Laser irradiation device

Abstract

A laser irradiation device provides laser irradiation capable of improving heat dissipation performance. A laser irradiation device is provided with: an auxiliary mount having a first surface and a second surface on the opposite side from the first surface; a laser element that is provided on the first surface and that irradiates laser light; the heat dissipation part is arranged on the second surface; and a movement mechanism that changes the relative position between the laser element and the irradiation target.

Description

Technical Field

[0001] The present invention relates to a laser irradiation device. Background Art

[0002] There are known a processing device that irradiates a laser to process a processing object and a recording device that performs recording such as printing on a recording object.

[0003] For example, Patent Document 1 describes a three-dimensional printer device including: a printer head configured to have a light-emitting element array in which laser elements are arranged; a liquid tank that stores a photocurable liquid cured by light emitted from the printer head; and a stage unit to which a molded object formed by photocuring is attached.

[0004] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2021-154714

[0005] In a laser irradiation device that irradiates a laser as described above, improvement in heat dissipation is required. Summary of the Invention

[0006] One aspect of the laser irradiation device of the present invention includes: an auxiliary mounting member having a first surface and a second surface on the side opposite to the first surface; a laser element disposed on the first surface and irradiating a laser; a heat dissipation unit disposed on the second surface; and a moving mechanism that changes the relative position between the laser element and an irradiation object. Brief Description of the Drawings

[0007] Figure 1 is a perspective view schematically showing the laser irradiation device according to the first embodiment.

[0008] Figure 2 is a bottom view schematically showing the laser irradiation device according to the first embodiment.

[0009] Figure 3 is a cross-sectional view schematically showing the laser irradiation device according to the first embodiment.

[0010] Figure 4 is a cross-sectional view schematically showing the laser element of the laser irradiation device according to the first embodiment.

[0011] Figure 5 is a cross-sectional view schematically showing the laser irradiation device according to the first embodiment.

[0012] Figure 6 is a top view schematically showing the laser irradiation device according to the first embodiment.

[0013] Figure 7 is a cross-sectional view schematically showing the laser irradiation device according to the first embodiment.

[0014] Figure 8 This is a flowchart for explaining the processing of the control unit of the laser irradiation device according to the first embodiment.

[0015] Figure 9 This is a perspective view schematically showing the laser irradiation device according to the first modification of the first embodiment.

[0016] Figure 10 This is a top view schematically showing the laser irradiation device according to the second modification of the first embodiment.

[0017] Figure 11 This is a perspective view schematically showing the laser irradiation device according to the second embodiment.

[0018] Figure 12 This is a cross-sectional view schematically showing the laser irradiation device according to the second embodiment.

[0019] Figure 13 This is a flowchart for explaining the processing of the control unit of the laser irradiation device according to the second embodiment.

[0020] Figure 14 This is a perspective view schematically showing the laser irradiation device according to the modification of the second embodiment.

[0021] Reference Numeral Explanation

[0022] 2: Object to be irradiated; 2a: Molten portion; 2b: Non-molten portion; 4: Recording sheet; 6: Ribbon; 7: Ink layer; 8: Substrate; 10: Head; 11: Package; 11a: Base portion; 11b: Cover portion; 12: Auxiliary mounting member; 12a: First surface; 12b: Second surface; 13: First pad; 14: First wire bonding; 15: Through hole; 16: Second pad; 17: Second bonding wire; 18: Laser element; 20: Mounting substrate; 30: Support member; 40: Heat dissipation portion; 42: Plate-like portion; 44: Fins; 50: Moving mechanism; 52: Guide rail; 54: Conveyor portion; 56: Support portion; 60: Optical element; 70: Stage; 72: Stage base; 74: Lifting mechanism; 76: Housing; 80: Control unit; 90: Calibration device; 100: Laser irradiation device; 101: Substrate; 102: First semiconductor layer; 103: First guiding layer; 103a: Opening; 104: Light emitting layer; 105: Second guiding layer; 106: Second semiconductor layer; 107: Contact layer; 108: First electrode; 109: Second electrode; 109a: Through hole; 110: Laser irradiation device; 112: Fixing portion; 114: Base; 120, 200: Laser irradiation device; 202: Support rod; 210: Laser irradiation device; 220: Storage portion; 222: Cover; 224: Rod; 226: Discharge port; 228: Power switch; 230: Cutter. Detailed implementation manners

[0023] Hereinafter, preferred implementation manners of the present invention will be described in detail with reference to the accompanying drawings. In addition, the implementation manners described below do not unduly limit the content of the present invention recited in the claims. Further, not all of the structures described below are necessarily constituent elements essential to the present invention.

[0024] 1. First implementation manner

[0025] 1.1. Laser irradiation device

[0026] 1.1.1. Structure

[0027] First, the laser irradiation device of the first implementation manner will be described with reference to the accompanying drawings. Figure 1 is a perspective view schematically showing the laser irradiation device 100 of the first implementation manner. Figure 2 is a bottom view schematically showing the laser irradiation device 100. Figure 3 is a schematic illustration of the laser irradiation device 100 along Figure 2 sectional view taken along line III-III.

[0028] In addition, for convenience, in Figure 2 , illustrations of components of the laser irradiation device 100 other than the head 10 are omitted. Further, in Figure 3 , the laser element 18 of the laser irradiation device 100 is illustrated in a simplified manner. In addition, in Figures 1 to 3 , as three mutually orthogonal axes, the X-axis, Y-axis, and Z-axis are illustrated. The X-axis direction and the Y-axis direction are, for example, horizontal directions. The Z-axis direction is, for example, a vertical direction.

[0029] As Figures 1 to 3 shows, the laser irradiation device 100 has, for example, a head 10, a mounting substrate 20, a support member 30, a heat dissipation portion 40, a moving mechanism 50, an optical element 60, a stage 70, and a control portion 80. The laser irradiation device 100 is, for example, a laser processing device. The laser irradiation device 100 is, for example, a metal 3D printer that utilizes the selective laser melting (SLM) method.

[0030] As Figure 2 and Figure 3 show, the head 10 has, for example, a package 11, an auxiliary mounting member 12, a first pad 13, a first bonding wire 14, a through hole 15, a second pad 16, a second bonding wire 17, and a laser element 18.

[0031] As Figure 3As shown, the package 11 houses the auxiliary mounting member 12, the first pad 13, the first bonding wire 14, the second pad 16, the second bonding wire 17, and the laser element 18.

[0032] The package 11 has, for example, a base portion 11a and a lid portion 11b. The base portion 11a is mounted on the mounting substrate 20. The material of the base portion 11a is, for example, a ceramic such as aluminum nitride or alumina. The lid portion 11b is connected to the base portion 11a. The lid portion 11b allows the light from the laser element 18 to pass through. The material of the lid portion 11b is, for example, quartz, glass, etc.

[0033] The auxiliary mounting member 12 is provided on the base portion 11a. The shape of the auxiliary mounting member 12 is, for example, plate-shaped. The auxiliary mounting member 12 has a first surface 12a and a second surface 12b on the side opposite to the first surface 12a. The first surface 12a and the second surface 12b face in opposite directions. In the illustrated example, the first surface 12a faces the -Z axis direction. The second surface 12b faces the +Z axis direction. In Figure 2 In the illustrated example, the shape of the auxiliary mounting member 12 is quadrilateral. The auxiliary mounting member 12 has, for example, insulation. The material of the auxiliary mounting member 12 is, for example, a ceramic such as aluminum nitride or alumina.

[0034] The first pad 13 is provided on the base portion 11a of the package 11. The first pad 13 is electrically connected to the laser element 18 via the first bonding wire 14. The first pad 13 is provided, for example, with only one. The first pad 13 is electrically connected to the drive circuit provided on the mounting substrate 20 via the through hole 15.

[0035] The second pad 16 is provided on the base portion 11a of the package 11. The second pad 16 is electrically connected to the laser element 18 via the second bonding wire 17. A plurality of second pads 16 are provided corresponding to a plurality of laser elements 18. In the illustrated example, the plurality of second pads 16 are arranged in the Y-axis direction. The second pad 16 is electrically connected to the drive circuit provided on the mounting substrate 20 via an unillustrated through hole. The materials of the pads 13, 16, the bonding wires 14, 17, and the through hole 15 are copper, aluminum, gold, etc.

[0036] The laser element 18 is provided on the first surface 12a of the auxiliary mounting member 12. In the illustrated example, the laser element 18 is in contact with the first surface 12a. The laser element 18 irradiates laser light in the -Z axis direction, for example. The laser element 18 is, for example, a Photonic Crystal Surface Emitting Laser (PCSEL) that utilizes the photonic crystal effect. The emission angle of the laser light emitted from the laser element 18 as a PCSEL is narrow and the light output is high. A plurality of laser elements 18 are provided, for example. In the illustrated example, eight laser elements 18 are provided, but the number thereof is not particularly limited. The plurality of laser elements 18 are arranged in the Y-axis direction, for example.

[0037] Figure 4 is a cross-sectional view schematically showing the laser element 18. As Figure 4 shown, the laser element 18 has, for example, a substrate 101, a first semiconductor layer 102, a first guiding layer 103, a light-emitting layer 104, a second guiding layer 105, a second semiconductor layer 106, a contact layer 107, a first electrode 108, and a second electrode 109.

[0038] The substrate 101 is, for example, an n-type semiconductor substrate doped with Si. The substrates 101 are continuous with each other in adjacent laser elements 18. The substrate 101 is integrally provided in a plurality of laser elements 18. The substrate 101 is a shared substrate in a plurality of laser elements 18.

[0039] The first semiconductor layer 102 is provided on the substrate 101. The first semiconductor layer 102 is provided between the substrate 101 and the first guiding layer 103. The first semiconductor layer 102 is, for example, an n-type GaN layer doped with Si.

[0040] The first guiding layer 103 is provided on the first semiconductor layer 102. The first guiding layer 103 is provided between the first semiconductor layer 102 and the light-emitting layer 104. The first guiding layer 103 has, for example, an SL (Semiconductor Superlattice) structure composed of an i-type GaN layer and an InGaN layer that are not intentionally doped with impurities. The number of the GaN layer and the InGaN layer constituting the first guiding layer 103 is not particularly limited.

[0041] An opening 103a is formed in the first guiding layer 103. The opening 103a is, for example, a void. The planar shape of the opening 103a is, for example, a circle, a polygon, or the like. The diameter of the opening 103a is, for example, 50 nm or more and 500 nm or less.

[0042] In addition, when the planar shape of the opening 103a is a circle, the "diameter of the opening 103a" is the diameter, and when the planar shape of the opening 103a is not a circular shape, the "diameter of the opening 103a" is the diameter of the smallest circumscribed circle. For example, when the planar shape of the opening 103a is a polygon, the diameter of the opening 103a is the diameter of the smallest circle that contains the polygon inside, and when the planar shape of the opening 103a is an ellipse, the diameter of the opening 103a is the diameter of the smallest circle that contains the ellipse inside.

[0043] A plurality of opening portions 103a are provided. The plurality of opening portions 103a are separated from each other. The interval between adjacent opening portions 103a is, for example, 1 nm or more and 500 nm or less. The plurality of opening portions 103a are arranged at a prescribed pitch in a prescribed direction in a plan view. The plurality of opening portions 103a are arranged, for example, in a regular triangular lattice pattern or a square lattice pattern. The plurality of opening portions 103a exhibit a photonic crystal effect.

[0044] In addition, the "pitch of the opening portions 103a" means the distance between the centers of adjacent opening portions 103a along the prescribed direction. When the planar shape of the opening portion 103a is circular, the "center of the opening portion 103a" is the center of the circle, and when the planar shape of the opening portion 103a is a shape other than a circle, the "center of the opening portion 103a" is the center of the minimum enclosing circle. For example, when the planar shape of the opening portion 103a is a polygon, the center of the opening portion 103a is the center of the smallest circle that encloses the polygon inside, and when the planar shape of the opening portion 103a is an ellipse, the center of the opening portion 103a is the center of the smallest circle that encloses the ellipse inside.

[0045] The light-emitting layer 104 is provided on the first guiding layer 103. The light-emitting layer 104 is provided between the first guiding layer 103 and the second guiding layer 105. The light-emitting layer 104 emits light when current is injected. The light-emitting layer 104 has, for example, a well layer and a barrier layer. The well layer and the barrier layer are i-type semiconductor layers that are not intentionally doped with impurities. The well layer is, for example, an InGaN layer. The barrier layer is, for example, a GaN layer. The light-emitting layer 104 has a MQW (Multiple Quantum Well) structure composed of a well layer and a barrier layer.

[0046] In addition, the number of the well layer and the barrier layer constituting the light-emitting layer 104 is not particularly limited. For example, only one well layer may be provided, and in this case, the light-emitting layer 104 has a SQW (Single Quantum Well) structure.

[0047] The second guiding layer 105 is provided on the light-emitting layer 104. The second guiding layer 105 is provided between the light-emitting layer 104 and the second semiconductor layer 106. The second guiding layer 105 has, for example, a SL structure composed of an i-type GaN layer and an InGaN layer that are not intentionally doped with impurities. The number of the GaN layer and the InGaN layer constituting the second guiding layer 105 is not particularly limited. The first guiding layer 103 and the second guiding layer 105 have a function of increasing the light confinement factor of the laser element 18.

[0048] In addition, although not shown, a plurality of opening portions 103a may be formed not in the first guiding layer 103 but in the second guiding layer 105. Alternatively, the opening portions 103a may be filled with a member having a refractive index lower than that of the first guiding layer 103.

[0049] The second semiconductor layer 106 is provided on the second guiding layer 105. The second semiconductor layer 106 is provided between the second guiding layer 105 and the contact layer 107. The second semiconductor layer 106 is, for example, a p-type GaN layer doped with Mg. The first semiconductor layer 102 and the second semiconductor layer 106 are cladding layers having a function of confining light in the light-emitting layer 104.

[0050] The contact layer 107 is provided on the second semiconductor layer 106. The contact layer 107 is provided between the second semiconductor layer 106 and the second electrode 109. The contact layer 107 is, for example, a p-type GaN layer doped with Mg. The impurity concentration of the contact layer 107 is higher than that of the second semiconductor layer 106.

[0051] The first electrode 108 is provided in the +Z-axis direction of the substrate 101. The substrate 101 may be in ohmic contact with the first electrode 108. The first electrode 108 is electrically connected to the first semiconductor layer 102 via the substrate 101. The first electrode 108 is electrically connected to the first pad 13 via the first bonding wire 14. The first electrodes 108 are continuous with each other in adjacent laser elements 18. The first electrodes 108 are integrally provided in the plurality of laser elements 18. The first electrode 108 is a common electrode in the plurality of laser elements 18. The first electrode 108 is, for example, formed by sequentially laminating a Ni layer and an Au layer from the substrate 101 side. The first electrode 108 is an electrode for injecting current into the light-emitting layer 104.

[0052] The second electrode 109 is provided on the contact layer 107. The contact layer 107 may be in ohmic contact with the second electrode 109. The second electrode 109 is electrically connected to the second semiconductor layer 106 via the contact layer 107. The second electrode 109 is electrically connected to the second pad 16 via the second bonding wire 17. The second electrode 109 is, for example, formed by sequentially laminating a Cr layer, a Ni layer, and an Au layer from the contact layer 107 side. The second electrode 109 is another electrode for injecting current into the light-emitting layer 104.

[0053] A through hole 109a is formed in the second electrode 109. The through hole 109a penetrates the second electrode 109. The light generated by the light-emitting layer 104 is emitted through the through hole 109a. When viewed from the Z-axis direction, the region of the contact layer 107 overlapping with the through hole 109a is a light-emitting region where the light generated by the light-emitting layer 104 is emitted.

[0054] In the laser element 18, a PIN diode is constituted by a second semiconductor layer 106 of p-type, a light-emitting layer 104 of i-type that is not intentionally doped with impurities, and guiding layers 103, 105, and a first semiconductor layer 102 of n-type. In the laser element 18, when a forward bias voltage of the PIN diode is applied between the first electrode 108 and the second electrode 109 through a driving circuit (not shown), current is injected into the light-emitting layer 104, and recombination of electrons and holes is caused in the light-emitting layer 104. Light emission is generated by this recombination. The light generated in the light-emitting layer 104 propagates in a direction perpendicular to the Z-axis direction, and a standing wave is formed by the photonic crystal effect of a plurality of openings 103a, and gain is obtained in the light-emitting layer 104 to perform laser oscillation. And, in the laser element 18, diffracted light is emitted as a laser in the Z-axis direction.

[0055] In addition, in the above, the InGaN-based light-emitting layer 104 has been described, but as the light-emitting layer 104, various material systems that can emit light by injecting current according to the wavelength of the emitted light can be used. For example, semiconductor materials such as AlGaN-based, AlGaAs-based, InGaAs-based, InGaAsP-based, InP-based, GaP-based, and AlGaP-based can be used.

[0056] Figure 5 is a cross-sectional view schematically showing the laser irradiation device 100. Figure 6 is a top view schematically showing the laser irradiation device 100. In addition, Figure 5 is along Figure 6 the V-V line cross-sectional view. In addition, for convenience, in Figure 5 the illustration of components other than the head 10, the mounting substrate 20, the support member 30, and the heat dissipation part 40 is omitted.

[0057] As Figure 5 and Figure 6 shown, the mounting substrate 20 supports the head 10. In the illustrated example, the mounting substrate 20 is provided in the +Z-axis direction of the head 10. The mounting substrate 20 is provided between the head 10 and the support member 30. The mounting substrate 20 is, for example, a ceramic substrate. The mounting substrate 20 may also be a silicon substrate. A driving circuit for driving the laser element 18 may be provided in the mounting substrate 20.

[0058] The support member 30 supports the mounting substrate 20. In the illustrated example, the support member 30 is provided in the +Z-axis direction of the mounting substrate 20. The support member 30 is provided between the mounting substrate 20 and the heat dissipation part 40. The shape of the support member 30 is, for example, plate-shaped. As Figure 6 shown, the support member 30 is supported by two guide rails 52 of the moving mechanism 50. The support member 30 straddles the two guide rails 52. The material of the support member 30 is, for example, a metal such as iron, aluminum, or copper.

[0059] The heat dissipation part 40 is supported by the support member 30. In the illustrated example, the heat dissipation part 40 is disposed in the +Z axis direction of the support member 30. The heat dissipation part 40 is disposed on the second surface 12b of the auxiliary mounting member 12 via, for example, the support member 30, the mounting substrate 20, and the base 11a of the package 11. In other words, the heat dissipation part 40 and the auxiliary mounting member 12 are thermally connected to each other via the support member 30, the mounting substrate 20, and the base 11a of the package 11. By thermal connection is meant a state in which, in a state of being directly connected to each other or connected to each other via a heat-conductive substance, heat conduction can be performed between the connected ones. The heat dissipation part 40 dissipates the heat generated by the laser element 18 via the auxiliary mounting member 12, the base 11a, the mounting substrate 20, and the support member 30. The heat dissipation part 40 has, for example, electrical conductivity. The thermal conductivity of the heat dissipation part 40 is, for example, higher than the thermal conductivity of the substrate 101, the thermal conductivity of the auxiliary mounting member 12, and the thermal conductivity of the mounting substrate 20. The thermal conductivity of the heat dissipation part 40 may also be higher than the thermal conductivity of the support member 30. The material of the heat dissipation part 40 is, for example, a metal such as copper.

[0060] As Figure 5 shown, the heat dissipation part 40 has, for example, a plate-like part 42 and a plurality of fins 44. The plate-like part 42 is disposed on the support member 30. The plate-like part 42 is disposed between the support member 30 and the plurality of fins 44. The fins 44 are disposed on the plate-like part 42. In the illustrated example, the fins 44 project from the plate-like part 42 in the +Z axis direction. The fins 44 are, for example, integrally provided with the plate-like part 42. The plurality of fins 44 are arranged in the Y axis direction, for example. As Figure 6 shown, when viewed from the Z axis direction, the fins 44 extend in the X axis direction.

[0061] The moving mechanism 50 has, for example, guide rails 52 and a motor (not shown). Two guide rails 52 are provided, for example. The two guide rails 52 are arranged in the Y axis direction. The auxiliary mounting member 12 is supported by the two guide rails 52 via the base 11a of the package 11, the mounting substrate 20, and the support member 30. The two guide rails 52 do not overlap the irradiation object 2 in a top view. The two guide rails 52 do not overlap the head 10 in a top view. That is, the two guide rails 52 do not overlap the laser element 18 in a top view.

[0062] The moving mechanism 50 changes the relative position between the laser element 18 and the irradiation object 2 by a motor (not shown). The motor is controlled by the control unit 80. In the illustrated example, the moving mechanism 50 moves the laser element 18 in the +X axis direction. The moving mechanism 50 moves the head 10, the mounting substrate 20, the support member 30, and the heat dissipation part 40 in the +X axis direction. The guide rails 52 extend in the X axis direction, for example. The moving mechanism 50 moves the laser element 18 along the guide rails 52. The moving mechanism 50 may also have an encoder (not shown). The moving mechanism 50 does not move the irradiation object 2.

[0063] Figure 7 is a VII-VII line cross-sectional view schematically showing the laser irradiation device 100. Additionally, for ease of explanation, in Figure 1 , the head 10 is illustrated in a simplified manner. Furthermore, in Figure 7 , the illustration of the mounting substrate 20, the support member 30, the heat dissipation portion 40, and the moving mechanism 50 is omitted. Figure 7 As shown in

[0064] , the laser L emitted from the laser element 18 is incident on the optical element 60. The optical element 60 is disposed between the head 10 and the irradiation object 2. Although not shown, the optical element 60 may also be supported by the guide rail 52. The optical element 60 condenses, for example, the laser L from the laser element 18. The optical element 60 is, for example, a lens array. The focal points of the lenses constituting the optical element 60 are preferably located on the irradiation object 2. Thereby, the irradiation time of the irradiation object 2 can be shortened. The lenses constituting the optical element 60 are provided, for example, in a plurality corresponding to the number of laser elements 18. Figure 7 The irradiation object 2 is supplied and placed on the stage 70. The irradiation object 2 is disposed between the head 10 and the stage 70. The irradiation object 2 is, for example, a processing object to be processed by the laser L from the laser element 18. The irradiation object 2 is, for example, a metal powder that can be melted by the laser L. The irradiation object 2 is supplied by a supply machine (not shown).

[0065] The stage 70 has, for example, a stage base 72, a lifting mechanism 74, and a housing 76 that houses the stage base 72 and the lifting mechanism 74.

[0066] The irradiation object 2 is supplied onto the stage base 72. The head 10 irradiates the laser L onto the irradiation object 2 on the stage base 72, and a molten portion 2a and a non-molten portion 2b are formed on the irradiation object 2. After the molten portion 2a is melted by the irradiation of the laser L, it is cooled and becomes a solidified state. The non-molten portion 2b is not irradiated with the laser L. Therefore, the non-molten portion 2b does not solidify and remains in the state of metal powder.

[0067] The lifting mechanism 74 supports the stage base 72. In the illustrated example, the lifting mechanism 74 moves the stage base 72 in the -Z axis direction. As the stage base 72 moves, the irradiation object 2 moves. After the stage base 72 moves in the -Z axis direction, the supply machine supplies the irradiation object 2 of the second layer again. The irradiation object 2 of the second layer is supplied onto the irradiation object 2 of the first layer. Then, the head 10 irradiates the laser L onto the irradiation object 2 of the second layer.

[0068]

[0069] ​As described above, by repeatedly performing a series of steps including the supply of the supply machine to the irradiation object 2, the irradiation of the laser L by the head 10, and the movement of the lifting mechanism 74 for the stage base 72, a laminate composed of multiple layers of irradiation objects 2 can be formed. Then, the non-molten portion 2b of the laminate is removed by a removal device (not shown), thereby shaping a three-dimensional object with a specified shape. As the removal device, for example, air blowing, brushes, etc. can be cited.

[0070] The control unit 80 is composed of, for example, a computer having a processor, a main storage device, and an input / output interface for inputting / outputting signals to / from the outside. The control unit 80 exhibits various functions by, for example, the processor executing a program read into the main storage device. Specifically, the control unit 80 controls the laser element 18, the movement mechanism 50, and the lifting mechanism 74. In addition, the control unit 80 may not be a computer but may be composed of a combination of multiple circuits.

[0071] In addition, as Figure 1 shown, the laser irradiation device 100 may also have a correction device 90. The correction device 90 may have a light receiving element for receiving the laser L. If the correction device 90 is provided, even if the characteristics of the laser element 18 deviate from the design values, the deviation can be detected by the correction device 90 and fed back to the processing.

[0072] 1.1.2. Operation

[0073] Next, the operation of the laser irradiation device 100 of the first embodiment will be described with reference to the drawings. Specifically, the processing of the control unit 80 of the laser irradiation device 100 of the first embodiment will be described with reference to the drawings. Figure 8 is a flowchart for explaining the processing of the control unit 80.

[0074] The user operates, for example, an operation unit (not shown) to output a processing start signal for starting the processing to the control unit 80. The operation unit is composed of, for example, a mouse, a keyboard, a touch panel, etc. The control unit 80 starts the processing when it receives the processing start signal.

[0075] First, as Figure 8 shown, the control unit 80 performs a data acquisition process (step S1) for acquiring the modeling data for modeling the three-dimensional object.

[0076] The modeling data includes, for example, information related to the material of the metal powder constituting the irradiation object 2, the number of layers of the irradiation object 2, the moving speed of the head 10, the on / off of the multiple laser elements 18, etc.

[0077] The shaping data is produced, for example, by having the slicing software installed on a computer connected to the laser irradiation device 100 read in the shape data. The shape data is data representing the target shape of a three-dimensional model produced using three-dimensional CAD (Computer Aided Design) software, three-dimensional CG (Computer Graphics) software, etc. As the shape data, for example, data in the STL (Standard Triangulated Language) format, AMF (Additive Manufacturing File Format), etc. is used. The slicing software divides the target shape of the three-dimensional model into layers of a specified thickness and produces shaping data for each layer. The shaping data is represented by G codes, M codes, etc. The control unit 80 obtains the shaping data from a recording medium such as a computer connected to the laser irradiation device 100 or a USB (Universal Serial Bus) memory.

[0078] Next, the control unit 80 controls the laser element 18 and the moving mechanism 50 to perform a machining process (step S2) of irradiating the object to be irradiated 2 with the laser L and changing the relative position between the laser element 18 and the object to be irradiated 2.

[0079] Specifically, based on the shaping data, the control unit 80 causes the laser element 18 to irradiate the laser L and drives the motor of the moving mechanism 50 to move the laser element 18 in the +X-axis direction. Thereby, the object to be irradiated 2 can be machined. As Figure 7 shown, a molten portion 2a and a non-molten portion 2b are formed in the object to be irradiated 2.

[0080] Next, as Figure 8 shown, the control unit 80 performs a determination process (step S3) of determining whether the formation of all layers of the object to be irradiated 2 is completed, based on the shaping data.

[0081] In the case where it is determined that the formation of all layers of the object to be irradiated 2 is not completed (in step S3, "no"), the control unit 80 returns the process to step S2. The control unit 80 repeats step S2 and step S3 until it is determined in step S3 that the formation of all layers of the object to be irradiated 2 is completed.

[0082] On the other hand, in the case where the control unit 80 determines that the formation of all layers of the object to be irradiated 2 is completed (in step S3, "yes"), the control unit 80 performs a non-molten portion removal process (step S4) of causing the removal device to remove the non-molten portion 2b of the laminate formed by the object to be irradiated 2. Thereby, a three-dimensional model is shaped. Then, the control unit 80 ends the process.

[0083] In addition, the removal of the non-molten portion 2b can also be manually performed by the user. In this case, the control unit 80 ends the process after determining that the formation of all the layers of the irradiation object 2 is completed.

[0084] 1.1.3. Effects

[0085] In the laser irradiation device (100), there are provided: an auxiliary mounting member (12) having a first surface (12a) and a second surface (12b) on the side opposite to the first surface (12a); a laser element (18) disposed on the first surface (12a) and irradiating a laser (L); a heat dissipation part (40) disposed on the second surface (12b); and a moving mechanism (50) that changes the relative position between the laser element (18) and the irradiation object (2).

[0086] Therefore, in the laser irradiation device 100, the heat of the laser element 18 can be dissipated from the heat dissipation part 40 via the auxiliary mounting member 12. Therefore, the heat dissipation performance can be improved. Therefore, the output variation of the laser element 18 caused by heat can be reduced. As a result, the stabilization of the operation of the laser element 18 can be achieved.

[0087] In the laser irradiation device 100, the auxiliary mounting member 12 has insulation properties. Therefore, in the laser irradiation device 100, it is possible to suppress current from reaching the heat dissipation part 40 through the auxiliary mounting member 12.

[0088] In the laser irradiation device 100, the heat dissipation part 40 has conductivity. Therefore, the heat dissipation part 40 can have a high thermal conductivity.

[0089] In the laser irradiation device 100, the moving mechanism 50 has two guide rails 52, and the auxiliary mounting member 12 is supported by the two guide rails 52. Therefore, in the laser irradiation device 100, the auxiliary mounting member 12 can be supported more stably compared to the case where the auxiliary mounting member is supported by one guide rail.

[0090] In the laser irradiation device 100, the two guide rails 52 do not overlap the laser element 18 in a top view. Therefore, in the laser irradiation device 100, the heat of the laser element 18 can be efficiently dissipated from the heat dissipation part 40.

[0091] In the laser irradiation device 100, the heat dissipation part 40 has a plurality of fins 44. Therefore, in the laser irradiation device 100, the heat of the laser element 18 can be dissipated from the plurality of fins 44.

[0092] In the laser irradiation device 100, the moving mechanism 50 moves the laser element 18 in the X-axis direction as the first direction, and in a top view, the plurality of fins 44 extend in the X-axis direction respectively. Therefore, in the laser irradiation device 100, the air resistance received by the fins 44 can be reduced. Thereby, the laser element 18 can move smoothly.

[0093] In the laser irradiation device 100, the object 2 to be irradiated is an object to be processed that is processed by the laser L from the laser element 18. Therefore, in the laser irradiation device 100, the object 2 to be irradiated can be processed with high precision.

[0094] In the laser irradiation device 100, the laser element 18 is a PCSEL. Therefore, in the laser irradiation device 100, the emission angle of the laser L from the laser element 18 can be narrowed. As a result, the irradiation time of the object 2 to be irradiated can be shortened.

[0095] 1.2. Modified examples of the laser irradiation device

[0096] 1.2.1. First modified example

[0097] Next, the laser irradiation device according to the first modified example of the first embodiment will be described with reference to the drawings. Figure 9 FIG. is a cross-sectional view schematically showing the laser irradiation device 110 according to the first modified example of the first embodiment.

[0098] Hereinafter, in the laser irradiation device 110 according to the first modified example of the first embodiment, components having the same functions as those of the components of the laser irradiation device 100 of the above-described first embodiment are denoted by the same reference numerals, and detailed descriptions thereof are omitted. The same applies to the laser irradiation device according to the second modified example of the first embodiment described later.

[0099] In the above-described laser irradiation device 100, as Figure 1 shown, during the processing, the head 10 moves in the +X-axis direction.

[0100] In contrast, in the laser irradiation device 110, as Figure 9 shown, the head 10 is fixed to the fixing portion 112. The laser irradiation device 110 has, for example, a fixing portion 112 and a base 114.

[0101] The fixing portion 112 is provided across the guide rail 52 of the moving mechanism 50. The head 10 does not move during the processing. The head 10 is separated from the moving mechanism 50 and is located above the moving mechanism 50. Only one guide rail 52 is provided.

[0102] The base 114 supports the guide rail 52. The guide rail 52 is provided on the base 114. The stage 70 is provided on the guide rail 52. The control unit 80 controls the moving mechanism 50 during the processing to move the stage 70 in the +X-axis direction. Along with the movement of the stage 70, the object 2 to be irradiated moves in the +X-axis direction. As a result, the relative position between the laser element 18 and the object 2 to be irradiated changes.

[0103] 1.2.2. Second modified example

[0104] Next, a laser irradiation apparatus according to a second modification of the first embodiment will be described with reference to the accompanying drawings. Figure 10 FIG. is a plan view schematically showing a laser irradiation apparatus 120 according to a second modification of the first embodiment.

[0105] In the above-described laser irradiation apparatus 100, as Figure 6 shown, when viewed from the Z-axis direction, the fins 44 extend in the X-axis direction.

[0106] In contrast, in the laser irradiation apparatus 120, as Figure 10 shown, when viewed from the Z-axis direction, the fins 44 extend in a direction inclined with respect to the X-axis direction. That is, when viewed from the Z-axis direction, the fins 44 do not extend in the X-axis direction and do not extend in a direction perpendicular to the X-axis direction. The fins 44 extend in a direction inclined with respect to the X-axis direction and the Y-axis direction. In the illustrated example, the fins 44 extend in a direction inclined 30° with respect to the X-axis direction. In addition, the extending direction of the fins 44 is only required to be inclined with respect to the X-axis direction and is not particularly limited.

[0107] In the laser irradiation apparatus 120, the moving mechanism 50 moves the laser element 18 in the X-axis direction as the first direction, and in a plan view, the plurality of fins 44 respectively extend in a second direction inclined with respect to the X-axis direction. Therefore, in the laser irradiation apparatus 120, the amount of air coming into contact with the fins 44 can be increased. Thereby, the heat dissipation performance can be improved. In addition, although not shown, a cooling fan for cooling the heat dissipation part 40 may be provided in the -X-axis direction of the heat dissipation part 40. The cooling fan may also blow air in the +X-axis direction.

[0108] 2. Second Embodiment

[0109] 2.1. Laser Irradiation Apparatus

[0110] Next, a laser irradiation apparatus according to the second embodiment will be described with reference to the accompanying drawings. Figure 11 FIG. is a perspective view schematically showing a laser irradiation apparatus 200 according to the second embodiment. Figure 12 FIG. is a cross-sectional view taken along line XII-XII of the laser irradiation apparatus 200 according to the second embodiment. In addition, for ease of explanation, in Figure 11 , the head 10 is illustrated in a simplified manner. Further, in Figure 12 , illustration of the mounting substrate 20, the support member 30, and the heat dissipation part 40 is omitted. Figure 12

[0111] ​Hereinafter, in the laser irradiation device 200 of the second embodiment, components having the same functions as the components of the laser irradiation device 100 of the above-described first embodiment are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

[0112] In the above-described laser irradiation device 100, as Figure 1 and Figure 7 shown, the object to be irradiated 2 is an object to be processed that is processed by the laser L from the laser element 18.

[0113] In contrast, in the laser irradiation device 200, as Figure 11 and Figure 12 shown, the object to be irradiated 2 is an object to be recorded that is recorded by the laser L from the laser element 18. The laser irradiation device 200 is a recording device.

[0114] In the laser irradiation device 200, for example, there is a support bar 202. For example, two support bars 202 are provided. In the illustrated example, the two support bars 202 are arranged in the Y-axis direction. The support bar 202 has a shape extending in the X-axis direction. The head 10 is supported by the support member 30 on the support bar 202.

[0115] The moving mechanism 50 is separated from the support member 30. The moving mechanism 50 is located in the -Z-axis direction of the head 10. The moving mechanism 50 has, for example, a conveying unit 54 and a support unit 56.

[0116] The conveying unit 54 conveys the object to be irradiated 2 toward the support unit 56. In the illustrated example, the conveying unit 54 conveys the object to be irradiated 2 in the -X-axis direction. The object to be irradiated 2 is wound around the conveying unit 54. The conveying unit 54 is, for example, a roller that supplies the object to be irradiated 2 to the support unit 56. The shape of the object to be irradiated 2 is, for example, sheet-like.

[0117] The support unit 56 is provided, for example, in the -X-axis direction of the conveying unit 54. When recording on the object to be irradiated 2, the support unit 56 supports the object to be irradiated 2 conveyed from the conveying unit 54. The support unit 56 is, for example, a paper pressing roller. In the illustrated example, the conveying unit 54 and the support unit 56 rotate about the Y-axis. The rotation of the conveying unit 54 and the support unit 56 is controlled by the control unit 80, for example. By the rotation of the conveying unit 54 and the support unit 56, the moving mechanism 50 moves the object to be irradiated 2 in the -X-axis direction.

[0118] In the recording process of the object to be irradiated 2, the object to be irradiated 2 is located between the head 10 and the support unit 56. The object to be irradiated 2 has, for example, a recording sheet 4 and an ink ribbon 6 provided on the recording sheet 4. As Figure 12As shown, the ink ribbon 6 has, for example, an ink layer 7 composed of a heat-fusible ink liquid and a base 8 provided on the ink layer 7. The base 8 is, for example, transparent. When the laser L is irradiated from the head 10, the irradiated portion of the ink layer 7 melts and is transferred to the recording sheet 4. Thereby, recording such as printing can be performed on the recording sheet 4. The laser irradiation device 200 is, for example, a thermal transfer type thermal printer. In addition, for ease of explanation, in Figure 12 the recording sheet 4 and the ink ribbon 6 are separated from each other, but usually the recording sheet 4 and the ink ribbon 6 are in contact with each other.

[0119] Here, Figure 13 is a flowchart for explaining the processing of the control unit 80 of the laser irradiation device 200. The user operates, for example, an operation unit (not shown) and outputs a processing start signal for starting the processing to the control unit 80. The control unit 80 starts the processing when it receives the processing start signal.

[0120] First, as Figure 13 shown, the control unit 80 performs data acquisition processing (step S11) for acquiring print data generated by the user.

[0121] Next, the control unit 80 controls the laser element 18 and the moving mechanism 50 to perform recording processing (step S12) in which the relative position of the laser element 18 and the irradiation object 2 is changed while irradiating the irradiation object 2 with the laser L.

[0122] Specifically, the control unit 80 irradiates the laser L from the laser element 18 based on the print data and drives the conveying unit 54 of the moving mechanism 50 to move the irradiation object 2 in the -X axis direction. Thereby, recording can be performed on the irradiation object 2.

[0123] Then, the control unit 80 ends the processing.

[0124] In the laser irradiation device 200, the irradiation object 2 is a recording object to be recorded by the laser L from the laser element 18. Therefore, in the laser irradiation device 200, the irradiation object 2 can be recorded with high precision.

[0125] 2.2. Modification Example of Laser Irradiation Device

[0126] Next, a laser irradiation device according to a modification example of the second embodiment will be described with reference to the drawings. Figure 14 is a perspective view schematically showing a laser irradiation device 210 according to a modification example of the second embodiment.

[0127] Hereinafter, in the laser irradiation device 210 according to the modification example of the second embodiment, components having the same functions as those of the components of the laser irradiation device 200 of the above-described second embodiment are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

[0128] The laser irradiation device 210 is a receipt printer, which is different from the above-described laser irradiation device 200. The laser irradiation device 210 is provided, for example, at the cash register of stores such as supermarkets, convenience stores, and restaurants. Moreover, in the laser irradiation device 210, according to the settlement performed at the cash register, a receipt is issued with the result of printing an image on the irradiation object 2. The material of the irradiation object 2 is, for example, paper. In addition, the material of the irradiation object 2 may also be polyethylene (PE), polyethylene terephthalate (PET), or polypropylene (PP).

[0129] As Figure 14 shown, the laser irradiation device 210 has, for example, a storage unit 220 and a cutter 230.

[0130] The storage unit 220 stores the irradiation object 2 wound in a roll shape, the head 10, the mounting substrate 20, the support member 30, the heat dissipation unit 40, the moving mechanism 50, and the cutter 230. The storage unit 220 has an openable and closable cover 222. The cover 222 is opened by being pressed by the user with a rod 224. The user can supplement or replace the irradiation object 2 wound in a roll shape in the state where the cover 222 is open. A discharge port 226 for discharging the printed irradiation object 2 is provided in the cover 222. And, a power switch 228 for switching the power supply of the laser irradiation device 210 on and off is provided in the storage unit 220.

[0131] The cutter 230 is provided at a position corresponding to the discharge port 226. The cutter 230 cuts the printed irradiation object 2. Thereby, a receipt is generated. The shape of the cutter 230 is not particularly limited as long as it can cut the irradiation object 2.

[0132] It should be noted that the use of the laser irradiation device of the present invention is not particularly limited. For example, it may be a laser cleaner that removes rust or the like attached to a metal using a laser, or a laser annealing device that heats the surfaces of metals and resins using a laser.

[0133] In addition, the material of the irradiation object is not particularly limited. For example, it may be resins such as photocurable resins, wood, glass, paper, leather, minerals, etc.

[0134] The above-described embodiments and modification examples are examples and are not limited thereto. For example, the respective embodiments and modification examples may be appropriately combined.

[0135] The present invention includes a structure that is substantially the same as the structure described in the embodiments, such as a structure with the same functions, methods, and results, or a structure with the same purposes and effects. In addition, the present invention includes a structure in which non-essential parts of the structure described in the embodiments are replaced. In addition, the present invention includes a structure that has the same effects as the structure described in the embodiments or a structure that can achieve the same purpose. In addition, the present invention includes a structure in which a well-known technique is added to the structure described in the embodiments.

[0136] The following is derived from the above-described embodiments and modification examples.

[0137] One embodiment of the laser irradiation device includes: an auxiliary mounting member having a first surface and a second surface on the side opposite to the first surface; a laser element disposed on the first surface and irradiating laser light; a heat dissipation portion disposed on the second surface; and a moving mechanism that changes the relative position between the laser element and the irradiation object.

[0138] According to this laser irradiation device, heat dissipation performance can be improved.

[0139] In one embodiment of the laser irradiation device, the auxiliary mounting member may have insulation properties.

[0140] According to this laser irradiation device, it is possible to suppress current from reaching the heat dissipation portion through the auxiliary mounting member.

[0141] In one embodiment of the laser irradiation device, the heat dissipation portion may also have conductivity.

[0142] According to this laser irradiation device, the heat dissipation portion can have a high thermal conductivity.

[0143] In one embodiment of the laser irradiation device, the moving mechanism may have two guide rails, and the auxiliary mounting member is supported by the two guide rails.

[0144] According to this laser irradiation device, the auxiliary mounting member can be stably supported.

[0145] In one embodiment of the laser irradiation device, the two guide rails may not overlap with the laser element in a top view.

[0146] According to this laser irradiation device, heat of the laser element can be efficiently dissipated from the heat dissipation portion.

[0147] In one embodiment of the laser irradiation device, the heat dissipation portion may have a plurality of fins.

[0148] According to this laser irradiation device, heat of the laser element can be dissipated from the plurality of fins.

[0149] In one aspect of the laser irradiation device, the moving mechanism may move the laser element in a first direction, and in a plan view, the plurality of fins respectively extend in the first direction.

[0150] According to this laser irradiation device, the air resistance received by the fins can be reduced.

[0151] In one aspect of the laser irradiation device, the moving mechanism may move the laser element in a first direction, and in a plan view, the plurality of fins respectively extend in a second direction inclined with respect to the first direction.

[0152] According to this laser irradiation device, the amount of air in contact with the fins can be increased.

[0153] In one aspect of the laser irradiation device, the object to be irradiated may be an object to be processed that is processed using the laser from the laser element.

[0154] According to this laser irradiation device, the object to be irradiated can be processed with high precision.

[0155] In one aspect of the laser irradiation device, the object to be irradiated may also be a recording object that is recorded using the laser from the laser element.

[0156] According to this laser irradiation device, the object to be irradiated can be recorded with high precision.

[0157] In one aspect of the laser irradiation device, the laser element may be a photonic crystal surface emitting laser.

[0158] According to this laser irradiation device, the emission angle of the laser from the laser element can be narrowed.

Claims

1. A laser irradiation device, comprising: An auxiliary mounting member having a first surface and a second surface on the side opposite to the first surface; A laser element disposed on the first surface and irradiating laser light; A heat dissipation portion disposed on the second surface; And A moving mechanism for changing the relative position between the laser element and the irradiation object.

2. The laser irradiation device according to claim 1, wherein The auxiliary mounting member has insulation properties.

3. The laser irradiation device according to claim 1, wherein The heat dissipation portion has conductivity.

4. The laser irradiation device according to claim 1, wherein The moving mechanism has two guide rails, The auxiliary mounting member is supported by the two guide rails.

5. The laser irradiation device according to claim 4, wherein In a top view, the two guide rails do not overlap with the laser element.

6. The laser irradiation device according to claim 1, wherein The heat dissipation portion has a plurality of fins.

7. The laser irradiation device according to claim 6, wherein The moving mechanism moves the laser element in a first direction, In a top view, the plurality of fins respectively extend along the first direction.

8. The laser irradiation device according to claim 6, wherein The moving mechanism moves the laser element in a first direction, In a top view, the plurality of fins respectively extend along a second direction inclined with respect to the first direction.

9. The laser irradiation device according to claim 1, wherein The irradiation object is a processing object processed using the laser light from the laser element.

10. The laser irradiation device according to claim 1, wherein The irradiation object is a recording object recorded using the laser light from the laser element.

11. The laser irradiation device according to any one of claims 1 to 10, wherein The laser element is a photonic crystal surface emitting laser.

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