Copper alloy dual-wavelength laser synergistic pulsed magnetic field additive manufacturing device and method

Abstract

The invention provides a copper alloy dual-wavelength laser synergistic pulsed magnetic field additive manufacturing device and method, and belongs to the field of additive manufacturing. The base is arranged right above the base plate and horizontally moves relative to the base plate; the blanking mechanism is arranged on the base and conveys powder materials to the base plate; the first laser is arranged on the base and emits blue laser towards the substrate; the second laser is arranged on the base and emits red laser towards the substrate; the blue laser irradiates the raw material and enables the powder material to form a molten pool on the substrate. The red laser irradiates the molten pool, inputs a heat source and expands the molten pool. According to the method, the irradiation starting time of the red and blue laser is designed, the power and the light spot area of the red and blue laser are adjusted, the molten pool formed by copper or copper alloy additive manufacturing can be finely regulated and controlled, and therefore the problems that in the additive manufacturing process, copper or copper alloy is low in forming efficiency and poor in compactness are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of additive manufacturing, and particularly relates to a copper alloy dual-wavelength laser collaborative pulsed magnetic field additive manufacturing device and method. Background Art

[0002] Copper alloys are widely used in industries such as electronics, aerospace, and automotive due to their excellent electrical conductivity, thermal conductivity, and corrosion resistance. Laser melting deposition technology, with its layer-by-layer stacking forming characteristics, is particularly suitable for manufacturing copper alloy functional components with lightweight topological configurations. This technology has become the core manufacturing method for high thermal conductivity copper alloy components such as microchannel heat dissipation modules for electronic devices and regenerative cooling heat exchangers for aerospace through high-precision molten pool control and the ability to integrally form complex structures.

[0003] However, copper alloys have an extremely low absorption rate of common infrared lasers (less than 5%), resulting in low energy utilization efficiency and low forming efficiency, and are not suitable for copper alloy additive manufacturing. Although using a single blue / green laser can increase the absorption rate of copper alloys (the laser absorption rate is 40%-50%), the equipment cost is extremely high, severely limiting practical applications. Moreover, due to the high thermal conductivity of copper alloys (>350 W / m·K), the molten pool cools rapidly, easily causing thermal stress concentration and leading to part deformation or cracking. The existing invention patent with the patent number CN20211157198 is proposed to solve the problems of low laser absorption rate and low forming efficiency during the additive manufacturing of copper alloys in the prior art. In the above technical solution, additive manufacturing is carried out by combining blue light-near-infrared lasers, which increases the absorption rate of the copper alloy molten pool to the laser. However, the energy matching and spatio-temporal coordination of the two are not fully optimized, and due to the high thermal conductivity of copper or copper alloys, the molten pool stability is insufficient, and there are still problems such as pores and uneven spreading inside the specimen. Summary of the Invention

[0004] In view of this, the present invention proposes a copper alloy dual-wavelength laser collaborative pulsed magnetic field additive manufacturing device and method to solve the problem that the current copper alloy additive manufacturing method using red and blue laser combination has not been optimized.

[0005] The technical solution of the present invention is realized as follows: The present invention provides a copper alloy dual-wavelength laser collaborative pulsed magnetic field additive manufacturing device, including a substrate on which a printed part is additively manufactured; a base disposed directly above the substrate and horizontally movable relative to the substrate; a powder feeding mechanism disposed on the base and feeding powder to the substrate; a first laser disposed on the base and emitting blue laser towards the substrate; a second laser disposed on the base and emitting red laser towards the substrate; wherein, the blue laser irradiates the raw material and forms a molten pool of the powder on the substrate, and the red laser irradiates the molten pool to input heat source and expand the molten pool.

[0006] Based on the above technical solutions, preferably, it further includes a pulsed magnetic field generating mechanism, which is arranged below the substrate and moves horizontally relative to the substrate; wherein, the pulsed magnetic field generating mechanism moves synchronously with the base, and the pulsed magnetic field generating mechanism applies a pulsed magnetic field towards the molten pool.

[0007] On the other hand, the present invention also provides a method for additive manufacturing of copper alloy by dual-wavelength laser synergistic pulsed magnetic field, using the above-mentioned device for additive manufacturing of copper alloy by dual-wavelength laser synergistic pulsed magnetic field, including the following steps. Step 1, establish a three-dimensional model of the printed part and slice and layer the three-dimensional model, and design the laser scanning path and printing parameters during additive manufacturing; Step 2, set the printing parameters and convey powder materials to the substrate. First, turn on the first laser to emit blue laser to irradiate the powder materials to form a molten pool on the substrate, and then turn on the second laser to emit red laser to irradiate the molten pool, input heat source to the molten pool and expand the molten pool; Step 3, after completing the additive manufacturing of the printed part according to the designed laser scanning path, turn off the second laser first and then turn off the first laser.

[0008] Based on the above technical solutions, preferably, in Step 2, the second laser is turned on 1 s to 2 s after the first laser is turned on; in Step 3, the first laser is turned off 1 s to 2 s after the second laser is turned off.

[0009] Based on the above technical solutions, preferably, the power of the first laser is 400 W to 1000 W, and the power of the second laser is 3000 W to 6000 W.

[0010] More preferably, the spot area of the blue laser is smaller than that of the red laser.

[0011] More preferably, the spot of the blue laser is not larger than the covering area of the molten pool on the substrate, and the spot of the blue laser covers the molten pool.

[0012] Based on the above technical solutions, preferably, in Step 2, after the molten pool is formed on the substrate, the pulsed magnetic field generating mechanism is turned on to apply a pulsed magnetic field towards the molten pool.

[0013] More preferably, the pulsed magnetic field generating mechanism simultaneously applies a transverse magnetic field and a radial rotating magnetic field to the molten pool.

[0014] More preferably, the application direction of the transverse magnetic field is the parallel direction of the laser scanning path, and the application direction of the radial rotating magnetic field is perpendicular to the surface of the substrate.

[0015] The device and method for additive manufacturing of copper alloy by dual-wavelength laser synergistic pulsed magnetic field of the present invention have the following beneficial effects compared with the prior art:

[0016] (1) By designing the irradiation start time of the red and blue lasers and adjusting the power and spot area of the red and blue lasers, the present invention can finely control the molten pool formed by the additive manufacturing of copper or copper alloy, thereby solving the problems of low forming efficiency and poor density of copper or copper alloy during the additive manufacturing process.

[0017] (2) By applying a pulsed magnetic field to the molten pool, the present invention changes the movement trajectory of free electrons in the material through the Lorentz force, affects its oscillation response, and constrains the collective oscillation of electrons through the Lorentz force, increases the electron scattering probability, reduces the reflectivity, and forces more energy to be absorbed in the form of Joule heat. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 is a schematic structural diagram of the additive manufacturing device of the present invention;

[0020] Figure 2 is a micrograph of the printed sample of Example 1 of the present invention;

[0021] Figure 3 is a micrograph of the printed sample of Example 2 of the present invention;

[0022] Figure 4 is a micrograph of the printed sample of Example 3 of the present invention.

[0023] In the figure: 1, substrate; 11, molten pool; 2, base; 3, blanking mechanism; 4, first laser; 41, blue laser; 5, second laser; 51, red laser; 6, pulsed magnetic field generating mechanism. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the scope of protection of the present invention.

[0025] As Figure 1 shown, a copper alloy dual-wavelength laser collaborative pulsed magnetic field additive manufacturing device of the present invention includes a substrate 1, a base 2, a blanking mechanism 3, a first laser 4 and a second laser 5.

[0026] Among them, the substrate 1 is for additive manufacturing of printed parts. The substrate 1 can be arranged in a closed box.

[0027] The base 2 is arranged directly above the substrate 1 and moves horizontally relative to the substrate 1. The base 2 can be installed on a multi-axis guide mechanism to achieve movement, or can be arranged at the end of a robotic arm.

[0028] The powder feeding mechanism 3 is arranged on the base 2 and conveys powder materials to the substrate 1. The powder materials are copper or copper alloy metal powder materials, and their particle size ranges from 10 to 50 μm. The powder feeding mechanism 3 can adopt a powder feeding conduit. In actual implementation, the powder feeding mechanism 3 is arranged at the center of the base 2 and vertically downward aligns with the substrate 1 for powder material conveyance; the first laser 4 and the second laser 5 are arranged around the powder feeding mechanism 3, and the first laser 4 and the second laser 5 are obliquely aligned with the molten pool on the substrate 1.

[0029] The first laser 4 is arranged on the base 2 and emits blue laser 41 towards the substrate 1. The first laser 4 is a blue light (450nm - 470nm) laser; the blue laser 41 has a Gaussian heat source distribution. The blue laser 41 irradiates the raw materials and makes the powder materials form a molten pool 11 on the substrate 1.

[0030] The second laser 5 is arranged on the base 2 and emits red laser 51 towards the substrate 1. The second laser 5 is a near-infrared light (750 - 1100nm) laser; the red laser 51 has a uniform heat source distribution. The red laser 51 irradiates the molten pool 11 to input heat source and expand the molten pool 11.

[0031] The principle of this solution is that the absorption rate of copper alloy for light of different wavelengths mainly stems from the response difference of its electronic structure to photons of different wavelengths. The energy of blue light photons is relatively high (about 2.75eV), exceeding the energy required for electrons in the copper alloy to jump from the valence band to the conduction band (the interband transition threshold of copper is about 2.1eV). When blue light irradiates, the photon energy is sufficient to excite electrons to cross the energy band gap, triggering interband transition, resulting in part of the energy being absorbed by the material. While the energy of infrared light photons is relatively low (such as 1064nm corresponding to about 1.16eV), far lower than the interband transition threshold of copper, unable to trigger electron transition, but the infrared laser can continuously provide high heat source input to ensure that the molten pool can have a high heat source. Therefore, the selected near-infrared laser has a higher power. Copper has a significantly higher absorption rate for blue light in the solid state than for infrared light because its photon energy is close to the interband transition threshold of copper, triggering electron resonance absorption. After the molten pool is formed, the absorption rate of liquid copper for red light increases with the increase in temperature. Therefore, in this embodiment, by the combined action of red and blue lasers on the formation and expansion of the molten pool, the absorption rate of copper alloy powder materials for light energy can be greatly improved, thereby obtaining a stable molten pool and avoiding the situation of pores and uneven spreading inside the obtained printed parts.

[0032] InFigure 1 In a preferred embodiment described above, the absorption rate of copper for blue light in the solid state is significantly higher than that of infrared light. Because the photon energy is close to the interband transition threshold of copper, it causes electron resonance absorption. After the molten pool is formed, the absorption rate of liquid copper for red light increases with the increase of temperature. However, when the temperature exceeds the critical value (such as approaching the boiling point), the absorption rate of the molten pool surface may decrease due to plasma shielding or surface morphology change. Therefore, the optimal temperature range can be maintained by applying an external field to the molten pool. For the above reasons, this embodiment further includes a pulsed magnetic field generating mechanism 6.

[0033] Among them, the pulsed magnetic field generating mechanism 6 is arranged below the substrate 1 and moves horizontally relative to the substrate 1; among them, the pulsed magnetic field generating mechanism 6 moves synchronously with the base 2, and the pulsed magnetic field generating mechanism 6 applies a pulsed magnetic field to the molten pool 11. The pulsed magnetic field generating mechanism 6 can adopt an electromagnetic coil or an electromagnet. The pulsed magnetic field changes the movement trajectory of free electrons in the material through the Lorentz force, affecting its oscillation response; for infrared lasers, the high reflectivity of metals mainly stems from the plasma oscillation of free electrons. The pulsed magnetic field restricts the collective oscillation of electrons through the Lorentz force, increases the probability of electron scattering, reduces the reflectivity, and forces more energy to be absorbed in the form of Joule heat.

[0034] As Figure 1 shown, a method for additive manufacturing of a copper alloy with dual-wavelength laser synergistic pulsed magnetic field using the additive manufacturing device of a copper alloy with dual-wavelength laser synergistic pulsed magnetic field in the above embodiment includes the following steps:

[0035] Step 1: Establish a three-dimensional model of the printed part and slice and layer the three-dimensional model, and design the laser scanning path and printing parameters during additive manufacturing. Specifically, use digital modeling technologies such as CAD software or Soildworks software to construct a three-dimensional solid model of the printed part, and import the model data into the layer processing system through STL file format conversion; determine the component forming parameters based on the requirements of the printed component, so as to obtain the two-dimensional data model generated after slicing the three-dimensional solid model; the area and thickness of each stacking layer are optimized and analyzed according to the layer slicing software, so as to select the numerical values of the blue light laser power and infrared light laser power within the range.

[0036] Step 2: Set the printing parameters and convey the powder material to the substrate 1 through the powder feeding mechanism 3. The printing parameters include the infrared laser printing parameters, blue light laser printing parameters, pulsed magnetic field device parameters, powder feeding parameters, etc. for each stacking layer; first, turn on the first laser 4 to emit blue laser 41 to irradiate the powder material, so as to form a molten pool 11 on the substrate 1, and then turn on the second laser 5 to emit red laser 51 to irradiate the molten pool 11, input heat source to the molten pool 11 and expand the molten pool 11.

[0037] Step 3: Optimize the scanning strategy according to the model. Control the laser heat source to deposit the powder material along the designed laser scanning path to complete the layer-by-layer stacking of the printed component until a three-dimensional solid component is formed. After the additive manufacturing of the printed part is completed, first turn off the second laser 5 and then turn off the first laser 4. In addition, during the printing process, an inert gas needs to be injected into the molten pool through a gas pipe.

[0038] In Figure 1 In a preferred embodiment, in Step 2, turn on the second laser 5 after 1 s to 2 s of turning on the first laser 41; in Step 3, turn off the first laser 4 after 1 s to 2 s of turning off the second laser 51.

[0039] In Figure 1 In a preferred embodiment, the power of the first laser 4 is 400 W to 1000 W, and the power of the second laser 5 is 3000 W to 6000 W. Before printing, the area and thickness of each stacking layer need to be optimized and analyzed according to the slicing software, so as to select the values of the blue laser power of the first laser 4 and the infrared laser power of the second laser 5 within a certain range.

[0040] In Figure 1 In a preferred embodiment, to ensure that the near-infrared red laser 51 can fully expand the molten pool 11, the spot area of the blue laser 41 is smaller than that of the red laser 51.

[0041] In Figure 1 In a preferred embodiment, the spots of the blue laser 41 and the red laser 51 are both circular. The spot of the blue laser 41 is not larger than the coverage area of the molten pool on the substrate, and the spot of the blue laser 41 covers the molten pool 11. The optional spot diameter of the blue laser 41 is 100 - 150 μm; the optional spot diameter of the near-infrared red laser 51 is 300 - 400 μm.

[0042] In Figure 1 In a preferred embodiment, since the absorption rate of copper for blue light in the solid state is significantly higher than that of infrared light, because its photon energy is close to the interband transition threshold of copper, causing electron resonance absorption. After the molten pool is formed, the absorption rate of liquid copper for red light increases with the increase of temperature, but when the temperature exceeds the critical value (such as approaching the boiling point), the absorption rate of the molten pool surface may decrease due to plasma shielding or surface morphology change. Therefore, an external field needs to act on the molten pool to maintain the optimal temperature range. In this embodiment, in Step 2, after the molten pool 11 is formed on the substrate 1, turn on the pulsed magnetic field generating mechanism 6 to apply a pulsed magnetic field to the molten pool 11 and continue until the solidification of the printed part is completed. The pulsed magnetic field induces eddy currents in the molten pool. According to Joule's law (Q = I 2RT) generates additional heat to compensate for the energy loss of the molten pool due to heat conduction, convection, and radiation, and maintains the high-temperature state of the molten pool. The pulsed magnetic field interacts with the conductive liquid metal in the molten pool, induces eddy currents in the molten pool, and generates a periodically varying Lorentz force (F = J × B, where J is the current density and B is the magnetic induction intensity), suppressing the natural convection inside the molten pool (such as Marangoni convection), reducing the heat dissipation to the surrounding cold substrate through convection. The magnetic field can weaken the disturbance of the thermal boundary layer at the edge of the molten pool, reduce the heat conduction loss, and extend the residence time in the high-temperature zone. In addition, the magnetic field induces non-uniform nucleation in the molten pool, refines the solidification structure, reduces the grain boundary thermal resistance, improves the heat conduction efficiency from the molten pool to the surroundings, and avoids the sudden temperature drop caused by local rapid solidification.

[0043] In Figure 1 In a preferred embodiment described above, the pulsed magnetic field generating mechanism 6 simultaneously applies a transverse magnetic field and a radial rotating magnetic field to the molten pool 11, and the two magnetic fields act on the control of the molten pool 11 simultaneously.

[0044] In Figure 1 In a preferred embodiment described above, the application direction of the transverse magnetic field is parallel to the laser scanning path, and it mainly acts on the long straight path; the application direction of the radial rotating magnetic field is perpendicular to the surface of the substrate 1, and it mainly acts on the forming of complex contours.

[0045] In order to explore the influence of various factors of the combined red and blue laser participation in the additive manufacturing of copper alloys on copper alloy products, the present invention prepares the following copper alloy printed sample for comparative analysis:

[0046] Sample 1

[0047] It is made by using a copper alloy dual-wavelength laser synergistic pulsed magnetic field additive manufacturing device and method of the present invention, including a substrate 1, a base 2, a blanking mechanism 3, a first laser 4, a second laser 5, and a pulsed magnetic field generating mechanism 6. Its preparation steps include,

[0048] Step 1: First, use three-dimensional modeling software to establish a three-dimensional model of the target component, and then use special slicing software to slice the three-dimensional model layer by layer, discretize the three-dimensional solid model into a series of two-dimensional data and import it into the printing management software to generate an additive manufacturing laser scanning path at the same time;

[0049] Step 2: Set the printing parameters of the additive manufacturing robot, the metal powder feeding parameters, and the pulsed magnetic field technical parameters to control the printing process. Among them, copper alloy metal powder is used as the raw material, and the particle size range is 30μm; the power of the blue laser 41 is 800W, the power of the near-infrared red laser 51 is 4000W, the laser scanning speed is 15mm / s; the powder feeding speed is 45g / min; the magnetic field intensity of the pulsed magnetic field is 1T, the pulse frequency is 90kHz, and the pulse width is 250μs.

[0050] Step 3: When starting additive manufacturing, first start the first laser 4 to emit blue laser 41 for irradiation for 1 s to melt the metal powder to form a molten pool 11; then start the second laser 5 to emit near-infrared red laser 51 to make up for the insufficient power of the blue laser 41, so that the molten pool 11 has sufficient heat source input to expand the molten pool. At the same time, start the pulsed magnetic field generating mechanism 6 to apply a transverse magnetic field and a radial rotating magnetic field to the molten pool 11; after completing the additive manufacturing, first turn off the second laser 5, and then turn off the first laser 4 and the pulsed magnetic field generating mechanism 6 after waiting for 1 s.

[0051] The printed sample 1 is obtained through the above additive manufacturing device and method for copper alloy, and its microscopic morphology is observed by a microscopic electron microscope to obtain Figure 2 the microscopic image;

[0052] Sample 2

[0053] It is prepared by using an additive manufacturing device and method for copper alloy similar to that of Sample 1, the difference being that the power of the blue laser 41 is 400 W. The microscopic morphology of Sample 2 is observed by a microscopic electron microscope to obtain Figure 3 the microscopic image.

[0054] Sample 3

[0055] It is prepared by using an additive manufacturing device and method for copper alloy similar to that of Sample 1, the difference being that the power of the blue laser 41 is 1000 W. <q

[0056] Sample 4

[0057] It is prepared by using an additive manufacturing device and method for copper alloy similar to that of Sample 1, the difference being that the power of the blue laser 41 is 2500 W.

[0058] Sample 5

[0059] It is prepared by using an additive manufacturing device and method for copper alloy similar to that of Sample 1, the difference being that the blue laser 41 and the red laser 51 are simultaneously started to irradiate the molten pool 11.

[0060] Sample 6

[0061] It is prepared by using an additive manufacturing device and method for copper alloy similar to that of Sample 1, the difference being that the blue laser 41 is not used to irradiate the molten pool 11.

[0062] Sample 7

[0063] It is prepared by using an additive manufacturing device and method for copper alloy similar to that of Sample 1, the difference being that the particle size of the raw copper alloy powder is 50 μm.

[0064] Sample 8

[0065] It is prepared by using an additive manufacturing device and method for a copper alloy similar to that of Sample 1, with the differences being that the particle size of the raw copper alloy powder is 50 μm and the power of the blue laser 41 is 1000 W.

[0066] Sample 9

[0067] It is prepared by using an additive manufacturing device and method for a copper alloy similar to that of Sample 1, with the differences being that the additive manufacturing device for the copper alloy does not include a pulsed magnetic field generating mechanism 6, and during the additive manufacturing process, a pulsed magnetic field is not applied to the molten pool 11. For Sample 7, a microscopic electron microscope is used to observe its microscopic morphology to obtain Figure 4 the microscopic image.

[0068] By comparing the microstructures of Examples 1, 2, and 9 Figures 2 to 4 it can be found that: Figure 2 there are no obvious defects such as cracks and pores; Figure 3 in [Example 2], due to the reduction of the power of the blue laser 41, the effect of electrons in the copper alloy crossing the energy band gap and triggering interband transitions cannot be fully excited, and obvious or large unfused pores and other defects are formed in the microscopic components; Figure 4 in [Sample 9], due to the lack of using a pulsed magnetic field to regulate the molten pool 11, a relatively large number of large unfused pore defects are formed in the microstructure.

[0069] The density of Samples 1 to 9 is detected, and the statistical data in Table 1 below are obtained for comparative analysis.

[0070] Table 1 [[ID=)27]]

[0071]

[0072]

[0073] By comparing the densities of Samples 1 to 4, it can be found that as the power of the blue laser 41 increases, the effect of electrons in the copper alloy crossing the energy band gap and triggering interband transitions can be excited, thereby greatly improving the density of the copper alloy product. However, when the power of the blue laser 41 is too large (2500 W), the temperature of the molten pool 11 quickly exceeds the critical value (such as approaching the boiling point) during its formation, resulting in a possible decrease in the absorption rate of red and blue light due to plasma shielding or surface morphology changes on the surface of the molten pool 11, and thus the density of Sample 4 is reduced.

[0074] By comparing the density of Samples 1 and 5, it can be found that when the copper alloy material is sintered by the combined red and blue lasers, the instantaneous heat source applied to the copper alloy material is excessive, and at the same time, the effect of electrons crossing the energy band gap and causing interband transitions cannot be fully excited inside the copper alloy structure. Therefore, the density of Sample 5 is still not ideal. By comparing the density of Samples 1 and 6, it can be found that without first exciting the effect of electrons in the copper alloy to cross the energy band gap and cause interband transitions by the blue laser 41, it is difficult to effectively improve the absorption rate of the red laser 51 by the copper alloy molten pool 11, resulting in a decrease in the density of Sample 6.

[0075] By comparing the density of Samples 1, 7, and 8, it can be found that an increase in the powder particle size will affect the absorption rate of the copper alloy material for the red and blue lasers, thereby reducing the density of Sample 7. Therefore, reasonably increasing (Example 8) or decreasing the power of the blue laser 41 according to the powder particle size helps to improve the density of the sample.

[0076] By comparing the density of Samples 1 and 9, it can be found that since the absorption rate of copper for blue light in the solid state is significantly higher than that for infrared light, because its photon energy is close to the interband transition threshold of copper, causing electron resonance absorption. After the molten pool is formed, the absorption rate of liquid copper for red light increases with the increase in temperature. However, when the temperature exceeds the critical value (such as approaching the boiling point), the absorption rate may decrease due to plasma shielding or surface morphology changes on the surface of the molten pool. Therefore, a pulsed magnetic field is required as an external field to act on the molten pool to maintain the optimal temperature range, thereby effectively improving the density of the sample.

[0077] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A copper alloy dual-wavelength laser synergistic pulsed magnetic field additive manufacturing device, characterized in that, Comprising: A substrate (1) for additive manufacturing of a printed part thereon; A base (2) disposed directly above the substrate (1) and horizontally movable relative to the substrate (1); A powder feeding mechanism (3) disposed on the base (2) and feeding powder to the substrate (1); A first laser (4) disposed on the base (2) and emitting blue laser light (41) towards the substrate (1); A second laser (5) disposed on the base (2) and emitting red laser light (51) towards the substrate (1); Wherein, the blue laser light (41) irradiates the raw material and causes the powder to form a molten pool (11) on the substrate (1), and the red laser light (51) irradiates the molten pool (11) to input heat energy and expand the molten pool (11).

2. The additive manufacturing device for copper alloy with dual-wavelength laser collaborative pulse magnetic field according to claim 1, wherein, Further comprising: A pulsed magnetic field generating mechanism (6) disposed below the substrate (1) and horizontally movable relative to the substrate (1); Wherein, the pulsed magnetic field generating mechanism (6) moves synchronously with the base (2), and the pulsed magnetic field generating mechanism (6) applies a pulsed magnetic field towards the molten pool (11).

3. A method for additive manufacturing of copper alloy by dual-wavelength laser synergistic pulsed magnetic field, characterized in that: Using a copper alloy dual-wavelength laser synergistic pulsed magnetic field additive manufacturing device according to claim 2, comprising the following steps Step 1, establishing a three-dimensional model of the printed part and slicing and layering the three-dimensional model, and designing a laser scanning path and printing parameters during additive manufacturing; Step 2, setting the printing parameters and feeding powder to the substrate (1), first turning on the first laser (4) to emit blue laser light (41) to irradiate the powder, causing it to form a molten pool (11) on the substrate (1), and then turning on the second laser (5) to emit red laser light (51) to irradiate the molten pool (11), inputting heat energy to the molten pool (11) and expanding the molten pool (11); Step 3, after completing the additive manufacturing of the printed part according to the designed laser scanning path, first turning off the second laser (5) and then turning off the first laser (4).

4. A method for additive manufacturing of a copper alloy by dual-wavelength laser synergistic pulsed magnetic field according to claim 3, characterized in that: In step 2, the second laser (5) is turned on 1 s to 1.5 s after turning on the first laser (4); in step 3, the first laser (4) is turned off 1 s to 1.5 s after turning off the second laser (5).

5. A method for additive manufacturing of a copper alloy by dual-wavelength laser synergistic pulsed magnetic field according to claim 3, characterized in that: The power of the first laser (4) is 400 W to 1000 W, and the power of the second laser (5) is 3000 W to 6000 W.

6. A method for additive manufacturing of copper alloy by dual-wavelength laser synergistic pulsed magnetic field according to claim 5, characterized in that: The spot area of the blue laser light (41) is smaller than the spot area of the red laser light (51).

7. A method for additive manufacturing of a copper alloy by dual-wavelength laser synergistic pulsed magnetic field according to claim 6, characterized in that: The spot of the blue laser light (41) is not larger than the coverage area of the molten pool (11) on the substrate (1), and the spot of the blue laser light (41) covers the molten pool (11).

8. A method for additive manufacturing of copper alloy by dual-wavelength laser collaborative pulsed magnetic field according to claim 3, characterized in that: In step 2, after the molten pool (11) is formed on the substrate (1), the pulsed magnetic field generating mechanism (6) is turned on to apply a pulsed magnetic field towards the molten pool (11).

9. A method for additive manufacturing of copper alloy by dual-wavelength laser synergistic pulsed magnetic field according to claim 8, characterized in that: The pulsed magnetic field generating mechanism (6) simultaneously applies a transverse magnetic field and a radial rotating magnetic field to the molten pool (11).

10. A method for additive manufacturing of copper alloy by dual-wavelength laser synergistic pulsed magnetic field according to claim 9, characterized in that: The application direction of the transverse magnetic field is the parallel direction of the laser scanning path, and the application direction of the radial rotating magnetic field is perpendicular to the surface of the substrate (1).

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