Non-contact wet film thickness detection method and device and electronic equipment
Through the combination of non-contact eddy current sensor and laser ranging sensor, the problems of large error, low accuracy and destructiveness of wet film thickness detection are solved, and efficient and accurate measurement of wet film thickness is achieved, and the integrity of wet film is protected.
Patent Information
- Application Number
- CN202510477360.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-16
- Publication Date
- 2025-07-29
AI Technical Summary
The existing wet film thickness detection methods and devices have large errors, low accuracy, harsh measurement conditions, and contact testing will damage the wet film, making it difficult to achieve efficient and accurate full coverage detection.
A non-contact eddy current sensor and a laser ranging sensor are used to calculate the wet film thickness through the signal processing unit to avoid direct contact with the wet film surface.
It realizes efficient, stable and accurate measurement of wet film thickness, protects the integrity of wet film, and improves detection efficiency and accuracy.
Smart Images
Figure CN120385273A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of wet film measurement, and in particular, to a non-contact wet film thickness detection method, device, and electronic device. Background Art
[0002] When processing fine and high-value products such as circuit boards, special metals, and engine blades, a wet film such as a coating, ink, or paint film is often printed or sprayed on their surfaces to achieve functions such as moisture-proof, protection, insulation, heat insulation, and aesthetics. During the processing, it is often necessary to measure the thickness of the wet film such as the coated ink or coating to confirm whether the product meets the requirement of the minimum thickness specified by the technical specifications.
[0003] Current wet film thickness detection devices, also known as wet film thickness gauges, wet film combs, thickness gauges, wet film cards, etc. Their working process is usually to immediately and stably place the detection device vertically on the flat workpiece coating surface after the coating construction, and move the detection device horizontally to measure and read the coating thickness, as Figure 1 shown. However, this wet film thickness measurement method generally relies on manual measurement and reading, and usually has problems of large errors and low accuracy, resulting in serious deviations in the read data. Secondly, the measurement conditions of the existing detection devices are relatively harsh. For example, during the measurement process, it is necessary to ensure that the test tool is kept horizontally placed, etc., resulting in low measurement efficiency. Finally, the contact test method of the existing detection devices will also cause irreversible damage to the wet film of the product to be tested, so only sampling detection can be carried out, and it is difficult to ensure the uniformity and accuracy of all products and sites.
[0004] Therefore, how to provide a non-contact wet film thickness detection method, device, and electronic device that can achieve non-contact measurement of the wet film thickness on the workpiece surface, while improving the measurement efficiency and the accuracy of the measurement data, has become one of the technical problems that need to be solved urgently by those skilled in the art. Summary of the Invention
[0005] The present application aims to solve at least one of the technical problems in the related art to some extent.
[0006] To achieve the above object, a first aspect embodiment of the present application provides a non-contact wet film thickness detection device, including:
[0007] Providing a workpiece to be tested, where the workpiece to be tested includes a metal substrate and a wet film covering the surface of the metal substrate;
[0008] The eddy current sensor and the laser distance sensor are respectively used to detect a preset position of the workpiece to be measured, so as to obtain an eddy current response signal reflecting the distance information between the eddy current sensor and the metal substrate, and to obtain a laser response signal reflecting the distance information between the laser distance sensor and the wet film;
[0009] Based on the received eddy current response signal and laser response signal, and according to the relative position relationship among the eddy current sensor, the laser distance sensor and the workpiece to be measured, as well as the mapping relationship between the actual distance between the eddy current sensor and the metal substrate and the eddy current response signal, the signal processing unit calculates the thickness parameter of the wet film at the preset measurement point.
[0010] Optionally, before the step of using the eddy current sensor and the laser distance sensor to respectively detect the preset position of the workpiece to be measured, it further includes using the eddy current sensor and a standard gauge block to measure multiple measurement points of the metal substrate, so as to obtain the mapping relationship between the actual distance between the eddy current sensor and the metal substrate and the eddy current response signal, and the standard gauge block is used to calibrate the actual distance between the eddy current sensor and the metal substrate in the direction perpendicular to the surface of the metal substrate.
[0011] Optionally, the relative position relationship among the eddy current sensor, the laser distance sensor and the workpiece to be measured at least includes the angle between the laser ranging signal of the laser distance sensor and the surface of the wet film, and the vertical distance between the eddy current sensor and the laser distance sensor in the vertical direction.
[0012] Optionally, the vertical distances of the eddy current sensor and the laser distance sensor from the preset measurement point of the wet film in the vertical direction are equal.
[0013] Optionally, the thickness δ of the wet film at the preset measurement point satisfies:
[0014] δ = S1 - H1
[0015] S1 = β * U1
[0016] H1 = S2 * sinθ
[0017] Wherein, S1 is the vertical distance between the eddy current sensor and the metal substrate corresponding to the preset measurement point, H1 is the vertical distance between the laser ranging sensor and the wet film corresponding to the preset measurement point, S2 is the straight-line distance between the laser ranging sensor and the wet film corresponding to the preset measurement point, U1 is the intensity of the eddy current response signal output by the eddy current sensor, β is the relationship coefficient between the eddy current response signal and the distance S1, and θ is the angle between the laser ranging signal emitted by the laser ranging sensor and the surface of the wet film.
[0018] To achieve the above object, an embodiment of the first aspect of the present application proposes a non-contact wet film thickness detection device for detecting the thickness of a wet film on the surface of a metal substrate, including a detection unit and a signal processing unit connected by communication; wherein,
[0019] The detection unit includes an eddy current sensor and a laser ranging sensor. The eddy current sensor is used to detect the distance between the metal substrate at the preset measurement point and the eddy current sensor and output an eddy current response signal; the laser ranging sensor is used to detect the distance between the wet film at the preset measurement point and the laser ranging sensor and output a laser response signal;
[0020] The signal processing unit is respectively connected to the eddy current sensor and the laser ranging sensor by communication, and is used to receive the eddy current response signal and the laser response signal, and calculate the thickness parameter of the wet film at the preset measurement point according to the relative position relationship between the eddy current sensor, the laser ranging sensor and the wet film, and the mapping relationship between the actual distance between the eddy current sensor and the metal substrate and the eddy current response signal.
[0021] Optionally, the eddy current sensor includes one of a Hall sensor, a magnetic induction sensor, and a microwave sensor.
[0022] Optionally, the laser ranging sensor includes one of an ultraviolet sensor, a Doppler sensor, and a vision sensor.
[0023] Optionally, it further includes a display unit, and the display unit is connected to the signal processing unit by communication, and is used to display the calculated thickness parameter of the wet film at the preset measurement point.
[0024] To achieve the above object, an embodiment of the first aspect of the present application proposes an electronic device, including a processor and a memory connected to the processor by communication;
[0025] The memory stores computer execution instructions;
[0026] The processor executes the computer-executable instructions stored in the memory to implement the method described in any one of the above.
[0027] The non-contact wet film thickness detection method, device, and electronic device provided by this application at least include the following
[0028] Beneficial effects:
[0029] This application provides a non-contact wet film thickness detection method, device, and electronic device, including a signal processing unit, an eddy current sensor, and a laser ranging sensor with a fixed positional relationship. Among them, the eddy current sensor is used to detect the distance between the metal substrate at a preset measurement point and the eddy current sensor and output an eddy current response signal; the laser ranging sensor is used to detect the distance between the wet film at the preset measurement point and the laser ranging sensor and output a laser response signal; the signal processing unit is used to receive the eddy current response signal and the laser response signal, and calculate the thickness parameter of the wet film at the preset measurement point according to the relative positional relationship between the eddy current sensor and the laser ranging sensor, as well as the mapping relationship between the laser response signal and the detection distance. This application can achieve direct non-contact measurement of the wet film thickness, protect the integrity of the wet film, and improve the detection efficiency, measurement stability, and accuracy of the wet film thickness.
[0030] Additional aspects and advantages of this application will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of this application. Description of the Drawings
[0031] The above and / or additional aspects and advantages of this application will become apparent and easy to understand from the following description of the embodiments in conjunction with the drawings, where:
[0032] Figure 1 It is a schematic flow chart of a non-contact wet film thickness detection method shown according to an embodiment of this application.
[0033] Figure 2 It is a schematic structural diagram of a non-contact wet film thickness detection device shown according to an embodiment of this application.
[0034] 110 Eddy current sensor; 120 Laser ranging sensor; 130 Signal processing unit; 140 Display unit; 150 Housing; 200 Workpiece to be measured; 210 Metal substrate; 220 Wet film. Detailed Embodiments
[0035] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present application, but should not be construed as limiting the present application.
[0036] In the existing wet film thickness detection methods or devices, manual measurement and reading are generally required, and there are usually problems such as large errors and low precision, resulting in serious deviations in the read data. Secondly, the measurement conditions of the existing detection methods or devices are relatively harsh. For example, during the measurement process, it is necessary to ensure that the test tool is placed horizontally, etc., resulting in low measurement efficiency. Finally, the contact test method of the existing detection methods or devices will also cause irreversible damage to the wet film of the product to be tested. Therefore, only sampling detection can be carried out, and it is difficult to ensure the uniformity and accuracy of all products and sites.
[0037] Based on the above problems, the present application provides a non-contact wet film thickness detection method, device and electronic device, which can realize direct non-contact measurement of the wet film thickness by using an eddy current sensor and a laser ranging sensor with a fixed positional relationship, and the wet film thickness measurement method or device will not damage the existing wet film surface. Compared with the existing measurement methods, the present application can improve the detection efficiency, measurement stability and accuracy of the wet film thickness, and protect the integrity of the wet film to be tested.
[0038] In the first aspect of the present application, a non-contact wet film thickness measurement method is provided, as Figure 1 and Figure 2 shown. The method includes the following steps:
[0039] S1. Provide a workpiece 200 to be tested, where the workpiece 200 to be tested includes a metal substrate 210 and a wet film 220 covering the surface of the metal substrate 210;
[0040] S2. Use an eddy current sensor 110 and a laser ranging sensor 120 to respectively detect a preset position of the workpiece 200 to be tested, so as to obtain an eddy current response signal reflecting the distance information between the eddy current sensor 110 and the metal substrate 210, and obtain a laser response signal reflecting the distance information between the laser ranging sensor 120 and the wet film 220;
[0041] S3. The signal processing unit 130 calculates the thickness parameter of the wet film 220 at the preset measurement point based on the received eddy current response signal and laser response signal, and according to the relative position relationship among the eddy current sensor 110, the laser distance sensor 120, and the workpiece 200 to be measured, as well as the mapping relationship between the actual distance between the eddy current sensor 110 and the metal substrate 210 and the eddy current response signal.
[0042] It can be understood that the eddy current sensor 110 is a non-contact measurement sensor based on the principle of electromagnetic induction. It is widely used in industrial inspection, displacement measurement, vibration analysis, metal defect detection and other fields. Its core principle is to obtain the physical parameters (such as displacement, thickness, conductivity, etc.) of the object to be measured through the eddy current effect induced in the conductive material. Therefore, in this application, by arranging the eddy current sensor 110 above the wet film 220, the distance between the metal substrate 210 at the preset measurement point and the eddy current sensor 110 can be detected non-contact by using the principle of electromagnetic induction, and an eddy current response signal reflecting the distance information between the eddy current sensor 110 and the metal substrate 210 is output.
[0043] Similarly, the laser distance sensor 120 is a non-contact distance measurement sensor that uses the characteristics of laser beams to achieve high precision. It is widely used in industrial automation, robot navigation, building surveying and mapping, security monitoring and other fields. Its core principle is to calculate the target distance by measuring the time difference (time-of-flight method) or phase difference (phase method) between laser emission and reception. Therefore, in this application, by arranging the laser distance sensor 120 above the wet film 220, the distance between the surface of the wet film 220 at the preset measurement point and the laser distance sensor 120 can be measured non-contact by using the time between laser emission and reflection, and a laser response signal reflecting the distance information between the laser distance sensor 120 and the wet film 220 is output.
[0044] Therefore, by communicatively connecting the signal processing unit 130 with the eddy current sensor 110 and the laser distance sensor 120, the signal processing unit 130 receives the eddy current response signal output by the eddy current sensor 110 and the laser response signal output by the laser distance sensor 120. Based on the eddy current response signal, the laser response signal, the relative position relationship among the eddy current sensor 110, the laser distance sensor 120, and the workpiece 200 to be measured, and the mapping relationship between the actual distance between the eddy current sensor 110 and the metal substrate 210 and the eddy current response signal, the thickness of the wet film 220 at the preset measurement point can be obtained through simple mathematical calculations.
[0045] As an example, the mapping relationship between the actual distance between the eddy current sensor 110 and the metal substrate 210 and the eddy current response signal can be obtained by continuously measuring with a standard gauge and multiple measurement points on the metal substrate. Among them, the standard gauge is used to calibrate the actual distance between the eddy current sensor 110 and the metal substrate 210 in the direction perpendicular to the surface of the metal substrate 210.
[0046] It should be noted that the above steps of obtaining the mapping relationship between the actual distance between the eddy current sensor 110 and the metal substrate 210 and the eddy current response signal by continuously measuring with a standard gauge and multiple measurement points on the metal substrate can be executed before step S2. And this mapping relationship is related to the material of the metal substrate 210. That is to say, for different wet films 220 with different materials formed on the same metal substrate 210, the same mapping relationship can be used to detect the thickness of the wet film 220, thus greatly improving the detection efficiency of the thickness of the wet film 220.
[0047] As an example, the relative position relationship among the eddy current sensor 110, the laser distance measuring sensor 120, and the workpiece to be measured 200 at least includes the angle between the laser distance measuring signal of the laser distance measuring sensor 120 and the surface of the wet film 220, and the vertical distance between the eddy current sensor 110 and the laser distance measuring sensor 120 in the vertical direction.
[0048] Since the eddy current sensor 110 and the laser distance measuring sensor 120 measure the same measurement point on the wet film 220, in order to avoid mutual interference during the measurement processes of the eddy current sensor 110 and the laser distance measuring sensor 120, the laser distance measuring sensor 120 needs to be arranged on one side of the eddy current sensor 110, so that the eddy current sensor 110 can be located directly above the preset measurement point of the wet film 220 to directly obtain the vertical distance between the metal substrate 210 in the direction perpendicular to the surface of the wet film 220 and the eddy current sensor 110. The laser distance measuring sensor 120 located on one side of the eddy current sensor 110 is used to obtain the straight-line distance between the laser distance measuring sensor 120 and the preset measurement point of the wet film 220. By measuring in advance the angle between the laser distance measuring signal output by the laser distance measuring sensor 120 and the surface of the wet film 220 (preset measurement point), the vertical distance between the laser distance measuring sensor 120 and the surface of the wet film 220 in the vertical direction can be obtained through mathematical conversion. Thus, based on the vertical distance between the eddy current sensor 110 and the laser distance measuring sensor 120 in the vertical direction, the thickness of the wet film 220 at the preset measurement point can be obtained.
[0049] Specifically, the mapping relationship between the actual distance between the eddy current sensor 110 and the metal substrate 210 and the eddy current response signal can satisfy:
[0050] S1 = β * U1
[0051] Among them, S1 is the vertical distance between the eddy current sensor 110 and the metal substrate 210 corresponding to the preset measurement point position, U1 is the intensity (voltage) of the eddy current response signal output by the eddy current sensor 110, and β is the mapping relationship coefficient between the eddy current response signal and the distance S1.
[0052] The straight-line distance and the vertical distance between the laser distance sensor and the preset measurement point of the wet film 220 satisfy:
[0053] H1 = S2 * sinθ
[0054] Among them, H1 is the vertical distance in the vertical direction between the laser distance sensor and the preset measurement point of the wet film 220, S2 is the straight-line distance between the laser distance sensor and the preset measurement point of the wet film 220, which can be directly calculated through the laser response signal (the time difference between the laser emission time and the laser reflection reception time) and the speed of light, and θ is the angle between the laser ranging signal output by the laser ranging sensor 120 and the surface (preset measurement point) of the wet film 220.
[0055] Thus, the thickness of the wet film 220 at the preset measurement point satisfies:
[0056] δ = S1 - H1 - d1
[0057] Among them, d1 is the vertical distance in the vertical direction between the eddy current sensor 110 and the laser ranging sensor 120. For the convenience of calculation, the eddy current sensor 110 and the laser ranging sensor 120 can be set at the same horizontal height position above the wet film 220, so that the vertical distance d1 between the eddy current sensor 110 and the laser ranging sensor 120 is 0, and the thickness of the wet film 220 at the preset measurement point satisfies δ = S1 - H1.
[0058] Since neither the eddy current sensor 110 nor the laser ranging sensor 120 needs to be in direct contact with the wet film 220, the wet film 220 thickness measurement method provided by this application will not damage the existing surface of the wet film 220. In addition, after the operator completes the single-point measurement, for the samples of the same metal substrate, it can be used again without re-calibration and device cleaning. Compared with the existing test methods, this application can improve the detection efficiency, measurement stability and accuracy of the wet film 220 thickness, and protect the integrity of the wet film 220 to be measured.
[0059] According to the second aspect of the present application, a non-contact wet film thickness measurement device is also provided, as Figure 2 shown. The detection device includes a detection unit and a signal processing unit 130 that are communicatively connected; among them,
[0060] The detection unit includes an eddy current sensor 110 and a laser ranging sensor 120. The eddy current sensor 110 is used to detect the distance between the metal substrate 210 at a preset measurement point and the eddy current sensor 110, and output an eddy current response signal; the laser ranging sensor 120 is used to detect the distance between the wet film 220 at a preset measurement point and the laser ranging sensor 120, and output a laser response signal;
[0061] The signal processing unit 130 is communicatively connected to the eddy current sensor 110 and the laser ranging sensor 120 respectively, and is used to receive the eddy current response signal and the laser response signal, and calculate the thickness parameter of the wet film 220 at the preset measurement point according to the relative position relationship among the eddy current sensor 110, the laser ranging sensor 120 and the workpiece 200 to be measured, as well as the mapping relationship between the actual distance between the eddy current sensor 110 and the metal substrate 210 and the eddy current response signal.
[0062] Among them, the eddy current sensor 110 includes but is not limited to any one of a Hall sensor, a magnetic induction sensor, and a microwave sensor, and the laser ranging sensor 120 includes but is not limited to any one of an ultraviolet sensor, a Doppler sensor, and a vision sensor.
[0063] The signal of the signal processing unit 130 includes a processor. The processor is communicatively connected to the eddy current sensor 110 and the laser ranging sensor 120 to control the eddy current sensor 110 and the laser ranging sensor 120 to measure the thickness of the wet film 220 at a preset measurement point of the wet film 220, receive the eddy current response signal and the laser response signal, and calculate and output the thickness of the wet film 220 based on the measurement results. The processor includes but is not limited to a single-chip microcomputer, a programmable logic controller (PLC), or an electronic control unit (ECU), etc. The communication connection method between the processor and the eddy current sensor 110 and the laser ranging sensor 120 includes but is not limited to data interaction through long wires, Bluetooth, and 5G and other communication methods.
[0064] In addition, the detection device may further include a display unit 140. The display unit 140 is communicatively connected to the signal processing unit 130 to display the thickness of the wet film 220 at the preset measurement point obtained by the processor calculation. The display unit 140 includes but is not limited to a TF display screen, a TFT display screen, an AMOLED display screen, and an IPS display screen.
[0065] The detection device further includes a housing 150, which can be used to connect the eddy current sensor 110 and the laser ranging sensor 120 and keep the relative position relationship between the eddy current sensor 110 and the laser ranging sensor 120 fixed.
[0066] According to the third aspect of the present application, an electronic device is further provided. The electronic device includes: at least one processor, a memory, and a communication component. Among them, the processor, the memory, and the communication component are connected through a bus.
[0067] Among them, at least one processor executes the computer-executable instructions stored in the memory, so that at least one processor executes the detection method described in any of the above embodiments.
[0068] In summary, the present application provides a non-contact wet film thickness detection method, device and electronic device, including a signal processing unit 130 and an eddy current sensor 110 and a laser ranging sensor 120 with a fixed positional relationship. Among them, the eddy current sensor 110 is used to detect the distance between the metal substrate 210 at a preset measurement point and the eddy current sensor 110, and output an eddy current response signal; the laser ranging sensor 120 is used to detect the distance between the wet film 220 at the preset measurement point and the laser ranging sensor 120, and output a laser response signal; the signal processing unit 130 is used to receive the eddy current response signal and the laser response signal, and calculate the thickness parameter of the wet film 220 at the preset measurement point according to the relative positional relationship between the eddy current sensor 110 and the laser ranging sensor 120, and the mapping relationship between the laser response signal and the detection distance. The present application can realize direct non-contact measurement of the thickness of the wet film 220, improve the detection efficiency, measurement stability and accuracy of the thickness of the wet film 220, and protect the integrity of the wet film 220 to be measured.
[0069] The non-contact wet film thickness detection measurement method and device provided by the present application can be not affected by the material of the workpiece 200 to be measured. The eddy current sensor 110 and the laser ranging sensor 120 used can detect different substrates and wet films 220 of different materials, and accurate measurement can be realized after simple calibration, improving the universality of the wet film 220 thickness measurement.
[0070] The non-contact wet film thickness detection device provided by the present application reduces the volume of the wet film 220 thickness measurement device, improves the portability of the wet film 220 thickness measurement, and makes the range and application scenarios of the wet film 220 thickness measurement wider.
[0071] In the description of the foregoing embodiments, the descriptions referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0072] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.
Claims
1. A non-contact wet film thickness detection method, characterized in that Including: Providing a workpiece to be measured, the workpiece to be measured includes a metal substrate and a wet film covering the surface of the metal substrate; Using an eddy current sensor and a laser distance sensor to respectively detect a preset position of the workpiece to be measured, so as to obtain an eddy current response signal reflecting the distance information between the eddy current sensor and the metal substrate, and obtain a laser response signal reflecting the distance information between the laser distance sensor and the wet film; The signal processing unit calculates the thickness parameter of the wet film at the preset measurement point based on the received eddy current response signal and laser response signal, and according to the relative position relationship between the eddy current sensor, the laser distance sensor and the workpiece to be measured, and the mapping relationship between the actual distance between the eddy current sensor and the metal substrate and the eddy current response signal.
2. The non-contact wet film thickness detection method according to claim 1, characterized in that, Before the step of using the eddy current sensor and the laser distance sensor to respectively detect the preset position of the workpiece to be measured, it further includes using the eddy current sensor and a standard gauge to measure multiple measurement points of the metal substrate, so as to obtain the mapping relationship between the actual distance between the eddy current sensor and the metal substrate and the eddy current response signal, and the standard gauge is used to calibrate the actual distance between the eddy current sensor and the metal substrate in the direction perpendicular to the surface of the metal substrate.
3. The non-contact wet film thickness detection method according to claim 1, characterized in that, The relative position relationship between the eddy current sensor, the laser distance sensor and the workpiece to be measured at least includes the angle between the laser distance measurement signal of the laser distance sensor and the surface of the wet film, and the vertical distance between the eddy current sensor and the laser distance sensor in the vertical direction.
4. The non-contact wet film thickness detection method according to claim 3, characterized in that, The vertical distances of the eddy current sensor and the laser distance sensor from the preset measurement point of the wet film in the vertical direction are equal.
5. The non-contact wet film thickness detection method according to claim 4, characterized in that: The thickness δ of the wet film at the preset measurement point satisfies: δ = S1 - H1 S1 = β * U1 H1 = S2 * sinθ Wherein, S1 is the vertical distance between the eddy current sensor and the metal substrate corresponding to the preset measurement point, H1 is the vertical distance between the laser distance sensor and the wet film corresponding to the preset measurement point, S2 is the straight-line distance between the laser distance sensor and the wet film corresponding to the preset measurement point, U1 is the intensity of the eddy current response signal output by the eddy current sensor, β is the relationship coefficient between the eddy current response signal and the distance S1, and θ is the angle between the laser distance measurement signal emitted by the laser distance sensor and the surface of the wet film.
6. A non-contact wet film thickness detection device for detecting the wet film thickness on the surface of a metal substrate, characterized in that, Including a detection unit and a signal processing unit connected by communication; wherein, The detection unit includes an eddy current sensor and a laser distance sensor. The eddy current sensor is used to detect the distance between the metal substrate at the preset measurement point and the eddy current sensor, and output an eddy current response signal; the laser distance sensor is used to detect the distance between the wet film at the preset measurement point and the laser distance sensor, and output a laser response signal. The signal processing unit is respectively communicatively connected to the eddy current sensor and the laser range finder sensor, and is configured to receive the eddy current response signal and the laser response signal, and calculate the thickness parameter of the wet film at the preset measurement point according to the relative position relationship among the eddy current sensor, the laser range finder sensor and the wet film, and the mapping relationship between the actual distance between the eddy current sensor and the metal substrate and the eddy current response signal.
7. The non-contact wet film thickness detection device according to claim 6, characterized in that The eddy current sensor includes one of a Hall sensor, a magnetic induction sensor, and a microwave sensor.
8. The non-contact wet film thickness detection device according to claim 6, characterized in that: The laser range finder sensor includes one of an ultraviolet sensor, a Doppler sensor, and a vision sensor.
9. The non-contact wet film thickness detection device according to claim 6, characterized in that: It further includes a display unit, which is communicatively connected to the signal processing unit and is configured to display the thickness parameter of the wet film at the preset measurement point obtained by calculation.
10. An electronic device, characterized in that: It includes a processor and a memory communicatively connected to the processor; The memory stores computer-executable instructions; The processor executes the computer-executable instructions stored in the memory to implement the method according to any one of claims 1 to 5.