Method, device and equipment for judging thermal failure of heat transfer cold plate of case, medium and product
The heat transfer path is simplified through the equivalent thermal resistance network, and the complex thermal failure evaluation process of electronic equipment is solved, achieving efficient and accurate thermal failure judgment.
Patent Information
- Application Number
- CN202510294442.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-13
- Publication Date
- 2025-07-29
AI Technical Summary
In the prior art, the thermal failure evaluation process of electronic equipment is complex, consumes a lot of time and resources, and the existing equivalent thermal resistance division scheme has low accuracy.
The heat transfer path of the device on the cold plate is equivalent to thermal resistance, and an equivalent thermal resistance network is built. The temperature rise is calculated by simplifying the conductive heat dissipation path and determining whether it exceeds the allowable temperature.
It greatly simplifies the thermal design evaluation process and improves the accuracy and efficiency of thermal failure judgment.
Smart Images
Figure CN120387257A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the technical field of thermal design, and particularly relates to a method, device, equipment, medium and product for judging the thermal failure of a chassis heat transfer cold plate. Background Art
[0002] With the rapid development of electronic technology, the power density of devices is getting higher and higher, and thermal failure caused by poor heat dissipation has become the main form of electronic device failure. To solve the problem of thermal failure of electronic devices, it is necessary to obtain the temperatures of components inside the chassis and modules, and then judge whether they fail. Therefore, complex computational simulations are often required in the design stage. However, unreasonable designs often make the simulation and calculation processes repetitive, consuming a large amount of time and energy. Summary of the Invention
[0003] Embodiments of this application provide a method, device, equipment, medium and product for judging the thermal failure of a chassis heat transfer cold plate, so as to at least solve the problem of complex evaluation processes in related technologies.
[0004] In a first aspect, embodiments of this application provide a method for judging the thermal failure of a chassis heat transfer cold plate, where a heat generating component is provided at the center of the cold plate, and the method includes: Determine a simplified conduction heat dissipation path in which the heat of the heat generating component is conducted through the cold plate to the side wall and then from the side wall to the bottom cold surface; According to the simplified conduction heat dissipation path, construct an equivalent thermal resistance network of the cold plate, where the equivalent thermal resistance network includes a number of parallel resistors, and each of the resistors corresponds to each heat transfer direction in the simplified conduction heat dissipation path; According to the equivalent thermal resistance of the cold plate and the heat generation power of the heat generating component, calculate the temperature rise of the chassis affected by the heat generating component, where the equivalent thermal resistance of the cold plate is calculated based on the equivalent thermal resistance network; In response to determining that the temperature rise exceeds the allowable temperature, determine thermal failure.
[0005] In a second aspect, embodiments of this application provide a device for judging the thermal failure of a chassis heat transfer cold plate, where a heat generating component is provided at the center of the cold plate, and the device includes: A determination module, configured to determine a simplified conduction heat dissipation path in which the heat of the heat generating component is conducted through the cold plate to the side wall and then from the side wall to the bottom cold surface; A construction module, configured to construct an equivalent thermal resistance network of the cold plate according to the simplified conduction heat dissipation path, where the equivalent thermal resistance network includes a number of parallel resistors, and each of the resistors corresponds to each heat transfer direction in the simplified conduction heat dissipation path; a calculation module, configured to calculate the temperature rise of the chassis affected by the heating device according to the equivalent thermal resistance of the cold plate and the heating power of the heating device, wherein the equivalent thermal resistance of the cold plate is calculated based on the equivalent thermal resistance network; The determination module is configured to determine a thermal failure in response to determining that the temperature rise exceeds an allowable temperature.
[0006] In a third aspect, an embodiment of the present application provides an electronic device comprising: a processor and a memory storing computer program instructions; when the processor executes the computer program instructions, the steps of the chassis heat transfer cold plate thermal failure judgment method as described in any embodiment of the first aspect are implemented.
[0007] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, on which computer program instructions are stored. When the computer program instructions are executed by a processor, the steps of the chassis heat transfer cold plate thermal failure judgment method as described in any embodiment of the first aspect are implemented.
[0008] In a fifth aspect, an embodiment of the present application provides a computer program product, which is stored in a storage medium and executed by at least one processor to implement the steps of the chassis heat transfer cold plate thermal failure judgment method provided in the first aspect of the embodiment of the present application.
[0009] The chassis heat transfer cold plate thermal failure judgment method, device, equipment, medium and product of the embodiments of the present application equate each heat transfer link in the heat transfer path of the device on the cold plate to a thermal resistance, divide the thermal resistance when calculating the equivalent thermal resistance, and estimate the temperature rise caused by the heating device to the entire device based on the equivalent thermal resistance and the device heating power, so as to judge whether the allowable temperature is exceeded, that is, whether there is thermal failure, which greatly simplifies the thermal design evaluation process. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0011] Figure 1 This is a flow chart of a method for determining thermal failure of a chassis heat transfer cold plate provided by an embodiment of the present application; Figure 2 is a schematic diagram of a simplified conductive heat dissipation path provided by an embodiment of the present application; Figure 3 This is a schematic diagram of the thermal resistance equivalent of the cold plate provided in the embodiment of the present application; Figure 4 This is a local equivalent thermal resistance network diagram of a cold plate provided in an embodiment of the present application; Figure 5 It is a schematic diagram of the cold plate mathematical model provided by an embodiment of the present application; Figure 6 It is a schematic structural diagram of a chassis heat transfer cold plate thermal failure judgment device provided by an embodiment of the present application; Figure 7 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
[0012] Reference numerals: Chassis heat transfer cold plate thermal failure judgment device 600, determination module 601, construction module 602, calculation module 603, determination module 604, Electronic device 700, processor 701, memory 702, communication interface 703, bus 710. Detailed implementation manners
[0013] The features and exemplary embodiments of various aspects of the present application will be described in detail below. To make the objectives, technical solutions and advantages of the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than limiting the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.
[0014] It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, the elements defined by the statement "comprising..." do not exclude the existence of additional identical elements in the process, method, article or device comprising the said elements.
[0015] With the rapid development of electronic technology, the power density of devices is getting higher and higher, and thermal failure caused by poor heat dissipation has become the main form of electronic device failure. To solve the thermal failure problem of electronic devices, it is necessary to obtain the temperatures of the components inside the chassis and modules, and then determine whether they fail. Therefore, complex computational simulations are often required in the design stage. However, unreasonable designs often make the simulation and calculation processes repetitive, consuming a large amount of time and energy.
[0016] The heat of the device is often conducted bidirectionally on the cold plate. When calculating the equivalent thermal resistance of bidirectional heat conduction, how to divide the thermal resistance is a problem that needs to be clarified. In the book "Thermal Design and Analysis Technology of Electronic Equipment" compiled by Yu Jianzu, there is an equivalent example of a two-dimensional simulated resistance network, but its model is adiabatic on three sides and does not involve a detailed description of thermal resistance division. The current equivalent thermal resistance division scheme usually uses the dividing line parallel to the edge of the cold plate for division, with low accuracy.
[0017] To solve the problems of related technologies, the embodiments of the present application provide a method, device, equipment, medium and product for judging the thermal failure of a cold plate for chassis heat transfer.
[0018] The following combines the drawings and details the method for judging the thermal failure of a cold plate for chassis heat transfer provided by the embodiments of the present application through specific embodiments and their application scenarios.
[0019] Figure 1 The flowchart of the method for judging the thermal failure of a cold plate for chassis heat transfer according to the embodiments of the present application is shown. As Figure 1 shown, the method for judging the thermal failure of a cold plate for chassis heat transfer may specifically include the following steps: S101. Determine the simplified conduction heat dissipation path corresponding to the heat of the heat-generating device being conducted through the cold plate to the side wall and then from the side wall to the bottom cold surface; S102. Construct an equivalent thermal resistance network of the cold plate according to the simplified conduction heat dissipation path. The equivalent thermal resistance network includes a plurality of parallel resistors, and each of the resistors corresponds to each heat transfer direction in the simplified conduction heat dissipation path; S103. Calculate the temperature rise of the chassis affected by the heat-generating device according to the equivalent thermal resistance of the cold plate and the heat generation power of the heat-generating device. The equivalent thermal resistance of the cold plate is calculated according to the equivalent thermal resistance network; S104. In response to determining that the temperature rise exceeds the allowable temperature, determine thermal failure.
[0020] Therefore, each heat transfer link in the heat transfer path of the device on the cold plate is equivalent to a thermal resistance. When calculating the equivalent thermal resistance, the thermal resistance is divided. According to the equivalent thermal resistance and the heat generation power of the device, it is estimated how much temperature rise the heat-generating device causes to the entire device, so as to judge whether it exceeds the allowable temperature, that is, whether there is thermal failure, greatly simplifying the thermal design evaluation process.
[0021] The following introduces the specific implementation manners of the above steps.
[0022] It should be noted that a heat-generating device is arranged at the center of the chassis heat transfer cold plate. For example, but not limited to, the power device to be cooled is closely attached to the center position of the cold plate with thermal grease, so that the device conducts heat to the cold plate, thereby keeping the temperature of the device to be cooled within the safe temperature range to ensure the reliability of the device.
[0023] Figure 2 Fig. shows a schematic diagram of simplifying the conduction heat dissipation path in S101. As Figure 2 shown, for a single heat source modeling, at this time multiple heat sources can be regarded as a parallel relationship. The heat of the heat-generating device 110 is conducted to the side wall 130 through the simplified module or the cold plate 120 on the top layer of the chassis, and then conducted from the side wall 130 to the cold surface 140 at the bottom.
[0024] Furthermore, in S102, according to the simplified conduction heat dissipation path, the equivalent thermal resistance of the cold plate 120 is divided into several parallel resistors to obtain the equivalent thermal resistance network of the cold plate. And each resistor corresponds one by one to each heat transfer direction in the simplified conduction heat dissipation path. It can be understood that the several parallel resistors include at least two parallel resistors.
[0025] Taking the example that the simplified conduction heat dissipation path includes four heat transfer directions, Figure 3 Fig. shows a schematic diagram of the cold plate thermal resistance equivalence. As Figure 1 shown, for the thermal resistance equivalence of the top cold plate 120 thereof, each heat transfer direction can be regarded as the parallel connection of 4 resistors ( , , , ), and the heat is respectively conducted to the four side walls 130 (or the four sides A, B, C, D of the cold plate).
[0026] It should be noted that there is no temperature gradient at each edge of the cold plate, that is, the premise for the equivalence in this embodiment, otherwise it cannot be equivalent to only one thermal resistance for each heat transfer direction.
[0027] Furthermore, Figure 4 Fig. shows the equivalent thermal resistance network diagram of the local part of the cold plate. Figure 4 In , , , respectively represent the temperatures corresponding to the four sides A, B, C, D of the cold plate.
[0028] Furthermore, in some alternative embodiments, the equivalent thermal resistance of the cold plate is calculated according to the following formula (1): ; (1) Wherein, Represents the thermal resistance value corresponding to the heat of the heating device conducting on the cold plate to any edge of the cold plate; Represents the perpendicular length corresponding to drawing a perpendicular line from the heating device to any edge of the cold plate; Represents the thickness of the cold plate; Represents the heat transfer coefficient of the material; Represents the distance between the perpendicular foot O of the perpendicular line and one endpoint F of the edge; Represents the distance between the perpendicular foot O of the perpendicular line and the other endpoint E of the edge.
[0029] In specific implementation, since the heat transfer between two points will propagate along the minimum path (straight line), a mathematical model can be established for the cold plate, that is Figure 5 . As Figure 5 shown, taking the heat conduction to side A as an example, side A is decomposed into countless small segments, the length of each small segment is dx, a perpendicular line is drawn from the heat source (heating device 110) to side A, and the perpendicular length is defined as a, the distance from the position where dx is located to the perpendicular foot O is x, and the thickness of the cold plate is t. Then the length of the heat transfer path at this time is x / cosθ, and the cross-sectional area of the perpendicular heat transfer path is .
[0030] Then, the thermal resistance Rx on this path can be calculated through the following formula (2): . (2) In specific implementation, the total thermal resistance is obtained by the parallel connection of the thermal resistances on these paths, that is, it can be calculated through the following formulas (3) to (8): ; (3) Among them, ; (4) ; (5) Therefore, . (6) Similarly, ; (7) Therefore, it can be obtained that: . (8) It should be noted that some embodiments of the present application are described above. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in a different order than in the above embodiments and still achieve the desired result. Additionally, the processes depicted in the figures do not necessarily require the specific order or sequential order shown to achieve the desired result. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.
[0031] Based on the same inventive concept, corresponding to the method of any of the above embodiments, the present application further provides a chassis heat transfer cold plate thermal failure determination device 600. It should be noted that a heat generating device is provided at the center of the cold plate.
[0032] As Figure 6 shown, the chassis heat transfer cold plate thermal failure determination device 600 may include: A determination module 601, configured to determine a simplified conduction heat dissipation path in which the heat of the heat generating device is conducted through the cold plate to the side wall and then conducted from the side wall to the bottom cold surface; A construction module 602, configured to construct an equivalent thermal resistance network of the cold plate according to the simplified conduction heat dissipation path, where the equivalent thermal resistance network includes a plurality of parallel resistors, and each of the resistors corresponds to each heat transfer direction in the simplified conduction heat dissipation path; A calculation module 603, configured to calculate the temperature rise of the chassis affected by the heat generating device according to the equivalent thermal resistance of the cold plate and the heat generation power of the heat generating device, where the equivalent thermal resistance of the cold plate is calculated according to the equivalent thermal resistance network; A determination module 604, configured to determine a thermal failure in response to determining that the temperature rise exceeds the allowable temperature.
[0033] As an optional embodiment, the calculation module 603 is further configured to: Calculate the equivalent thermal resistance of the cold plate according to the following formula: ; where represents the thermal resistance value corresponding to the heat of the heat generating device being conducted on the cold plate to any edge of the cold plate; represents the perpendicular length from the heat generating device to any edge of the cold plate; represents the thickness of the cold plate; represents the heat transfer coefficient of the material; represents the distance between the perpendicular foot O of the perpendicular and one end point F of the edge; represents the distance between the perpendicular foot O of the perpendicular and the other end point E of the edge.
[0034] Optionally, there is no temperature gradient on each edge of the cold plate.
[0035] Optionally, the plurality of parallel resistors include at least two parallel resistors.
[0036] It should be noted that for the convenience of description, when describing the above device, various modules are described separately according to their functions. Of course, when implementing the present application, the functions of each module can be implemented in one or more software and / or hardware.
[0037] The device of the above embodiment is used to implement the corresponding chassis heat transfer cold plate thermal failure judgment method in any of the above embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be described in detail here.
[0038] Based on the same technical concept, corresponding to any of the above-mentioned embodiment methods, the present application also provides an electronic device.
[0039] Figure 7 A more specific hardware structure diagram of an electronic device provided by this embodiment is shown.
[0040] The electronic device 700 may include a processor 701 and a memory 702 storing computer program instructions.
[0041] Specifically, the processor 701 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.
[0042] The memory 702 may include a large-capacity memory for data or instructions. By way of example and not limitation, the memory 702 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. Where appropriate, the memory 702 may include removable or non-removable (or fixed) media. Where appropriate, the memory 702 may be internal or external to the integrated gateway disaster recovery device. In a specific embodiment, the memory 702 is a non-volatile solid-state memory.
[0043] In certain embodiments, the memory may include read-only memory (ROM), random access memory (RAM), magnetic disk storage media devices, optical storage media devices, flash memory devices, electrical, optical, or other physical / tangible memory storage devices. Thus, generally, the memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described with reference to the method according to an aspect of the present application.
[0044] The processor 701 reads and executes computer program instructions stored in the memory 702 to implement any one of the chassis heat transfer cold plate thermal failure determination methods in the above embodiments.
[0045] In some examples, the electronic device 700 may further include a communication interface 703 and a bus 710. Among them, as Figure 7 shown, the processor 701, the memory 702, and the communication interface 703 are connected through the bus 710 and complete communication with each other.
[0046] The communication interface 703 is mainly used to implement communication between each module, device, unit, and / or device in the embodiments of the present application.
[0047] The bus 710 includes hardware, software, or both, and couples the components of the online data flow metering device to each other. By way of example and not limitation, the bus 710 may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), a HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an InfiniBand interconnect, a Low Pin Count (LPC) bus, a memory bus, a MicroChannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable buses or a combination of two or more of these. In a suitable case, the bus 710 may include one or more buses. Although the embodiments of the present application describe and illustrate specific buses, the present application contemplates any suitable bus or interconnect.
[0048] Exemplarily, the electronic device 700 may be a mobile phone, a tablet computer, a laptop computer, a handheld computer, an in-vehicle electronic device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc.
[0049] Based on the same inventive concept, corresponding to the method of any of the above embodiments, the present application further provides a non-transitory computer-readable storage medium. Computer program instructions are stored on the computer-readable storage medium; when the computer program instructions are executed by a processor, any one of the chassis heat transfer cold plate thermal failure determination methods in the above embodiments is implemented. Examples of computer-readable storage media include non-transitory computer-readable storage media, such as portable disks, hard disks, random access memories (RAMs), read-only memories (ROMs), erasable programmable read-only memories (EPROMs or flash memories), portable compact disk read-only memories (CD-ROMs), optical storage devices, magnetic storage devices, etc.
[0050] Based on the same inventive concept, corresponding to the method of any of the above embodiments, the present application further provides a computer program product, which includes computer program instructions. In some embodiments, the computer program instructions can be executed by one or more processors of a computer to cause the computer and / or the processor to execute the method for judging thermal failure of the chassis heat transfer cold plate. Corresponding to the execution subject of each step in each embodiment of the method for judging thermal failure of the chassis heat transfer cold plate, the processor for executing the corresponding step can belong to the corresponding execution subject.
[0051] It should be clear that the present application is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, the detailed description of known methods is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present application is not limited to the specific steps described and shown. Those skilled in the art can make various changes, modifications and additions, or change the order between steps after understanding the spirit of the present application.
[0052] It should also be noted that the functional blocks shown in the above structure block diagrams can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a functional card, and so on. When implemented in software, the elements of the present application are programs or code segments for performing the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted via a data signal carried in a carrier wave on a transmission medium or a communication link. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical discs, hard disks, fiber optic media, radio frequency (RF) links, and so on. The code segment can be downloaded via a computer network such as the Internet, an intranet, and so on.
[0053] It also needs to be noted that the exemplary embodiments mentioned in the present application describe some methods or systems based on a series of steps or devices. However, the present application is not limited to the order of the above steps, that is, the steps can be executed in the order mentioned in the embodiments, or different from the order in the embodiments, or several steps can be executed simultaneously.
[0054] As described above with reference to the flowcharts and / or block diagrams of methods, apparatuses (systems) and computer program products according to embodiments of the present application. It should be understood that each block in the flowchart and / or block diagram, and the combination of blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device to generate a machine, such that these instructions executed by the processor of the computer or other programmable data processing device enable the implementation of the functions / actions specified in one or more blocks of the flowchart and / or block diagram. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field programmable logic circuit. It should also be understood that each block in the block diagram and / or flowchart, and the combination of blocks in the block diagram and / or flowchart, can also be implemented by dedicated hardware that performs the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.
[0055] As described above, the above is only the specific implementation manner of the present application. Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the above-described systems, modules, and units can refer to the corresponding processes in the foregoing method embodiments and will not be described herein again. It should be understood that the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present application.
Claims
1. A method for judging the thermal failure of a heat sink cold plate in a chassis, characterized in that, A heating device is provided at the center of the cold plate, and the method includes: Determine a simplified conduction heat dissipation path in which the heat of the heating device is conducted through the cold plate to the side wall and then from the side wall to the bottom cold surface; Construct an equivalent thermal resistance network of the cold plate according to the simplified conduction heat dissipation path, where the equivalent thermal resistance network includes a number of parallel resistors, and each of the resistors corresponds one-to-one to each heat transfer direction in the simplified conduction heat dissipation path; Calculate the temperature rise of the chassis affected by the heating device according to the equivalent thermal resistance of the cold plate and the heating power of the heating device, where the equivalent thermal resistance of the cold plate is calculated based on the equivalent thermal resistance network; In response to determining that the temperature rise exceeds the allowable temperature, determine thermal failure.
2. The method according to claim 1, wherein Before calculating the temperature rise of the chassis affected by the heating device according to the equivalent thermal resistance of the cold plate and the heating power of the heating device, the method further includes: Calculate the equivalent thermal resistance of the cold plate according to the following formula: ； Among them, represents the thermal resistance value corresponding to the conduction of the heat of the heating device on the cold plate to any edge of the cold plate; represents the perpendicular length corresponding to drawing a perpendicular line from the heating device to any edge of the cold plate; represents the thickness of the cold plate; represents the heat transfer coefficient of the material; represents the distance between the perpendicular foot O of the perpendicular line and one end point F of the edge; represents the distance between the perpendicular foot O of the perpendicular line and the other end point E of the edge.
3. The method according to claim 1, characterized in that, There is no temperature gradient at each edge of the cold plate.
4. The method according to claim 1, characterized in that The number of parallel resistors includes at least two parallel resistors.
5. A heat transfer cold plate thermal failure judgment device for a chassis, characterized in that A heating device is provided at the center of the cold plate, and the device includes: A determination module for determining a simplified conduction heat dissipation path in which the heat of the heating device is conducted through the cold plate to the side wall and then from the side wall to the bottom cold surface; A construction module for constructing an equivalent thermal resistance network of the cold plate according to the simplified conduction heat dissipation path, where the equivalent thermal resistance network includes a number of parallel resistors, and each of the resistors corresponds one-to-one to each heat transfer direction in the simplified conduction heat dissipation path; A calculation module for calculating the temperature rise of the chassis affected by the heating device according to the equivalent thermal resistance of the cold plate and the heating power of the heating device, where the equivalent thermal resistance of the cold plate is calculated based on the equivalent thermal resistance network; A determination module for determining thermal failure in response to determining that the temperature rise exceeds the allowable temperature.
6. The method according to claim 5, wherein The calculation module is further configured to: Calculate the equivalent thermal resistance of the cold plate according to the following formula: ； Among them, represents the thermal resistance value corresponding to the heat of the heating device conducting on the cold plate to any edge of the cold plate; represents the perpendicular length corresponding to drawing a perpendicular line from the heating device to any edge of the cold plate; represents the thickness of the cold plate; represents the heat transfer coefficient of the material; represents the distance between the perpendicular foot O of the perpendicular line and one endpoint F of the edge; represents the distance between the perpendicular foot O of the perpendicular line and the other endpoint E of the edge.
7. An electronic device, characterized in that, The device includes: a processor and a memory storing computer program instructions; when the processor calls the computer program instructions, the method for judging thermal failure of the heat transfer cold plate of the chassis as described in any one of claims 1-4 is implemented.
8. A computer-readable storage medium, characterized in that, Computer program instructions are stored on a computer-readable storage medium, and when the computer program instructions are called by a processor, the method for judging thermal failure of the heat transfer cold plate of the chassis as described in any one of claims 1-4 is implemented.
9. A computer program product, characterized in that, When the instructions in the computer program product are executed by a processor of an electronic device, the electronic device is caused to execute the method for judging thermal failure of the heat transfer cold plate of the chassis as described in any one of claims 1-4.