Wafer etching processing positioning device and use method thereof

Abstract

The invention discloses a wafer etching processing positioning device and a use method thereof, and belongs to the technical field of wafer processing.The wafer etching processing positioning device is provided with a circular base plate, a limiting sliding column, a sliding connecting frame, an electric push rod, a pull plate, a convex moving seat and a pressing positioning mechanism, and the sliding connecting frame is pushed to slide on the surface of the limiting sliding column; a pulling plate is rotated between a rotating frame I and a rotating frame II, and convex moving seats are pulled to slide in convex sliding grooves, so that the four convex moving seats respectively drive corresponding pressing and positioning mechanisms to synchronously move at the top of the mounting top plate to be close to a circular base plate until the pressing and positioning mechanisms are tightly attached to the edge of the wafer disc; the wafer disc is pushed to slide on the top of the circular base plate until the four pressing and positioning mechanisms cling to the edge of the wafer disc at the same time, so that the wafer disc is positioned to the central position of the top of the circular base plate, the central position of the wafer disc is conveniently moved to coincide with the central position of the circular base plate, and it is ensured that dislocation and deviation cannot occur when the wafer disc is etched.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer processing, and specifically relates to a wafer etching processing positioning device and a using method thereof. Background Art

[0002] As a silicon wafer used for manufacturing silicon semiconductor circuits, when processing and producing silicon semiconductor circuits, a plurality of processing steps are required. Among them, wafer etching processing is a key link in semiconductor manufacturing. With the continuous development of modern technology, the integration degree of semiconductor devices is getting higher and higher, and the precision requirements for wafer etching processing are becoming increasingly stringent. During the wafer etching process, even a tiny error may lead to a decline or even failure of the performance of the entire chip. During the wafer etching processing, a positioning device is often used to adjust the position of the wafer, so that the wafer is accurately positioned and placed at a designated position for etching processing, improving the precision of wafer etching processing, increasing the yield rate of wafer etching processing, and at the same time protecting the wafer to prevent damage to the wafer edge during the processing.

[0003] When the existing wafer etching processing positioning device adjusts the position of the wafer, generally, a manipulator adsorbs the wafer disk, controls the manipulator to rotate, and places the wafer disk at a designated position. After long-term use of the multi-axis rotation of the manipulator, it is easy to cause deviation in the rotation of the manipulator, resulting in deviation between the wafer disk and the etching processing position, affecting the etching effect of the wafer disk. Therefore, improvement is needed. Summary of the Invention

[0004] In order to overcome the above defects, the present invention provides a wafer etching processing positioning device and a using method thereof, which solve the problem that when the existing wafer etching processing positioning device adjusts the position of the wafer, generally, a manipulator adsorbs the wafer disk, controls the manipulator to rotate, and places the wafer disk at a designated position. After long-term use of the multi-axis rotation of the manipulator, it is easy to cause deviation in the rotation of the manipulator, resulting in deviation between the wafer disk and the etching processing position, affecting the etching effect of the wafer disk.

[0005] To achieve the above object, the present invention provides the following technical solution: A wafer etching processing positioning device includes a mounting bottom plate. Four corners of the bottom of the mounting bottom plate are respectively fixedly installed with feet. Four corners of the top of the mounting bottom plate are respectively fixedly installed with support columns. The tops of the four support columns are fixedly installed with a mounting top plate. A limiting sliding column is fixedly installed at the central position between the mounting bottom plate and the mounting top plate. The surface of the limiting sliding column is slidably connected through a sliding connection frame. Four electric push rods and pulling plates are arranged at equal angles and staggered between the surface of the sliding connection frame and the bottom of the mounting top plate. A convex moving seat is slidably installed through the bottom of the mounting top plate corresponding to the pulling plate. The top of the convex moving seat passes through the mounting top plate and is fixedly installed with a pressing and positioning mechanism.

[0006] As a further solution of the present invention: four convex slide grooves are provided at equal angles on the bottom of the mounting top plate, and the convex slide grooves pass through both sides of the mounting top plate, and mounting slide rods are symmetrically fixedly installed inside the convex slide grooves, the convex movable seat passes through and is slidably connected to the surfaces of the two mounting slide rods, and the convex movable seat passes through the convex slide grooves on both sides and extends to the outside of the mounting top plate, and the surface of the mounting slide rod on one side of the convex movable seat is sleeved with a return spring, and a cross pad is fixedly installed at the top of the mounting top plate at the central position between the four convex slide grooves, and a circular pad is fixedly installed on the top of the cross pad.

[0007] As a further solution of the present invention: an installation groove 1 is provided inside the limit sliding column, sliding grooves are symmetrically provided on the surface of the limit sliding column, and the installation groove 1 is connected to the two sliding grooves, a mounting column is fixedly installed at the central position inside the installation groove 1, and a lifting spring is sleeved on the surface of the installation column located inside the installation groove 1, and a limit stop ring is fixedly installed on the top of the surface of the limit sliding column.

[0008] As a further solution of the present invention: a sliding plate is fixedly installed inside the sliding connecting frame, the sliding plate passes through the sliding slot and is slidably connected to the inside of the installation slot, and the sliding plate passes through and is slidably connected to the surface of the installation column located on the top of the lifting spring.

[0009] As a further solution of the present invention: the two ends of the electric push rod are respectively rotatably installed with a rotating seat one and a rotating seat two through a pin shaft, one side of the rotating seat one is fixedly connected to the surface of the sliding connecting frame, and the rotating seat two is fixedly connected to the bottom of the mounting top plate, and the four electric push rods are distributed at equal angles on the surface of the sliding connecting frame and the bottom of the mounting top plate.

[0010] As a further solution of the present invention: the two ends of the pull plate are respectively rotatably installed with a rotating frame one and a rotating frame two through a pin shaft, one side of the rotating frame one is fixedly connected to the surface of the sliding connecting frame, and the rotating frame two is fixedly connected to the bottom of the mounting top plate, and the four electric push rods and the four pull plates are staggered and distributed at equal angles on the surface of the sliding connecting frame and the bottom of the mounting top plate, and the rotating frame two is fixedly connected to the convex movable seat.

[0011] As a further solution of the present invention: the clamping and positioning mechanism includes a mounting block, a mounting groove 2 is provided inside the mounting block, and the top of the mounting groove 2 passes through the mounting block, a limiting slide is slidably installed on the bottom of the mounting groove 2, a connecting rod is fixedly installed on the top of the limiting slide, and the top end of the connecting rod passes through and is slidably connected to the top of the mounting groove 2, and a compression spring is sleeved on the surface of the connecting rod located inside the mounting groove 2.

[0012] As a further solution of the present invention: the top end of the connecting rod passes through the second installation groove and extends to the top of the installation block, where a pressing top block is fixedly installed. At the bottom of one side of the pressing top block, a pressing wheel is rotatably installed through a rotating shaft. On the top of both sides of the installation block, limiting convex blocks are symmetrically and fixedly installed. On the surface of the pressing top block, a limiting frame is fixedly installed. At the bottom of both sides of the limiting frame, limiting sliding grooves are symmetrically arranged, and the limiting sliding grooves penetrate and are slidably connected to the surface of the limiting convex blocks.

[0013] A method for using a wafer etching processing positioning device, the method comprising the following steps:

[0014] After placing the wafer disk on the top of the circular backing plate, control the synchronous telescoping of the four electric push rods to push the sliding connection frame to move downward on the surface of the limiting sliding column, so that the sliding connection frame drives the sliding plate to slide on the surface of the installation column, squeezing the spring under the sliding plate to deform. At the same time, when the sliding connection frame slides down on the surface of the limiting sliding column, it pulls the pull plate to rotate between the first rotating frame and the second rotating frame, driving the convex moving seat to slide inside the convex sliding groove, squeezing the reset spring to deform on the surface of the corresponding installation sliding rod. At the same time, during the movement of the convex moving seat, it drives the installation block to approach the circular backing plate, so that the four installation blocks move synchronously on the top of the installation top plate and approach the circular backing plate, pushing the wafer disk to move to the central position on the top of the circular backing plate;

[0015] When the installation block is closely attached to the edge of the wafer disk, the edge of the wafer disk is in contact with the pressing wheel, so that the pressing wheel rolls on the edge of the wafer disk, causing the edge of the wafer disk to lift the pressing top block. When the pressing top block moves upward and away from the installation block, it drives the connecting rod to pull the limiting sliding plate to move upward inside the second installation groove, squeezing the pressing spring to deform inside the second installation groove until the edge of the wafer disk is closely attached to the installation block and the pressing top block. Under the rebounding action of the pressing spring, the limiting sliding plate is pressed against the inner bottom of the second installation groove, driving the pressing top block to move downward and approach the installation block, pressing the edge of the wafer disk between the installation block and the pressing top block, thereby pressing and fixing the wafer disk on the top of the circular backing plate, ensuring that the center of the wafer disk coincides with the center of the circular backing plate, and positioning and fixing the wafer disk.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] 1. In the present invention, by providing a circular backing plate, limiting sliding columns, sliding connection frames, electric push rods, pulling plates, convex moving seats, and a pressing and positioning mechanism, after placing the crystal disk on the top of the circular backing plate, control the four electric push rods to extend and retract synchronously, push the sliding connection frame to slide on the surface of the limiting sliding columns, make the pulling plate rotate between the first rotating frame and the second rotating frame, pull the convex moving seat to slide inside the convex sliding groove, so that the four convex moving seats respectively drive the corresponding pressing and positioning mechanisms to move synchronously on the top of the installation top plate close to the circular backing plate until the pressing and positioning mechanisms are tightly attached to the edge of the crystal disk, and push the crystal disk to slide on the top of the circular backing plate until the four pressing and positioning mechanisms are simultaneously tightly attached to the edge of the crystal disk, thereby positioning the crystal disk to the central position on the top of the circular backing plate, facilitating the movement of the central position of the crystal disk to coincide with the central position of the circular backing plate, and ensuring that there is no misalignment during the etching of the crystal disk.

[0018] 2. In the present invention, by providing an installation block, a limiting sliding plate, a pressing spring, a pressing top block, and a pressing wheel, when the installation block approaches the crystal disk placed on the top of the circular backing plate, the crystal disk is inserted into the opening gap between the installation block and the pressing top block, so that the pressing wheel tightly adheres to and rolls on the top of the crystal disk, pushing the pressing top block away from the installation block. When the pressing top block moves upward, it drives the connecting rod and the limiting sliding plate to move upward inside the second installation groove, squeezing the pressing spring to deform on the top of the limiting sliding plate until the crystal disk tightly adheres to the inner wall at the opening of the installation block and the pressing top block. Then, under the rebounding action of the pressing spring, the limiting sliding plate is pressed downward close to the inner bottom of the second installation groove, and the connecting rod drives the pressing top block to move downward close to the installation block, thereby tightly pressing and fixing the edge of the crystal disk between the installation block and the pressing top block, ensuring that there is no tilting or deflection during the etching process of the crystal disk, which may cause misalignment in the etching of the crystal disk. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic cross-sectional structure diagram of the present invention;

[0020] Figure 2 is a schematic cross-sectional structure diagram of the installation top plate of the present invention;

[0021] Figure 3 is a schematic structure diagram of the installation sliding rod, convex moving seat, and pressing and positioning mechanism of the present invention;

[0022] Figure 4 is a schematic cross-sectional structure diagram of the limiting sliding column and sliding connection frame of the present invention;

[0023] Figure 5 is a schematic structure diagram of the sliding connection frame, electric push rod, and pulling plate of the present invention;

[0024] Figure 6 is a schematic cross-sectional structure diagram of the installation block, pressing top block, and limiting frame of the present invention;

[0025] In the figure: 1, mounting base plate; 2, feet; 3, support column; 4, mounting top plate; 401, convex chute; 402, cross-shaped backing plate; 403, circular backing plate; 404, mounting slide bar; 405, return spring; 5, limit slide post; 501, first mounting groove; 502, sliding through groove; 503, mounting post; 504, jacking spring; 505, limit retaining ring; 6, sliding connection frame; 601, sliding plate; 7, electric push rod; 701, first rotating seat; 702, second rotating seat; 8, pull plate; 801, first rotating frame; 802, second rotating frame; 9, convex moving seat; 10, pressing and positioning mechanism; 1001, mounting block; 1002, second mounting groove; 1003, limit sliding plate; 1004, connecting rod; 1005, pressing spring; 1006, pressing top block; 1007, pressing wheel; 1008, limit convex block; 1009, limit frame; 1010, limit chute. Detailed implementation manners

[0026] The technical solutions of the present application will be further described in detail below in conjunction with the specific implementation manners.

[0027] As Figure 1-6 shown, the present invention provides a technical solution: a wafer etching processing positioning device, including a mounting base plate 1, feet 2 are respectively fixedly installed at the four corners of the bottom of the mounting base plate 1, support columns 3 are respectively fixedly installed at the four corners of the top of the mounting base plate 1, a mounting top plate 4 is fixedly installed at the tops of the four support columns 3, four convex chutes 401 are equiangularly arranged at the bottom of the mounting top plate 4, and the convex chutes 401 penetrate through the upper and lower sides of the mounting top plate 4. Two mounting slide bars 404 are symmetrically and fixedly installed along the length direction inside the convex chutes 401. The convex moving seat 9 is slidably connected through the two mounting slide bars 404. The convex moving seat 9 is engaged and slid in the convex chute 401, and both sides of the convex moving seat 9 penetrate through the convex chute 401 and extend to the outside of the mounting top plate 4. A return spring 405 is sleeved on the surface of the mounting slide bar 404 on one side of the convex moving seat 9. By providing the return spring 405, when the convex moving seat 9 slides on the surface of the mounting slide bar 404, the return spring 405 is extruded and deformed on the surface of the mounting slide bar 404, so that the return spring 405 applies an elastic force to the convex moving seat 9. When the convex moving seat 9 slides and resets on the surface of the mounting slide bar 404, the return spring 405 rebounds to assist the convex moving seat 9 in resetting.

[0028] A cross-shaped backing plate 402 is fixedly installed at the central position between the four convex chutes 401 on the top of the mounting top plate 4, and a circular backing plate 403 is fixedly installed on the top of the cross-shaped backing plate 402. Due to the provision of the circular backing plate 403, when the crystal disk is placed on the top of the circular backing plate 403, there is a certain gap between the crystal disk and the mounting top plate 4, avoiding the crystal disk being completely attached to the top of the mounting top plate 4 and affecting the taking of the crystal disk.

[0029] A limiting slide post 5 is fixedly installed at the central position between the mounting bottom plate 1 and the mounting top plate 4. An installation groove 501 is arranged inside the limiting slide post 5. Sliding through grooves 502 are symmetrically arranged on the surface of the limiting slide post 5, and the installation groove 501 communicates with the two sliding through grooves 502. An installation post 503 is fixedly installed at the central position inside the installation groove 501. A jacking spring 504 is sleeved on the surface of the installation post 503 located inside the installation groove 501. A limiting retaining ring 505 is fixedly installed at the top of the surface of the limiting slide post 5. A sliding connection frame 6 is slidably connected through the surface of the limiting slide post 5. A sliding plate 601 is fixedly installed inside the sliding connection frame 6. The sliding plate 601 passes through the sliding through groove 502 and is slidably connected inside the installation groove 501. The sliding plate 601 is slidably connected through the surface of the installation post 503 located at the top of the jacking spring 504.

[0030] When the sliding connection frame 6 slides on the surface of the limiting slide post 5, it drives the sliding plate 601 to slide on the surface of the installation post 503, squeezing the jacking spring 504 to deform at the bottom of the sliding plate 601. When controlling the sliding connection frame 6 to move upward, the jacking spring 504 rebounds and applies an upward elastic force to the sliding plate 601, assisting the sliding connection frame 6 to slide upward and reset on the surface of the limiting slide post 5 until it is in tight contact with the limiting retaining ring 505. At the same time, the limiting retaining ring 505 restricts the sliding range of the sliding connection frame 6 on the surface of the limiting slide post 5.

[0031] Four electric push rods 7 and pull plates 8 are arranged at equal angles and staggered between the surface of the sliding connection frame 6 and the bottom of the mounting top plate 4. Both ends of the electric push rod 7 are respectively rotatably installed with a rotating seat 701 and a rotating seat 702 through a pin shaft. One side of the rotating seat 701 is fixedly connected with the surface of the sliding connection frame 6, and the rotating seat 702 is fixedly connected with the bottom of the mounting top plate 4. And the four electric push rods 7 are equally angularly distributed on the surface of the sliding connection frame 6 and the bottom of the mounting top plate 4. Due to the provision of the electric push rod 7, the four electric push rods 7 are controlled to synchronously expand and contract, so that the electric push rod 7 rotates between the corresponding rotating seat 701 and rotating seat 702, thereby pushing the sliding connection frame 6 to slide on the surface of the limiting slide post 5 and adjusting the position of the sliding connection frame 6 on the surface of the limiting slide post 5.

[0032] Both ends of the pull plate 8 are respectively rotatably installed with a rotating frame 801 and a rotating frame 802 through a pin shaft. One side of the rotating frame 801 is fixedly connected with the surface of the sliding connection frame 6, and the rotating frame 802 is fixedly connected with the bottom of the mounting top plate 4. And the four electric push rods 7 and the four pull plates 8 are staggered and equally angularly distributed on the surface of the sliding connection frame 6 and the bottom of the mounting top plate 4. The rotating frame 802 is fixedly connected with the convex moving seat 9. By providing the pull plate 8, when the sliding connection frame 6 moves up and down on the surface of the limiting slide post 5, it drives the pull plate 8 to rotate between the rotating frame 801 and the rotating frame 802, so that the pull plate 8 pulls the convex moving seat 9 to slide inside the convex sliding groove 401, thereby controlling the distance between the four convex moving seats 9.

[0033] A pressing and positioning mechanism 10 is fixedly installed through the top of the convex moving seat 9 and the installation top plate 4. The pressing and positioning mechanism 10 includes an installation block 1001. An installation groove two 1002 is provided inside the installation block 1001, and the top of the installation groove two 1002 penetrates through the installation block 1001. A limiting slide plate 1003 is slidably installed at the inner bottom of the installation groove two 1002. A connecting rod 1004 is fixedly installed at the top of the limiting slide plate 1003, and the top end of the connecting rod 1004 penetrates and is slidably connected to the top of the installation groove two 1002. A pressing spring 1005 is sleeved on the surface of the connecting rod 1004 inside the installation groove two 1002. The top end of the connecting rod 1004 passes through the installation groove two 1002 and extends to the top of the installation block 1001 to fixedly install a pressing top block 1006. A pressing wheel 1007 is rotatably installed at the bottom of one side of the pressing top block 1006 through a rotating shaft.

[0034] When inserting the opening between the installation block 1001 and the pressing top block 1006 at the edge of the crystal disk during processing, the crystal disk jacks up the pressing top block 1006, causing the pressing top block 1006 to move upward away from the installation block 1001, driving the connecting rod 1004 and the limiting slide plate 1003 to move upward inside the installation groove two 1002 and squeezing the pressing spring 1005 to deform. Under the rebounding action of the pressing spring 1005, the limiting slide plate 1003 is pressed downward, causing the pressing top block 1006 to move downward close to the installation block 1001, thereby clamping and fixing the crystal disk between the installation block 1001 and the pressing top block 1006. When inserting the crystal disk into the opening between the installation block 1001 and the pressing top block 1006, the pressing wheel 1007 rolls on the edge of the crystal disk, thereby reducing the pressure when the installation block 1001 and the pressing top block 1006 clamp the crystal disk and avoiding damage to the crystal disk due to excessive clamping pressure.

[0035] Limiting convex blocks 1008 are symmetrically and fixedly installed at the top of both sides of the installation block 1001. A limiting frame 1009 is fixedly installed on the surface of the pressing top block 1006. Limiting sliding grooves 1010 are symmetrically provided at the bottom of both sides of the limiting frame 1009. The limiting sliding grooves 1010 penetrate and are slidably connected to the surface of the limiting convex blocks 1008. By providing the limiting convex blocks 1008 and the limiting frame 1009, when the pressing top block 1006 moves upward away from the installation block 1001, the limiting frame 1009 is driven to move upward on the surface of the installation block 1001, and at the same time, the limiting sliding grooves 1010 slide on the surface of the limiting convex blocks 1008, thereby limiting the pressing top block 1006 and ensuring that the pressing top block 1006 does not shift out of position when moving on the top of the installation block 1001.

[0036] A usage method of a wafer etching processing positioning device, the usage method includes the following steps:

[0037] After placing the crystal disk on top of the circular backing plate 403, control the four electric push rods 7 to synchronously extend and retract, pushing the sliding connecting frame 6 to move downward on the surface of the limit sliding column 5, causing the sliding connecting frame 6 to drive the sliding plate 601 to slide on the surface of the mounting column 503, squeezing the top spring 504 to deform at the bottom of the sliding plate 601. At the same time, during the downward sliding of the sliding connecting frame 6 on the surface of the limit sliding column 5, the pull plate 8 is pulled to rotate between the rotating frame one 801 and the rotating frame two 802, driving the convex moving seat 9 to slide inside the convex sliding groove 401, squeezing the reset spring 405 to deform on the surface of the corresponding mounting slide rod 404. At the same time, during the movement of the convex moving seat 9, the mounting block 1001 is driven to approach the circular backing plate 403, causing the four mounting blocks 1001 to synchronously move closer to the circular backing plate 403 on top of the mounting top plate 4, pushing the crystal disk to move to the central position on top of the circular backing plate 403;

[0038] When the mounting block 1001 is in close contact with the edge of the crystal disk, the edge of the crystal disk is in contact with the pressing wheel 1007, causing the pressing wheel 1007 to roll on the edge of the crystal disk, causing the edge of the crystal disk to lift the pressing top block 1006. When the pressing top block 1006 moves upward away from the mounting block 1001, it drives the connecting rod 1004 to pull the limit sliding plate 1003 to move upward inside the mounting groove two 1002, squeezing the pressing spring 1005 to deform inside the mounting groove two 1002 until the edge of the crystal disk is in close contact with the mounting block 1001 and the pressing top block 1006. Under the rebounding action of the pressing spring 1005, the limit sliding plate 1003 is pressed against the inner bottom of the mounting groove two 1002, driving the pressing top block 1006 to move downward closer to the mounting block 1001, pressing the edge of the crystal disk between the mounting block 1001 and the pressing top block 1006, thereby pressing and fixing the crystal disk on top of the circular backing plate 403, ensuring that the center of the crystal disk coincides with the center of the circular backing plate 403, and positioning and fixing the crystal disk.

[0039] In the description of the present invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0040] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more, unless otherwise specifically defined.

[0041] In the present invention, unless otherwise clearly stipulated or defined, terms such as "installed", "connected", "joined", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection, or a communication connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal connection of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In the present invention, unless otherwise clearly stipulated or defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of this specification, the description with reference to terms such as "one solution", "some solutions", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the solution or example are included in at least one solution or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same solution or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more solutions or examples.

Claims

1. A wafer etching processing positioning device, comprising a mounting base plate (1), characterized in that: Four feet (2) are respectively and fixedly installed at the four corners of the bottom of the installation base plate (1). Four support columns (3) are respectively and fixedly installed at the four corners of the top of the installation base plate (1). The top ends of the four support columns (3) are fixedly installed with an installation top plate (4). A limit sliding column (5) is fixedly installed at the central position between the installation base plate (1) and the installation top plate (4). The surface of the limit sliding column (5) is slidably connected through a sliding connection frame (6). Four electric push rods (7) and pull plates (8) are arranged at equal angles and staggered between the surface of the sliding connection frame (6) and the bottom of the installation top plate (4). A convex moving seat (9) is slidably installed through the bottom of the installation top plate (4) corresponding to the pull plate (8). The top of the convex moving seat (9) passes through the installation top plate (4) and is fixedly installed with a pressing and positioning mechanism (10).

2. The positioning device for wafer etching processing according to claim 1, wherein: Four convex chutes (401) are arranged at equal angles at the bottom of the installation top plate (4), and the convex chutes (401) penetrate through both sides of the installation top plate (4). Installation sliding rods (404) are symmetrically and fixedly installed inside the convex chutes (401). The convex moving seat (9) is slidably connected through the surfaces of the two installation sliding rods (404), and both sides of the convex moving seat (9) penetrate through the convex chutes (401) and extend to the outside of the installation top plate (4). A return spring (405) is sleeved on the surface of the installation sliding rod (404) on one side of the convex moving seat (9). A cross-shaped cushion plate (402) is fixedly installed at the central position between the four convex chutes (401) at the top of the installation top plate (4). A circular cushion plate (403) is fixedly installed on the top of the cross-shaped cushion plate (402).

3. A wafer etching and processing positioning device according to claim 1, characterized in that: An installation groove one (501) is arranged inside the limit sliding column (5). Sliding through grooves (502) are symmetrically arranged on the surface of the limit sliding column (5), and the installation groove one (501) is communicated with the two sliding through grooves (502). An installation column (503) is fixedly installed at the central position inside the installation groove one (501). A jacking spring (504) is sleeved on the surface of the installation column (503) inside the installation groove one (501). A limit retaining ring (505) is fixedly installed at the top of the surface of the limit sliding column (5).

4. The wafer etching and processing positioning device according to claim 3, characterized in that: A sliding plate (601) is fixedly installed inside the sliding connection frame (6). The sliding plate (601) is slidably connected through the sliding through groove (502) and is inside the installation groove one (501). The sliding plate (601) is slidably connected through the surface of the installation column (503) on the top of the jacking spring (504).

5. A wafer etching and processing positioning device according to claim 1, characterized in that: Both ends of the electric push rod (7) are respectively rotatably installed with a rotating seat one (701) and a rotating seat two (702) through a pin shaft. One side of the rotating seat one (701) is fixedly connected with the surface of the sliding connection frame (6). The rotating seat two (702) is fixedly connected with the bottom of the installation top plate (4), and the four electric push rods (7) are distributed at equal angles on the surface of the sliding connection frame (6) and the bottom of the installation top plate (4).

6. The positioning device for wafer etching processing according to claim 1, characterized in that: Both ends of the pull plate (8) are rotatably installed with a first rotating frame (801) and a second rotating frame (802) through pin shafts. One side of the first rotating frame (801) is fixedly connected to the surface of the sliding connection frame (6). The second rotating frame (802) is fixedly connected to the bottom of the installation top plate (4). Four electric push rods (7) and four pull plates (8) are staggered and equally angularly distributed on the surface of the sliding connection frame (6) and the bottom of the installation top plate (4). The second rotating frame (802) is fixedly connected to the convex moving seat (9).

7. A wafer etching and processing positioning device according to claim 1, characterized in that: The pressing and positioning mechanism (10) includes an installation block (1001). An installation groove two (1002) is arranged inside the installation block (1001), and the top of the installation groove two (1002) penetrates through the installation block (1001). A limiting slide plate (1003) is slidably installed at the inner bottom of the installation groove two (1002). A connecting rod (1004) is fixedly installed at the top of the limiting slide plate (1003), and the top end of the connecting rod (1004) penetrates and is slidably connected to the top of the installation groove two (1002). A pressing spring (1005) is sleeved on the surface of the connecting rod (1004) located inside the installation groove two (1002).

8. A wafer etching and processing positioning device according to claim 7, characterized in that: The top end of the connecting rod (1004) passes through the installation groove two (1002) and extends to the top of the installation block (1001) to fixedly install a pressing top block (1006). A pressing wheel (1007) is rotatably installed at the bottom of one side of the pressing top block (1006) through a rotating shaft. Limiting convex blocks (1008) are symmetrically and fixedly installed at the top of both sides of the installation block (1001). A limiting frame (1009) is fixedly installed on the surface of the pressing top block (1006). Limiting sliding grooves (1010) are symmetrically arranged at the bottom of both sides of the limiting frame (1009). The limiting sliding grooves (1010) penetrate and are slidably connected to the surface of the limiting convex blocks (1008).

9. A method for using a positioning device for wafer etching processing, the positioning device for wafer etching processing according to any one of claims 1-8, characterized in that: The usage method includes the following steps: After placing the crystal disk on the top of the circular cushion plate (403), control the four electric push rods (7) to synchronously extend and retract, push the sliding connection frame (6) to move downward on the surface of the limiting sliding column (5), so that the sliding connection frame (6) drives the sliding plate (601) to slide on the surface of the installation column (503), and the compression top spring (504) deforms at the bottom of the sliding plate (601). At the same time, when the sliding connection frame (6) slides down on the surface of the limiting sliding column (5), it pulls the pull plate (8) to rotate between the first rotating frame (801) and the second rotating frame (802), drives the convex moving seat (9) to slide inside the convex sliding groove (401), and the compression return spring (405) deforms on the surface of the corresponding installation sliding rod (404). At the same time, when the convex moving seat (9) moves, it drives the installation block (1001) to approach the circular cushion plate (403), so that the four installation blocks (1001) move synchronously on the top of the installation top plate (4) and approach the circular cushion plate (403), and push the crystal disk to move to the central position on the top of the circular cushion plate (403); When the mounting block (1001) is pressed against the edge of the wafer disk, the edge of the wafer disk fits with the pressing wheel (1007), causing the pressing wheel (1007) to roll on the edge of the wafer disk, and the edge of the wafer disk jacks up the pressing top block (1006). When the pressing top block (1006) moves upward and away from the mounting block (1001), it drives the connecting rod (1004) to pull the limiting sliding plate (1003) to move upward inside the second mounting groove (1002), squeezing the pressing spring (1005) to deform inside the second mounting groove (1002) until the edge of the wafer disk is pressed against the mounting block (1001) and the pressing top block (1006). Under the rebounding action of the pressing spring (1005), the limiting sliding plate (1003) is pressed against the inner bottom of the second mounting groove (1002), driving the pressing top block (1006) to move downward and approach the mounting block (1001), pressing the edge of the wafer disk between the mounting block (1001) and the pressing top block (1006), thereby pressing and fixing the wafer disk on the top of the circular backing plate (403), ensuring that the center of the wafer disk coincides with the center of the circular backing plate (403), and positioning and fixing the wafer disk.

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