

[0147] Specifically, the cold plate is a plate body into which a heat dissipation medium flows. The heat dissipation medium may be a liquid medium or a low-temperature gas medium.

[0148] In this embodiment, since the cooling system includes a cold plate, it has the same technical effect as the cold plate and is not described in detail here.

[0149] According to an embodiment of the present application, in a third aspect, an electronic device is provided, comprising at least one cold plate in the first aspect, or the cooling system in the second aspect.

[0150] Specifically, the electronic device is a device with data processing capabilities such as a server.

[0151] In this embodiment, since the electronic device includes a cold plate, it has the same technical effect as the cold plate and is not described in detail here.

[0152] Although the embodiments of the present application have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations shall fall within the scope defined by the appended claims.

Claims

1. A cold plate, characterized in that: include: A cold plate body (1), wherein a liquid cooling cavity (11) is provided in the cold plate body (1); a first surface (12) is provided on the cold plate body (1), wherein at least a portion of the first surface (12) is used for contacting a heating element; A plurality of heat conducting members (2) are arranged in the liquid cooling cavity (11), the heat conducting members (2) being connected to portions corresponding to the first surface (12) in the liquid cooling cavity (11) and extending in a direction away from the first surface (12); At least one jet component (3), the jet component (3) is arranged in the liquid cooling chamber (11), the jet component (3) has a plurality of jet surfaces (32), the jet component (3) is spaced apart from the plurality of the heat-conducting members (2), and two spaced-apart jet surfaces (32) are arranged between at least one group of two adjacent heat-conducting members (2); each of the jet surfaces (32) is provided with a plurality of jet holes (31); the jet holes (31) face the heat-conducting members (2) and spray toward two adjacent side surfaces of two adjacent heat-conducting members (2).

2. The cold plate according to claim 1, wherein The jet assembly (3) separates the liquid cooling cavity (11) into a static pressure cavity (111) and a flow channel cavity (112), and the heat conducting element (2) is at least partially located in the flow channel cavity (112).

3. The cold plate according to claim 2, characterized in that The plurality of heat-conducting members (2) are arranged at intervals, wherein at least one surface of the heat-conducting member (2) located in the flow channel cavity (112) is arranged parallel to one of the jet surface portions (32).

4. The cold plate according to claim 3, characterized in that The plurality of heat conducting members (2) are arranged at intervals along a first direction, and the first direction is arranged parallel to the first surface (12).

5. The cold plate according to claim 4, characterized in that The jet assembly (3) includes a plurality of jet plates (33), each of the jet plates (33) is provided with a plurality of jet surfaces (32), the plurality of jet plates (33) are spaced apart along the first direction, the two ends of the jet plates (33) along the first direction are respectively connected to the side surfaces of the two heat conducting members (2), and of any two adjacent jet plates (33), the two ends of the two jet plates (33) that are close to each other along the first direction are connected to the same heat conducting member (2); Wherein, two jet surface portions (32) are arranged at intervals between any two adjacent heat-conducting members (2).

6. The cold plate according to claim 4, characterized in that Among the plurality of heat-conducting members (2), the heat-conducting members (2) located at both ends along the first direction form a part of the wall surface of the cold plate body (1).

7. The cold plate according to claim 6, characterized in that The heat conducting members (2) located at both ends along the first direction are provided with first heat dissipating fin groups at locations on the outer surface of the cold plate body (1).

8. The cold plate according to any one of claims 1 to 7, characterized in that: The heat conducting member (2) is a heat soaking plate, a first heat soaking cavity (21) is provided in the heat soaking plate, and the first heat soaking cavity (21) extends in a direction away from the first surface (12).

9. The cold plate according to claim 8, characterized in that A second heat-saturating cavity (13) is provided at a portion of the cold plate body (1) that is in contact with a heat-generating component.

10. The cold plate according to claim 9, characterized in that The first heat-averaging chamber (21) is in communication with the second heat-averaging chamber (13).

11. The cold plate according to any one of claims 2 to 7, characterized in that: The cold plate body (1) is provided with a plurality of liquid inlets (14) in communication with the static pressure cavity (111), and the plurality of liquid inlets (14) are evenly distributed on portions of the cold plate body (1) corresponding to the static pressure cavity (111); And / or, the cold plate body (1) is provided with a plurality of liquid outlets (15) in communication with the flow channel cavity (112), and the plurality of liquid outlets (15) are evenly distributed on positions corresponding to the flow channel cavity (112) on the cold plate body (1).

12. The cold plate according to any one of claims 3 to 7, characterized in that: Fins (22) are provided on at least part of the outer surface of the heat conducting member (2).

13. The cold plate according to claim 12, wherein The fins (22) are provided on at least a portion of the surface of the heat conducting member (2) facing the jet surface portion (32); And / or, the fin (22) is in any one of a cylindrical shape, an elliptical cylindrical shape and a diamond cylindrical shape.

14. The cold plate according to any one of claims 3 to 7, characterized in that: The distance between the surface of the heat conducting member (2) facing the jet surface (32) and the jet surface (32) is 2 to 5 times the diameter of the jet hole (31) on the jet surface (32).

15. The cold plate according to claim 14, wherein The distance between the surface of the heat conducting member (2) facing the jet surface (32) and the jet surface (32) is 3.5 to 4.5 times the diameter of the jet hole (31) on the jet surface (32).

16. The cold plate according to any one of claims 1 to 7, characterized in that: The cold plate body (1) comprises a base plate (16), a side wall shell (17) and a top cover (18); the side wall shell (17) is open along both sides perpendicular to the first surface (12); the base plate (16) and the top cover (18) respectively cover the two openings; the heat conducting element (2) is connected and arranged on the base plate (16); and the first surface (12) is located on the base plate (16).

17. The cold plate according to claim 16, wherein The top cover (18) is spaced apart from the end of the heat conducting member (2) away from the first surface (12); Alternatively, the top cover (18) is arranged in contact with the end of the heat conducting member (2) away from the first surface (12), and a second heat dissipation fin group is provided on the surface of the top cover (18) located outside the liquid cooling cavity (11).

18. A cooling system, characterized in that: include: At least one cold plate according to any one of claims 1 to 17.

19. An electronic device, characterized in that: include: At least one cold plate according to any one of claims 1 to 17, or a cooling system according to claim 18.

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