Power module and power conversion device

Abstract

The invention provides a power module and a power conversion device. The power module comprises a substrate and a power device, the substrate comprises an insulating layer, a first conductive layer and a first heat conduction layer, and the first conductive layer and the first heat conduction layer are arranged on the two opposite sides of the insulating layer in the thickness direction of the substrate. The power device is arranged on the side, back to the insulating layer, of the first conductive layer. Wherein in the thickness direction of the substrate, one side, opposite to the power device, of the first heat conduction layer is provided with a bulge. In the power module provided by the embodiment of the invention, the power device can realize rapid heat dissipation only through the substrate and the bulges arranged on the first heat conduction layer, so that the heat dissipation path of the power device is shortened, the heat dissipation thermal resistance of the power device is reduced, and the heat dissipation efficiency of the power device is greatly improved. Moreover, the design that the protrusions are arranged on the first heat conduction layer is beneficial to simplifying the structure of the substrate, reducing the processing cost of the substrate, and reducing the processing cost of the power module.

Description

Technical Field

[0001] This application relates to the field of electronic technologies, and particularly to a power module and a power conversion device. Background Art

[0002] In existing power modules, power devices are mounted on a substrate, and the substrate is then mounted on a heat sink through solder. A large amount of heat generated by the power devices mounted on the substrate is diffused to the heat sink through the substrate and the solder, and then diffused from the heat sink to the outside, realizing rapid heat dissipation of the power devices. However, this not only has the problem of a long heat dissipation path for the power devices; moreover, due to the large thermal resistance of the solder, there is a problem of a large heat dissipation thermal resistance for the power devices, and the heat dissipation efficiency of the power devices is low. Summary of the Invention

[0003] This application provides a power module and a power conversion device. The power module provided by this application shortens the heat dissipation path of the power devices, reduces the heat dissipation thermal resistance of the power devices, greatly improves the heat dissipation efficiency of the power devices, and is beneficial to improving the use safety of the power devices; moreover, it is beneficial to simplify the structure of the substrate, reduce the processing difficulty of the substrate, reduce the processing cost of the substrate, and reduce the processing cost of the power module.

[0004] In a first aspect, an embodiment of this application provides a power module. The power module includes a substrate and power devices. The substrate includes an insulating layer, a first conductive layer, and a first heat-conducting layer. In the thickness direction of the substrate, the first conductive layer and the first heat-conducting layer are disposed on opposite sides of the insulating layer. The power devices are disposed on a side of the first conductive layer facing away from the insulating layer. Among them, in the thickness direction of the substrate, a protrusion is provided on a side of the first heat-conducting layer facing away from the power devices.

[0005] In the power module provided by the embodiment of this application, a large amount of heat generated by the power devices during operation is diffused from the substrate through the first heat-conducting layer to the protrusion, and then dissipated from the protrusion to the outside of the substrate, realizing rapid heat dissipation of the power devices. Compared with the existing solution for heat dissipation of power devices through a substrate, solder, and a heat sink, the power devices in the embodiment of this application can achieve rapid heat dissipation only through the substrate and the protrusions provided on the first heat-conducting layer, shortening the heat dissipation path of the power devices, reducing the heat dissipation thermal resistance of the power devices, and greatly improving the heat dissipation efficiency of the power devices, which is beneficial to improving the use safety of the power devices. Moreover, the design of the protrusions is beneficial to increasing the heat dissipation area of the first heat-conducting layer, improving the efficiency of heat diffusion of the power devices from the first heat-conducting layer to the outside of the substrate, and improving the heat dissipation efficiency of the power devices. In addition, the design of the protrusions provided on the first heat-conducting layer is beneficial to simplifying the structure of the substrate, reducing the processing difficulty of the substrate, reducing the processing cost of the substrate, and reducing the processing cost of the power module.

[0006] In a possible implementation, the protrusion is integrally formed with the first heat-conducting layer.

[0007] The design of integrally forming the protrusion with the first heat-conducting layer is beneficial to improving the connection strength between the protrusion and the first heat-conducting layer, and is beneficial to improving the structural stability of the power module.

[0008] In a possible implementation, the projection of the protrusion along the thickness direction of the substrate overlaps with the projection of the power device along the thickness direction of the substrate.

[0009] The design that the projection of the protrusion along the thickness direction of the substrate overlaps with the projection of the power device along the thickness direction of the substrate is beneficial to shortening the heat dissipation path for the power device to dissipate heat from the protrusion through the substrate, and is beneficial to improving the heat dissipation efficiency of the power device.

[0010] In a possible implementation, the number of protrusions is multiple, and the multiple protrusions are arranged at intervals.

[0011] The design of multiple protrusions is beneficial to increasing the heat dissipation area for the power device to dissipate heat from the protrusion through the substrate, and is beneficial to improving the heat dissipation efficiency of the power device.

[0012] In a possible implementation, the power module includes a package body, the package body covers an insulating layer, a first conductive layer, a power device and a part of the first heat-conducting layer, the side of the first heat-conducting layer facing away from the insulating layer is exposed outside the package body, and the protrusion is exposed outside the package body.

[0013] The design of the package body realizes the protection of the power device, and is beneficial to improving the working life of the power device.

[0014] In a possible implementation, the power module includes a heat dissipation plate, the heat dissipation plate is arranged on the side of the first heat-conducting layer facing away from the insulating layer and encloses a receiving cavity with the first heat-conducting layer, the protrusion is received in the receiving cavity, the heat dissipation plate is provided with a fluid inlet and a fluid outlet, and both the fluid inlet and the fluid outlet are communicated with the receiving cavity.

[0015] The protrusion is received in the receiving cavity, and the design that both the fluid inlet and the fluid outlet are communicated with the receiving cavity ensures that the fluid (gas or liquid) can flow into the receiving cavity from the fluid inlet, and then after passing through the protrusion and absorbing the heat diffused from the power device through the substrate from the protrusion, it flows out of the receiving cavity from the fluid outlet, ensuring that the fluid can take out the heat diffused from the power device through the substrate from the protrusion from the receiving cavity, thereby realizing liquid cooling (or air cooling) of the power device, and greatly improving the heat dissipation efficiency of the power device.

[0016] In a possible implementation, a fixing part is provided on the side of the first heat-conducting layer facing away from the insulating layer, the fixing part surrounds the protrusion, and the fixing part, the first heat-conducting layer and the heat dissipation plate enclose a receiving cavity.

[0017] The design that the fixing part, the first heat-conducting layer and the heat dissipation plate enclose to form a receiving cavity not only ensures the sealing at the connection position between the heat dissipation plate and the fixing part, ensures that a sealed receiving cavity can be formed, and ensures that the fluid can stably take out the heat diffused from the power device through the substrate from the protruding part out of the receiving cavity, greatly improving the heat dissipation stability and efficiency of the power device; moreover, the processing difficulty is low, which is beneficial to reducing the processing cost.

[0018] In a possible implementation manner, the size of the fixing part in the thickness direction of the substrate is smaller than the size of the protruding part in the thickness direction of the substrate.

[0019] The design that the size of the fixing part in the thickness direction of the substrate is smaller than the size of the protruding part in the thickness direction of the substrate is beneficial to increasing the heat dissipation area of the protruding part, beneficial to improving the heat dissipation efficiency of the power device from the protruding part, and beneficial to improving the heat dissipation efficiency of the power device.

[0020] In a possible implementation manner, the surface of the heat dissipation plate facing the first heat-conducting layer is provided with a groove, the fluid inlet and the fluid outlet are located on opposite sides of the groove and are both communicated with the groove, and the protruding part is partially received in the groove.

[0021] The design of the groove not only is beneficial to reducing the length of the fixing part on the basis of ensuring the volume of the receiving cavity, beneficial to improving the strength of the fixing part, beneficial to improving the connection strength between the fixing part and the heat dissipation plate, and beneficial to improving the structural stability of the power module; moreover, it is convenient for the fluid flowing in from the fluid inlet to flow through the protruding part and then flow out from the fluid outlet, which is beneficial to improving the efficiency of the fluid taking out the heat diffused from the power device through the substrate from the protruding part out of the receiving cavity, and thus beneficial to improving the heat dissipation efficiency of the power device.

[0022] In a possible implementation manner, a sealing ring is provided on the side of the heat dissipation plate facing the first heat-conducting layer, the sealing ring is sleeved outside the first heat-conducting layer, and the first heat-conducting layer, the sealing ring and the heat dissipation plate enclose to form a receiving cavity.

[0023] The design of the sealing ring also ensures that a sealed receiving cavity can be formed, ensures that the fluid can stably take out the heat diffused from the power device through the substrate from the protruding part out of the receiving cavity, and greatly improves the heat dissipation stability and efficiency of the power device.

[0024] In a possible implementation manner, the power module includes a second substrate, the second substrate includes a second insulating layer, a second conductive layer and a second heat-conducting layer, the second conductive layer is disposed on the side of the power device facing away from the substrate, the second insulating layer is disposed on the side of the second conductive layer facing away from the power device, the second heat-conducting layer is disposed on the side of the second insulating layer facing away from the second conductive layer, and a second protruding part is provided on the side of the second heat-conducting layer facing away from the second insulating layer.

[0025] Since the second conductive layer is disposed on the side of the power device facing away from the substrate, the second insulating layer is disposed on the side of the second conductive layer facing away from the power device, the second heat conductive layer is disposed on the side of the second insulating layer facing away from the second conductive layer, and a second protrusion is provided on the side of the second heat conductive layer facing away from the second insulating layer; when the power device operates, the heat dissipated can not only be diffused from the substrate to the protrusion and then from the protrusion to the outside of the substrate, but also be diffused from the second substrate to the second protrusion and then from the second protrusion to the outside of the second substrate, realizing two-way heat dissipation of the power device, which is beneficial to improving the heat dissipation efficiency of the power device. Moreover, the design of the second protrusion is beneficial to increasing the heat dissipation area of the second heat conductive layer, beneficial to improving the efficiency of the heat of the power device diffusing from the second heat conductive layer to the outside of the second substrate, and beneficial to improving the heat dissipation efficiency of the power device. In addition, the design of providing the second protrusion on the side of the second heat conductive layer facing away from the second insulating layer is not only beneficial to shortening the heat dissipation path of the power device through the second substrate, beneficial to reducing the heat dissipation path of the power device through the second substrate, and further improving the heat dissipation efficiency of the power device; moreover, it is beneficial to simplifying the structure of the second substrate, beneficial to reducing the processing difficulty of the second substrate, beneficial to reducing the processing cost of the second substrate, and beneficial to reducing the processing cost of the power module.

[0026] In a possible implementation manner, the second protrusion and the second heat conductive layer are integrally formed.

[0027] The design that the second protrusion and the second heat conductive layer are integrally formed is beneficial to improving the connection strength between the second protrusion and the second heat conductive layer and beneficial to improving the structural stability of the power module.

[0028] In a possible implementation manner, the projection of the second protrusion along the thickness direction of the substrate overlaps with the projection of the power device along the thickness direction of the substrate.

[0029] The design that the projection of the second protrusion along the thickness direction of the substrate overlaps with the projection of the power device along the thickness direction of the substrate is beneficial to shortening the heat dissipation path of the power device dissipating heat from the second protrusion through the second substrate and beneficial to improving the heat dissipation efficiency of the power device.

[0030] In a possible implementation manner, the power module includes a gasket, and the gasket is disposed between the power device and the second conductive layer; or the gasket is disposed between the first conductive layer and the power device.

[0031] The design that the gasket is disposed between the power device and the second conductive layer can prevent the power device disposed on the substrate from contacting the second substrate, avoid damage to the power device caused by collision with the second substrate, and is beneficial to improving the working life of the power device.

[0032] The design of setting the gasket between the first conductive layer and the power device can prevent the power device disposed on the second substrate from contacting the substrate, avoid damage to the power device caused by collision with the substrate, and is beneficial to improving the working life of the power device.

[0033] In a possible implementation, the number of the second protrusions is multiple, and the multiple second protrusions are arranged at intervals.

[0034] The design of the multiple second protrusions is beneficial to increasing the heat dissipation area of the power device dissipating heat from the second protrusion through the second substrate, and is beneficial to improving the heat dissipation efficiency of the power device.

[0035] In a possible implementation, the power module includes a second heat sink. The second heat sink is disposed on the side of the second heat conductive layer facing away from the second insulating layer and forms a second receiving cavity with the second heat conductive layer. The second protrusion is received in the second receiving cavity. The second heat sink is provided with a second fluid inlet and a second fluid outlet, and both the second fluid inlet and the second fluid outlet are communicated with the second receiving cavity.

[0036] The design that the second protrusion is received in the second receiving cavity and both the second fluid inlet and the second fluid outlet are communicated with the second receiving cavity ensures that the fluid (gas or liquid) can flow into the second receiving cavity from the second fluid inlet, then pass through the second protrusion and absorb the heat diffused from the second protrusion of the power device through the second substrate, and then flow out of the second receiving cavity from the second fluid outlet, ensuring that the fluid can take out the heat diffused from the second protrusion of the power device through the second substrate from the second receiving cavity, thereby realizing liquid cooling (or air cooling) of the power device and greatly improving the heat dissipation efficiency of the power device.

[0037] In a possible implementation, a second fixing portion is provided on the side of the second heat conductive layer facing away from the second insulating layer. The second fixing portion surrounds the second protrusion, and the second fixing portion, the second heat conductive layer and the second heat sink form the second receiving cavity.

[0038] The design that the second fixing portion, the second heat conductive layer and the second heat sink form the second receiving cavity not only ensures the sealing at the connection position between the second heat sink and the second heat conductive layer, ensures that the fluid can stably take out the heat diffused from the second protrusion of the power device through the second substrate from the second receiving cavity, and greatly improves the heat dissipation stability and heat dissipation efficiency of the power device; moreover, the processing difficulty is low, which is beneficial to reducing the processing cost.

[0039] In a possible implementation, a second groove is provided on the surface of the second heat sink facing the second heat conductive layer. The second fluid inlet and the second fluid outlet are located on opposite sides of the second groove and are both communicated with the second groove. The second protrusion is partially received in the second groove.

[0040] The design of the second groove not only helps to reduce the length of the second fixing part, improve the strength of the second fixing part, enhance the connection strength between the second fixing part and the second heat dissipation plate, and improve the structural stability of the power module while ensuring the volume of the second accommodation cavity; moreover, it facilitates the fluid flowing in from the second fluid inlet to flow out from the second fluid outlet after passing through the second protrusion, which is conducive to improving the efficiency of the fluid to carry out the heat diffused from the power device through the second substrate from the second protrusion out of the second accommodation cavity, and further conducive to improving the heat dissipation efficiency of the power device.

[0041] In a second aspect, an embodiment of the present application further provides a power conversion device. The power conversion device includes a circuit board and the power module according to any one of the first aspect, and the power module is mounted on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the following will describe the drawings required to be used in the embodiments of the present application or the background art.

[0043] Figure 1 It is a structural block diagram of the power conversion device provided by the embodiment of the present application in cooperation with a photovoltaic module and a power grid;

[0044] Figure 2 is Figure 1 a three-dimensional structural schematic diagram of the power conversion device shown;

[0045] Figure 3 is Figure 2 a three-dimensional structural schematic diagram of the power module of the power conversion device shown;

[0046] Figure 4 is Figure 3 a three-dimensional structural exploded schematic diagram of the power module shown;

[0047] Figure 5 is Figure 3 a structural schematic diagram of the power module shown cut along line A-A;

[0048] Figure 6 is Figure 3 a structural schematic diagram of the heating element of the power module shown at another angle;

[0049] Figure 7 is Figure 3 a structural schematic diagram of the power module shown cut along line A-A in another embodiment;

[0050] Figure 8 is Figure 3 a three-dimensional structural schematic diagram of the power module shown in another embodiment;

[0051] Figure 9 Yes Figure 8 is a schematic cross-sectional view of the power module shown along line B-B;

[0052] Figure 10 Yes Figure 9 is a schematic structural diagram of the power module shown in another embodiment. Specific implementation manner

[0053] The embodiments of the present application provide a power module and a power conversion device. The power module is applied to the power conversion device. The power module provided by the present application shortens the heat dissipation path of the power device, reduces the heat dissipation thermal resistance of the power device, greatly improves the heat dissipation efficiency of the power device, and is beneficial to improving the use safety of the power device. Moreover, it is beneficial to simplify the structure of the substrate, reduce the processing difficulty of the substrate, reduce the processing cost of the substrate, and reduce the processing cost of the power module.

[0054] The embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

[0055] Please refer to Figure 1 and Figure 2 , Figure 1 is a structural block diagram of the power conversion device 1000 provided by the embodiments of the present application in cooperation with the photovoltaic module 2000 and the power grid 3000. Figure 2 Yes Figure 1 is a three-dimensional structural schematic diagram of the power conversion device 1000 shown.

[0056] Exemplarily, the power conversion device 1000 is a photovoltaic inverter. In some other embodiments, the power conversion device 1000 may also be a rectifier, a transformer, or other inverters and other electronic devices for power conversion. The power conversion device 1000 is used to convert the direct current output by the photovoltaic module 2000 into alternating current and supply it to the power grid 3000. In some other embodiments, the power conversion device 1000 may also be used to convert the direct current output by the photovoltaic module 2000 into alternating current and supply it to a load device. The load device may be an electronic device using alternating current including but not limited to a motor, a fan, or an air conditioner. In some other embodiments, the power conversion device 1000 may also be applied to an electric drive controller. For example, the power conversion device 1000 may convert the direct current output by the battery into alternating current to supply the motor.

[0057] In some embodiments, the power conversion device 1000 includes a circuit board 100, an input terminal 200, a power module 300, and an output terminal 400. The input terminal 200, the power module 300, and the output terminal 400 are all mounted on the circuit board 100. Specifically, the input terminal 200, the power module 300, and the output terminal 400 are all mounted on one side of the circuit board 100. In some other embodiments, the input terminal 200, the power module 300, and the output terminal 400 may also be respectively mounted on opposite sides of the circuit board 100.

[0058] The input terminal 200 is used to receive the direct current output by the photovoltaic module 2000. The power module 300 is used to receive the direct current delivered from the input terminal 200 and convert the direct current into alternating current. The output terminal 400 is used to receive the alternating current output by the power module 300 and deliver the alternating current to the power grid 3000. The power conversion device 1000 converts the direct current output by the photovoltaic module 2000 into alternating current through the power module 300.

[0059] Please refer to Figure 3 , Figure 4 , Figure 5 and Figure 6 , and in combination with Figure 2 , Figure 3 is Figure 2 the perspective structural schematic diagram of the power module 300 of the power conversion device 1000 shown in Figure 4 is Figure 3 the exploded perspective structural schematic diagram of the power module 300 shown in Figure 5 is Figure 3 the structural schematic diagram of the power module 300 cut along the line A-A shown in Figure 6 is Figure 3 the structural schematic diagram of the heating element 10 of the power module 300 at another angle shown in

[0060] As Figure 2 , Figure 3 and Figure 4 shown, in some embodiments, the power module 300 includes a heating element 10 and a heat sink 20. The heat sink 20 is mounted on one side of the heating element 10. Among them, the heating element 10 is mounted on the circuit board 100, and the heat sink 20 is located on the side of the heating element 10 facing away from the circuit board 100. The heating element 10 is used to convert the direct current delivered from the input terminal 200 into alternating current. The output terminal 400 receives the alternating current output by the heating element 10 and delivers the alternating current to the power grid 3000 (as Figure 1 shown) to supply the power grid 3000. The heat sink 20 is used to dissipate heat from the heating element 10 to ensure that the heating element 10 can operate normally.

[0061] As Figure 2 , Figure 3 andFigure 5 As shown, the heating element 10 includes a substrate 11, a fixing layer 12, a power device 13, a package 14, and leads 15. In other words, the power module 300 includes the substrate 11, the fixing layer 12, the power device 13, the package 14, and the leads 15. The fixing layer 12 is disposed on one side of the substrate 11. The power device 13 is disposed on the side of the fixing layer 12 facing away from the substrate 11. Through the fixing layer 12, the power device 13 is mounted on the substrate 11. The package 14 covers a part of the substrate 11, the fixing layer 12, and the power device 13. The side of the substrate 11 facing away from the power device 13 is exposed outside the package 14. The leads 15 are embedded in the package 14 and extend out of the package 14. The leads 15 are electrically connected to the power device 13. Among them, the leads 15 are mounted on the circuit board 100. The direct current delivered from the input terminal 200 is delivered to the power device 13 through the leads 15. The power device 13 is used to convert the direct current into alternating current. The alternating current output by the power device 13 is delivered to the output terminal 400 through the leads 15.

[0062] As Figure 4 , Figure 5 and Figure 6 shown, exemplarily, the substrate 11 is a DBC (Direct Bond Copper) substrate. In some other embodiments, the substrate 11 may also be an AMB (Active Metal Brazing) substrate or other ceramic substrates or aluminum substrates. The substrate 11 is a rectangular substrate. In some other embodiments, the substrate 11 may also be a circular substrate, a triangular substrate, or other irregularly shaped substrates. In this embodiment, the thickness direction of the substrate 11 is defined as the first direction (i.e., the Z-axis direction shown in the figure), the length direction of the substrate 11 is defined as the second direction (i.e., the X-axis direction shown in the figure), and the width direction of the substrate 11 is defined as the third direction (i.e., the Y-axis direction shown in the figure). In some other embodiments, the length direction of the substrate 11 may also be the Y-axis direction shown in the figure, and the width direction of the substrate 11 may also be the X-axis direction shown in the figure.

[0063] The substrate 11 includes an insulating layer 111, a first conductive layer 112, and a first heat-conducting layer 113. Exemplarily, the insulating layer 111 is made of insulating materials including but not limited to ceramics or epoxy resins. The first conductive layer 112 and the first heat-conducting layer 113 are made of conductive materials including but not limited to copper or aluminum. In the Z-axis direction (i.e., the thickness direction of the substrate 11), the first conductive layer 112 and the first heat-conducting layer 113 are disposed on opposite sides of the insulating layer 111. Specifically, in the Z-axis direction, the first conductive layer 112 and the first heat-conducting layer 113 are fixedly laminated on opposite sides of the insulating layer 111 by means including but not limited to welding or gluing. Exemplarily, the number of the first conductive layers 112 is multiple. Specifically, the number of the first conductive layers 112 is 2. In some other embodiments, the number of the first conductive layers 112 may also be 1, 3, or more. The multiple first conductive layers 112 are spaced along the X-axis direction. Wherein, the first heat-conducting layer 113 includes a mating surface 1131, and the mating surface 1131 faces away from the insulating layer 111.

[0064] In some embodiments, the first heat-conducting layer 113 is provided with a protrusion 114. Specifically, the mating surface 1131 of the first heat-conducting layer 113 is provided with the protrusion 114. That is to say, the protrusion 114 is disposed on the side of the first heat-conducting layer 113 facing away from the insulating layer 111. The protrusion 114 extends along the Z-axis direction. Exemplarily, the number of the protrusions 114 is multiple. Specifically, the number of the protrusions 114 is 9. In some other embodiments, the number of the protrusions 114 may also be 1, 2, 3, or more. Along the X-axis direction, the multiple protrusions 114 are spaced. The design of disposing the protrusion 114 on the first heat-conducting layer 113 is beneficial to simplifying the structure of the substrate 11, reducing the processing difficulty of the substrate 11, reducing the processing cost of the substrate 11, and reducing the processing cost of the power module 300.

[0065] Wherein, the protrusion 114 and the first heat-conducting layer 113 are integrally formed. In this way, it is beneficial to improve the connection strength between the protrusion 114 and the first heat-conducting layer 113, improve the structural stability of the substrate 11, and improve the structural stability of the power module 300. In some other embodiments, the protrusion 114 can also be disposed on the side of the first heat-conducting layer 113 facing away from the insulating layer 111 by means including but not limited to welding or gluing.

[0066] In some embodiments, the first heat-conducting layer 113 is provided with a fixing portion 115. Specifically, the mating surface 1131 of the first heat-conducting layer 113 is provided with the fixing portion 115. That is to say, the fixing portion 115 is provided on the side of the first heat-conducting layer 113 facing away from the insulating layer 111. The fixing portion 115 surrounds the plurality of protrusions 114 and is spaced apart from the plurality of protrusions 114. That is, the fixing portion 115 surrounds the protrusions 114 and is spaced apart from the protrusions 114. The fixing portion 115 extends in the Z-axis direction. Exemplarily, the fixing portion 115 is a rectangular ring. In some other embodiments, the fixing portion 115 may also be a circular ring, a triangular ring or other special-shaped rings. The fixing portion 115 and the first heat-conducting layer 113 enclose a receiving space 116. The protrusions 114 are located in the receiving space 116.

[0067] Wherein, the fixing portion 115 includes a first wall surface 1151 and a second wall surface 1152. The first wall surface 1151 faces away from the mating surface 1131. The first wall surface 1151 faces away from the insulating layer 111. The second wall surface 1152 faces the plurality of protrusions 114 and is spaced apart from the plurality of protrusions 114. That is, the second wall surface 1152 faces the protrusions 114 and is spaced apart from the protrusions 114. Specifically, the second wall surface 1152 includes two first planes and two second planes. In the X-axis direction, the two first planes are opposite and spaced apart. In the Y-axis direction, the two second planes are opposite and spaced apart. Both of the two second planes are connected between the two first planes. Both the two first planes and the two second planes are spaced apart from the protrusions 114. The second wall surface 1152 and the mating surface 1131 enclose the receiving space 116. The distance between the first wall surface 1151 and the mating surface 1131 is smaller than the distance between the protrusions 114 facing away from the mating surface 1131 and the mating surface 1131. That is, the dimension of the fixing portion 115 in the Z-axis direction (i.e., the thickness direction of the substrate 11) is smaller than the dimension of the protrusions 114 in the Z-axis direction (i.e., the thickness direction of the substrate 11).

[0068] As Figure 3 、 Figure 4 And Figure 5 shown, exemplarily, the fixing layer 12 is made of solder including but not limited to aluminum or lead. In some other embodiments, the fixing layer 12 may also be made of other sintered materials such as sintered silver or sintered copper. The fixing layer 12 is disposed on the side of the first conductive layer 112 facing away from the insulating layer 111. Specifically, the fixing layer 12 is fixedly laminated on the side of the first conductive layer 112 facing away from the insulating layer 111. Exemplarily, the number of the fixing layers 12 is plural. Specifically, the number of the fixing layers 12 is 2. In some other embodiments, the number of the fixing layers 12 may also be 1, 3 or more. The plurality of fixing layers 12 are correspondingly disposed on the sides of the plurality of first conductive layers 112 facing away from the insulating layer 111.

[0069] Exemplarily, the power device 13 is an IGBT (Insulated Gate Bipolar Transistor) chip. In some other embodiments, the power device 13 may also be an FRD (Fast Recovery Diode) chip, a Mosfet (Metal oxide semiconductor field-effect transistor) chip, or other electronic devices such as a triode. The power device 13 is disposed on a side of the fixing layer 12 facing away from the first conductive layer 112. Through the fixing layer 12, the power device 13 is disposed on a side of the first conductive layer 112 facing away from the insulating layer 111. It can be understood that both the protrusion 114 and the fixing portion 115 are disposed on a side of the first heat-conducting layer 113 facing away from the power device 13. That is to say, in the Z-axis direction (i.e., the thickness direction of the substrate 11), the protrusion 114 and the fixing portion 115 are provided on a side of the first heat-conducting layer 113 facing away from the power device 13.

[0070] Exemplarily, the number of the power devices 13 is multiple. Specifically, the number of the power devices 13 is two. In some other embodiments, the number of the power devices 13 may also be one, three, or more. The multiple power devices 13 are respectively disposed on sides of the multiple fixing layers 12 facing away from the first conductive layer 112, and the multiple power devices 13 are spaced apart along the X-axis direction. Bonding wires 16 are provided between the multiple power devices 13. The multiple power devices 13 are electrically connected through the bonding wires 16, so that the multiple power devices 13 can cooperate to convert direct current into alternating current. In some other embodiments, the multiple power devices 13 may also be electrically connected through copper clips or other means. Among them, the projection of each power device 13 along the Z-axis direction overlaps with the projection of the multiple protrusions 114 along the Z-axis direction. That is to say, the projection of the protrusion 114 along the Z-axis direction (i.e., the thickness direction of the substrate 11) overlaps with the projection of the power device 13 along the Z-axis direction (i.e., the thickness direction of the substrate 11).

[0071] In the power module 300 provided by the embodiment of the present application, a large amount of heat dissipated by the power device 13 during operation is diffused to the protrusion 114 through the fixing layer 12, the first conductive layer 112, the insulating layer 111, and the first heat-conducting layer 113, and then dissipated from the protrusion 114 to the outside of the substrate 11, realizing rapid heat dissipation of the power device 13. That is to say, in the power module 300 provided by the embodiment of the present application, a large amount of heat dissipated by the power device 13 during operation is diffused from the first heat-conducting layer 113 to the protrusion 114 through the substrate 11, and then dissipated from the protrusion 114 to the outside of the substrate 11, realizing rapid heat dissipation of the power device 13. Compared with the existing solution for dissipating heat from the power device 13 through the substrate 11, solder, and heat sink, the power device 13 in the embodiment of the present application can achieve rapid heat dissipation only through the substrate 11 and the protrusion 114 provided on the first heat-conducting layer 113, shortening the heat dissipation path of the power device 13, reducing the heat dissipation thermal resistance of the power device 13, greatly improving the heat dissipation efficiency of the power device 13, and being beneficial to improving the use safety of the power device 13. Moreover, the design of the protrusion 114 is beneficial to increasing the heat dissipation area of the first heat-conducting layer 113, beneficial to improving the efficiency of the heat of the power device 13 diffusing from the first heat-conducting layer 113 to the outside of the substrate 11, and beneficial to improving the heat dissipation efficiency of the power device 13. In addition, the design of the protrusion 114 provided on the first heat-conducting layer 113 is beneficial to simplifying the structure of the substrate 11, beneficial to reducing the processing difficulty of the substrate 11, beneficial to reducing the processing cost of the substrate 11, and beneficial to reducing the processing cost of the power module 300.

[0072] The design that the projection of the protrusion 114 in the Z-axis direction (i.e., the thickness direction of the substrate 11) overlaps with the projection of the power device 13 in the Z-axis direction (i.e., the thickness direction of the substrate 11) is beneficial to shortening the heat dissipation path of the power device 13 dissipating heat from the protrusion 114 through the substrate 11, and beneficial to improving the heat dissipation efficiency of the power device 13. The design of multiple protrusions 114 is beneficial to increasing the heat dissipation area of the power device 13 dissipating heat from the protrusion 114 through the substrate 11, and beneficial to improving the heat dissipation efficiency of the power device 13.

[0073] Exemplarily, the encapsulation body 14 is made of a plastic encapsulation material including but not limited to epoxy resin or polyimide. In some other embodiments, the encapsulation body 14 may also be made of other insulating materials such as potting glue. The encapsulation body 14 covers a part of the substrate 11, the fixing layer 12, the power device 13 and the bonding wire 16. Among them, the mating surface 1131 of the first heat-conducting layer 113 of the substrate 11 is exposed outside the encapsulation body 14, and the protrusion 114 and the fixing portion 115 of the substrate 11 are exposed outside the encapsulation body 14. That is to say, the encapsulation body 14 covers the insulating layer 111, the first conductive layer 112, the power device 13 and a part of the first heat-conducting layer 113, the side of the first heat-conducting layer 113 facing away from the insulating layer 111 is exposed outside the encapsulation body 14, and the protrusion 114 is exposed outside the encapsulation body 14. Among them, the encapsulation body 14 includes a first encapsulation surface 141 and a second encapsulation surface 142. In the X-axis direction, the first encapsulation surface 141 and the second encapsulation surface 142 are arranged opposite to each other.

[0074] As Figure 2 , Figure 3 and Figure 5 shown, exemplarily, the number of the leads 15 is multiple. Specifically, the number of the leads 15 is 6. In some other embodiments, the number of the leads 15 may also be 2, 3 or more. The lead 15 includes a first lead 15a and a second lead 15b, and the number of the first leads 15a and the number of the second leads 15b are both 3. The 3 first leads 15a are embedded in the encapsulation body 14, extend out from the first encapsulation surface 141 of the encapsulation body 14, and are bent in a direction away from the protrusion 114 and then extend along the Z-axis direction. The 3 second leads 15b are embedded in the encapsulation body 14, extend out from the second encapsulation surface 142 of the encapsulation body 14, and are bent in a direction away from the protrusion 114 and then extend along the Z-axis direction. In some other embodiments, the number of the first leads 15a may also be 1, 2 or more, and the number of the second leads 15b may also be 1, 2 or more.

[0075] Among them, both the first lead 15a and the second lead 15b are electrically connected to multiple power devices 13. By means including but not limited to plugging or soldering, both the first lead 15a and the second lead 15b are mounted on the circuit board 100. The direct current transmitted from the input terminal 200 is transmitted to the multiple power devices 13 through the first lead 15a. The multiple power devices 13 convert the direct current into alternating current. The alternating current output from the multiple power devices 13 is transmitted to the output terminal 400 through the second lead 15b.

[0076] It can be understood that the encapsulation of the substrate 11, the fixing layer 12, the power device 13, the lead 15 and the bonding wire 16 is realized through the encapsulation body 14. The design of the encapsulation body 14 realizes the protection of the power device 13, which is beneficial to improving the working life of the power device 13, and further beneficial to improving the working life of the power module 300.

[0077] As Figure 3 , Figure 4 and Figure 5 shown, in some embodiments, the heat dissipation plate 20 is disposed on the side of the first heat conduction layer 113 facing away from the insulating layer 111 and encloses a receiving cavity 30 with the first heat conduction layer 113. Specifically, by means of welding including but not limited to reflow soldering, etc., the heat dissipation plate 20 is located on the side of the fixing portion 115 facing away from the insulating layer 111 and is fixedly connected to the fixing portion 115. The heat dissipation plate 20, the first heat conduction layer 113 and the fixing portion 115 enclose a receiving cavity 30. In other words, the fixing portion 115 is installed in the heat dissipation plate 20, and the fixing portion 115, the first heat conduction layer 113 and the heat dissipation plate 20 enclose a receiving cavity 30. The plurality of protrusions 114 are received in the receiving cavity 30. That is, the protrusions 114 are received in the receiving cavity 30. The heat dissipation plate 20 is used to dissipate heat from the protrusions 114, and thus dissipate heat from the power device 13.

[0078] Exemplarily, the heat dissipation plate 20 is a rectangular plate. In some other embodiments, the heat dissipation plate 20 may also be a circular plate, a triangular plate or other shaped plates. The heat dissipation plate 20 includes a first plate surface 21, a second plate surface 22 and a third plate surface 23. In the X-axis direction, the second plate surface 22 and the third plate surface 23 are connected to opposite sides of the first plate surface 21. In the X-axis direction, the second plate surface 22 and the third plate surface 23 are opposite and spaced apart. Among them, the first plate surface 21 faces the fixing portion 115 and is fixedly connected to the fixing portion 115.

[0079] The heat dissipation plate 20 is provided with a groove 24. Specifically, the first plate surface 21 of the heat dissipation plate 20 (i.e., the surface of the heat dissipation plate 20 facing the first heat conduction layer 113) is provided with the groove 24. The groove 24 extends in the Z-axis direction. Exemplarily, the groove 24 is a rectangular groove. In some other embodiments, the groove 24 may also be a circular groove, a triangular groove or other shaped grooves. Among them, the groove 24 communicates with the receiving space 116. The groove 24 and the receiving space 116 constitute the receiving cavity 30. In other words, the receiving cavity 30 includes the receiving space 116 and the groove 24. A part of each protrusion 114 is received in the receiving space 116, and the other part is received in the groove 24.

[0080] The heat dissipation plate 20 is provided with a fluid inlet 25. Specifically, the second plate surface 22 of the heat dissipation plate 20 is provided with the fluid inlet 25. The fluid inlet 25 extends along the X-axis direction and communicates with the groove 24. That is to say, in the X-axis direction, the fluid inlet 25 is located on one side of the groove 24 and communicates with the groove 24. The fluid inlet 25 communicates with the receiving cavity 30.

[0081] The heat dissipation plate 20 is provided with a fluid outlet 26. Specifically, the third plate surface 23 of the heat dissipation plate 20 is provided with the fluid outlet 26. The fluid outlet 26 extends along the X-axis direction and communicates with the groove 24. That is to say, in the X-axis direction, the fluid outlet 26 is located on the side of the groove 24 opposite to the fluid inlet 25 and communicates with the groove 24. In the X-axis direction, the fluid inlet 25 and the fluid outlet 26 are located on opposite sides of the groove 24 and both communicate with the groove 24. In some other embodiments, the fluid inlet 25 and the fluid outlet 26 may also be located on opposite sides of the groove 24 in the Y-axis direction and both communicate with the groove 24. That is, the fluid inlet 25 and the fluid outlet 26 are located on opposite sides of the groove 24 and both communicate with the groove 24.

[0082] The fluid inlet 25 is used for allowing the fluid to flow into the receiving cavity 30. The fluid outlet 26 is used for allowing the fluid flowing into the receiving cavity 30 to flow out of the receiving cavity 30. Exemplarily, the fluid is a cooling liquid including but not limited to water, alcohol-based coolant or glycerol-based coolant, etc. That is, the heat dissipation plate 20 is a liquid cooling plate. In some other embodiments, the fluid may also be a low-temperature gas such as low-temperature wind. That is, the heat dissipation plate 20 is an air cooling plate. The fluid (gas or liquid) flows into the receiving cavity 30 from the fluid inlet 25, then passes through the protrusion 114 and absorbs the heat diffused from the power device 13 through the substrate 11 from the protrusion 114, and then flows out of the receiving cavity 30 from the fluid outlet 26, realizing liquid cooling (or air cooling) of the protrusion 114 and realizing liquid cooling (or air cooling) of the power device 13. Among them, the fluid flowing into the receiving cavity 30 fills the receiving cavity 30. In this way, it is beneficial to improve the efficiency of the fluid absorbing the heat diffused from the power device 13 through the substrate 11 from the protrusion 114, and is beneficial to improve the heat dissipation efficiency of the power device 13.

[0083] It can be understood that the protrusion 114 is received in the receiving cavity 30, and the design that the fluid inlet 25 and the fluid outlet 26 both communicate with the receiving cavity 30 ensures that the fluid (gas or liquid) can flow into the receiving cavity 30 from the fluid inlet 25, then passes through the protrusion 114 and absorbs the heat diffused from the power device 13 through the substrate 11 from the protrusion 114, and then flows out of the receiving cavity 30 from the fluid outlet 26, ensuring that the fluid can take out the heat diffused from the power device 13 through the substrate 11 from the protrusion 114 out of the receiving cavity 30, thereby realizing liquid cooling (or air cooling) of the power device 13 and greatly improving the heat dissipation efficiency of the power device 13.

[0084] The fixing part 115 is installed on the heat dissipation plate 20. The design that the fixing part 115, the first heat conduction layer 113 and the heat dissipation plate 20 enclose to form the accommodation cavity 30 not only ensures the sealing at the connection position between the heat dissipation plate 20 and the fixing part 115, ensures that the sealed accommodation cavity 30 can be formed, and ensures that the fluid can stably take out the heat diffused from the power device 13 through the substrate 11 from the protrusion 114 out of the accommodation cavity 30, greatly improving the heat dissipation stability and heat dissipation efficiency of the power device 13; moreover, the processing difficulty is low, which is beneficial to reducing the processing cost.

[0085] It can be understood that the design that the size of the fixing part 115 in the Z-axis direction (i.e., the thickness direction of the substrate 11) is smaller than the size of the protrusion 114 in the Z-axis direction (i.e., the thickness direction of the substrate 11) is beneficial to increasing the heat dissipation area of the protrusion 114, beneficial to improving the heat dissipation efficiency of the power device 13 from the protrusion 114, and beneficial to improving the heat dissipation efficiency of the power device 13.

[0086] The design of the groove 24 not only is beneficial to reducing the length of the fixing part 115 (i.e., the size of the fixing part 115 in the Z-axis direction) on the basis of ensuring the volume of the accommodation cavity 30, beneficial to improving the strength of the fixing part 115, beneficial to improving the connection strength between the fixing part 115 and the heat dissipation plate 20, and beneficial to improving the structural stability of the power module 300; moreover, it is convenient for the fluid flowing in from the fluid inlet 25 to flow through the protrusion 114 and then flow out from the fluid outlet 26, which is beneficial to improving the efficiency of the fluid taking out the heat diffused from the power device 13 through the substrate 11 from the protrusion 114 out of the accommodation cavity 30, and thus beneficial to improving the heat dissipation efficiency of the power device 13.

[0087] In some other embodiments, the heat dissipation plate 20 may not be provided with the groove 24. That is, the accommodation cavity 30 may only include the accommodation space 116. The fluid inlet 25 and the fluid outlet 26 are both communicated with the accommodation space 116. The protrusion 114 is entirely accommodated in the accommodation space 116. In this way, the fluid (gas or liquid) can also flow into the accommodation cavity 30 from the fluid inlet 25, then pass through the protrusion 114 and absorb the heat diffused from the power device 13 through the substrate 11 from the protrusion 114, and then flow out of the accommodation cavity 30 from the fluid outlet 26, ensuring that the fluid can take out the heat diffused from the power device 13 through the substrate 11 from the protrusion 114 out of the accommodation cavity 30, and thus realizing the liquid cooling heat dissipation (or air cooling heat dissipation) of the power device 13, greatly improving the heat dissipation efficiency of the power device 13.

[0088] Please refer to Figure 7 and in combination with Figure 5 Figure 7 is Figure 3 the schematic structural diagram of the power module 300 shown in the sectional view along the line A-A in another embodiment.

[0089] ​In some other embodiments, the fixing portion 115 is omitted. A sealing ring 40 is provided on the side of the heat dissipation plate 20 facing the first heat conducting layer 113. The sealing ring 40 is sleeved outside the first heat conducting layer 113, and the first heat conducting layer 113, the sealing ring 40 and the heat dissipation plate 20 can also enclose to form a receiving cavity 30.

[0090] Specifically, the projection of the first heat conducting layer 113 in the Z-axis direction is located within the projection of the groove 24 in the Z-axis direction. The package 14 further includes a third package surface 143. In other words, the package 14 includes a first package surface 141, a second package surface 142 and a third package surface 143. The third package surface 143 is connected between the first package surface 141 and the second package surface 142. The third package surface 143 faces the heat dissipation plate 20. The mating surface 1131 of the third package surface 143 is flush with the first heat conducting layer 113.

[0091] The sealing ring 40 abuts between the third package surface 143 and the first plate surface 21 of the heat dissipation plate 20. The sealing ring 40 abuts between the package 14 and the heat dissipation plate 20. The sealing ring 40 is sleeved outside the first heat conducting layer 113. And in the Z-axis direction, the sealing ring 40 is located between the first heat conducting layer 113 and the heat dissipation plate 20. The sealing ring 40 and the first heat conducting layer 113 enclose to form a mating space 50. Specifically, the sealing ring 40 includes a first surface 41. The first surface 41 faces the protrusion 114 and is spaced apart from the protrusion 114. The first surface 41 and the mating surface 1131 enclose to form the mating space 50. The mating space 50 communicates with the groove 24. The mating space 50 and the groove 24 constitute the receiving cavity 30. In other words. The receiving cavity 30 includes the mating space 50 and the groove 24. The design of the sealing ring 40 also ensures that a sealed receiving cavity 30 can be formed, ensuring that the fluid can stably take out the heat diffused from the power device 13 through the substrate 11 from the protrusion 114 out of the receiving cavity 30, greatly improving the heat dissipation stability and heat dissipation efficiency of the power device 13.

[0092] Please refer to Figure 8 、 Figure 9 and Figure 10 and in combination with Figure 5 , Figure 8 which Figure 3 is a schematic three-dimensional structure diagram of the power module 300 shown in another embodiment. Figure 9 which Figure 8 is a schematic cross-sectional structure diagram of the power module 300 taken along the line B-B shown in Figure 10 which Figure 9 is a schematic structure diagram of the power module 300 shown in another embodiment.

[0093] Such as Figure 5 , Figure 8 and Figure 9As shown, in some other embodiments, the bonding wire 16 can be omitted. The heating element 10 further includes a second substrate 17, a second fixing layer 18, a spacer 19, and a third fixing layer 19a. In other words, the power module 300 includes the second substrate 17, the second fixing layer 18, the spacer 19, and the third fixing layer 19a. The second substrate 17 is located on the side of the power device 13 facing away from the substrate 11. The second fixing layer 18 is disposed on the side of the second substrate 17 facing the power device 13. The spacer 19 is disposed on the side of the second fixing layer 18 facing the power device 13. The third fixing layer 19a is disposed between the spacer 19 and the power device 13. Through the second fixing layer 18 and the third fixing layer 19a, the spacer 19 is disposed between the power device 13 and the second substrate 17. Through the spacer 19, the second substrate 17 is disposed on the side of the power device 13 facing away from the substrate 11. Among them, a part of the second substrate 17 is covered by the encapsulation body 14, and the side of the second substrate 17 facing away from the power device 13 is exposed outside the encapsulation body 14, and the second fixing layer 18, the spacer 19, and the third fixing layer 19a are all covered by the encapsulation body 14.

[0094] The second substrate 17 includes a second insulating layer 171, a second heat-conducting layer 172, and a second conductive layer 173. Exemplarily, the second insulating layer 171 is made of insulating materials including but not limited to ceramics or epoxy resins. The second heat-conducting layer 172 and the second conductive layer 173 are made of conductive materials including but not limited to copper or aluminum. In the Z-axis direction, the second heat-conducting layer 172 and the second conductive layer 173 are disposed on opposite sides of the second insulating layer 171. Specifically, in the Z-axis direction, the second heat-conducting layer 172 and the second conductive layer 173 are fixedly laminated on opposite sides of the second insulating layer 171 by means including but not limited to welding or gluing. The second conductive layer 173 is located on the side of the power device 13 facing away from the substrate 11. The second insulating layer 171 is disposed on the side of the second conductive layer 173 facing away from the power device 13. The second heat-conducting layer 172 is disposed on the side of the second insulating layer 171 facing away from the second conductive layer 173.

[0095] Exemplarily, the number of the second conductive layers 173 is multiple. Specifically, the number of the second conductive layers 173 is 2. In some other embodiments, the number of the second conductive layers 173 can also be 1, 3, or other more. The projections of the multiple second conductive layers 173 along the Z-axis direction overlap with the projections of the multiple power devices 13 along the Z-axis direction one by one. Among them, the second heat-conducting layer 172 includes a second mating surface 1721, and the second mating surface 1721 faces away from the second insulating layer 171.

[0096] The second heat-conducting layer 172 is provided with second protrusions 174. Specifically, the second mating surface 1721 of the second heat-conducting layer 172 is provided with second protrusions 174. That is to say, the second protrusions 174 are arranged on the side of the second heat-conducting layer 172 facing away from the second insulating layer 171. The side of the second heat-conducting layer 172 facing away from the second insulating layer 171 is provided with second protrusions 174. The second protrusions 174 extend in the Z-axis direction. Exemplarily, the number of the second protrusions 174 is multiple. Specifically, the number of the second protrusions 174 is 9. In some other embodiments, the number of the second protrusions 174 may also be 1, 2, 3 or more. In the X-axis direction, the multiple second protrusions 174 are arranged at intervals. The design of arranging the second protrusions 174 on the second heat-conducting layer 172 is beneficial to simplifying the structure of the second substrate 17, reducing the processing difficulty of the second substrate 17, reducing the processing cost of the second substrate 17, and reducing the processing cost of the power module 300.

[0097] The second protrusions 174 and the second heat-conducting layer 172 are integrally formed. In this way, it is beneficial to improve the connection strength between the second protrusions 174 and the second heat-conducting layer 172, beneficial to improving the structural stability of the second substrate 17, and beneficial to improving the structural stability of the power module 300. In some other embodiments, the second protrusions 174 can also be arranged on the side of the second heat-conducting layer 172 facing away from the second insulating layer 171 by means including but not limited to welding or gluing. Among them, the projections of the multiple second protrusions 174 in the Z-axis direction overlap with the projections of each power device 13 in the Z-axis direction. That is, the projection of the second protrusions 174 in the Z-axis direction (i.e., the thickness direction of the substrate 11) overlaps with the projection of the power device 13 in the Z-axis direction (i.e., the thickness direction of the substrate 11).

[0098] The second heat-conducting layer 172 is provided with a second fixing portion 175. Specifically, the second mating surface 1721 of the second heat-conducting layer 172 is provided with a second fixing portion 175. That is to say, the second fixing portion 175 is arranged on the side of the second heat-conducting layer 172 facing away from the second insulating layer 171. The second fixing portion 175 surrounds the multiple second protrusions 174 and is arranged at intervals from the multiple second protrusions 174. That is, the second fixing portion 175 surrounds the second protrusions 174 and is arranged at intervals from the second protrusions 174. The second fixing portion 175 extends in the Z-axis direction. The second fixing portion 175 and the second heat-conducting layer 172 enclose a second accommodating space 176. The second protrusions 174 are located in the second accommodating space 176. Exemplarily, the second fixing portion 175 is a rectangular ring. In some other embodiments, the second fixing portion 175 may also be a circular ring, a triangular ring or other special-shaped rings. The dimension of the second fixing portion 175 in the Z-axis direction (i.e., the thickness direction of the substrate 11) is smaller than the dimension of the second protrusions 174 in the Z-axis direction (i.e., the thickness direction of the substrate 11).

[0099] Exemplarily, the second fixing layer 18 is made of solder including but not limited to aluminum or lead. In some other embodiments, the second fixing layer 18 can also be made of other sintered materials such as sintered silver or sintered copper. The second fixing layer 18 is disposed on a side of the second conductive layer 173 facing away from the second insulating layer 171. Specifically, the second fixing layer 18 is fixedly laminated on a side of the second conductive layer 173 facing away from the second insulating layer 171. Exemplarily, the number of the second fixing layers 18 is multiple. Specifically, the number of the second fixing layers 18 is two. In some other embodiments, the number of the second fixing layers 18 can also be one, three or more. The multiple second fixing layers 18 are disposed on sides of the multiple second conductive layers 173 facing away from the second insulating layer 171 in a one-to-one correspondence. Among them, in the Z-axis direction, projections of the multiple second fixing layers 18 along the Z-axis direction overlap with projections of the multiple power devices 13 along the Z-axis direction in a one-to-one correspondence.

[0100] Exemplarily, the spacer 19 is made of a heat-conducting material including but not limited to copper or aluminum. The number of the spacers 19 is multiple. Specifically, the number of the spacers 19 is two. In some other embodiments, the number of the spacers 19 can also be one, three or more. In the Z-axis direction, the multiple spacers 19 are disposed on sides of the multiple second fixing layers 18 facing the multiple power devices 13 in a one-to-one correspondence. Among them, in the Z-axis direction, projections of the multiple spacers 19 along the Z-axis direction overlap with projections of the multiple power devices 13 along the Z-axis direction in a one-to-one correspondence.

[0101] Exemplarily, the third fixing layer 19a is made of solder including but not limited to aluminum or lead. In some other embodiments, the third fixing layer 19a can also be made of other sintered materials such as sintered silver or sintered copper. The third fixing layer 19a is disposed between the spacer 19 and the power device 13. Specifically, the third fixing layer 19a is fixedly laminated between the spacer 19 and the power device 13. Exemplarily, the number of the third fixing layers 19a is multiple. Specifically, the number of the third fixing layers 19a is two. In some other embodiments, the number of the third fixing layers 19a can also be one, three or more. The multiple third fixing layers 19a are disposed between the multiple spacers 19 and the multiple power devices 13 in a one-to-one correspondence.

[0102] Through the second fixing layer 18 and the third fixing layer 19a, the spacer 19 is disposed between the plurality of power devices 13 and the second conductive layer 173. The spacer 19 is disposed between the power device 13 and the second conductive layer 173. The spacer 19 is disposed between the power device 13 and the second insulating layer 171. It can be understood that through the second fixing layer 18, the spacer 19 and the third fixing layer 19a, the second conductive layer 173 is disposed on the side of the power device 13 facing away from the substrate 11. In some other embodiments, the second conductive layer 173 may also be omitted. Through the second fixing layer 18, the spacer 19 may also be directly disposed between the power device 13 and the second insulating layer 171.

[0103] The design of disposing the spacer 19 between the power device 13 and the second conductive layer 173 can prevent the power device 13 disposed on the substrate 11 from contacting the second substrate 17, and avoid damage to the power device 13 caused by collision with the second substrate 17, which is beneficial to improving the working life of the power device 13.

[0104] The heat dissipated by each power device 13 during operation can not only be diffused to the protrusion 114 through the fixing layer 12 and the substrate 11, and then diffused from the protrusion 114 to the outside of the substrate 11; but also be diffused to the second protrusion 174 through the third fixing layer 19a, the spacer 19, the second fixing layer 18 and the second substrate 17, and then diffused from the second protrusion 174 to the outside of the second substrate 17.

[0105] That is to say, since the second conductive layer 173 is disposed on the side of the power device 13 facing away from the substrate 11, the second insulating layer 171 is disposed on the side of the second conductive layer 173 facing away from the power device 13, the second heat-conducting layer 172 is disposed on the side of the second insulating layer 171 facing away from the second conductive layer 173, and a second protrusion 174 is provided on the side of the second heat-conducting layer 172 facing away from the second insulating layer 171; when the power device 13 operates, the heat dissipated can not only be diffused from the substrate 11 to the protrusion 114 and then from the protrusion 114 to the outside of the substrate 11; but also be diffused from the second substrate 17 to the second protrusion 174 and then from the second protrusion 174 to the outside of the second substrate 17, realizing two-way heat dissipation of the power device 13, which is beneficial to improving the heat dissipation efficiency of the power device 13. Moreover, the design of the second protrusion 174 is beneficial to increasing the heat dissipation area of the second heat-conducting layer 172, beneficial to improving the efficiency of the heat of the power device 13 diffusing from the second heat-conducting layer 172 to the outside of the second substrate 17, and beneficial to improving the heat dissipation efficiency of the power device 13. In addition, the design that the second protrusion 174 is provided on the side of the second heat-conducting layer 172 facing away from the second insulating layer 171 is not only beneficial to shortening the heat dissipation path of the power device 13 through the second substrate 17 and reducing the heat dissipation path of the power device 13 through the second substrate 17, further improving the heat dissipation efficiency of the power device 13; but also beneficial to simplifying the structure of the second substrate 17, reducing the processing difficulty of the second substrate 17, reducing the processing cost of the second substrate 17, and reducing the processing cost of the power module 300.

[0106] It can be understood that the design in which the projection of the second protrusion 174 in the Z-axis direction (i.e., the thickness direction of the substrate 11) overlaps with the projection of the power device 13 in the Z-axis direction (i.e., the thickness direction of the substrate 11) is beneficial to shortening the heat dissipation path of the power device 13 through the second substrate 17 from the second protrusion 174 and beneficial to improving the heat dissipation efficiency of the power device 13. The design of multiple second protrusions 174 is beneficial to increasing the heat dissipation area of the power device 13 through the second substrate 17 from the second protrusion 174 and beneficial to improving the heat dissipation efficiency of the power device 13.

[0107] In this embodiment, the power module 300 further includes a second heat sink 60. The second heat sink 60 is disposed on a side of the second heat conduction layer 172 facing away from the second insulating layer 171, and forms a second receiving cavity 70 in cooperation with the second heat conduction layer 172. Specifically, by means of welding including but not limited to reflow soldering, etc., the second heat sink 60 is located on a side of the second fixing portion 175 facing away from the second insulating layer 171 and is fixedly connected to the second fixing portion 175. The second heat sink 60, the second heat conduction layer 172 and the second fixing portion 175 enclose to form the second receiving cavity 70. In other words, the second fixing portion 175 is installed on the second heat sink 60, and the second fixing portion 175, the second heat conduction layer 172 and the second heat sink 60 enclose to form the second receiving cavity 70. A plurality of second protrusions 174 are received in the second receiving cavity 70. That is, the second protrusions 174 are received in the second receiving cavity 70. The second heat sink 60 is used to dissipate heat from the second protrusions 174, and thus dissipate heat from the power device 13.

[0108] Exemplarily, the second heat sink 60 is a rectangular plate. In some other embodiments, the second heat sink 60 can also be a circular plate, a triangular plate or other shaped plates. The second heat sink 60 includes a fourth plate surface 61, a fifth plate surface 62 and a sixth plate surface 63. In the X-axis direction, the fifth plate surface 62 and the sixth plate surface 63 are connected to opposite sides of the fourth plate surface 61. In the X-axis direction, the fifth plate surface 62 and the sixth plate surface 63 are opposite and spaced apart. Among them, the fourth plate surface 61 faces the second fixing portion 175 and is fixedly connected to the second fixing portion 175.

[0109] The second heat sink 60 is provided with a second groove 64. Specifically, the fourth plate surface 61 of the second heat sink 60 (i.e., the surface of the second heat sink 60 facing the second heat conduction layer 172) is provided with the second groove 64. The second groove 64 extends in the Z-axis direction. Exemplarily, the second groove 64 is a rectangular groove. In some other embodiments, the second groove 64 can also be a circular groove, a triangular groove or other shaped grooves. Among them, the second groove 64 communicates with the second receiving space 176. The second groove 64 and the second receiving space 176 constitute the second receiving cavity 70. In other words, the second receiving cavity 70 includes the second groove 64 and the second receiving space 176. A part of each second protrusion 174 is received in the second receiving space 176, and another part is received in the second groove 64. The surface of the second protrusion 174 facing away from the second mating surface 1721 is spaced apart from the groove wall of the second groove 64 facing the second mating surface 1721. In some other embodiments, the surface of the second protrusion 174 facing away from the second mating surface 1721 can also be in contact with the groove wall of the second groove 64 facing the second mating surface 1721.

[0110] The second heat sink 60 is provided with a second fluid inlet 65. Specifically, the fifth plate surface 62 of the second heat sink 60 is provided with the second fluid inlet 65. The second fluid inlet 65 extends along the X-axis direction and communicates with the second groove 64. That is to say, in the X-axis direction, the second fluid inlet 65 is located on one side of the second groove 64 and communicates with the second groove 64. The second fluid inlet 65 communicates with the second receiving cavity 70.

[0111] The second heat sink 60 is provided with a second fluid outlet 66. Specifically, the sixth plate surface 63 of the second heat sink 60 is provided with the second fluid outlet 66. The second fluid outlet 66 extends along the X-axis direction and communicates with the second groove 64. That is to say, in the X-axis direction, the second fluid outlet 66 is located on the side of the second groove 64 opposite to the second fluid inlet 65 and communicates with the second groove 64. In the X-axis direction, the second fluid inlet 65 and the second fluid outlet 66 are located on opposite sides of the second groove 64 and both communicate with the second groove 64. In some other embodiments, the second fluid inlet 65 and the second fluid outlet 66 may also be located on opposite sides of the second groove 64 in the Y-axis direction and both communicate with the second groove 64. That is to say, the second fluid inlet 65 and the second fluid outlet 66 are located on opposite sides of the second groove 64 and both communicate with the second groove 64.

[0112] The second fluid inlet 65 is used for allowing fluid to flow into the second receiving cavity 70. The second fluid outlet 66 is used for allowing the fluid flowing into the second receiving cavity 70 to flow out of the second receiving cavity 70. Exemplarily, the fluid is a cooling liquid including but not limited to water, alcohol-based coolant or glycerol-based coolant, etc. That is, the second heat sink 60 is a liquid cooling plate. In some other embodiments, the fluid may also be a low-temperature gas such as low-temperature wind. That is, the second heat sink 60 is an air cooling plate. The fluid (gas or liquid) flows into the second receiving cavity 70 from the second fluid inlet 65, then passes through the second protrusion 174 and absorbs the heat diffused from the power device 13 through the second substrate 17 from the second protrusion 174, and then flows out of the second receiving cavity 70 from the second fluid outlet 66, realizing liquid cooling (or air cooling) of the second protrusion 174 and realizing liquid cooling (or air cooling) of the power device 13. Among them, the fluid flowing into the second receiving cavity 70 fills the second receiving cavity 70. In this way, it is beneficial to improve the efficiency of the fluid absorbing the heat diffused from the power device 13 through the second substrate 17 from the second protrusion 174, and is beneficial to improve the heat dissipation efficiency of the power device 13.

[0113] It can be understood that the second protrusion 174 is received in the second receiving cavity 70, and the design that both the second fluid inlet 65 and the second fluid outlet 66 communicate with the second receiving cavity 70 ensures that the fluid (gas or liquid) can flow into the second receiving cavity 70 from the second fluid inlet 65, and then pass through the second protrusion 174 and absorb the heat diffused from the power device 13 through the substrate 11 from the second protrusion 174, and then flow out of the second receiving cavity 70 from the second fluid outlet 66, ensuring that the fluid can carry out the heat diffused from the power device 13 through the substrate 11 from the second protrusion 174 out of the second receiving cavity 70, thereby realizing liquid cooling (or air cooling) of the power device 13 and greatly improving the heat dissipation efficiency of the power device 13.

[0114] The second fixing portion 175 is installed on the second heat dissipation plate 60, and the design that the second fixing portion 175, the second heat conduction layer 172 and the second heat dissipation plate 60 enclose to form the second receiving cavity 70 not only ensures the sealing at the connection position between the second heat dissipation plate 60 and the second fixing portion 175, ensures that the fluid can stably carry out the heat diffused from the power device 13 through the second substrate 17 from the second protrusion 174 out of the second receiving cavity 70, and greatly improves the heat dissipation stability and heat dissipation efficiency of the power device 13; moreover, the processing difficulty is low, which is beneficial to reducing the processing cost.

[0115] It can be understood that the design that the size of the second fixing portion 175 in the Z-axis direction (i.e., the thickness direction of the substrate 11) is smaller than the size of the second protrusion 174 in the Z-axis direction (i.e., the thickness direction of the substrate 11) is beneficial to increasing the heat dissipation area of the second protrusion 174, beneficial to improving the heat dissipation efficiency of the power device 13 from the second protrusion 174, and beneficial to improving the heat dissipation efficiency of the power device 13.

[0116] The design of the second groove 64 not only is beneficial to reducing the length of the second fixing portion 175 (i.e., the size of the second fixing portion 175 in the Z-axis direction) on the basis of ensuring the volume of the second receiving cavity 70, beneficial to improving the strength of the second fixing portion 175, beneficial to improving the connection strength between the second fixing portion 175 and the second heat dissipation plate 60, and beneficial to improving the structural stability of the power module 300; moreover, it is convenient for the fluid flowing in from the second fluid inlet 65 to flow through the second protrusion 174 and then flow out from the second fluid outlet 66, beneficial to improving the efficiency of the fluid carrying out the heat diffused from the power device 13 through the substrate 11 from the second protrusion 174 out of the second receiving cavity 70, and thus beneficial to improving the heat dissipation efficiency of the power device 13.

[0117] In some other embodiments, the second heat dissipation plate 60 may not be provided with the second groove 64. That is, the second receiving cavity 70 only includes the second receiving space 176. The second fluid inlet 65 and the second fluid outlet 66 are both in communication with the second receiving space 176. The second protrusion 174 is entirely received in the second receiving space 176. In this way, the fluid (gas or liquid) can also flow into the second receiving cavity 70 from the second fluid inlet 65, then pass through the second protrusion 174 and absorb the heat diffused from the power device 13 through the second substrate 17 from the second protrusion 174, and then flow out of the second receiving cavity 70 from the second fluid outlet 66, ensuring that the fluid can carry out the heat diffused from the power device 13 through the second substrate 17 from the second protrusion 174 out of the second receiving cavity 70, thereby realizing liquid cooling (or air cooling) of the power device 13 and greatly improving the heat dissipation efficiency of the power device 13.

[0118] As Figure 9 and Figure 10 shown, in some other embodiments, the power device 13 may also be disposed on the side of the second fixing layer 18 facing away from the second substrate 17. That is to say, the power device 13 is disposed on the second substrate 17. The gasket 19 is disposed on the side of the fixing layer 12 facing away from the substrate 11. Specifically, the gasket 19 is disposed on the side of the first conductive layer 112 facing away from the insulating layer 111. The third fixing layer 19a is disposed between the power device 13 and the gasket 19. That is to say, the gasket 19 is disposed between the first conductive layer 112 and the power device 13. The design of disposing the gasket 19 between the first conductive layer 112 and the power device 13 can prevent the power device 13 disposed on the second substrate 17 from contacting the substrate 11, avoiding damage to the power device 13 caused by collision with the substrate 11, and being beneficial to improving the working life of the power device 13.

[0119] Please refer to Figure 3 , Figure 5 , Figure 7 , Figure 8 , Figure 9 and Figure 10 again. The embodiment of the present application provides a power module 300. The power module 300 includes a substrate 11 and a power device 13. The substrate 11 includes an insulating layer 111, a first conductive layer 112 and a first heat conductive layer 113. In the Z-axis direction (i.e., the thickness direction of the substrate 11), the first conductive layer 112 and the first heat conductive layer 113 are disposed on opposite sides of the insulating layer 111. The power device 13 is disposed on the side of the first conductive layer 112 facing away from the insulating layer 111. Among them, in the Z-axis direction (i.e., the thickness direction of the substrate 11), a protrusion 114 is provided on the side of the first heat conductive layer 113 facing away from the power device 13.

[0120] In the power module 300 provided by the embodiment of the present application, a large amount of heat generated when the power device 13 operates diffuses from the substrate 11 to the protrusion 114 through the first heat-conducting layer 113, and then dissipates from the protrusion 114 to the outside of the substrate 11, realizing rapid heat dissipation of the power device 13. Compared with the existing solution for heat dissipation of the power device 13 through the substrate 11, solder, and heat sink, the power device 13 in the embodiment of the present application can achieve rapid heat dissipation only through the substrate 11 and the protrusion 114 provided on the first heat-conducting layer 113, shortening the heat dissipation path of the power device 13, reducing the heat dissipation thermal resistance of the power device 13, greatly improving the heat dissipation efficiency of the power device 13, and being beneficial to improving the use safety of the power device 13. Moreover, the design of the protrusion is beneficial to increasing the heat dissipation area of the first heat-conducting layer, beneficial to improving the efficiency of heat diffusion of the power device from the first heat-conducting layer to the outside of the substrate, and beneficial to improving the heat dissipation efficiency of the power device. In addition, the design of the protrusion 114 provided on the first heat-conducting layer 113 is beneficial to simplifying the structure of the substrate 11, beneficial to reducing the processing difficulty of the substrate 11, beneficial to reducing the processing cost of the substrate 11, and beneficial to reducing the processing cost of the power module 300.

Claims

1. A power module, characterized in that, The power module includes: a substrate, the substrate includes an insulating layer, a first conductive layer and a first heat-conducting layer, in the thickness direction of the substrate, the first conductive layer and the first heat-conducting layer are disposed on opposite sides of the insulating layer; and a power device, the power device is disposed on a side of the first conductive layer facing away from the insulating layer; wherein, in the thickness direction of the substrate, a protrusion is provided on a side of the first heat-conducting layer facing away from the power device.

2. The power module according to claim 1, characterized in that, The projection of the protrusion in the thickness direction of the substrate overlaps with the projection of the power device in the thickness direction of the substrate.

3. The power module according to claim 1, characterized in that The number of the protrusions is multiple, and the multiple protrusions are arranged at intervals.

4. The power module according to claim 1, wherein The power module includes a package body, the package body covers the insulating layer, the first conductive layer, the power device and a part of the first heat-conducting layer, a side of the first heat-conducting layer facing away from the insulating layer is exposed outside the package body, and the protrusion is exposed outside the package body.

5. The power module according to claim 1, characterized in that The power module includes a heat sink, the heat sink is disposed on a side of the first heat-conducting layer facing away from the insulating layer and encloses with the first heat-conducting layer to form a receiving cavity, the protrusion is received in the receiving cavity, the heat sink is provided with a fluid inlet and a fluid outlet, and both the fluid inlet and the fluid outlet are communicated with the receiving cavity.

6. The power module according to claim 5, characterized in that, A fixing portion is provided on a side of the first heat-conducting layer facing away from the insulating layer, the fixing portion surrounds the protrusion, and the fixing portion, the first heat-conducting layer and the heat sink enclose to form the receiving cavity.

7. The power module according to claim 6, characterized in that, The dimension of the fixing portion in the thickness direction of the substrate is smaller than the dimension of the protrusion in the thickness direction of the substrate.

8. The power module according to claim 6, characterized in that, A groove is provided on a surface of the heat sink facing the first heat-conducting layer, the fluid inlet and the fluid outlet are located on opposite sides of the groove and are both communicated with the groove, and a part of the protrusion is received in the groove.

9. The power module according to claim 5, characterized in that, A sealing ring is provided on a side of the heat sink facing the first heat-conducting layer, the sealing ring is sleeved outside the first heat-conducting layer, and the first heat-conducting layer, the sealing ring and the heat sink enclose to form the receiving cavity.

10. The power module according to any one of claims 1 to 9, characterized in that, The power module includes a second substrate, the second substrate includes a second insulating layer, a second conductive layer and a second heat-conducting layer, the second conductive layer is disposed on a side of the power device facing away from the substrate, the second insulating layer is disposed on a side of the second conductive layer facing away from the power device, the second heat-conducting layer is disposed on a side of the second insulating layer facing away from the second conductive layer, and a second protrusion is provided on a side of the second heat-conducting layer facing away from the second insulating layer.

11. The power module according to claim 10, wherein The power module includes a gasket, the gasket is disposed between the power device and the second conductive layer; or, the gasket is disposed between the first conductive layer and the power device.

12. The power module according to claim 10, characterized in that, The number of the second protrusions is multiple, and the multiple second protrusions are arranged at intervals.

13. The power module according to claim 10, wherein The power module includes a second heat dissipation plate, which is disposed on a side of the second heat conduction layer facing away from the second insulating layer and encloses a second accommodation cavity with the second heat conduction layer. The second protrusion is accommodated in the second accommodation cavity. The second heat dissipation plate is provided with a second fluid inlet and a second fluid outlet, and both the second fluid inlet and the second fluid outlet communicate with the second accommodation cavity.

14. The power module according to claim 13, wherein, A second fixing portion is provided on a side of the second heat conduction layer facing away from the second insulating layer. The second fixing portion surrounds the second protrusion, and the second fixing portion, the second heat conduction layer, and the second heat dissipation plate enclose the second accommodation cavity.

15. The power module according to claim 14, characterized in that, A second groove is provided on a surface of the second heat dissipation plate facing the second heat conduction layer. The second fluid inlet and the second fluid outlet are located on opposite sides of the second groove and both communicate with the second groove. The second protrusion is partially accommodated in the second groove.

16. A power conversion device, characterized in that, The power conversion device includes a circuit board and the power module according to any one of claims 1 to 15, and the power module is mounted on the circuit board.

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