Conductive adhesive pasting equipment for conductive sponge production

Abstract

The invention belongs to the technical field of conductive sponge production, and discloses conductive adhesive pasting equipment for conductive sponge production, and the conductive adhesive pasting equipment comprises a smearing mechanism, the smearing mechanism comprises a smearing roller, lines, a groove, a sliding frame, a connecting plate, a smearing sheet and a material distribution plate; through cooperation of structures such as the smearing roller and the smearing sheet, the conductive adhesive can be uniformly distributed on the surface of the conductive sponge conveniently, the conductive adhesive can be uniformly distributed on the smearing roller along lines on the smearing roller, and the smearing roller is uniformly distributed on the surface of the conductive sponge under the action of rotation and reciprocating motion; according to the invention, uniform distribution of the conductive adhesive in most areas of the surface of the conductive sponge is ensured, improvement of the consistency of the overall conductivity of the conductive sponge is facilitated, and meanwhile, due to lines on the smearing roller and the synergistic effect of rotation and reciprocating motion of the smearing roller, the situation that the local adhesive amount of the conductive adhesive on the surface of the conductive sponge is too large or too small can be effectively avoided; therefore, the uniformity of the thickness of the conductive adhesive layer is ensured.

Description

Technical Field

[0001] The present invention belongs to the technical field of conductive sponge production, and specifically relates to a conductive glue pasting device for conductive sponge production. Background Art

[0002] In the wave of the rapid development of the modern electronics industry, conductive sponges, as a key electronic material, are widely used in fields such as shielding, grounding, and electromagnetic interference (EMI) protection of electronic products. From small portable devices such as smartphones and tablets to large electronic devices such as computer hosts and servers, conductive sponges play an indispensable role. Their quality directly affects the performance and stability of electronic products. As electronic products develop towards thinner, lighter, and higher-performance directions, the demand for conductive sponges is increasing day by day, and the requirements for their quality and production efficiency are becoming more and more stringent. In the production process of conductive sponges, the paste application link of conductive glue is crucial.

[0003] Traditional conductive glue pasting methods mostly rely on manual operations. Workers hold tools to apply conductive glue on the surface of the sponge and then paste it. This method not only has low efficiency, but also due to the differences in manual operations, it is difficult to ensure the uniformity of conductive glue application and the accuracy of pasting on each conductive sponge. Over-thick application will cause waste of conductive glue, increase production costs, and may also affect product performance; too thin or uneven application will lead to unstable conductive performance and reduce the product qualification rate. Therefore, a conductive glue pasting device for conductive sponge production is now proposed. Summary of the Invention

[0004] To solve the problems raised in the above background art, the present invention provides a conductive glue pasting device for conductive sponge production.

[0005] To achieve the above object, the present invention provides the following technical solution: A conductive glue pasting device for conductive sponge production, including a main body mechanism, and further including:

[0006] A coating mechanism, the coating mechanism is located above the main body mechanism;

[0007] Among them, the coating mechanism includes a coating roller, patterns, grooves, a sliding frame, a connecting plate, a coating sheet, and a material distributing plate. The material distributing plate is slidably connected with a sliding frame. A coating roller is rotatably connected inside the sliding frame. A plurality of patterns and grooves for evenly distributing conductive glue are uniformly formed on the coating roller. A connecting plate is fixedly connected inside the sliding frame. A coating sheet for further evenly distributing the conductive glue on the coating roller is arranged on one side of the connecting plate close to the coating roller.

[0008] Preferably, both sides of the material distribution plate are fixedly connected with sliding plates. The bottom of the sliding plate is fixedly connected with a limiting block. The side of the sliding plate is fixedly connected with a telescopic rod. A plurality of the grooves and a plurality of the grooves are distributed in a staggered manner. The sliding frame is located below the material distribution plate.

[0009] Preferably, a collection mechanism is arranged inside the coating mechanism. The collection mechanism includes a rubber scraping plate. The bottom of the rubber scraping plate is provided with an inclined surface. Both sides of the rubber scraping plate are fixedly connected with rubber pushing plates. The side of the rubber pushing plate far away from the rubber scraping plate is fixedly connected with a rotating frame. A roller is rotatably connected to the rotating frame.

[0010] Preferably, the shape of the rubber scraping plate is "V"-shaped. A glue conveying pipe is arranged at the top of the material distribution plate. A plurality of glue outlets are arranged at the bottom of the material distribution plate. The side of the rubber scraping plate provided with the inclined surface is located on the side of the rubber scraping plate close to the coating roller. The telescopic rod is located on the side of the rubber scraping plate far away from the coating roller.

[0011] Preferably, the tops of the two rubber pushing plates are respectively fixedly connected with the sides of the two sliding plates. The rubber scraping plate is located on the side of the coating roller far away from the connecting plate. A plurality of the glue outlets are all located above the coating roller. A plurality of the glue outlets and a plurality of the grooves are distributed in a staggered manner. A plurality of the glue outlets are all located inside the sliding frame. The glue conveying pipe is communicated with a plurality of the glue outlets respectively through the inside of the material distribution plate.

[0012] Preferably, the main body mechanism includes a base and a winding cylinder. Two collection grooves are opened at the top of the base. A plurality of convex blocks are evenly arranged on the inner wall of the base. Two limiting grooves are opened at the top of the base. A conductive sponge is arranged inside the base. A sticking material is arranged on the top of the conductive sponge. The side of the sticking material far away from the conductive sponge is wound around the winding cylinder. Two hydraulic cylinders are arranged at the top of the base.

[0013] Preferably, a plurality of the convex blocks are distributed in a staggered manner with each other. The conductive sponge is located between the two collection grooves. The winding cylinder is located above the two hydraulic cylinders. The winding cylinder is located above the sticking material.

[0014] Preferably, the limiting block is slidably connected with the limiting groove. The sliding frame abuts against the convex block. The rubber scraping plate and the coating roller are both located above the conductive sponge. The rubber pushing plate is slidably connected with the collection groove. The roller abuts against the side of the sticking material far away from the rubber scraping plate. The end of the telescopic rod far away from the sliding plate is slidably connected with the inner wall of the hydraulic cylinder.

[0015] Preferably, an extrusion mechanism is arranged inside the main body mechanism. The extrusion mechanism includes a pressing plate. Two sliding rods are fixedly connected to the top of the pressing plate. Two springs are fixedly connected to the top of the pressing plate.

[0016] Preferably, the bottom of the pressure plate is against the adhesive material, the two sliding rods are respectively slidably connected to the top of the base, the top of the pressure plate is elastically connected to the top of the base through a spring, and the sliding rod is located between the two hydraulic cylinders.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The present invention facilitates the uniform distribution of the conductive adhesive on the surface of the conductive sponge by providing the coordination of structures such as the smear roller and the smear sheet. The conductive adhesive is evenly distributed on the smear roller along the lines on the smear roller, and the smear roller is evenly distributed on the surface of the conductive sponge under the action of rotation and reciprocating motion, ensuring that the conductive adhesive is evenly distributed in most areas of the conductive sponge surface, which helps to improve the overall conductivity consistency of the conductive sponge. At the same time, due to the synergistic effect of the lines on the smear roller and its rotation and reciprocating motion, it can effectively avoid the situation where the conductive adhesive is locally excessive or insufficient on the surface of the conductive sponge, thereby ensuring the uniformity of the thickness of the conductive adhesive layer.

[0019] The present invention facilitates the recycling and reuse of excess conductive glue on the surface of the conductive sponge by providing a scraper and a pusher. After the conductive glue is laid, the V-shaped scraper scrapes away the excess conductive glue on the surface of the conductive sponge, so that the excess conductive glue is scraped along the inclined surface into the collection tank. Under the push of the pusher, the glue moves from the collection tank to a recycling bucket provided on the side of the base away from the convergence cylinder, thereby reducing the waste of conductive glue. The timely scraping and recycling of excess conductive glue can prevent the conductive glue from accumulating and drying in the equipment or production area, helping to keep the equipment clean, reducing equipment failures and maintenance time, and thus improving production efficiency.

[0020] The present invention facilitates secondary coating of the surface of the conductive sponge while recovering the conductive glue by arranging the groove and the scraper. The conductive glue located in the groove will cause a small part of the surface of the conductive sponge to be covered with more conductive glue. When the scraper moves to this position, the "V"-shaped structure will be used to spread this part of the excess conductive glue along the inclined surface from the top of the conductive sponge again, avoiding the occurrence of blank areas on the surface of the conductive sponge where no conductive glue is laid or the situation where there is less conductive glue. The conductive glue can be distributed more evenly on the entire surface of the conductive sponge, ensuring that the entire surface of the conductive sponge is covered with conductive glue, so that when the conductive sponge is pasted with other components, the conductive glue can provide more uniform adhesion. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the present invention;

[0022] Figure 2This is a schematic diagram of the back structure of the main body of the present invention;

[0023] Figure 3 This is a schematic diagram of the front view of the main structure of the present invention;

[0024] Figure 4 Schematic diagram of the cross-sectional structure of the coating mechanism of the present invention;

[0025] Figure 5 This is a schematic diagram of the cross-sectional structure of the main mechanism of the present invention;

[0026] Figure 6 This is a schematic diagram of the collecting mechanism of the present invention when viewed from above;

[0027] Figure 7 For the present invention Figure 6 A in the middle is an enlarged structural diagram;

[0028] Figure 8 It is a bottom view of the structure of the smearing mechanism of the present invention.

[0029] In the figure: 1. smearing mechanism; 101. smearing roller; 102. grain; 103. groove; 104. sliding frame; 105. connecting plate; 106. smearing piece; 107. dividing plate; 108. slide plate; 109. limit block; 110. telescopic rod; 2. collecting mechanism; 201. scraper; 202. inclined plane; 203. pusher plate; 204. rotating frame; 205. roller; 206. glue head; 207. glue delivery hose; 3. main body mechanism; 301. base; 302. collecting tank; 303. bump; 304. limit groove; 305. conductive sponge; 306. adhesive material; 307. bunching cylinder; 308. hydraulic cylinder; 4. extrusion mechanism; 401. pressing plate; 402. slide bar; 403. spring. DETAILED DESCRIPTION

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] like Figures 1 to 8 As shown, the present invention provides a conductive adhesive bonding device for producing conductive sponge, including a main body mechanism 3, and also includes:

[0032] The smearing mechanism 1 is located above the main body mechanism 3;

[0033] Among them, the smearing mechanism 1 includes a smearing roller 101, patterns 102, grooves 103, a sliding frame 104, a connecting plate 105, a smearing piece 106 and a material distributing plate 107. A sliding frame 104 is slidably connected to the material distributing plate 107. A smearing roller 101 is rotatably connected inside the sliding frame 104. A plurality of patterns 102 and grooves 103 for evenly distributing the conductive adhesive are evenly formed on the smearing roller 101. A connecting plate 105 is fixedly connected inside the sliding frame 104. A smearing piece 106 for further evenly distributing the conductive adhesive on the smearing roller 101 is arranged on one side of the connecting plate 105 close to the smearing roller 101.

[0034] Skid plates 108 are fixedly connected to both sides of the material distributing plate 107. A limiting block 109 is fixedly connected to the bottom of the skid plate 108. A telescopic rod 110 is fixedly connected to the side of the skid plate 108. A plurality of grooves 103 and a plurality of grooves 103 are staggeredly distributed. The sliding frame 104 is located below the material distributing plate 107.

[0035] The main body mechanism 3 includes a base 301 and a winding cylinder 307. Two collecting grooves 302 are formed in the top of the base 301. A plurality of convex blocks 303 are evenly arranged on the inner wall of the base 301. Two limiting grooves 304 are formed in the top of the base 301. A conductive sponge 305 is arranged inside the base 301. An adhesive material 306 is arranged on the top of the conductive sponge 305. One side of the adhesive material 306 away from the conductive sponge 305 is wound around the winding cylinder 307. Two hydraulic cylinders 308 are arranged on the top of the base 301. A plurality of convex blocks 303 are staggeredly distributed with each other. The conductive sponge 305 is located between the two collecting grooves 302. The winding cylinder 307 is located above the two hydraulic cylinders 308. The winding cylinder 307 is located above the adhesive material 306.

[0036] Adopting the above scheme: Through the cooperation of structures such as the smearing roller 101 and the smearing piece 106, it is convenient to evenly distribute the conductive adhesive on the surface of the conductive sponge 305. The conductive adhesive released to the smearing roller 101 through the glue outlet 206 will be evenly distributed on the smearing roller 101 along the patterns 102 on the smearing roller 101, and the excess conductive adhesive will enter the grooves 103 along the patterns 102 under the blockage of the smearing piece 106. When the part of the smearing roller 101 evenly distributed with the conductive adhesive contacts the conductive sponge 305, the conductive adhesive on it will be evenly distributed on the surface of the conductive sponge 305 under the action of rotation and reciprocating movement, ensuring that the conductive adhesive is evenly distributed in most areas on the surface of the conductive sponge 305, which helps to improve the consistency of the overall conductive performance of the conductive sponge 305. At the same time, due to the synergistic effect of the patterns on the smearing roller 101 and its rotation and reciprocating movement, it can effectively avoid the situation of excessive or insufficient local glue amount of the conductive adhesive on the surface of the conductive sponge, thus ensuring the uniformity of the thickness of the conductive adhesive layer.

[0037] As shown Figures 3 to 8 As shown in the figure, a collecting mechanism 2 is arranged inside the coating mechanism 1. The collecting mechanism 2 includes a rubber scraping plate 201. An inclined surface 202 is arranged at the bottom of the rubber scraping plate 201. Rubber pushing plates 203 are fixedly connected to both sides of the rubber scraping plate 201. A rotating frame 204 is fixedly connected to the side of the rubber pushing plate 203 away from the rubber scraping plate 201. A roller 205 is rotatably connected to the rotating frame 204. The outer shape of the rubber scraping plate 201 is in a "V" shape. A glue conveying pipe 207 is arranged at the top of the material distributing plate 107. A plurality of glue outlets 206 are arranged at the bottom of the material distributing plate 107. The side of the rubber scraping plate 201 provided with the inclined surface 202 is located on the side of the rubber scraping plate 201 close to the coating roller 101. The telescopic rod 110 is located on the side of the rubber scraping plate 201 away from the coating roller 101.

[0038] The tops of the two rubber pushing plates 203 are respectively fixedly connected to the sides of the two sliding plates 108. The rubber scraping plate 201 is located on the side of the coating roller 101 away from the connecting plate 105. A plurality of glue outlets 206 are all located above the coating roller 101. The plurality of glue outlets 206 and the plurality of grooves 103 are staggeredly distributed. The plurality of glue outlets 206 are all located inside the sliding frame 104. The glue conveying pipe 207 communicates with the plurality of glue outlets 206 respectively through the inside of the material distributing plate 107.

[0039] The limiting block 109 is slidably connected with the limiting groove 304. The sliding frame 104 abuts against the convex block 303. The rubber scraping plate 201 and the coating roller 101 are both located above the conductive sponge 305. The rubber pushing plate 203 is slidably connected with the collecting groove 302. The roller 205 abuts against the side of the adhesive material 306 away from the rubber scraping plate 201. The end of the telescopic rod 110 away from the sliding plate 108 is slidably connected with the inner wall of the hydraulic cylinder 308.

[0040] An extrusion mechanism 4 is arranged inside the main body mechanism 3. The extrusion mechanism 4 includes a pressing plate 401. Two sliding rods 402 are fixedly connected to the top of the pressing plate 401. Two springs 403 are fixedly connected to the top of the pressing plate 401. The bottom of the pressing plate 401 abuts against the adhesive material 306. The two sliding rods 402 are respectively slidably connected to the top of the base 301. The top of the pressing plate 401 is elastically connected to the top of the base 301 through the spring 403. The sliding rods 402 are located between the two hydraulic cylinders 308.

[0041] Adopting the above solution: By setting up the cooperation of structures such as the rubber scraping plate 201 and the rubber pushing plate 203, it is convenient to recycle and reuse the excess conductive adhesive on the surface of the conductive sponge 305. After laying the conductive adhesive, the excess conductive adhesive on the surface of the conductive sponge 305 is scraped off by the "V"-shaped rubber scraping plate 201, and it is scraped along the inclined surface 202 into the collection tank 302. Then, under the push of the rubber pushing plate 203, it moves from the collection tank 302 into the recycling bucket arranged on the side of the base 301 away from the beam concentrator 307, reducing the waste of conductive adhesive. Timely scraping and recycling of the excess conductive adhesive can prevent the conductive adhesive from accumulating and drying in the equipment or production area, helping to keep the equipment clean, reducing equipment failures and maintenance time, and thus improving production efficiency;

[0042] By setting up the cooperation of structures such as the groove 103 and the rubber scraping plate 201, it is convenient to reapply the conductive adhesive on the surface of the conductive sponge 305 while recycling the conductive adhesive. The conductive adhesive in the groove 103 will make a small part of the surface of the conductive sponge 305 have more conductive adhesive. When the rubber scraping plate 201 moves to this position, this part of the excess conductive adhesive will be spread again along the inclined surface 202 from the top of the conductive sponge 305 through the "V"-shaped structure, avoiding blank areas or areas with less conductive adhesive on the surface of the conductive sponge 305. It can make the distribution of the conductive adhesive on the entire surface of the conductive sponge 305 more uniform, ensuring that the entire surface of the conductive sponge 305 is covered with the conductive adhesive, so that when the conductive sponge 305 is pasted with other components, the conductive adhesive can provide a more uniform adhesive force.

[0043] The working principle and usage process of the present invention: First, place the conductive sponge 305 to be processed inside the base 301, and place the end of the adhesive material 306 away from the beam concentrator 307 around the roller pressing cylinder 205 and between the pressing plate 401 and the conductive sponge 305. Through the elastic force of the spring 403, the pressing plate 401 presses the adhesive material 306 on the top of the conductive sponge 305. Subsequently, the conductive adhesive is transported into the material distributing plate 107 through the glue conveying pipe 207, and its glue outlet head 206 is extruded and dropped onto the coating roller 101 under external pressure, and is evenly distributed on the coating roller 101 along the texture 102 on the coating roller 101;

[0044] At the same time, the hydraulic cylinder 308 is used to make the telescopic rod 110 drive the slide 108 to move in the direction away from the convergence cylinder 307, so that the smear roller 101 rotates under the action of the friction between it and the conductive sponge 305. The rotation of the smear roller 101 will cause the excess conductive glue on the surface of the smear roller 101 to enter the groove 103 along the lines 102 under the obstruction of the smear sheet 106. At the same time, the several protrusions 303 staggeredly distributed inside the base 301 will squeeze the two sides of the sliding frame 104 respectively, so that the sliding frame 104 slides back and forth on the dividing plate 107. When the part of the smear roller 101 with evenly distributed conductive glue contacts the conductive sponge 305, the conductive glue on it will be evenly distributed on the surface of the conductive sponge 305 under the action of rotation and reciprocating motion.

[0045] The conductive glue in the groove 103 will cause a small part of the surface of the conductive sponge 305 to be covered with more conductive glue. When the scraper 201 moves to this position, it will use the "V"-shaped structure to make this excess conductive glue spread again along the inclined surface 202 from the top of the conductive sponge 305, and finally scrape it into the collection tank 302. With the push of the pusher 203, it moves from the collection tank 302 to the recycling bucket provided on the side of the base 301 away from the converging tube 307.

[0046] During this process, the movement of the slide 108 will drive the rolling cylinder 205 to apply pressure to the pasting material 306 through the rotating frame 204, drive the converging cylinder 307 to release the pasting material 306 and roll the pasting material 306, so that the pasting material 306 is pasted on the surface evenly coated with conductive glue.

[0047] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0048] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A conductive adhesive pasting device for the production of conductive sponges, comprising a main body mechanism (3), characterized in that: Further comprising: A coating mechanism (1), which is located above the main body mechanism (3); Wherein, the coating mechanism (1) includes a coating roller (101), a texture (102), a groove (103), a sliding frame (104), a connecting plate (105), a coating piece (106) and a material distributing plate (107). The sliding frame (104) is slidably connected to the material distributing plate (107). The coating roller (101) is rotatably connected inside the sliding frame (104). A plurality of textures (102) and grooves (103) for evenly distributing the conductive adhesive are evenly formed on the coating roller (101). The connecting plate (105) is fixedly connected inside the sliding frame (104). A coating piece (106) for further evenly distributing the conductive adhesive on the coating roller (101) is arranged on one side of the connecting plate (105) close to the coating roller (101).

2. The conductive adhesive pasting device for the production of conductive sponges according to claim 1, wherein: Skid plates (108) are fixedly connected to both sides of the material distributing plate (107). A limiting block (109) is fixedly connected to the bottom of the skid plate (108). A telescopic rod (110) is fixedly connected to the side surface of the skid plate (108). The plurality of grooves (103) are staggeredly distributed with the plurality of grooves (103). The sliding frame (104) is located below the material distributing plate (107).

3. The conductive adhesive pasting device for the production of conductive sponges according to claim 2, wherein: A collecting mechanism (2) is arranged inside the coating mechanism (1). The collecting mechanism (2) includes a glue scraping plate (201). An inclined surface (202) is arranged at the bottom of the glue scraping plate (201). Glue pushing plates (203) are fixedly connected to both sides of the glue scraping plate (201). A rotating frame (204) is fixedly connected to one side of the glue pushing plate (203) away from the glue scraping plate (201). A roller pressing cylinder (205) is rotatably connected to the rotating frame (204).

4. The conductive adhesive pasting device for the production of conductive sponges according to claim 3, characterized in that: The outer shape of the glue scraping plate (201) is in a "V" shape. A glue conveying pipe (207) is arranged at the top of the material distributing plate (107). A plurality of glue outlet heads (206) are arranged at the bottom of the material distributing plate (107). The side of the glue scraping plate (201) provided with the inclined surface (202) is located on the side of the glue scraping plate (201) close to the coating roller (101). The telescopic rod (110) is located on the side of the glue scraping plate (201) away from the coating roller (101).

5. The conductive adhesive pasting device for the production of conductive sponges according to claim 4, characterized in that: The tops of the two glue pushing plates (203) are respectively fixedly connected to the side surfaces of the two skid plates (108). The glue scraping plate (201) is located on the side of the coating roller (101) away from the connecting plate (105). The plurality of glue outlet heads (206) are all located above the coating roller (101). The plurality of glue outlet heads (206) are staggeredly distributed with the plurality of grooves (103). The plurality of glue outlet heads (206) are all located inside the sliding frame (104). The glue conveying pipe (207) is communicated with the plurality of glue outlet heads (206) respectively through the inside of the material distributing plate (107).

6. The conductive adhesive pasting device for the production of conductive sponges according to claim 4, wherein: The main body mechanism (3) includes a base (301) and a converging cylinder (307). Two collecting grooves (302) are formed in the top of the base (301). A plurality of bumps (303) are evenly arranged on the inner wall of the base (301). Two limiting grooves (304) are formed in the top of the base (301). A conductive sponge (305) is arranged inside the base (301). A paste material (306) is arranged on the top of the conductive sponge (305). The side of the paste material (306) away from the conductive sponge (305) is wound around the converging cylinder (307). Two hydraulic cylinders (308) are arranged on the top of the base (301).

7. The conductive adhesive pasting device for the production of conductive sponges according to claim 6, characterized in that: A plurality of the bumps (303) are distributed in a staggered manner. The conductive sponge (305) is located between the two collecting grooves (302). The converging cylinder (307) is located above the two hydraulic cylinders (308). The converging cylinder (307) is located above the paste material (306).

8. The conductive adhesive pasting device for the production of conductive sponges according to claim 6, characterized in that: The limiting block (109) is slidably connected with the limiting groove (304). The sliding frame (104) abuts against the bump (303). The glue scraping plate (201) and the coating roller (101) are both located above the conductive sponge (305). The glue pushing plate (203) is slidably connected with the collecting groove (302). The rolling cylinder (205) abuts against the side of the paste material (306) away from the glue scraping plate (201). The end of the telescopic rod (110) away from the sliding plate (108) is slidably connected with the inner wall of the hydraulic cylinder (308).

9. The conductive adhesive pasting device for the production of conductive sponges according to claim 6, wherein: An extrusion mechanism (4) is arranged inside the main body mechanism (3). The extrusion mechanism (4) includes a pressing plate (401). Two sliding rods (402) are fixedly connected to the top of the pressing plate (401). Two springs (403) are fixedly connected to the top of the pressing plate (401).

10. The conductive adhesive pasting device for the production of conductive sponges according to claim 9, characterized in that: The bottom of the pressing plate (401) abuts against the paste material (306). The two sliding rods (402) are respectively slidably connected with the top of the base (301). The top of the pressing plate (401) is elastically connected with the top of the base (301) through the spring (403). The sliding rods (402) are located between the two hydraulic cylinders (308).

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