Heat dissipation device, charging pile and charging equipment

Abstract

The embodiment of the invention provides a heat dissipation device, a charging pile and charging equipment, and relates to the technical field of charging equipment. The heat dissipation device comprises a heat exchanger and a buffer tank. The heat exchanger is provided with an inlet connector, an outlet connector and a bypass connector, the inlet connector is arranged at an inlet of the heat exchanger, the inlet of the heat exchanger is used for communicating with an outlet of the liquid cooling assembly through the inlet connector, the outlet connector is arranged at an outlet of the heat exchanger, and the outlet of the heat exchanger is used for communicating with an inlet of the liquid cooling assembly through the outlet connector. The heat exchanger is used for forming a cooling medium circulation loop with the liquid cooling assembly through the inlet connector and the outlet connector. The buffer tank communicates with the heat exchanger through a bypass connector. Therefore, the service life of the buffer tank is prolonged.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of charging devices, and in particular, to a heat dissipation device, a charging pile, and a charging device. Background Art

[0002] With the continuous increase in the charging power of charging devices, the heat generated during the charging of charging devices is getting higher and higher. To improve the heat dissipation efficiency of charging devices, a charging device may include a power component, a heat dissipation device, and a liquid cooling component. The power component is used to output electric energy. The heat dissipation device and the liquid cooling component form a cooling medium circulation loop. The cooling medium flowing into the liquid cooling component is used to absorb the heat generated by the power component. After absorbing heat at the liquid cooling component, the cooling medium flows to the heat dissipation device for heat dissipation, so as to achieve liquid cooling and heat dissipation of the power component.

[0003] The heat dissipation device usually includes a buffer tank. However, in the related art, the buffer tank is prone to corrosion, resulting in a short service life of the buffer tank. Therefore, how to solve the problem of easy corrosion of the buffer tank has become an urgent problem to be solved in the technical field of charging devices. Summary of the Invention

[0004] The embodiments of the present application provide a heat dissipation device, a charging pile, and a charging device to solve the problem of easy corrosion of the buffer tank in the related art.

[0005] In the first aspect of the embodiments of the present application, a heat dissipation device is provided. The heat dissipation device includes a heat exchanger and a buffer tank. The heat exchanger is provided with an inlet joint, an outlet joint, and a bypass joint. The inlet joint is arranged at the inlet of the heat exchanger. The inlet of the heat exchanger is used to communicate with the outlet of the liquid cooling component through the inlet joint. The outlet joint is arranged at the outlet of the heat exchanger. The outlet of the heat exchanger is used to communicate with the inlet of the liquid cooling component through the outlet joint. The heat exchanger is used to form a cooling medium circulation loop with the liquid cooling component through the inlet joint and the outlet joint. The buffer tank is communicated with the heat exchanger through the bypass joint.

[0006] In the heat dissipation device provided by the embodiments of the present application, the buffer tank communicated with the heat exchanger through the bypass joint is connected as a branch to the cooling medium circulation loop. The cooling medium circulating in the cooling medium circulation loop is not likely to cause erosion to the buffer tank, so that the buffer tank is not easily corroded due to the erosion of the cooling medium circulating in the cooling medium circulation loop, which is beneficial to extending the service life of the buffer tank. In addition, since the buffer tank is not likely to be corroded, it is not necessary to thicken the wall thickness of the buffer tank to meet the requirements of the reliability and service life of the buffer tank. After the buffer tank is connected as a branch to the cooling medium circulation loop, the wall thickness of the buffer tank can be reduced on the basis of meeting the requirements of the reliability and service life of the buffer tank, which is beneficial to reducing the weight and production cost of the buffer tank.

[0007] In some possible embodiments, the buffer tank is disposed above the heat exchanger. In this way, when there is a cooling medium in the cooling medium circulation loop, it is convenient to open the buffer tank to facilitate operations such as maintenance and liquid injection of the buffer tank.

[0008] In some possible embodiments, the heat exchanger includes a liquid inlet structure, a liquid outlet structure, and a heat exchange structure. The inlet joint is disposed at the inlet of the liquid inlet structure, and the inlet of the liquid inlet structure is used to communicate with the outlet of the liquid cooling component through the inlet joint. The outlet joint is disposed at the outlet of the liquid outlet structure, and the outlet of the liquid outlet structure is used to communicate with the inlet of the liquid cooling component through the outlet joint. The heat exchange structure is disposed between the liquid inlet structure and the liquid outlet structure, and both ends of the heat exchange structure are respectively communicated with the liquid inlet structure and the liquid outlet structure. The bypass joint is disposed on the liquid outlet structure, and the buffer tank is communicated with the liquid outlet structure through the bypass joint.

[0009] In this way, after the cooling medium dissipates heat in the heat exchange structure, it then flows to the bypass joint. The temperature of the cooling medium at the bypass joint is relatively low, and it is not easy for the cooling medium to leak at the bypass joint, so the reliability of the cooling medium circulation loop is relatively high.

[0010] In some possible embodiments, the heat dissipation device further includes a first connecting pipe, and the buffer tank is provided with a first joint. The first joint is connected to the bypass joint through the first connecting pipe, so that the buffer tank is communicated with the heat exchanger through the first joint, the first connecting pipe, and the bypass joint. In this way, it is more convenient to connect the buffer tank to the bypass joint, facilitating the connection between the buffer tank and the bypass joint. In addition, the requirements for the relative positions of the buffer tank and the bypass joint are relatively low, and the layout of the buffer tank can be more flexible.

[0011] In some possible embodiments, the heat dissipation device further includes a second connecting pipe, and the buffer tank is further provided with a second joint. The first joint has a first port, a second port, and a third port. The first port is connected to the buffer tank. The second port is connected to the bypass joint through the first connecting pipe, so that the buffer tank is communicated with the heat exchanger through the first port, the second port, the first connecting pipe, and the bypass joint. The third port is connected to the second joint through the second connecting pipe, so that one end of the second connecting pipe is communicated with the buffer tank through the third port and the first port, and the other end of the second connecting pipe is communicated with the buffer tank through the second joint. Among them, the second connecting pipe is a transparent pipe, and the second connecting pipe is used to display the liquid level in the buffer tank.

[0012] In this way, the transparent second connecting pipe can serve as a liquid level window to facilitate knowing the liquid level of the cooling medium in the buffer tank. In addition, the first connecting pipe and the second connecting pipe are connected to the same joint, which can reduce the number of joints and holes that need to be opened on the buffer tank, making the assembly of the buffer tank easier. In addition, the reduced number of joints and holes on the buffer tank can also reduce the risk of leakage at the joints of the buffer tank, making the buffer tank more reliable.

[0013] In some possible embodiments, the first joint is provided at the lower part of the buffer tank. In this way, it is convenient for the cooling medium accommodated in the lower part of the buffer tank to flow into the cooling medium circulation loop, so that the utilization rate of the cooling medium in the buffer tank is relatively high. In addition, when the liquid level in the buffer tank is relatively low, it is also convenient for the second connecting pipe to display the liquid level in the buffer tank.

[0014] In some possible embodiments, the second joint is provided at the upper part of the buffer tank, so that when the liquid level in the buffer tank is relatively high, the second connecting pipe can display the liquid level in the buffer.

[0015] Exemplarily, the first port, the second port, and the third port are respectively located on different sides of the first joint, so as to facilitate the connection of the first joint with the buffer tank, the first connecting pipe, and the second connecting pipe.

[0016] Exemplarily, the first joint and the bypass joint are provided on the same side of the buffer tank, so as to facilitate the connection of the first joint and the bypass joint.

[0017] In some possible embodiments, the buffer tank includes a housing and a plate body. The plate body is provided in the housing, and the plate body and the housing enclose to form the inner cavity of the buffer tank. The housing includes a base plate portion, the base plate portion is disposed opposite to the plate body, and a reinforcing structure is provided in the buffer tank. Two ends of the reinforcing structure are respectively fixedly connected to the plate body and the base plate portion. In this way, the pressure resistance performance of the buffer tank can be improved, so as to facilitate the pressure resistance detection of the cooling medium circulation loop, and it is also beneficial to meet the high-pressure requirements under extreme operating conditions.

[0018] In some possible embodiments, the reinforcing structure includes reinforcing columns. Two ends of the reinforcing columns are respectively fixedly connected to the plate body and the base plate portion. In this way, the position arrangement of the reinforcing columns is relatively flexible, which is beneficial to strengthening a certain local part of the buffer tank.

[0019] In some possible embodiments, the reinforcing structure includes reinforcing plates. One side edge of the reinforcing plate is fixedly connected to the plate body, and the other side edge of the reinforcing plate is fixedly connected to the base plate portion.

[0020] In this way, the reinforcing plate can achieve the strengthening of a large area of the buffer tank. When it is necessary to strengthen a certain strip-shaped area of the buffer tank in a large area, the reinforcing plate can be connected to the buffer tank once to achieve the strengthening of a relatively large area of the buffer tank, and the assembly of the reinforcing structure and the buffer tank is relatively easy.

[0021] In some possible embodiments, the bottom of the reinforcing plate has a communication hole penetrating through both sides in the thickness direction of the reinforcing plate.

[0022] In this way, the communication hole connects the spaces on both sides in the thickness direction of the reinforcing plate in the buffer tank, and the cooling medium in the buffer tank can flow through the communication hole on both sides in the thickness direction of the reinforcing plate, so that the reinforcing plate is not likely to affect the use of the cooling medium in the buffer tank.

[0023] Exemplarily, the reinforcing plate is a perforated plate, so that the influence of the arranged reinforcing plate on the flow of the liquid and gas on both sides of the reinforcing plate in the thickness direction in the buffer tank is small.

[0024] In some possible embodiments, the buffer tank has a liquid injection port located on the top surface of the buffer tank. A plug is provided at the liquid injection port, and the plug is detachably connected to the buffer tank to block the liquid injection port.

[0025] In this way, while it is convenient to inject liquid into the buffer tank, the liquid in the buffer tank is not likely to leak from the liquid injection port.

[0026] In some possible embodiments, the heat dissipation device further includes a driving pump. The outlet joint is connected to the driving pump, and the outlet of the heat exchanger is used to communicate with the inlet of the liquid cooling assembly through the outlet joint and the driving pump.

[0027] In this way, the driving pump can drive the cooling medium to flow, so as to facilitate liquid cooling heat dissipation. In addition, after the cooling medium dissipates heat in the heat exchanger and then flows to the driving pump, the temperature of the cooling medium at the driving pump is relatively low, and the cooling medium is not likely to leak at the connections of the driving pump, the outlet joint and the liquid cooling assembly, and the reliability of the cooling medium circulation loop is relatively high. In addition, since the temperature of the cooling medium is relatively low, the driving efficiency of the driving pump for the cooling medium can also be relatively high.

[0028] In a second aspect of the embodiments of the present application, a charging pile is provided, which includes a pile body and the heat dissipation device in any of the above embodiments. The heat dissipation device is arranged in the pile body.

[0029] In a third aspect of the embodiments of the present application, a charging device is provided, which includes a liquid cooling assembly and the heat dissipation device in any of the above embodiments. The inlet of the heat exchanger of the heat dissipation device is communicated with the outlet of the liquid cooling assembly through the inlet joint of the heat dissipation device, and the outlet of the heat exchanger is communicated with the inlet of the liquid cooling assembly through the outlet joint of the heat dissipation device. Description of the Drawings

[0030] Figure 1 It is a schematic diagram of a charging device provided by an embodiment of the present application;

[0031] Figure 2 It is a schematic diagram of a heat dissipation device provided by an embodiment of the present application;

[0032] Figure 3 It is a schematic diagram of another heat dissipation device provided by an embodiment of the present application;

[0033] Figure 4 It is Figure 3 an exploded schematic diagram of a perspective of the heat dissipation device provided in

[0034] Figure 5For Figure 3 Explosion schematic diagram of another perspective of the heat dissipation device provided in

[0035] Figure 6 For Figure 3 Schematic diagram at the heat exchanger of the heat dissipation device provided in

[0036] Figure 7 For Figure 3 Schematic diagram at the buffer tank of the heat dissipation device provided in

[0037] Figure 8 For Figure 3 Explosion schematic diagram at the buffer tank of the heat dissipation device provided in

[0038] Figure 9 For Figure 3 Cross-sectional schematic diagram at the buffer tank of the heat dissipation device provided in

[0039] Explanation of reference numerals:

[0040] 100, charging pile; 110, pile body; 120, heat dissipation device; 130, power supply component;

[0041] 200, power component; 210, power terminal; 220, power line;

[0042] 300, liquid cooling component; 310, liquid cooling part; 320, liquid supply channel; 330, liquid return channel;

[0043] 1000, heat exchanger; 1100, inlet joint; 1200, outlet joint; 1300, bypass joint; 1400, liquid inlet structure; 1500, liquid outlet structure; 1600, heat exchange structure;

[0044] 2000, buffer tank; 2100, first joint; 2200, first connecting pipe; 2300, second joint; 2400, second connecting pipe; 2500, housing; 2510, base plate part; 2520, surrounding wall part; 2600, plate body; 2700, strengthening structure; 2710, strengthening column; 2720, strengthening plate; 2721, communication hole; 2810, liquid level gauge; 2820, pressure relief valve; 2830, plug;

[0045] 3000, electric control component;

[0046] 4000, frame;

[0047] 5000, fan;

[0048] 6000, drive pump; 6100, third connecting pipe; 6200, fourth connecting pipe;

[0049] 7000, wind hood;

[0050] 8100, the first temperature sensor; 8200, the pressure sensor; 8300, the second temperature sensor. Specific embodiments

[0051] The terms used in the embodiments section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application. The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0052] Figure 1 It is a schematic diagram of a charging device provided for an embodiment of this application.

[0053] As Figure 1 shown, an embodiment of this application provides a charging device, and this charging device is a liquid-cooled charging device. This charging device may include a charging pile 100, a power component 200, and a liquid-cooling component 300. The charging pile 100 includes a pile body 110, a power supply component 130, and a heat dissipation device 120, and the power supply component 130 and the heat dissipation device 120 are arranged inside the pile body 110. The power supply component 130 is electrically connected to the power component 200, and the power supply component 130 can be electrically connected to the commercial power through a charging host. The charging host can convert the current provided by the commercial power into the current required for charging and transmit it to the power component 200, and the power component 200 is used to output electric energy.

[0054] The heat dissipation device 120 and the liquid-cooling component 300 form a cooling medium circulation loop. The cooling medium flows into the liquid-cooling component 300 from the heat dissipation device 120, and the cooling medium flowing into the liquid-cooling component 300 is used to absorb the heat generated by the power component 200. After the cooling medium absorbs heat at the liquid-cooling component 300, it flows back to the heat dissipation device 120 for heat dissipation, thereby realizing liquid-cooled heat dissipation of the power component 200.

[0055] Exemplarily, the liquid-cooling component 300 can be in direct contact with the power component 200, or the liquid-cooling component 300 can be in contact with the power component 200 through a heat-conducting medium, so that the heat generated by the power component 200 can be efficiently transferred to the cooling medium in the liquid-cooling component 300.

[0056] Exemplarily, the power component 200 may include power terminals 210 and power lines 220. One end of the power line 220 is electrically connected to the power supply component 130, and the other end of the power line 220 is electrically connected to the power terminals 210, so that the electric energy provided by the power supply component 130 can be transmitted to the power terminals 210 through the power line 220, and the power terminals 210 are used to output electric energy.

[0057] Exemplarily, the liquid cooling component 300 may include a liquid cooling part 310. The liquid cooling component 300 has a liquid supply channel 320 and a liquid return channel 330. The inlet of the liquid supply channel 320 is communicated with the outlet of the heat dissipation device 120, and the outlet of the liquid supply channel 320 is communicated with the inlet of the liquid cooling part 310, so that the inlet of the liquid cooling part 310 is communicated with the outlet of the heat dissipation device 120 through the liquid supply channel 320. The inlet of the liquid return channel 330 is communicated with the outlet of the liquid cooling part 310, and the outlet of the liquid return channel 330 is communicated with the inlet of the heat dissipation device 120, so that the outlet of the liquid cooling part 310 is communicated with the inlet of the heat dissipation device 120 through the liquid return channel 330. The liquid cooling part 310 and the heat dissipation device 120 are communicated through the liquid supply channel 320 and the liquid return channel 330 to form a cooling medium circulation loop.

[0058] The liquid cooling part 310 is arranged at the power terminal 210. The cooling medium provided by the heat dissipation device 120 can flow into the liquid cooling part 310 through the liquid supply channel 320. The cooling medium flowing into the liquid cooling part 310 is used to absorb the heat generated by the power terminal 210. After the cooling medium absorbs the heat generated by the power terminal 210 in the liquid cooling part 310, it can flow back to the heat dissipation device 120 through the liquid return channel 330 for heat dissipation, thereby realizing liquid cooling and heat dissipation of the power terminal 210. At this time, the inlet of the liquid supply channel 320 can be used as the inlet of the liquid cooling component 300, and the outlet of the liquid return channel 330 can be used as the outlet of the liquid cooling component 300.

[0059] Exemplarily, the liquid cooling part 310 can be in direct contact with the power terminal 210, or the liquid cooling part 310 can be in contact with the power terminal 210 through a heat conduction medium, so that the heat generated by the power terminal 210 can be efficiently transferred to the cooling medium in the liquid cooling part 310.

[0060] Exemplarily, the liquid cooling part 310 may include one or more of a liquid cooling plate, a liquid cooling tube, etc.

[0061] Exemplarily, the cooling medium flowing in the liquid supply channel 320 and the liquid return channel 330 can absorb the heat of the power line 220 to dissipate the heat of the power line 220.

[0062] In some examples, the charging device includes a charging gun. The charging gun includes a power component 200 and a liquid cooling component 300. That is to say, the power component 200 and the liquid cooling component 300 are components used to form the charging gun, and the charging gun is a liquid-cooled charging gun. The charging gun can be used to plug into a vehicle. After the charging gun is plugged into the vehicle, the charging pile 100 can charge the vehicle through the charging gun. In some examples, the charging device can be a supercharging device, and the charging power of a single charging gun can be greater than or equal to 480KW.

[0063] Exemplarily, the charging gun includes a gun head and a cable. The power terminal 210 and the liquid cooling component 310 are disposed on the gun head. The cable includes a power line 220, and the cable has a liquid supply channel 320 and a liquid return channel 330.

[0064] In some examples, the cable includes a liquid supply pipe and a liquid return pipe. The inner cavity of the liquid supply pipe forms the liquid supply channel 320, and the inner cavity of the liquid return pipe forms the liquid return channel 330.

[0065] Exemplarily, the liquid supply pipe and the liquid return pipe can be in direct contact with the power line or in contact through a heat-conducting medium.

[0066] In other examples, a partition can be provided inside the cable, and the liquid supply channel 320 and the liquid return channel 330 can be formed by partitioning inside the cable through the partition.

[0067] Figure 2 It is a schematic diagram of a heat dissipation device provided by an embodiment of the present application. In Figure 2 it, the direction pointed by the solid arrow is the direction of the cooling medium flow, the direction pointed by the dashed arrow is the direction of the air flow, and the two components connected by the dotted line indicate that the two components are electrically connected.

[0068] As Figure 2 shown, the heat dissipation device 120 includes a heat exchanger 1000. The heat exchanger 1000 is provided with an inlet joint 1100 and an outlet joint 1200. The inlet joint 1100 is disposed at the inlet of the heat exchanger 1000. The inlet of the heat exchanger 1000 is communicated with the outlet of the liquid cooling component 300 through the inlet joint 1100. The outlet joint 1200 is disposed at the outlet of the heat exchanger 1000. The outlet of the heat exchanger 1000 is communicated with the inlet of the liquid cooling component 300 through the outlet joint 1200. The heat exchanger 1000 is used to form a cooling medium circulation loop with the liquid cooling component 300 through the inlet joint 1100 and the outlet joint 1200. The cooling medium that has absorbed the heat generated by the power component 200 can flow into the heat exchanger 1000 for heat dissipation.

[0069] Exemplarily, the outlet of the liquid return channel 330 is connected to the inlet joint 1100, so that the inlet of the heat exchanger 1000 is communicated with the outlet of the liquid return channel 330 through the inlet joint 1100. The inlet of the liquid supply channel 320 is connected to the outlet joint 1200, so that the outlet of the heat exchanger 1000 can be communicated with the inlet of the liquid supply channel 320 through the outlet joint 1200. The heat exchanger 1000, the liquid cooling component 310, the liquid supply channel 320 and the liquid return channel 330 are used to form a cooling medium circulation loop.

[0070] Exemplarily, the heat dissipation device 120 further includes a fan 5000. The fan 5000 is configured to drive the air flow at the heat exchanger 1000 to improve the heat dissipation efficiency of the heat exchanger 1000. In some examples, the fan 5000 can blow air towards the heat exchanger 1000. In other examples, the fan 5000 can suck away the air at the heat exchanger 1000. In the embodiments of the present application, the example where the fan 5000 blows air towards the heat exchanger 1000 is used for illustration.

[0071] Exemplarily, the heat dissipation device 120 further includes a driving pump 6000. The driving pump 6000 is connected in series in the cooling medium circulation loop, and the driving pump 6000 is configured to drive the cooling medium to circulate in the cooling medium circulation loop.

[0072] In some examples, the driving pump 6000 can be disposed between the outlet joint 1200 and the liquid cooling assembly 300. The outlet joint 1200 is connected to the driving pump 6000, and the outlet of the heat exchanger 1000 is communicated with the inlet of the liquid cooling assembly 300 through the outlet joint 1200 and the driving pump 6000.

[0073] In this way, after the cooling medium dissipates heat in the heat exchanger 1000, it then flows to the driving pump 6000. The temperature of the cooling medium at the driving pump 6000 is relatively low, and it is not easy for the cooling medium to leak at the connection points of the driving pump 6000, the outlet joint 1200, and the liquid cooling assembly 300. The reliability of the cooling medium circulation loop is relatively high. In addition, since the temperature of the cooling medium is relatively low, the driving efficiency of the driving pump 6000 for the cooling medium can also be relatively high.

[0074] Exemplarily, the inlet end of the driving pump 6000 can be connected to the outlet joint 1200 through a third connecting pipe 6100, and the outlet end of the driving pump 6000 can be connected to the inlet of the liquid cooling assembly 300 through a fourth connecting pipe 6200. For example, the outlet end of the driving pump 6000 can be connected to the inlet of the liquid supply channel 320 through the fourth connecting pipe 6200. At this time, the outlet of the heat exchanger 1000 can be communicated with the inlet of the liquid cooling assembly 300 through the outlet joint 1200, the third connecting pipe 6100, the driving pump 6000, and the fourth connecting pipe 6200.

[0075] In this way, it is more convenient to connect the driving pump 6000 to the heat exchanger 1000 and the liquid cooling assembly 300, facilitating the connection of the driving pump 6000 to the heat exchanger 1000 and the liquid cooling assembly 300. In addition, the requirements for the relative positions of the driving pump 6000, the heat exchanger 1000, and the liquid cooling assembly 300 are relatively low, enabling the layout of the driving pump 6000 to be more flexible.

[0076] Exemplarily, both the third connecting pipe 6100 and the fourth connecting pipe 6200 can be flexible hoses, making the connection of the third connecting pipe 6100 and the fourth connecting pipe 6200 more convenient.

[0077] In some other examples, the driving pump 6000 can also be disposed between the inlet joint 1100 and the liquid cooling assembly 300.

[0078] Exemplarily, the outlet end of the driving pump 6000 can be connected to the inlet joint 1100 through a fifth connecting pipe, and the inlet end of the driving pump 6000 can be connected to the outlet of the liquid cooling assembly 300 through a sixth connecting pipe. For example, the inlet end of the driving pump 6000 can be connected to the outlet of the liquid return channel 330 through a sixth connecting pipe. At this time, the inlet of the heat exchanger 1000 can be communicated with the outlet of the liquid cooling assembly 300 through the inlet joint 1100, the fifth connecting pipe, the driving pump 6000, and the sixth connecting pipe.

[0079] In the embodiment of the present application, the case where the driving pump 6000 is disposed between the outlet joint 1200 and the liquid cooling assembly 300 is taken as an example for illustration.

[0080] As Figure 2 shown, in some examples, the heat dissipation device 120 may further include an electronic control component 3000. The electronic control component 3000 is electrically connected to the fan 5000 and the driving pump 6000. The electronic control component 3000 is used to control the fan 5000 and the driving pump 6000, so as to adjust the rotation speed of the fan 5000 and the flow rate of the cooling medium, so as to provide the required cooling capacity to the liquid cooling assembly 300.

[0081] The electronic control component 3000 can be used to obtain the rotation speeds of the fan 5000 and the driving pump 6000.

[0082] To achieve automatic adjustment of the fan 5000 and the driving pump 6000, the heat dissipation device 120 may further include a first temperature sensor 8100 and a second temperature sensor 8300. The first temperature sensor 8100 is used to collect the temperature of the cooling medium flowing into the inlet of the heat exchanger 1000, and the second temperature sensor 8300 is used to collect the temperature of the cooling medium flowing out of the outlet of the heat exchanger 1000. Both the first temperature sensor 8100 and the second temperature sensor 8300 are electrically connected to the electronic control component 3000. The electronic control component 3000 is used to obtain the temperatures collected by the first temperature sensor 8100 and the second temperature sensor 8300. The electronic control component 3000 is further used to control at least one of the fan 5000 and the driving pump 6000 according to the temperature collected by at least one of the first temperature sensor 8100 and the second temperature sensor 8300.

[0083] Exemplarily, the first temperature sensor 8100 can be disposed at the inlet joint 1100 to collect the temperature of the cooling medium at the inlet joint 1100.

[0084] Exemplarily, the second temperature sensor 8300 can be disposed on the fourth connecting pipe 6200 to collect the temperature of the cooling medium in the fourth connecting pipe 6200.

[0085] Exemplarily, the electronic control component 3000 can be used to control the fan 5000 and the drive pump 6000 according to the temperatures collected by the first temperature sensor 8100 and the second temperature sensor 8300, so as to adjust the rotation speed of the fan 5000 and the flow rate of the cooling medium flowing into the liquid cooling component 300, thereby adapting to different working conditions of the charging device.

[0086] The heat dissipation device 120 further includes a pressure sensor 8200. The pressure sensor 8200 is used to collect the pressure in the cooling medium circulation loop. The pressure sensors 8200 are all electrically connected to the electronic control component 3000. The electronic control component 3000 is used to obtain the pressure collected by the pressure sensor 8200, so as to monitor the pressure in the cooling medium circulation loop, and further facilitate forming corresponding instructions according to the pressure in the cooling medium circulation loop.

[0087] Exemplarily, the pressure sensor 8200 can be disposed on the fourth connecting pipe 6200 to collect the pressure in the fourth connecting pipe 6200.

[0088] Exemplarily, the electronic control component 3000 is further used to form a status instruction for indicating the working state of the cooling medium circulation loop according to at least one parameter among the temperature collected by the first temperature sensor 8100, the temperature collected by the second temperature sensor 8300, the pressure collected by the pressure sensor 8200, the rotation speed of the fan 5000, and the rotation speed of the drive pump 6000. The working state of the cooling medium circulation loop can include a normal state and a fault state.

[0089] The charging pile 100 further includes a first controller, and the first controller is a controller independent of the heat dissipation device 120. The electronic control component 3000 is electrically connected to the first controller. The electronic control component 3000 is further used to send the formed status instruction for indicating the working state of the cooling medium circulation loop to the first controller of the charging pile 100, and the first controller of the charging pile 100 can form corresponding control instructions according to the obtained status instruction.

[0090] As Figure 2 shown, in the embodiment of the present application, the heat dissipation device 120 further includes a buffer tank 2000. The buffer tank 2000 is used to buffer the pressure change in the cooling medium circulation loop. The heat exchanger 1000 is also provided with a bypass joint 1300, and the buffer tank 2000 is communicated with the heat exchanger 1000 through the bypass joint 1300.

[0091] In this way, the buffer tank 2000 communicated with the heat exchanger 1000 through the bypass joint 1300 is connected as a branch to the cooling medium circulation loop. The cooling medium circulating in the cooling medium circulation loop is not likely to cause erosion to the buffer tank 2000, so that the buffer tank 2000 is not easily corroded due to the erosion of the cooling medium circulating in the cooling medium circulation loop, which is beneficial to extending the service life of the buffer tank 2000. In addition, since the buffer tank 2000 is not easily corroded, it is not necessary to thicken the wall thickness of the buffer tank 2000 to meet the requirements of the reliability and service life of the buffer tank 2000. After the buffer tank 2000 is connected as a branch to the cooling medium circulation loop, the wall thickness of the buffer tank 2000 can be reduced on the basis of meeting the requirements of the reliability and service life of the buffer tank 2000, which is beneficial to reducing the weight and production cost of the buffer tank 2000.

[0092] Exemplarily, the buffer tank 2000 contains a cooling medium and a gas. That is to say, a part of the inner cavity of the buffer tank 2000 contains the cooling medium, and a part of the inner cavity of the buffer tank 2000 contains the gas, and the cooling medium does not fill the inner cavity of the buffer tank 2000. The gas contained in the buffer tank 2000 is used to achieve the buffering function. The cooling medium contained in the buffer tank 2000 can be used to supplement the cooling medium in the cooling medium circulation loop when the cooling medium in the cooling medium circulation loop decreases.

[0093] Exemplarily, the gas contained in the buffer tank 2000 can be air.

[0094] Exemplarily, the buffer tank 2000 is provided with a first joint 2100, and the first joint 2100 is connected to the bypass joint 1300 so that the buffer tank 2000 is communicated with the heat exchanger 1000.

[0095] The liquid level of the cooling medium in the buffer tank 2000 is above the first joint 2100, so that the cooling medium in the buffer tank 2000 can flow out from the first joint 2100.

[0096] In some possible implementation manners, the heat dissipation device 120 further includes a first connecting pipe 2200. The first joint 2100 is connected to the bypass joint 1300 through the first connecting pipe 2200 so that the buffer tank 2000 is communicated with the heat exchanger 1000 through the first joint 2100, the first connecting pipe 2200 and the bypass joint 1300.

[0097] In this way, it is more convenient to connect the buffer tank 2000 to the bypass joint 1300, which is convenient to realize the connection between the buffer tank 2000 and the bypass joint 1300. In addition, the requirement for the relative position of the buffer tank 2000 and the bypass joint 1300 is relatively low, and the arrangement of the buffer tank 2000 can be more flexible.

[0098] Figure 3Schematic diagram of another heat dissipation device provided by an embodiment of the present application Figure 4 is Figure 3 an exploded schematic diagram of the heat dissipation device provided in Figure 5 is Figure 3 an exploded schematic diagram of the heat dissipation device provided in from another perspective.

[0099] As Figures 3 - 5 shown, in some possible implementation manners, the first joint 2100 is disposed at the lower part of the buffer tank 2000. In this way, it is convenient for the cooling medium accommodated in the lower part of the buffer tank 2000 to flow into the cooling medium circulation loop, so that the utilization rate of the cooling medium in the buffer tank 2000 is relatively high.

[0100] In some possible implementation manners, the heat dissipation device 120 further includes a second connecting pipe 2400, and the buffer tank 2000 is further provided with a second joint 2300. The first joint 2100 has a first port, a second port, and a third port, and the first port is connected to the buffer tank 2000. The second port is connected to the bypass joint 1300 through the first connecting pipe 2200, so that the buffer tank 2000 is communicated with the heat exchanger 1000 through the first port, the second port, the first connecting pipe 2200, and the bypass joint 1300. The third port is connected to the second joint 2300 through the second connecting pipe 2400, so that one end of the second connecting pipe 2400 is communicated with the buffer tank 2000 through the third port and the first port, and the other end of the second connecting pipe 2400 is communicated with the buffer tank 2000 through the second joint 2300. The second connecting pipe 2400 is a transparent pipe, and the second connecting pipe 2400 is used to display the liquid level in the buffer tank 2000.

[0101] In this way, the transparent second connecting pipe 2400 can be used as a liquid level window. That is to say, the liquid level of the cooling medium in the buffer tank 2000 can be known through the liquid level of the cooling medium in the second connecting pipe 2400. In addition, the first connecting pipe 2200 and the second connecting pipe 2400 are connected to the same joint, which can reduce the number of joints and holes to be opened on the buffer tank 2000, making the assembly of the buffer tank 2000 relatively easy. In addition, the reduction in the number of joints and holes to be opened on the buffer tank 2000 can also reduce the risk of leakage at the joints of the buffer tank 2000, making the buffer tank 2000 highly reliable.

[0102] The first joint 2100 is disposed at the lower part of the buffer tank 2000, which is also convenient for the second connecting pipe 2400 to display the liquid level in the buffer tank 2000 when the liquid level in the buffer tank 2000 is relatively low.

[0103] Exemplarily, the second joint 2300 is provided at the upper part of the buffer tank 2000 so that when the liquid level in the buffer tank 2000 is relatively high, the second connecting pipe 2400 can display the liquid level in the buffer tank 2000.

[0104] Exemplarily, both the first joint 2100 and the second joint 2300 can be welded to the buffer tank 2000 to achieve fixation with the buffer tank 2000 and sealed connection.

[0105] Exemplarily, the first joint 2100 can be a tee joint.

[0106] Exemplarily, the material of the second connecting pipe 2400 can be transparent plastic. In this way, while facilitating the transparency of the pipe body of the second connecting pipe 2400, it is relatively easy to form a connecting structure on the second connecting pipe 2400 for connecting with the first joint 2100 and the second joint 2300, so as to facilitate the assembly of the second connecting pipe 2400 with the first joint 2100 and the second joint 2300.

[0107] Exemplarily, the first port, the second port, and the third port are respectively located on different sides of the first joint 2100 to facilitate the connection of the first joint 2100 with the buffer tank 2000, the first connecting pipe 2200, and the second connecting pipe 2400.

[0108] Exemplarily, the included angle between the first connecting pipe 2200 and the second connecting pipe 2400 can be approximately 90°. That is to say, the included angle between the opening directions of the second port and the third port can be approximately 90°.

[0109] Exemplarily, the first joint 2100 and the bypass joint 1300 are provided on the same side of the buffer tank 2000 to facilitate the connection of the first joint 2100 and the bypass joint 1300.

[0110] In some possible implementation manners, the buffer tank 2000 is provided above the heat exchanger 1000.

[0111] In this way, when there is a cooling medium in the cooling medium circulation loop, it is convenient to open the buffer tank 2000 to facilitate operations such as maintenance and liquid injection of the buffer tank 2000.

[0112] Exemplarily, the bypass joint 1300 is provided at the upper part of the heat exchanger 1000. For example, the bypass joint 1300 can be provided on the top surface of the heat exchanger 1000.

[0113] In some examples, the heat dissipation device 120 further includes a frame 4000 and a wind hood 7000. The heat exchanger 1000 is disposed on one side of the frame 4000, the wind hood 7000 is disposed on the other side of the frame 4000, and the fan 5000 and the drive pump 6000 are disposed inside the frame 4000 and between the heat exchanger 1000 and the wind hood 7000. The buffer tank 2000 is disposed on the top of the heat exchanger 1000 and the frame 4000. The heat exchanger 1000 and the frame 4000 can support the buffer tank 2000. The electronic control component 3000 is disposed on the top of the frame 4000. The frame 4000 can support the electronic control component 3000. The electronic control component 3000 can be an electronic control box. The electronic control component 3000 and the buffer tank 2000 can be arranged side by side along the arrangement direction of the heat exchanger 1000 and the wind hood 7000.

[0114] Exemplarily, the electronic control component 3000 can include a box body and a second controller. The second controller is disposed inside the box body. The fan 5000, the drive pump 6000, the first temperature sensor 8100, the second temperature sensor 8300, the pressure sensor 8200, and the first controller are all electrically connected to the second controller. The box body can protect the second controller.

[0115] Exemplarily, the box body has a handle to facilitate the movement of the electronic control component 3000. For example, the top of the box body has a handle.

[0116] In other examples, the buffer tank 2000 can also be disposed on the same horizontal plane as the heat exchanger 1000, or the buffer tank 2000 can be disposed below the heat exchanger 1000.

[0117] Figure 6 For Figure 3 a schematic diagram of the heat exchanger of the heat dissipation device provided in

[0118] As Figure 6 shown, in some possible implementation manners, the heat exchanger 1000 includes a liquid inlet structure 1400, a liquid outlet structure 1500, and a heat exchange structure 1600. The inlet joint 1100 is disposed at the inlet of the liquid inlet structure 1400. The inlet of the liquid inlet structure 1400 is used to communicate with the outlet of the liquid cooling component 300 through the inlet joint 1100. The outlet joint 1200 is disposed at the outlet of the liquid outlet structure 1500. The outlet of the liquid outlet structure 1500 is used to communicate with the inlet of the liquid cooling component 300 through the outlet joint 1200. The heat exchange structure 1600 is disposed between the liquid inlet structure 1400 and the liquid outlet structure 1500. Both ends of the heat exchange structure 1600 are respectively communicated with the liquid inlet structure 1400 and the liquid outlet structure 1500. The cooling medium flowing into the heat exchanger 1000 dissipates heat at the heat exchange structure 1600. The bypass joint 1300 is disposed on the liquid outlet structure 1500. The buffer tank 2000 is communicated with the liquid outlet structure 1500 through the bypass joint 1300.

[0119] In this way, after the cooling medium dissipates heat within the heat exchange structure 1600, it then flows towards the bypass joint 1300. The temperature of the cooling medium at the bypass joint 1300 is relatively low, and it is not easy for the cooling medium to leak at the bypass joint 1300, so the reliability of the cooling medium circulation loop is relatively high.

[0120] In some examples, both the liquid inlet structure 1400 and the liquid outlet structure 1500 can be flat tube structures, and the liquid inlet structure 1400 and the liquid outlet structure 1500 can be used to form the side walls on opposite sides of the heat exchanger 1000.

[0121] In other examples, the liquid inlet structure 1400 can include a first side plate and a liquid inlet pipe disposed within the first side plate, and the liquid outlet structure 1500 can include a second side plate and a liquid outlet pipe disposed within the second side plate. The inlet joint 1100 is disposed at the inlet of the liquid inlet pipe, and the inlet of the liquid inlet pipe is used to communicate with the outlet of the liquid cooling assembly 300 through the inlet joint 1100. The outlet joint 1200 is disposed at the outlet of the liquid outlet pipe, and the outlet of the liquid outlet pipe is used to communicate with the inlet of the liquid cooling assembly 300 through the outlet joint 1200. The heat exchange structure 1600 is disposed between the liquid inlet pipe and the liquid outlet pipe, and both ends of the heat exchange structure 1600 are respectively communicated with the liquid inlet pipe and the liquid outlet pipe. The first side plate and the second side plate can be used to form the side walls on opposite sides of the heat exchanger 1000.

[0122] Exemplarily, both the liquid inlet structure 1400 and the liquid outlet structure 1500 can be vertically arranged.

[0123] Exemplarily, the inlet joint 1100 can be disposed on the top surface of the liquid inlet structure 1400.

[0124] Exemplarily, the bypass joint 1300 can be disposed on the top surface of the liquid outlet structure 1500, and the outlet joint 1200 can be disposed at the lower part of the liquid outlet structure 1500.

[0125] Exemplarily, the heat exchange structure 1600 can include a plurality of heat exchange plates arranged vertically and in parallel, and adjacent two heat exchange plates can be connected by heat exchange fins.

[0126] Figure 7 For Figure 3 the schematic diagram at the buffer tank of the heat dissipation device provided in Figure 8 For Figure 3 the explosion schematic diagram at the buffer tank of the heat dissipation device provided in

[0127] As Figure 7 、 Figure 8 shown, in some possible implementation manners, the buffer tank 2000 is further provided with a pressure relief valve 2820.

[0128] In this way, when the pressure in the buffer tank 2000 is too high, the pressure can be relieved through the pressure relief valve 2820, making the use of the buffer tank 2000 safer.

[0129] Exemplarily, the pressure relief valve 2820 is provided on the top surface of the buffer tank 2000, so that when the pressure in the buffer tank 2000 is in a normal state, the cooling medium in the buffer tank 2000 is not likely to leak at the pressure relief valve 2820.

[0130] In some possible implementation manners, the buffer tank 2000 is further provided with a liquid level gauge 2810. The liquid level gauge 2810 is electrically connected to the electronic control component 3000. The liquid level gauge 2810 is configured to form a first signal when the liquid level in the buffer tank 2000 is lower than a preset liquid level and form a second signal when the liquid level in the buffer tank 2000 is higher than or equal to the preset liquid level. The electronic control component 3000 is configured to obtain the first signal and the second signal and form a status instruction for indicating the status of the buffer tank 2000 according to the first signal and the second signal. The status of the buffer tank 2000 may include a normal state and a liquid shortage state.

[0131] In this way, it is convenient to master the liquid level situation in the buffer tank 2000 and beneficial to discover the situation of liquid shortage in the buffer tank 2000.

[0132] Exemplarily, the liquid level gauge 2810 is electrically connected to the second controller.

[0133] Exemplarily, the top surface of the buffer tank 2000 has an assembly hole. The liquid level gauge 2810 is inserted into the assembly hole. A part of the liquid level gauge 2810 is located outside the buffer tank 2000 and is connected to the electronic control component 3000. A part of the liquid level gauge 2810 is located inside the buffer tank 2000 and is used to detect the liquid level in the buffer tank 2000. The liquid level gauge 2810 is sealingly connected to the buffer tank 2000.

[0134] In this way, on the basis that the connection between the liquid level gauge 2810 and the electronic control component 3000 is relatively convenient, the cooling medium in the buffer tank 2000 is not likely to leak at the liquid level gauge 2810.

[0135] In some possible implementation manners, the buffer tank 2000 has a liquid injection port. A plug 2830 is provided at the liquid injection port. The plug 2830 is detachably connected to the buffer tank 2000, and the plug 2830 seals the liquid injection port.

[0136] In this way, the buffer tank 2000 can be filled with liquid by opening the plug 2830, and it is relatively convenient to fill the buffer tank 2000 with liquid.

[0137] Exemplarily, the liquid injection port is located on the top surface of the buffer tank 2000, so that when the plug 2830 seals the liquid injection port, the liquid in the buffer tank 2000 is not likely to leak from the liquid injection port.

[0138] In some possible embodiments, the buffer tank 2000 includes a housing 2500 and a plate body 2600. The plate body 2600 is disposed in the housing 2500, and the plate body 2600 and the housing 2500 enclose to form the inner cavity of the buffer tank 2000.

[0139] Exemplarily, the plate body 2600 is disposed at the bottom of the housing 2500. The plate body 2600 forms the bottom wall of the buffer tank 2000, and the housing 2500 forms the top wall and the side walls of the buffer tank 2000. The plate body 2600 can be fixedly connected to the heat exchanger 1000 through fasteners.

[0140] Exemplarily, both the first joint 2100 and the second joint 2300 are disposed on the housing 2500.

[0141] Exemplarily, the second joint 2300 is disposed on the top surface of the buffer tank 2000.

[0142] Exemplarily, the first joint 2100 is disposed on the side surface of the buffer tank 2000, so that the first joint 2100 is not likely to affect the assembly of the buffer tank 2000 and the components below.

[0143] Exemplarily, the plate body 2600 and the housing 2500 can be welded to realize the fixation and sealed connection between the plate body 2600 and the housing 2500.

[0144] Exemplarily, the buffer tank 2000 can be in a cuboid structure.

[0145] Exemplarily, the housing 2500 includes a base plate portion 2510 and a surrounding wall portion 2520. One end of the surrounding wall portion 2520 is connected to the base plate portion 2510, and the plate body 2600 is connected to the other end of the surrounding wall portion 2520. The base plate portion 2510, the surrounding wall portion 2520 and the plate body 2600 enclose to form the inner cavity of the buffer tank 2000, and the base plate portion 2510 and the plate body 2600 are disposed opposite to each other.

[0146] Exemplarily, the base plate portion 2510 forms the top wall of the buffer tank 2000, and the surrounding wall portion 2520 forms the side walls of the buffer tank 2000.

[0147] Exemplarily, the plate body 2600 can include a connecting portion protruding from the surrounding wall portion 2520, and the connecting portion is fixedly connected to the heat exchanger 1000 through fasteners.

[0148] Exemplarily, the pressure relief valve 2820, the liquid level gauge 2810, the liquid injection port and the second joint 2300 are all disposed on the base plate portion 2510, and the first joint 2100 is disposed on the surrounding wall portion 2520.

[0149] Exemplarily, the base plate portion 2510 and the surrounding wall portion 2520 are of an integral structure, and the plate body 2600 is welded to the surrounding wall portion 2520.

[0150] Figure 9 is Figure 3 a schematic cross-sectional view at the buffer tank of the heat dissipation device provided in

[0151] As Figure 9 shown, and referring to Figure 8 , in some possible embodiments, a reinforcing structure 2700 is provided inside the buffer tank 2000. Both ends of the reinforcing structure 2700 are fixedly connected to the plate body 2600 and the substrate portion 2510 respectively.

[0152] In this way, the pressure resistance performance of the buffer tank 2000 can be improved, facilitating the pressure resistance detection of the cooling medium circulation loop and also meeting the high-pressure requirements under extreme operating conditions.

[0153] Exemplarily, both ends of the reinforcing structure 2700 can be welded to the plate body 2600 and the substrate portion 2510 respectively.

[0154] Exemplarily, before the housing 2500 and the plate body 2600 are assembled, one end of the reinforcing structure 2700 can be welded to one of the plate body 2600 and the substrate portion 2510. Then, after solder is provided at the other end of the reinforcing structure 2700, the housing 2500 and the plate body 2600 are assembled. Then, the buffer tank 2000 with the reinforcing structure 2700 and solder inside is placed in a high-temperature furnace to complete the welding of the other end of the reinforcing structure 2700 to the other of the plate body 2600 and the substrate portion 2510.

[0155] In some possible embodiments, the reinforcing structure 2700 includes reinforcing columns 2710. Both ends of the reinforcing columns 2710 are fixedly connected to the plate body 2600 and the substrate portion 2510 respectively.

[0156] In this way, the position arrangement of the reinforcing columns 2710 is relatively flexible, facilitating the strengthening of a certain local part of the buffer tank 2000.

[0157] In some possible embodiments, the reinforcing structure 2700 includes a reinforcing plate 2720. One side edge of the reinforcing plate 2720 is fixedly connected to the plate body 2600, and the other side edge of the reinforcing plate 2720 is fixedly connected to the substrate portion 2510.

[0158] In this way, the reinforcing plate 2720 can achieve the strengthening of a large area of the buffer tank 2000. When it is necessary to strengthen a certain strip-shaped area of the buffer tank 2000, the reinforcing plate 2720 can be connected to the buffer tank 2000 once to achieve the strengthening of a relatively large area of the buffer tank 2000, and the assembly of the reinforcing structure 2700 and the buffer tank 2000 is relatively easy.

[0159] Exemplarily, the bottom of the reinforcing plate 2720 has a communication hole 2721 penetrating through both sides in the thickness direction of the reinforcing plate 2720.

[0160] In this way, the communication holes 2721 connect the spaces on both sides of the reinforcing plate 2720 in the thickness direction inside the buffer tank 2000. The cooling medium inside the buffer tank 2000 can flow through the communication holes 2721 on both sides of the reinforcing plate 2720 in the thickness direction, so that the reinforcing plate 2720 is not likely to affect the use of the cooling medium inside the buffer tank 2000.

[0161] Exemplarily, the reinforcing plate 2720 is a perforated plate, so that the arranged reinforcing plate 2720 has less influence on the flow of liquid and gas on both sides of the reinforcing plate 2720 in the thickness direction inside the buffer tank 2000.

[0162] In some examples, the reinforcing structure 2700 may include reinforcing columns 2710 and not include the reinforcing plate 2720. For example, the reinforcing structure 2700 may include multiple spaced-apart reinforcing columns 2710.

[0163] In some other examples, the reinforcing structure 2700 may include the reinforcing plate 2720 and not include the reinforcing columns 2710.

[0164] As Figure 9 shown, in still some other examples, the reinforcing structure 2700 may include the reinforcing plate 2720 and the reinforcing columns 2710, and the reinforcing columns 2710 may be provided on both sides of the reinforcing plate 2720.

[0165] In some examples where the buffer tank 2000 is a cuboid, the reinforcing structure 2700 includes a reinforcing plate 2720 perpendicular to the length direction of the buffer tank 2000 and multiple reinforcing columns 2710. The reinforcing plate 2720 is provided in the middle of the buffer tank 2000, and the reinforcing columns 2710 are provided on both sides of the reinforcing plate 2720.

[0166] In some examples, the reinforcing plate 2720 may have an avoidance notch, and the avoidance notch can be used to avoid components such as the pressure relief valve 2820, so that the arrangement of the reinforcing plate 2720 is not likely to affect the arrangement of components such as the pressure relief valve 2820.

[0167] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it may be a fixed connection, or indirectly connected through an intermediate medium, and may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0168] The terms "first", "second", "third", "fourth", etc. (if any) in the description of the embodiments of the present application, the specification, the claims, and the above drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence.

[0169] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them; although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation device (120), characterized in that, Comprising: A heat exchanger (1000), the heat exchanger (1000) is provided with an inlet joint (1100), an outlet joint (1200) and a bypass joint (1300), the inlet joint (1100) is arranged at the inlet of the heat exchanger (1000), and the inlet of the heat exchanger (1000) is used to communicate with the outlet of the liquid cooling assembly (300) through the inlet joint (1100), the outlet joint (1200) is arranged at the outlet of the heat exchanger (1000), and the outlet of the heat exchanger (1000) is used to communicate with the inlet of the liquid cooling assembly (300) through the outlet joint (1200); A buffer tank (2000), the buffer tank (2000) is communicated with the heat exchanger (1000) through the bypass joint (1300).

2. The heat dissipation device (120) according to claim 1, wherein, The buffer tank (2000) is arranged above the heat exchanger (1000).

3. The heat dissipation device (120) according to claim 1 or 2, characterized in that, The heat exchanger (1000) includes a liquid inlet structure (1400), a liquid outlet structure (1500) and a heat exchange structure (1600); The inlet joint (1100) is arranged at the inlet of the liquid inlet structure (1400), and the inlet of the liquid inlet structure (1400) is used to communicate with the outlet of the liquid cooling assembly (300) through the inlet joint (1100), the outlet joint (1200) is arranged at the outlet of the liquid outlet structure (1500), and the outlet of the liquid outlet structure (1500) is used to communicate with the inlet of the liquid cooling assembly (300) through the outlet joint (1200), the heat exchange structure (1600) is arranged between the liquid inlet structure (1400) and the liquid outlet structure (1500), and both ends of the heat exchange structure (1600) are respectively communicated with the liquid inlet structure (1400) and the liquid outlet structure (1500), the bypass joint (1300) is arranged on the liquid outlet structure (1500), and the buffer tank (2000) is communicated with the liquid outlet structure (1500) through the bypass joint (1300).

4. The heat dissipation device (120) according to any one of claims 1-3, characterized in that, It further includes a first connecting pipe (2200), and the buffer tank (2000) is provided with a first joint (2100); The first joint (2100) is connected to the bypass joint (1300) through the first connecting pipe (2200), so that the buffer tank (2000) is communicated with the heat exchanger (1000) through the first joint (2100), the first connecting pipe (2200) and the bypass joint (1300).

5. The heat dissipation device (120) according to claim 4, characterized in that, It further includes a second connecting pipe (2400), and the buffer tank (2000) is further provided with a second joint (2300); The first joint (2100) has a first port, a second port and a third port; The first port is connected to the buffer tank (2000); The second port is connected to the bypass joint (1300) through the first connecting pipe (2200), so that the buffer tank (2000) is communicated with the heat exchanger (1000) through the first port, the second port, the first connecting pipe (2200) and the bypass joint (1300); The third port is connected to the second joint (2300) through the second connecting pipe (2400), such that one end of the second connecting pipe (2400) communicates with the buffer tank (2000) through the third port and the first port, and the other end of the second connecting pipe (2400) communicates with the buffer tank (2000) through the second joint (2300); Wherein, the second connecting pipe (2400) is a transparent pipe, and the second connecting pipe (2400) is used to display the liquid level in the buffer tank (2000).

6. The heat dissipation device (120) according to any one of claims 1-5, characterized in that, The buffer tank (2000) includes a housing (2500) and a plate body (2600). The plate body (2600) is disposed in the housing (2500), and the plate body (2600) and the housing (2500) enclose to form the inner cavity of the buffer tank (2000); The housing (2500) includes a base plate portion (2510). The base plate portion (2510) is disposed opposite to the plate body (2600). A strengthening structure (2700) is provided in the buffer tank (2000), and two ends of the strengthening structure (2700) are respectively fixedly connected to the plate body (2600) and the base plate portion (2510).

7. The heat dissipation device (120) according to claim 6, characterized in that, The strengthening structure (2700) includes a strengthening column (2710); Two ends of the strengthening column (2710) are respectively fixedly connected to the plate body (2600) and the base plate portion (2510).

8. The heat dissipation device (120) according to claim 6 or 7, characterized in that, The strengthening structure (2700) includes a strengthening plate (2720); One side edge of the strengthening plate (2720) is fixedly connected to the plate body (2600), and the other side edge of the strengthening plate (2720) is fixedly connected to the base plate portion (2510); The bottom of the strengthening plate (2720) has a communication hole (2721) penetrating through both sides in the thickness direction of the strengthening plate (2720).

9. A charging pile (100), characterized in that, Including a pile body (110) and a heat dissipation device (120) according to any one of claims 1-8; The heat dissipation device (120) is disposed in the pile body (110).

10. A charging device, characterized in that, Including a liquid cooling component (300) and a heat dissipation device (120) according to any one of claims 1-8; The inlet of the heat exchanger (1000) of the heat dissipation device (120) communicates with the outlet of the liquid cooling component (300) through the inlet joint (1100) of the heat dissipation device (120), and the outlet of the heat exchanger (1000) communicates with the inlet of the liquid cooling component (300) through the outlet joint (1200) of the heat dissipation device (120).

Images