Portable electronic device carrier, system and method for controlling cooling provided by portable electronic device carrier

By designing a portable electronic device bracket with controllable cooling, combining airflow and direct contact cooling, the problem of low heat dissipation efficiency of portable electronic devices is solved, achieving efficient cooling and performance improvement.

CN120380437APending Publication Date: 2025-07-25RAZER ASIA PACIFIC
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Patent Information

Application Number
CN202380081890.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2022-11-30
Filing Date
2023-11-30
Publication Date
2025-07-25

AI Technical Summary

Technical Problem

The heat generated by portable electronic devices during use is difficult to effectively disperse, and the existing bracket cooling method is inefficient and cannot meet the performance requirements of the equipment.

Method used

A portable electronic device bracket is designed, including a main body, a cooling device, a controller and a communication interface. By actively controlling the cooling device, it provides controllable cooling, combining air flow and direct contact cooling mode to achieve flexible cooling management of the equipment.

Benefits of technology

It realizes efficient cooling of portable electronic devices, improves the performance and user experience of the equipment, and adapts to the cooling needs of different equipment models.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to a portable electronic device holder with controllable cooling. The stand includes: a main body having a device rest side; a cooling device disposed at the main body, the cooling device having a cooling interface exposed through the device resting side of the main body, where the cooling interface is capable of providing cooling to the portable electronic device when the portable electronic device is disposed at the device resting side; a controller connected to the cooling device to control the cooling device for providing cooling across a range of cooling levels via a cooling interface; and a communication interface connectable to the portable electronic device to communicatively interconnect the controller and the portable electronic device by communicating data between the controller and the portable electronic device, where the data is associated with cooling provided via the cooling interface of the cooling apparatus.
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Description

Technical Field

[0001] Various embodiments generally relate to a portable electronic device stand. In particular, various embodiments generally relate to a portable electronic device stand with controllable cooling. Various embodiments also relate to a system and method for controlling the cooling provided by a portable electronic device stand. Background Art

[0002] Heat dissipation is one of the main problems of portable electronic devices such as laptops, ultrabooks, tablets or smartphones. Under certain usage conditions, the heat generated by the chips inside a portable electronic device can be very large. Therefore, it may be beneficial to dissipate the heat generated within the limited space of a portable electronic device. For example, a laptop or an ultrabook may be able to inhale room temperature air and exhaust hot air from inside the laptop or ultrabook. Further, a portable electronic device can also be used with a portable electronic device stand that has been developed to help cool the portable electronic device. Some portable electronic device stands only prop up the portable electronic device. Some portable electronic device stands include one or more fan units that inhale ambient air and blow it towards the portable electronic device indiscriminately.

[0003] Therefore, there is a need for an improved portable electronic device stand that can provide more effective cooling. Summary of the Invention

[0004] According to various embodiments, there is provided a portable electronic device stand with controllable cooling. The stand includes: a body having a device resting side; a cooling device disposed at the body, the cooling device having a cooling interface exposed through the device resting side of the body, wherein when a portable electronic device is disposed on the device resting side, the cooling interface is capable of providing cooling to the portable electronic device; a controller connected to the cooling device to control the cooling device to provide cooling via the cooling interface over a range of cooling levels; and a communication interface connectable to the portable electronic device to communicatively interconnect the controller and the portable electronic device by transmitting data between the controller and the portable electronic device, wherein the data is associated with the cooling provided via the cooling interface of the cooling device.

[0005] According to various embodiments, a system for controlling cooling provided by a portable electronic device holder to a portable electronic device disposed thereon is provided. The system includes a portable electronic device holder. The holder includes: a body having a device resting side; a cooling device disposed at the body, the cooling device having a cooling interface exposed through the device resting side of the body, wherein when the portable electronic device is disposed on the device resting side, the cooling interface is capable of providing cooling to the portable electronic device; a controller connected to the cooling device to control the cooling device to provide cooling via the cooling interface over a range of cooling levels; and a communication interface connectable to the controller. The system further includes a portable electronic device, wherein the communication interface of the portable electronic device holder is connected to the portable electronic device to communicatively interconnect the controller of the portable electronic device holder and the portable electronic device by transmitting data between the controller and the portable electronic device, wherein the data is associated with the cooling provided via the cooling interface of the cooling device.

[0006] According to various embodiments, a method for controlling cooling provided by a portable electronic device holder to a portable electronic device displaced thereon is provided, wherein the portable electronic device holder includes: a body having a device resting side; a cooling device disposed at the body, the cooling device having a cooling interface exposed through the device resting side of the body, wherein when the portable electronic device is displaced on the device resting side, the cooling interface is capable of providing cooling to the portable electronic device; a controller connected to the cooling device to control the cooling device to provide cooling via the cooling interface over a range of cooling levels; and a communication interface connectable to the portable electronic device to communicatively interconnect the controller and the portable electronic device. The method includes: transmitting data between the controller of the portable electronic device holder and the portable electronic device via the communication interface, wherein the data is associated with the cooling provided via the cooling interface of the cooling device, wherein the data includes cooling level information of the cooling provided by the cooling device via the cooling interface, the cooling level information being transmitted from the controller to the device, wherein the data includes a control signal to control the cooling device to provide cooling via the cooling interface at a cooling level corresponding to the control signal, the cooling level being selected from the range of cooling levels, the control signal being transmitted from the portable electronic device to the controller.

[0007] According to various embodiments, a computer program including instructions is provided, which when executed by a portable electronic device disposed on and communicatively connected to a portable electronic device holder, causes the portable electronic device to perform a method of controlling cooling provided by the portable electronic device holder to the portable electronic device according to the method as described herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In the drawings, like reference numerals generally refer to like components throughout the different views. The drawings are not necessarily to scale, but rather generally focus on illustrating the principles of the present invention.

[0009] In the following description, various embodiments are described with reference to the following drawings, in which:

[0010] Figure 1 A schematic diagram of a portable electronic device holder according to various embodiments is shown;

[0011] Figure 2A An exploded view of a portable electronic device holder according to various embodiments is shown;

[0012] Figure 2B is another exploded view of a portable electronic device holder according to various embodiments;

[0013] Figure 3 A portable electronic device holder according to various embodiments is shown;

[0014] Figure 4 A flowchart of an example of a method for controlling cooling in a system is shown, by which a portable electronic device is set to a portable electronic device holder according to various embodiments, wherein the portable electronic device is connected to the portable electronic device holder;

[0015] Figure 5 A flowchart of another example of a method for controlling cooling in a system is shown, by which a portable electronic device is set to a portable electronic device holder according to various embodiments, wherein the portable electronic device is connected to the portable electronic device holder;

[0016] Figure 6 A flowchart of a further example of a method for controlling cooling in a system is shown, by which a portable electronic device is set to a portable electronic device holder according to various embodiments, wherein the portable electronic device is connected to the portable electronic device holder;

[0017] Figure 7 A flowchart of yet another example of a method for controlling cooling in a system is shown, by which a portable electronic device is set to a portable electronic device holder according to various embodiments, wherein the portable electronic device is connected to the portable electronic device holder. Detailed Description

[0018] The embodiments described below in the context of a device are similarly effective for the corresponding methods, and vice versa. In addition, it will be understood that the embodiments described below can be combined, for example, a part of one embodiment can be combined with a part of another embodiment.

[0019] It should be understood that terms such as "upper", "above", "top", "bottom", "downward", "side", "rear", "left", "right", "front", "lateral", "sideways", "upward", "down", etc., when used in the following description, are used for convenience and to assist in understanding relative position or orientation, and are not intended to limit the orientation of any device or structure or any part of any device or structure. Additionally, the singular terms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. Similarly, the word "or" is intended to include "and" unless the context clearly dictates otherwise.

[0020] Various embodiments generally relate to a portable electronic device stand (PED stand) for supporting a portable electronic device (PED) thereon. In particular, various embodiments generally relate to a PED stand having controllable cooling that can facilitate heat dissipation from the PED. Various embodiments also relate to a system for controlling the cooling provided by the PED stand and a method for controlling the cooling provided by the PED stand. Various embodiments also relate to a computer program for running on the PED to control the cooling of the PED. According to various embodiments, the PED may include a laptop, a thin and light laptop, a tablet computer, or a smart phone. According to various embodiments, the PED stand may include a riser type PED stand, a vertical stand type PED stand, or an angled type PED stand.

[0021] According to various embodiments, the PED stand may provide cooling to the PED received by the PED stand. The type of cooling may be based on providing an air flow for cooling and / or based on direct contact cooling. According to various embodiments, the PED stand and the PED may together form an ecosystem for controlling the cooling of the PED. For example, the PED and the PED stand may be communicatively interconnected, and software control algorithms may be implemented. Thus, software may be executed by the PED such that the software may allow control of the cooling provided by the PED stand via the PED. According to various embodiments, the ecosystem formed by the PED stand and the PED may provide various options to the user to control the cooling according to the user's preferences. Thus, the ecosystem may allow flexibility in how the cooling is controlled. For example, an option for controlling the cooling may be to cool the PED through a cooling device (e.g., a cooling hub or a cooling engine or a cooling mechanism) of the PED stand. Thus, the cooling device may be actively controlled to change or adjust or vary the cooling as needed. Another option for controlling the cooling may be to change the operating settings and / or load of the PED in order to adjust the PED to operate at a suitable level while maintaining the cooling provided by the PED stand in order to enhance the performance of the PED.

[0022] According to various embodiments, the PED bracket may include a communication interface for connecting the PED bracket to the PED. The communication interface may allow data communication between the PED bracket and the PED. For example, the data may be associated with the cooling function of the PED bracket. Thus, data communication between the PED bracket and the PED via the communication interface may allow, for example, feedback and / or control of the cooling of the PED through the PED bracket.

[0023] According to various embodiments, the PED bracket may be configured to be modular such that one or more components / parts of the PED bracket may be removably coupled so as to be interchangeable or exchangeable with other similar components / parts in order to vary or adapt the PED bracket for providing cooling for different types and / or brands and / or models of PEDs. For example, the cooling device of the PED bracket may be a modular unit that may be removable so as to be interchangeable or exchangeable between different types of cooling devices, such as a cooling device that provides an air flow for cooling or a cooling device that provides direct contact cooling. Thus, when the PED has air holes in the housing of the PED, the modular unit having a cooling device that provides an air flow for cooling may be assembled to the PED bracket so as to provide the air flow into the air holes of the PED for cooling. On the other hand, when the PED does not have any air holes in the housing of the PED, the modular unit having a cooling device that provides direct contact cooling may be assembled to the PED bracket so as to cool the housing of the PED for cooling. Thus, depending on whether the PED has air holes or does not have air holes in the housing of the PED, the PED bracket may be correspondingly configured by interchanging or exchanging between the modular unit having a cooling device that provides an air flow for cooling or the modular unit having a cooling device that provides direct contact cooling. As another example, the size of the opening in the support frame of the PED bracket may be changed by interchanging or exchanging with different support frames having different sized openings through which the cooling interface of the cooling device is exposed for providing cooling to the PED. Thus, the PED bracket may be configured to optimize the cooling of PEDs of different sizes.

[0024] Figure 1 A schematic diagram of a PED bracket 100 according to various embodiments is shown. According to various embodiments, the PED bracket 100 may provide cooling to a PED received by the PED bracket 100 so as to facilitate heat dissipation from the PED. For example, the PED may be a laptop computer, a thin and light laptop computer, a tablet computer, or a smart phone. For example, the PED bracket may be a riser-type PED bracket, a vertical stand-type PED bracket, or an angled-type PED bracket. In addition, the PED bracket may be a fixed structure, a rigid structure, a flexible structure, a foldable structure, or a collapsible structure.

[0025] According to various embodiments, the PED bracket 100 may include a body 110. The body 110 of the PED bracket 100 may provide a base structure or framework, and the PED may be received by the PED bracket 100 or supported by the PED bracket 100 to the base structure or framework. According to various embodiments, the body 110 of the PED bracket 100 may include a device resting side 112. The device resting side 112 of the body 110 of the PED bracket 100 may be the side of the body 110 for receiving the PED. Accordingly, the PED may be supported or drilled by the device resting side 112 of the body 110 of the PED bracket 100 such that the PED may be supported by the PED bracket 100. According to some embodiments, the device resting side 112 of the body 110 of the PED bracket 100 may be configured such that the PED may be placed or rested or laid on the device resting side 112 of the body 110 of the PED bracket 100. According to some embodiments, the device resting side 112 of the body 110 of the PED bracket 100 may be configured such that the PED may be held, clamped or secured by the device resting side 112 of the body 110 of the PED bracket 100.

[0026] According to various embodiments, the PED bracket 100 may include a cooling device 120. The cooling device 120 may be provided at the body 110 of the PED bracket 100. For example, the body 110 may include an enclosed structure, such as, a housing or a casing, such that the cooling device 120 may be inside the enclosed structure of the body 110 of the PED bracket 100. As another example, the body 110 may include a framework structure, such as, a network of interconnected rod-shaped members, such that the cooling device 120 may be within the framework structure of the body 110 of the PED bracket 100.

[0027] According to various embodiments, the cooling device 120 may include a cooling interface 122. The cooling interface 122 may be through the device resting side 112 of the body 110 (e.g., via such as Figure 2A and Figure 2BThe opening 215) shown in is exposed. Thus, the cooling interface 122 of the cooling device 120 can be accessed through the device placement side 112 of the main body 110, whereby the device placement side 112 of the main body 110 can include an interruption to expose or reveal or make visible the cooling interface 122 of the cooling device 120. According to various embodiments, when the PED is disposed at the device placement side 112 of the main body 110 of the PED holder 100, the cooling interface 122 of the cooling device 120 may be capable of providing cooling to the PED. The PED may be disposed at the device placement side 112 of the main body 110 of the PED holder 100 in such a manner as to cover the cooling interface 122 of the cooling device 120 exposed through the device placement side 112 of the main body 110 of the PED holder 100. Thus, the cooling of the PED may be transferred to the PED via the cooling interface 122 of the cooling device 120 across the device placement side 112 of the main body 110 of the PED holder 100.

[0028] According to various embodiments, the cooling device 120 may be an air-flow-based cooling device or a direct-contact cooling device. When the cooling device 120 is an air-flow-based cooling device, the cooling interface 122 may be an air flow outlet (e.g., see Figure 2A 256) in. Further, the air flow outlet may be exposed through the device placement side 112 of the main body 110 of the PED holder 100 for guiding the air flow generated by the air-flow-based cooling device toward the PED disposed at the device placement side 112 of the main body 110 of the PED holder 100. Thus, the air flow guided at the PED via the air flow outlet of the air-flow-based cooling device may provide cooling to the PED. When the cooling device 120 is a direct-contact cooling device, the cooling interface 122 may be a heat-conductive surface, e.g., the surface of a cooling plate (e.g., see Figure 2B 257) in, to contact the PED. Further, the heat-conductive surface may be exposed through the device placement side 112 of the main body 110 of the PED holder 110 such that the heat-conductive surface may provide a cold surface to thermally contact the PED for cooling the PED. The heat-conductive surface in contact with the PED may provide cooling to the PED.

[0029] According to various embodiments, the cooling device 120 may include a suitable cooling mechanism. Suitable cooling mechanisms may include but are not limited to fans, air flow generators, or heat exchangers. For example, when the cooling device 120 is an air-flow-based cooling device, the cooling device 120 may include a fan or an air flow generator (e.g., see Figure 2AAmong them (254), a fan or an air flow generator is used as a cooling mechanism and is operable to generate an air flow. The cooling device 120 may further include an air flow duct having an air flow outlet for guiding the air flow in a desired direction. Thus, the fan or the air flow generator may be disposed in the PED bracket 100, and the air flow duct may divert the air flow to the air flow outlet such that the air flow may exit from the device placement side 112 of the main body 110 of the PED bracket 100 so as to be guided toward the PED disposed at the device placement side 112 of the main body 110 of the PED bracket 100. As another example, when the cooling device 120 is a direct contact cooling device, the cooling device 120 may include a heat exchanger (for example, see Figure 2B Among them (255)) and a cooling plate having a heat conducting surface, whereby the heat exchanger may be operable to remove heat from the cooling plate so as to keep the cooling plate cooled. Thus, the heat exchanger may be disposed in the PED bracket 100, and the cooling plate may be disposed in such a manner that the heat conducting surface may be exposed through the device placement side 112 of the main body 110 of the PED bracket 100 so as to contact the PED disposed at the placement side 112 of the main body 110 of the PED bracket 100 for cooling the PED.

[0030] According to various embodiments, the PED bracket 100 may include a controller 130. The controller 130 may be connected to the cooling device 120. The controller 130 may control the cooling device 120 to provide cooling to the PED disposed at the device placement side 112 of the main body 110 of the PED bracket 100 via the cooling interface 122 of the cooling device 120 for cooling the PED. Thus, the controller 130 may manage the operation and function of the cooling device 120 for providing cooling. For example, when the cooling device 120 is an air flow-based cooling device, the controller 130 may control the operation and function of the fan or the air flow generator for generating an air flow. As another example, when the cooling device 120 is a direct contact cooling device, the controller 130 may control the operation and function of the heat exchanger for regulating the temperature of the cooling plate. According to various embodiments, the controller 130 may be operable to control the cooling device 120 to provide cooling within a range of cooling levels. Different cooling levels within the range of cooling levels may be associated with different amounts of cooling provided. Thus, the cooling device 120 may be controlled by the controller 130 to provide different amounts of cooling according to the range of cooling levels. According to various embodiments, the cooling device 120 may be hardware for generating cooling, and the controller 130 may direct or regulate the operation and function of the cooling device 120.

[0031] In various embodiments, a "controller" can be understood as any kind of logical implementation entity, which can be a dedicated circuit or a processor, firmware, or any combination thereof that executes software stored in a memory. Thus, in an embodiment, a "controller" can be a hardwired logic circuit or a programmable logic circuit, such as a programmable processor, e.g., a microprocessor (e.g., a Complex Instruction Set Computer (CISC) processor or a Reduced Instruction Set Computer (RISC) processor). A "controller" can also be a processor that executes software, e.g., any kind of computer program, e.g., a computer program that uses virtual machine code such as, for example, Java. According to various embodiments, any other kind of implementation of the corresponding functions described in more detail throughout can also be understood as a "controller". In various embodiments, a "controller" can be part of a computing system or a controller or a microcontroller or any other system that provides processing capabilities. According to various embodiments, such a system can include, for example, a memory used in the processing performed by the device or system. The memory used in the embodiments can be a volatile memory, such as DRAM (Dynamic Random Access Memory), or a non-volatile memory, such as PROM (Programmable Read-Only Memory), EPROM (Erasable PROM), EEPROM (Electrically Erasable PROM), or flash memory, e.g., floating gate memory, charge trapping memory, MRAM (Magnetoresistive Random Access Memory), or PCRAM (Phase Change Random Access Memory).

[0032] According to various embodiments, the PED stent 100 can include a communication interface 140. The communication interface 140 can be connectable to the PED for connecting the PED stent 100 to the PED. According to various embodiments, the communication interface 140 can be used for wired communication or wireless communication. For example, when the communication interface 140 is used for wired communication, the communication interface 140 can include, but is not limited to, a serial communication interface, a parallel communication interface, a universal serial bus communication interface, an Ethernet communication interface, a coaxial communication interface, an optical fiber communication interface, or a lightning communication interface. As another example, when the communication interface 140 is used for wireless communication, the communication interface 140 can include, but is not limited to, a Wi-Fi communication interface, a Bluetooth communication interface, an infrared communication interface, or a radio frequency communication interface.

[0033] According to various embodiments, within the PED bracket 100, the communication interface 140 may be connected to the controller 130 of the PED bracket 100. Thus, when the communication interface 140 of the PED bracket 100 is connected to the PED, the communication interface 140 may be used to interconnect the controller 130 of the PED bracket 100 with the PED. In the case where the communication interface 140 interconnects the controller 130 of the PED bracket 100 with the PED, the communication interface 140 may transfer data between the controller 130 of the PED bracket 100 and the PED. According to various embodiments, the data may be associated with the cooling provided via the cooling interface 122 of the cooling device 120. For example, the data may include information related to the cooling provided by the cooling device 120 and / or the controller 130, or information that may be transmitted to the cooling device 120 and / or the controller 130 for controlling the cooling provided by the cooling device 120. According to various embodiments, the data may include the cooling level information provided by the cooling device 120 via the cooling interface 122, wherein the cooling level information may be transmitted from the controller 130 to the PED. Thus, the data may be related to the operation settings / information of the cooling device 120 as an indication of the amount of cooling provided by the cooling device 120 via the cooling interface 122. According to various embodiments, the data may include a control signal to control the cooling device 120 to provide cooling at a cooling level corresponding to the control signal via the cooling interface 122, wherein the cooling level may be selected from a range of cooling levels, and wherein the control signal may be transmitted from the PED to the controller 130. Thus, the data may be related to an instruction for controlling the cooling device 120 to provide a desired amount of cooling. Then, the controller 130 may control the cooling device 120 based on the received control signal.

[0034] Figure 2A A disassembled view of the PED bracket 200 according to various embodiments is shown. Figure 2B is another disassembled view of the PED bracket 200 according to various embodiments. According to various embodiments, Figure 2A and Figure 2B the PED bracket 200 includes Figure 1 all the features of the PED bracket 100. Thus, all the features, changes, modifications, and variations applicable to Figure 1 the PED bracket 100 are also applicable to Figure 2A and Figure 2B the PED bracket 200. In addition, the same reference numerals are assigned to elements that are the same as those previously described, and for the sake of brevity, the repetition of their corresponding descriptions is omitted. The following description focuses on various possible additional features and details.

[0035] According to various embodiments, the PED bracket 200 may include a body 110 having a device placement side 112, a cooling device 120 for a cooling interface 122, a controller 130, and a communication interface 140. Refer to Figure 2A and Figure 2B , according to various embodiments, the cooling device 120 may be disposed in a modular unit 250. Thus, the PED bracket 200 may include the modular unit 250 containing the cooling device 120. According to various embodiments, the modular unit 250 may be removably assembled into a cavity 214 in the body 110. Thus, the modular unit may be assembled in a removable manner from the cavity 214 of the body 110. According to various embodiments, in the case where the modular unit 250 contains the cooling device 120, the PED bracket 200 may be configurable or interchangeable or exchangeable with different types of cooling devices 120 by interchanging or exchanging between modular units 250 containing different types of cooling devices 120. Thus, the modular unit 250 may be removably assembled into the cavity 214 of the body 110 in an interchangeable or exchangeable manner between modular units 250 having different types of cooling devices 120. For example, the PED bracket 200 may be interchangeable or exchangeable with a modular unit 250a having an air-flow-based cooling device (such as Figure 2A shown) and a modular unit 250b having a direct-contact cooling device (such as Figure 2B shown). Refer to Figure 2A , the modular unit 250a having an air-flow-based cooling device may include an air-flow generator 254 and an air-flow outlet 256. Refer to Figure 2B , the modular unit 250b having a direct-contact cooling device may include a heat exchanger 255 and a cooling plate 257.

[0036] According to various embodiments, the electrical terminal 252 may be provided at the modular unit 250, and the complementary electrical terminal 216 may be provided in the cavity 214 of the body 110 of the PED bracket 200. When the modular unit 250 is removably assembled into the cavity 214 of the body 110 of the PED bracket 200, the electrical terminal 252 of the modular unit 250 and the complementary electrical terminal 216 of the body 110 may be engaged with each other. Thus, data communication through the modular unit 250 via the body 110 of the PED bracket 200 with the cooling device 120 included in the modular unit 250 may be established. According to various embodiments, the communication interface 140 of the PED bracket 200 may be connected to the complementary electrical terminal 216 of the body 110 of the PED bracket 200. Thus, in the case where the electrical terminal 252 of the modular unit 250 and the complementary electrical terminal 216 of the body 110 are engaged, the communication interface 140 of the PED bracket 200 may be connected to the cooling device 120 included in the modular unit 250. Thus, when the communication interface 140 of the PED bracket 200 is connected to the PED, communication between the cooling device 120 included in the modular unit 250 and the PED may be enabled.

[0037] According to some embodiments, the controller 130 may be included in the modular unit 250 together with the cooling device 120. Thus, the controller 130 and the cooling device 120 may be directly connected to each other within the modular unit 250. Further, in the case where the electrical terminal 252 of the modular unit 250 and the complementary electrical terminal 216 of the body 110 are engaged, when the communication interface 140 of the PED bracket 200 is connected to the PED, communication between the controller 130 included in the modular unit 250 and the PED may be enabled. According to some embodiments, the controller 130 may be provided at the body 110 of the PED bracket 200 instead of being included in the modular unit 250. Thus, when the electrical terminal 252 of the modular unit 250 and the complementary electrical terminal 216 of the body 110 are engaged with each other, communication between the controller 130 and the cooling device 120 may be established. Although the controller 130 and the PED may communicate when the communication interface 140 of the PED bracket 200 is connected to the PED, the controller 130 may control the cooling device 120 only when the modular unit 250 is removably assembled into the cavity 214 of the body 110 of the PED bracket 200, where the electrical terminal 252 of the modular unit 250 and the complementary electrical terminal 216 of the body 110 are engaged with each other.

[0038] Reference Figure 2A and Figure 2B, According to various embodiments, the body 110 of the PED bracket 200 may include a base frame 211 and a support frame 213. The support frame 213 may include an opening 215. According to various embodiments, the support frame 213 may be removably coupled to the base frame 211. Thus, the support frame 213 may be coupled to the base frame 211 in a removable manner. According to various embodiments, the base frame 211 may include a receiving portion that defines a cavity 214. Additionally, the support frame 213 may be coupled to the base frame 211 so as to be placed above the cavity 214. According to various embodiments, the PED bracket 200 may be assembled by fitting a modular unit 250 into the cavity 214 defined by the base frame 211 of the body 110 of the PED bracket 200, and then fitting the support frame 213 of the body 110 of the PED bracket 200 to the base frame 211 such that the support frame 213 is placed above the modular unit 250 fitted in the cavity 214 of the base frame 211.

[0039] , According to various embodiments, the support frame 213 of the body 110 may be at the device resting side 112 of the body 110 of the PED bracket 200. According to various embodiments, when the PED is disposed at the device resting side 112 of the body 110 of the PED bracket 200, the support frame 213 of the body 110 may be used to support the PED. Thus, the support frame 213 of the body 110 may bear the weight of the PED to carry the PED. According to various embodiments, the support frame 213 of the body 110 of the PED bracket 200 may be a panel-like structure that provides a wide surface area for supporting the PED. According to various embodiments, the opening 215 in the support frame 213 of the PED bracket 200 may be used to expose the cooling interface 122 of the cooling device 120 of the PED bracket 200 to the PED supported on the support frame 213. Thus, the cooling interface 122 of the cooling device 120 of the PED bracket 200 may provide cooling to the PED through the opening 215 in the support frame 213 of the body 110 of the PED bracket 200.

[0040] , According to various embodiments, the PED bracket 200 may include a sealing strip 260 lined along the edge of the opening 215 of the support frame 213 of the body 110 of the PED bracket 200. When the PED is set on the support frame 213 at the device resting side 112 of the body 110 of the PED bracket 200, the sealing strip 260 may form a seal with the PED. Thus, in the case where the sealing strip 260 forms a seal between the opening 215 of the support frame 213 of the body 110 of the PED bracket 200 and the PED, the cooling provided through the opening 215 in the support frame 213 of the body 110 of the PED bracket 200 may minimize losses. Thus, more effective and efficient cooling may be provided.

[0041] According to various embodiments, in the case where the support frame 213 of the main body 110 of the PED bracket 200 is removably coupled to the base frame 211 of the main body 110 of the PED bracket 200, the support frame 213 can be interchangeable or exchangeable with different support frames having openings 215 of different sizes. Thus, for different types and / or brands and / or models of PEDs, the size of the area for cooling can be different. Some PEDs may require a larger area for cooling, while some PEDs may require a smaller area for cooling. Therefore, by interchanging or exchanging between different support frames having openings 215 of different sizes for the PED bracket 200, the PED bracket 200 can be configured to cool the PED in a more effective and efficient manner.

[0042] Figure 3 A PED bracket 300 according to various embodiments is shown. According to various embodiments, Figure 3 the PED bracket 300 includes Figure 1 all the features of the PED bracket 100. According to various embodiments, Figure 3 the PED bracket 300 further includes Figure 2A and Figure 2B the features of the PED bracket 200, except that the PED bracket 300 does not include the modular unit 250. Thus, all the features, changes, modifications, and variations applicable to Figure 1 the PED bracket 100, and the related features, changes, modifications, and variations applicable to Figure 2A and Figure 2B the PED bracket 200 can also be applicable to Figure 3 the PED bracket 300. In addition, the same reference numerals are assigned to the elements that are the same as those previously described, and for the sake of brevity, the repetition of their corresponding descriptions is omitted. The following description focuses on various possible additional features and details.

[0043] According to various embodiments, the PED bracket 300 can include a main body 110 having a device placement side 112, a cooling device 120 for the cooling interface 122, a controller 130, and a communication interface 140. According to various embodiments, the PED bracket 300 can be without the modular unit 250. Thus, the cooling device 120 of the PED bracket 300 can be directly provided to the main body 110 of the PED bracket 300. According to various embodiments, the main body 110 of the PED bracket 300 can include a cavity 214. Thus, the cooling device 120 can be provided in the cavity 214 of the main body 110 of the PED bracket 300.

[0044] According to various embodiments, the body 110 of the PED stent 300 may include a base frame 211 and a support frame 213. The support frame 213 may include an opening 215. The base frame 211 may include a receiving portion that defines a cavity 214. Further, the support frame 213 may be removably coupled to the base frame 211 in such a way as to be placed over the cavity 214. According to various embodiments, a cooling device 120 may be disposed in the cavity 214 defined by the base frame 211. For example, the cooling device 120 may be installed in the receiving portion of the base frame 211 within the cavity 214. Further, the support frame 213 may be assembled to the base frame 211 by being placed over the cavity 214 and the cooling device 120. When the support frame 213 is over the cooling device 120, the cooling interface 122 of the cooling device 120 may be exposed through the opening 215 of the support frame 213 of the PED stent 300.

[0045] Reference Figure 3 , the support frame 213 of the body 110 of the PED stent 300 may be removably coupled to the base frame 211 of the body 110 of the PED stent 300. As shown, the support frame 213 of the body 110 of the PED stent 300 may include at least one engaging element 317, and the base frame 211 of the body 110 of the PED stent 300 may include at least one complementary engaging element 319. According to various embodiments, at least one engaging element 317 of the support frame 213 of the body 110 of the PED stent 300 and at least one complementary engaging element 319 of the base frame 211 of the body 110 of the PED stent 300 may form a detachable engagement when the support frame 213 is coupled to the base frame 211. Thus, at least one engaging element 317 of the support frame 213 of the body 110 of the PED stent 300 and at least one complementary engaging element 319 of the base frame 211 of the body 110 of the PED stent 300 may engage with each other when the support frame 213 and the base frame 211 are coupled together. Further, at least one engaging element 317 of the support frame 213 of the body 110 of the PED stent 300 and at least one complementary engaging element 319 of the base frame 211 of the body 110 of the PED stent 300 may engage with each other when the support frame 213 and the base frame 211 are coupled together. Reference Figure 3 , according to one implementation, at least one engaging element 317 of the support frame 213 of the body 110 of the PED stent 300 may be an insertion tab, and at least one complementary engaging element 319 of the base frame 211 of the body 110 of the PED stent 300 may be a corresponding hole for receiving the insertion tab. It can be understood that, according to various embodiments, the insertion tab and the corresponding hole may be reversed. Also reference Figure 3, According to various embodiments, the support frame 213 of the main body 110 of the PED bracket 300 may include one or two or more engaging elements 317, and the base frame 211 of the main body 110 of the PED bracket 300 may include a corresponding number of complementary engaging elements 319. In addition, the (e.g., two or more) engaging elements 317 of the support frame 213 of the main body 110 of the PED bracket 300 may be along the same edge of the support frame 213, and the (e.g., two or more) complementary engaging elements 319 of the base frame 211 of the main body 110 of the PED bracket 300 may be along the same corresponding side of the base frame 211 of the main body 110 of the PED bracket 300.

[0046] , According to various embodiments, the main body 110 of the PED bracket 300 may include a stop 370. The stop 370 may be located at the device resting side 112 of the main body 110 of the PED bracket 300. According to some embodiments, the stop 370 may be at a part of the base frame 211, whereby this part of the base frame 211 is at the device resting side 112 of the main body 110 of the PED bracket 300. According to some embodiments, the stop 370 may be at the support frame 213 of the main body 110 of the PED bracket 300, rather than at the base frame 211. According to various embodiments, when the PED is disposed at the device resting side 112 of the main body 110 of the PED bracket 300, the stop 370 may be used to support the edge of the PED. According to various embodiments, the stop 370 may be a ridge or a rib or a raised tab or a raised flange. In addition, the stop 370 may provide a flat abutment surface for supporting the edge of the PED.

[0047] , According to various embodiments, the stop 370 of the PED bracket 300 may be movable relative to the cooling interface 122 of the cooling device 120 along the device resting side 112 of the main body 110 of the PED bracket 300. Thus, the stop 370 of the PED bracket 300 may move along a plane corresponding to the device resting side 112 of the main body 110 of the PED bracket 300 so as to move closer to or farther from the cooling interface 122 of the cooling device 120. According to various embodiments, the stop 370 may be movable along a movement axis perpendicular to the flat abutment surface supporting the edge of the PED. Thus, according to the size of the PED, the stop 370 may be adjusted accordingly so as to optimally position the PED relative to the cooling interface 122 of the cooling device 120 for cooling the PED.

[0048] , According to various embodiments, the stop 370 of the PED bracket 300 may be lockable within a predetermined position range from the cooling interface 122 of the cooling device 120. Thus, when the stop 370 is moved to a desired position, the stop 370 may be locked in place so as to be able to support the edge of the PED.

[0049] According to various embodiments, the PED brackets 100, 200, 300 may provide controlled cooling for the PED. In addition, when the PED brackets 100, 200, 300 are connected to the PED via the communication interface 140, the PED and the PED brackets 100, 200, 300 may together form a system for controlling the cooling of the PED (e.g., the cooling provided by the PED brackets 100, 200, 300). Thus, the method of controlling the cooling provided by the PED brackets 100, 200, 300 may be implemented by a system having an interconnected PED and PED brackets 100, 200, 300. According to various embodiments, a computer program associated with controlling the PED brackets 100, 200, 300 may be executed by the PED to control the cooling of the PED. According to various embodiments, the system and / or method for controlling the cooling of the PED may include controlling the cooling device 120 of the PED brackets 100, 200, 300 based on system information and / or the operating state to cool the PED. According to various embodiments, the system and / or method for controlling the cooling of the PED may include changing the operating settings and / or load of the PED in order to adjust the PED to operate at a suitable level while maintaining the cooling level provided by the cooling device 120 of the PED brackets 100, 200, 300 in order to maintain or improve the performance of the PED.

[0050] Figure 4 A flowchart showing an example of a method 401 for controlling cooling in a control system is shown, by which the PED is set to the PED brackets 100, 200, 300, where the PED is connected to the PED brackets 100, 200, 300. In Figure 4 the method 401 as shown, the cooling of the PED may be based on receiving cooling level information from the PED brackets 100, 200, 300 in order to adjust the performance settings of the PED. As Figure 4As shown, according to various embodiments, method 401 may include the PED receiving cooling level information provided by the cooling interface 122 of the cooling device 120 to determine whether the cooling device 120 is operating (see 403). The cooling level information may include the cooling settings of the cooling device 120 and / or thermal sensing information from sensors configured to measure the cooling provided by the cooling device 120. If no cooling level information is received or if the received cooling level information indicates that the cooling device 120 is not operating, the PED may maintain its current performance settings so as not to increase the temperature of the PED (see 405). If the cooling level information indicates that the cooling device 120 is operating, the PED may determine the current cooling level provided by the cooling device 120 (see 407) to determine whether the current cooling level is at the maximum level (see 409). The cooling device 120 is capable of providing cooling over a range of cooling levels. The current cooling level may be one of the cooling levels from the range of cooling levels and may be based on the current cooling settings of the cooling device 120 and / or the current thermal sensing information from sensors configured to measure the cooling provided by the cooling device 120. If the cooling level information indicates that the cooling provided by the cooling device 120 is not at the maximum cooling level, the PED may maintain its current performance settings so as not to cause an increase in the temperature of the PED (see 411). If the cooling level information indicates that the cooling provided by the cooling device 120 is operating at the maximum cooling level, the PED may prompt the user and provide the user with an option to change the operating mode of the PED (see 413). The PED may receive input from the user and determine whether the user has selected to change the operating mode (see 415). If the user has not selected to change the operating mode, the PED may maintain its current performance settings so as not to cause an increase in the temperature of the PED (see 417). However, if the user selects to change the operating mode, the PED may change to operate at a higher performance setting (see 419). Although the temperature of the PED may increase due to the change to a higher performance setting, the higher performance setting may be a predefined setting where the PED can be sufficiently cooled by the cooling device 120 of the PED holders 100, 200, 300 to provide cooling at the maximum cooling level to prevent overheating or performance degradation of the PED due to heat.

[0051] Figure 5 A flowchart showing another example of a method 501 for cooling in a control system is shown, by which the PED is set to the PED holders 100, 200, 300, where the PED is connected to the PED holders 100, 200, 300. In the method 501 as Figure 5 shown, the cooling of the PED may be based on receiving cooling level information from the PED holders 100, 200, 300 to adjust the performance settings of the PED. As Figure 5As shown, according to various embodiments, method 501 may include the PED receiving cooling level information provided by the cooling interface 122 of the cooling device 120 to determine whether the cooling device 120 is operating (see 503). The cooling level information may include the cooling settings of the cooling device 120 and / or thermal sensing information from sensors set to measure the cooling provided by the cooling device 120. If no cooling level information is received or if the received cooling level information indicates that the cooling device 120 is not operating, the PED may maintain its current performance settings so as not to cause an increase in the temperature of the PED (see 505). If the cooling level information indicates that the cooling device 120 is operating, the PED may determine the current cooling level provided by the cooling device 120 (see 507). The cooling device 120 is capable of providing cooling throughout a range of cooling levels. The current cooling level may be one of the cooling levels from the range of cooling levels and may be based on the current cooling settings of the cooling device 120 and / or current thermal sensing information from sensors set to measure the cooling provided by the cooling device 120. According to various embodiments, the cooling device 120 may be operable to provide cooling throughout a range of cooling levels. Thus, the cooling level information received by the PED may indicate whether the cooling device 120 is operating at cooling level 1, or cooling level 2, or cooling level 3, or cooling level 4, or cooling level 5. Although five cooling levels are shown in Figure 5 , it should be understood that there may be a different number of cooling levels. Figure 5 For illustrative purposes only.

[0052] Refer to Figure 5As an example, if the cooling level information indicates that the cooling device 120 is providing cooling at cooling level 1 (see 509), the PED can maintain its current performance settings so as not to increase the temperature of the PED (see 511). If the cooling level information indicates that the cooling device 120 is providing cooling at cooling level 2 (see 513), the PED can maintain its current performance settings so as not to increase the temperature of the PED (see 515). If the cooling level information indicates that the cooling device 120 is providing cooling at cooling level 3 (see 517), the PED can increase its performance settings to a first intermediate level (see 519). Although the temperature of the PED can increase due to the increase in its performance settings, the performance settings of the first intermediate level can be predefined settings where the PED can be sufficiently cooled by the cooling device 120 of the PED brackets 100, 200, 300 providing cooling at cooling level 3 to prevent overheating or performance degradation of the PED due to heat. If the cooling level information indicates that the cooling device 120 is providing cooling at cooling level 4 (see 521), the PED can increase its performance settings to a second intermediate level (see 523). Although the temperature of the PED can increase due to the increase in its performance settings, the performance settings of the second intermediate level can be predefined settings where the PED can be sufficiently cooled by the cooling device 120 of the PED brackets 100, 200, 300 providing cooling at cooling level 4 to prevent overheating or performance degradation of the PED due to heat. If the cooling level information indicates that the cooling device 120 is providing cooling at cooling level 5 (see 525), the PED can increase its performance settings to the maximum performance settings (see 527). Although the temperature of the PED can increase due to the increase in its performance settings, the maximum performance settings can be predefined settings where the PED can be sufficiently cooled by the cooling device 120 of the PED brackets 100, 200, 300 providing cooling at cooling level 5 to prevent overheating or performance degradation of the PED due to heat.

[0053] Figure 6 A flowchart showing another example of a method 601 for cooling in a control system is shown, by which the PED is set to the PED brackets 100, 200, 300, where the PED is connected to the PED brackets 100, 200, 300. In the method 601 as Figure 6 shown, the cooling of the PED can include controlling the cooling device 120 of the PED brackets 100, 200, 300 based on system information and / or the operating state of the PED to cool the PED. As Figure 6As shown, according to various embodiments, the method may include PED checking and retrieving information related to the current load of the PED (see 603). The current load of the PED may include, but is not limited to, the current processor computing load, or the current processor utilization, or the current processor power consumption. The current load of the PED may be part of the system information and / or operating state of the PED. Additionally, the method may further include the PED obtaining cooling level information provided by the cooling interface 122 of the cooling device 120 to determine the current cooling level of the cooling device 120 (see 603). The cooling level information may include the cooling settings of the cooling device 120 and / or thermal sensing information from sensors set to measure the cooling provided by the cooling device 120. The cooling device 120 may be controllable to provide cooling across a range of cooling levels. The current cooling level may be one of the cooling levels from the range of cooling levels and may be based on the current cooling settings of the cooling device 120 and / or the current thermal sensing information from the sensors set to measure the cooling provided by the cooling device 120.

[0054] Subsequently, the method may include comparing the current load of the PED with the previous load of the PED (see 605). If the current load of the PED is equal to or substantially the same as the previous load of the PED, the PED may continue to monitor the load of the PED and the cooling provided by the PED brackets 100, 200, 300 without changing or adjusting or altering the cooling level provided by the PED brackets 100, 200, 300. If the current load of the PED is different from the previous load of the PED, the PED may continue to compare the current load of the PED with the corresponding threshold load ranges of the current cooling levels provided by the PED brackets 100, 200, 300 (see 607, 609). Each cooling level in the range of cooling levels of the cooling device 120 may be designated or associated with a threshold load range. The threshold load range may be a load range of the PED that can be adequately cooled by the cooling device 120 of the PED brackets 100, 200, 300, providing cooling at the cooling level to prevent overheating or performance degradation of the PED due to heat. The threshold load range may include an upper limit value defining the upper limit of the threshold load range and a lower limit value defining the lower limit of the threshold load range.

[0055] As an example, when it is determined that the current load of the PED is greater than the previous load of the PED, the PED can compare the current load of the PED with the upper limit value of the corresponding threshold load range of the current cooling level of the cooling provided by the cooling device 120 (see 607). If the current load of the PED is equal to or less than the lower limit value of the corresponding threshold load range of the current cooling level of the cooling provided by the cooling device 120, the PED can continue to monitor the load of the PED and the cooling provided by the PED brackets 100, 200, 300 without changing or adjusting or altering the cooling level provided by the PED brackets 100, 200, 300. If the current temperature of the processing unit is greater than the upper limit value of the corresponding threshold temperature range of the current cooling level of the cooling provided by the cooling device 120, the PED can send a control signal from the PED to the PED brackets 100, 200, 300 (e.g., to the controller 130 of the PED brackets 100, 200, 300) to control the cooling device 120 to adjust or change or alter the provided cooling (e.g., via the cooling interface 122 of the cooling device 120) to a higher cooling level (i.e., to increase the cooling level). The change in the cooling level of the cooling can be achieved by adjusting or changing or altering the settings of the cooling device 120 based on the control signal.

[0056] As another example, when it is determined that the current load of the PED is less than the previous load of the PED, the PED can compare the current load of the PED with the lower limit value of the corresponding threshold load range of the current cooling level of the cooling provided by the cooling device 120 (see 609). If the current load of the PED is equal to or greater than the lower limit value of the corresponding threshold load range of the current cooling level of the cooling provided by the cooling device 120, the PED can continue to monitor the load of the PED and the cooling provided by the PED brackets 100, 200, 300 without changing or adjusting or altering the cooling level provided by the PED brackets 100, 200, 300. If the current load of the PED is less than the lower limit value of the corresponding threshold load range of the current cooling level of the cooling provided by the cooling device 120, the PED can send a control signal from the PED to the PED brackets 100, 200, 300 (e.g., to the controller 130 of the PED brackets 100, 200, 300) to control the cooling device 120 to adjust or change or alter the provided cooling (e.g., via the cooling interface 122 of the cooling device 120) to a lower cooling level (i.e., to reduce the cooling level, see 613). The change in the cooling level of the cooling can be achieved by adjusting or changing or altering the settings of the cooling device 120 based on the control signal.

[0057] As exemplified by the method of 601, according to various embodiments, the PED may generate a control signal based on the cooling level information received from the PED brackets 100, 200, 300 together with the system information and / or the operating state of the PED, for controlling the cooling device 120 to provide appropriate cooling to the PED according to the system information and / or the operating state of the PED. Therefore, the system formed by the PED and the PED brackets 100, 200, 300 may allow dynamic control of the cooling provided by the PED brackets 100, 200, 300.

[0058] Figure 7 Another example of a method 701 for cooling in a control system is shown, by which the PED is set to the PED brackets 100, 200, 300, where the PED is connected to the PED brackets 100, 200, 300. In the method 701 as Figure 7 shown, the cooling of the PED may include controlling the cooling device 120 of the PED brackets 100, 200, 300 based on the system information and / or the operating state of the PED for cooling the PED.

[0059] According to various embodiments, the method 701 may include a setup sequence. In the setup sequence, the method 701 may include the PED obtaining the cooling level information provided by the cooling interface 122 of the cooling device 120 to determine the current cooling level of the cooling device 120. The cooling level information may include the cooling settings of the cooling device 120 and / or the thermal sensing information from a sensor set to measure the cooling provided by the cooling device 120.

[0060] The method 701 may then include setting parameters for monitoring the operating state of the PED based on the current cooling level (see 703). The operating state of the PED may include but is not limited to temperature, power consumption, internal fan speed, or load. The set parameters may correspond to the monitored operating state.

[0061] Subsequently, the method 701 may include obtaining the system information of the PED (see 705). The system information may include but is not limited to the type, brand, model, operating system, processor, memory, storage device, device driver, installed software, network configuration, or system configuration of the PED.

[0062] Using the system information of the PED, method 701 may include retrieving a cooling database for the PED (see 707). The cooling database may include a range of cooling levels and parameters of the operating state of the PED associated with or assigned to the respective cooling levels. Depending on the system information of the PED, the cooling database may vary with different ranges of cooling levels. For example, different types of PEDs may have different cooling databases with different ranges of cooling levels. Different brands of PEDs may have different fan vents on the back surface of the PED. Different models of PEDs from the same brand may also have different cooling databases including different ranges of cooling levels. Further, PEDs with different processor / system configurations, etc. from the same brand may also have different cooling databases including different ranges of cooling levels. Different cooling databases including different ranges of cooling levels for different PEDs may be stored in the memory of the PED.

[0063] Using the system information of the PED, the method may include prompting the user to optimize the configuration of the PED brackets 100, 200, 300 for cooling the PED (see 709). For example, the user may be prompted to assemble a suitable modular unit 250, a suitable support frame 213 with suitable openings 215 and sealing strips 260, and / or adjust the plug 370 to a suitable position.

[0064] Upon completion of the setup sequence, method 701 may then proceed to the cooling loop sequence. In the cooling loop sequence, method 701 may include detecting or determining the current operating state of the PED (see 711). Depending on the PED, the current operating state of the PED may include one or a combination of the current temperature of the processing unit of the PED, the current power consumption, the current internal fan speed, or the current load. The processing unit of the PED may include, but is not limited to, a central processing unit (CPU) or a graphics processing unit (GPU).

[0065] Subsequently, method 701 may include comparing the current operating state of the PED with the set parameters for the current cooling level (see 713). According to various embodiments, each cooling level in the range of cooling levels for the PED may be specified or associated with a threshold temperature range of the processing unit, and / or a threshold power range of the processing unit, and / or a threshold fan speed range of the processing unit, and / or a threshold load range of the processing unit. The threshold temperature range of the processing unit, and / or the threshold power range of the processing unit, and / or the threshold fan speed range of the processing unit, and / or the threshold load range of the processing unit for the current cooling level may be used as the set parameters. Each of the threshold temperature range of the processing unit, and / or the threshold power range of the processing unit, and / or the threshold fan speed range of the processing unit, and / or the threshold load range of the processing unit may include an upper limit value defining an upper limit and a lower limit value defining a lower limit.

[0066] Based on the comparison result between the current operating state of the PED and the set parameters of the current cooling level, method 701 can then determine whether the cooling level of the PED brackets 100, 200, 300 needs to be adjusted or changed or altered (see 715). When the current operating state of the PED is within the set parameters of the current cooling level, method 701 can include the PED continuing to monitor the operating state of the PED without changing or adjusting or altering the cooling level provided by the PED brackets 100, 200, 300. However, when the current operating state of the PED is outside the set parameters of the current cooling level, method 701 can include the PED sending a control signal from the PED to the PED brackets 100, 200, 300 (e.g., to the controllers 130 of the PED brackets 100, 200, 300) (see 717) so as to control the cooling device 120 to adjust or change or alter the provided cooling (e.g., via the cooling interface 122 of the cooling device 120) to another cooling level (i.e., so as to increase / decrease the cooling level). The change in the cooling level of the cooling can be achieved by adjusting or changing or altering the settings of the cooling device 120 based on the control signal. In the case where the control signal has been sent, method 701 can include monitoring the operating state of the PED based on the new parameters for the new cooling level settings (see 719).

[0067] As an example, when the threshold temperature range is set as a parameter for monitoring, the PED can determine the current temperature of the processing unit of the PED and compare it with the threshold temperature range of the current cooling level. If the current temperature of the processing unit of the PED is equal to or less than the upper limit value of the corresponding threshold temperature range of the current cooling level of the cooling provided by the cooling device 120 and / or the current temperature of the processing unit of the PED is equal to or greater than the lower limit value of the corresponding threshold temperature range of the current cooling level of the cooling provided by the cooling device 120, the PED can continue to monitor the operating state of the PED without changing or adjusting or altering the cooling level provided by the PED brackets 100, 200, 300. If the current temperature of the processing unit is greater than the upper limit value of the corresponding threshold temperature range of the current cooling level of the cooling provided by the cooling device 120, the PED can send a control signal from the PED to the PED brackets 100, 200, 300 (e.g., to the controller 130 of the PED brackets 100, 200, 300) to control the cooling device 120 to adjust or change or alter the cooling provided (e.g., via the cooling interface 122 of the cooling device 120) to a higher cooling level (i.e., to increase the cooling level). On the other hand, if the current temperature of the processing unit is less than the lower limit value of the corresponding threshold temperature range of the current cooling level of the cooling provided by the cooling device 120, the PED can send a control signal from the PED to the PED brackets 100, 200, 300 (e.g., to the controller 130 of the PED brackets 100, 200, 300) to control the cooling device 120 to adjust or change or alter the cooling provided (e.g., via the cooling interface 122 of the cooling device 120) to a lower cooling level (i.e., to decrease the cooling level).

[0068] As another example, when the threshold temperature range and / or the threshold power range are set as parameters for monitoring, the PED can determine the current temperature and / or the current power of the processing unit of the PED and compare them with the threshold temperature range and / or the threshold power range, respectively. If the current temperature of the processing unit of the PED is greater than the upper limit value of the corresponding threshold temperature range and / or the current power of the processing unit of the PED is greater than the upper limit value of the corresponding threshold power range, the PED can send a control signal from the PED to the PED brackets 100, 200, 300 (e.g., to the controller 130 of the PED brackets 100, 200, 300) to control the cooling device 120 to adjust or change or vary the provided cooling (e.g., via the cooling interface 122 of the cooling device 120) to a higher cooling level (i.e., to increase the cooling level). If the current temperature of the processing unit of the PED is less than the lower limit value of the corresponding threshold temperature range and / or the current power of the processing unit of the PED is less than the lower limit value of the corresponding threshold power range, the PED can send a control signal from the PED to the PED brackets 100, 200, 300 (e.g., to the controller 130 of the PED brackets 100, 200, 300) to control the cooling device 120 to adjust or change or vary the provided cooling (e.g., via the cooling interface 122 of the cooling device 120) to a lower cooling level (i.e., to decrease the cooling level).

[0069] As another example, when the threshold temperature range of the processing unit, and / or the threshold power range of the processing unit, and / or the fan speed of the fan unit of the PED are set as parameters for monitoring, the PED can determine the current temperature of the processing unit and / or the current power of the processing unit and / or the current fan speed of the fan unit, and compare them with the threshold temperature range, and / or the threshold power range, and / or the threshold fan speed range respectively. If the current temperature of the processing unit of the PED is greater than the upper limit value of the corresponding threshold temperature range and / or the current power of the processing unit of the PED is greater than the upper limit value of the corresponding threshold power range and / or the current fan speed of the fan unit of the PED is greater than the upper limit value of the corresponding threshold fan speed range, the PED can send a control signal from the PED to the PED brackets 100, 200, 300 (e.g., to the controller 130 of the PED brackets 100, 200, 300) to control the cooling device 120 to adjust or change or vary the provided cooling (e.g., via the cooling interface 122 of the cooling device 120) to a higher cooling level (i.e., to increase the cooling level). If the current temperature of the processing unit of the PED is less than the lower limit value of the corresponding threshold temperature range and / or the current power of the processing unit of the PED is less than the lower limit value of the corresponding threshold power range and / or the current fan speed of the fan unit of the PED is less than the lower limit value of the corresponding threshold fan speed range, the PED can send a control signal from the PED to the PED brackets 100, 200, 300 (e.g., to the controller 130 of the PED brackets 100, 200, 300) to control the cooling device 120 to adjust or change or vary the provided cooling (e.g., via the cooling interface 122 of the cooling device 120) to a lower cooling level (i.e., to decrease the cooling level).

[0070] As illustrated by the method of 701, according to various embodiments, the PED can generate a control signal based on the cooling level information received from the PED brackets 100, 200, 300 together with the system information and / or the operating state of the PED for controlling the cooling device 120 to provide appropriate cooling to the PED according to the system information and / or the operating state of the PED. Thus, the system formed by the PED and the PED brackets 100, 200, 300 can allow dynamic control of the cooling provided by the PED brackets 100, 200, 300.

[0071] According to various embodiments, a method of cooling in a control system (wherein a PED is set to PED brackets 100, 200, 300 and the PED is connected to the PED brackets 100, 200, 300) may include feeding an input data set including cooling level information received from the PED brackets 100, 200, 300 and system information and / or operating state of the PED into a machine learning model, and generating an output data set including control signals for sending from the PED to the PED brackets 100, 200, 300 so as to control a cooling device 120 to adjust or change or alter the provided cooling to achieve dynamic control of the cooling provided by the PED brackets 100, 200, 300. The machine learning model may include, but is not limited to, a classification type machine learning model, a regression type machine learning model, a prediction type machine learning model, or a clustering type machine learning model.

[0072] Various embodiments have provided a PED bracket with controllable cooling, which may be capable of being connected to a PED to jointly control the cooling of the PED. Various embodiments have provided a system including a PED bracket connected to a PED, whereby the PED bracket and the PED work together to control the cooling of the PED. Various embodiments also provide a method of controlling the cooling of a PED, wherein the PED bracket and the PED are connected to jointly control the cooling of the PED.

[0073] Although the present invention has been specifically shown and described with reference to specific embodiments, those skilled in the art should understand that various changes, modifications, and variations in form and detail may be made therein without departing from the scope of the present invention as defined by the appended claims. Therefore, the scope of the present invention is indicated by the appended claims and is thus intended to include all changes falling within the meaning and scope of the equivalents of the claims.

Claims

1. A portable electronic device stand with controllable cooling, the stand comprising: A main body having a device resting side; A cooling device disposed at the main body, the cooling device having a cooling interface exposed through the device resting side of the main body, wherein when the portable electronic device is disposed on the device resting side, the cooling interface is capable of providing cooling to the portable electronic device; A controller connected to the cooling device to control the cooling device for providing cooling via the cooling interface over a range of cooling levels; and A communication interface capable of connecting to the portable electronic device to communicatively interconnect the controller and the portable electronic device by transmitting data between the controller and the portable electronic device, wherein the data is associated with the cooling provided via the cooling interface of the cooling device.

2. The device according to claim 1, wherein, The data includes cooling level information of the cooling provided by the cooling device via the cooling interface, and the cooling level information is transmitted from the controller to the portable electronic device.

3. The device according to claim 1 or 2, wherein, The data includes a control signal to control the cooling device to provide cooling via the cooling interface at a cooling level corresponding to the control signal, the cooling level being selected from the range of cooling levels, and the control signal is transmitted from the portable electronic device to the controller.

4. The apparatus according to any one of claims 1 to 3, wherein The cooling device includes an air-flow-based cooling device or a direct-contact cooling device.

5. The device according to claim 4, wherein, The cooling device is in a modular unit in a cavity removably assembled to the main body, wherein electrical terminals are provided at the modular unit and complementary electrical terminals are provided at the cavity of the main body, such that when the modular unit is removably assembled to the cavity of the main body, the electrical terminals of the modular unit and the complementary electrical terminals engage.

6. The device according to claim 5, wherein, The modular unit is removably assembled to the cavity of the main body in a manner that can be interchanged between a modular unit having the air-flow-based cooling device and a modular unit having the direct-contact cooling device.

7. The apparatus according to any one of claims 1 to 6, wherein The main body includes a base frame and a support frame having an opening, wherein the support frame is removably coupled to the base frame, and the support frame of the main body is at the device resting side of the main body.

8. The apparatus according to claim 7, wherein, A sealing strip is lined along the edge of the opening of the support frame.

9. The device according to claim 7 or 8, wherein, The support frame includes at least one engaging element, and the base frame includes at least one complementary engaging element, wherein when the support frame is coupled to the base frame, the at least one engaging element of the support frame and the at least one complementary engaging element of the base frame form a detachable engagement.

10. The device according to any one of claims 7 to 9, wherein The support frame is removably coupled to the base frame in a manner that can be interchanged between different support frames having openings of different sizes.

11. The apparatus according to any one of claims 1 to 10, wherein, The main body includes a stopper at the device resting side, wherein when the portable electronic device is disposed on the device resting side, the stopper is used to support the edge of the portable electronic device.

12. The device according to claim 11, wherein, The stop member is movable relative to the cooling interface along the device resting side of the body and lockable at a predetermined position range from the cooling interface, wherein a suitable position of the stop member is determined by the portable electronic device.

13. A system for controlling cooling provided to a portable electronic device disposed on a portable electronic device holder, the system comprising: A portable electronic device holder, the portable electronic device holder comprising: A body having a device resting side; A cooling device disposed at the body, the cooling device having a cooling interface exposed through the device resting side of the body, wherein the cooling interface is capable of providing cooling to the portable electronic device disposed at the device resting side; A controller connected to the cooling device to control the cooling device, For providing cooling over a range of cooling levels via the cooling interface; and A communication interface connected to the controller; and The portable electronic device, Wherein the communication interface of the portable electronic device holder is connected to the portable electronic device to communicatively interconnect the controller of the portable electronic device holder and the portable electronic device by transmitting data between the controller and the portable electronic device, wherein the data is associated with the cooling provided via the cooling interface of the cooling device.

14. The system according to claim 13, wherein, The data includes cooling level information of the cooling provided by the cooling device via the cooling interface, and / or the data includes a control signal to control the cooling device to provide cooling at a cooling level corresponding to the control signal via the cooling interface.

15. The system according to claim 14, wherein, The portable electronic device receives the cooling level information from the controller of the portable electronic device holder, wherein the portable electronic device generates the control signal based on the received cooling level information and one or more or a combination of the system information and / or operating state of the portable electronic device.

16. The system according to claim 15, wherein, The system information of the portable electronic device includes one or more of type, brand, model, operating system, processor, memory, storage device, device driver, installed software, network configuration or system configuration, wherein the operating state of the portable electronic device includes one or more of temperature, power consumption, internal fan speed or load.

17. The system according to claim 15 or 16, wherein, The cooling level information includes the current cooling level of the cooling provided by the cooling device via the cooling interface.

18. The system according to claim 17, wherein, Each cooling level in the range of cooling levels is assigned a threshold load range, wherein the portable electronic device determines the current load of the portable electronic device and compares the current load of the portable electronic device with the corresponding threshold load range of the current cooling level.

19. The system according to claim 18, wherein, When the current load is greater than the upper limit value of the corresponding threshold load range, the portable electronic device sends the control signal from the portable electronic device to the controller of the portable electronic device holder to control the cooling device to adjust the cooling provided via the cooling interface to a higher cooling level.

20. The system according to claim 18, wherein When the current load is less than the lower limit value of the corresponding threshold load range, the portable electronic device sends the control signal from the portable electronic device to the controller of the portable electronic device holder to control the cooling device to adjust the cooling provided via the cooling interface to a lower cooling level.

21. The system according to any one of claims 18 to 20, Among them, The portable electronic device compares the current load of the portable electronic device with the previous load of the portable electronic device. Wherein, when the current load is different from the previous load, the portable electronic device continues to compare the current load of the portable electronic device with the corresponding threshold load range of the current cooling level.

22. The system according to claim 17, wherein The cooling level range is based on the system information of the portable electronic device.

23. The system according to claim 22, wherein, Each cooling level in the cooling level range is associated with a threshold temperature range of the processing unit of the portable electronic device. Wherein, the portable electronic device determines the current temperature of the processing unit of the portable electronic device and compares the current temperature of the processing unit of the portable electronic device with the corresponding threshold temperature range of the current cooling level.

24. The system according to claim 23, wherein, Each cooling level in the cooling level range is further associated with a threshold power range of the processing unit of the portable electronic device. Wherein, the portable electronic device further determines the current power of the processing unit of the portable electronic device and compares the current power of the processing unit of the portable electronic device with the corresponding threshold power range of the current cooling level.

25. The system according to claim 23 or 24, wherein, Each cooling level in the cooling level range is further associated with a threshold fan speed range of the fan unit of the portable electronic device. Wherein, the portable electronic device further determines the current fan speed of the fan unit of the portable electronic device and compares the current fan speed of the fan unit of the portable electronic device with the corresponding threshold fan speed range of the current cooling level.

26. The system according to claim 23, wherein When the current temperature of the processing unit of the portable electronic device is greater than the upper limit value of the corresponding threshold temperature range, the portable electronic device sends the control signal from the portable electronic device to the controller of the portable electronic device holder to control the cooling device to adjust the cooling provided via the cooling interface to a higher cooling level.

27. The system according to claim 23, wherein, When the current temperature of the processing unit of the portable electronic device is less than the lower limit value of the corresponding threshold temperature range, the portable electronic device sends the control signal from the portable electronic device to the controller of the portable electronic device holder, so as to control the cooling device to adjust the cooling provided via the cooling interface to a lower cooling level.

28. The system according to claim 24, wherein, When the current temperature of the processing unit of the portable electronic device is greater than the upper limit value of the corresponding threshold temperature range and / or when the current power of the processing unit of the portable electronic device is greater than the upper limit value of the corresponding threshold power range, the portable electronic device sends the control signal from the portable electronic device to the controller of the portable electronic device holder, so as to control the cooling device to adjust the cooling provided via the cooling interface to a higher cooling level.

29. The system according to claim 24, wherein When the current temperature of the processing unit of the portable electronic device is less than the lower limit value of the corresponding threshold temperature range and / or when the current power of the processing unit of the portable electronic device is less than the lower limit value of the corresponding threshold power range, the portable electronic device sends the control signal from the portable electronic device to the controller of the portable electronic device holder, so as to control the cooling device to adjust the cooling provided via the cooling interface to a lower cooling level.

30. The system according to claim 25, wherein, When the current temperature of the processing unit of the portable electronic device is greater than the upper limit value of the corresponding threshold temperature range, and / or when the current power of the processing unit of the portable electronic device is greater than the upper limit value of the corresponding threshold power range, and / or when the current fan speed of the fan unit of the portable electronic device is greater than the upper limit value of the corresponding fan speed range, the portable electronic device sends the control signal from the portable electronic device to the controller of the portable electronic device holder, so as to control the cooling device to adjust the cooling provided via the cooling interface to a higher cooling level.

31. The system according to claim 25, wherein When the current temperature of the processing unit of the portable electronic device is less than the lower limit value of the corresponding threshold temperature range, and / or when the current power of the processing unit of the portable electronic device is less than the lower limit value of the corresponding threshold power range, and / or when the current fan speed of the fan unit of the portable electronic device is greater than the lower limit value of the corresponding fan speed range, the portable electronic device sends the control signal from the portable electronic device to the controller of the portable electronic device holder, so as to control the cooling device to adjust the cooling provided via the cooling interface to a lower cooling level.

32. The system according to any one of claims 22 to 31, wherein The cooling level ranges of different portable electronic devices are stored in the memory of the portable electronic device.

33. A method for controlling cooling provided by a portable electronic device holder to a portable electronic device displaced thereto, wherein, The portable electronic device stand includes: a main body having a device placement side; a cooling device disposed at the main body, the cooling device having a cooling interface exposed through the device placement side of the main body, wherein when the portable electronic device is displaced on the device placement side, the cooling interface is capable of providing cooling to the portable electronic device; a controller connected to the cooling device to control the cooling device to provide cooling via the cooling interface over a range of cooling levels; and a communication interface capable of connecting to the portable electronic device to communicatively interconnect the controller and the portable electronic device. The method includes: Transferring data between the controller of the portable electronic device stand and the portable electronic device via the communication interface, wherein the data is associated with the cooling provided via the cooling interface of the cooling device, wherein the data includes cooling level information of the cooling provided by the cooling device via the cooling interface, and the cooling level information is transmitted from the controller to the device, wherein the data includes a control signal to control the cooling device to provide cooling via the cooling interface at a cooling level corresponding to the control signal, the cooling level being selected from the range of cooling levels, and the control signal is transmitted from the portable electronic device to the controller.