Unequal-thickness glass, preparation method thereof and electronic display device

Abstract

The invention relates to the technical field of glass processing, in particular to unequal-thickness glass, a preparation method thereof and an electronic display device. The preparation method of the unequal-thickness glass comprises the following steps that a glass substrate is provided, and the surface of the glass substrate comprises a non-preset etching area and a preset etching area; performing yellow light process treatment on the surface of the glass substrate, and forming a protective film on a non-preset etching area on the glass substrate; carrying out at least one time of etching treatment on the surface, where the non-preset etching area is formed, of the glass substrate by adopting an etching agent, so that the preset etching area on the surface of the glass substrate is etched to form a groove, and preparing unequal-thickness glass; the etching agent is prepared from the following components in parts by mass: 1 to 55 parts of hydrofluoric acid, 1 to 20 parts of potassium chloride and 100 parts of solvent. The unequal-thickness glass prepared by the preparation method provided by the invention has relatively long bending life and relatively high product yield, and is suitable for large-scale production.

Description

Technical Field

[0001] The present application relates to the technical field of glass processing, and particularly relates to an unequal-thickness glass, a preparation method thereof, and an electronic display device. Background Art

[0002] With the continuous development of electronic products such as smart phones and tablet computers towards foldable and thinner directions, increasingly stringent requirements are imposed on the performance of flexible cover materials that match them. Currently, flexible glass has more excellent wear resistance, bendability, and transmittance compared to transparent polyimide, and thus has received extensive attention.

[0003] The thickness of ultra-thin flexible glass is less than 0.1 mm. Currently, products with relatively uniform overall thickness are usually prepared by two methods: one-time forming and secondary thinning. However, as the thickness decreases, the ultra-thin flexible glass inevitably has problems such as a decrease in mechanical properties such as impact resistance due to the pursuit of an extremely thin thickness.

[0004] In view of the above-mentioned disadvantages of ultra-thin flexible glass, unequal-thickness glass has emerged. The unequal-thickness glass is provided with grooves on the glass, and the grooves can be bent to reduce the local stress concentration problem during bending, thereby improving its durability. Currently, the main preparation methods of unequal-thickness glass are as follows: (1) An etching solution channel for guiding the etching solution to flow through the area to be etched is arranged above the glass to be processed, and the etching solution is introduced into the etching solution channel; this method uses the flow direction of the etching solution to control the etching area, so it is necessary to strictly control the flow direction of the etching solution, and there are disadvantages of high precision and being not conducive to large-scale production; (2) Mechanical methods such as laser cutting or polishing are used, and combined with a chemical thinning process to obtain unequal-thickness flexible glass; during the mechanical processing of the above methods, glass debris will inevitably be generated, which easily causes micro-scratches or cracks on the glass, affecting the product yield. Summary of the Invention

[0005] Based on this, the present application provides an unequal-thickness glass, a preparation method thereof, and an electronic display device. The unequal-thickness glass prepared by the preparation method provided by the present application has a high bending life, a high product yield, and is suitable for large-scale production.

[0006] In the first aspect of the present application, a preparation method of an unequal-thickness glass is provided, including the following steps:

[0007] Provide a glass substrate, the surface of the glass substrate including a non-preset etching area and a preset etching area;

[0008] Perform a yellow light process on the surface of the glass substrate to form a protective film on the non-preset etching area of the glass substrate;

[0009] Etch the surface of the glass substrate with a non - preset etching area at least once using an etchant, so that the preset etching area on the surface of the glass substrate is etched to form grooves, and the unequal - thickness glass is prepared.

[0010] Wherein, by mass parts, the etchant includes 1 part to 55 parts of hydrofluoric acid, 1 part to 20 parts of potassium chloride, and 100 parts of a solvent.

[0011] In one embodiment, the preparation method has one or more of the following characteristics:

[0012] (1) The temperature of the etching treatment is 20°C to 40°C;

[0013] (2) The etching rate of the etching treatment is 0.01 μm / min to 2 μm / min.

[0014] In one embodiment, the steps of performing a yellow - light process on the surface of the glass substrate include:

[0015] Form a developable layer and an electron - beam resist layer on the surface of the glass substrate in sequence to prepare a photoresist layer;

[0016] Expose and develop the photoresist layer to remove the photoresist layer in the preset etching area on the surface of the glass substrate, and form a protective film on the non - preset etching area on the glass substrate.

[0017] In one embodiment, the material of the developable layer includes one or more of polymethyl methacrylate, lysine - 2 - oxoglutarate dehydrogenase, m - cresol formaldehyde resin, polystyrene, and polycarbonate.

[0018] In one embodiment, the electron - beam resist layer has one or more of the following characteristics:

[0019] (1) The electron - beam resist layer is positive, and the material of the electron - beam resist layer includes one or more of polycarbonate ester amide, polymethacrylic acid, polystyrene sulfonate, and glycidyl methacrylate polymethacrylate;

[0020] (2) The electron - beam resist layer is negative, and the material of the electron - beam resist layer includes one or more of polyethylene oxide, polydimethylsiloxane, and polyurethane acrylate.

[0021] In one embodiment, after each step of etching the surface of the glass substrate with a non - preset etching area using an etchant, the following steps are further included:

[0022] Perform a pickling treatment on the surface of the glass substrate with a non - preset etching area.

[0023] In one embodiment, in the step of pickling treatment, the pickling solution used, by mass parts, includes 40 parts to 55 parts of sulfuric acid, 0.5 part to 2 parts of hydrofluoric acid, and 100 parts of water.

[0024] In one embodiment, the preparation method has one or more of the following features:

[0025] (1) By chemical composition, in the glass substrate, the mass fraction of Al2O3 is 20% to 50%;

[0026] (2) The thickness of the glass substrate is 45 μm to 55 μm.

[0027] In the second aspect of the present application, an unequal-thickness glass is provided, which is prepared by the preparation method according to any one of the first aspects of the present application; the unequal-thickness glass includes a glass substrate, and grooves are provided on at least one surface of the glass substrate;

[0028] Optionally, the unequal-thickness glass has one or more of the following features:

[0029] (1) The minimum thickness of the unequal-thickness glass is 10 μm to 35 μm;

[0030] (2) The maximum thickness of the unequal-thickness glass is 45 μm to 55 μm.

[0031] In the third aspect of the present application, an electronic display device is provided, including the unequal-thickness glass according to the second aspect of the present application.

[0032] The beneficial effects of the preparation method of the unequal-thickness glass provided by the present application at least include:

[0033] The preparation method of the unequal-thickness glass provided by the present application first performs a yellow light process on the glass substrate. At this time, a protective film will be formed on the non-preset etching area of the glass substrate, which can effectively block the erosion of the etchant and ensure that the glass surface of the non-preset etching area is not damaged. Further, hydrofluoric acid and potassium chloride are used in combination in the etchant, and the two cooperate with each other to make the etching more uniform and stable, and reduce the etching roughness, so as to ensure the display effect of the unequal-thickness glass and improve the bending life at the groove.

[0034] Furthermore, the preparation method provided by the present application avoids the use of methods such as mechanical cutting, has a good product yield, and has a simple process, which is suitable for large-scale production. Description of the Drawings

[0035] Figure 1 It is a side view of the unequal-thickness glass provided by the present application;

[0036] Figure 2This is the front view of the unequal-thickness glass provided by this application.

[0037] In the figure, 10 is the unequal-thickness glass, 100 is the glass substrate, and 200 is the groove. Detailed implementation manners

[0038] The following further describes the unequal-thickness glass, its preparation method, and the electronic display device of this application in a more complete and clear manner with reference to specific embodiments. This application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosed content of this application more thorough and comprehensive.

[0039] The unequal-thickness glass, also known as "UFG" glass, has a shape with a thinner middle and thicker edges. The unequal-thickness glass can reduce the local stress concentration during the folding of the flexible screen, make the crease smoother, and improve its durability.

[0040] Currently, the preparation methods of the unequal-thickness glass mainly include one-time forming, machining, and chemical etching, etc., to form grooves in the folding area of the flexible glass. However, the above methods all have deficiencies, such as glass breakage caused by mechanical stress, and the groove shape and processing rate are difficult to control, resulting in a reduction in the bending effect or bending life of the glass.

[0041] Based on this, in the first aspect of this application, a preparation method of an unequal-thickness glass is provided, including the following steps:

[0042] S20. Provide a glass substrate, the surface of the glass substrate includes a non-preset etching area and a preset etching area; perform a yellow light process on the surface of the glass substrate to form a protective film on the non-preset etching area of the glass substrate.

[0043] S30. Use an etchant to perform at least one etching process on the surface of the glass substrate where the non-preset etching area is formed, so that the preset etching area on the surface of the glass substrate is etched to form a groove, and prepare the unequal-thickness glass.

[0044] In one example, in step S30, by mass, the etchant includes 1 part to 55 parts of hydrofluoric acid, 1 part to 20 parts of potassium chloride, and 100 parts of a solvent.

[0045] The present application has found that the components of the etchant play an important role in forming the depth of the groove and the bendable life. The etchant selected by the present application uses hydrofluoric acid as the main etching component. Its low content can achieve a slower etching rate, which is conducive to fine control of the etching process to improve the preparation accuracy of the groove. Potassium chloride of a specific mass fraction helps to adjust the performance of the etchant, control the diffusion and reaction rate of the etchant on the surface of the glass substrate, and make the etching process more uniform to ensure the performance stability of glass of unequal thickness. In addition, potassium chloride in the etchant provided by the present application may also change the wettability of the etchant on the glass surface, making it easier for the etchant to spread and penetrate in the preset etching area, while in the non-preset etching area, due to the combined action of the protective film and potassium chloride, it is more difficult to adhere and react, thereby further improving the selectivity of the etching. The selectivity of the pre-etched area can be enhanced.

[0046] It is understandable that in the present application's etching agent, the mass fraction of hydrofluoric acid can be selected from any numerical value between 1 part ~ 55 parts. For example, the mass fraction of hydrofluoric acid includes but is not limited to 1 part, 2 parts, 5 parts, 8 parts, 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 32 parts, 35 parts, 38 parts, 40 parts, 42 parts, 45 parts, 48 parts, 50 parts, 52 parts or 55 parts, or in the range that any two of the above-mentioned points are constituted as endpoint values. It is understandable that in the present application's etching agent, the mass fraction of potassium chloride can be selected from any numerical value between 1 part ~ 20 parts. For example, the mass fraction of potassium chloride includes but is not limited to 1 part, 5 parts, 10 parts, 12 parts, 15 parts, 18 parts or 20 parts, or in the range that any two of the above-mentioned points are constituted as endpoint values.

[0047] In this application, unless otherwise specified, "hydrofluoric acid" refers to hydrofluoric acid with a mass fraction of 40%.

[0048] In one example, the solvent is water.

[0049] In one example, in step S30, the etching temperature of the etching process is 20°C~40°C. The present application found that when the temperature of the etching process is within the above range, a relatively stable etching activity can be maintained to avoid excessive volatilization, decomposition or side reactions of the etchant, thereby improving the selectivity of the etching effect. For example, the temperature of the etching process includes but is not limited to 20°C, 22°C, 24°C, 26°C, 28°C, 30°C, 32°C, 34°C, 36°C, 38°C or 40°C, or within the range of any two of the above point values.

[0050] In one example, in step S30, the etching rate of the etching process is 0.01 μm / min to 2 μm / min. It is found in this application that an unequal-thickness glass with a thin groove area and good flexibility can be prepared at the etching rate of the etching process, and at the same time, it can ensure that the glass in the non-preset etching area has sufficient thickness and strength. Exemplarily, the etching rate of the etching process includes but is not limited to 0.01 μm / min, 0.05 μm / min, 0.08 μm / min, 0.1 μm / min, 0.3 μm / min, 0.5 μm / min, 0.7 μm / min, 0.9 μm / min, 1 μm / min, 1.2 μm / min, 1.4 μm / min, 1.6 μm / min, 1.8 μm / min or 2 μm / min, or within the range formed by any two of the above point values as the end point values.

[0051] Exemplarily, the etching rate of the etching process is represented by V, and the unit is μm / min.

[0052] In one example, the etching thickness h of a single etching process is 1 μm to 5 μm. It is found in this application that sequential etching is beneficial to reducing the etching roughness and improving the bending life at the groove. Exemplarily, the etching thickness h of a single etching process includes but is not limited to 1 μm, 2 μm, 3 μm, 4 μm or 5 μm, or within the range formed by any two of the above point values as the end point values. It can be understood that the etching thickness h of a single etching process satisfies the following relational expression: h = T×V. Wherein, T is the time of a single etching process, and the unit is min; V is the etching rate of the etching process, and the unit is μm / min.

[0053] It can be understood that the number of etching processes n satisfies the following relational expression: n = H / h, and n is a positive integer. It can be understood that when H / h is 4.1, n takes the value of 5.

[0054] In one example, the step of performing a yellow light process on the surface of the glass substrate includes:

[0055] S201. Sequentially form a developer-soluble layer and an electron beam resist layer on the surface of the glass substrate to prepare a photoresist layer.

[0056] S202. Perform exposure and development on the photoresist layer to remove the photoresist layer in the preset etching area on the surface of the glass substrate, and form a protective film on the non-preset etching area on the glass substrate.

[0057] In one example, in step S201, the material of the developer-soluble layer includes one or more of polymethyl methacrylate, lysine-2-ketoglutarate dehydrogenase, m-cresol formaldehyde resin, polystyrene, and polycarbonate.

[0058] In one example, in step S202, the electron beam resist layer is positive, and the material of the electron beam resist layer includes one or more of polycarbonate ester amide, polymethacrylic acid, polystyrene sulfonate, and glycidyl methacrylate.

[0059] In one example, the electron beam resist layer is negative, and the material of the electron beam resist layer includes one or more of polyethylene oxide, polydimethylsiloxane, and polyurethane acrylate.

[0060] In one example, in step S30, after each step of etching the surface of the glass substrate where the non - preset etching area is formed with an etchant, the following steps are further included:

[0061] A step of pickling the surface of the glass substrate where the non - preset etching area is formed.

[0062] In one example, in the step of pickling, the pickling solution, by mass fraction, includes 40 parts to 55 parts of sulfuric acid, 0.5 parts to 2 parts of hydrofluoric acid, and 100 parts of water. Exemplarily, the mass fraction of sulfuric acid includes, but is not limited to, 40 parts, 42 parts, 43 parts, 44 parts, 45 parts, 47 parts, 49 parts, or 50 parts. The mass fraction of hydrofluoric acid includes, but is not limited to, 0.5 parts, 0.7 parts, 0.9 parts, 1 part, 1.2 parts, 1.4 parts, 1.5 parts, 1.6 parts, 1.8 parts, 1.9 parts, or 2 parts.

[0063] In this application, unless otherwise specified, "sulfuric acid" refers to a sulfuric acid solution with a mass fraction of 50%.

[0064] Pickling treatment can remove some etchant components, reaction products, and unreacted impurities that may remain on the surface of the glass substrate during the etching process, making the surface of the glass substrate cleaner and providing a good foundation for subsequent process steps. In addition, after pickling to remove surface impurities, the surface purity of the glass substrate is improved to ensure the transparency of the unequal - thickness glass.

[0065] In one example, before the step of performing a yellow light process on the surface of the glass substrate, the following steps are further included:

[0066] S10: Fix the glass substrate; clean the fixed glass substrate.

[0067] Understandably, in step S10, the glass substrate is fixed, and at this time, the surface of the glass substrate that has not undergone the yellow light process treatment is fixed to the backplane. In this way, the movement of the glass substrate during the yellow light process treatment, etching treatment, or pickling treatment can be avoided. Exemplarily, the method of fixing the surface of the glass substrate that has not undergone the yellow light process treatment to the backplane includes, but is not limited to, dispensing. The dispensing fixing method can not only ensure the bonding between the glass substrate and the backplane, but also be easily peeled off after the preparation is completed, improving the feasibility of batch preparation. Further, in step S10, the cleaning method includes, but is not limited to, ultrasonic cleaning.

[0068] In one example, after the step of preparing the unequal-thickness glass, the following steps are further included:

[0069] S40. A step of post-treating the unequal-thickness glass.

[0070] Further, in step S40, the post-treatment steps include, but are not limited to, one or more of water washing treatment, water bath separation, immersion cleaning, and finished product inspection.

[0071] In one example, the post-treatment steps include sequentially performing water washing treatment, water bath separation, immersion cleaning, and finished product inspection.

[0072] Exemplarily, the process parameters of the water washing treatment include: the water washing temperature is 30°C to 35°C. The water washing treatment can remove the chemical reagents used in the etching treatment and pickling treatment to avoid the corrosive effect of the chemical reagent residues on the glass. It is found in this application that by performing the water washing treatment at 30°C to 35°C, the movement of water molecules can be ensured, making it easy for water molecules to penetrate and wash away the impurities and acid solution residues on the surface of the unequal-thickness glass.

[0073] Exemplarily, the process parameters of the water bath separation include: the water bath temperature is 85°C to 95°C. The high-temperature water bath at 85°C to 95°C can reduce the viscosity of substances such as the binder between the unequal-thickness glass and the backplane, and intensify the molecular movement, making it easier to peel off the unequal-thickness glass from the backplane; and the peeling process can be completed in a shorter time, improving production efficiency. Further, the equipment for performing the water bath separation includes, but is not limited to, a tank-type water bath equipment.

[0074] Exemplarily, the equipment for immersion cleaning includes, but is not limited to, a tank-type cleaning machine.

[0075] In one example, the glass substrate is high-aluminum glass. Exemplarily, in terms of chemical composition, in the glass substrate, the mass fraction of Al2O3 is 20% to 50%. It is found in this application that compared with other types of glass, the high-aluminum glass has a more excellent bending life after being thinned by the preparation method of this application and can be effectively applied to electronic display panels.

[0076] In one example, the thickness of the glass substrate is 45 μm to 55 μm. It is found in this application that by pre-thinning the glass to a thickness range between 45 μm and 55 μm and then performing an etching process, the etching efficiency can be improved.

[0077] Furthermore, the method for preparing the unequal-thickness glass provided in this application includes the following steps:

[0078] P100. Fix one side surface of the glass substrate and the backplane by using a dispensing process; perform ultrasonic cleaning on the fixed glass substrate.

[0079] P200. Perform a yellow light process on the side surface of the glass substrate that is not fixed to the backplane. Specifically, a developable layer and an electron beam resist layer are sequentially formed on the side surface of the glass substrate that is not fixed to the backplane to prepare a photoresist layer.

[0080] P300. Perform exposure and development on the photoresist layer to remove the photoresist layer in the preset etching area on the surface of the glass substrate, and form a protective film on the non-preset etching area on the glass substrate.

[0081] P400. Perform at least one etching process on the side surface of the glass substrate where the non-preset etching area is formed by using an etchant, so that the preset etching area on the surface of the glass substrate is etched to form a groove. Specifically, after each step of performing an etching process on the side surface of the glass substrate where the non-preset etching area is formed by using an etchant, a pickling process step for the side surface of the glass substrate where the non-preset etching area is formed is further included to prepare the unequal-thickness glass.

[0082] P500. Perform post-treatment steps of water washing, water bath separation, immersion cleaning, and finished product inspection on the unequal-thickness glass. The post-treatment steps include: performing water washing on the unequal-thickness glass at 30°C to 35°C. Performing water bath separation at 85°C to 95°C through a tank-type water bath device to peel the unequal-thickness glass and the backplane. Performing immersion cleaning on the unequal-thickness glass through a tank-type cleaning machine. Then performing finished product inspection.

[0083] In the second aspect of this application, an unequal-thickness glass is provided, which is prepared by the preparation method described in any item of the first aspect of this application.

[0084] Refer to Figure 1 and Figure 2 , in one example, the unequal-thickness glass 10 includes a glass substrate 100, and a groove 200 is provided on at least one side surface of the glass substrate 100.

[0085] In one example, the glass substrate 100 has an upper surface and a lower surface which are oppositely arranged, and side walls located between the upper surface and the lower surface. Among them, a groove 200 is provided on the upper surface of the glass substrate 100, and both sides of the groove 200 communicate with the side walls of the glass substrate 100.

[0086] In one example, the minimum thickness of the unequal-thickness glass is 10 μm to 35 μm. Exemplarily, the minimum thickness includes but is not limited to 10 μm, 15 μm, 20 μm, 25 μm, 30 μm or 35 μm.

[0087] It can be understood that the minimum thickness of the unequal-thickness glass is the difference between the thickness of the glass substrate and the thickness etched in the preset etching area. Exemplarily, Figure 1 in which, the minimum thickness of the unequal-thickness flexible glass is denoted as H1.

[0088] In one example, the maximum thickness of the unequal-thickness glass is 45 μm to 55 μm. Exemplarily, the maximum thickness includes but is not limited to 45 μm, 50 μm or 55 μm.

[0089] It can be understood that the maximum thickness of the unequal-thickness glass is the thickness of the glass substrate; or the thickness of the non-preset etching area of the glass substrate. Exemplarily, Figure 1 in which, the maximum thickness of the unequal-thickness flexible glass is denoted as H2.

[0090] In the third aspect of the present application, an electronic display device is provided, including the unequal-thickness glass described in the second aspect of the present application.

[0091] The following further specific embodiments are used to elaborate the present application in detail. It should also be understood that the following embodiments are only used to further illustrate the present application and cannot be construed as limiting the protection scope of the present application. Some non-essential improvements and adjustments made by those skilled in the art based on the above content of the present application all fall within the protection scope of the present application. The specific process parameters and the like in the following embodiments are also only an example within a suitable range, that is, those skilled in the art can make selections within a suitable range through the description in this article, and do not necessarily have to be limited to the specific values in the following embodiments.

[0092] Embodiment 1

[0093] Embodiment 1 provides an unequal-thickness glass and a preparation method thereof, including the following steps:

[0094] Unequal-thickness glass: One side surface of the unequal-thickness glass has a strip-shaped groove, the groove depth is about 20 μm, the maximum thickness of the unequal-thickness glass is 50 μm, and the minimum thickness of the unequal-thickness glass is about 30 μm.

[0095] The preparation process steps of the unequal-thickness glass include:

[0096] (1) Take a pre-etched and thinned high-aluminum glass substrate (with a thickness of 50 μm). The high-aluminum glass substrate has a first surface and a second surface arranged opposite to each other. Fix the second surface of the high-aluminum glass substrate and the backplane by using a dispensing process; perform ultrasonic cleaning on the fixed glass substrate.

[0097] (2) Perform a yellow light process treatment on the first surface of the high-aluminum glass substrate. Among them, it includes sequentially forming a developer-soluble layer (with a thickness of 2 - 3 μm) and an electron beam resist layer (with a thickness of 2 - 3 μm) on the first surface of the high-aluminum glass substrate to prepare a photoresist layer.

[0098] (3) Perform exposure and development treatments on the photoresist layer to remove the photoresist layer in the preset etching area on the first surface of the high-aluminum glass substrate, and form a protective film on the non-preset etching area on the glass substrate.

[0099] (4) Use an etchant (wherein, the etchant includes 40 parts of hydrofluoric acid, 10 parts of potassium chloride, and 100 parts of water) to perform multiple micro-etching treatments on the side surface of the high-aluminum glass substrate where the non-preset etching area is formed (the temperature of the micro-etching treatment is 30 °C, and the rate of the micro-etching treatment is 1 μm / min), so that the preset micro-etching area on the surface of the glass substrate is etched to form a groove, and prepare the unequal-thickness glass. Among them, the etching thickness of a single micro-etching treatment is 5 μm, the etching time of a single micro-etching treatment is 5 min, and the number of micro-etching treatments is about 4 times.

[0100] After each step of using the etchant to perform a micro-etching treatment on the side surface of the glass substrate where the non-preset micro-etching area is formed, it further includes a step of performing pickling treatment on the side surface of the glass substrate where the non-preset micro-etching area is formed (in the step of the pickling treatment, the pickling solution includes, by mass, 50 parts of sulfuric acid, 1 part of hydrofluoric acid, and 100 parts of water).

[0101] (5) Perform post-treatment steps of water washing treatment, water bath separation, immersion cleaning, and finished product inspection on the unequal-thickness glass. Among them, the post-treatment steps include: performing water washing treatment on the unequal-thickness glass at 30 °C - 35 °C. Perform water bath separation at 85 °C - 95 °C through a tank-type water bath device to peel off the unequal-thickness glass and the backplane. Perform immersion cleaning on the unequal-thickness glass through a tank-type cleaning machine. Then perform finished product inspection.

[0102] Example 2

[0103] Example 2 is basically the same as Example 1. The main difference is that the etchant used in step (4) in Example 2 and the process parameters of the number of etching treatments are different from those in Example 1; step (4) of Example 2 is:

[0104] (4) Use an etchant (wherein, the etchant includes 30 parts of hydrofluoric acid, 6 parts of potassium chloride, and 100 parts of water) to perform multiple micro-etching treatments on one side surface of the high-aluminum glass substrate where a non-preset etching area is formed (the temperature of the micro-etching treatment is 35 °C, and the rate of the micro-etching treatment is 0.6 μm / min), so that the preset micro-etching area on the surface of the glass substrate is etched to form grooves, and an unequal-thickness glass is prepared.

[0105] Among them, the etching thickness of a single micro-etching treatment is 3 μm, the etching time of a single micro-etching treatment is 5 min, and the number of micro-etching treatments is about 7 times.

[0106] Example 3

[0107] Example 3 is basically the same as Example 1. The main difference is that the etchant used in step (4) in Example 3 and the process parameters of the number of etching treatments are different from those in Example 1; step (4) of Example 3 is as follows:

[0108] (4) Use an etchant (wherein, the etchant includes 20 parts of hydrofluoric acid, 6 parts of potassium chloride, and 100 parts of water) to perform multiple micro-etching treatments on one side surface of the high-aluminum glass substrate where a non-preset etching area is formed (the temperature of the micro-etching treatment is 40 °C, and the rate of the micro-etching treatment is 0.5 μm / min), so that the preset micro-etching area on the surface of the glass substrate is etched to form grooves, and an unequal-thickness glass is prepared.

[0109] Among them, the etching thickness of a single micro-etching treatment is 4 μm, the etching time of a single micro-etching treatment is 8 min, and the number of micro-etching treatments is about 5 times.

[0110] Comparative Example 1

[0111] Comparative Example 1 is basically the same as Example 1. The main difference is that the etchant used in step (4) in Comparative Example 1 and the process parameters of the number of etching treatments are different from those in Example 1; step (4) of Comparative Example 1 is as follows:

[0112] (4) Use an etchant (wherein, the etchant includes 65 parts of hydrofluoric acid, 25 parts of potassium chloride, and 100 parts of water) to perform multiple micro-etching treatments on one side surface of the high-aluminum glass substrate where a non-preset etching area is formed (the temperature of the micro-etching treatment is 30 °C, and the rate of the micro-etching treatment is 1.5 μm / min), so that the preset micro-etching area on the surface of the glass substrate is etched to form grooves, and an unequal-thickness glass is prepared.

[0113] Among them, the etching thickness of a single micro-etching treatment is 5 μm, the etching time of a single micro-etching treatment is 3.33 min, and the number of micro-etching treatments is about 4 times.

[0114] Performance test:

[0115] Place the unequal-thickness glasses prepared in the examples and comparative examples in a bending device with a bending radius of 1.0 mm. Set the low temperature at -20°C, the bending angle at 180°, and the bending radius at 1.0 mm. Record the bending life of the unequal-thickness glasses. The specific test results are shown in Table 1:

[0116] Table 1

[0117]

[0118] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as within the scope described in this specification.

[0119] The above-described embodiments only represent several implementation manners of the present application, which are convenient for understanding the technical solutions of the present application specifically and in detail, but should not be construed as a limitation on the protection scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can be made, and these all belong to the protection scope of the present application. It should be understood that the technical solutions obtained by those skilled in the art through logical analysis, reasoning or limited experiments based on the technical solutions provided in the present application are all within the protection scope of the appended claims of the present application. Therefore, the protection scope of the patent of the present application should be subject to the content of the appended claims, and the specification can be used to explain the content of the claims.

Claims

1. A method for preparing glass with unequal thicknesses, characterized in that, It includes the following steps: Provide a glass substrate, the surface of which includes a non - preset etching area and a preset etching area; Perform a yellow light process on the surface of the glass substrate to form a protective film on the non - preset etching area of the glass substrate; Use an etchant to perform at least one etching process on the surface of the glass substrate with a non - preset etching area, so that the preset etching area on the surface of the glass substrate is etched to form a groove, and prepare the unequal - thickness glass; Wherein, by mass fraction, the etchant includes 1 part to 55 parts of hydrofluoric acid, 1 part to 20 parts of potassium chloride, and 100 parts of a solvent.

2. The preparation method of the glass with unequal thickness according to claim 1, characterized in that, The preparation method has one or more of the following characteristics: (1) The temperature of the etching process is 20°C to 40°C; (2) The rate of the etching process is 0.01 μm / min to 2 μm / min.

3. The preparation method of the glass with unequal thickness according to claim 1, characterized in that, The step of performing a yellow light process on the surface of the glass substrate includes: Form a developable layer and an electron beam resist layer on the surface of the glass substrate in sequence to prepare a photoresist layer; Perform exposure and development on the photoresist layer to remove the photoresist layer on the preset etching area of the surface of the glass substrate, and form a protective film on the non - preset etching area of the glass substrate.

4. The method for preparing the glass with unequal thickness according to claim 3, characterized in that, The material of the developable layer includes one or more of polymethyl methacrylate, lysine - 2 - ketoglutarate dehydrogenase, m - cresol formaldehyde resin, polystyrene, and polycarbonate.

5. The method for preparing the glass with unequal thickness according to claim 3 or 4, characterized in that, The electron beam resist layer has one or more of the following characteristics: (1) The electron beam resist layer is positive, and the material of the electron beam resist layer includes one or more of polycarbonate ester amide, polymethacrylic acid, polystyrene sulfonate, and glycidyl methacrylate; (2) The electron beam resist layer is negative, and the material of the electron beam resist layer includes one or more of polyethylene oxide, polydimethylsiloxane, and polyurethane acrylate.

6. The preparation method of the unequal-thickness glass according to any one of claims 1 to 4, characterized in that, After each step of using an etchant to perform an etching process on the surface of the glass substrate with a non - preset etching area, it further includes: The step of performing pickling on the surface of the glass substrate with a non - preset etching area.

7. The manufacturing method of the glass with unequal thickness according to claim 6, characterized in that In the step of pickling, the pickling solution, by mass fraction, includes 40 parts to 55 parts of sulfuric acid, 0.5 part to 2 parts of hydrofluoric acid, and 100 parts of water.

8. The preparation method of the unequal-thickness glass according to any one of claims 1 to 4, characterized in that, The preparation method has one or more of the following characteristics: (1) By chemical composition, in the glass substrate, the mass fraction of Al2O3 is 20% to 50%; (2) The thickness of the glass substrate is 45 μm to 55 μm.

9. An unequal-thickness glass, characterized in that, Prepared by the preparation method according to any one of claims 1 to 8; the unequal - thickness glass includes a glass substrate, and grooves are provided on at least one side surface of the glass substrate; Optionally, the unequal - thickness glass has one or more of the following characteristics: (1) The minimum thickness of the unequal - thickness glass is 10 μm to 35 μm; (2) The maximum thickness of the unequal - thickness glass is 45 μm to 55 μm.

10. An electronic display device, characterized in that, It includes the unequal - thickness glass according to claim 9.

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