Photosensitive composition, cured product, display device, and method for producing cured product

Abstract

The purpose of the present invention is to provide a cured product which can achieve both excellent sensitivity during exposure and suppression of residues after development, and which has excellent mechanical properties. The purpose of the present invention is also to provide a cured product provided in a display device having excellent reliability of a light-emitting element. The present invention is a photosensitive composition containing (A) a binder resin and (C) a photosensitizer, the photosensitive composition further containing (H) an imide compound having at least two (I) structures in which a structure containing an imide bond and a cyclic structure having a phenolic hydroxyl group and / or a fluorine-containing substituent are bonded, and the compound also has a structure (II) which is a structure for connecting at least two structures (I).

Description

Technical Field

[0001] The present invention relates to a photosensitive composition, a cured product, a display device, and a method for producing a cured product. Background Art

[0002] In recent years, efforts have been made to reduce costs and increase integration due to the high efficiency of semiconductor manufacturing processes, and semiconductor devices with multilayer metal rewiring have attracted attention. For the materials used for the interlayer insulating layer in such multilayer metal rewiring, high mechanical properties for withstanding the stress generated by multilayer formation are required. In addition, for reducing the process time, high sensitivity during exposure is required, and it is also necessary to simultaneously achieve suppression of development residues when forming positive or negative patterns by photolithography.

[0003] In addition, in an organic electroluminescence (hereinafter referred to as "organic EL") display, a pixel division layer and a thin film transistor (hereinafter referred to as "TFT") planarization layer are formed in a position adjacent to or close to a light-emitting element. Therefore, outgassing from these layers and the like can reduce the lifespan of the light-emitting element. Therefore, in order to achieve high durability of the organic EL display, it is necessary to improve the reliability of the light-emitting element through the physical properties such as the constitution of the pixel division layer and the heat resistance of the materials used.

[0004] As the photosensitive composition, for example, a positive photosensitive composition containing polyimide as a resin can be cited (for example, see Patent Document 1). In addition, as a material with improved mechanical properties, for example, a composition obtained by introducing a soft polyoxyalkylene structure into the main chain of polyimide can be cited (for example, see Patent Document 2).

[0005] Prior Art Documents

[0006] Patent Documents

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2002-091343

[0008] Patent Document 2: Japanese Patent Application Laid-Open No. 2012-208360 Summary of the Invention

[0009] Problems to be Solved by the Invention

[0010] However, the compositions described in Patent Document 1 or Patent Document 2 have problems in simultaneously achieving sensitivity during exposure, suppression of residues after development, mechanical properties, and reliability of light-emitting elements. Therefore, further improvement in characteristics is desired for the photosensitive composition. An object of the present invention is to provide a cured product that simultaneously achieves excellent sensitivity during exposure and suppression of residues after development, has excellent mechanical properties, and can be used in a display device with excellent reliability of a light-emitting element. Another object of the present invention is to provide a display device with excellent reliability of a light-emitting element.

[0011] Means for Solving the Problems

[0012] In order to solve the above problems, the photosensitive composition and the display device of the present invention have the following configurations [1] to

[20] .

[0013] [1] A photosensitive composition containing (A) a binder resin and (C) a photosensitizer, wherein the photosensitive composition further contains (H) an imide compound.

[0014] The (H) imide compound has at least two (I) structures: a structure in which a structure containing an imide bond is bonded to a cyclic structure having a phenolic hydroxyl group and / or a fluorine-substituted group, and also has (II) a structure that connects at least two of the (I) structures.

[0015] [2] The photosensitive composition according to [1] above, wherein the structure containing an imide bond in the (I) structure is an aromatic structure containing an imide bond, a condensed polycyclic structure containing an imide bond, an alicyclic structure containing an imide bond, an aliphatic structure containing an imide structure, a succinimide structure, a maleimide structure, or a nadic imide structure.

[0016] The cyclic structure in the (I) structure is an aromatic structure or a condensed polycyclic structure.

[0017] The (II) structure is an alkylene group, a sulfonyl group, a condensed polycyclic structure, a hydrocarbon group containing an ether bond, a direct connection bond, an ether bond, a thioether bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a haloalkylene group, a subcycloalkyl group, an arylene group, a condensed polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group.

[0018] [3]The photosensitive composition as described in [1] or [2] above, wherein the aforementioned (A) binder resin contains at least one selected from the group consisting of (A1x-1) resin: polyimide, (A1x-2) resin: polyimide precursor, (A1x-3) resin: polybenzoxazole, (A1x-4) resin: polybenzoxazole precursor, (A1x-5) resin: polyamideimide, (A1x-6) resin: polyamideimide precursor, (A1x-7) resin: polyamide, and copolymers thereof (hereinafter referred to as "polyimide-based resins having weakly acidic groups").

[0019] The polyimide-based resin having weakly acidic groups has (DA1) a first amine residue: an amine residue having a phenolic hydroxyl group, and the (DA1) first amine residue has at least two (Ia) structures: a cyclic structure having a phenolic hydroxyl group, and also has (IIa) a structure: a structure connecting at least two of the (Ia) structures.

[0020] The (IIa) structure is an alkylene group, a sulfonyl group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, an ether bond, a thioether bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a sub-cycloalkyl group, an arylene group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group.

[0021] The aforementioned (H) imide compound contains (H2) a compound: a compound in which the cyclic structure in the aforementioned (I) structure is an aromatic structure having a phenolic hydroxyl group.

[0022] [4]The photosensitive composition as described in any one of [1] to [3] above, wherein the aforementioned (A) binder resin satisfies the following condition (P1a).

[0023] (P1a) The content of fluorine element in the structure of the (A) binder resin is 10,000 mass ppm or less.

[0024] [5]The photosensitive composition as described in any one of [1] to [4] above, wherein the aforementioned (II) structure is an alkylene group, a sulfonyl group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, an ether bond, a thioether bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a sub-cycloalkyl group, an arylene group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group.

[0025] [6] The photosensitive composition according to any one of [1] to [5] above, wherein the imide compound (H) contains the compound (H2z): the cyclic structure in the structure (I) is an aromatic structure having a phenolic hydroxyl group, and the structure (II) is an alkylene group, a sulfonyl group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, an ether bond, a thioether bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a subcycloalkyl group, a subaryl group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group.

[0026] [7] The photosensitive composition according to any one of [1] to [6] above, which satisfies the condition of the following (1a).

[0027] (1a) The content of fluorine element in all solid components of the photosensitive composition is 1,000 mass ppm or less.

[0028] [8] The photosensitive composition according to any one of [1] to [7] above, wherein the imide compound (H) contains the compound (H1): the cyclic structure in the structure (I) is a cyclic structure having a fluorine-containing substituent.

[0029] [9] The photosensitive composition according to any one of [1] to [8] above, wherein the imide compound (H) contains the compound (H1x): the cyclic structure in the structure (I) is a cyclic structure having a fluorine-containing substituent, and the structure (II) is an ether bond.

[0030]

[10] The photosensitive composition according to any one of [1] to [9] above, wherein the binder resin (A) contains a resin (A1) having a weakly acidic group, and the resin (A1) having a weakly acidic group has a weakly acidic group (WA): one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, 1,1-bis(trifluoromethyl)hydroxymethyl, and a mercapto group.

[0031] The resin (A1) having a weakly acidic group contains a resin (A1x): a resin having one or more selected from the group consisting of an imide structure, an amide structure, an oxazole structure, and a siloxane structure in the structural unit of the resin.

[0032] The resin (A1x) contains one or more selected from the group consisting of a resin (A1x-1): polyimide, a resin (A1x-2): polyimide precursor, a resin (A1x-3): polybenzoxazole, a resin (A1x-4): polybenzoxazole precursor, a resin (A1x-5): polyamideimide, a resin (A1x-6): polyamideimide precursor, a resin (A1x-7): polyamide, and copolymers thereof.

[0033] The (A1x) resin contains an amine residue having the aforementioned (WA) weakly acidic group and / or a carboxylic acid residue having the aforementioned (WA) weakly acidic group.

[0034]

[11] The photosensitive composition according to the aforementioned

[10] , wherein the aforementioned (A1x) resin contains a fluorinated amine residue and / or a fluorinated carboxylic acid residue, the fluorinated amine residue and the fluorinated carboxylic acid residue each have at least two fluorinated aromatic structures, and have a group connecting the at least two fluorinated aromatic structures,

[0035] The group connecting the at least two fluorinated aromatic structures has an ether bond.

[0036]

[12] The photosensitive composition according to any one of the aforementioned [1] to

[11] , wherein the aforementioned (A) binder resin contains (A1) a resin containing a weakly acidic group, and the (A1) resin containing a weakly acidic group has a (WA) weakly acidic group: one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, 1,1-bis(trifluoromethyl)hydroxymethyl, and a mercapto group,

[0037] The (A) binder resin contains the (A1) resin containing a weakly acidic group and (A2) a resin not having a weakly acidic group, and the (A1) resin containing a weakly acidic group includes (A1x) a resin having at least one resin selected from the group consisting of an imide structure, an amide structure, an oxazole structure, and a siloxane structure in the structural unit of the resin, and / or (A1y) a resin having a phenolic hydroxyl group in the structural unit of the resin,

[0038] The (A2) resin not having a weakly acidic group includes (A2x) a resin having a radical polymerizable group and / or (A2y) a resin not having a radical polymerizable group.

[0039]

[13] The photosensitive composition according to any one of the aforementioned [1] to

[12] , further containing (I) a carboxylic acid compound and a carboxylic acid ester, the (I) carboxylic acid compound and carboxylic acid ester contain a compound represented by the general formula (41), and satisfy the following condition (3).

[0040] (3) The total content of the (I) carboxylic acid compound and carboxylic acid ester in all the solid components of the photosensitive composition is 0.010% by mass or more and 5.0% by mass or less

[0041] [Chemical formula 1]

[0042]

[0043] In the general formula (41), R 21 and R22 each independently represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. R 23 and R 24 each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. a and b each independently represent an integer of 2 to 8. c represents an integer of 0 to 4.

[0044]

[14] The photosensitive composition according to any one of the foregoing [1] to

[13] , which further contains water and satisfies the condition of the following (4).

[0045] (4) The content of water in the photosensitive composition is 0.010% by mass or more and 3.0% by mass or less.

[0046]

[15] The photosensitive composition according to any one of the foregoing [1] to

[14] , wherein the foregoing structure (I) or the foregoing structure (II) further has a radical polymerizable group and / or a thermal reactive group.

[0047]

[16] The photosensitive composition according to the foregoing

[15] , which further contains (B) a radical polymerizable compound and / or (F) a crosslinking agent. When the foregoing structure (I) or the foregoing structure (II) further has a radical polymerizable group, the photosensitive composition contains the (B) radical polymerizable compound,

[0048] When the foregoing structure (I) or the foregoing structure (II) further has a thermal reactive group, the photosensitive composition contains the (F) crosslinking agent.

[0049]

[17] A cured product obtained by curing the photosensitive composition according to any one of the foregoing [1] to

[16] .

[0050]

[18] A display device including the cured product according to the foregoing

[17] .

[0051]

[19] A method for manufacturing a cured product, comprising: (1) a step of forming a coating film of the photosensitive composition according to any one of the foregoing [1] to

[16] on a substrate; (2) a step of irradiating the coating film of the photosensitive composition with actinic rays through a photomask; (3) a step of developing using a developer to form a pattern of the photosensitive composition; and (4) a step of heating the foregoing pattern to obtain a cured pattern of the photosensitive composition.

[0052]

[20] A display device having a substrate, a first electrode, a second electrode, a pixel dividing layer, a light emitting layer, and a TFT planarization layer, wherein the pixel dividing layer and / or the TFT planarization layer contains an (XH) imide compound,

[0053] The (XH) imide compound has at least two (XI) structures: a structure formed by bonding a structure containing an imide bond to a cyclic structure having a phenolic hydroxyl group and / or a fluorine-containing substituent, and also has an (XII) structure: a structure connecting at least two of the (XI) structures.

[0054] Advantages of the Invention

[0055] The photosensitive composition according to the present invention can provide a cured product that can simultaneously achieve excellent sensitivity during exposure and suppression of residues after development, and has excellent mechanical properties. Moreover, it can provide a cured product included in a display device having excellent reliability of a light-emitting element. In addition, according to the display device of the present invention, a display device having excellent reliability of a light-emitting element can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 is a plan view showing the manufacturing process of steps 1 to 4 in the substrate of the organic EL display used in the evaluation of light-emitting characteristics. DETAILED DESCRIPTION OF THE INVENTION

[0057] Hereinafter, the photosensitive composition of the present invention will be described. However, the present invention is not limited to the following embodiments, and various modifications can be made within the scope that can achieve the object of the invention and does not deviate from the gist of the invention. It should be noted that the main chain of a resin refers to the chain with the longest chain length among the chains constituting the resin containing structural units. The side chain of a resin refers to a chain that branches from or bonds to the main chain among the chains constituting the resin containing structural units and has a shorter chain length than the main chain. The terminal of a resin refers to a structure that closes the main chain, for example, a structure derived from a capping agent or the like. In addition, a hydrocarbon group or an alkylene group containing "*** bond" or "*** group" means: a hydrocarbon group or an alkylene group formed by bonding "*** bond" or "*** group"; or at least two hydrocarbon groups or at least two alkylene groups connected by "*** bond" or "*** group".

[0058] <Photosensitive Composition>

[0059] ​The photosensitive composition of the present invention has the constitution of [1] described above. By setting it to the above constitution, the photosensitive composition of the present invention can provide a cured product that can simultaneously achieve excellent sensitivity during exposure and suppression of residues after development, and has excellent mechanical properties. Moreover, it can provide a cured product included in a display device with excellent reliability of a light-emitting element. It is considered that this is because, by including an (H) imide compound having the above specific structure in the photosensitive composition, the compound becomes compatible in the entire film. In addition, by the action of promoting alkali dissolution of the aromatic structure having a phenolic hydroxyl group in the above (II) structure, and the action of promoting dissolution in the developer brought about by the interaction between the cyclic structure having a fluorine-substituted group and the residue components of the organic matter in the opening (in the case of negative photosensitivity, the unexposed portion; in the case of positive photosensitivity, the exposed portion), the effects of excellent sensitivity during exposure and suppression of residues after development are achieved. In addition, it is also considered that since the surface of the substrate is surface-modified with this compound, the effect of suppressing residues after development is achieved by preventing the adhesion of residues in the opening.

[0060] In addition, it is inferred that the imide bond in the above (I) structure interacts with the imide bond and amide bond in resins such as polyimide and polybenzoxazole. Moreover, it is inferred that through the π-electron interaction between the π-electrons in the imide bond and the resins having an aromatic ring such as polyimide, polybenzoxazole and their precursors, and the coordination bonding based on π-electrons between the resin containing a silicon atom having a 3d orbital (an empty atomic orbital) such as polysiloxane, these resins are in a state of being locally oriented. As a result, the crosslinking reaction between resins and the ring-closure reaction of the resin are efficiently carried out. Therefore, it is considered that excellent mechanical properties can be achieved. In addition, it is inferred that this compound forms a crosslinked structure with a resin or the like as a crosslinking agent. Therefore, it is considered that the above (I) structure or (II) structure contributes to the control of the polarization structure and charge balance in the cured product. As a result, it is inferred that ion migration and electromigration caused by metal impurities and ionic impurities, which have an adverse effect on the light-emitting characteristics, can be suppressed. In addition, the effect of excellent reliability of the light-emitting element is achieved by suppressing the migration and aggregation of metals in the electrode and wiring. That is, it is inferred that the effect of excellent migration resistance in electronic components, semiconductor devices, display devices or metal-clad laminates can also be achieved.

[0061] <(A) Binder resin>

[0062] The photosensitive composition of the present invention contains (A) a binder resin. The so-called (A) binder resin is a resin having heat resistance and remaining at least a part thereof in the cured product obtained by curing the composition. The (A) binder resin is preferably a resin that forms a crosslinked structure and cures through a reaction. The reaction is not particularly limited, such as a reaction based on heating or a reaction based on irradiation with energy rays, and a crosslinked structure can also be formed using the (F) crosslinking agent described later. The (A) binder resin is preferably a thermosetting resin.

[0063] (A) The binder resin is preferably an alkali-soluble resin having an acidic group or an organic solvent-soluble resin having an organic solvent-soluble structure. (A) The binder resin is preferably a resin that imparts positive or negative photosensitivity to the composition using the (C) photosensitizer described later and has solubility capable of forming a positive or negative pattern. The (A) binder resin more preferably has an acidic group in the structural unit of the resin. From the viewpoint of pattern processability using an alkaline developer, the acidic group is preferably a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, 1,1-bis(trifluoromethyl)hydroxymethyl, a mercapto group, a carboxyl group, a carboxylic anhydride group, or a sulfonic acid group. Further, from the viewpoints of improving sensitivity during exposure and suppressing residues after development, it is more preferably a carboxyl group, a carboxylic anhydride group, or a sulfonic acid group.

[0064] (A) The binder resin preferably has a radically polymerizable group, and more preferably has a radically polymerizable group in the structural unit of the resin. The radically polymerizable group preferably has an ethylenically unsaturated double bond group, and more preferably is a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, or an alkynyl group having 2 to 5 carbon atoms. The photoreactive group is preferably a styryl group, a cinnamoyl group, a maleimide group, a nadic imide group, or a (meth)acryloyl group. From the viewpoints of improving sensitivity during exposure and improving mechanical properties, it is more preferably a (meth)acryloyl group. On the other hand, the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably a vinyl group, an allyl group, 2-methyl-2-propenyl, crotonyl, 2-methyl-2-butenyl, 3-methyl-2-butenyl, 2,3-dimethyl-2-butenyl, ethynyl, or 2-propynyl. From the viewpoints of improving sensitivity during exposure and improving mechanical properties, it is more preferably a vinyl group or an allyl group.

[0065] <(A1) resin and (A2) resin>

[0066] (A) The binder resin preferably contains (A1) a resin containing a weakly acidic group and / or (A2) a resin not having a weakly acidic group.

[0067] From the viewpoint of improving the sensitivity during exposure, the (A) binder resin preferably contains (A1) a resin having a weakly acidic group, and the (A1) resin having a weakly acidic group has a (WA) weakly acidic group selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, 1,1-bis(trifluoromethyl)hydroxymethyl, and a mercapto group, and more preferably has a (WA) weakly acidic group in the structural unit of the resin. From the viewpoints of improving the sensitivity during exposure and suppressing the residue after development, the (WA) weakly acidic group is preferably a phenolic hydroxyl group, a silanol group, or 1,1-bis(trifluoromethyl)hydroxymethyl, and more preferably a phenolic hydroxyl group.

[0068] Regarding the above-mentioned (A1) resin having a weakly acidic group, due to the moderate acidity of the (WA) weakly acidic group and the interaction with the (C) photosensitizer described later, the solubility of the exposed portion is improved, and thus the effect of improving the sensitivity during exposure becomes significant. The phenolic hydroxyl group in the (WA) weakly acidic group makes the effect of suppressing the residue after development significant due to its role in promoting alkali dissolution. In addition, when the composition has positive photosensitivity, the phenolic hydroxyl group in the (WA) weakly acidic group can improve the dissolution contrast between the exposed portion and the unexposed portion due to its strong interaction with the (C) photosensitizer, and also improve the dissolution promotion effect in the exposed portion. Therefore, the effects of improving the sensitivity during exposure and suppressing the residue after development become significant.

[0069] From the viewpoint of suppressing the residue after development, the (A) binder resin preferably contains (A2) a resin having no weakly acidic group. The (A2) resin having no weakly acidic group preferably has an acidic group different from the (WA) weakly acidic group, and more preferably has an acidic group different from the (WA) weakly acidic group in the structural unit of the resin. From the viewpoints of improving the sensitivity during exposure and suppressing the residue after development, the acidic group different from the (WA) weakly acidic group is more preferably a carboxyl group, a carboxylic anhydride group, or a sulfonic acid group.

[0070] From the viewpoints of improving the sensitivity during exposure and improving the mechanical properties, preferably, the (A) binder resin contains (A1) a resin having a weakly acidic group, and the (A1) resin having a weakly acidic group has a radical polymerizable group. Examples and preferred descriptions of the radical polymerizable group are as described in the above-mentioned (A) binder resin.

[0071] (A) The binder resin preferably contains (A1) a resin having a weakly acidic group and / or (A2) a resin not having a weakly acidic group. (A1) The resin having a weakly acidic group includes (A1x) a resin having, in the structural unit of the resin, at least one selected from the group consisting of an imide structure, an amide structure, an oxazole structure, and a siloxane structure (hereinafter referred to as "imide structure, etc.") and / or (A1y) a resin having a phenolic hydroxyl group in the structural unit of the resin. (A2) The resin not having a weakly acidic group includes (A2x) a resin having a radically polymerizable group and / or (A2y) a resin not having a radically polymerizable group.

[0072] When (A) the binder resin contains (A1) a resin having a weakly acidic group, (A) the binder resin preferably contains (A1) a resin having a weakly acidic group and (A2) a resin not having a weakly acidic group.

[0073] From the viewpoints of improving the sensitivity during exposure and suppressing the residue after development, it is preferable that (A) the binder resin contains (A1) a resin having a weakly acidic group and (A2) a resin not having a weakly acidic group, (A1) the resin having a weakly acidic group includes (A1x) a resin and / or (A1y) a resin, and (A2) the resin not having a weakly acidic group includes (A2x) a resin and / or (A2y) a resin.

[0074] When the photosensitive composition of the present invention has the constitution of the above [3], from the viewpoints of improving the sensitivity during exposure and suppressing the residue after development, it is preferable that the photosensitive composition of the present invention contains (A1) a resin having a weakly acidic group and (A2) a resin not having a weakly acidic group, (A1) the resin having a weakly acidic group includes (A1x) a resin and / or (A1y) a resin, and (A2) the resin not having a weakly acidic group includes (A2x) a resin and / or (A2y) a resin.

[0075] It should be noted that, for (A1x) a resin, (A1y) a resin, (A2x) a resin, and (A2y) a resin, when they each have a structure or a group constituting another resin, they are classified into any one by the classification method shown in Table 1-1 below. When a certain resin can belong to two or more of (A1x) a resin, (A1y) a resin, (A2x) a resin, and (A2y) a resin, this classification method is used to determine which resin it belongs to.

[0076] [Table 1-1]

[0077] [Table 1-1]

[0078]

[0079] (A) The binder resin preferably contains the (A1x) resin and / or the (A1y) resin, more preferably contains the (A1x) resin, and further preferably contains the (A1x) resin and the (A1y) resin. In addition, the (A) binder resin preferably contains the (A1x) resin and / or the (A1y) resin and further contains the (A2x) resin, more preferably contains the (A1x) resin, the (A1y) resin, and the (A2x) resin. In addition, the (A) binder resin also preferably contains the (A1x) resin, the (A1y) resin, or the (A2x) resin and further contains the (A2y) resin. In addition, from the viewpoint of improving the characteristics brought by each resin, the (A) binder resin also preferably contains two or more selected from the group consisting of the (A1x) resin, the (A1y) resin, the (A2x) resin, and the (A2y) resin.

[0080] <(A1x) resin>

[0081] When the (A) binder resin contains the (A1) resin having a weakly acidic group, from the viewpoints of improving the sensitivity during exposure, improving the mechanical properties, and improving the reliability of the light-emitting element, the (A1) resin having a weakly acidic group preferably contains the (A1x) resin. From the viewpoints of improving the sensitivity during exposure, improving the mechanical properties, and improving the reliability of the light-emitting element, the (A1x) resin preferably contains one or more selected from the group consisting of the (A1x-1) resin: polyimide, the (A1x-2) resin: polyimide precursor, the (A1x-3) resin: polybenzoxazole, the (A1x-4) resin: polybenzoxazole precursor, the (A1x-5) resin: polyamideimide, the (A1x-6) resin: polyamideimide precursor, the (A1x-7) resin: polyamide, the (A1x-8) resin: polysiloxane, maleimide resin, maleimide-styrene resin, maleimide-triazine resin, maleimide-oxazine resin, and their copolymers, and more preferably contains one or more selected from the group consisting of the (A1x-1) resin, the (A1x-2) resin, the (A1x-3) resin, the (A1x-4) resin, the (A1x-5) resin, the (A1x-6) resin, the (A1x-7) resin, and their copolymers (hereinafter, "polyimide-based resins having a weakly acidic group"). From the viewpoint of improving the mechanical properties, the (A1x) resin further preferably contains the (A1x-1) resin, the (A1x-3) resin, and their copolymers. From the viewpoint of improving the sensitivity during exposure, the (A1x) resin further preferably contains the (A1x-2) resin, the (A1x-4) resin, and their copolymers. The (A1x) resin can be either a single resin or their copolymer.

[0082] Since the above-mentioned (A1x) resin has an imide structure, an amide structure, an oxazole structure, or a siloxane structure in the structural unit of the resin, an effect of improving mechanical properties can be obtained. In addition, it is inferred that these structures capture metal impurities, ionic impurities, etc. that have an adverse effect on electrical insulation, and thus ion migration and electromigration can be suppressed, and the reliability of the light-emitting element is improved.

[0083] On the other hand, from the viewpoints of improving sensitivity during exposure, suppressing residues after development, and improving mechanical properties, the (A2x) resin and the (A2y) resin preferably contain one or more selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, polyamide, maleimide resin, maleimide-styrene resin, maleimide-triazine resin, maleimide-oxazine resin, and copolymers thereof, and more preferably contain one or more selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, polyamide, and copolymers thereof (hereinafter referred to as "polyimide-based resins without weakly acidic groups").

[0084] <An amine residue containing a (WA) weakly acidic group and a carboxylic acid residue containing a (WA) weakly acidic group>

[0085] When the (A1) resin containing a weakly acidic group contains the (A1x) resin, from the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving mechanical properties, and improving the reliability of the light-emitting element, the (A1x) resin contains one or more selected from the group consisting of the above-mentioned polyimide-based resins having a weakly acidic group, and the (A1x) resin preferably has an amine residue containing a (WA) weakly acidic group and / or a carboxylic acid residue containing a (WA) weakly acidic group.

[0086] When the photosensitive composition of the present invention has the constitution of the above [3], from the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving mechanical properties, and improving the reliability of the light-emitting element, preferably, the (A) binder resin contains the (A1) resin containing a weakly acidic group, the (A1) resin containing a weakly acidic group has a (WA) weakly acidic group, and the (A1) resin containing a weakly acidic group contains the (A1x) resin.

[0087] (A1x) resin contains one or more selected from the group consisting of the above-mentioned polyimide-based resins having a weakly acidic group, and the (A1x) resin has an amine residue containing a (WA) weakly acidic group and / or a carboxylic acid residue containing a (WA) weakly acidic group.

[0088] When the (A1x) resin has an amine residue containing a (WA) weakly acidic group and / or a carboxylic acid residue containing a (WA) weakly acidic group,

[0089] From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving mechanical properties, and improving the reliability of the light-emitting element, it is preferable that the (A1x) resin contains a fluoroamine residue and / or a fluorocarboxylic acid residue, the fluoroamine residue and the fluorocarboxylic acid residue have at least two fluorinated aromatic structures, and have a group connecting at least two fluorinated aromatic structures.

[0090] The group connecting at least two fluorinated aromatic structures has an ether bond.

[0091] When the (A1x) resin contains the above-mentioned fluoroamine residue and / or fluorocarboxylic acid residue, from the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving mechanical properties, and improving the reliability of the light-emitting element, the above-mentioned fluorinated aromatic structure preferably includes an aromatic structure having a trifluoromethyl group.

[0092] One or more selected from the group consisting of (A1x-1) resin, (A1x-2) resin, (A1x-3) resin, (A1x-4) resin, (A1x-5) resin, (A1x-6) resin, and their copolymers more preferably have one or more selected from the group consisting of the amine residue represented by the general formula (11) and the amine residue represented by the general formula (13), and / or one or more selected from the group consisting of the carboxylic acid residues represented by the general formulas (11), (12), and (14).

[0093] [Chemical formula 2]

[0094]

[0095] In the general formulas (11) to (14), R 31 ~R 38 Each independently represents 1,1-bis(trifluoromethyl)hydroxymethyl, a mercapto group, or a sulfonic acid group. R 39 ~R 42 Each independently represents a halogen atom, an alkyl group having 1 to 6 carbon atoms, or a halogenated alkyl group having 1 to 6 carbon atoms. R 61 ~R 68 Each independently represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogenated alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkenyloxy group having 2 to 10 carbon atoms, or an acyl group having 1 to 10 carbon atoms. X 11 ~X 16Each independently represents a direct bonding key, a hydrocarbon group, a hydrocarbon group containing an ether bond, or an amide group bonded with a hydrocarbon group. Y 11 ~Y 14 Each independently represents a direct bonding key, an oxygen atom, a sulfur atom, a sulfonyl group, a hydrocarbon group, a hydrocarbon group containing an ether bond, a fused polycyclic structure, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group. a, b, c, d, e, and f each independently represent an integer of 0 to 4. g, h, i, j, m, and n each independently represent an integer of 0 to 4. k and l each independently represent an integer of 0 to 3. o, p, q, r, s, t, u, and v each independently represent an integer of 0 to 3. w, x, y, and z each independently represent an integer of 0 to 6. It should be noted that 1 ≤ a + g ≤ 4, and 1 ≤ b + h ≤ 4. In addition, 1 ≤ c + i ≤ 4, and 1 ≤ d + j ≤ 4. In addition, 1 ≤ e + m ≤ 4, and 1 ≤ f + n ≤ 4. * 1 ~* 13 Each independently represents a bonding site in the resin.

[0096] In General Formulas (11) to (14), the halogen atom is preferably a fluorine atom. The haloalkyl group is preferably a fluoroalkyl group. X 11 ~X 16 In, the hydrocarbon group in the hydrocarbon group, the hydrocarbon group containing an ether bond, and the amide group bonded with a hydrocarbon group is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, an arylene group having 6 to 15 carbon atoms, or an arylalkylene group having 10 to 20 carbon atoms. Y 11 ~Y 14 In, the hydrocarbon group in the hydrocarbon group and the hydrocarbon group containing an ether bond is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. Y 11 ~Y 14 In, the carbon atom number of the hydrocarbon group containing a carbonyloxy group and the hydrocarbon group containing a carbonylamide group is preferably 1 to 15, and the hydrocarbon group is preferably an aliphatic structure, an alicyclic structure, an aromatic structure, a fused polycyclic structure, or a fused polycyclic heterocyclic structure. The above-mentioned substituents and structures may have heteroatoms and may be either unsubstituted or substituted.

[0097] From the viewpoint of improving the above-described properties, the total content ratio of the amine residues represented by the general formula (11) and the general formula (13) in all the amine residues, and / or the total content ratio of the carboxylic acid residues represented by the general formula (11), (12), and (14) in all the carboxylic acid residues is preferably 10 mol% or more, more preferably 30 mol% or more, and further preferably 50 mol% or more. On the other hand, from the viewpoint of improving the above-described properties, the total content ratio of the amine residues represented by the general formula (11) and the general formula (13), and / or the total content ratio of the carboxylic acid residues represented by the general formula (11), (12), and (14) is preferably 100 mol% or less, more preferably 90 mol% or less, and further preferably 70 mol% or less.

[0098] Regarding the above-mentioned amine residue containing a (WA) weakly acidic group and the carboxylic acid residue containing a (WA) weakly acidic group, the action of promoting alkali dissolution by the phenolic hydroxyl group and the aromatic structure having a fluorine substituent makes the sensitivity during exposure and the effect of suppressing residues after development remarkable. In addition, the crosslinking reaction between resins and the ring-closing reaction of the resin are efficiently carried out using these structures, and thus the effect of improving the mechanical properties becomes remarkable. Further, it is presumed that these structures promote the capture of metal impurities, ionic impurities, etc. that have an adverse effect on electrical insulation, and thus the reliability of the light-emitting element is improved.

[0099] <(DA1) First amine residue: an amine residue having a phenolic hydroxyl group>

[0100] When the (A) binder resin contains one or more selected from the group consisting of the above-described polyimide resins having a weakly acidic group

[0101] From the viewpoints of improving the sensitivity during exposure, suppressing residues after development, improving mechanical properties, and improving the reliability of the light-emitting element, the polyimide resin having a weakly acidic group preferably has a (DA1) first amine residue: an amine residue having a phenolic hydroxyl group, and more preferably the (DA1) first amine residue has at least two (Ia) structures: a cyclic structure having a phenolic hydroxyl group, and also has a (IIa) structure: a structure connecting at least two (Ia) structures.

[0102] From the viewpoint of improving the reliability of the light-emitting element, the cyclic structure in the (Ia) structure is preferably an aromatic structure or a fused polycyclic structure, more preferably an aromatic structure having 6 to 15 carbon atoms or a fused polycyclic structure having 6 to 20 carbon atoms. The aromatic structure is preferably a biphenyl structure or a benzene structure. The fused polycyclic structure is preferably a fluorene structure, an anthracene structure, or a naphthalene structure. It should be noted that the phenolic hydroxyl group in the (DA1) first amine residue can react with the structure and / or group in the resin to form a benzoxazole ring. That is, in a resin having a benzoxazole ring in the structural unit of the resin, the benzoxazole ring can have the (DA1) first amine residue.

[0103] From the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, improving the mechanical properties, and improving the reliability of the light-emitting element, the (IIa) structure is preferably an alkylene group, a sulfonyl group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, an ether bond, a thioether bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a sub-cycloalkyl group, a sub-aryl group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group. The alkylene group, sub-cycloalkyl group, or sub-aryl group is preferably an alkylene group having 1 to 10 carbon atoms, a sub-cycloalkyl group having 4 to 10 carbon atoms, or a sub-aryl group having 6 to 15 carbon atoms. The hydrocarbon group in the hydrocarbon group containing an ether bond is preferably an alkylene group having 1 to 10 carbon atoms, a sub-cycloalkyl group having 4 to 10 carbon atoms, or a sub-aryl group having 6 to 15 carbon atoms. The carbon atoms of the hydrocarbon group containing a carbonyloxy group and the hydrocarbon group containing a carbonylamide group are preferably 1 to 15, and the hydrocarbon group is preferably an aliphatic structure, an alicyclic structure, an aromatic structure, a fused polycyclic structure, or a fused polycyclic heterocyclic structure.

[0104] In the case where (A) the binder resin contains one or more selected from the group consisting of the above polyimide resins having a weakly acidic group, and the polyimide resin having a weakly acidic group has the (DA1) first amine residue, the (DA1) first amine residue has at least two (Ia) structures and (IIa) structures, and further the (IIa) structure is the above specific structure,

[0105] From the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, improving the mechanical properties, and improving the reliability of the light-emitting element, the (H) imide compound described later preferably contains the (H2) compound: a compound in which the cyclic structure in the (I) structure described later is an aromatic structure having a phenolic hydroxyl group.

[0106] From the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, improving the mechanical properties, and improving the reliability of the light-emitting element, the (DA1) first amine residue preferably has an amine residue represented by the general formula (31).

[0107] [Chemical formula 3]

[0108]

[0109] In general formula (31), R 71 and R 72 each independently represent a carboxyl group, a mercapto group or a sulfonic acid group. R 73 represents an alkyl group having 1 to 6 carbon atoms. R 74 and R 75 each independently represent an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkenyloxy group having 2 to 10 carbon atoms or an acyl group having 1 to 10 carbon atoms. X 31 and X 32 each independently represent a direct bond, a hydrocarbon group, a hydrocarbon group containing an ether bond or an amide group bonded with a hydrocarbon group. Y 31 represents an alkylene group, a sulfonyl group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, an ether bond, a thioether bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a sub-cycloalkyl group, a sub-aryl group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group or a hydrocarbon group containing a carbonylamide group. a and b each independently represent an integer of 1 to 4. g and h each independently represent an integer of 0 to 3. o and p each independently represent an integer of 0 to 3. w represents an integer of 0 to 6. It should be noted that 1 ≤ a + g ≤ 4, and 1 ≤ b + h ≤ 4. * 1 and * 2 each independently represent a bonding site in the resin.

[0110] In general formula (31), the hydrocarbon group, the hydrocarbon group containing an ether bond and the hydrocarbon group in the amide group bonded with a hydrocarbon group in X 31 and X 32 are preferably an alkylene group having 1 to 10 carbon atoms, a sub-cycloalkyl group having 4 to 10 carbon atoms, a sub-aryl group having 6 to 15 carbon atoms or an arylalkylene group having 10 to 20 carbon atoms. In Y 31 , the hydrocarbon group and the hydrocarbon group in the hydrocarbon group containing an ether bond are preferably an alkylene group having 1 to 10 carbon atoms, a sub-cycloalkyl group having 4 to 10 carbon atoms or a sub-aryl group having 6 to 15 carbon atoms. Y 31In the formula, the number of carbon atoms of the hydrocarbon group containing a carbonyloxy group and the hydrocarbon group containing a carbonylamide group is preferably 1 to 15, and the hydrocarbon group is preferably an aliphatic structure, an alicyclic structure, an aromatic structure, a fused polycyclic structure or a fused polycyclic heterocyclic structure. The above substituents and structures may have heteroatoms and may be either unsubstituted or substituted. It should be noted that the phenolic hydroxyl group in the amine residue represented by the general formula (31) can react with the structure and / or group in the resin to form a benzoxazole ring. That is, in a resin having a benzoxazole ring in the structural unit of the resin, the benzoxazole ring may have an amine residue represented by the general formula (31).

[0111] From the viewpoint of the effects of the above invention, the total content ratio of the amine residue represented by the general formula (31) in the polyimide resin having a weakly acidic group among all the amine residues is preferably 10 mol% or more, more preferably 20 mol% or more, further preferably 30 mol% or more, and particularly preferably 50 mol% or more. On the other hand, from the viewpoint of the effects of the above invention, the total content ratio of the amine residue represented by the general formula (31) is preferably 100 mol% or less, more preferably 90 mol% or less, and further preferably 70 mol% or less.

[0112] Regarding the polyimide resin having a weakly acidic group, from the viewpoints of improving mechanical properties and the reliability of the light-emitting element, it preferably further has a (DA2) second amine residue: an amine residue without a phenolic hydroxyl group, and satisfies the following condition (α1) and / or condition (α2). Furthermore, from the viewpoint of suppressing the residue after development, it more preferably satisfies the following condition (α1) and condition (α2).

[0113] (α1) The (DA2) second amine residue has at least two (Ib) structures: a cyclic structure without a phenolic hydroxyl group, and also has a (IIb) structure: a structure connecting at least two (Ib) structures. The (IIb) structure is an alkylene group, a sulfonyl group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a thioether bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a subcycloalkyl group, a subaryl group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group or a hydrocarbon group containing a carbonylamide group

[0114] (α2) The (DA2) second amine residue has a (IIIb) structure: an organosilicon structure and / or a siloxane structure.

[0115] From the viewpoint of improving the reliability of the light-emitting element, the ring structure in the (Ib) structure is preferably an aromatic structure or a fused polycyclic structure, more preferably an aromatic structure having 6 to 15 carbon atoms or a fused polycyclic structure having 6 to 20 carbon atoms. The aromatic structure is preferably a biphenyl structure or a benzene structure. The fused polycyclic structure is preferably a fluorene structure, an anthracene structure, or a naphthalene structure.

[0116] (In the (IIb) structure, the alkylene group, cycloalkylene group, or arylene group is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. The hydrocarbon group in the hydrocarbon group containing an ether bond is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. The carbon atom number of the hydrocarbon group containing a carbonyloxy group and the hydrocarbon group containing a carbonylamide group is preferably 1 to 15, and the hydrocarbon group is preferably an aliphatic structure, an alicyclic structure, an aromatic structure, a fused polycyclic structure, or a fused polycyclic heterocyclic structure.

[0117] (In the (IIIb) structure, the organosilicon structure and the siloxane structure are preferably structures having a valence of 2 or more that are bonded to at least two alkylene groups and are interposed between these alkylene groups. The above-mentioned structure having a valence of 2 or more is more preferably 3 or more, and further preferably 4 or more. On the other hand, the above-mentioned structure having a valence of 2 or more is preferably 6 or less. The number of silicon atoms in the organosilicon structure and / or the siloxane structure is preferably 2 or more, more preferably 3 or more, and further preferably 4 or more. On the other hand, the above-mentioned number of silicon atoms is preferably 15 or less, more preferably 10 or less, and further preferably 8 or less. The organosilicon structure is preferably a dialkyl organosilicon structure and / or a monoalkyl organosilicon structure, and the siloxane structure is preferably a monoalkyl siloxane structure. The carbon atom number of the alkyl group in the dialkyl organosilicon structure, the monoalkyl organosilicon structure, and the monoalkyl siloxane structure is preferably 1 or more, more preferably 2 or more, and further preferably 3 or more. On the other hand, the above-mentioned carbon atom number of the alkyl group is preferably 10 or less, more preferably 8 or less, and further preferably 6 or less.

[0118] In the case of a polyimide resin having a weakly acidic group, preferably, (DA1) the total content ratio of the first amine residue in all amine residues is 20 mol% or more and 90 mol% or less, and (DA2) the total content ratio of the second amine residue in all amine residues is 10 mol% or more and 80 mol% or less. From the viewpoint of the effects of the above invention, (DA2) the total content ratio of the second amine residue in all amine residues is preferably 10 mol% or more, more preferably 20 mol% or more, further preferably 30 mol% or more, and particularly preferably 40 mol% or more. On the other hand, from the viewpoint of the effects of the above invention, (DA2) the total content ratio of the second amine residue is preferably 80 mol% or less, more preferably 70 mol% or less, and further preferably 60 mol% or less.

[0119] Regarding the above (DA1) first amine residue, due to the action of the amine residue having a phenolic hydroxyl group to promote alkali dissolution, the sensitivity during exposure is increased and the effect of suppressing residues after development becomes significant. In addition, by using these structures, the crosslinking reaction between resins and the ring-closure reaction of the resin are efficiently carried out, so the effect of improving mechanical properties becomes significant. In addition, it is inferred that these structures promote the capture of metal impurities, ionic impurities, etc. that have an adverse effect on electrical insulation, so the reliability of the light-emitting element is improved.

[0120] <(Substituent in the (A1x) resin)>

[0121] From the viewpoints of improving the sensitivity during exposure and mechanical properties, the (A1x) resin preferably has a radically polymerizable group. Examples and preferred descriptions of the radically polymerizable group are as described in the above (A) binder resin. The radically polymerizable group is preferably a group obtained by reacting a part of the phenolic hydroxyl group and / or carboxyl group possessed by the resin with a compound having a radically polymerizable group.

[0122] From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving mechanical properties, and improving the reliability of light-emitting elements, the (A1x) resin preferably contains an (A1x) resin having no radically polymerizable group and an (A1x) resin having a radically polymerizable group. It is considered that by setting the above-described constitution, the (A1x) resin having no radically polymerizable group achieves suppression of residues after development and capture ability for metal impurities, ionic impurities, etc. due to acidic groups or an organic solvent-soluble structure. On the other hand, the (A1x) resin having a radically polymerizable group achieves improvement in sensitivity during exposure and improvement in the crosslinking degree of the film due to promotion of radical polymerization. As a result, outgassing can be suppressed, and the effect of improving the reliability of the light-emitting element becomes significant. By such functional separation in the (A1x) resin, the effect of improving multiple characteristics becomes significant.

[0123] From the viewpoint of improving sensitivity during exposure, the acid equivalent of the (A1x) resin is preferably 200 g / mol or more. On the other hand, from the viewpoint of suppressing residues after development, the acid equivalent of the (A1x) resin is preferably 600 g / mol or less. Here, the exposure refers to irradiation with active chemical rays (radiation), and examples thereof include irradiation with visible light, ultraviolet rays, electron beams, or X-rays. Hereinafter, the exposure refers to irradiation with active chemical rays (radiation). From the viewpoint of suppressing residues after development, the double bond equivalent of the (A1x) resin is preferably 200 g / mol or more. On the other hand, from the viewpoint of improving sensitivity during exposure, the double bond equivalent of the (A1x) resin is preferably 3,000 g / mol or less.

[0124] <Polyimide-based resin>

[0125] Hereinafter, a polyimide-based resin having a weakly acidic group as the (A1x) resin and a polyimide-based resin having no weakly acidic group as the (A2x) resin or (A2y) resin are collectively described. These resins are sometimes collectively referred to as polyimide-based resins. From the viewpoint of improving mechanical properties, the polyimide precursor preferably has an amide acid ester structural unit and / or an amide acid amide structural unit. In addition, the polyimide precursor may have an imide ring-closed structural unit formed by imide ring closure of a part of an amide acid structural unit, an amide acid ester structural unit, or an amide acid amide structural unit. The above-described polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, and polyamideimide precursor may also be copolymers with polyamide.

[0126] From the viewpoint of improving the sensitivity during exposure, the polyimide resin preferably contains a carboxylic acid residue having a fluorine atom and / or an amine residue having a fluorine atom. The total content ratio of the carboxylic acid residue having a fluorine atom and the amine residue having a fluorine atom in all the carboxylic acid residues and all the amine residues of each resin is preferably 10 mol% or more and 100 mol% or less, more preferably 30 mol% or more and 100 mol% or less, and still more preferably 50 mol% or more and 100 mol% or less. The preferred ranges of the total content ratio of the amine residue having a fluorine atom in all the amine residues and the total content ratio of the carboxylic acid residue having a fluorine atom in all the carboxylic acid residues are also the same as above respectively.

[0127] From the viewpoint of improving the reliability of the light-emitting element, the weight-average molecular weight of the polyimide resin measured by gel permeation chromatography (hereinafter referred to as "GPC") and converted to polystyrene is preferably 4,000 or more, more preferably 5,000 or more, still more preferably 7,000 or more, and particularly preferably 10,000 or more. On the other hand, from the viewpoint of suppressing the residue after development, the weight-average molecular weight is preferably 100,000 or less, more preferably 50,000 or less, still more preferably 30,000 or less, and particularly preferably 20,000 or less. The polyimide resin can be synthesized by a known method.

[0128] From the viewpoint of improving the storage stability, the polyimide resin preferably has a structure in which the terminal of the resin is blocked with a monoamine, a dicarboxylic anhydride or a monocarboxylic acid derivative. From the viewpoints of improving the sensitivity during exposure and the mechanical properties, the polyimide resin preferably has a radical polymerizable group and / or a thermal reactive group capable of reacting with the resin, other components, etc. at the terminal of the resin. The radical polymerizable group and the thermal reactive group at the terminal of the resin are preferably an amine residue and / or a carboxylic acid residue, and more preferably have a maleimide group or a nadicimide group. As the acid monomer having these groups, for example, maleic anhydride or nadic anhydride can be cited.

[0129] In the case where the following (H) imide compound, the following (I) structure or (II) structure further has a radical polymerizable group and / or a thermal reactive group, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, suppressing the residue after thermal curing, improving the mechanical properties, and improving the reliability of the light-emitting element, the polyimide resin preferably has a radical polymerizable group and / or a thermal reactive group at the terminal of the resin.

[0130] In addition, in such a case, the radically polymerizable group at the end of the resin is preferably at least one group selected from the group consisting of a styryl group, a cinnamoyl group, a maleimide group, a nadic imide group, a (meth)acryloyl group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms. In addition, the thermally reactive group at the end of the resin is preferably at least one group selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, 1,1-bis(trifluoromethyl)hydroxymethyl, a mercapto group, a carboxyl group, a carboxylic anhydride group, a sulfonic acid group, an alkoxyalkyl group, a hydroxyalkyl group, an epoxy group, an oxetanyl group, and a blocked isocyanate group. By setting it to such a configuration, the crosslinking reaction between the (H) imide compound and the polyimide resin described later becomes easy, and the effects of the above invention become remarkable. Similarly, the crosslinking reaction between the (B) radically polymerizable compound and the polyimide resin and the crosslinking reaction between the (F) crosslinking agent and the polyimide resin described later become easy, and the effects of the above invention become remarkable.

[0131] <Structural unit of polyimide resin>

[0132] In the above polyimide resin, the polyimide has a polyimide unit, the polyimide precursor has a polyimide precursor unit, the polybenzoxazole has a polybenzoxazole unit, the polybenzoxazole precursor has a polybenzoxazole precursor unit, the polyamideimide has a polyamideimide unit, the polyamideimide precursor has a polyamideimide precursor unit, and the polyamide has a polyamide unit.

[0133] The so-called polyimide unit refers to a unit having two imide structures in the structural unit of the resin containing an amine residue and a carboxylic acid residue. The so-called polyimide precursor unit refers to a unit having two amic acid structures, two amic acid ester structures, two amic acid amide structures, an amic acid structure and an amic acid ester structure, an amic acid structure and an amic acid amide structure, or an amic acid ester structure and an amic acid amide structure in the structural unit of the resin containing an amine residue and a carboxylic acid residue. It should be noted that the so-called amic acid structure refers to a structure having one carboxylic acid amide bond and one carboxyl group. The so-called amic acid ester structure refers to a structure having one carboxylic acid amide bond and one carboxylic acid ester bond. The so-called amic acid amide structure refers to a structure having one carboxylic acid amide bond and another carboxylic acid amide bond.

[0134] The so-called polybenzoxazole unit refers to a unit having two benzoxazole structures in the structural unit of the resin containing an amine residue and a carboxylic acid residue. The so-called polybenzoxazole precursor unit refers to a unit having two hydroxyamide structures in the structural unit of the resin containing an amine residue and a carboxylic acid residue.

[0135] The so-called polyamideimide unit refers to a unit having an imide structure and an amide structure among the structural units of a resin containing amine residues and carboxylic acid residues. The so-called polyamideimide precursor unit refers to a unit having an amide structure and an amic acid structure, an amide structure and an amic acid ester structure, or an amide structure and an amic acid amide structure among the structural units of a resin containing amine residues and carboxylic acid residues.

[0136] The polyimide unit, polyimide precursor unit, polybenzoxazole unit, polybenzoxazole precursor unit, polyamideimide unit, polyamideimide precursor unit, and polyamide unit are all structural units constituting the resin and are repeating units with a repeat number of 2 or more. The repeat number of these units is preferably 2 or more, more preferably 5 or more, and still more preferably 10 or more. On the other hand, the repeat number is preferably 1,000 or less.

[0137] Resins in which the content ratio of the polyimide unit in the total of the polyimide unit and the polyimide precursor unit is 50 mol% or more are classified as polyimides. On the other hand, resins in which the content ratio of the polyimide unit is less than 50 mol% are classified as polyimide precursors. Similarly, resins in which the content ratio of the polybenzoxazole unit in the total of the polybenzoxazole unit and the polybenzoxazole precursor unit is 50 mol% or more are classified as polybenzoxazoles. On the other hand, resins in which the content ratio of the polybenzoxazole unit is less than 50 mol% are classified as polybenzoxazole precursors. Similarly, resins in which the content ratio of the polyamideimide unit in the total of the polyamideimide unit and the polyamideimide precursor unit is 50 mol% or more are classified as polyamideimides. On the other hand, resins in which the content ratio of the polyamideimide unit is less than 50 mol% are classified as polyamideimide precursors. The content ratio of the polyimide unit and the polyimide precursor unit can be calculated from the imide ring closure rate of the resin. The content ratio of the polybenzoxazole unit and the polybenzoxazole precursor unit can be calculated from the benzoxazole ring closure rate of the resin. The content ratio of the polyamideimide unit and the polyamideimide precursor unit can be calculated from the imide ring closure rate of the resin.

[0138] It should be noted that resins having two or more selected from the group consisting of (1) a polyimide unit or its precursor unit, (2) a polybenzoxazole unit or its precursor unit, (3) a polyamideimide unit or its precursor unit, and (4) a polyamide unit are classified into two resins based on each unit. That is, a resin having a polyimide precursor unit and a polybenzoxazole precursor unit is classified into two types, namely, a polyimide precursor and a polybenzoxazole precursor. In addition, when a certain structural unit in the resin belongs to, for example, both a polyimide precursor unit and a polybenzoxazole precursor unit, this structural unit is used when calculating the total content ratio of the polyimide precursor units in the resin and the total content ratio of the polybenzoxazole precursor units in the resin, respectively.

[0139] <Content of fluorine element in the structure of (A) binder resin>

[0140] From the viewpoints of suppressing the residue after development and improving the reliability of the light-emitting element, (A) binder resin preferably also satisfies the following condition (P1a). (A) binder resin more preferably further satisfies the following condition (P2a). Similarly, in the case where (A) binder resin is a polyimide-based resin, from the viewpoints of suppressing the residue after development and improving the reliability of the light-emitting element, it preferably satisfies the following condition (P1a), and more preferably further satisfies the following condition (P2a).

[0141] (P1a) The content of fluorine element in the structure of (A) binder resin is 10,000 mass ppm or less

[0142] (P2a) The content of fluoride ions in the structure of (A) binder resin is 10,000 mass ppm or less.

[0143] From the viewpoints of the effects of the above invention, the content of fluorine element in the structure of (A) binder resin is preferably 0 mass ppm or more, more preferably 0.010 mass ppm or more, further preferably 0.030 mass ppm or more, further more preferably 0.050 mass ppm or more, particularly preferably 0.070 mass ppm or more, and most preferably 0.10 mass ppm or more. On the other hand, from the viewpoints of the effects of the above invention, the content of fluorine element is preferably 10,000 mass ppm or less, more preferably 5,000 mass ppm or less, further preferably 1,000 mass ppm or less, further more preferably 500 mass ppm or less, particularly preferably 300 mass ppm or less, and most preferably 100 mass ppm or less. In addition, the content of fluorine element is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, further preferably 10 mass ppm or less, further more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0144] The preferred ranges of the content of fluoride ions in the structure of (A) binder resin are the same as those of the content of fluorine element in the structure of (A) binder resin described above, respectively.

[0145] When the photosensitive composition of the present invention has the constitution of the above [3], from the viewpoints of the effects of the above invention, (A) binder resin preferably also satisfies the above condition (P1a), and more preferably further satisfies the above condition (P2a).

[0146] The content of fluorine element in the structure of the (A) binder resin may be 0 mass ppm. The content of fluoride ions in the structure of the (A) binder resin may also be 0 mass ppm.

[0147] It is inferred that by making the (A) binder resin containing a fluorine element in a photosensitive composition at a specific value or less, the content of fluorine element, fluoride ions or anions containing fluorine element from these resins in these resins becomes a specific value or less. Therefore, due to the interaction such as hydrogen bonding of each component in the photosensitive composition, protons in the photosensitive composition are locally activated. Therefore, it is considered that the effect of suppressing the residue after development becomes significant by promoting the dissolution in the developer. In addition, it is considered that by deliberately making the content of the above components in the resin at a specific value or less, the content of the above components in the cured product of the photosensitive composition can be reduced, and the polarization structure and charge balance in the cured product can be controlled. As a result, it is inferred that by suppressing ion migration and electromigration caused by metal impurities and ionic impurities, which have an adverse effect on the light-emitting characteristics or electrical insulation, the reliability of the light-emitting element is improved. In addition, it is inferred that the reliability in the display device is improved due to the suppression of migration and aggregation of the metal in the electrode or the metal in the metal wiring.

[0148] <Polysiloxane and other resins>

[0149] Hereinafter, the (A1x) resin other than the polyimide resin not having a weakly acidic group and the (A2x) resin or (A2y) resin other than the polyimide resin not having a weakly acidic group are collectively described. It should be noted that polysiloxane has a silanol group and contains a siloxane structure in the structural unit of the resin, so it is an (A1x) resin.

[0150] In terms of polysiloxanes, from the viewpoint of pattern processability using an alkaline developer, it is preferable to have a silane unit containing an acidic group, and from the viewpoint of improving sensitivity during exposure, it is more preferable to have a silane unit containing a (WA) weakly acidic group. From the viewpoints of improving sensitivity during exposure and suppressing residues after development, the polysiloxane also preferably has a silane unit containing a carboxyl group, a carboxylic anhydride group, or a sulfonic acid group. Examples and preferred descriptions of the acidic group and the (WA) weakly acidic group are as described in the above-mentioned (A) binder resin. From the viewpoints of improving sensitivity during exposure and improving mechanical properties, the polysiloxane preferably has a radically polymerizable group, and more preferably has a silane unit containing a radically polymerizable group. Examples and preferred descriptions of the radically polymerizable group are as described in the above-mentioned (A) binder resin. From the viewpoints of improving sensitivity during exposure, reducing the taper of the pattern shape, improving mechanical properties, and improving the reliability of the light-emitting element, the polysiloxane preferably has a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure, and more preferably has a silane unit containing a naphthyl group, an anthracenyl group, a biphenyl group, a phenyl group, a tolyl group, or a methoxyphenyl group.

[0151] The maleimide resin is a resin having at least two maleimide groups. The maleimide-styrene resin is a resin having a maleimide group and a unit derived from a styrene derivative. The maleimide-triazine resin is a resin having a maleimide group and a unit containing a triazine structure. The maleimide-oxazine resin is a resin having a maleimide group and a unit containing an oxazine structure. They are resins different from polyimide-based resins.

[0152] <(A1y) resin>

[0153] From the viewpoints of improving sensitivity during exposure, suppressing residues after development, and improving mechanical properties, the (A1) resin containing a weakly acidic group preferably contains the (A1y) resin. From the viewpoints of improving sensitivity during exposure, suppressing residues after development, and improving mechanical properties, the (A1y) resin preferably contains one or more selected from the group consisting of a phenol resin, polyhydroxystyrene, an epoxy resin containing a phenol group, and an acrylic resin containing a phenol group. The (A1y) resin can be either a single resin or a copolymer thereof.

[0154] From the viewpoints of improving the sensitivity during exposure, suppressing residues after development, and improving the reliability of the light-emitting element, the (A1y) resin preferably has at least one selected from the group consisting of (y1) structural units: structural units containing at least two phenolic hydroxyl groups; (y2) structural units: structural units containing a phenolic hydroxyl group and an aromatic group; and (y3) structural units: structural units containing a phenolic hydroxyl group and a second aromatic group, and more preferably has the (y1) structural unit and / or the (y2) structural unit. Further, from the viewpoints of improving the sensitivity during exposure, suppressing residues after development, improving mechanical properties, and improving the reliability of the light-emitting element, the (A1y) resin preferably has the (y1) structural unit.

[0155] At least two phenolic hydroxyl groups in the (y1) structural unit are bonded to the same aromatic ring or different aromatic rings, preferably bonded to different aromatic rings, and also preferably bonded to different aromatic rings in a condensed polycyclic structure. Here, the aromatic group in the (y2) structural unit is an aromatic group different from the aromatic ring to which the phenolic hydroxyl group is bonded. Further, the second aromatic group in the (y3) structural unit is an aromatic group other than the aromatic ring to which the phenolic hydroxyl group is bonded. The so-called second aromatic group is a term used to distinguish it from the aromatic group in the (y2) structural unit (referred to as an aromatic group different from the aromatic ring to which the phenolic hydroxyl group is bonded).

[0156] The phenolic resin is preferably a Novolac resin, a Resol resin, or a phenol aralkyl resin. The phenolic resin preferably has a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, an aromatic structure, or a heterocyclic structure.

[0157] The polyhydroxystyrene preferably has units derived from (meth)acrylate derivatives containing a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure, or units derived from styrene derivatives.

[0158] Examples of the epoxy resin containing a phenolic group include resins obtained by reacting a polyfunctional epoxy compound with a phenolic compound having an epoxy group-reactive group, and are preferably a Cardo resin containing a phenolic group or an epoxy-modified resin containing a phenolic group. The epoxy-modified resin containing a phenolic group is preferably an epoxy ester resin containing a phenolic group. The Cardo resin containing a phenolic group preferably has a condensed polycyclic structure or a condensed polycyclic heterocyclic structure. The epoxy resin containing a phenolic group preferably has a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or an aromatic structure.

[0159] As a phenol group-containing acrylic resin, for example, a resin obtained by further reacting the acrylic resin described below with a phenol compound having an addition-reactive group can be mentioned. In addition, a resin obtained by subjecting a copolymer component having a phenolic hydroxyl group and other copolymer components such as (meth)acrylic acid derivatives to radical copolymerization can also be mentioned. It should be noted that the phenol group-containing acrylic resin is a resin different from polyhydroxystyrene. The phenol group-containing acrylic resin preferably has units derived from (meth)acrylate derivatives containing a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure, or units derived from styrene derivatives.

[0160] The fused polycyclic structure, the fused polycyclic heterocyclic structure, the aromatic structure, or the heterocyclic structure in these resins is preferably a fluorene structure, an anthracene structure, a naphthalene structure, a tricyclo[5.2.1.0 2,6 decane structure, an adamantane structure, a xanthene structure, an isoindolinone structure, a biphenyl structure, a benzene structure, a bisphenol A structure, a bisphenol F structure, a bisphenol AF structure, an isocyanuric acid structure, or a triazine structure.

[0161] <(A2x) resin and (A2y) resin>

[0162] Regarding the resin in which (A2) does not have a weakly acidic group, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, and improving the mechanical properties, it is preferable to contain the (A2x) resin. From the viewpoints of improving the sensitivity during exposure and suppressing the residue after development, it is preferable to further contain the (A2y) resin. From the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, and improving the mechanical properties, the (A2x) resin preferably contains one or more selected from the group consisting of a resin having a polycyclic side chain, an acid-modified epoxy resin, and an acrylic resin. The (A2x) resin can be either a single resin or a copolymer thereof. On the other hand, from the viewpoints of improving the sensitivity during exposure and suppressing the residue after development, the (A2y) resin preferably contains one or more selected from the group consisting of a resin having a polycyclic side chain, an acid-modified epoxy resin, and an acrylic resin. The (A2y) resin can be either a single resin or a copolymer thereof.

[0163] From the viewpoint of improving the reliability of the light-emitting element, the resin containing a polycyclic side chain is preferably a Cardo resin having a fused polycyclic structure or a fused polycyclic heterocyclic structure. From the viewpoint of improving the reliability of the light-emitting element, the acid-modified epoxy resin is preferably an epoxy (meth) acrylate resin having a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure. From the viewpoint of improving the reliability of the light-emitting element, the acrylic resin preferably has a unit derived from a (meth) acrylate derivative containing a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure, or a unit derived from a styrene derivative. In addition, it is also preferred to have a unit derived from a (meth) acrylate derivative having an epoxy group. The fused polycyclic structure, the fused polycyclic heterocyclic structure, or the aromatic structure in these resins is preferably a fluorene structure, an anthracene structure, a naphthalene structure, a tricyclo[5.2.1.0 2,6 decane structure, an adamantane structure, a xanthene structure, an isoindolinone structure, a biphenyl structure, or a benzene structure.

[0164] From the viewpoints of reducing the taper of the pattern shape, improving the mechanical properties, and improving the reliability of the light-emitting element, the total content ratio of the (A1x) resin in the total 100% by mass of the (A) binder resin is preferably 10% by mass or more, more preferably 30% by mass or more, still more preferably 50% by mass or more, and particularly preferably 70% by mass or more. On the other hand, from the viewpoint of suppressing the residue after development, the total content ratio of the (A1x) resin is preferably 100% by mass or less, more preferably 90% by mass or less, still more preferably 80% by mass or less. In addition, from the viewpoints of suppressing the residue after development, reducing the taper of the pattern shape, and improving the mechanical properties, the total content ratio of the (A1y) resin is preferably 5.0% by mass or more, more preferably 10% by mass or more, still more preferably 20% by mass or more, and particularly preferably 30% by mass or more. On the other hand, from the viewpoint of improving the mechanical properties, the total content ratio of the (A1y) resin is preferably 70% by mass or less, more preferably 60% by mass or less, still more preferably 50% by mass or less. In addition, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, reducing the taper of the pattern shape, and improving the mechanical properties, the total content ratio of the (A2x) resin and the (A2x) resin is preferably 5.0% by mass or more, more preferably 10% by mass or more, still more preferably 20% by mass or more, and particularly preferably 30% by mass or more. On the other hand, from the viewpoint of improving the mechanical properties, the total content ratio of the (A2x) resin and the (A2y) resin is preferably 70% by mass or less, more preferably 60% by mass or less, still more preferably 50% by mass or less.

[0165] From the viewpoint of improving the properties brought by each resin, the content ratio of the (A) binder resin in all solid components of the photosensitive composition of the present invention is preferably 10% by mass or more. On the other hand, from the viewpoint of improving the properties brought by each resin, the content ratio of the (A) binder resin is preferably 75% by mass or less. It should be noted that all solid components of the composition refer to the total mass of all components except the solvent in the composition. In addition, for the solid component concentration, 1 g of the composition is heated at 150 °C for 30 minutes to evaporate and dry it, and the mass remaining after heating is measured, and it is calculated as the solid component concentration calculated from the mass before and after heating.

[0166] <(B) Free-radical polymerizable compound>

[0167] The photosensitive composition of the present invention preferably further contains a (B) free-radical polymerizable compound (hereinafter referred to as the "(B) compound") and / or an (F) crosslinking agent. The so-called (B) compound refers to a compound having a free-radical polymerizable group. Examples and preferred descriptions of the free-radical polymerizable group are as described in the above-mentioned (A) binder resin. From the viewpoints of promoting free-radical polymerization, improving the sensitivity during exposure, and improving the mechanical properties, the free-radical polymerizable group is preferably a (meth)acryloyl group. From the viewpoints of improving the sensitivity during exposure and improving the mechanical properties, the number of free-radical polymerizable groups possessed by the (B) compound is preferably 2 or more, more preferably 3 or more, and further preferably 4 or more. On the other hand, from the viewpoints of improving the mechanical properties and improving the reliability of the light-emitting element, the number of free-radical polymerizable groups is preferably 12 or less, more preferably 10 or less, further preferably 8 or less, and particularly preferably 6 or less.

[0168] When the photosensitive composition of the present invention contains the (A) binder resin and the (B) compound, when the total of the (A) binder resin and the (B) compound is set to 100 parts by mass, from the viewpoints of reducing the taper of the pattern shape, improving the mechanical properties, and improving the reliability of the light-emitting element, the content of the (A) binder resin is preferably 25 parts by mass or more, more preferably 35 parts by mass or more, and further preferably 45 parts by mass or more. On the other hand, from the viewpoints of improving the sensitivity during exposure and suppressing the residue after development, the content of the (A) binder resin is preferably 85 parts by mass or less, more preferably 80 parts by mass or less, and further preferably 75 parts by mass or less. In addition, when the total of the (A) binder resin and the (B) compound is set to 100 parts by mass, from the viewpoints of improving the above-mentioned properties, the content of the (B) compound is preferably 15 parts by mass or more. On the other hand, from the viewpoints of improving the above-mentioned properties, the content of the (B) compound is preferably 75 parts by mass or less.

[0169] In the case where the following (H) imide compound and the following (I) structure or (II) structure further have a radically polymerizable group, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, suppressing the residue after thermal curing, improving the mechanical properties, and improving the reliability of the light-emitting element, the photosensitive composition of the present invention preferably further contains (B) a radically polymerizable compound. In addition, in such a case, the (B) radically polymerizable compound preferably has at least one group selected from the group consisting of a styryl group, a cinnamoyl group, a maleimide group, a nadic imide group, a (meth)acryloyl group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms. By setting such a constitution, the crosslinking reaction between the following (H) imide compound and the (B) radically polymerizable compound is facilitated, and the effects of the above invention become remarkable.

[0170] <(B1) compound to (B5) compound>

[0171] From the viewpoints of improving the sensitivity during exposure and improving the mechanical properties, the photosensitive composition of the present invention preferably satisfies at least one of the following conditions (δ), (ε), and (ζ).

[0172] (δ) The (B) compound contains the following (B1) compound and (B2) compound

[0173] (ε) The (B) compound contains the following (B3) compound and (B4) compound

[0174] (ζ) The (B) compound contains the following (B1) compound or (B2) compound, and further contains the following (B3) compound or (B4) compound

[0175] (B1) compound: A compound having a structure of (I-b1): including a fused polycyclic alicyclic structure, an alicyclic structure, or a heterocyclic structure, and further having at least 2 radically polymerizable groups

[0176] (B2) compound: A compound having a structure of (I-b2): including a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure, and a structure of (II-b2): including an aliphatic structure, and further having at least 2 radically polymerizable groups

[0177] (B3) compound: A compound having at least 2 (meth)acryloyl groups, and further having a structure of (I-b3): connecting at least 2 (meth)acryloyl groups with a minimum number of 4 to 10 atoms and including an aliphatic structure

[0178] (B4) Compound: A compound having at least two (meth)acryloyl groups and further having a structure of (I-b4): a structure in which at least two (meth)acryloyl groups are connected with a minimum number of 11 to 45 atoms and contain an aliphatic structure.

[0179] From the viewpoint of improving the sensitivity during exposure, the (B1) compound preferably further has a structure of (II-b1): a structure containing an aliphatic structure. It should be noted that the (B3) compound and the (B4) compound are different compounds from the above-mentioned (B1) compound and (B2) compound, and do not have any structure containing a fused polycyclic alicyclic structure, an alicyclic structure or a heterocyclic structure, and a structure containing a fused polycyclic structure, a fused polycyclic heterocyclic structure or an aromatic structure.

[0180] In the case where the (B3) compound or the (B4) compound has two (meth)acryloyl groups, the minimum number of atoms in the above-mentioned (I-b3) structure or (I-b4) structure refers to the minimum number of carbon atoms and heteroatoms between the carbonyl carbons of the two (meth)acryloyl groups. It should be noted that the atoms bonded to the carbon atoms and heteroatoms between the carbonyl carbons are not included in the calculation of the minimum number of atoms. For example, when there are an oxygen atom, a propylene group and an oxygen atom between the carbonyl carbons, the minimum number of atoms is 5. In addition, in the case where the (B3) compound or the (B4) compound has three or more (meth)acryloyl groups, the above-mentioned minimum number of atoms refers to the minimum number of carbon atoms and heteroatoms connecting the carbonyl carbons of all (meth)acryloyl groups. Similarly, the atoms bonded to the carbon atoms and heteroatoms connecting the carbonyl carbons are not included in the calculation of the minimum number of atoms.

[0181] The above-mentioned (B) compound can obtain the effect of improving the crosslinking degree of the cured product through the generation of free radicals during exposure and heating. In addition, the effect of improving the crosslinking degree can be obtained through the reaction with the free radical polymerizable groups on the side chains and ends of the resin. Therefore, the effect of improving the mechanical properties becomes significant. In addition, it is inferred that the (B) compound having an aliphatic structure in the above-mentioned (II-b1) structure, (II-b2) structure, (I-b3) structure or (I-b4) structure inhibits ion migration and electromigration by reducing the low-molecular components derived from the (B) compound in the cured product, and improves the reliability of the light-emitting element by inhibiting the aggregation of metals such as electrodes.

[0182] From the viewpoints of reducing the taper of the pattern shape and improving the mechanical properties, it is also preferable that the (B) compound further contains a (B5) compound: a compound having a structure including a fused polycyclic structure or a fused polycyclic heterocyclic structure and further having at least two radically polymerizable groups. It should be noted that the (B5) compound is a compound different from the above-mentioned (B2) compound and does not have the above-mentioned (II-b2) structure.

[0183] (B) The compound also preferably contains one or more selected from the group consisting of the above-mentioned (B1) compound, (B2) compound, (B3) compound, (B4) compound, and (B5) compound. The preferred contents of these (B) compounds are also the same as above.

[0184] <(C) Photosensitizer>

[0185] The photosensitive composition of the present invention contains a (C) photosensitizer. The so-called (C) photosensitizer refers to a compound that undergoes bond cleavage, reaction, or structural change upon exposure to generate other compounds, thereby imparting positive or negative photosensitivity to the composition. (C) The photosensitizer preferably contains one or more selected from the group consisting of a (C1) diazonaphthoquinone compound (hereinafter referred to as the “(C1) compound”), a (C2) photoinitiator (hereinafter referred to as the “(C2) compound”), a (C3) photoacid generator (hereinafter referred to as the “(C3) compound”), and a (C4) photobase generator (hereinafter referred to as the “(C4) compound”). When imparting positive photosensitivity to the composition, it preferably contains the (C1) compound and / or the (C3) compound, and it is also preferable to further contain the (C2) compound or the (C4) compound. When imparting negative photosensitivity to the composition, it preferably contains the (C2) compound and / or the (C3) compound, and it is also preferable to further contain the (C1) compound or the (C4) compound.

[0186] When the total of the (A) binder resin and the (B) compound is 100 parts by mass, from the viewpoint of improving the sensitivity during exposure, the content of the (C) photosensitizer is preferably 1.0 part by mass or more. On the other hand, from the viewpoint of suppressing the residue after development, the content of the (C) photosensitizer is preferably 30 parts by mass or less.

[0187] <(C1) Diazonaphthoquinone compound>

[0188] The so-called (C1) compound refers to a compound that undergoes a structural change upon exposure to generate indene carboxylic acid and / or sulfoindene carboxylic acid. When the (C1) compound is contained, it is suitable for forming a positive pattern. During exposure, the acidic compound formed by the structural change of the (C1) compound makes the exposed portion of the film of the composition selectively soluble in an alkaline developer, so the effect of improving the resolution after development becomes significant.

[0189] (C1) The compound is preferably a 1,2-diazidonaphthoquinone-5-sulfonate (hereinafter referred to as "5-ester") or a 1,2-diazidonaphthoquinone-4-sulfonate (hereinafter referred to as "4-ester") of a compound having a phenolic hydroxyl group. From the viewpoint of improving the resolution after development, the (C1) compound preferably contains the 5-ester. From the viewpoint of improving the sensitivity during exposure, the (C1) compound preferably contains the 4-ester. From the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, and improving the resolution after development, the (C1) compound more preferably contains the 5-ester and the 4-ester.

[0190] From the viewpoint of improving the resolution after development, the total content ratio (hereinafter referred to as "esterification rate") of the 5-ester group and the 4-ester group in the (C1) compound in the total number of moles of the phenolic hydroxyl group, the 1,2-diazidonaphthoquinone-5-sulfonate group (hereinafter referred to as "5-ester group") and the 1,2-diazidonaphthoquinone-4-sulfonate group (hereinafter referred to as "4-ester group") is preferably 50 mol% or more, more preferably 55 mol% or more, and further preferably 60 mol% or more. On the other hand, from the viewpoint of improving the sensitivity during exposure, the esterification rate is preferably 100 mol% or less, more preferably 90 mol% or less, further preferably 80 mol% or less, and particularly preferably 70 mol% or less. For the (C1) compound, it is also preferable to mix two or more (C1) compounds having different esterification rates to make the above esterification rate.

[0191] From the viewpoint of improving the sensitivity during exposure, the total content ratio (hereinafter referred to as "low-ester substituent ratio") of the compound having one 5-ester group or 4-ester group in the molecule and the compound having two 5-ester groups or 4-ester groups in the molecule in the total 100 mol% of the (C1) compound is preferably 60 mol% or more, more preferably 70 mol% or more, and further preferably 80 mol% or more. On the other hand, from the viewpoint of improving the resolution after development, the low-ester substituent ratio is preferably 100 mol% or less, more preferably 95 mol% or less, and further preferably 90 mol% or less.

[0192] In addition, from the viewpoint of improving the sensitivity during exposure, the ratio of the low-ester substituent in the total 100 mol% of the (C1) compound is preferably 0 mol% or more, more preferably 10 mol% or more, further preferably 20 mol% or more, and particularly preferably 30 mol% or more. On the other hand, from the viewpoint of suppressing the residue after development, the low-ester substituent ratio is preferably less than 60 mol%, more preferably 50 mol% or less, and further preferably 40 mol% or less.

[0193] Examples of methods for producing the compound (C1) include a method of subjecting a compound having a phenolic hydroxyl group to an esterification reaction with naphthoquinonediazidesulfonic acid, a method of subjecting a compound having a phenolic hydroxyl group to an esterification reaction with naphthoquinonediazidesulfonyl chloride, etc. The naphthoquinonediazidesulfonyl chloride is preferably 1,2-naphthoquinonediazide-5-sulfonyl chloride or 1,2-naphthoquinonediazide-4-sulfonyl chloride.

[0194] <(C2) Photopolymerization Initiator>

[0195] The so-called (C2) compound refers to a compound that undergoes bond cleavage and / or reaction upon exposure and generates free radicals. When the (C2) compound is contained, it is suitable for forming a negative pattern. During exposure, even if the free radicals generated by the (C2) compound are trace, free radical polymerization of the above-mentioned (B) compound and the like is carried out in a chain reaction, so that the effect of improving the sensitivity during exposure becomes significant.

[0196] The (C2) compound is preferably a benzyl ketal compound, an α-hydroxy ketone compound, an α-amino ketone compound, a biimidazole compound, a phosphine oxide compound, an oxime ester compound, an acridine compound, a titanocene compound, a benzophenone compound, an acetophenone compound, an aromatic ketoester compound or a benzoate compound. From the viewpoint of improving the sensitivity during exposure and improving the mechanical properties, an α-hydroxy ketone compound, an α-amino ketone compound, a biimidazole compound, a phosphine oxide compound or an oxime ester compound is more preferred, and an oxime ester compound is further preferred.

[0197] The above-mentioned α-hydroxyketone compounds, α-aminoketone compounds, biimidazole compounds, phosphine oxide compounds and oxime ester compounds can generate free radicals during heating, and can improve the crosslinking degree of the cured product and promote the ring-closing reaction of the resin based on the interaction of hydroxyl, amino, imidazole structure, phosphine oxide structure or oxime ester structure, so the effect of improving mechanical properties becomes significant.

[0198] <(C3) Photoacid Generator>

[0199] The so-called (C3) compound refers to a compound that undergoes bond cleavage and / or reaction by exposure and generates an acid. In the case of containing the (C3) compound, it is suitable for forming a negative pattern from the viewpoint of promoting cationic polymerization, etc. On the other hand, in the case of a resin or the like having an acidic group protected by an acid dissociable group, it is suitable for forming a positive pattern from the viewpoint of freeing the acidic group by exposure, and the effect of improving the sensitivity during exposure becomes significant.

[0200] As the (C3) compound, for example, an ionic compound or a non-ionic compound can be cited. The ionic compound is preferably a triorganosulfonium salt-based compound. The non-ionic compound is preferably a halogen-containing compound, a diazomethane compound, a sulfone compound, a sulfonate compound, a carboxylate compound, a sulfonimide compound, a phosphate compound or a sulfone benzotriazole compound.

[0201] <(C4) photo-base generator>

[0202] The so-called (C4) compound refers to a compound that undergoes bond cleavage and / or reaction upon exposure to light and generates a base. In the case of containing a (C4) compound, from the viewpoint of promoting anionic polymerization and the like, it is suitable for forming a negative pattern. On the other hand, in the case of a resin or the like having an acidic group protected by an alkali-dissociable group, from the viewpoint of freeing the acidic group upon exposure to light, it is suitable for forming a positive pattern, and the effect of improving the sensitivity during exposure becomes remarkable.

[0203] As the (C4) compound, for example, an ionic compound or a non-ionic compound can be cited. The ionic compound is preferably a diazabicycloolefin salt-based compound, a triazabicycloolefin salt-based compound, an α-keto acid quaternary ammonium salt-based compound, a benzyl quaternary ammonium salt-based compound, a guanidine salt-based compound or a biguanide salt-based compound. The ionic compound preferably has a ketoprofen structure, an oxoxanthene structure, a benzofuran structure or a naphthalene structure. The non-ionic compound is preferably a nitrobenzyl carbamate compound, an anthryl carbamate compound, a benzoin-based carbamate compound, an anthraquinone-based carbamate compound, a hydroxycinnamide-based compound or a coumarinamide-based compound.

[0204] <(D) colorant>

[0205] The photosensitive composition of the present invention preferably further contains a (D) colorant. The so-called (D) colorant refers to a compound that colors by absorbing light having a wavelength in the visible light range (380 to 780 nm). The (D) colorant is preferably a pigment or a dye. From the viewpoint of suppressing external light reflection, the (D) colorant preferably contains a black agent or a mixture of two or more colorants. The black agent preferably contains an organic black pigment and / or an inorganic black pigment. The so-called black in the (D) colorant is as described in paragraphs

[0284] to

[0285] of International Publication No. 2019 / 087985.

[0206] From the viewpoints of suppressing reflection of external light and improving the reliability of the device, the content ratio of the (D) colorant in all solid components of the photosensitive composition of the present invention is preferably 5.0% by mass or more, more preferably 10% by mass or more, and further preferably 20% by mass or more. On the other hand, from the viewpoints of improving sensitivity during exposure and suppressing residues after development, the content ratio of the (D) colorant is preferably 70% by mass or less, and more preferably 50% by mass or less.

[0207] From the viewpoints of suppressing residues after development, reducing the taper of the pattern shape, and improving the reliability of the light-emitting device, the organic black pigment preferably contains at least one selected from the group consisting of benzofuranone-based black pigments, perylene-based black pigments, and azomethine-based black pigments. More preferably, the benzofuranone-based black pigment includes a compound having at least two benzofuran-2(3H)-one structures or at least two benzofuran-3(2H)-one structures that can share a benzene ring, their geometric isomers, their salts, or salts of their geometric isomers; the perylene-based black pigment includes a compound having a 3,4,9,10-perylenetetracarboxylic acid bisbenzimidazole structure, their geometric isomers, their salts, or salts of their geometric isomers; and the azomethine-based black pigment includes a compound having an azomethine structure and a carbazole structure or a salt thereof. The above-mentioned organic black pigments have a high transmittance at wavelengths in the ultraviolet region (e.g., 400 nm or less), so the effect of improving sensitivity during exposure becomes significant.

[0208] The organic black pigment is also preferably an anthraquinone-based black pigment, an aniline-based black pigment, an azo-based black pigment, or carbon black. Carbon black is preferably subjected to resin coating, dye coating, oxidation treatment, surface modification with an organic group having an ionic group, or surface treatment with a sulfonic acid group.

[0209] From the viewpoints of suppressing residues after development and reducing the taper of the pattern shape, the mixture of two or more colorants preferably contains a mixture of two or more color pigments and / or a mixture of two or more color dyes. More preferably, two or more colors include blue and / or purple, and include red and orange. The color pigment is an anthraquinone-based pigment, a diketopyrrolopyrrole-based pigment, a perylene-based pigment, an isoindoline-based pigment, an isoindolinone-based pigment, an imidazolone-based pigment, a quinacridone-based pigment, a pyranthron-based pigment, a phthalocyanine-based pigment, an indanthrone-based pigment, or a dioxazine-based pigment; and the color dye is a squarylium-based dye, a xanthene-based dye, a triarylmethane-based dye, or a phthalocyanine-based dye.

[0210] From the viewpoint of improving the reliability of the component, the average primary particle diameter of the pigment is preferably 20 nm or more. On the other hand, from the viewpoints of suppressing reflection of external light and improving the reliability of the component, the average primary particle diameter of the pigment is preferably 150 nm or less.

[0211] From the viewpoints of suppressing residues after development and reducing the taper of the pattern shape, the inorganic black pigment preferably contains one or more selected from the group consisting of nitrides containing a metal element, carbides containing a metal element, and oxynitrides containing a metal element (hereinafter referred to as "specific inorganic black pigments"), and the metal element is one or more selected from the group consisting of zirconium, vanadium, niobium, hafnium, and tantalum. More preferably, it contains one or more selected from the group consisting of nitrides, carbides, and oxynitrides of zirconium, vanadium, niobium, hafnium, or tantalum. Further, from the viewpoint of improving the sensitivity during exposure, it is more preferably contains one or more selected from the group consisting of zirconium nitride, zirconium carbide, and zirconium oxynitride. Zirconium nitride, zirconium carbide, and zirconium oxynitride have high transmittance at wavelengths in the ultraviolet region, so the effect of improving the sensitivity during exposure becomes significant.

[0212] The specific inorganic black pigment preferably contains an element such as zirconium, vanadium, niobium, hafnium, or tantalum as a main component element. It should be noted that the main component element refers to the element that is most contained by mass among the constituent elements. From the viewpoints of suppressing reflection of external light and improving the reliability of the component, the specific inorganic black pigment preferably contains an element different from the main component element, and more preferably contains B, Al, Si, Mn, Co, Ni, Fe, Cu, Zn, or Ag.

[0213] For each compound particle such as zirconium nitride particles contained in the specific inorganic black pigment, the crystallite size can be calculated from the half-value width of the peak from the (111) plane in the X-ray diffraction spectrum using CuKα rays as the X-ray source. From the viewpoints of suppressing reflection of external light and improving the reliability of the component, the crystallite size is preferably 5.0 nm or more. On the other hand, from the viewpoints of improving the sensitivity during exposure and suppressing reflection of external light, the crystallite size is preferably 60 nm or less. It should be noted that the crystallite size of the particle powder, the crystallite size of the particles in the dispersion, and the crystallite size of the particles in the film can be determined based on the methods described in paragraphs

[0172] to

[0179] of International Publication No. 2021 / 182499.

[0214] Regarding the photosensitive composition of the present invention, it is also preferable that the pigment has a coating layer. The so-called coating layer refers to a layer covering the surface of the pigment. For example, a layer formed by surface treatment based on a silane coupling agent or resin coating treatment can be cited. By making the pigment have a coating layer, the effects of suppressing residues after development, reducing the taper of the pattern shape, and improving the reliability of the light-emitting element become significant. The coating layer preferably has one or more selected from the group consisting of a silica coating layer, a metal oxide coating layer, and a metal hydroxide coating layer.

[0215] <(E) Dispersant>

[0216] The photosensitive composition of the present invention also preferably further contains an (E) dispersant. The so-called (E) dispersant refers to a compound having a structure that interacts with the surface of the pigment and a structure that hinders the approach of pigments to each other. From the viewpoint of improving the dispersion stability of the pigment, the (E) dispersant preferably has a basic group, an acidic group, or a salt structure thereof, and more preferably has a basic group or a salt structure thereof.

[0217] <(F) Crosslinking Agent>

[0218] The photosensitive composition of the present invention preferably further contains a (B) compound and / or an (F) crosslinking agent. The so-called (F) crosslinking agent refers to a compound having a crosslinkable group, a cationic polymerizable group, or an anionic polymerizable group that can react with a resin or the like. From the viewpoints of improving the sensitivity during exposure and the mechanical properties, the (F) crosslinking agent preferably has one or more groups selected from the group consisting of an alkoxyalkyl group, a hydroxyalkyl group, an epoxy group, an oxetanyl group, and a blocked isocyanate group (hereinafter referred to as "specific crosslinkable groups"). The alkoxyalkyl group is preferably an alkoxymethyl group or an alkoxyethyl group, and more preferably a methoxymethyl group or a methoxyethyl group. The hydroxyalkyl group is preferably a hydroxymethyl group or a hydroxyethyl group. From the viewpoints of improving the sensitivity during exposure and the mechanical properties, the number of specific crosslinkable groups possessed by the (F) crosslinking agent is preferably 2 or more, more preferably 3 or more, further preferably 4 or more, and particularly preferably 6 or more. On the other hand, from the viewpoint of improving the mechanical properties, the number of specific crosslinkable groups is preferably 12 or less, more preferably 10 or less, and further preferably 8 or less.

[0219] When the total of the (A) binder resin and the (B) compound is set to 100 parts by mass, from the viewpoints of improving the sensitivity during exposure and the mechanical properties, the content of the (F) crosslinking agent is preferably 1.0 part by mass or more. On the other hand, from the viewpoints of suppressing residues after development and improving the mechanical properties, the content of the (F) crosslinking agent is preferably 30 parts by mass or less.

[0220] In the case where the following (H) imide compound and the following (I) structure or (II) structure further have a heat-reactive group, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, suppressing the residue after heat curing, improving the mechanical properties, and improving the reliability of the light-emitting element, the photosensitive composition of the present invention preferably further contains (F) a crosslinking agent. In such a case, the (F) crosslinking agent preferably has one or more groups selected from the group consisting of an alkoxyalkyl group, a hydroxyalkyl group, an epoxy group, an oxetanyl group, and a blocked isocyanate group. By setting the constitution in this way, the crosslinking reaction between the following (H) imide compound and the (F) crosslinking agent becomes easy, and the effects of the above invention become remarkable.

[0221] From the viewpoints of suppressing the residue after development and improving the mechanical properties, the (F) crosslinking agent preferably contains a (F1) compound: a compound having at least two phenolic hydroxyl groups and at least two specific crosslinkable groups and / or a (F2) compound: a compound having a structure containing a heterocyclic structure and at least two specific crosslinkable groups. The preferred contents of these (F) crosslinking agents are also the same as above.

[0222] From the viewpoint of improving the mechanical properties, the (F1) compound preferably has a structure in which at least two phenolic hydroxyl groups and specific crosslinkable groups are bonded to one aromatic structure, and more preferably has a structure in which at least two phenolic hydroxyl groups and at least two specific crosslinkable groups are bonded to one aromatic structure. From the viewpoint of improving the mechanical properties, the heterocyclic structure in the (F2) compound is preferably a nitrogen-containing cyclic structure, more preferably a cyclic structure having at least two nitrogen atoms, further preferably an isocyanuric acid structure, a triazine structure, a glycoluril structure, an imidazolidinone structure, a pyrazole structure, an imidazole structure, a triazole structure, a tetrazole structure, or a purine structure. The number of nitrogen atoms in the heterocyclic structure of the (F2) compound is preferably 1 or more, more preferably 2 or more, and further preferably 3 or more. On the other hand, the number of nitrogen atoms is preferably 6 or less, more preferably 4 or less.

[0223] <(G) Inorganic particles>

[0224] From the viewpoint of improving the reliability of the light-emitting element, the photosensitive composition of the present invention preferably further contains (G) inorganic particles. The so-called (G) inorganic particles refer to particles containing an element selected from the group consisting of a metal element, a metalloid element, and a semiconductor element as a main component. It should be noted that the so-called main component refers to the component that is contained in the largest amount on a mass basis among the constituent components. From the viewpoint of improving the reliability of the light-emitting element, the (G) inorganic particles preferably have a hydroxyl group and / or a silanol group on the particle surface. From the viewpoint of improving the reliability of the light-emitting element, the (G) inorganic particles preferably contain one or more selected from the group consisting of silica particles, alumina particles, titanium dioxide particles, vanadium oxide particles, chromium oxide particles, iron oxide particles, cobalt oxide particles, copper oxide particles, zinc oxide particles, zirconium oxide particles, niobium oxide particles, tin oxide particles, and cerium oxide particles. Further, from the viewpoint of suppressing external light reflection, silica particles are more preferably contained.

[0225] Regarding the silica particles, from the viewpoints of improving mechanical properties and the reliability of the light-emitting element, it is preferable to have a radically polymerizable group, a thermally reactive group, a hydroxyl group, a silanol group, an alkoxysilyl group, an alkylsilyl group, a dialkylsilyl group, a trialkylsilyl group, a phenylsilyl group, or a diphenylsilyl group on the particle surface. Further, from the viewpoint of improving mechanical properties, it is more preferable to have a radically polymerizable group or a thermally reactive group on the particle surface. Examples and preferred descriptions of the radically polymerizable group are as described in the above-mentioned (A) binder resin.

[0226] It is considered that the above-mentioned silica particles capture metal impurities, ionic impurities, etc. that have an adverse effect on electrical insulation by the acidity and negative charge of the hydroxyl group and / or silanol group on the particle surface. In addition, it is inferred that due to the firm structure of the particles, the captured impurities are continuously retained even during heat treatment or voltage application, thus improving the reliability of the light-emitting element. In addition, it is considered that the reflection and scattering of incident external light can be reduced by the silica particles biased on the surface of the cured product.

[0227] From the viewpoint of improving the reliability of the light-emitting element, the content of sodium element in the silica particles is preferably 1.0 mass ppm or more. On the other hand, from the viewpoint of improving the reliability of the light-emitting element, the content of sodium element in the silica particles is preferably 1,000 mass ppm or less. As the existence form of the sodium element, for example, ions (Na + ) or salts formed with silanol groups (Si-ONa) can be cited.

[0228] From the viewpoint of improving the reliability of the light-emitting element, the content ratio of (G) inorganic particles in all solid components of the photosensitive composition of the present invention is preferably 5.0% by mass or more. On the other hand, from the viewpoint of suppressing the residue after development, the content ratio of (G) inorganic particles is preferably 90% by mass or less.

[0229] <(H) imide compound>

[0230] The photosensitive composition of the present invention further contains (H) imide compound, and the (H) imide compound has at least two (I) structures: a structure formed by bonding a structure containing an imide bond and a cyclic structure having a phenolic hydroxyl group and / or a fluorine-substituted group, and also has a (II) structure: a structure connecting at least two (I) structures (wherein, the above-mentioned (A) binder resin is not included). It should be noted that the imide bond in the above-mentioned (I) structure does not include a hydroxyimide group. In the structure containing an imide bond in the above-mentioned (I) structure, the atom bonded to the cyclic structure in the (I) structure can be any atom among the nitrogen atom in the imide bond or other atoms in the structure containing an imide bond. It should be noted that the number of other atoms in the structure containing an imide bond bonded to the "*** structure" can be two or more. Sometimes, the (H) imide compounds having these structures are collectively referred to as specific (H) imide compounds.

[0231] From the viewpoints of improving the sensitivity during exposure and suppressing the residue after development, the structure containing an imide bond in the above-mentioned (I) structure is preferably an aromatic structure containing an imide bond, a condensed polycyclic structure containing an imide bond, an alicyclic structure containing an imide bond, an aliphatic structure containing an imide structure, a succinimide structure, a maleimide structure or a nadicimide structure, more preferably an aromatic structure containing an imide bond with 6 to 15 carbon atoms, a condensed polycyclic structure containing an imide bond with 6 to 20 carbon atoms, an alicyclic structure containing an imide bond with 4 to 10 carbon atoms, an aliphatic structure containing an imide structure with 1 to 6 carbon atoms, a succinimide structure, a maleimide structure or a nadicimide structure. It should be noted that the so-called "*** structure" containing an imide bond refers to a "*** structure" bonded with an imide bond or at least two "*** structures" connected by an imide bond. Here, in the "*** structure" bonded with an imide bond, the atom bonded to the "*** structure" can be any atom among the nitrogen atom in the imide bond or other atoms in the structure containing an imide bond. It should be noted that the number of other atoms in the structure containing an imide bond bonded to the "*** structure" can be two or more.

[0232] From the viewpoints of improving the sensitivity during exposure and suppressing residues after development, the cyclic structure in the above (I) structure is preferably an aromatic structure or a fused polycyclic structure, more preferably an aromatic structure having 6 to 15 carbon atoms or a fused polycyclic structure having 6 to 20 carbon atoms. The aromatic structure is preferably a biphenyl structure or a benzene structure. The fused polycyclic structure is preferably a fluorene structure, an anthracene structure, a naphthalene structure, a tricyclo[5.2.1.0 2,6 decane structure or an adamantane structure.

[0233] From the viewpoints of improving the sensitivity during exposure, suppressing residues after development, improving mechanical properties, and improving the reliability of the light-emitting element, the specific (H) imide compound preferably contains (H1) compound: a compound in which the cyclic structure in the above (I) structure is a cyclic structure having a fluorine-substituted group; and / or, (H2) compound: a compound in which the cyclic structure in the above (I) structure is an aromatic structure having a phenolic hydroxyl group. Further, from the viewpoints of suppressing water absorption, improving mechanical properties, and improving the reliability of the light-emitting element, it is more preferably to contain the (H1) compound, and it is also more preferably to contain the (H2) compound. In addition, from the viewpoints of improving the above-mentioned properties, it is further preferably to contain the (H1) compound and the (H2) compound.

[0234] From the viewpoints of improving the sensitivity during exposure, suppressing residues after development, improving mechanical properties, and improving the reliability of the light-emitting element, the specific (H) imide compound preferably contains (H1) compound: a compound in which the cyclic structure in the above (I) structure is a cyclic structure having a fluorine-substituted group; and / or, (H2) compound: a compound in which the cyclic structure in the above (I) structure is an aromatic structure having a phenolic hydroxyl group. Further, from the viewpoints of suppressing water absorption, improving mechanical properties, and improving the reliability of the light-emitting element, it is more preferably to contain the (H1) compound, and it is also more preferably to contain the (H2) compound. In addition, from the viewpoints of improving the above-mentioned properties, it is further preferably to contain the (H1) compound and the (H2) compound.

[0235] From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving mechanical properties, and improving the reliability of light-emitting elements, a specific (H) imide compound preferably contains: (H1x) compound: a compound in which the cyclic structure in the above (I) structure is a cyclic structure having a fluorine-substituted group and the above (II) structure is an ether bond; and / or, (H2y) compound: a compound in which the cyclic structure in the above (I) structure is an aromatic structure having a phenolic hydroxyl group and the above (II) structure is an alkylene group or a haloalkylene group. Further, from the viewpoints of suppressing water absorption, improving mechanical properties, and improving the reliability of light-emitting elements, it is more preferable to contain the (H1x) compound, it is also more preferable to contain the (H2y) compound, and it is also more preferable to contain the (H2z) compound described later. In addition, from the viewpoint of improving the above characteristics, it is further preferable to contain one or more selected from the group consisting of the (H1x) compound, the (H2y) compound, and the (H2z) compound.

[0236] Regarding a specific (H) imide compound, when the cyclic structure in the above (I) structure is a cyclic structure having a fluorine-substituted group, from the viewpoints of improving sensitivity during exposure, suppressing residues after development, suppressing water absorption, improving mechanical properties, and improving the reliability of light-emitting elements, the cyclic structure having a fluorine-substituted group is preferably a cyclic structure having a trifluoromethyl group, more preferably an aromatic structure having a trifluoromethyl group or a fused polycyclic structure having a trifluoromethyl group.

[0237] From the viewpoints of improving sensitivity during exposure, suppressing residues after development, improving mechanical properties, and improving the reliability of light-emitting elements, a specific (H) imide compound preferably contains a (H2z) compound: a compound in which the cyclic structure in the above (I) structure is an aromatic structure having a phenolic hydroxyl group and the above (II) structure is an alkylene group, a sulfonyl group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, an ether bond, a thioether bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a sub-cycloalkyl group, a sub-aryl group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group.

[0238] When the (A) binder resin contains one or more selected from the group consisting of the above polyimide resins having a weakly acidic group, and the polyimide resin having a weakly acidic group has a (DA1) first amine residue, the (DA1) first amine residue has at least two (Ia) structures and (IIa) structures, and further the (IIa) structure is the above specific structure,

[0239] From the viewpoints of improving the sensitivity during exposure, suppressing residues after development, improving mechanical properties, and improving the reliability of the light-emitting element, the (H) imide compound preferably contains the (H2) compound. Further, from the viewpoints of improving the above-described properties, the (H) imide compound more preferably contains the (H2z) compound.

[0240] From the viewpoints of improving the sensitivity during exposure, suppressing residues after development, improving mechanical properties, and improving the reliability of the light-emitting element, a specific (H) imide compound preferably contains one or more compounds selected from the group consisting of the compounds represented by General Formulas (15) to (17).

[0241] [Chemical Formula 4]

[0242]

[0243] In General Formula (15), R 101 and R 102 each independently represent a fluorine atom or a fluoroalkyl group having 1 to 10 carbon atoms. R 103 and R 104 each independently represent an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkenyloxy group having 2 to 10 carbon atoms, an acyl group having 1 to 10 carbon atoms, 1,1-bis(trifluoromethyl)hydroxymethyl, a mercapto group, or a sulfonic acid group. R 105 to R 108 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a group forming a ring. It should be noted that when a ring is formed by R 105 and R 106 , the number of carbon atoms of the ring members based on R 105 and R 106 is 3 to 10. Further, when a ring is formed by R 107 and R 108 , the number of carbon atoms of the ring members based on R 107 and R 108 is 3 to 10. The ring connected by the group forming a ring represents a monocyclic or fused polycyclic hydrocarbon ring. The hydrocarbon ring has an alicyclic structure or an aromatic structure. R 109 represents a halogen atom, an alkyl group having 1 to 6 carbon atoms, or a haloalkyl group having 1 to 6 carbon atoms. X 1 and X 2 each independently represent a direct bond, a hydrocarbon group, a hydrocarbon group containing an ether bond, or an amide group bonded to a hydrocarbon group. Y 1Represents a direct - connecting bond, an oxygen atom, a sulfur atom, a sulfonyl group, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a hydrocarbon group, a hydrocarbon group containing an ether bond, a fused polycyclic structure, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group or a hydrocarbon group containing a carbonylamide group. Each of a and b independently represents an integer from 0 to 4. Each of c and d independently represents an integer from 0 to 4. Each of e and f independently represents an integer from 0 to 3. g represents an integer from 0 to 6. It should be noted that 1≤a + c≤4, and 1≤b + d≤4. The dotted line represents a carbon - carbon single bond or a carbon - carbon double bond.

[0244] X in general formula (15) 1 and X 2 Among them, the hydrocarbon group in the hydrocarbon group, the hydrocarbon group containing an ether bond, and the amide group bonded with a hydrocarbon group is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, an arylene group having 6 to 15 carbon atoms, or an arylalkylene group having 10 to 20 carbon atoms. In Y 1 Among them, the hydrocarbon group in the hydrocarbon group and the hydrocarbon group containing an ether bond is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. In Y 1 Among them, the carbon atom number of the hydrocarbon group containing a carbonyloxy group and the hydrocarbon group containing a carbonylamide group is preferably 1 to 15, and the hydrocarbon group is preferably an aliphatic structure, an alicyclic structure, an aromatic structure, a fused polycyclic structure, or a fused polycyclic heterocyclic structure. The above - mentioned substituents and structures may have heteroatoms and may be either unsubstituted or substituted.

[0245] [Chemical formula 5]

[0246]

[0247] In general formulas (16) and (17), R 111 ~R 114 and R 151 ~R 154 each independently represents a fluorine atom or a fluoroalkyl group having 1 to 10 carbon atoms. R 115 ~R 118 and R 155 ~R 158 each independently represents an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkenyloxy group having 2 to 10 carbon atoms, an acyl group having 1 to 10 carbon atoms, 1,1 - bis(trifluoromethyl)hydroxymethyl, a mercapto group, or a sulfonic acid group. R 119 ~R 122 and R 159 ~R 162Each independently represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a ring-forming group. It should be noted that when a ring is formed by R 119 and R 120 , the number of carbon atoms of the ring members based on R 119 and R 120 is 3 to 10. Additionally, when a ring is formed by R 121 and R 122 , the number of carbon atoms of the ring members based on R 121 and R 122 is 3 to 10. When a ring is formed by R 159 and R 160 , the number of carbon atoms of the ring members based on R 159 and R 160 is 3 to 10. Additionally, when a ring is formed by R 161 and R 162 , the number of carbon atoms of the ring members based on R 161 and R 162 is 3 to 10. The ring connected by the ring-forming group represents a monocyclic or fused polycyclic hydrocarbon ring. The hydrocarbon ring has an alicyclic structure or an aromatic structure. R 123 , R 124 , R 163 and R 164 each independently represents a halogen atom, an alkyl group having 1 to 6 carbon atoms, or a haloalkyl group having 1 to 6 carbon atoms. W 3 and W 7 represent an organic group having a valence of 4 to 10. R 125 represents a group represented by the general formula (18) and the general formula (19). R 126 and R 166 represent a phenolic hydroxyl group, a sulfonic acid group, or a mercapto group. X 3 to X 6 and X 7 to X 10 each independently represents a direct bond, a hydrocarbon group, a hydrocarbon group containing an ether bond, or an amide group bonded to a hydrocarbon group. Y 3 , Y 5 , Y 7 and Y 9 each independently represents a direct bond, an oxygen atom, a sulfur atom, a sulfonyl group, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a hydrocarbon group, a hydrocarbon group containing an ether bond, a fused polycyclic structure, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group.

[0248] In the general formula (16), a, b, c and d each independently represent an integer of 0 to 4. e, f, g and h each independently represent an integer of 0 to 4. i, j, k and l each independently represent an integer of 0 to 3. m and n each independently represent an integer of 0 to 6. It should be noted that 1≤a+e≤4, and 1≤b+f≤4. In addition, 1≤c+g≤4, and 1≤d+h≤4. o represents an integer of 2 to 8, p represents an integer of 0 to 6, and 2≤o+p≤8. x represents an integer of 1 to 5. The dotted line portion represents a carbon-carbon single bond or a carbon-carbon double bond.

[0249] In the general formula (17), a, b, c and d each independently represent an integer of 0 to 4. e, f, g and h each independently represent an integer of 0 to 4. i, j, k and l each independently represent an integer of 0 to 3. m and n each independently represent an integer of 0 to 6. It should be noted that 1≤a+e≤4, and 1≤b+f≤4. In addition, 1≤c+g≤4, and 1≤d+h≤4. p represents an integer of 0 to 6. y represents an integer of 1 to 5. The dotted line portion represents a carbon-carbon single bond or a carbon-carbon double bond.

[0250] X in the general formula (16) and the general formula (17) 3 ~X 10 The hydrocarbon group, the hydrocarbon group containing an ether bond, and the hydrocarbon group in the amide group bonded with a hydrocarbon group are preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, an arylene group having 6 to 15 carbon atoms, or an arylalkylene group having 10 to 20 carbon atoms. 3 , Y 5 , X 7 and X 9 The hydrocarbon group and the hydrocarbon group containing an ether bond are preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. 3 , Y 5 , Y 7 and Y 9 In the formula (W), the carbon number of the hydrocarbon group containing the carbonyloxy group and the hydrocarbon group containing the carbonylamide group is preferably 1 to 15, and the hydrocarbon group is preferably an aliphatic structure, an alicyclic structure, an aromatic structure, a condensed polycyclic structure or a condensed polycyclic heterocyclic structure. 3 and W 7 It preferably has an aliphatic structure having 2 to 20 carbon atoms, an alicyclic structure having 4 to 20 carbon atoms, or an aromatic structure having 6 to 30 carbon atoms. 126 When the phenolic hydroxyl group is represented, W bonded to the phenolic hydroxyl group 3 Its structure contains an aromatic structure. 166 When the phenolic hydroxyl group is represented, W bonded to the phenolic hydroxyl group 7It contains an aromatic structure in its structure. W 3 and W 7 is sometimes also referred to as a carboxylic acid residue. x is preferably an integer of 2 to 4. y is preferably an integer of 2 to 4. The above-mentioned substituents and structures may have heteroatoms and may be either unsubstituted or substituted. The above-mentioned substituents and structures may have heteroatoms and may be either unsubstituted or substituted.

[0251] [Chemical formula 6]

[0252]

[0253] In general formulas (18) and (19), R 127 to R 129 each independently represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an acyl group having 2 to 6 carbon atoms, or an aryl group having 6 to 15 carbon atoms. In general formulas (18) and (19), R 127 to R 129 are each independently preferably a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an acyl group having 2 to 4 carbon atoms, or an aryl group having 6 to 10 carbon atoms. The above-mentioned substituents and structures may have heteroatoms and may be either unsubstituted or substituted.

[0254] In a specific (H) imide compound, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, suppressing the residue after thermal curing, improving the mechanical properties, and improving the reliability of the light-emitting element, the above-mentioned (I) structure or (II) structure preferably further has a radical polymerizable group and / or a thermal reactive group. Examples and preferred descriptions of the radical polymerizable group are as described in the above-mentioned (A) binder resin. It should be noted that the thermal reactive group is a group not included in the radical polymerizable group.

[0255] In a specific (H) imide compound, when the above-mentioned (I) structure or (II) structure further has a radical polymerizable group, the radical polymerizable group is preferably at least one group selected from the group consisting of a styryl group, a cinnamoyl group, a maleimide group, a nadic imide group, a (meth)acryloyl group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms. It should be noted that in the structure containing an imide bond in the above-mentioned (I) structure, the radical polymerizable group in the (I) structure may be any group among radical polymerizable groups such as a maleimide structure or a nadic imide structure or other radical polymerizable groups in the structure containing an imide bond.

[0256] In a specific (H) imide compound, when the above-mentioned (I) structure or (II) structure further has a thermal reactive group, the thermal reactive group is preferably at least one group selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, 1,1-bis(trifluoromethyl)hydroxymethyl, a mercapto group, a carboxyl group, a carboxylic anhydride group, a sulfonic acid group, an alkoxyalkyl group, a hydroxyalkyl group, an epoxy group, an oxetanyl group, and a blocked isocyanate group. It should be noted that, as described above, the hydroxyimide group is not included in the imide bond in the above-mentioned (I) structure.

[0257] From the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, suppressing the residue after thermal curing, improving the mechanical properties, and improving the reliability of the light-emitting element, the photosensitive composition of the present invention preferably contains a specific (H) imide compound having no radical polymerizable group and thermal reactive group, and a specific (H) imide compound having a radical polymerizable group and / or a thermal reactive group.

[0258] It is inferred that the above-mentioned specific (H) imide compound having a radical polymerizable group and / or a thermal reactive group forms a crosslinked structure with a resin or the like as a crosslinking agent. Therefore, the sublimates during thermal curing can be suppressed, and the effect of suppressing the residue after thermal curing becomes significant. Moreover, the effect of increasing the crosslinking degree of the cured product and promoting the ring-closure reaction of the resin can be obtained, and the effect of improving the mechanical properties becomes significant. In addition, it is inferred that the above-mentioned (I) structure contributes to the control of the polarization structure and charge balance in the cured product, and suppresses outgassing by improving the heat resistance of the cured product, thereby improving the reliability of the light-emitting element.

[0259] From the viewpoints of suppressing the residue after thermal curing, improving the mechanical properties, and improving the reliability of the light-emitting element, the molecular weight of the specific (H) imide compound is preferably 100 or more, more preferably 300 or more, further preferably 500 or more, and particularly preferably 700 or more. On the other hand, from the viewpoints of improving the sensitivity during exposure and suppressing the residue after development, the molecular weight is preferably less than 3,000, more preferably 2,000 or less, further preferably 1,500 or less, and particularly preferably 1,000 or less.

[0260] In the specific (H) imide compound, the above-mentioned (II) structure may have a repeating unit with a repeating number of 2 or more. In such a case, the specific (H) imide compound is a compound different from the polyimide resin in the above-mentioned (A) binder resin, and the molecular weight of the specific (H) imide compound is less than 3,000.

[0261] In addition, in the case where the above (II) structure has a repeating unit in a specific (H) imide compound, the weight-average molecular weight of the polyimide-based resin is measured by GPC and converted to polystyrene to be 4,000 or more. It should be noted that in such a case, the polyimide-based resin does not contain a compound having a molecular weight less than 3,000.

[0262] When the total of the (A) binder resin and the (B) compound is 100 parts by mass, from the viewpoints of improving the sensitivity during exposure, suppressing the residue after development, improving the mechanical properties, and improving the reliability of the light-emitting element, the content of the specific (H) imide compound is preferably 0.000010 part by mass or more, more preferably 0.00010 part by mass or more, still more preferably 0.00050 part by mass or more. In addition, it is preferably 0.0010 part by mass or more, more preferably 0.0050 part by mass or more, still more preferably 0.010 part by mass or more, particularly preferably 0.030 part by mass or more. In addition, it is preferably 0.050 part by mass or more, more preferably 0.10 part by mass or more, still more preferably 0.15 part by mass or more, particularly preferably 0.20 part by mass or more. On the other hand, from the viewpoint of improving the reliability of the light-emitting element, the content of the specific (H) imide compound is preferably 30 parts by mass or less, more preferably 20 parts by mass or less, still more preferably 10 parts by mass or less. In addition, it is preferably 7.0 parts by mass or less, more preferably 5.0 parts by mass or less, still more preferably 3.0 parts by mass or less, still more preferably 2.0 parts by mass or less, particularly preferably 1.0 part by mass or less.

[0263] <(I) carboxylic acid compound and carboxylic acid ester>

[0264] From the viewpoints of suppressing the residue after development, improving the mechanical properties, and improving the reliability of the light-emitting element, the photosensitive composition of the present invention preferably further contains an (I) carboxylic acid compound and a carboxylic acid ester, and the (I) carboxylic acid compound and the carboxylic acid ester contain a compound represented by the general formula (41) and satisfy the following condition (3).

[0265] (3) The total content of the (I) carboxylic acid compound and the carboxylic acid ester in all the solid components of the photosensitive composition is 0.010 mass% or more and 5.0 mass% or less.

[0266] [Chemical formula 7]

[0267]

[0268] In the general formula (41), R 21 and R 22 each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. R 23 and R24 Each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. a and b each independently represent an integer of 2 to 8. c represents an integer of 0 to 4. The above substituents and structures may have heteroatoms and may be either unsubstituted or substituted.

[0269] Examples of the (I) carboxylic acid compound and carboxylic acid ester include 4-hydroxybutyric acid, 5-hydroxypentanoic acid, 6-hydroxyhexanoic acid, 4-(4-hydroxybutyl)carbonyloxybutyric acid, 5-(5-hydroxypentyl)carbonyloxypentanoic acid, 6-(6-hydroxyhexyl)carbonyloxyhexanoic acid, methyl 4-hydroxybutyrate, ethyl 4-hydroxybutyrate, butyl 4-hydroxybutyrate, methyl 5-hydroxypentanoate, ethyl 5-hydroxypentanoate, butyl 5-hydroxypentanoate, methyl 6-hydroxyhexanoate, ethyl 6-hydroxyhexanoate, butyl 6-hydroxyhexanoate, ethyl 4-(4-hydroxybutyl)carbonyloxybutyrate, ethyl 5-(5-hydroxypentyl)carbonyloxypentanoate, or ethyl 6-(6-hydroxyhexyl)carbonyloxyhexanoate.

[0270] From the viewpoint of the effects of the above invention, the total content of the (I) carboxylic acid compound and carboxylic acid ester in all the solid components of the photosensitive composition is preferably 0.030% by mass or more, more preferably 0.050% by mass or more, further preferably 0.070% by mass or more, and particularly preferably 0.10% by mass or more. On the other hand, from the viewpoint of the effects of the above invention, the total content of the (I) carboxylic acid compound and carboxylic acid ester is preferably 4.0% by mass or less, more preferably 3.5% by mass or less, further preferably 3.0% by mass or less. In addition, it is preferably 2.5% by mass or less, more preferably 2.0% by mass or less, further preferably 1.5% by mass or less, still further preferably 1.0% by mass or less, particularly preferably 0.70% by mass or less, and most preferably 0.50% by mass or less.

[0271] It is considered that by containing a trace amount of the above (I) carboxylic acid compound and carboxylic acid ester, these compounds promote the surface modification action on the surface of the first electrode in the opening of the pixel division layer. Therefore, it is inferred that the effect of suppressing the residue after development becomes significant. In addition, these compounds function as catalysts for promoting the crosslinking reaction on the aromatic ring in resins having an aromatic ring such as polyimide, polybenzoxazole, and their precursors, the ring-closing reaction of the resin, and the crosslinking reaction in resins having a silanol group such as polysiloxane. Therefore, the effect of improving the mechanical properties becomes significant. Furthermore, these compounds have the function of a catalyst for promoting the crosslinking reaction in the film caused by a thermal reaction. Therefore, by increasing the crosslinking degree in the film, it contributes to the improvement of heat resistance and the suppression of outgassing, and thus the effect of improving the reliability of the light-emitting element becomes significant.

[0272] When the photosensitive composition of the present invention contains the above polyimide resin, from the viewpoint of improving the reliability of the light-emitting element, the photosensitive composition of the present invention preferably satisfies the condition of the above (3). When the photosensitive composition of the present invention satisfies the condition of the above (3), the polyimide resin more preferably contains a polyimide resin having a weakly acidic group.

[0273] <Content of specific nitrogen-containing compound>

[0274] From the viewpoints of improving mechanical properties and the reliability of the light-emitting element, the photosensitive composition of the present invention preferably further contains at least one selected from the group consisting of a cyclic amide compound represented by the general formula (20), an amide compound represented by the general formula (21), a cyclic urea compound represented by the general formula (22), a urea compound represented by the general formula (23), an oxazolidinone compound represented by the general formula (24), and an isoxazolidinone compound represented by the general formula (25) (hereinafter referred to as "specific nitrogen-containing compounds"), and satisfies the following condition (5).

[0275] (5) The total content of the cyclic amide compound represented by the general formula (20), the amide compound represented by the general formula (21), the cyclic urea compound represented by the general formula (22), the urea compound represented by the general formula (23), the oxazolidinone compound represented by the general formula (24), and the isoxazolidinone compound represented by the general formula (25) in all solid components of the photosensitive composition is 0.010% by mass or more and 5.0% by mass or less.

[0276] [Chemical formula 8]

[0277]

[0278] In the general formulas (20) to (25), R 46 ~R 56 each independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydroxyalkyl group having 1 to 6 carbon atoms. R 130 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, a hydroxyalkoxy group having 1 to 6 carbon atoms, a hydroxy group, an amino group, a monoalkylamino group having 1 to 6 carbon atoms, or a dialkylamino group having 2 to 12 carbon atoms. R 131 ~R 142Each independently represents an alkyl group having 1 to 6 carbon atoms. α, β, and γ each independently represent an integer of 0 to 6. a, b, c, e, f, g, h, i, j, k, l, and m each independently represent an integer of 0 to 2. When α is 0, a is 0. When β is 0, b is 0. When γ is 0, c is 0. The above substituents and structures may have heteroatoms and may be either unsubstituted or substituted.

[0279] As specific nitrogen-containing compounds, for example, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N-butyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-vinyl-2-pyrrolidone, N,N-dimethylformamide, N,N-diethylformamide, N,N-dimethylacetamide, N,N-dimethylpropionamide, N,N-dimethylisobutylamide, N,N-dimethyl-3-methoxypropionamide, N,N-dimethyl-3-butoxypropionamide, 1,3-dimethyl-2-imidazolidinone, 1,3-diethyl-2-imidazolidinone, N,N'-dimethylpropyleneurea, 1,1,3,3-tetramethylurea, or 1,1,3,3-tetraethylurea can be cited.

[0280] From the viewpoints of improving mechanical properties and the reliability of the light-emitting element, the total content of the specific nitrogen-containing compound in all solid components of the photosensitive composition is preferably 0.030% by mass or more, more preferably 0.050% by mass or more, further preferably 0.070% by mass or more, and particularly preferably 0.10% by mass or more. On the other hand, from the viewpoints of improving mechanical properties and the reliability of the light-emitting element, the total content of the specific nitrogen-containing compound is preferably 4.0% by mass or less, more preferably 3.5% by mass or less, further preferably 3.0% by mass or less. In addition, it is preferably 2.5% by mass or less, more preferably 2.0% by mass or less, further preferably 1.5% by mass or less, still more preferably 1.0% by mass or less, particularly preferably 0.70% by mass or less, and most preferably 0.50% by mass or less.

[0281] It is inferred that by containing a trace amount of the above specific nitrogen-containing compound, a nitrogen-containing structure having an unshared electron pair captures metal impurities, ionic impurities, etc. that have an adverse effect on electrical insulation, so ion migration and electromigration can be suppressed, and the reliability of the light-emitting element is improved. In addition, the specific nitrogen-containing compound functions as a catalyst for promoting crosslinking reactions on the aromatic ring in resins having an aromatic ring such as polyimide, polybenzoxazole, and their precursors, and crosslinking reactions in resins having a silanol group such as polysiloxane. Therefore, the effect of improving mechanical properties becomes significant.

[0282] When the photosensitive composition of the present invention contains the above-mentioned polyimide resin, from the viewpoint of improving the reliability of the light-emitting element, the photosensitive composition of the present invention preferably satisfies the condition of the above-mentioned (5). When the photosensitive composition of the present invention satisfies the condition of the above-mentioned (5), the polyimide resin more preferably contains a polyimide resin having a weakly acidic group.

[0283] <Water content>

[0284] From the viewpoints of improving the sensitivity during exposure and the reliability of the light-emitting element, the photosensitive composition of the present invention preferably further contains water and satisfies the following condition (4).

[0285] (4) The content of water in the photosensitive composition is 0.010% by mass or more and 3.0% by mass or less.

[0286] From the viewpoints of improving the sensitivity during exposure and the reliability of the light-emitting element, the content of water in the photosensitive composition is preferably 0.030% by mass or more, more preferably 0.050% by mass or more, further preferably 0.070% by mass or more, and particularly preferably 0.10% by mass or more. On the other hand, from the viewpoints of improving the sensitivity during exposure and the reliability of the light-emitting element, the water content is preferably 2.5% by mass or less, more preferably 2.2% by mass or less, further preferably 2.0% by mass or less. In addition, it is preferably 1.7% by mass or less, more preferably 1.5% by mass or less, further preferably 1.2% by mass or less, still more preferably 1.0% by mass or less, particularly preferably 0.70% by mass or less, and most preferably 0.50% by mass or less.

[0287] It is inferred that the above-mentioned water captures metal impurities, ionic impurities, etc. that have an adverse effect on electrical insulation by means of interactions such as the dipole moment and hydrogen bond of water molecules, so ion migration and electromigration can be inhibited, and the reliability of the light-emitting element is improved.

[0288] <Content of fluorine element>

[0289] From the viewpoints of suppressing the residue after development and improving the reliability of the light-emitting element, the photosensitive composition of the present invention preferably satisfies the following condition (1a). The photosensitive composition of the present invention more preferably further satisfies the following condition (2a).

[0290] (1a) The content of fluorine element in all solid components of the photosensitive composition is 1,000 mass ppm or less

[0291] (2a) The content of fluoride ions in all solid components of the photosensitive composition is 1,000 mass ppm or less.

[0292] From the viewpoint of the effects of the above invention, the content of fluorine element in all solid components of the photosensitive composition is preferably 0 mass ppm or more, more preferably 0.010 mass ppm or more, still more preferably 0.030 mass ppm or more, further more preferably 0.050 mass ppm or more, particularly preferably 0.070 mass ppm or more, and most preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of the effects of the above invention, the content of fluorine element is preferably 1,000 mass ppm or less, more preferably 500 mass ppm or less, still more preferably 300 mass ppm or less, particularly preferably 100 mass ppm or less. In addition, the content of fluorine element is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, still more preferably 10 mass ppm or less, further more preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0293] The preferred ranges of the content of fluoride ions in all solid components of the photosensitive composition are also the same as the preferred ranges of the content of fluorine element in all solid components of the photosensitive composition described above, respectively.

[0294] When the photosensitive composition of the present invention has the constitution of the above [3], from the viewpoint of the effects of the above invention, the photosensitive composition of the present invention preferably satisfies the condition of the above (1a), and more preferably further satisfies the condition of the above (2a).

[0295] Similarly, in a specific (H) imide compound, when the above (II) structure is an alkylene group, a sulfonyl group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, an ether bond, a thioether bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a subcycloalkyl group, an arylene group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group, from the viewpoint of the effects of the above invention, the photosensitive composition of the present invention preferably satisfies the condition of the above (1a), and more preferably further satisfies the condition of the above (2a).

[0296] Similarly, when a specific (H) imide compound contains a (H2z) compound, from the viewpoint of the effects of the above invention, the photosensitive composition of the present invention preferably satisfies the condition of the above (1a), and more preferably further satisfies the condition of the above (2a).

[0297] The content of fluorine element in all solid components of the photosensitive composition may be 0 mass ppm. The content of fluoride ions in all solid components of the photosensitive composition may also be 0 mass ppm. When the content of fluorine element in all solid components of the photosensitive composition and / or the content of fluoride ions in all solid components of the photosensitive composition is greater than 0 mass ppm, for the photosensitive composition of the present invention, preferably, (A) binder resin, (C) photosensitizer, (B) compound, (F) crosslinking agent or (H) imide compound has fluorine atoms or fluoride ions in the structure, or further contains a component containing fluorine element and / or a component containing fluoride ions.

[0298] The component containing fluorine element is preferably a phenolic compound, a fluoroalkyl compound, a fluorocycloalkyl compound or a fluoroaryl compound having a substituent containing a fluoroalkyl group. Among the components containing fluoride ions, as the cation species, ammonium ions, primary ammonium ions, secondary ammonium ions, tertiary ammonium ions or quaternary ammonium ions are preferably contained. The quaternary ammonium ion preferably has a linear or branched hydrocarbon group. The hydrocarbon group is preferably an alkyl group having 1 to 15 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms or a hydroxyalkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, and further preferably an alkyl group having 1 to 6 carbon atoms.

[0299] It is inferred that by making the content of the compound containing fluorine atoms in the structure, the component containing fluorine element, etc. in the photosensitive composition below a specific value, the content of fluorine element, fluoride ions or the fluorine element-containing anion derived from these components becomes below a specific value. Therefore, by the interaction such as hydrogen bonding of each component in the photosensitive composition, the protons in the photosensitive composition are locally activated. Therefore, it is considered that the effect of suppressing the residue at the bottom of the pattern edge is made significant by promoting the dissolution in the developer. In addition, it is considered that by deliberately making the content of the above components below a specific value, the polarization structure and charge balance in the cured product can be controlled. As a result, it is inferred that the reliability of the light-emitting element is improved by suppressing ion migration and electromigration caused by metal impurities and ionic impurities, which have an adverse effect on the light-emitting characteristics or electrical insulation. In addition, it is inferred that the reliability in the display device is improved due to the suppression of migration and aggregation of the metal in the electrode or the metal in the metal wiring.

[0300] <Other additives and solvents>

[0301] The photosensitive composition of the present invention preferably further contains a thermochromic agent, an oxidation chromogenic agent, a dissolution accelerator, an ink repellent, a sensitizer, a chain transfer agent, a polymerization inhibitor, a silane coupling agent, or a surfactant. These additives can be known additives. The photosensitive composition of the present invention preferably further contains a solvent. When the photosensitive composition of the present invention contains a pigment and also contains a dispersant, from the viewpoint of improving the dispersion stability of the pigment, the solvent is preferably a compound having an acetate bond, a propionate bond, or a butyrate bond.

[0302] <The photosensitive composition film and the photosensitive composition film of the present invention>

[0303] The photosensitive composition film of the present invention is a film in a semi-cured state (B stage) obtained by forming the photosensitive composition of the present invention into a film. The semi-cured state means a state where a crosslinked structure is not formed, or a crosslinked structure is formed by partial reaction but the film still has fluidity. For example, it can be a state where the solvent is distilled off by subjecting the coated film to reduced pressure drying after coating on a substrate or the like, or a state where the coated film is dried by heating at 40 to 150 °C, which is a state soluble in an alkaline solution or an organic solvent. The photosensitive composition film of the present invention preferably has a photosensitive composition film obtained by forming the photosensitive composition of the present invention and a support. Such a configuration is preferably set from the viewpoint of operability. The photosensitive composition film has positive or negative photosensitivity. The photosensitive composition film also preferably can form a self-supporting film with a single film. The photosensitive composition film preferably has adhesiveness and preferably joins multiple members. The ability to form a self-supporting film with a single film means that a film with a width of 1.5 cm or more, a length of 5.0 cm or more, and a thickness of 5.0 μm or more can be formed without a support. That is, the photosensitive composition film of the present invention is also preferably a photosensitive composition film capable of forming a self-supporting film with a single film. The support is preferably a flexible substrate and can also be a rigid substrate. The surface on the photosensitive film side of the support can be surface-treated with a silane coupling agent or the like. From the viewpoint of operability, the thickness of the support is preferably 10 to 200 μm.

[0304] <The cured product of the photosensitive composition of the present invention>

[0305] The cured product of the present invention is a cured product obtained by curing the photosensitive composition of the present invention. Curing means a state where a crosslinked structure is formed by reaction and the fluidity of the film disappears. The reaction is not particularly limited, such as a reaction based on heating, a reaction based on irradiation with energy rays, etc., and is preferably a reaction based on heating. The state where a crosslinked structure is formed by heating and the fluidity of the film disappears is called thermal curing. As the heating conditions, for example, conditions such as heating at 150 to 500 °C for 5 to 300 minutes. The cured product of the present invention can also be a cured product obtained by curing the photosensitive film of the present invention.

[0306] From the viewpoints of suppressing reflection of external light and improving the reliability of the component, the optical density at the wavelength of visible light per 1 μm film thickness of the cured product of the present invention is preferably 0.20 or more, more preferably 0.50 or more, and still more preferably 1.0 or more. On the other hand, from the viewpoints of improving the sensitivity during exposure and improving the reliability of the component, the above optical density is preferably 3.0 or less, more preferably 2.0 or less, and still more preferably 1.5 or less. It should be noted that the optical density is preferably the optical density in the cured product obtained by heating the composition to cure it. By making the optical density within the above range, the incident external light can be blocked, so the effect of suppressing external light reflection becomes remarkable. In addition, photo-degradation of the cured product itself and the layer inside it can be suppressed, so the effect of improving the reliability of the component becomes remarkable.

[0307] From the viewpoints of improving the reliability of the component and low transmission loss, the dielectric loss tangent of the cured product of the present invention at a frequency of 1 GHz is preferably 0.00010 or more and 0.0100 or less. It should be noted that the dielectric loss tangent is a value measured by the resonator method using a split dielectric resonator (SPDR). On the other hand, from the viewpoints of improving the reliability of the component and low transmission loss, the dielectric constant of the cured product of the present invention at a frequency of 1 GHz is preferably 2.0 or more and 3.5 or less. The preferred ranges of the dielectric loss tangent and the dielectric constant of the cured product of the present invention at frequencies of 10 GHz, 30 GHz, and 70 GHz are also the same as above.

[0308] From the viewpoint of improving the reliability of the light-emitting element, the water absorption rate of the cured product of the present invention is preferably 0.10% by mass or more, more preferably 0.30% by mass or more. On the other hand, from the viewpoint of improving the reliability of the light-emitting element, the above water absorption rate is preferably 2.0% by mass or less, more preferably 1.5% by mass or less, still more preferably 1.0% by mass or less, still more preferably 0.70% by mass or less, and particularly preferably 0.50% by mass or less.

[0309] <Component and article having a cured product>

[0310] The element of the present invention includes the cured product of the present invention. In addition, the article of the present invention includes the cured product of the present invention. Examples of the article include electronic components, electronic devices, moving bodies, buildings, or windows. Examples of the electronic component include a semiconductor device, an antenna, a display device, a metal-clad laminate, a wiring substrate, a semiconductor package, an active component or a passive component including a semiconductor device. The photosensitive composition of the present invention is preferably used for forming an electronic component. Examples of the semiconductor device include a semiconductor device having a fan-out wafer-level package structure, a fan-out panel-level package structure, or a packaged antenna structure. Examples of the antenna include a microstrip antenna or a stripline antenna. Examples of the display device include an organic EL display, a quantum dot display, a micro light-emitting diode (hereinafter referred to as "LED") display, a Mini LED display, or a liquid crystal display. Examples of the metal-clad laminate include a printed circuit board.

[0311] The electronic component of the present invention includes the cured product of the present invention. In addition, the display device of the present invention includes the cured product of the present invention. The cured product of the present invention can have both excellent mechanical properties and excellent reliability of the light-emitting element. Therefore, the photosensitive composition of the present invention is preferably used for forming an insulating layer of a metal wiring, a protective layer of a metal wiring, or an interlayer insulating layer of a metal wiring in an electronic component. In addition, the photosensitive composition of the present invention is also preferably used for forming an interlayer insulating layer of a redistribution in a semiconductor device, and is also preferably used for forming an insulating layer of a metal wiring, a protective layer of a metal wiring, or an interlayer insulating layer between a metal wiring and a ground wire in an antenna, and is also preferably used for forming a pixel division layer, a planarization layer of a TFT, a protective layer of a TFT, an interlayer insulating layer of a TFT, or a gate insulating layer in an organic EL display, a quantum dot display, or a Micro LED display, and is also preferably used for forming an insulating layer of a metal wiring, a protective layer of a metal wiring, or a solder resist layer of a metal wiring in a metal-clad laminate.

[0312] <Hollow structure body>

[0313] The hollow structure body of the present invention includes the cured product of the present invention. The electronic component of the present invention preferably has the hollow structure body of the present invention. The hollow structure body of the present invention has a hollow structure support material and a hollow structure ceiling material. From the viewpoints of improving heat resistance and reliability, the hollow structure support material and the hollow structure ceiling material preferably contain the above-mentioned polyimide-based resin. The film thickness of the hollow structure support material is preferably 5 to 20 μm. The film thickness of the hollow structure ceiling material is preferably 10 to 50 μm. The photosensitive composition of the present invention is preferably used for forming a hollow structure body. The photosensitive film of the present invention is suitable for forming a hollow structure body. Examples of the electronic component having a hollow structure body include MEMS (Micro ElectroMechanical Systems).

[0314] <Display device>

[0315] Hereinafter, the display device of the present invention will be described. However, the present invention is not limited to the following embodiments, and various modifications can be made within the scope that can achieve the object of the invention and does not deviate from the gist of the invention.

[0316] The display device of the present invention has the configuration of the above

[20] . By setting the configuration as above, the display device of the present invention can provide a display device with excellent reliability of the light-emitting element. It is considered that this is because the above (XI) structure contributes to the control of the polarization structure and charge balance in the cured product. As a result, it is inferred that ion migration and electromigration caused by metal impurities and ionic impurities, which have an adverse effect on the light-emitting characteristics, can be suppressed. In addition, the effect of achieving excellent reliability of the light-emitting element is realized by suppressing the migration and aggregation of the metal in the electrode and wiring. That is, it is inferred that the effect of excellent migration resistance in electronic components, semiconductor devices, display devices, or metal-clad laminates can also be achieved.

[0317] The (XH) imide compound in the cured product is preferably the (H) imide compound in the above photosensitive composition or a compound having a structure derived from the (H) imide compound. The examples and preferred descriptions of the (XI) structure and (XII) structure in the (XH) imide compound in the cured product are the same as the examples and preferred descriptions of the (I) structure and (II) structure in the (H) imide compound in the above photosensitive composition. Known materials can be used for the substrate, the first electrode, the second electrode, the pixel division layer, the light-emitting layer, and the TFT planarization layer.

[0318] From the viewpoint of improving the reliability of the light-emitting element, the cured product in the display device of the present invention preferably satisfies the following condition (Xπ).

[0319] (Xπ) The content of the (XH) imide compound in the cured product is 0.0010% by mass or more and 5.0% by mass or less.

[0320] From the viewpoint of improving the reliability of the light-emitting element, the content of the (XH) imide compound in the cured product is preferably 0.0050% by mass or more, more preferably 0.0070% by mass or more, and further preferably 0.010% by mass or more. In addition, it is preferably 0.030% by mass or more, more preferably 0.050% by mass or more, further preferably 0.070% by mass or more, and particularly preferably 0.10% by mass or more. On the other hand, from the viewpoint of improving the reliability of the light-emitting element, the content of the (XH) imide compound is preferably 5.0% by mass or less, more preferably 4.5% by mass or less, and further preferably 4.0% by mass or less. In addition, it is preferably 3.5% by mass or less, more preferably 2.5% by mass or less, further preferably 1.5% by mass or less, still more preferably 1.0% by mass or less, and particularly preferably 0.50% by mass or less.

[0321] <Resin and Compound in Cured Product>

[0322] The display device of the present invention includes a cured product. The cured product in the display device of the present invention is preferably a cured product of a photosensitive composition, and more preferably contains a resin. The resin in the cured product preferably contains a resin (XA1) having a weakly acidic group and / or a resin (XA2) not having a weakly acidic group. The resin (XA1) having a weakly acidic group in the cured product is preferably the above-mentioned resin (A1) having a weakly acidic group or a resin having a structure derived from this resin. The resin (XA2) not having a weakly acidic group is preferably the above-mentioned resin (A2) not having a weakly acidic group or a resin having a structure derived from this resin. The examples and preferred descriptions of the resin in the cured product are the same as the examples and preferred descriptions of the above-mentioned (A) binder resin. The resin in the cured product can be any resin of the (A) binder resin in the composition or a resin having a structure derived from this resin.

[0323] <Method for Manufacturing Cured Product>

[0324] The method for manufacturing the cured product of the present invention includes: (1) a step of forming a coating film of the photosensitive composition of the present invention on a substrate; (2) a step of irradiating the coating film of the photosensitive composition with actinic radiation through a photomask; (3) a step of developing using a developer to form a pattern of the photosensitive composition; and (4) a step of heating the pattern to obtain a cured pattern of the photosensitive composition. It should be noted that, in these steps, the methods described in paragraphs

[0453] to

[0481] of International Publication No. 2019 / 087985 can be applied. The step of forming a coating film is preferably the following step: after coating, pre-baking is performed to form a film. The step of obtaining a cured pattern is preferably the following step: the pattern is heated to perform thermal curing.

[0325] Examples

[0326] Examples, reference examples, and comparative examples are given below to more specifically illustrate the present invention, but the present invention is not limited to these ranges. It should be noted that for the compounds using abbreviations in the following descriptions or tables, the names corresponding to the abbreviations are summarized in Table 1-2.

[0327] [Table 1-2]

[0328]

[0329] <Synthesis Examples of Each Resin>

[0330] As the (A) binder resin, the compositions of the resins obtained in Synthesis Examples 1 to 21 are summarized in Tables 1-3 to 1-4. For each resin, based on the methods described in known literature, the monomer compounds as monomers and the copolymerization ratios are appropriately changed, and they are synthesized using known methods. The copolymerization ratios of the monomers are as described in Tables 1-3 to 1-4.

[0331] The hydroxyl group-containing diamine (HA) having the following structure used in Synthesis Examples 10 and 11 was synthesized using a known method based on the synthesis method described in paragraphs

[0374] to

[0376] of International Publication No. 2016 / 056451, Example 1. It should be noted that the resins obtained in Synthesis Examples 10 and 11 using the hydroxyl group-containing diamine (HA) having the following structure are polyimide precursors having amidoester structural units, amic acid structural units, and imide ring-closed structural units.

[0332] [Chemical Formula 9]

[0333]

[0334] In Synthesis Examples 10 and 11, DFA as an esterifying agent was reacted with the amic acid structural units in the resin, so that the structure was converted into amidoester structural units having methyl groups.

[0335] In Synthesis Example 19, GMA having an epoxy group was reacted with the carboxyl group derived from MAA in the resin, so that all the epoxy groups of GMA underwent ring-opening addition.

[0336] [Table 1-3]

[0337]

[0338] [Table 1-4]

[0339] [Table 1-4]

[0340]

[0341] Regarding the resins obtained in each synthesis example and the resins used in each example, reference example, and comparative example, the structural units and structures of each resin are summarized in Table 2-1. It should be noted that for polyimide (PI-1) and (PI-3) to (PI-6); polyimide precursor (PIP-1) and (PIP-2); polybenzoxazole (PB-1); polybenzoxazole precursor (PBP-1); polyamideimide (PAI-1), the content of fluorine element in the resin structure is greater than 10,000 mass ppm. For polyimide (PI-2) and (PI-7) to (PI-9); polyimide precursor (PIP-3); and the resins in other synthesis examples, the content of fluorine element in the resin structure is 0 mass ppm.

[0342] [Table 2-1]

[0343]

[0344] <Preparation Examples of Each Pigment Dispersion Liquid>

[0345] As the pigment dispersion liquids, the compositions of the respective dispersion liquids obtained in Preparation Examples Bk-1 to Bk-3 are summarized in Table 2-2. Preparation Examples Bk-1 to Bk-3 prepared each pigment dispersion liquid by the following method. In addition, a list and description of the (D) colorants and (E) dispersants used in each example, reference example, and comparative example are summarized in Table 2-2.

[0346] Preparation of Pigment Dispersion Liquids (Bk-1) to (Bk-3) in Preparation Examples Bk-1 to Bk-3

[0347] Based on paragraphs

[0138] to

[0140] of International Publication No. 2022 / 196261 and the method described in Preparation Example 1, using the colorants described in Table 2-2 and a polyalkyleneamine-polyoxyalkylene ether-based dispersant, i.e., ADP, as the dispersant, a wet medium dispersion treatment was carried out in a circulation manner so that the average primary particle size of the pigment became the value described in Table 2-2. Then, filtration was carried out using a 0.80 μmφ filter to obtain pigment dispersion liquids (Bk-1) to (Bk-3) with a solid content concentration of 15 mass% and a colorant / dispersant = 100 / 35 (mass ratio). The average primary particle size of the pigment in the obtained pigment dispersion liquids is shown in Table 2-2. In addition, the average primary particle size of the pigment in the cured film, the crystal size of the pigment in the pigment dispersion liquid, and the crystal size of the pigment in the cured film are also shown in Table 2-2.

[0348] [Table 2-2]

[0349]

[0350] <Synthesis Example of Silicon Dioxide Particle Dispersion Liquid>

[0351] Synthesis Example 22: Synthesis of Dispersion of Silica Particles (SP-1)

[0352] Based on paragraphs

[0132] to

[0134] of International Publication No. 2022 / 196261 and the method described in Synthesis Example 3, a dispersion of silica particles (SP-1) was obtained using MEK-ST-40 as the silica particle dispersion, KBM-503 as the surface modifier, and MOP as the polymerization inhibitor. The functional group possessed by the silica particles (SP-1) as inorganic particles on the particle surface is methacryloyl. The distribution range of the primary particle size is 10 to 16 nm, the average primary particle size is 12 nm, the aspect ratio range is 1.0 to 1.1, the average aspect ratio is 1.1, and the sodium element content is 100 mass ppm.

[0353] <Evaluation Methods in Each Example, Reference Example, and Comparative Example>

[0354] The following shows the evaluation methods in each example, reference example, and comparative example. It should be noted that for a glass substrate (manufactured by Geomatec Co., Ltd.; hereinafter referred to as "ITO / Ag substrate") obtained by forming a 100-nm film of APC (silver / palladium / copper = 98.07 / 0.87 / 1.06 (mass ratio)) by sputtering on the glass and further forming a 10-nm film of ITO by sputtering on the upper layer of the APC layer, it was used after performing a 100-second UV-O3 washing treatment using a bench-top light surface treatment apparatus (PL16-110; manufactured by SEN Special Light Source Co., Ltd.). The TEMPAX glass substrate (manufactured by AGC TECHNO GLASS Co., Ltd.) and other substrates were used without performing pretreatment. In addition, for film thickness measurement, a surface roughness / profile shape measuring machine (SURFCOM1400D; manufactured by Tokyo Seimitsu Co., Ltd.) was used, and the film thickness was measured under the conditions of a measurement magnification of 10,000 times, a measurement length of 1.0 mm, and a measurement speed of 0.30 mm / s.

[0355] (1) Weight-average Molecular Weight of Resin

[0356] For the above polyimides (PI-1) to (PI-9), polyimide precursors (PIP-1) to (PIP-3), polybenzoxazoles (PB-1), polybenzoxazole precursors (PBP-1), and polyamide-imides (PAI-1), prepare a 0.10 mass% N-methyl-2-pyrrolidone solution of each resin. Using a GPC analyzer (Waters 2690; manufactured by Waters Corporation), use N-methyl-2-pyrrolidone obtained by dissolving lithium chloride and phosphoric acid at 0.050 mol / L each as the mobile phase, and measure and determine the weight-average molecular weight in terms of polystyrene. For other resins, use a GPC analyzer (HLC-8220; manufactured by TOSOH Corporation), use tetrahydrofuran or N-methyl-2-pyrrolidone as the mobile phase, and based on "JIS K7252-3 (2008)", measure and determine the weight-average molecular weight in terms of polystyrene using a method near room temperature.

[0357] (2) Imide ring closure rate and benzoxazole ring closure rate of the resin

[0358] Dissolve each of the above resins in GBL so that the concentration becomes 35 mass% to prepare a resin solution. Using a spin coater (1H-DX; manufactured by MIKASA Corporation), coat each resin solution on a silicon wafer, and then bake at 120 °C for 180 seconds to produce a resin film with a film thickness of 4 to 5 μm. Divide the silicon wafer with the resin film produced into two. For one of them, use a clean oven (CLH-21CD-S; manufactured by Koyo Thermo Systems Co., Ltd.), heat in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less at 140 °C for 30 minutes, and then further raise the temperature and heat at 320 °C for 60 minutes to completely close the imide ring (heated resin film). The other is used directly without heat treatment (resin film before heating). Using an infrared spectrophotometer (FT-720; manufactured by Horiba, Ltd.), measure the infrared absorption spectra transmitted through the resin films before and after heating. After confirming the presence of absorption peaks (near 1,780 cm -1 and near 1,377 cm -1 ) due to the imide structure of the polyimide, respectively determine the peak intensity (X) near 1,377 cm -1 before heating and the peak intensity (Y) near 1,377 cm -1 after heating. Calculate the imide ring closure rate in the resin film before heating from the following formula.

[0359] Imide ring closure rate [%] = (X / Y) × 100.

[0360] A resin film with a thickness of 4 to 5 μm was produced using the same method as above. The silicon wafer with the resin film was divided into two. For one of them, a heating plate with a buzzer (HPD-3000BZN; manufactured by AS ONE Corporation) was used to heat it at 320 °C for 30 minutes to completely close the benzoxazole ring (heated resin film). The other was used directly without heat treatment (resin film before heating).

[0361] Using an infrared spectrophotometer (FT-720; manufactured by Horiba, Ltd.), the infrared absorption spectra of the resin film before and after heating were measured. After confirming the presence of the absorption peak (the peak around 1,570 cm -1 due to the benzoxazole structure of polybenzoxazole, which is due to the stretching vibration of C=C(C=N)), the peak intensity (P) around 1,570 cm -1 before heating and the peak intensity (Q) around 1,570 cm -1 after heating were respectively obtained. The benzoxazole ring closure rate in the resin film before heating was calculated by the following formula.

[0362] Benzoxazole ring closure rate [%] = (P / Q) × 100.

[0363] The imide ring closure rates of the above-mentioned polyimides (PI-1) to (PI-9) measured by these methods were 100%. The imide ring closure rates of the polyimide precursors (PIP-1) to (PIP-3) were 10%, and their benzoxazole ring closure rates were 0%. The imide ring closure rate of the polyimide precursor (PIP-3) was 10%. The benzoxazole ring closure rate of polybenzoxazole (PB-1) was 60%. The benzoxazole ring closure rate of the polybenzoxazole precursor (PBP-1) was 0%. The imide ring closure rate of polyamideimide (PAI-1) was 100%, and the benzoxazole ring closure rate was 0%.

[0364] (3) Contents of imide compounds, specific nitrogen-containing compounds, and (I) carboxylic acid compounds and carboxylic acid esters in the composition or the cured film

[0365] The contents of (H) imide compounds in the composition, (XH) imide compounds in the cured film, specific nitrogen-containing compounds in the composition, and (I) carboxylic acid compounds and carboxylic acid esters in the composition were determined by gas chromatography-mass spectrometry and liquid chromatography-mass spectrometry using a standard curve based on a reference substance. It should be noted that the content in all solid components of the composition was calculated from the obtained measurement values and the following formula.

[0366] (Content in all solid components of the composition) = (Content in the composition) × 100 / (Solid component concentration of the composition [mass%]).

[0367] (4) Content of fluorine element in resin or composition

[0368] The content of fluorine element in resin or composition is measured by combustion ion chromatography under the following measurement conditions. For each of the above resins, after separation by gel permeation chromatography (hereinafter referred to as "GPC"), it is used. It should be noted that in the case where the resin is composed of resins with different structures of the structural units constituting the resin, each resin is also separated by GPC and then used. In addition, for the resin in the composition, in any case where the composition contains a single resin or resins with different structures of the structural units constituting the resin, the composition is extracted with dichloromethane. After ultracentrifugation, each resin is separated by GPC from the dichloromethane-insoluble matter and then used. The resin or composition is burned and decomposed in the combustion tube of the analytical device. After the generated gas is absorbed into the absorption liquid, a part of the absorption liquid is analyzed by ion chromatography. The case where there is no record of the element content means that the element cannot be detected. It should be noted that the content in all solid components of the composition is calculated from the obtained measured value and the following formula.

[0369] (Content in all solid components of composition) = (Content in composition) × 100 / (Solid component concentration of composition [mass%])

[0370] <Combustion and absorption conditions>

[0371] System: AQF-2100H, GA-210 (manufactured by Mitsubishi Chemical Corporation)

[0372] Electric furnace temperature: Inlet 900 °C, Outlet 1000 °C

[0373] Gas: Ar / O2 200 mL / min, O2 400 mL / min

[0374] Absorption liquid: 0.1 mass% H2O2

[0375] Absorption liquid volume: 5 mL

[0376] <Ion chromatography and anion analysis conditions>

[0377] System: ICS1600 (manufactured by DIONEX Corporation)

[0378] Mobile phase: 2.7 mmol / L Na2CO3, 0.3 mmol / L NaHCO3

[0379] Flow rate: 1.50 mL / min

[0380] Detector: Conductivity detector

[0381] Injection volume: 100 μL.

[0382] (5) Content of fluoride ions in the composition

[0383] The content of fluoride ions in the composition was measured by ion chromatography under the following measurement conditions. The composition was added to ultrapure water, shaken at room temperature, and the ionic components were extracted. After treating the extract with a solid-phase extraction column, the anionic components were analyzed by ion chromatography. When the anionic components could not be measured under the following Ion Chromatography Analysis Conditions 1, they were measured under the following Ion Chromatography Analysis Conditions 2. The case where there is no record of the ion content indicates that the ion was not detected. It should be noted that the content in all solid components of the composition was calculated from the obtained measured value and the following formula.

[0384] (Content in all solid components of the composition) = (Content in the composition) × 100 / (Solid component concentration of the composition [mass%])

[0385] <Ion Chromatography Analysis Conditions 1 (Anionic components)>

[0386] Apparatus: IC-2010 (manufactured by TOSOH Corporation)

[0387] Separation column: 4.6 mm φ × 100 mm, TSKgel Super IC-Anion HS

[0388] Eluent: Sodium bicarbonate

[0389] Column temperature: 40 °C

[0390] Detector: Conductivity meter

[0391] Sample injection volume: 250 μL

[0392] <Ion Chromatography Analysis Conditions 2 (Anionic components)>

[0393] Apparatus: IC-2010 (manufactured by TOSOH Corporation)

[0394] Separation column: 4.6 mm φ × 100 mm, TSKgel Super IC-Anion HS

[0395] Eluent: Sodium carbonate / Sodium bicarbonate

[0396] Column temperature: 40 °C

[0397] Detector: Conductivity meter

[0398] Sample injection volume: 250 μL.

[0399] (6) Content of water in the composition

[0400] For the water content in the composition, using a Karl Fischer moisture meter (MKS-520; manufactured by Kyoto Electronics Industry Co., Ltd.), with Karl Fischer reagent as the titrant, the determination was carried out by volumetric titration method based on "JIS K0113 (2005)".

[0401] (7) Sensitivity

[0402] Using an FPD / LSI inspection microscope (OPTIPHOT-300; manufactured by Nikon Corporation), the developed film's resolution pattern was observed. In the case of using a composition with positive photosensitivity, as an index of sensitivity, the optimum exposure dose (value of i-line illuminometer) that can form a space pattern equivalent to the opening with a size width of 20 μm in a 20-μm line-and-space pattern was determined. On the other hand, in the case of using a composition with negative photosensitivity, as an index of sensitivity, the exposure dose (value of i-line illuminometer) that can form a space pattern equivalent to the opening with a size width of 18 μm in a 20-μm line-and-space pattern was regarded as the sensitivity. The determination was made as follows, and the sensitivity of 90 mJ / cm 2 The following A+, A, B+, B, C+ and C were regarded as qualified.

[0403] A+: The sensitivity is 30 mJ / cm 2 The following

[0404] A: The sensitivity is greater than 30 mJ / cm 2 , and is 40 mJ / cm 2 The following

[0405] B+: The sensitivity is greater than 40 mJ / cm 2 , and is 50 mJ / cm 2 The following

[0406] B: The sensitivity is greater than 50 mJ / cm 2 , and is 60 mJ / cm 2 The following

[0407] C+: The sensitivity is greater than 60 mJ / cm 2 , and is 75 mJ / cm 2 The following

[0408] C: The sensitivity is greater than 75 mJ / cm 2 , and is 90 mJ / cm 2 The following

[0409] D: The sensitivity is greater than 90 mJ / cm 2 , and is 150 mJ / cm 2 The following

[0410] E: Sensitivity is greater than 150 mJ / cm 2 .

[0411] (8) Development residue

[0412] Using an FPD / LSI inspection microscope (OPTIPHOT-300; manufactured by Nikon Corporation), observe the resolution pattern of the developed film produced. As an index of development residue, observe the presence or absence of residue in the 20-μm line-and-space pattern, and calculate the area of the residue present in the opening. Judgment is made as follows, and A+, A, B+, B, C+, and C with the area of the residue being 20% or less are regarded as qualified.

[0413] A+: No residue

[0414] A: The area of the residue present is 3% or less

[0415] B+: The area of the residue present is greater than 3% and 6% or less

[0416] B: The area of the residue present is greater than 6% and 10% or less

[0417] C+: The area of the residue present is greater than 10% and 15% or less

[0418] C: The area of the residue present is greater than 15% and 20% or less

[0419] D: The area of the residue present is greater than 20% and 50% or less

[0420] E: The area of the residue present is greater than 50% and 100% or less.

[0421] (9) Light-shielding property (optical density value (hereinafter referred to as "OD value"))

[0422] Using the method described in Example 1 below, form a cured film of the composition on a TEMPAX glass substrate (manufactured by AGC TECHNO GLASS Co., Ltd.). Using a transmission densitometer (X-Rite 361T(V); manufactured by X-Rite), measure the incident light intensity (I0) and the transmitted light intensity (I) at three points in the plane of the cured film formed, respectively. As an index of the light-shielding property, calculate the OD value per 1-μm film thickness from the following formula, and calculate the average value of the OD values at three points in the plane.

[0423] OD value = log 10 (I0 / I).

[0424] (10) Water absorption rate

[0425] Using the method described in Example 1 below, a cured film of the composition was formed on a 6-inch diameter Si wafer with a film thickness of about 1 μm. The cured film was scraped off from the Si wafer, and about 10 mg was placed in an aluminum dish. Using a thermogravimetric analyzer (TGA-50; manufactured by Shimadzu Corporation), the temperature was raised to 100 °C at a rate of 10 °C / min under a nitrogen gas flow, and then thermogravimetric analysis was performed while maintaining at 100 °C for 10 minutes. The difference in mass after maintaining at 100 °C for 10 minutes and the mass before heating was calculated as the water absorption rate.

[0426] (11) Mechanical properties (elongation at break)

[0427] Using the method described in Example 1 below, a cured film of the composition was formed on a 6-inch diameter SiO2 / Si wafer with a film thickness of about 5 μm. The cured film was peeled off from the SiO2 / Si wafer using dilute hydrofluoric acid. The peeled cured film was cut into strips with a width of 1.5 cm and a length of 9.0 cm. Using a Tensilon (RTM-100; manufactured by Orientec Corporation), a tensile test was performed at a tensile speed of 50 mm / min under the conditions of a room temperature of 23.0 °C and a humidity of 45.0% RH to measure the elongation at break. It should be noted that for each sample, the measurement was performed on 10 strips. As an index of mechanical properties, the average value of the top 5 was calculated from the obtained results. The judgment was made as follows, and A+, A, B+, B, C+ and C with an elongation at break of 5.0% or more were regarded as qualified.

[0428] A+: Elongation at break is 30% or more

[0429] A: Elongation at break is 20% or more and less than 30%

[0430] B+: Elongation at break is 15% or more and less than 20%

[0431] B: Elongation at break is 10% or more and less than 15%

[0432] C+: Elongation at break is 7.5% or more and less than 10%

[0433] C: Elongation at break is 5.0% or more and less than 7.5%

[0434] D: Elongation at break is 1.0% or more and less than 5.0%

[0435] E: Elongation at break is less than 1.0% or cannot be measured.

[0436] (12) Reliability of light-emitting elements

[0437] By DC driving at 10 mA / cm2 The organic EL display fabricated by the method described in Example 1 below was made to emit light, and the presence or absence of non-light-emitting regions, luminance unevenness, and other light-emitting defects were observed. Additionally, as a durability test, the light extraction side of the light-emitting element was oriented upward and heated to 80 °C, and light with a wavelength of 365 nm and an illuminance of 0.6 mW / cm 2 was irradiated for 500 hours. After 500 hours, the organic EL display was made to emit light by DC driving at 10 mA / cm 2 and the change in the light-emitting characteristics was observed. As an index of the reliability of the light-emitting element, the area of the light-emitting region after the durability test was measured with the area of the light-emitting region before the durability test set as 100%. The determination was made as follows, and A+, A, B+, B, C+, and C with a light-emitting region area of 80% or more were regarded as qualified.

[0438] A+: The light-emitting region area is 100%

[0439] A: The light-emitting region area is 97% or more and less than 100%

[0440] B+: The light-emitting region area is 94% or more and less than 97%

[0441] B: The light-emitting region area is 90% or more and less than 94%

[0442] C+: The light-emitting region area is 85% or more and less than 90%

[0443] C: The light-emitting region area is 80% or more and less than 85%

[0444] D: The light-emitting region area is 60% or more and less than 80%

[0445] E: The light-emitting region area is less than 60%.

[0446] <Compounds Used in Each Example, Reference Example, and Comparative Example>

[0447] The structures of the compounds used in each example, reference example, and comparative example are shown below. The minimum number of atoms in the above (I-b4) structure of (b-5) is 31. (x-1) to (x-18) correspond to the above-mentioned specific (H) imide compounds. (r-1) to (r-3) are compounds used in the comparative examples. These compounds were synthesized by known methods. It should be noted that the compounds belonging to the (H2x) compound, (H2y) compound, or (H2z) compound among the specific (H) imide compounds are the following compounds respectively. Additionally, among the specific (H) imide compounds, the compounds belonging to the compounds with a repeating unit having a repetition number of 2 or more in the above (II) structure are (x-15) to (x-18).

[0448] (H2x) compounds: (x - 1), (x - 8), (x - 9), and (x - 11)

[0449] (H2y) compounds: (x - 4), (x - 10), (x - 12), (x - 14), and (x - 15)

[0450] (H2z) compounds: (x - 4) to (x - 7), (x - 10), and (x - 15) to (x - 18)

[0451] [Chemical Formula 10]

[0452]

[0453] [Chemical Formula 11]

[0454]

[0455] [Chemical Formula 12]

[0456]

[0457] [Chemical Formula 13]

[0458]

[0459] [Chemical Formula 14]

[0460]

[0461] [Chemical Formula 15]

[0462]

[0463] In addition, the compounds corresponding to specific nitrogen-containing compounds, (I) carboxylic acid compounds and carboxylic acid esters, and compounds containing fluorine elements used in each of the examples, reference examples, and comparative examples are summarized in Table 2-3.

[0464] [Table 2-3]

[0465] [Table 2-3]

[0466]

[0467] <Preparation of Photosensitive Composition>

[0468] Compositions 1 to 100 were prepared with the compositions described in Tables 3-1 to 3-8. In Tables 3-1 to 3-8, the values in parentheses represent the mass parts of the solid components of each component. When the composition contains a pigment, a formulation liquid not containing a pigment dispersion liquid is first prepared, and then the pigment dispersion liquid is mixed with the formulation liquid to prepare the composition. As the solvent, PGMEA / EL / GBL = 50 / 40 / 10 (mass ratio) was used, and the composition was prepared such that the solid component concentration of the composition became 20% by mass. The solution of the obtained composition was filtered through a 0.45 μm φ filter and then used.

[0469] <Example 1>

[0470] After applying Composition 1 on an ITO / Ag substrate using a spin coater (MS-A100; manufactured by MIKASA Co., Ltd.), a pre-baked film with a film thickness of about 1.8 μm was produced by pre-baking at 120 °C for 120 seconds using a hot plate with a buzzer (HPD-3000BZN; manufactured by AS ONE Co., Ltd.). For the produced pre-baked film, a small developing device for lithography (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.) was used, and spray development was performed using a 2.38 mass% TMAH aqueous solution or cyclopentanone, and the time (Breaking Point; hereinafter referred to as "BP") when the pre-baked film (unexposed portion) was completely dissolved was measured.

[0471] A pre-baked film was fabricated using the same method. For the fabricated pre-baked film, a two-sided alignment single-sided exposure apparatus (mask aligner PEM-6M; manufactured by Union Optical Co., LTD.) was used. Through a gray-scale mask for sensitivity measurement (MDRM MODEL 4000-5-FS; manufactured by Opto-Line International), patterning exposure was performed using the i-line (wavelength 365 nm), h-line (wavelength 405 nm), and g-line (wavelength 436 nm) of an ultra-high pressure mercury lamp. After exposure, a small-scale lithographic developing apparatus (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.) was used, and development was carried out using a 2.38 mass% TMAH aqueous solution, followed by rinsing with water for 30 seconds to fabricate a post-development film. The development time was set to 60 seconds, 90 seconds, or 120 seconds. It should be noted that when patterns could not be formed after development in the development using a 2.38 mass% TMAH aqueous solution with development times of 60 seconds, 90 seconds, and 120 seconds, an exposed film was fabricated in the same manner as the above method. After exposure, a small-scale lithographic developing apparatus (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.) was used, and development was carried out using cyclopentanone, followed by rinsing with water for 30 seconds to fabricate a post-development film. Similarly, the development time was set to 60 seconds, 90 seconds, or 120 seconds. For all the films with development times of 60 seconds, 90 seconds, and 120 seconds, the patterns after development were observed, and the optimal exposure dose (value of the i-line illuminometer) capable of forming a space pattern equivalent to the opening with a size width of 20 μm in a 20-μm line-and-space pattern was determined. Based on these results, the optimal development time (60 seconds, 90 seconds, or 120 seconds) and the optimal exposure dose at this development time were determined. For the patterns after exposure at the optimal exposure dose and development at the optimal development time, a high-temperature inert gas oven (INH-9CD-S; manufactured by Koyo Thermo Systems Co., Ltd.) was used to perform thermal curing at 200°C for 60 minutes to fabricate a cured film with a film thickness of approximately 1.2 μm. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less, the temperature was raised to 200°C at a heating rate of 3.5°C / min, heated at 200°C for 60 minutes, and then cooled to 50°C.

[0472] The cured film was analyzed using methods such as nuclear magnetic resonance spectroscopy, infrared spectroscopy, gas chromatography-mass spectrometry, liquid chromatography-mass spectrometry, and time-of-flight secondary ion mass spectrometry to analyze the structural units of the resin contained in the cured film and the structures of the compounds contained in the cured film. The cured film of Composition 1 contained the following resin and compound, including a resin having a structure derived from the resin contained in Composition 1 and a compound having a structure derived from the compound contained in Composition 1.

[0473] (XA1) Resin: A resin having phenolic hydroxyl groups and an imide structure in the structural unit; a resin having phenolic hydroxyl groups and an amidoester structure, an amic acid structure, and an imide structure in the structural unit; a phenolic resin having phenolic hydroxyl groups in the structural unit

[0474] (XH) Imide compound: A compound having two (XI) structures: a structure formed by bonding a phthalimide structure and a benzene structure having a trifluoromethyl group, and further having an (XII) structure: an ether bond.

[0475] <Fabrication of Organic EL Display>

[0476] Next, a method for fabricating an organic EL display will be described. Figure 1 A schematic diagram of the substrate used is shown. First, on a 38×46 mm non-alkali glass substrate 47, APC (silver / palladium / copper = 98.07 / 0.87 / 1.06 (mass ratio)) is formed into a 100 nm film as a non-transparent conductive metal layer by sputtering, and patterned by etching to form an APC layer. Further, on the upper layer of the APC layer, amorphous ITO is formed into a 10 nm film as a transparent conductive oxide film layer by sputtering, and a reflective electrode is formed as the first electrode portion 48 by etching. In addition, in order to take out the second electrode, an auxiliary electrode portion 49 ( Figure 1 of (1)) is also formed simultaneously. The obtained substrate is ultrasonically washed for 10 minutes using "Semico Clean" (registered trademark) 56 (manufactured by Furuuchi Chemical Co., Ltd.) and then washed with ultrapure water. Next, on this substrate, Composition 1 is coated using the above method and pre-baked. After patterning exposure, development, and rinsing are performed through a photomask having a specified pattern, heating is performed to cause thermal curing. It should be noted that the development time is set to 60 seconds, 90 seconds, or 120 seconds, and the optimal development time (60 seconds, 90 seconds, or 120 seconds) and the optimal exposure amount at this development time are obtained in advance. The pattern after exposure at the optimal exposure amount and development at the optimal development time is thermally cured at 200 °C for 60 minutes. The thermal curing conditions are as follows: in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less, the temperature is raised to 200 °C at a heating rate of 3.5 °C / min, heated at 200 °C for 60 minutes, and then cooled to 50 °C. Through the above method, a pixel division layer portion 50 having the following shape is defined in the effective area of the substrate: quadrilateral openings with a width of 70 μm and a length of 70 μm are arranged with a pitch of 175 μm in the width direction and a pitch of 175 μm in the length direction, and each opening exposes the first electrode Figure 1(2)). It should be noted that this opening portion ultimately becomes the light-emitting pixel of the organic EL display. Additionally, the effective area of the substrate is 16 mm square, and the pixel division layer portion 50 is formed with a thickness of approximately 1.5 μm.

[0477] Next, using the substrate on which the first electrode portion 48, the auxiliary electrode portion 49, and the pixel division layer portion 50 are formed, an organic EL display is fabricated. After performing nitrogen plasma treatment as a pre-treatment, an organic EL layer portion 51 including a light-emitting layer is formed by vacuum evaporation ([ Figure 1 (3)). It should be noted that the degree of vacuum during evaporation is 1×10 -3 Pa or less, and during evaporation, the substrate is rotated relative to the evaporation source. First, a 10-nm compound (HT-1) is evaporated as a hole injection layer, and a 50-nm compound (HT-2) is evaporated as a hole transport layer. Next, on the light-emitting layer, a compound (GH-1) as a host material and a compound (GD-1) as a dopant material are evaporated with a doping concentration of 10 vol% and a thickness of 40 nm. Then, a compound (ET-1) and a compound (LiQ) as electron transport materials are laminated with a thickness of 40 nm and a volume ratio of 1:1. It should be noted that the compounds used in the organic EL layer (compound (HT-1), compound (HT-2), compound (GH-1), compound (GD-1), compound (ET-1), and compound (LiQ)) are the same as the compounds described in paragraphs

[0599] to

[0600] of International Publication No. 2017 / 057281.

[0478] Next, after evaporating 2 nm of the compound (LiQ), 10 nm of MgAg (magnesium / silver = 10 / 1 (volume ratio)) is evaporated to form the second electrode portion 52, and a transparent electrode is formed ([ Figure 1 (4)). Then, in a low-humidity nitrogen atmosphere, a cover-shaped glass plate is bonded using an epoxy resin-based adhesive, thereby performing sealing, and four top-emission organic EL displays with a size of 5 mm square are fabricated on one substrate. It should be noted that the film thickness here refers to the value displayed by a quartz crystal oscillator film thickness monitor.

[0479] <Examples 2 to 95 and Comparative Examples 1 to 5>

[0480] Using the respective compositions shown in Tables 3-1 to 3-9, the same operations and evaluations as in Example 1 were carried out. The evaluation results thereof are collectively shown in Tables 3-1 to 3-9. It should be noted that in Examples 1 to 53 and Comparative Examples 1 to 5, the content of fluorine element in all solid components of the composition is greater than 1,000 mass ppm. In Examples 54 to 90, the content of fluorine element in all solid components of the composition is 0 mass ppm. In Examples 91 to 95, the content of fluorine element in all solid components of the composition is as described in Table 3-7. In addition, in each example, when using a composition having positive photosensitivity, the development time was set to 60 seconds, 90 seconds, or 120 seconds. Based on these results, the optimal development time (60 seconds, 90 seconds, or 120 seconds) and the optimal exposure amount at this development time were determined. The pattern after exposure at the optimal exposure amount and development at the optimal development time was thermally cured at 200 °C for 60 minutes. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less, the temperature was raised to 200 °C at a heating rate of 3.5 °C / min, heated at 200 °C for 60 minutes, and then cooled to 50 °C. On the other hand, when using a composition having negative photosensitivity, a photomask with the light-transmitting part and the light-shielding part reversed was used, and the development time was set to 1.3 times the measured BP. The pattern after exposure at the optimal exposure amount and development was thermally cured at 220 °C for 60 minutes. The thermal curing conditions were as follows: in a nitrogen atmosphere with an oxygen concentration of 20 mass ppm or less, the temperature was raised to 220 °C at a heating rate of 3.5 °C / min, heated at 220 °C for 60 minutes, and then cooled to 50 °C.

[0481] [Table 3-1]

[0482]

[0483] [Table 3-2]

[0484]

[0485] [Table 3-3]

[0486]

[0487] [Table 3-4]

[0488]

[0489] [Table 3-5]

[0490]

[0491] [Table 3-6]

[0492]

[0493] [Table 3-7]

[0494]

[0495] [Table 3-8]

[0496]

[0497] Comparative Examples 1 to 5 do not contain a specific (H) imide compound, so there are differences in various properties.

[0498] Description of Reference Numerals

[0499] 47 Non-alkali glass substrate

[0500] 48 First electrode portion

[0501] 49 Auxiliary electrode portion

[0502] 50 Pixel division layer portion

[0503] 51 Organic EL layer portion including a light-emitting layer

[0504] 52 Second electrode portion

Claims

1. A photosensitive composition comprising a (A) binder resin and a (C) photosensitizer, the photosensitive composition further comprising a (H) imide compound, The (H) imide compound has at least two (I) structures: a structure formed by bonding a structure containing an imide bond and a cyclic structure having a phenolic hydroxyl group and / or a fluorine-substituted group, and also has a (II) structure: a structure connecting at least two of the (I) structures.

2. The photosensitive composition according to claim 1, wherein, The structure containing an imide bond in the (I) structure is an aromatic structure containing an imide bond, a condensed polycyclic structure containing an imide bond, an alicyclic structure containing an imide bond, an aliphatic structure containing an imide structure, a succinimide structure, a maleimide structure or a nadic imide structure, The cyclic structure in the (I) structure is an aromatic structure or a condensed polycyclic structure, The (II) structure is an alkylene group, a sulfonyl group, a condensed polycyclic structure, a hydrocarbon group containing an ether bond, a direct bond, an ether bond, a thioether bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a haloalkylene group, a subcycloalkyl group, an arylene group, a condensed polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group or a hydrocarbon group containing a carbonylamide group.

3. The photosensitive composition according to claim 1, wherein, The (A) binder resin contains at least one selected from the group consisting of (A1x-1) resin: polyimide, (A1x-2) resin: polyimide precursor, (A1x-3) resin: polybenzoxazole, (A1x-4) resin: polybenzoxazole precursor, (A1x-5) resin: polyamideimide, (A1x-6) resin: polyamideimide precursor, (A1x-7) resin: polyamide, and copolymers thereof (hereinafter referred to as "polyimide-based resins having weak acidic groups"), The polyimide-based resin having weak acidic groups has a (DA1) first amine residue: an amine residue having a phenolic hydroxyl group, and the (DA1) first amine residue has at least two (Ia) structures: a cyclic structure having a phenolic hydroxyl group, and also has a (IIa) structure: a structure connecting at least two of the (Ia) structures, The (IIa) structure is an alkylene group, a sulfonyl group, a condensed polycyclic structure, a hydrocarbon group containing an ether bond, an ether bond, a thioether bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a subcycloalkyl group, an arylene group, a condensed polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group or a hydrocarbon group containing a carbonylamide group, The (H) imide compound contains a (H2) compound: a compound in which the cyclic structure in the (I) structure is an aromatic structure having a phenolic hydroxyl group.

4. The photosensitive composition according to claim 3, wherein, The (A) binder resin satisfies the following condition (P1a), (P1a) The content of fluorine element in the structure of the (A) binder resin is 10,000 mass ppm or less.

5. The photosensitive composition according to claim 2, wherein, The (II) structure is an alkylene group, a sulfonyl group, a condensed polycyclic structure, a hydrocarbon group containing an ether bond, an ether bond, a thioether bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a subcycloalkyl group, an arylene group, a condensed polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group or a hydrocarbon group containing a carbonylamide group.

6. The photosensitive composition according to claim 1, wherein, The (H) imide compound contains a (H2z) compound: the cyclic structure in the (I) structure is an aromatic structure having a phenolic hydroxyl group, and the (II) structure is an alkylene group, a sulfonyl group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, an ether bond, a thioether bond, a carbonyl group, a carboxylic acid ester bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a sub-cycloalkyl group, a sub-aryl group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyloxy group, or a hydrocarbon group containing a carbonylamide group.

7. The photosensitive composition according to any one of claims 3 to 6, which satisfies the condition of the following (1a). (1a) The content of fluorine element in all solid components of the photosensitive composition is 1,000 mass ppm or less.

8. The photosensitive composition according to claim 1, wherein, The (H) imide compound contains a (H1) compound: the cyclic structure in the (I) structure is a cyclic structure having a fluorine-containing substituent.

9. The photosensitive composition according to claim 1, wherein, The (H) imide compound contains a (H1x) compound: the cyclic structure in the (I) structure is a cyclic structure having a fluorine-containing substituent, and the (II) structure is an ether bond.

10. The photosensitive composition according to any one of claims 3 to 6, 8, and 9, wherein, The (A) binder resin contains an (A1) resin containing a weakly acidic group, and the (A1) resin containing a weakly acidic group has a (WA) weakly acidic group: one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, 1,1-bis(trifluoromethyl)hydroxymethyl, and a mercapto group. The (A1) resin containing a weakly acidic group contains an (A1x) resin: a resin having one or more selected from the group consisting of an imide structure, an amide structure, an oxazole structure, and a siloxane structure in the structural unit of the resin. The (A1x) resin contains one or more selected from the group consisting of an (A1x-1) resin: polyimide, an (A1x-2) resin: polyimide precursor, an (A1x-3) resin: polybenzoxazole, an (A1x-4) resin: polybenzoxazole precursor, an (A1x-5) resin: polyamideimide, an (A1x-6) resin: polyamideimide precursor, an (A1x-7) resin: polyamide, and their copolymers. The (A1x) resin contains an amine residue having the (WA) weakly acidic group and / or a carboxylic acid residue having the (WA) weakly acidic group.

11. The photosensitive composition according to claim 10, wherein, The (A1x) resin contains a fluorinated amine residue and / or a fluorinated carboxylic acid residue, and the fluorinated amine residue and the fluorinated carboxylic acid residue have at least two fluorinated aromatic structures and a group connecting the at least two fluorinated aromatic structures. The group connecting the at least two fluorinated aromatic structures has an ether bond.

12. The photosensitive composition according to any one of claims 3 to 6, 8, and 9, wherein, The (A) binder resin contains an (A1) resin containing a weakly acidic group, and the (A1) resin containing a weakly acidic group has a (WA) weakly acidic group: one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, 1,1-bis(trifluoromethyl)hydroxymethyl, and a mercapto group. The (A) binder resin contains the (A1) resin containing a weakly acidic group and the (A2) resin not having a weakly acidic group. The (A1) resin containing a weakly acidic group includes the (A1x) resin: a resin having at least one selected from the group consisting of an imide structure, an amide structure, an oxazole structure, and a siloxane structure in the structural unit of the resin, and / or the (A1y) resin: a resin having a phenolic hydroxyl group in the structural unit of the resin. The (A2) resin not having a weakly acidic group includes the (A2x) resin: a resin having a radically polymerizable group and / or the (A2y) resin: a resin not having a radically polymerizable group.

13. The photosensitive composition according to any one of claims 1 to 6, 8, and 9, further comprising (I) a carboxylic acid compound and a carboxylic acid ester. The (I) carboxylic acid compound and carboxylic acid ester contain the compound represented by the general formula (41) and satisfy the condition (3) below. (3) The total content of the (I) carboxylic acid compound and carboxylic acid ester in all solid components of the photosensitive composition is 0.010% by mass or more and 5.0% by mass or less. [Chemical formula 1] In general formula (41), R 21 and R 22 each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; R 23 and R 24 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; a and b each independently represent an integer of 2 to 8; c represents an integer of 0 to 4.

14. The photosensitive composition according to any one of claims 1 to 6, 8, and 9, further comprising water and satisfying the condition (4) below. (4) The content of water in the photosensitive composition is 0.010% by mass or more and 3.0% by mass or less.

15. The photosensitive composition according to any one of claims 1 to 6, 8, and 9, wherein, The (I) structure or the (II) structure further has a radically polymerizable group and / or a thermally reactive group.

16. The photosensitive composition according to claim 15, further comprising (B) a radically polymerizable compound and / or (F) a crosslinking agent. When the (I) structure or the (II) structure further has a radically polymerizable group, the photosensitive composition contains the (B) radically polymerizable compound. When the (I) structure or the (II) structure further has a thermally reactive group, the photosensitive composition contains the (F) crosslinking agent.

17. A cured product obtained by curing the photosensitive composition according to any one of claims 1 to 6, 8, and 9.

18. A display device comprising the cured product according to claim 17.

19. A method for manufacturing a cured product, comprising: (1) a step of forming a coating film of the photosensitive composition according to any one of claims 1 to 6, 8, and 9 on a substrate; (2) a step of irradiating the coating film of the photosensitive composition with actinic radiation through a photomask; (3) a step of developing with a developer to form a pattern of the photosensitive composition; and (4) a step of heating the pattern to obtain a cured pattern of the photosensitive composition.

20. A display device having a substrate, a first electrode, a second electrode, a pixel division layer, a light-emitting layer, and a TFT planarization layer, wherein the pixel division layer and / or the TFT planarization layer contains an (XH) imide compound. The (XH) imide compound has at least two (XI) structures: a structure in which a structure containing an imide bond is bonded to a cyclic structure having a phenolic hydroxyl group and / or a fluorine-containing substituent, and also has an (XII) structure: a structure connecting at least two of the (XI) structures.

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