Wafer conversion equipment for semiconductor processing

Abstract

The invention relates to the field of semiconductor processing, and discloses wafer conversion equipment for semiconductor processing, which comprises a shell, a bearing mechanism, a pushing mechanism and an opening and closing control mechanism. According to the invention, through driving of the bearing mechanism, the pushing mechanism and the opening and closing control mechanism, when a wafer is borne and the size of the wafer is smaller than that of the bearing mechanism, a threaded column in the opening and closing control mechanism is controlled to rotate, so that the sliding frame is driven to move towards the direction of the bearing mechanism; the two push rods are further driven to slide towards the open side of the shell, so that the brackets rotate around the axes of the rotating columns under the pushing of the push rods, the ends, adjacent to the open side of the shell, of the two brackets are close to each other, a wafer with a smaller size is supported, and the rotating angles of the two brackets can be adjusted by adjusting the sliding distance of the push rods. Therefore, the device can support wafers of different sizes.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technologies, and particularly to a wafer conversion device for semiconductor processing. Background Art

[0002] In semiconductor processing, wafers need to be transferred between multiple processing devices. At this time, a wafer conversion device is used to carry the wafers and move them. When transferring wafers, a robotic arm is used to transfer the wafers in the conversion device into the processing device or move the wafers in the processing device into the conversion device, and the optical system carried by the robotic arm is used to position the wafers. Existing wafer conversion devices can only carry wafers with the same size and thickness, with a small applicable range. When converting wafers with different sizes and thicknesses, different conversion devices need to be used, which not only increases the equipment cost, but also the redundant equipment occupies more space. At the same time, a supporting vacuum environment also needs to be equipped, which is not conducive to the development of the semiconductor processing industry. Summary of the Invention

[0003] The present application proposes a wafer conversion device for semiconductor processing, which has the advantages of a wide applicable range and flexible adjustment, to solve the problem that the applicable wafer size of existing wafer conversion devices cannot be adjusted.

[0004] To achieve the above object, the present application adopts the following technical solutions: A wafer conversion device for semiconductor processing, including a housing, symmetric through grooves are opened on the back surface of the housing, and a mounting seat is rotatably installed on the bottom surface of the housing. The device further includes:

[0005] A loading mechanism, which includes a plurality of rotating columns fixedly clamped on the mounting seat. A guiding groove is opened on the circumferential surface of the rotating column. A lower ring and an upper ring are rotatably installed outside the rotating column. A guiding column is slidably connected inside the upper ring. One end of the guiding column is slidably connected in the guiding groove. Two symmetric brackets are rotatably installed on the outer side surface of the upper ring. A through horizontal groove is opened on the top surface of the bracket. A push rod is hinged in the horizontal groove, and the push rod passes through the through groove;

[0006] A pushing mechanism, the pushing mechanism includes a connecting frame fixedly connected to the push rod. A rotating block is rotatably installed at the end of the connecting frame away from the push rod. A round bar is slidably sleeved inside the rotating block. One end of the round bar is fixedly connected to a chute frame, and a push column is slidably connected inside the chute frame;

[0007] An opening and closing control mechanism, which is responsible for pushing the push rod to slide into the housing.

[0008] Preferably, a clamping block is fixedly connected to the top surface of the rotating column, and a clamping groove is opened on the bottom surface of the rotating column.

[0009] Preferably, a limiting post is rotatably installed at one end of the bracket away from the rotating column, and the limiting post contacts the side of the wafer placed on the bracket together with the pushing post.

[0010] Preferably, symmetric first sliding rails are fixedly connected to the inner bottom surface of the outer shell. A plurality of sliders are slidably connected in the first sliding rails, and one end of the round rod away from the chute frame is hinged to the slider.

[0011] Preferably, the opening and closing control mechanism includes a side shell fixedly connected to the back of the outer shell. A sliding frame is slidably connected in the side shell, and the sliding frame translates towards the outer shell.

[0012] Preferably, a threaded post penetrating through the outer side surface of the side shell is threadedly connected to the center of the sliding frame. When the threaded post rotates forward, it drives the sliding frame to approach the loading mechanism.

[0013] Preferably, symmetric second sliding rails are fixedly connected to the side surface of the sliding frame facing the outer shell. The second sliding rails are in a vertical state, and one end of the push rod passing through the through groove is slidably connected in the second sliding rails.

[0014] Preferably, a rotating column is rotatably installed on the top surface of the outer shell, and the rotating column is fixedly clamped on the clamping block at the top of the uppermost rotating column.

[0015] Preferably, a first motor is fixedly connected to the top surface of the outer shell. A first bevel gear is fixedly sleeved on the output shaft of the first motor and the outer side surface of the rotating column respectively, and the first bevel gears are meshed with each other.

[0016] Preferably, a second motor is fixedly connected to the outer side surface of the side shell. A second bevel gear is fixedly sleeved on the output shaft of the second motor and the outer side surface of the threaded post respectively, and the second bevel gears are meshed with each other.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. In the present invention, driven by the provided loading mechanism, pushing mechanism and opening and closing control mechanism, when loading a wafer, when the size of the wafer is smaller than that of the loading mechanism, by controlling the rotation of the threaded post in the opening and closing control mechanism, the sliding frame is driven to move towards the loading mechanism, and then the two push rods are driven to slide towards the open side of the outer shell. Thus, under the push of the push rods, the bracket rotates around the axis of the rotating column, so that one end of the two brackets adjacent to the open side of the outer shell approaches, thereby supporting the wafer with a smaller size. By adjusting the sliding distance of the push rods, the rotation angle of the two brackets can be adjusted, so that the device can support wafers of different sizes.

[0019] 2. Secondly, in the present invention, through the provided pushing mechanism, when the size of the wafer is smaller than the size of the wafer that the current bearing mechanism can support, as the push rod slides, it drives the bracket to rotate. At the same time, the connecting frame also moves together. Then, the round rod is pushed by the rotating block connected to the connecting frame. At this time, one end of the round rod is hinged inside the slider, so that the round rod rotates around the hinge point with the slider. At this time, the chute frame at the other end of the round rod moves. Through the movement of the two chute frames, the push column moves towards the open side of the housing. Thus, the small-sized wafer located on the bracket is pushed towards the open side of the housing. At the same time, the wafer is positioned through the cooperation of the push column and the two limit columns, ensuring that when wafers of different sizes are carried, the wafers will all be close to the open side of the housing, facilitating the manipulator to place and remove the wafers, and avoiding the need to position the wafers again when the manipulator removes the wafers because the centers of multiple wafers in the bearing mechanism are not on the same vertical line.

[0020] 3. Finally, through the provided multiple rotating columns and guiding grooves, when the manipulator places the wafer on the bracket, by rotating the rotating column, the guiding column slides in the guiding groove, and then the guiding column moves from the lowest point of the inclined section of the guiding groove to the highest point. At this time, the guiding column drives the lower ring and the upper ring to move upward, and then drives the two brackets to move upward, thereby increasing the distance between the lowermost bracket and the inner bottom surface of the housing, avoiding affecting the extension of the manipulator due to too close a distance and affecting the loading quantity of the equipment. After the loading is completed, by rotating the rotating column in the reverse direction, the guiding column moves from the highest point of the inclined section of the guiding groove to the lowest point, and then the bracket moves downward. At this time, the overall center of gravity of the bearing mechanism moves downward, thereby preventing the wafers on the bearing mechanism from sliding when the equipment is moved because the center of gravity of the equipment is relatively high. At the same time, by replacing the rotating column with different guiding grooves, the upward movement distance of the bracket can be changed. In this way, when the thickness of the wafers is different, by replacing the rotating column, it can be prevented that the thick wafers are close to the wafers above, avoiding collisions between the wafers and other objects when the manipulator removes the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings forming a part of the specification depict the embodiments disclosed in the present application and, together with the specification, are used to explain the principles of the present application in a clear and understandable manner.

[0022] Referring to the drawings, the present disclosure can be more clearly understood from the following detailed description, wherein:

[0023] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 is a schematic diagram of the rear side view structure of the present invention;

[0025] Figure 3 is a schematic diagram of the sectional view of the housing of the present invention;

[0026] Figure 4 For the present invention Figure 3 The enlarged view of part A in the present invention;

[0027] Figure 5 The schematic structural diagram of the bottom part of the outer shell of the present invention;

[0028] Figure 6 The schematic structural diagram of the bearing mechanism and the pushing mechanism of the present invention;

[0029] Figure 7 The schematic cross-sectional structural diagram of the bearing mechanism of the present invention;

[0030] Figure 8 For the present invention Figure 7 The enlarged view of part B in the present invention;

[0031] Figure 9 The schematic structural diagram of another shape of the guiding groove of the present invention.

[0032] Wherein: 1. Outer shell; 11. Rotating column; 12. First motor; 13. First helical gear; 14. Through groove; 15. First slide rail; 16. Slide block; 17. Mounting seat; 2. Bearing mechanism; 21. Rotating column; 22. Guiding groove; 23. Engaging block; 24. Lower ring; 25. Upper ring; 26. Guiding column; 27. Bracket; 28. Transverse groove; 29. Push rod; 210. Limit post; 211. Engaging groove; 3. Pushing mechanism; 31. Connecting frame; 32. Rotating block; 33. Round bar; 34. Slide groove frame; 35. Push post; 4. Opening and closing control mechanism; 41. Side shell; 42. Second motor; 43. Threaded column; 44. Sliding frame; 45. Second helical gear; 46. Second slide rail. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0034] As Figures 1 to 9 shown, the wafer conversion device for semiconductor processing in this embodiment includes an outer shell 1. Symmetric through grooves 14 are provided on the back of the outer shell 1. A mounting seat 17 is rotatably installed on the bottom surface of the outer shell 1. It further includes:

[0035] The bearing mechanism 2 includes a plurality of rotating columns 21 fixedly connected to the mounting seat 17. The circumference of the rotating column 21 is provided with a guide groove 22. A lower ring 24 and an upper ring 25 are rotatably mounted on the outer side of the rotating column 21. A guide column 26 is slidably connected to the upper ring 25. One end of the guide column 26 is slidably connected to the guide groove 22. Two symmetrical brackets 27 are rotatably mounted on the outer side of the upper ring 25. The top surface of the bracket 27 is provided with a penetrating transverse groove 28. A push rod 29 is hinged in the transverse groove 28 and passes through the through groove 14.

[0036] The pushing mechanism 3 includes a connecting frame 31 fixedly connected to the push rod 29. A rotating block 32 is rotatably mounted on the end of the connecting frame 31 away from the push rod 29. A round rod 33 is slidably sleeved in the rotating block 32. One end of the round rod 33 is fixedly connected to a slide frame 34. A push column 35 is slidably connected in the slide frame 34.

[0037] The opening and closing control mechanism 4 is responsible for pushing the push rod 29 to slide into the housing 1 .

[0038] In the present invention, by driving the provided supporting mechanism 2, pushing mechanism 3 and opening and closing control mechanism 4, when carrying a wafer, when the size of the wafer is smaller than the size of the supporting mechanism 2, by controlling the rotation of the threaded column 43 in the opening and closing control mechanism 4, the sliding frame 44 is driven to move toward the supporting mechanism 2, and then the two push rods 29 are driven to slide toward the open side of the outer shell 1, so that under the push of the push rod 29, the bracket 27 rotates around the axis of the rotating column 21, so that the two brackets 27 are close to the end adjacent to the open side of the outer shell 1, thereby supporting smaller wafers, and by adjusting the sliding distance of the push rod 29, the rotation angle of the two brackets 27 can be adjusted, so that the equipment can support wafers of different sizes.

[0039] The push rod 35 is pressed against the support frame 27 to release the push rod 36, and the push rod 36 is pressed against the support frame 27 to release the push rod 36.

[0040] Finally, through the multiple rotating columns 21 and guiding grooves 22 provided, when the robotic arm places the wafers on the bracket 27, by rotating the rotating columns 21, the guiding columns 26 slide within the guiding grooves 22, and then the guiding columns 26 move from the lowest point of the inclined section of the guiding grooves 22 to the highest point. At this time, the guiding columns 26 drive the lower ring 24 and the upper ring 25 to move upward, and then drive the two brackets 27 to move upward, thereby increasing the distance between the lowermost bracket 27 and the inner bottom surface of the housing 1, avoiding affecting the extension of the robotic arm due to too close a distance and affecting the loading quantity of the equipment. After the loading is completed, by rotating the rotating columns 21 in the reverse direction, the guiding columns 26 move from the highest point of the inclined section of the guiding grooves 22 to the lowest point, and then the bracket 27 moves downward. At this time, the overall center of gravity of the loading mechanism 2 moves downward, thereby preventing the wafers on the loading mechanism 2 from sliding when moving the equipment due to the relatively high center of gravity of the equipment. At the same time, by replacing the rotating columns 21 with different guiding grooves 22, the upward movement distance of the bracket 27 can be changed. In this way, when the thicknesses of the wafers are different, by replacing the rotating columns 21, it is possible to prevent the thick wafers from approaching the wafers above, avoiding collisions between the wafers and other objects when the robotic arm removes the wafers.

[0041] Wherein, a clamping block 23 is fixedly connected to the top surface of the rotating column 21, and a clamping groove 211 is formed in the bottom surface of the rotating column 21.

[0042] Through the cooperation of the clamping block 23 and the clamping groove 211, the multiple rotating columns 21 can rotate synchronously. At the same time, since the rotating columns 21 can be replaced individually, when simultaneously converting wafers of different thicknesses, by replacing some of the rotating columns 21, it is possible to prevent the distance between the thick wafers and the wafers above from being too small, avoiding friction between the thick wafers and the components above after the robotic arm lifts the thick wafers from the bottom, resulting in scratches on the wafer surface and scrapping of the wafers. At the same time, setting multiple sections of rotating columns 21 also facilitates the replacement of damaged rotating columns 21.

[0043] Wherein, a limiting column 210 is rotatably installed at one end of the bracket 27 away from the rotating column 21, and the limiting column 210 contacts the side edges of the wafers placed on the bracket 27 together with the pushing column 35.

[0044] Through the cooperation of the limiting column 210 and the pushing column 35, the wafers are positioned at three points, thereby ensuring that the centers of the wafers supported by the loading mechanism 2 are all on the same vertical line, avoiding the need for the robotic arm to determine the center of the wafer when removing the wafer and avoiding a reduction in work efficiency.

[0045] Wherein, symmetric first sliding rails 15 are fixedly connected to the inner bottom surface of the housing 1, a plurality of sliders 16 are slidably connected within the first sliding rails 15, and one end of the round bar 33 away from the sliding groove frame 34 is hinged to the slider 16.

[0046] One end of the round bar 33 is hinged to the slider 16. When the push rod 29 pushes the round bar 33 through the connecting frame 31, the end of the round bar 33 connected to the chute frame 34 moves a longer distance, so that the push post 35 moves a farther distance, enabling the push post 35 to contact a wafer with a smaller size. Then, the limit post 210 is used to position the wafer.

[0047] Among them, the opening and closing control mechanism 4 includes a side shell 41 fixedly connected to the back surface of the housing 1. A sliding frame 44 is slidably connected inside the side shell 41. The sliding frame 44 translates towards the housing 1. A threaded post 43 passing through the outer side surface of the side shell 41 is threadedly connected to the center of the sliding frame 44. When the threaded post 43 rotates forward, it drives the sliding frame 44 to approach the loading mechanism 2. Symmetrical second sliding rails 46 are fixedly connected to the side surface of the sliding frame 44 facing the housing 1. The second sliding rails 46 are in a vertical state. One end of the push rod 29 passing through the through slot 14 is slidably connected inside the second sliding rails 46.

[0048] Due to the arranged second sliding rails 46, even if the bracket 27 drives the push rod 29 to move up and down, the sliding of the sliding frame 44 can still drive the push rod 29 to slide. By using the threaded post 43 to drive the sliding frame 44 to move, not only can the sliding frame 44 stop at any time, but also the sliding of the sliding frame 44 is smoother.

[0049] Among them, a rotating column 11 is rotatably installed on the top surface of the housing 1. The rotating column 11 is fixedly engaged with the engaging block 23 at the top of the uppermost rotating column 21.

[0050] Among them, a first motor 12 is fixedly connected to the top surface of the housing 1. A first bevel gear 13 is fixedly sleeved on the output shaft of the first motor 12 and the outer side surface of the rotating column 11 respectively, and they are meshed with each other.

[0051] By driving the first motor 12 to rotate, the rotating column 21 is driven to rotate. When the rotating column 21 rotates and the guide post 26 moves from the lowest point of the inclined section of the guide groove 22 to the highest point, the bracket 27 moves upward. At this time, the distance between the lowermost bracket 27 and the inner bottom surface of the housing 1 increases, enabling the robotic arm to hold the wafer from the bottom and take it outwards, and also enabling the robotic arm to place the wafer on the bracket 27 when contacting the bottom surface of the wafer. When the first motor 12 moves in the reverse direction and the bracket 27 descends, the overall center of gravity of the device can be reduced, making the device more stable during the moving process.

[0052] Among them, a second motor 42 is fixedly connected to the outer side surface of the side shell 41. A second bevel gear 45 is fixedly sleeved on the output shaft of the second motor 42 and the outer side surface of the threaded post 43 respectively, and they are meshed with each other.

[0053] By rotating the second motor 42 forward and backward, the threaded column 43 rotates to drive the sliding frame 44 to move forward and backward, thereby driving the push rod 29 to slide. By controlling the number of rotation cycles of the second motor 42, the sliding distance of the push rod 29 is controlled, so that the push column 35 moves different distances, and thus the bracket 27 can carry wafers of different diameters.

[0054] Working principle:

[0055] When using this device to transfer wafers, first adjust the position of the sliding frame 44 according to the size of the wafer to be transferred. When the sliding frame 44 moves towards the housing 1, the push rod 29 is pushed, causing the two brackets 27 to rotate around the rotating column 21, thereby reducing the distance between the two brackets 27, increasing the contact area between the small-sized wafer and the brackets 27, and preventing the wafer from slipping between the two brackets 27 and hitting the wafer below when moving the transfer device.

[0056] As the push rod 29 is pushed towards the open side of the housing 1, the push rod 29 drives the connecting frame 31 to move simultaneously. At this time, the movement of the connecting frame 31 drives the round rod 33 to rotate, causing the chute frame 34 connected to one end of the round rod 33 to rotate towards the open side of the housing 1, and then the push column 35 moves. At this time, the push column 35 and the two limit columns 210 perform three-point positioning on the wafer, and at the same time, by contacting the wafer, it prevents the wafer from sliding during the movement of the device, resulting in wafer damage.

[0057] When the wafers to be transferred by the device have different thicknesses, by replacing the guide posts 26 with different highest points in the guide grooves 22, the rising height of the brackets 27 is different, increasing the distance between the thick wafer and the wafer above, and preventing the top surface of the thick wafer from rubbing against the components above when the robotic arm transfers the thick wafer, resulting in damage to the wafer.

[0058] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not limitations. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered within the scope of the claims of the present invention.

Claims

1. A wafer conversion device for semiconductor processing, comprising a housing (1), symmetric through grooves (14) are formed in the back surface of the housing (1), and a mounting seat (17) is rotatably mounted on the bottom surface of the housing (1), characterized in that, Further included are: A carrying mechanism (2), which includes a plurality of rotating columns (21) fixedly clamped on the mounting base (17). A guiding groove (22) is formed on the circumferential surface of the rotating column (21). A lower ring (24) and an upper ring (25) are rotatably installed outside the rotating column (21). A guiding column (26) is slidably connected inside the upper ring (25). One end of the guiding column (26) is slidably connected in the guiding groove (22). Two symmetrical brackets (27) are rotatably installed on the outer side surface of the upper ring (25). A through horizontal groove (28) is formed on the top surface of the bracket (27). A push rod (29) is hinged in the horizontal groove (28), and the push rod (29) passes through the through groove (14); A pushing mechanism (3), which includes a connecting frame (31) fixedly connected to the push rod (29). A rotating block (32) is rotatably installed at one end of the connecting frame (31) away from the push rod (29). A round rod (33) is slidably sleeved inside the rotating block (32). One end of the round rod (33) is fixedly connected to a chute frame (34). A push column (35) is slidably connected inside the chute frame (34); An opening and closing control mechanism (4), which is responsible for pushing the push rod (29) to slide into the housing (1).

2. A wafer conversion device for semiconductor processing according to claim 1, characterized in that, A clamping block (23) is fixedly connected to the top surface of the rotating column (21), and a clamping groove (211) is formed on the bottom surface of the rotating column (21).

3. A wafer conversion device for semiconductor processing according to claim 1, characterized in that, A limiting column (210) is rotatably installed at one end of the bracket (27) away from the rotating column (21). The limiting column (210), the push column (35) are in contact with the side edge of the wafer placed on the bracket (27).

4. A wafer conversion device for semiconductor processing according to claim 1, characterized in that, Symmetrical first sliding rails (15) are fixedly connected to the inner bottom surface of the housing (1). A plurality of sliders (16) are slidably connected inside the first sliding rails (15). One end of the round rod (33) away from the chute frame (34) is hinged to the slider (16).

5. A wafer conversion device for semiconductor processing according to claim 1, characterized in that, The opening and closing control mechanism (4) includes a side shell (41) fixedly connected to the back surface of the housing (1). A sliding frame (44) is slidably connected inside the side shell (41), and the sliding frame (44) translates towards the housing (1).

6. A wafer conversion device for semiconductor processing according to claim 5, characterized in that, A threaded column (43) passing through the outer side surface of the side shell (41) is threadedly connected to the center of the sliding frame (44). When the threaded column (43) rotates forward, it drives the sliding frame (44) to approach the carrying mechanism (2).

7. A wafer conversion device for semiconductor processing according to claim 6, characterized in that, Symmetrical second sliding rails (46) are fixedly connected to the side surface of the sliding frame (44) facing the housing (1). The second sliding rails (46) are in a vertical state. One end of the push rod (29) passing through the through groove (14) is slidably connected inside the second sliding rails (46).

8. A wafer conversion device for semiconductor processing according to claim 1, characterized in that, A rotating column (11) is rotatably installed on the top surface of the housing (1). The rotating column (11) is fixedly clamped on the clamping block (23) at the top of the uppermost rotating column (21).

9. A wafer conversion device for semiconductor processing according to claim 1, characterized in that, A first motor (12) is fixedly connected to the top surface of the housing (1). A first bevel gear (13) is fixedly sleeved on the output shaft of the first motor (12) and the outer side surface of the rotating column (11) respectively, and they are meshed with each other.

10. A wafer conversion device for semiconductor processing according to claim 5, characterized in that, A second motor (42) is fixedly connected to the outer side surface of the side shell (41), and second helical gears (45) which mesh with each other are fixedly sleeved on the output shaft of the second motor (42) and the outer side surface of a threaded column (43) respectively.

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