Defect detection method, storage medium and terminal

Abstract

The invention discloses a defect detection method, a storage medium and a terminal, and the method comprises the steps: providing a to-be-detected wafer which comprises a plurality of rows of to-be-detected chips arranged in a first direction; obtaining the number of the to-be-detected chips in each row and judging whether the number reaches a detection number threshold value or not; acquiring to-be-detected image data of each to-be-detected chip; when the number of the to-be-detected chips in any row A is smaller than a detection number threshold value, copying to-be-detected image data of the to-be-detected chips in the row A to any row B which is not located in the row A, and generating virtual to-be-detected image data; according to the virtual to-be-detected image data and the to-be-detected image data in the row B and the to-be-detected image data of each row not located in the row B, whether the to-be-detected chip corresponding to the to-be-detected image data has defects or not is judged, so that the situation that detection missing areas exist in the to-be-detected wafer is effectively prevented, detection blind spots are swept, and the detection efficiency is improved. Excessive data comparison is not added, the data processing time can be effectively shortened, and the detection efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly to a defect detection method, a storage medium and a terminal. Background Art

[0002] Semiconductor integrated circuit chips are fabricated in batches, and a large number of various types of semiconductor devices are formed on the same substrate and interconnected to have complete electronic functions. Among them, defects generated in any step may lead to the failure of circuit fabrication. Therefore, in the manufacturing process, it is often necessary to detect and analyze the manufacturing structures of each process step to find out the causes of defects and eliminate them. However, with the rapid development of ultra-large-scale integration (ULSI), the integration degree of chips is getting higher and higher, the size of devices is getting smaller and smaller, and correspondingly, the defect size that is sufficient to affect the device yield rate in the process fabrication is also getting smaller and smaller, posing higher requirements for the defect detection of semiconductor devices.

[0003] However, there are still many problems in the defect detection process of the prior art. Summary of the Invention

[0004] The technical problem solved by the present invention is to provide a defect detection method, a storage medium and a terminal to prevent missed detection in the edge area of the wafer and eliminate detection blind spots.

[0005] To solve the above problems, the present invention provides a defect detection method, including: providing a wafer to be detected, where the wafer to be detected includes a plurality of rows of chips to be detected arranged along a first direction, and each row of the chips to be detected is arranged along a second direction, and the first direction is perpendicular to the second direction; obtaining the number of chips to be detected in each row, and determining whether the number of chips to be detected in each row reaches a detection quantity threshold; obtaining the image data to be detected of each chip to be detected; when it is determined that the number of chips to be detected in any row A is less than the detection quantity threshold, copying the image data to be detected of each chip to be detected in row A to any row B that is not in row A, and generating the number of virtual image data to be detected of the chips to be detected in row A in row B; determining whether there is a defect in the chip to be detected corresponding to the image data to be detected according to the virtual image data to be detected and the image data to be detected in row B, and the image data to be detected of each row that is not in row B.

[0006] Optionally, each piece of the image data to be detected has the same arrangement and number of pixel points, and each pixel point has a pixel value to be detected.

[0007] Optionally, the number of chips to be detected in row A is 1 or 2.

[0008] Optionally, when the number of chips to be detected described in row A is 2, the method for determining whether the chip to be detected corresponding to the image data to be detected is defective according to the virtual image data to be detected and the image data to be detected in row B includes: obtaining an absolute value of a first pixel deviation between the image data to be detected of the chip a to be detected in row B and the image data to be detected of the chip b to be detected adjacent thereto in the first direction at corresponding same-position pixel points, where the chip a to be detected is the starting chip to be detected in row B; obtaining an absolute value of a second pixel deviation between the image data to be detected of the chip a to be detected in row B and the virtual image data c to be detected at corresponding same-position pixel points; providing a pixel detection threshold; comparing each absolute value of the first pixel deviation and each absolute value of the second pixel deviation with the pixel detection threshold respectively to determine whether the chip to be detected corresponding to the image data to be detected is defective.

[0009] Optionally, when both the first pixel deviation value and the second pixel deviation value corresponding to the same-position pixel points are greater than the pixel detection threshold, it is determined that the chip a to be detected is defective; when the first pixel deviation value corresponding to the same-position pixel points is greater than the pixel detection threshold and the second pixel deviation value is less than the pixel detection threshold, it is determined that the chip b to be detected is defective; when the first pixel deviation value corresponding to the same-position pixel points is less than the pixel detection threshold and the second pixel deviation value is greater than the pixel detection threshold, it is determined that the chip to be detected corresponding to the virtual image data c to be detected is defective.

[0010] Optionally, when the number of chips to be detected described in row A is 2, the method for determining whether the chip to be detected corresponding to the image data to be detected is defective according to the virtual image data to be detected and the image data to be detected in row B further includes: obtaining an absolute value of a third pixel deviation between the image data to be detected of the chip d to be detected in row B and the image data to be detected of the chip e to be detected adjacent thereto in the first direction at corresponding same-position pixel points, where the chip e to be detected is the terminating chip to be detected in row B; obtaining an absolute value of a fourth pixel deviation between the image data to be detected of the chip e to be detected in row B and the virtual image data f to be detected at corresponding same-position pixel points; providing a pixel detection threshold; comparing each absolute value of the third pixel deviation and each absolute value of the fourth pixel deviation with the pixel detection threshold respectively to determine whether the chip to be detected corresponding to the image data to be detected is defective.

[0011] Optionally, when the third pixel deviation value and the fourth pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip e to be detected has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the fourth pixel deviation value is less than the pixel detection threshold, it is judged that the chip d to be detected has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the fourth pixel deviation value is greater than the pixel detection threshold, it is judged that the chip to be detected corresponding to the virtual image data f to be detected has a defect.

[0012] Optionally, when the number of the chips to be detected in row A is 1, a method for determining whether the chip to be detected corresponding to the image data to be detected has defects based on the virtual image data to be detected and the image data to be detected in row B includes: obtaining a first pixel deviation absolute value between the image data to be detected of the chip to be detected a in row B and the image data to be detected of the chip to be detected b adjacent to the chip to be detected along the first direction at corresponding pixel values at the same position, wherein the chip to be detected a is the starting chip to be detected in row B; obtaining a second pixel deviation absolute value between the image data to be detected of the chip to be detected a in row B and the pixel values to be detected of the virtual image data to be detected c at corresponding pixel values at the same position; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the image data. The method comprises the following steps: comparing the pixel detection threshold with the pixel detection threshold to determine whether the chip to be detected corresponding to the image data to be detected has defects; or obtaining the third pixel deviation absolute value between the pixel values to be detected at the same position of the image data of the chip to be detected d in row B and the pixel detection threshold with the pixel detection threshold to determine whether the chip to be detected corresponding to the image data to be detected has defects; or obtaining the third pixel deviation absolute value between the pixel values to be detected at the same position of the image data of the chip to be detected d in row B and the pixel detection threshold with the pixel detection threshold to determine whether the chip to be detected corresponding to the image data to be detected has defects. The method comprises the following steps:

[0013] Optionally, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip a to be detected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is judged that the chip b to be detected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the second pixel deviation value is greater than the pixel detection threshold, it is judged that the chip to be detected corresponding to the virtual image data to be detected c has a defect; or, when the third pixel deviation value and the fourth pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip e to be detected has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the fourth pixel deviation value is less than the pixel detection threshold, it is judged that the chip d to be detected has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the fourth pixel deviation value is greater than the pixel detection threshold, it is judged that the chip to be detected corresponding to the virtual image data to be detected c has a defect.

[0014] Optionally, the method for judging whether the chip to be detected corresponding to the image data to be detected has defects based on the image data to be detected in each row that is not located in row B includes: obtaining the first pixel deviation absolute value between the pixel values to be detected at the same position corresponding to the image data of the chip to be detected a, the chip to be detected b and the chip to be detected c arranged arbitrarily in succession in each row; the second pixel deviation absolute value between the pixel values to be detected at the same position corresponding to the image data of the chip to be detected c and the pixel values to be detected of the image data to be detected b; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively to judge whether the chip to be detected corresponding to the image data to be detected has defects.

[0015] Optionally, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip b to be detected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is judged that the chip a to be detected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the second pixel deviation value is greater than the pixel detection threshold, it is judged that the chip c to be detected has a defect.

[0016] Optionally, the method for obtaining the number of the chips to be detected in each row includes: obtaining the number of the chips to be detected in each row through a first scanning process.

[0017] Optionally, the method for obtaining the image data to be detected of each of the chips to be detected includes: obtaining the image data to be detected of each of the chips to be detected through a second scanning process.

[0018] Optionally, when it is determined that the number of the chips to be detected in each row is greater than or equal to the detection quantity threshold, based on the image data to be detected in each row, it is determined whether the chips to be detected corresponding to the image data to be detected are defective.

[0019] Optionally, after determining whether the chips to be detected corresponding to the image data to be detected are defective, the method further includes: restoring the virtual image data to be detected in row B to row A; forming a scanned image based on the image data to be detected in each row, and marking the defective positions of the chips to be detected in the scanned image.

[0020] Correspondingly, the technical solution of the present invention further provides a storage medium, on which computer instructions are stored, and characterized in that when the computer instructions run, the steps of the method in any one of the above technical solutions are executed.

[0021] Correspondingly, the technical solution of the present invention further provides a terminal, including a memory and a processor, and computer instructions capable of running on the processor are stored on the memory, and characterized in that when the processor runs the computer instructions, the steps of the method in any one of the above technical solutions are executed.

[0022] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0023] In the defect detection method of the technical solution of the present invention, when the number of the chips to be detected in any row A is less than the detection quantity threshold, by copying the image data to be detected of each of the chips to be detected in row A to any row B not located in row A, generating the number of virtual image data to be detected of the chips to be detected in row A in row B, thereby effectively preventing detection omission areas in the wafer to be detected and eliminating detection blind spots. In addition, by copying the image data to be detected in row A to row B for data comparison, no extra data comparison will be added during this process, which can effectively reduce the data processing time and improve the detection efficiency.

[0024] Further, after determining whether the to-be-detected chip corresponding to the to-be-detected image data has a defect, the method further includes: restoring the virtual to-be-detected image data in row B to row A; forming a scanned image according to the to-be-detected image data of each row, and marking the defect positions of the to-be-detected chip in the scanned image. By printing out the physical scanned image, the detected defect positions are presented more intuitively. Description of the Drawings

[0025] Figures 1 to 3 is a schematic structural diagram of each step of a defect detection method;

[0026] Figure 4 is a flowchart of a defect detection method in an embodiment of the present invention;

[0027] Figures 5 to 10 is a schematic structural diagram of each step of a defect detection method in an embodiment of the present invention. Detailed Embodiment

[0028] As described in the background art, there are still many problems in the defect detection process of the prior art. The following will be specifically described with reference to the drawings.

[0029] Figures 1 to 3 is a schematic structural diagram of each step of a defect detection method.

[0030] Please refer to Figure 1 , a to-be-detected wafer 100 is provided. The to-be-detected wafer 100 includes a plurality of to-be-detected chips arranged along a first direction X. Each row of the to-be-detected chips is arranged along a second direction Y, and the first direction X is perpendicular to the second direction Y. The plurality of to-be-detected chips include: a first to-be-detected chip 101, a second to-be-detected chip 102, and a third to-be-detected chip 103 that are arranged adjacent to each other along the first direction X.

[0031] Please refer to Figure 2 , respectively obtain first to-be-detected image data 101a of the first to-be-detected chip 101, second to-be-detected image data 102a of the second to-be-detected chip 102, and third to-be-detected image data 103a of the third to-be-detected chip 103. The first to-be-detected image data 101a, the second to-be-detected image data 102a, and the third to-be-detected image data 103a have the same arrangement and number of pixel points. Among them, each pixel point of the first to-be-detected image data 101a has a first to-be-detected pixel value, each pixel point of the second to-be-detected image data 102a has a second to-be-detected pixel value, and each pixel point of the third to-be-detected image data 103a has a third to-be-detected pixel value.

[0032] Please refer to Figure 3, compare the first image data to be detected 101a with the second image data to be detected 102a, obtain the first pixel value to be detected for each pixel point in the first image data to be detected 101a, and the first pixel deviation absolute value between the first pixel value to be detected and the second pixel value to be detected corresponding to the pixel point at the same position in the second image data to be detected 102a; compare the second image data to be detected 102a with the third image data to be detected 103a, obtain the second pixel value to be detected for each pixel point in the second image data to be detected 102a, and the second pixel deviation absolute value between the second pixel value to be detected and the pixel point at the same position in the third image data to be detected 103a; provide a pixel detection threshold; compare each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively, and determine whether the first chip to be detected 101, the second chip to be detected 102 and the third chip to be detected 103 have defects.

[0033] Please continue to refer to Figure 3 In one embodiment, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is determined that the second chip to be inspected 102 has a defect.

[0034] In one embodiment, when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold and the second pixel deviation value is less than the pixel detection threshold, it is determined that the first chip to be inspected 101 has a defect (not shown).

[0035] In one embodiment, when the first pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the second pixel deviation value is greater than the pixel detection threshold, it is determined that the third chip to be inspected 103 has a defect (not shown).

[0036] For defect scanning of the wafer 100 to be inspected, current scanning machines in the industry detect defects by comparing the inspected chip with the adjacent chips on both sides arranged along the first direction X. To meet current wafer defect detection methods, the number of inspected chips in each row must be greater than or equal to three.

[0037] However, when approaching the edge area of the wafer to be inspected, the number of chips in a row to be inspected is often less than 3 and cannot be scanned and compared, resulting in no defect information for the chips to be inspected in this row, which in turn increases the risk of low wafer yield.

[0038] On this basis, the present invention provides a defect detection method, a storage medium and a terminal. When the number of the chips to be detected in any row A is less than the detection quantity threshold, by copying the image data to be detected of each of the chips to be detected in row A to any row B not located in row A, a number of virtual image data to be detected equal to the number of the chips to be detected in row A are generated in row B, thereby effectively preventing detection omission areas in the wafer to be detected and eliminating detection blind spots. In addition, by copying the image data to be detected in row A to row B for data comparison, no extra data comparison is added in this process, which can effectively reduce the data processing time and improve the detection efficiency.

[0039] To make the above objects, features and advantages of the present invention more obvious and understandable, the following specifically describes the embodiments of the present invention in detail with reference to the drawings.

[0040] Figure 4 It is a flowchart of a defect detection method according to an embodiment of the present invention.

[0041] Please refer to Figure 4 , the defect detection method includes:

[0042] Step S101, providing a wafer to be detected, where the wafer to be detected includes a plurality of chips to be detected arranged in a first direction, and each row of the chips to be detected is arranged in a second direction, and the first direction is perpendicular to the second direction;

[0043] Step S102, obtaining the number of the chips to be detected in each row, and determining whether the number of the chips to be detected in each row reaches the detection quantity threshold;

[0044] Step S103, obtaining the image data to be detected of each of the chips to be detected;

[0045] Step S104, when it is determined that the number of the chips to be detected in any row A is less than the detection quantity threshold, copying the image data to be detected of each of the chips to be detected in row A to any row B not located in row A, and generating a number of virtual image data to be detected equal to the number of the chips to be detected in row A in row B;

[0046] Step S105, determining whether the chips to be detected corresponding to the image data to be detected are defective according to the virtual image data to be detected and the image data to be detected in row B, and the image data to be detected of each row not located in row B.

[0047] The following will specifically describe each step of the defect detection method with reference to the drawings.

[0048] Figures 5 to 10It is a schematic structural diagram of each step of a defect detection method in an embodiment of the present invention.

[0049] Please refer to Figure 5 , a wafer 200 to be detected is provided, and the wafer 200 to be detected includes a plurality of chips 201 to be detected arranged in a row along a first direction X, and each row of the chips 201 to be detected is arranged along a second direction Y, and the first direction X is perpendicular to the second direction Y.

[0050] It should be noted that, in this embodiment, a plurality of the chips 201 to be detected are divided by scribe lanes, and after defect detection of the chips 201 to be detected, subsequent cutting processing is performed on the scribe lanes, so that the wafer 200 to be detected is divided into a plurality of the chips 201 to be detected.

[0051] Please refer to Figure 6 , obtain the number of the chips 201 to be detected in each row, and determine whether the number of the chips 201 to be detected in each row reaches a detection quantity threshold.

[0052] In this embodiment, the method for obtaining the number of the chips 201 to be detected in each row includes: obtaining the number of the chips 201 to be detected in each row through a first scanning process 202.

[0053] In this embodiment, the path of the first scanning process 202 is scanned in an "S" - shaped path as shown in the figure. The first scanning process 202 is only used to detect the number of the chips 201 to be detected in each row, and is not used to obtain the image data of each chip 201 to be detected.

[0054] It should be noted that, since the wafer 200 to be detected has a circular structure, the width of the wafer 200 to be detected gradually decreases from the center to the edge, so the number of the chips 201 to be detected is often less than the detection quantity threshold in the edge area of the wafer 200 to be detected.

[0055] In this embodiment, it shows that the number of the chips 201 to be detected is less than the detection quantity threshold in the edge areas on opposite sides of the wafer 200 to be detected. Specifically, it shows that the number of the chips 201 to be detected in row A is 1.

[0056] In other embodiments, the number of the chips 201 to be detected in row A can also be 2.

[0057] In other embodiments, the number of the chips 201 to be detected in each row can also be greater than or equal to 3.

[0058] In this embodiment, the detection threshold is 3. This is because the subsequent scanning machine uses a row detection principle when performing defect detection. Defects are detected by comparing the chips 201 to be detected in the middle of each row with the chips 201 to be detected on both sides of the scanner. In other words, the chips 201 to be detected are compared with two adjacent chips 201 to be detected along the first direction X. Therefore, the number of chips 201 to be detected in each row must be greater than or equal to 3; otherwise, comparison detection cannot be performed.

[0059] Please refer to Figure 7 , obtaining the image data to be detected of each chip 201 to be detected.

[0060] In this embodiment, the method for obtaining the image data to be detected of each chip to be detected 201 includes: obtaining the image data to be detected of each chip to be detected 201 through a second scanning process 203 .

[0061] In this embodiment, the path of the second scanning process 203 is also scanned according to the "S"-shaped path shown above. The second scanning process 203 is used to obtain image data of each chip to be detected 201, and after obtaining the image data of each chip to be detected 201, it is stored in sequence.

[0062] It should be noted that, in this embodiment, each of the image data to be detected has the same arrangement and number of pixels, and each pixel has a pixel value to be detected, so that it can be used for subsequent comparison between different image data to be detected.

[0063] Please refer to Figure 8 When it is determined that the number of the chips 201 to be detected in any row A is less than the detection number threshold, the image data to be detected of each chip 201 to be detected in row A is copied to any row B that is not in row A, and virtual image data to be detected are generated in row B for the number of chips 201 to be detected in row A.

[0064] In this embodiment, one piece of image data to be detected in row A is copied to row B to generate one piece of virtual image data to be detected in row B.

[0065] In other embodiments, when the number of the chips 201 to be detected in row A is 2, the 2 image data to be detected in row A are copied to row B to generate 2 virtual image data to be detected in row B.

[0066] In other embodiments, when the number of the chips 201 to be inspected in each row is greater than or equal to 3, it is not necessary to perform compensation processing on the virtual image data to be inspected for any row.

[0067] Please refer to Figure 9 , based on the virtual image data to be detected and the image data to be detected in row B, and the image data to be detected in each row not located in row B, determine whether the chip to be detected 201 corresponding to the image data to be detected has defects.

[0068] In this embodiment, when it is detected that the number of chips 201 to be inspected in any row A is less than the detection number threshold, the image data to be inspected for each chip 201 to be inspected in row A is copied to any row B not located in row A, thereby generating virtual image data to be inspected in row B equal to the number of chips 201 to be inspected in row A. This effectively prevents areas of the wafer 200 to be inspected from being missed and eliminates inspection blind spots. In addition, by copying the image data to be inspected in row A to row B for data comparison, no additional redundant data comparison is added during this process, effectively reducing data processing time and improving inspection efficiency.

[0069] Please continue to refer to Figure 9 In this embodiment, the number of the chips to be inspected 201 in row A is 1. The method for determining whether the chip to be inspected 201 corresponding to the virtual image data to be inspected and the image data to be inspected in row B has a defect includes: obtaining a first pixel deviation absolute value between the image data to be inspected of the chip to be inspected a201 in row B and the image data to be inspected of the chip to be inspected b201 adjacent to the chip to be inspected along the first direction X at corresponding pixel values at the same position, where the chip to be inspected a201 is the starting chip to be inspected 201 in row B; obtaining a second pixel deviation absolute value between the image data to be inspected of the chip to be inspected a201 in row B and the pixel values to be inspected of the virtual image data to be inspected c at corresponding pixel values at the same position; providing a pixel detection threshold; and comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute values with the pixel detection threshold respectively to determine whether the chip to be inspected 201 corresponding to the image data to be inspected has a defect.

[0070] Please continue to refer to Figure 9 Correspondingly, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is determined that the chip a201 to be detected has a defect.

[0071] When the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is determined that the chip b to be inspected has a defect (not shown).

[0072] When the first pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the second pixel deviation value is greater than the pixel detection threshold, it is determined that the chip to be detected corresponding to the virtual image data c to be detected has a defect (not shown).

[0073] Alternatively, obtain the third pixel deviation absolute value between the pixel values to be detected at the same pixel position corresponding to the image data of the chip to be detected d in row B and the pixel values to be detected of the chip to be detected e adjacent to the chip to be detected along the first direction, and the chip to be detected e is located at the terminal chip to be detected in row B; obtain the fourth pixel deviation absolute value between the pixel values to be detected of the image data to be detected e in row B and the pixel values to be detected of the virtual image data c at the same pixel position corresponding to the pixel detection threshold; provide a pixel detection threshold; compare each of the third pixel deviation absolute values and each of the fourth pixel deviation absolute values with the pixel detection threshold respectively to determine whether the chip to be detected corresponding to the image data to be detected has a defect (not shown). Correspondingly, when the third pixel deviation value and the fourth pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip e to be detected has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the fourth pixel deviation value is less than the pixel detection threshold, it is judged that the chip to be detected d has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the fourth pixel deviation value is greater than the pixel detection threshold, it is judged that the chip to be detected corresponding to the virtual image data c to be detected has a defect (not shown).

[0074] In other embodiments, when the number of the chips to be detected in row A is 2, a method for determining whether the chip to be detected corresponding to the image data to be detected is defective according to the virtual image data to be detected and the image data to be detected in row B includes: obtaining an absolute value of a first pixel deviation between the pixel values to be detected at corresponding same-position pixels of the image data to be detected of the chip a to be detected in row B and the image data to be detected of the chip b to be detected adjacent thereto in the first direction, where the chip a to be detected is the starting chip to be detected in row B; obtaining an absolute value of a second pixel deviation between the pixel values to be detected at corresponding same-position pixels of the image data to be detected of the chip a to be detected in row B and the virtual image data c to be detected; providing a pixel detection threshold; comparing each of the absolute values of the first pixel deviation and each of the absolute values of the second pixel deviation with the pixel detection threshold respectively to determine whether the chip to be detected corresponding to the image data to be detected is defective. Correspondingly, when both the first pixel deviation value and the second pixel deviation value corresponding to the same-position pixels are greater than the pixel detection threshold, it is determined that the chip a to be detected is defective; when the first pixel deviation value corresponding to the same-position pixels is greater than the pixel detection threshold and the second pixel deviation value is less than the pixel detection threshold, it is determined that the chip b to be detected is defective; when the first pixel deviation value corresponding to the same-position pixels is less than the pixel detection threshold and the second pixel deviation value is greater than the pixel detection threshold, it is determined that the chip to be detected corresponding to the virtual image data c to be detected is defective (not shown).

[0075] When the number of the chips to be detected in row A is 2, the method for determining whether the chip to be detected corresponding to the image data to be detected has a defect according to the virtual image data to be detected and the image data to be detected in row B further includes: obtaining an absolute value of a third pixel deviation between the image data to be detected of the chip d to be detected in row B and the image data to be detected of the chip e to be detected adjacent thereto along the first direction at corresponding same-position pixel points, where the chip e to be detected is the chip to be detected that terminates in row B; obtaining an absolute value of a fourth pixel deviation between the image data to be detected of the chip e to be detected in row B and the virtual image data f to be detected at corresponding same-position pixel points; providing a pixel detection threshold; comparing each absolute value of the third pixel deviation and each absolute value of the fourth pixel deviation with the pixel detection threshold respectively to determine whether the chip to be detected corresponding to the image data to be detected has a defect. Correspondingly, when both the third pixel deviation value and the fourth pixel deviation value corresponding to the same-position pixel points are greater than the pixel detection threshold, it is determined that the chip e to be detected has a defect; when the third pixel deviation value corresponding to the same-position pixel points is greater than the pixel detection threshold and the fourth pixel deviation value is less than the pixel detection threshold, it is determined that the chip d to be detected has a defect; when the third pixel deviation value corresponding to the same-position pixel points is less than the pixel detection threshold and the fourth pixel deviation value is greater than the pixel detection threshold, it is determined that the chip to be detected corresponding to the virtual image data f to be detected has a defect (not shown).

[0076] Please continue to refer to Figure 9 , in this embodiment, the method for determining whether the chip 201 to be detected corresponding to the image data to be detected in each row not in row B has a defect includes: obtaining an absolute value of a first pixel deviation between the image data to be detected of the chip a 201 to be detected and the image data to be detected of the chip b 201 to be detected at corresponding same-position pixel points among any continuously arranged chips a 201 to be detected, chips b 201 to be detected, and chips c 201 to be detected in each row; obtaining an absolute value of a second pixel deviation between the image data to be detected of the chip c 201 to be detected and the image data to be detected of the chip b 201 to be detected at corresponding same-position pixel points; providing a pixel detection threshold; comparing each absolute value of the first pixel deviation and each absolute value of the second pixel deviation with the pixel detection threshold respectively to determine whether the chip 201 to be detected corresponding to the image data to be detected has a defect.

[0077] Please continue to refer to Figure 9, correspondingly, when both the first pixel deviation value and the second pixel deviation value corresponding to the pixel points at the same position are greater than the pixel detection threshold, it is determined that the chip b201 to be detected has a defect.

[0078] When the first pixel deviation value corresponding to the pixel points at the same position is greater than the pixel detection threshold and the second pixel deviation value is less than the pixel detection threshold, it is determined that the chip a201 to be detected has a defect (not shown).

[0079] When the first pixel deviation value corresponding to the pixel points at the same position is less than the pixel detection threshold and the second pixel deviation value is greater than the pixel detection threshold, it is determined that the chip c201 to be detected has a defect (not shown).

[0080] In other embodiments, when it is determined that the number of chips to be detected in each row is greater than or equal to 3, based on the image data to be detected in each row, it is determined whether the chips to be detected corresponding to the image data to be detected have defects. The specific comparison process is the same as the method of determining whether the chips to be detected corresponding to the image data to be detected in each row not located in row B have defects as described above, and will not be elaborated here.

[0081] Please refer to Figure 10 , after determining whether the chips to be detected corresponding to the image data to be detected have defects, restore the virtual image data to be detected in row B to row A; form a scanned image based on the image data to be detected in each row, and mark the defect positions of the chips to be detected in the scanned image.

[0082] In this embodiment, by printing out the physical scanned image 300, the detected defect positions are presented more intuitively.

[0083] Correspondingly, an embodiment of the present invention also provides a storage medium, on which computer instructions are stored, characterized in that when the computer instructions run, they execute the steps of the method in any one of the above embodiments.

[0084] Correspondingly, an embodiment of the present invention also provides a terminal, including a memory and a processor, where computer instructions capable of running on the processor are stored on the memory, characterized in that when the processor runs the computer instructions, it executes the steps of the method in any one of the above embodiments.

[0085] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be subject to the scope defined by the claims.

Claims

1. A defect detection method, characterized in that, Including: Providing a wafer to be detected, the wafer to be detected including a plurality of rows of chips to be detected arranged in a first direction, each row of the chips to be detected being arranged in a second direction, the first direction being perpendicular to the second direction; Obtaining the number of chips to be detected in each row, and determining whether the number of chips to be detected in each row reaches a detection quantity threshold; Obtaining the image data to be detected of each chip to be detected; When it is determined that the number of chips to be detected in any row A is less than the detection quantity threshold, copying the image data to be detected of each chip to be detected in row A to any row B that is not in row A, and generating the number of virtual image data to be detected of the chips to be detected in row A in row B; Determining whether the chips to be detected corresponding to the image data to be detected are defective according to the virtual image data to be detected and the image data to be detected in row B, and the image data to be detected of each row that is not in row B.

2. The defect detection method according to claim 1, characterized in that, Each of the image data to be detected has the same arrangement and number of pixel points, and each pixel point has a pixel value to be detected.

3. The defect detection method according to claim 2, characterized in that, The number of chips to be detected in row A is 1 or 2.

4. The defect detection method according to claim 3, wherein When the number of chips to be detected in row A is 2, the method for determining whether the chips to be detected corresponding to the image data to be detected are defective according to the virtual image data to be detected and the image data to be detected in row B includes: obtaining an absolute value of a first pixel deviation between the pixel values to be detected of corresponding same-position pixel points of the image data to be detected of the chip to be detected a in row B and the image data to be detected of the chip to be detected b adjacent in the first direction, the chip to be detected a being the starting chip to be detected in row B; obtaining an absolute value of a second pixel deviation between the pixel values to be detected of corresponding same-position pixel points of the image data to be detected of the chip to be detected a in row B and the virtual image data to be detected c; providing a pixel detection threshold; comparing each absolute value of the first pixel deviation and each absolute value of the second pixel deviation with the pixel detection threshold respectively to determine whether the chips to be detected corresponding to the image data to be detected are defective.

5. The defect detection method according to claim 4, wherein When both the first pixel deviation value and the second pixel deviation value corresponding to the same-position pixel points are greater than the pixel detection threshold, it is determined that the chip to be detected a is defective; when the first pixel deviation value corresponding to the same-position pixel points is greater than the pixel detection threshold and the second pixel deviation value is less than the pixel detection threshold, it is determined that the chip to be detected b is defective; When the first pixel deviation value corresponding to the same-position pixel points is less than the pixel detection threshold and the second pixel deviation value is greater than the pixel detection threshold, it is determined that the chip to be detected corresponding to the virtual image data to be detected c is defective.

6. The defect detection method according to claim 5, wherein When the number of the chips to be detected described in row A is 2, the method for determining whether the chip to be detected corresponding to the image data to be detected is defective according to the virtual image data to be detected and the image data to be detected described in row B further includes: obtaining an absolute value of a third pixel deviation between the image data to be detected of the chip d to be detected described in row B and the image data to be detected of the chip e to be detected adjacent thereto in the first direction at corresponding same-position pixel points, where the chip e to be detected is the chip to be detected that terminates in row B; obtaining an absolute value of a fourth pixel deviation between the image data to be detected of the chip e to be detected described in row B and the virtual image data f to be detected at corresponding same-position pixel points; providing a pixel detection threshold; comparing each of the absolute values of the third pixel deviation and each of the absolute values of the fourth pixel deviation with the pixel detection threshold respectively to determine whether the chip to be detected corresponding to the image data to be detected is defective.

7. The defect detection method according to claim 6, wherein When both the third pixel deviation value and the fourth pixel deviation value corresponding to the same-position pixel points are greater than the pixel detection threshold, it is determined that the chip e to be detected is defective; when the third pixel deviation value corresponding to the same-position pixel points is greater than the pixel detection threshold and the fourth pixel deviation value is less than the pixel detection threshold, it is determined that the chip d to be detected is defective; When the third pixel deviation value corresponding to the same-position pixel points is less than the pixel detection threshold and the fourth pixel deviation value is greater than the pixel detection threshold, it is determined that the chip to be detected corresponding to the virtual image data f to be detected is defective.

8. The defect detection method according to claim 3, wherein When the number of the chips to be detected described in row A is 1, the method for determining whether the chip to be detected corresponding to the image data to be detected is defective according to the virtual image data to be detected and the image data to be detected described in row B includes: obtaining an absolute value of a first pixel deviation between the image data to be detected of the chip a to be detected described in row B and the image data to be detected of the chip b to be detected adjacent thereto in the first direction at corresponding same-position pixel points, where the chip a to be detected is the chip to be detected that starts in row B; obtaining an absolute value of a second pixel deviation between the image data to be detected of the chip a to be detected described in row B and the virtual image data c to be detected at corresponding same-position pixel points; providing a pixel detection threshold; comparing each of the absolute values of the first pixel deviation and each of the absolute values of the second pixel deviation with the pixel detection threshold respectively to determine whether the chip to be detected corresponding to the image data to be detected is defective; or, Obtain the absolute value of the third pixel deviation between the to-be-detected image data of the to-be-detected chip d described in row B and the to-be-detected pixel values of the corresponding same-position pixel points of the to-be-detected image data of the to-be-detected chip e adjacent to the to-be-detected chip d along the first direction, where the to-be-detected chip e is the to-be-detected chip terminated in row B; obtain the absolute value of the fourth pixel deviation between the to-be-detected image data of the to-be-detected chip e in row B and the to-be-detected pixel values of the corresponding same-position pixel points of the virtual to-be-detected image data c; provide a pixel detection threshold; compare each of the absolute values of the third pixel deviation and each of the absolute values of the fourth pixel deviation with the pixel detection threshold respectively to determine whether the to-be-detected chip corresponding to the to-be-detected image data has a defect.

9. The defect detection method according to claim 8, wherein When both the first pixel deviation value and the second pixel deviation value corresponding to the same-position pixel points are greater than the pixel detection threshold, it is determined that the to-be-detected chip a has a defect; when the first pixel deviation value corresponding to the same-position pixel points is greater than the pixel detection threshold and the second pixel deviation value is less than the pixel detection threshold, it is determined that the to-be-detected chip b has a defect; When the first pixel deviation value corresponding to the same-position pixel points is less than the pixel detection threshold and the second pixel deviation value is greater than the pixel detection threshold, it is determined that the to-be-detected chip corresponding to the virtual to-be-detected image data c has a defect; or, When both the third pixel deviation value and the fourth pixel deviation value corresponding to the same-position pixel points are greater than the pixel detection threshold, it is determined that the to-be-detected chip e has a defect; when the third pixel deviation value corresponding to the same-position pixel points is greater than the pixel detection threshold and the fourth pixel deviation value is less than the pixel detection threshold, it is determined that the to-be-detected chip d has a defect; When the third pixel deviation value corresponding to the same-position pixel points is less than the pixel detection threshold and the fourth pixel deviation value is greater than the pixel detection threshold, it is determined that the to-be-detected chip corresponding to the virtual to-be-detected image data c has a defect.

10. The defect detection method according to claim 2, wherein, The method for determining whether the to-be-detected chip corresponding to the to-be-detected image data has a defect according to the to-be-detected image data of each row not in row B includes: obtaining the absolute value of the first pixel deviation between the to-be-detected image data of the to-be-detected chip a and the to-be-detected pixel values of the corresponding same-position pixel points of the to-be-detected image data of the to-be-detected chip b among any continuously arranged to-be-detected chips a, to-be-detected chips b, and to-be-detected chips c in each row; the absolute value of the second pixel deviation between the to-be-detected image data of the to-be-detected chip c and the to-be-detected pixel values of the corresponding same-position pixel points of the to-be-detected image data of the to-be-detected chip b; providing a pixel detection threshold; comparing each of the absolute values of the first pixel deviation and each of the absolute values of the second pixel deviation with the pixel detection threshold respectively to determine whether the to-be-detected chip corresponding to the to-be-detected image data has a defect.

11. The defect detection method according to claim 10, wherein, When both the first pixel deviation value and the second pixel deviation value corresponding to the pixel points at the same position are greater than the pixel detection threshold, it is determined that the chip b to be detected has a defect; when the first pixel deviation value corresponding to the pixel points at the same position is greater than the pixel detection threshold and the second pixel deviation value is less than the pixel detection threshold, it is determined that the chip a to be detected has a defect; When the first pixel deviation value corresponding to the pixel points at the same position is less than the pixel detection threshold and the second pixel deviation value is greater than the pixel detection threshold, it is determined that the chip c to be detected has a defect.

12. The defect detection method according to claim 1, wherein, The method for obtaining the number of the chips to be detected in each row includes: obtaining the number of the chips to be detected in each row through a first scanning process.

13. The defect detection method according to claim 1, characterized in that, The method for obtaining the image data to be detected of each of the chips to be detected includes: obtaining the image data to be detected of each of the chips to be detected through a second scanning process.

14. The defect detection method according to claim 1, wherein, When it is determined that the number of the chips to be detected in each row is greater than or equal to the detection quantity threshold, based on the image data to be detected in each row, it is determined whether the chips to be detected corresponding to the image data to be detected have defects.

15. The defect detection method according to claim 1, characterized in that, After determining whether the chips to be detected corresponding to the image data to be detected have defects, it further includes: restoring the virtual image data to be detected in row B to row A; forming a scanned image based on the image data to be detected in each row, and marking the defect positions of the chips to be detected in the scanned image.

16. A storage medium having computer instructions stored thereon, characterized in that, When the computer instructions run, they execute the steps of the method according to any one of claims 1 to 15.

17. A terminal, comprising a memory and a processor, wherein computer instructions capable of running on the processor are stored on the memory, characterized in that When the processor runs the computer instructions, it executes the steps of the method according to any one of claims 1 to 15.

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