Wave soldering equipment with self-adaptive PCB welding spot function

Abstract

The invention discloses wave-soldering equipment with a self-adaptive PCB welding spot function, and relates to the technical field of wave-soldering equipment. Comprising a machine frame, a conveying line is arranged on the machine frame, a plurality of circuit boards are sequentially borne on the conveying line, a visual camera and a confluence cylinder are sequentially installed on the two sides of the conveying line, a scaling powder spraying head, a heating pipe and a wave crest nozzle are sequentially installed on one side of the confluence cylinder on the lower portion, and a plurality of adsorption cylinders are arranged on the confluence cylinder. A first filter screen and a lifting plate are installed in the multiple adsorption barrels, a plurality of ribs are arranged on the first filter screen, the scaling powder spraying head is connected with a scaling powder tank, an extrusion plate is installed in the scaling powder tank in a sliding mode, scaling powder is arranged between the extrusion plate and the bottom of the scaling powder tank, and a cam is installed above the extrusion plate; the wave crest nozzle is connected with a welding fluid conveying system, through first cleaning treatment and second cleaning treatment, it is guaranteed that the first filter screen has the good filtering effect, and normal circuit board welding treatment is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of wave soldering equipment, and specifically relates to a wave soldering equipment with an adaptive PCB board solder joint function. Background Art

[0002] ‌In the field of electronic manufacturing, wave soldering technology, as the core soldering process for through-hole insertion (THT) and surface mount technology (SMT) mixed boards, directly affects the reliability of electronic products. Traditional wave soldering equipment generates a molten solder wave peak through a mechanical pump, enabling the solder joints at the bottom of the PCB board to come into contact with tin-lead or lead-free solder (such as SAC305) to complete soldering.

[0003] The existing circuit board wave soldering equipment mainly has the following problems: (1) There is no dust removal treatment for the circuit board, resulting in a low yield rate; (2) The flux is uneven, causing the spraying quality to fail to meet the soldering requirements; (3) It is impossible to achieve automatic circuit board wave soldering. Summary of the Invention

[0004] The purpose of the present invention is to provide a wave soldering equipment with an adaptive PCB board solder joint function to solve the problems raised in the prior art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A wave soldering equipment with an adaptive PCB board solder joint function, including a frame, on which a conveyor line is arranged, and a number of circuit boards are successively carried on the conveyor line. On both sides of the conveyor line, a vision camera and a confluence cylinder are successively installed. On one side of the lower confluence cylinder, a flux spraying head, a heating pipe, and a wave nozzle are successively installed. A number of adsorption cylinders are arranged on the confluence cylinder. A first filter screen and a lifting plate are installed in a number of the adsorption cylinders. A number of ribs are arranged on the first filter screen. The flux spraying head is connected to a flux tank. A pressing plate is slidably installed in the flux tank. Flux is provided between the pressing plate and the bottom of the flux tank. A cam is installed above the pressing plate. The wave nozzle is connected to a solder liquid delivery system.

[0006] Both the confluence cylinder and the adsorption cylinder are hollow inside. A confluence plate is arranged in the middle of the confluence cylinder. An inflow channel is arranged outside the confluence plate. An outflow channel is arranged in the middle of the confluence plate. A number of the inflow channels are provided. A second filter screen is arranged in the outflow channel. The inflow channel and the outflow channel are interconnected. The outflow channel is connected to the inlet of a negative pressure pump through a pipeline. The outlet of the negative pressure pump is connected to the external air; One end of each of the plurality of adsorption cylinders is provided with an adsorption port, and the other end of each of the plurality of adsorption cylinders is provided with a communication port. The lower side of the lifting plate is connected to the adsorption cylinder through a telescopic shaft. The telescopic shaft is arranged on the adsorption cylinder. The telescopic shaft is a telescopic structure. A lifting spring is connected between the bottom of the lifting plate and the adsorption cylinder. The lifting spring is electrically connected to the control system.

[0007] A fixed cylinder is arranged in the middle of the adsorption cylinder. The inside of the fixed cylinder is hollow. The fixed cylinder is communicated with the communication port. The communication port is communicated with the inflow channel through a pipeline. Both ends of the first filter screen are respectively connected to the fixed cylinder and the lifting plate. The longitudinal section of the first filter screen is funnel-shaped; Both the rib and the lifting plate are hollow inside. A plurality of air jet ports are arranged on the rib. One end of the rib is communicated with the inside of the lifting plate. A first mating port is arranged on the lifting plate. A second mating port is arranged on the adsorption cylinder opposite to the first mating port. The first mating port and the second mating port are arranged in cooperation. The second mating port is connected to the inlet of the vacuum pump through a pipeline. The outlet of the vacuum pump is communicated with the external air. The vacuum pump is installed on the frame. A blanking plate is arranged on the adsorption cylinder. The blanking plate and the adsorption cylinder are connected in a snap-fit manner.

[0008] The flux tank is installed on the frame. The inside of the flux tank is hollow. An air inlet and a liquid outlet are respectively arranged at both ends of the flux tank. The air inlet is connected to the nitrogen delivery system through a pipeline. The nitrogen delivery system is installed on the frame. The liquid outlet is connected to the flux spraying head through a pipeline; A driving motor is installed on the flux tank. The output end of the driving motor is connected with a transmission shaft. The transmission shaft is located inside the flux tank. A cam is installed on the transmission shaft. A plurality of protrusions are arranged on the opposite sides of the cam and the pressing plate. The protrusions on the cam and the protrusions on the pressing plate are arranged in cooperation.

[0009] A following cylinder is arranged under the pressing plate. The inside of the following cylinder is hollow. A plurality of following shafts are arranged on the inner wall of the following cylinder. The plurality of following shafts are spirally distributed; A stirring shaft is installed inside the following cylinder. A spiral groove is arranged on the outer side of the stirring shaft. The plurality of following shafts are inserted into the spiral groove. The following shafts and the spiral groove form a sliding connection. The bottom of the stirring shaft is rotatably installed on the flux tank. A plurality of stirring blades are arranged on the stirring shaft.

[0010] It includes two groups of linear modules. The flux spraying head and the wave soldering nozzle are respectively installed on two groups of moving plates. The two groups of moving plates are respectively installed on the two groups of linear modules. The two groups of linear modules respectively drive the flux spraying head and the wave soldering nozzle to move.

[0011] The heating tube is installed on the frame. A metal wire is arranged inside the heating tube. Both ends of the metal wire are electrically connected to the control system. A plurality of air blowing ports are arranged on the heating tube. The heating tube is connected to an extraction pump through a pipeline, and the extraction pump is installed on the frame.

[0012] There are two sets of the conveyor lines arranged oppositely. The conveyor line includes rollers, fixing plates and conveyor chains. The fixing plates are arranged on the frame. A plurality of rollers are provided, and all the plurality of rollers are installed on the fixing plates. The conveyor chains are sleeved on the plurality of rollers. A plurality of the circuit boards are sequentially placed on the conveyor chains of the two sets of conveyor lines.

[0013] The filtering effect of the second filter screen is better than that of the first filter screen; Electromagnetic valves and flow meters are installed in the air inlet and the liquid outlet, and the electromagnetic valves and the flow meters are electrically connected to the control system.

[0014] A sliding shaft is arranged on the outer side of the pressing plate. A return spring is connected between the sliding shaft and the flux tank. A sliding groove is arranged on the inner wall of the flux tank, and the sliding shaft slides in the sliding groove; A controller is arranged on the frame, and a control system is arranged inside the controller.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. The dust adsorption treatment on the circuit board is carried out to improve the finished product rate of wave soldering of the circuit board. The first filter screen has been turned from the original funnel shape to a conical shape. At this time, the lifting plate will move to the lowermost side, and the first pair of interfaces and the second pair of interfaces on the lifting plate are joined to form a continuous channel. The control system pressurizes the external air through the vacuum pump and transports it into the second pair of interfaces. The air is transported into the lifting plate through the second pair of interfaces and the first pair of interfaces. The air is transported inside the lifting plate to the ribs and sprayed outwards from the air jet ports on the ribs onto the first filter screen to blow off the remaining dust on the first filter screen, so as to realize the secondary cleaning treatment of the first filter screen. Through the first cleaning treatment and the secondary cleaning treatment, it is ensured that the first filter screen has a good filtering effect to ensure the normal circuit board soldering treatment, improve the qualified rate of circuit board soldering, and avoid the adverse impact of dust on circuit board soldering.

[0016] 2. Flux stirring treatment to ensure the uniformity of flux spraying. Through the cooperation of a cam and a return spring, the extrusion plate is continuously moved up and down, so that the flux is continuously transported into the flux spraying head. The follower cylinder moves up and down continuously following the extrusion plate, and the follower cylinder drives a number of follower shafts to move up and down continuously. Since the follower shafts are inserted into the spiral grooves, during the up and down movement of the follower shafts, the follower shafts drive the stirring shaft to rotate forward and backward continuously by a certain angle through the spiral grooves, and the stirring shaft drives the stirring blades to rotate forward and backward continuously by a certain angle. The stirring blades continuously stir the flux forward and backward, making the distribution of the flux more uniform, and thus making the sprayed flux more uniform.

[0017] 3. Two - stage dust treatment to ensure that the discharged air will not cause secondary impact on the circuit board. Large - particle dust is filtered through the first filter screen, and small - particle dust forms larger dust through van der Waals force and is filtered by the second filter screen to achieve secondary dust treatment, making the discharged air clean and avoiding the discharged air containing dust and causing secondary impact on the circuit board. Brief Description of the Drawings

[0018] Figure 1 is the schematic structural diagram of the whole invention; Figure 2 is the schematic structural diagram of the fixed plate in the invention; Figure 3 is the schematic structural diagram of the drum in the invention; Figure 4 is the schematic structural diagram of the vision camera in the invention; Figure 5 is the schematic structural diagram of the confluence cylinder in the invention; Figure 6 is the schematic structural diagram of the flux spray head in the invention; Figure 7 is the schematic structural diagram of the wave - peak nozzle in the invention; Figure 8 is the schematic structural diagram of the first filter screen in the invention; Figure 9 is Figure 8 the partial enlarged view of area A in Figure 10 is the schematic structural diagram of the inlet channel and the outlet channel in the invention; Figure 11 is the schematic structural diagram of the lifting spring in the invention; Figure 12 is the schematic structural diagram of the metal wire in the invention; Figure 13 is the schematic structural diagram of the stirring shaft in the invention; Figure 14 is the schematic structural diagram of the follower shaft in the invention.

[0019] In the figure: 1. Controller; 11. Frame; 12. Circuit board; 13. Vision camera; 14. Drum; 141. Fixed plate; 15. Moving plate; 2. Confluence cylinder; 21. Confluence plate; 211. Inflow channel; 212. Outflow channel; 213. Second filter screen; 3. Flux spraying head; 31. Flux tank; 311. Air inlet; 312. Liquid outlet; 32. Extrusion plate; 321. Following cylinder; 322. Following shaft; 323. Stirring shaft; 33. Cam; 34. Driving motor; 341. Transmission shaft; 4. Heating tube; 41. Metal wire; 42. Air blowing port; 5. Wave crest nozzle; 6. Adsorption cylinder; 61. First filter screen; 611. Rib; 62. Lifting plate; 621. Telescopic shaft; 63. Lifting spring; 64. Fixed cylinder. Detailed implementation mode

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] Embodiment: As Figures 1-14As shown in the figure, the present invention provides a technical solution for a wave soldering device with an adaptive PCB board soldering point function, including a frame 11 and two sets of linear modules. A conveyor line is arranged on the frame 11, and a number of circuit boards 12 are successively carried on the conveyor line. A vision camera 13 and a manifold 2 are successively installed on both sides of the conveyor line. On one side of the lower manifold 2, a flux spray head 3, a heating tube 4, and a wave nozzle 5 are successively installed. The heating tube 4 is installed on the frame 11. A metal wire 41 is arranged inside the heating tube 4, and both ends of the metal wire 41 are electrically connected to the control system. A number of air blowing ports 42 are arranged on the heating tube 4. The heating tube 4 is connected to an extraction pump (not shown in the figure) through a pipeline, and the extraction pump is installed on the frame 11. A number of adsorption cylinders 6 are arranged on the manifold 2. A first filter screen 61 and a lifting plate 62 are installed inside the number of adsorption cylinders 6. A number of ribs 611 are arranged on the first filter screen 61. The flux spray head 3 is connected to a flux tank 31. A pressing plate 32 is slidably installed inside the flux tank 31. Flux is arranged between the pressing plate 32 and the bottom of the flux tank 31. A cam 33 is installed above the pressing plate 32. The wave nozzle 5 is connected to a solder liquid delivery system (not shown in the figure). A controller 1 is arranged on the frame 11, and a control system is arranged inside the controller 1; there are two sets of conveyor lines arranged oppositely. The conveyor line includes rollers 14, fixing plates 141, and conveyor chains. The fixing plates 141 are arranged on the frame 11. A number of rollers 14 are provided, and all the number of rollers 14 are installed on the fixing plates 141. The conveyor chains are sleeved on the number of rollers 14. The number of circuit boards 12 are successively placed on the conveyor chains of the two sets of conveyor lines.

[0022] Both the manifold 2 and the adsorption cylinder 6 are hollow inside. A manifold plate 21 is arranged in the middle of the manifold 2. An inflow channel 211 is arranged outside the manifold plate 21. An outflow channel 212 is arranged in the middle of the manifold plate 21. A number of inflow channels 211 are provided. A second filter screen 213 is arranged inside the outflow channel 212. The inflow channel 211 and the outflow channel 212 are interconnected. The outflow channel 212 is connected to the inlet of a negative pressure pump (not shown in the figure) through a pipeline, and the outlet of the negative pressure pump is communicated with the external air; One end of each of the number of adsorption cylinders 6 is provided with an adsorption port, and the other end of each of the number of adsorption cylinders 6 is provided with a communication port. The lower side of the lifting plate 62 is connected to the adsorption cylinder 6 through a telescopic shaft 621. The telescopic shaft 621 is arranged on the adsorption cylinder 6. The telescopic shaft 621 is a telescopic structure. A lifting spring 63 is connected between the lifting plate 62 and the bottom of the adsorption cylinder 6. The lifting spring 63 is electrically connected to the control system.

[0023] A fixed cylinder 64 is arranged in the middle of the adsorption cylinder 6. The inside of the fixed cylinder 64 is hollow, and the fixed cylinder 64 is communicated with the communication port. The communication port is communicated with the inflow channel 211 through a pipeline. Both ends of the first filter screen 61 are respectively connected with the fixed cylinder 64 and the lifting plate 62. The longitudinal section of the first filter screen 61 is funnel-shaped; both the rib 611 and the lifting plate 62 are hollow inside. A number of air jet ports are arranged on the rib 611. One end of the rib 611 is communicated with the inside of the lifting plate 62. A first mating port (not shown in the figure) is arranged on the lifting plate 62. A second mating port (not shown in the figure) is arranged on the adsorption cylinder 6 opposite to the first mating port. The first mating port and the second mating port are arranged in cooperation. The second mating port is connected with the inlet of a vacuum pump (not shown in the figure) through a pipeline. The outlet of the vacuum pump is communicated with the external air. The vacuum pump is installed on the frame 11. A blanking plate is arranged on the adsorption cylinder 6. The blanking plate and the adsorption cylinder 6 are connected in a snap-fit manner.

[0024] After the first filter screen 61 has been working for a long time, dust will be deposited on its surface. It is necessary to clean the first filter screen 61. At this time, the staff removes the blanking plate and energizes the lifting spring 63 through the controller 1. After the lifting spring 63 is energized, it will shorten as a whole. The lifting spring 63 pulls the lifting plate 62 to move downward. The telescopic shaft 621 contracts as the lifting plate 62 moves. The lifting plate 62 drives the first filter screen 61 to turn downward, so that the first filter screen 61 is turned from the original funnel shape to a conical shape. While the first filter screen 61 is turning, the deposited dust is sheared, so that most of the dust falls as the first filter screen 61 turns, realizing the primary cleaning treatment of the first filter screen 61; When the lifting spring 63 is energized for a set time, the first filter screen 61 has been turned from the original funnel shape to a conical shape. At this time, the lifting plate 62 will move to the lowermost side. The first mating port and the second mating port on the lifting plate 62 are engaged with each other to form a continuous channel. The control system pressurizes the external air through the vacuum pump and transports it into the second mating port. The air is transported into the lifting plate 62 through the second mating port and the first mating port. The air is transported into the rib 611 through the inside of the lifting plate 62 and is sprayed out from the air jet ports on the rib 611 onto the first filter screen 61, blowing off the remaining dust on the first filter screen 61 to realize the secondary cleaning treatment of the first filter screen 61; The dust on the first filter screen 61 falls into the adsorption cylinder 6. The staff processes the dust in the adsorption cylinder 6 by removing the blanking plate. Through the primary cleaning treatment and the secondary cleaning treatment, it is ensured that the first filter screen 61 has a good filtering effect, so as to ensure the normal soldering treatment of the circuit board 12, improve the yield rate of the soldering of the circuit board 12, and avoid the adverse impact of dust on the soldering of the circuit board 12.

[0025] The solder flux tank 31 is installed on the frame 11. The interior of the solder flux tank 31 is hollow. An air inlet 311 and a liquid outlet 312 are respectively arranged at both ends of the solder flux tank 31. The air inlet 311 is connected to the nitrogen delivery system through a pipeline. The nitrogen delivery system is installed on the frame 11. The liquid outlet 312 is connected to the solder flux spray head 3 through a pipeline. A driving motor 34 is installed on the solder flux tank 31. The output end of the driving motor 34 is connected to a transmission shaft 341. The transmission shaft 341 is located inside the solder flux tank 31. A cam 33 is installed on the transmission shaft 341. A number of protrusions are arranged on the opposite sides of the cam 33 and the pressing plate 32. The protrusions on the cam 33 and the protrusions on the pressing plate 32 are arranged in a matching manner. The solder flux spray head 3 and the wave crest nozzle 5 are respectively installed on two sets of moving plates 15. The two sets of moving plates 15 are respectively installed on two sets of linear modules. The two sets of linear modules respectively drive the solder flux spray head 3 and the wave crest nozzle 5 to move.

[0026] A following cylinder 321 is arranged on the lower side of the pressing plate 32. The interior of the following cylinder 321 is hollow. A number of following shafts 322 are arranged on the inner wall of the following cylinder 321. The number of following shafts 322 is spirally distributed. A stirring shaft 323 is installed inside the following cylinder 321. A spiral groove is arranged on the outer side of the stirring shaft 323. The number of following shafts 322 is inserted into the spiral groove. The following shafts 322 and the spiral groove form a sliding connection. The bottom of the stirring shaft 323 is rotatably installed on the solder flux tank 31. A number of stirring blades are arranged on the stirring shaft 323. A sliding shaft is arranged on the outer side of the pressing plate 32. A return spring is connected between the sliding shaft and the solder flux tank 31. A sliding groove is arranged on the inner wall of the solder flux tank 31. The sliding shaft slides in the sliding groove.

[0027] During the process of nitrogen pushing the solder flux to be delivered to the solder flux spray head 3, through the cooperation of the cam 33 and the return spring, the pressing plate 32 is continuously moved up and down, so that the solder flux is continuously delivered into the solder flux spray head 3. And the following cylinder 321 follows the pressing plate 32 to continuously move up and down. The following cylinder 321 drives the number of following shafts 322 to continuously move up and down. Since the following shafts 322 are inserted into the spiral groove, during the up and down movement of the following shafts 322, the following shafts 322 drive the stirring shaft 323 to continuously rotate forward and backward by a certain angle through the spiral groove. The stirring shaft 323 drives the stirring blades to continuously rotate forward and backward by a certain angle. The stirring blades continuously stir the solder flux forward and backward, making the distribution of the solder flux more uniform, and further making the sprayed solder flux more uniform.

[0028] The filtering effect of the second filter screen 213 is better than that of the first filter screen 61. Solenoid valves and flow meters are installed in the air inlet 311 and the liquid outlet 312. The solenoid valves and the flow meters are electrically connected to the control system.

[0029] Working principle: Press the start button on the controller 1, and the wave soldering equipment starts. The staff sequentially place several circuit boards 12 on the conveyor chains of the two sets of conveyor lines. The control system drives the circuit board 12 to move to the right through several rollers 14 and the conveyor chain; When the circuit board 12 moves below the vision camera 13, the vision camera 13 identifies the welding positions of the circuit board 12 and identifies the sizes of the through holes that need to be welded on the circuit board 12. The control system then obtains data such as the solder joint positions and solder joint sizes of the circuit board 12.

[0030] When the circuit board 12 moves below the suction cylinder 6, the encoder in the roller 14 feeds back the displacement data of the circuit board 12 to the control system. The control system controls the operation of the negative pressure pump. Dust and air on the surface of the circuit board 12 enter through the suction port on the suction cylinder 6. After the dust and air enter the suction cylinder 6, large particles of dust are filtered by the first filter screen 61, and the large particles of dust are deposited on the first filter screen 61. Small particles of dust and air pass through the first filter screen 61 and enter the fixed cylinder 64. The small particles of dust and air are transported to the inlet flow channel 211 through the communication port and the pipeline. Since there are multiple inlet flow channels 211, after the small particles of dust flow out from the multiple inlet flow channels 211, they collide and converge at high speed in the outlet flow channel 212. Due to the action of the van der Waals force, the small particles of dust will form larger dust in the outlet flow channel 212. The larger dust is filtered by the second filter screen 213, and the air is discharged into the external atmosphere through the pipeline of the outlet flow channel 212 and the negative pressure pump; By adsorbing the dust on the surface of the circuit board 12, the adverse effects of dust on the welding process are reduced, and the yield of welding is improved; Large particles of dust are filtered through the first filter screen 61, and small particles of dust form larger dust through the van der Waals force and are filtered by the second filter screen 213 to achieve secondary treatment of the dust, making the discharged air clean and avoiding the secondary impact on the circuit board 12 caused by the dust-containing discharged air.

[0031] After the circuit board 12 is vacuumed by the suction cylinder 6, several rollers 14 continue to drive the circuit board 12 to move to the right, so that the circuit board 12 is located below the flux spraying head 3. At this time, the control system drives the moving plate 15 to move through the linear module close to the flux spraying head 3, and the moving plate 15 drives the flux spraying head 3 to move to the position where the circuit board 12 needs to be welded.

[0032] When the flux spraying head 3 moves to the position where the circuit board 12 needs to be welded, the linear module feeds back the displacement data of the flux spraying head 3 to the control system. The control system operates the drive motor 34, and the drive motor 34 drives the transmission shaft 341 to rotate a certain angle. The transmission shaft 341 drives the cam 33 to rotate a certain angle, and the protrusion on the cam 33 rotates a certain angle accordingly; When the protrusions on the cam 33 are away from the protrusions on the extrusion plate 32, the encoder in the drive motor 34 feeds back the rotation data of the cam 33 to the control system. The reset spring is released, and the reset spring pushes the extrusion plate 32 upward. At this time, the chamber between the extrusion plate 32 and the bottom of the flux tank 31 becomes larger to generate negative pressure. The control system simultaneously transports nitrogen into this chamber through the nitrogen delivery system and the air inlet 311. As the cam 33 continues to rotate, the protrusions on the cam 33 approach the protrusions on the extrusion plate 32. At this time, the protrusions on the cam 33 push the extrusion plate 32 downward. The extrusion plate 32 pushes the nitrogen downward. The nitrogen pushes the flux to be transported from the liquid outlet 312 and the pipeline to the flux spraying head 3, and then the flux is sprayed on the position of the circuit board 12 that needs to be soldered through the flux spraying head 3.

[0033] After the circuit board 12 is sprayed with flux through the flux spraying head 3, the linear module drives the flux spraying head 3 away from the circuit board 12 to prevent interference with the movement of the circuit board 12. The roller 14 continues to drive the circuit board 12 to move rightward to below the heating tube 4. The encoder in the roller 14 feeds back the displacement data of the circuit board 12 to the control system. The control system connects the metal wire 41 to the circuit and the extraction pump works. The extraction pump extracts external air into the heating tube 4. After the air is heated by the metal wire 41, it is sprayed on the circuit board 12 from the air blowing port 42 to realize the preheating treatment of the circuit board 12, which can evaporate the moisture in the flux, activate the flux to remove the oxides on the circuit board 12, and the circuit board 12 is preheated to reduce the thermal shock received by the circuit board 12 during soldering.

[0034] When the circuit board 12 is heated to the set time, the roller 14 continues to drive the circuit board 12 to move rightward, so that the circuit board 12 moves above the wave - peak nozzle 5. The encoder in the roller 14 feeds back the displacement data of the circuit board 12 to the control system. The control system drives the moving plate 15 to move through the linear module close to the wave - peak nozzle 5. The moving plate 15 drives the wave - peak nozzle 5 to move to the position of the circuit board 12 that needs to be soldered, and simultaneously transports the solder to the wave - peak nozzle 5 through the solder delivery system. The control system flexibly adjusts the wave - peak height and soldering time of the wave - peak nozzle 5 according to the different solder joint data detected by the vision camera 13 to complete high - quality soldering and realize the solder - joint self - adaptation of the circuit board 12.

[0035] After the wave - peak nozzle 5 finishes soldering the circuit board 12, the linear module close to the wave - peak nozzle 5 drives the moving plate 15 away from the circuit board 12. The moving plate 15 drives the wave - peak nozzle 5 away from the circuit board 12 to prevent interference with the movement of the circuit board 12. At this time, the roller 14 continues to drive the circuit board 12 to move rightward to discharge from the soldering equipment, and the staff removes the soldered circuit board 12.

[0036] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, in any aspect, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present invention. Any reference signs in the claims should not be construed as limiting the claims involved.

Claims

1. A wave soldering device with an adaptive PCB board solder joint function, characterized in that: It includes a frame (11) on which a conveyor line is provided. A number of circuit boards (12) are successively carried on the conveyor line. A vision camera (13) and a manifold (2) are successively installed on both sides of the conveyor line. On one side of the lower manifold (2), a flux spraying head (3), a heating pipe (4), and a wave nozzle (5) are successively installed. A number of suction cylinders (6) are provided on the manifold (2). A first filter screen (61) and a lifting plate (62) are installed in the number of suction cylinders (6). A number of ribs (611) are provided on the first filter screen (61). The flux spraying head (3) is connected to a flux tank (31). A pressing plate (32) is slidably installed in the flux tank (31). Flux is provided between the pressing plate (32) and the bottom of the flux tank (31). A cam (33) is installed above the pressing plate (32). The wave nozzle (5) is connected to a solder liquid delivery system.

2. The wave soldering equipment with an adaptive PCB board solder joint function according to claim 1, wherein: Both the manifold (2) and the suction cylinder (6) are hollow inside. A manifold plate (21) is provided in the middle of the manifold (2). An inlet channel (211) is provided outside the manifold plate (21). An outlet channel (212) is provided in the middle of the manifold plate (21). A number of the inlet channels (211) are provided. A second filter screen (213) is provided in the outlet channel (212). The inlet channel (211) and the outlet channel (212) are interconnected. The outlet channel (212) is connected to the inlet of a negative pressure pump through a pipe. The outlet of the negative pressure pump is connected to the external air. One end of each of the number of suction cylinders (6) is provided with a suction port, and the other end of each of the number of suction cylinders (6) is provided with a communication port. The lower side of the lifting plate (62) is connected to the suction cylinder (6) through a telescopic shaft (621). The telescopic shaft (621) is provided on the suction cylinder (6). The telescopic shaft (621) is a telescopic structure. A lifting spring (63) is connected between the lifting plate (62) and the bottom of the suction cylinder (6). The lifting spring (63) is electrically connected to a control system.

3. The wave soldering equipment with an adaptive PCB board solder joint function according to claim 2, characterized in that: A fixed cylinder (64) is provided in the middle of the suction cylinder (6). The fixed cylinder (64) is hollow inside. The fixed cylinder (64) is communicated with the communication port. The communication port is connected to the inlet channel (211) through a pipe. Both ends of the first filter screen (61) are respectively connected to the fixed cylinder (64) and the lifting plate (62). The longitudinal section of the first filter screen (61) is in a funnel shape. The rib (611) and the lifting plate (62) are both hollow inside. A plurality of air jet nozzles are provided on the rib (611). One end of the rib (611) is in communication with the inside of the lifting plate (62). A first mating port is provided on the lifting plate (62). A second mating port is provided on the adsorption cylinder (6) opposite to the first mating port. The first mating port and the second mating port are matingly arranged. The second mating port is connected to the inlet of a vacuum pump through a pipeline. The outlet of the vacuum pump is in communication with the external air. The vacuum pump is installed on the frame (11). A blanking plate is provided on the adsorption cylinder (6). The blanking plate and the adsorption cylinder (6) are connected in a snap-fit manner.

4. The wave soldering equipment with an adaptive PCB board solder joint function according to claim 3, characterized in that: The flux tank (31) is installed on the frame (11). The flux tank (31) is hollow inside. An air inlet (311) and a liquid outlet (312) are respectively provided at both ends of the flux tank (31). The air inlet (311) is connected to a nitrogen delivery system through a pipeline. The nitrogen delivery system is installed on the frame (11). The liquid outlet (312) is connected to a flux spraying head (3) through a pipeline. A drive motor (34) is installed on the flux tank (31). The output end of the drive motor (34) is connected to a transmission shaft (341). The transmission shaft (341) is located inside the flux tank (31). A cam (33) is installed on the transmission shaft (341). A plurality of protrusions are provided on the side of the cam (33) and the pressing plate (32) facing each other. The protrusions on the cam (33) and the protrusions on the pressing plate (32) are matingly arranged.

5. The wave soldering equipment with an adaptive PCB board solder joint function according to claim 4, wherein: A following cylinder (321) is provided on the lower side of the pressing plate (32). The following cylinder (321) is hollow inside. A plurality of following shafts (322) are provided on the inner wall of the following cylinder (321). The plurality of following shafts (322) are spirally distributed. A stirring shaft (323) is installed inside the following cylinder (321). A spiral groove is provided on the outer side of the stirring shaft (323). The plurality of following shafts (322) are inserted into the spiral groove. The following shafts (322) and the spiral groove form a sliding connection. The bottom of the stirring shaft (323) is rotatably installed on the flux tank (31). A plurality of stirring blades are provided on the stirring shaft (323).

6. The wave soldering equipment with the function of self - adapting to PCB board solder joints according to claim 5, comprising two groups of linear modules, characterized in that: The flux spraying head (3) and the wave crest nozzle (5) are respectively installed on two groups of moving plates (15). The two groups of moving plates (15) are respectively installed on two groups of linear modules.

7. The wave soldering equipment with an adaptive PCB board solder joint function according to claim 6, characterized in that: The heating tube (4) is installed on the frame (11). A metal wire (41) is provided inside the heating tube (4). Both ends of the metal wire (41) are electrically connected to a control system. A plurality of air blowing ports (42) are provided on the heating tube (4). The heating tube (4) is connected to a pumping pump through a pipeline. The pumping pump is installed on the frame (11).

8. The wave soldering equipment with an adaptive PCB board solder joint function according to claim 7, characterized in that: There are two sets of the conveyor lines arranged oppositely. The conveyor line includes rollers (14), fixing plates (141) and conveyor chains. The fixing plates (141) are arranged on the frame (11). A plurality of rollers (14) are provided, and the plurality of rollers (14) are all installed on the fixing plates (141). The conveyor chains are sleeved on the plurality of rollers (14). A plurality of the circuit boards (12) are sequentially placed on the conveyor chains of the two sets of conveyor lines.

9. A wave soldering device with an adaptive PCB board solder joint function according to claim 8, characterized in that: The filtering effect of the second filter screen (213) is better than that of the first filter screen (61); Electromagnetic valves and flow meters are installed in the air inlet (311) and the liquid outlet (312), and the electromagnetic valves and the flow meters are electrically connected to the control system.

10. The wave soldering equipment with an adaptive PCB board solder joint function according to claim 9, characterized in that: A sliding shaft is arranged outside the pressing plate (32). A return spring is connected between the sliding shaft and the flux tank (31). A sliding groove is arranged on the inner wall of the flux tank (31), and the sliding shaft slides in the sliding groove; A controller (1) is arranged on the frame (11), and a control system is arranged in the controller (1).

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