Antistatic epoxy encapsulation film, preparation method thereof and filter chip encapsulation structure

Abstract

The application provides an antistatic epoxy packaging film and a preparation method and a filter chip packaging structure thereof, and relates to the technical field of filter chip packaging. The antistatic epoxy packaging film comprises the following components in percentage by mass: 46-60% of silica, 17-25% of epoxy resin, 2-5% of phenoxy resin, 18-24% of phenolic curing agent, 0.3-0.5% of imidazole type accelerator and 0.2-0.3% of carbon black. The epoxy resin is composed of bisphenol F type epoxy resin and antistatic epoxy resin, the antistatic epoxy resin contains single-walled carbon nanotubes, the molecular weight of the phenoxy resin is 50000-53000, and the phenolic curing agent is composed of solid phenolic resin and liquid phenolic resin. The antistatic epoxy packaging film is prepared by introducing the antistatic epoxy resin and adopting a specific formula ratio, has excellent antistatic property and mechanical property, and after the filter chip is packaged, the packaged filter products that are intact and qualified can be quickly screened through a sorting machine.

Description

Technical Field

[0001] The present invention belongs to the technical field of filter chip packaging, and in particular relates to an antistatic epoxy packaging film and a preparation method thereof, and a filter chip packaging structure. Background Art

[0002] After the filter is encapsulated with epoxy resin film, it is marked and cut into single packaged filter chips. During the sorting process, due to the good insulation properties of the epoxy resin film and its large surface resistance, it is easy to be adsorbed on the machine due to static electricity during the rotation and friction of the sorting machine, making it impossible to select normally, affecting production efficiency and even making it impossible to continue with the subsequent processes.

[0003] At present, the surface resistance of epoxy resin film is 10 14 ~10 18 Ω, which makes it have good insulation properties, but the surface resistance value is high, and its charge discharge speed is slow, resulting in a longer time for the charge to be released through the surface of the material. The accumulation of surface charge will lead to problems such as static discharge, dust absorption and static adsorption. To make the epoxy resin film have antistatic properties, the surface resistance value must be between 10 9 ~10 12 The Ω resistance can be improved by adding antistatic agents, conductive fillers, conductive fibers, graphite, etc. to the epoxy resin matrix. However, the impact of the antistatic material on the epoxy resin matrix must be carefully considered when adding it. Therefore, how to provide an antistatic epoxy encapsulation film that, by adjusting the formulation ratio, imparts antistatic properties to the epoxy encapsulation film, ensuring normal operation during the sorting process without compromising its original performance, is an urgent problem for those skilled in the art. Summary of the Invention

[0004] The object of the present invention is to provide an antistatic epoxy packaging film and a preparation method thereof, and a filter chip packaging structure, so as to solve at least one of the above-mentioned technical problems.

[0005] To achieve the above objectives, the first aspect of the present invention provides an antistatic epoxy packaging film, which comprises the following components by mass percentage: 46% to 60% silicon dioxide, 17% to 25% epoxy resin, 2% to 5% phenoxy resin, 18% to 24% phenolic curing agent, 0.3% to 0.5% imidazole accelerator, and 0.2% to 0.3% carbon black; the epoxy resin is composed of bisphenol F epoxy resin and antistatic epoxy resin, and the antistatic epoxy resin contains single-walled carbon nanotubes; the phenoxy resin has a molecular weight of 50,000 to 53,000, and the phenolic curing agent is composed of solid phenolic resin and liquid phenolic resin.

[0006] In the first aspect, the epoxy encapsulation film comprises the following components in mass percentage: 50-60% of silica, 17-23% of bisphenol F type epoxy resin, 0.5-2% of antistatic epoxy resin, 2-5% of phenoxy resin, 18-24% of phenolic curing agent, 0.3-0.5% of imidazole type accelerator, and 0.2-0.3% of carbon black; the phenolic curing agent is composed of solid phenolic resin and liquid phenolic resin.

[0007] In the first aspect, the mass ratio of the solid phenolic resin to the liquid phenolic resin is 2:1.

[0008] In the first aspect, the hydroxyl equivalent weight of the solid phenolic epoxy resin is 165-177 g / eq, and the hydroxyl equivalent weight of the liquid phenolic epoxy resin is 130-152 g / eq.

[0009] In the first aspect, the epoxy equivalent weight of the bisphenol F type epoxy resin is 150-166 g / eq, and the epoxy equivalent weight of the antistatic epoxy resin is 210-250 g / eq.

[0010] In the first aspect, the particle size D50 of the silica is 6 μm, and the particle size D99 is 20 μm.

[0011] In the first aspect, the imidazole type accelerator comprises 2-methylimidazole.

[0012] The second aspect of the present application provides a preparation method of the antistatic epoxy encapsulation film of the first aspect, which comprises: stirring and mixing the raw material components according to their respective mass percentages, grinding the mixed components into a paste through a bead mill, and then vacuum degassing to obtain a slurry, coating the slurry on a base film through a coating machine, and removing the base film after drying to obtain an antistatic epoxy encapsulation film; the thickness of the antistatic epoxy encapsulation film is 200-300 μm.

[0013] The third aspect of the present application provides an encapsulation method of a filter chip packaging structure, which comprises: stirring and mixing, bead milling, and vacuum degassing the components in the antistatic epoxy encapsulation film of the first aspect to obtain a mixed slurry; coating the mixed slurry on a base film and drying to obtain an antistatic epoxy encapsulation film on the base film; covering the antistatic epoxy encapsulation film on the top and four sides of the filter chip and adhering to the underlying substrate by vacuum hot pressing to complete the encapsulation of the filter chip; the conditions of vacuum hot pressing include a pressure of 0.1-0.2 MPa, a temperature of 60-70℃, and a time of 10-30 s; and cutting the encapsulated filter chip structure to obtain a single encapsulated filter product.

[0014] The fourth aspect of the present application provides a filter chip packaging structure, which comprises a filter component, a substrate and the antistatic epoxy packaging film of the first aspect, the filter component is connected with the substrate through a plurality of spaced metal balls to form a cavity, and the antistatic epoxy packaging film is covered on the filter component and adhered to the substrate below by vacuum hot pressing.

[0015] Advantages:

[0016] The present application provides an antistatic epoxy packaging film, which comprises the following components in mass percentage: 46-60% of silica, 17-25% of epoxy resin, 2-5% of phenoxy resin, 18-24% of phenolic curing agent, 0.3-0.5% of imidazole accelerator and 0.2-0.3% of carbon black; the epoxy resin is composed of bisphenol F epoxy resin and antistatic epoxy resin, the antistatic epoxy resin contains single-walled carbon nanotubes; the molecular weight of the phenoxy resin is 50000-53000, and the phenolic curing agent is composed of solid phenolic resin and liquid phenolic resin; the bisphenol F epoxy resin and the antistatic epoxy resin are used as matrix materials to provide basic properties for the system and form a conductive network in the system, effectively transfer and disperse charges, prevent static accumulation and achieve the antistatic effect; meanwhile, the phenoxy resin is combined to improve the toughness and strength of the system, and the phenolic curing agent composed of solid phenolic resin and liquid phenolic resin is used to react with the matrix material to ensure that the performance of the antistatic epoxy packaging film meets the requirements of filter chip packaging. The present application introduces the antistatic epoxy resin and uses a specific formula ratio to prepare an antistatic epoxy packaging film, which has excellent antistatic property and mechanical property, and after the filter chip is packaged, the packaged filter products that are complete and qualified can be quickly screened out by a sorting machine. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0018] Figure 1 The flowchart of the packaging method of the filter chip packaging structure provided by the present application is shown in the figure.

[0019] Figure 2 The structural diagram of the filter chip packaging structure provided by the present application is shown in the figure.

[0020] Reference signs:

[0021] 1. Filter components; 2. Substrate; 3. Antistatic epoxy packaging film; 4. Metal ball; 5. Cavity. DETAILED DESCRIPTION

[0022] The present invention will be described in detail below in conjunction with specific embodiments and examples, and the advantages and various effects of the present invention will be more clearly presented. It should be understood by those skilled in the art that these specific embodiments and examples are for illustrating the present invention, rather than for limiting the present invention.

[0023] Throughout this specification, unless otherwise specified, the terms used herein should be understood as having the same meaning as commonly used in the art. Therefore, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In the event of any conflict, the present specification shall take precedence.

[0024] Unless otherwise specified, various raw materials, reagents, instruments and equipment used in the present invention can be purchased from the market or obtained through existing methods.

[0025] The present application provides an antistatic epoxy packaging film, which comprises the following components in mass percentage: 46% to 60% silicon dioxide, 17% to 25% epoxy resin, 2% to 5% phenoxy resin, 18% to 24% phenolic curing agent, 0.3% to 0.5% imidazole accelerator, and 0.2% to 0.3% carbon black; the epoxy resin is composed of bisphenol F epoxy resin and antistatic epoxy resin, and the antistatic epoxy resin contains single-walled carbon nanotubes; the molecular weight of the phenoxy resin is 50,000 to 53,000, and the phenolic curing agent is composed of solid phenolic resin and liquid phenolic resin.

[0026] Specifically, the present invention provides an antistatic epoxy packaging film, which comprises the following components by mass percentage: 46% to 60% silicon dioxide, 17% to 25% epoxy resin, 2% to 5% phenoxy resin, 18% to 24% phenolic curing agent, 0.3% to 0.5% imidazole accelerator, and 0.2% to 0.3% carbon black; the epoxy resin is composed of bisphenol F epoxy resin and antistatic epoxy resin, and the antistatic epoxy resin contains single-walled carbon nanotubes; the molecular weight of the phenoxy resin is 50,000 to 53,000, The phenolic curing agent is composed of a solid phenolic resin and a liquid phenolic resin. By using bisphenol F epoxy resin and antistatic epoxy resin as matrix materials, basic performance is provided for the system, and a conductive network is formed in the system to effectively transfer and disperse charges, prevent static electricity accumulation, and achieve an antistatic effect. At the same time, a phenoxy resin is combined to improve the toughness and strength of the system. The phenolic curing agent composed of solid phenolic resin and liquid phenolic resin reacts with the matrix material to ensure that the performance of the antistatic epoxy encapsulation film meets the requirements of filter chip encapsulation. The present invention introduces antistatic epoxy resin and adopts a specific formula ratio to prepare an antistatic epoxy encapsulation film with excellent antistatic and mechanical properties. After the filter chip is encapsulated, a sorting machine can be used to quickly screen out filter products with intact and qualified encapsulation.

[0027] In some possible embodiments, the epoxy encapsulation film includes the following components by mass percentage: 50% to 60% silicon dioxide, 17% to 23% bisphenol F epoxy resin, 0.5% to 2% antistatic epoxy resin, 2% to 5% phenoxy resin, 18% to 24% phenolic curing agent, 0.3% to 0.5% imidazole accelerator, and 0.2% to 0.3% carbon black; the phenolic curing agent is composed of solid phenolic resin and liquid phenolic resin.

[0028] Specifically, the present invention selects a bisphenol F epoxy resin with a mass percentage of 17% to 23% and an antistatic epoxy resin with a mass percentage of 0.5% to 2%. By adding a small amount of antistatic epoxy resin to the epoxy system, the surface resistance of the material can be reduced, resulting in the epoxy encapsulation film having good antistatic properties and improving subsequent sorting efficiency. The antistatic epoxy resin containing single-walled carbon nanotubes can be used in its pre-dispersion form to simplify the processing of the single-walled carbon nanotubes, avoiding the problem of poor compatibility with other raw materials. The single-walled carbon nanotubes in the antistatic epoxy resin can be evenly dispersed in the system without changing the viscosity of the system. Furthermore, the unique one-dimensional quantum structure of the single-walled carbon nanotubes can be utilized. The carbon atoms are mainly sp² hybridized, forming a large number of delocalized π bonds, allowing electrons to move freely within them and having good conductivity. At the same time, the single-walled carbon nanotubes have an extremely high aspect ratio, which makes them easily contact each other in the material to form a conductive network, thereby effectively transferring and dispersing charges, preventing static electricity accumulation, and achieving an antistatic effect. The filter chips with intact packaging and qualified quality can then be quickly screened out by a sorting machine.

[0029] In some possible embodiments, the mass ratio of the solid phenolic resin to the liquid phenolic resin is 2:1.

[0030] In some possible embodiments, the hydroxyl equivalent weight of the solid novolac epoxy resin is 165 to 177 g / eq; and the hydroxyl equivalent weight of the liquid novolac epoxy resin is 130 to 152 g / eq.

[0031] In this application, the curing agent is compounded by solid phenolic resin and liquid phenolic resin in a mass ratio of 2:1. This ratio can control the viscosity of the system, so that silica and carbon black can be evenly dispersed in the system, thereby improving the flatness of the film surface after curing.

[0032] In some possible embodiments, the epoxy equivalent of the bisphenol F epoxy resin is 150 to 166 g / eq; and the epoxy equivalent of the antistatic epoxy resin is 210 to 250 g / eq.

[0033] In some possible embodiments, the silica has a particle size D50 of 6 μm and a particle size D99 of 20 μm.

[0034] In some possible embodiments, the imidazole accelerator includes 2-methylimidazole.

[0035] In the present application, the epoxy equivalent of the epoxy resin and the hydroxyl equivalent of the curing agent are defined, which facilitates the regulation of the curing reaction and further regulates the reaction rate in combination with the imidazole promoter; further, the silica is used as the filler, and by controlling the particle size of the silica, the thermal expansion coefficient of the antistatic epoxy packaging film is reduced, so as to improve the adhesion with the filter component, thereby avoiding the foreign matter into the cavity of the filter component, affecting the packaging reliability of the filter chip.

[0036] Based on one general inventive concept, the present application further provides a preparation method of the antistatic epoxy packaging film of the first aspect, which comprises: stirring and mixing each component of raw materials according to their respective mass percentages, grinding the mixed components into a colloidal substance through a bead mill, and then obtaining a slurry through vacuum degassing, coating the slurry on a base film through a coating machine, removing the base film after drying, and obtaining the antistatic epoxy packaging film; the thickness of the antistatic epoxy packaging film is 200-300 μm.

[0037] Based on one general inventive concept, please refer to Figure 1 , the present application further provides a packaging method of a filter chip packaging structure, which comprises:

[0038] S1, stirring and mixing each component of the antistatic epoxy packaging film of the first aspect, bead milling and vacuum degassing to obtain a mixed slurry;

[0039] S2, coating the mixed slurry on a base film and drying, i.e. obtaining an antistatic epoxy packaging film on the base film;

[0040] S3, covering the antistatic epoxy packaging film on the top and four sides of the filter chip structure and adhering to the underlying substrate by vacuum hot pressing, completing the packaging of the filter chip structure; the conditions of vacuum hot pressing include: pressure of 0.1-0.2 MPa, temperature of 60-70℃, and time of 10-30 s;

[0041] S4, cutting the packaged filter chip structure to obtain a packaged single filter finished product.

[0042] Specifically, the present invention mixes the raw material components according to a specific formula ratio, and after bead milling and vacuum degassing, obtains a uniformly dispersed mixed slurry, and then coats the mixed slurry on a base film for drying to obtain an antistatic epoxy encapsulation film on the base film. Then, the antistatic epoxy encapsulation film is covered on the top and around the filter chip structure to be encapsulated by vacuum hot pressing and is bonded to the substrate below to complete the encapsulation of the filter chip structure. Finally, the encapsulated filter chip structure is cut and a sorting machine is used to screen out qualified, qualified single filter products. In addition, antistatic epoxy encapsulation films of different thicknesses can be prepared according to different epoxy used.

[0043] Based on a general inventive concept, please refer to Figure 2 The present application also provides a filter chip packaging structure, which includes: a filter component 1, a substrate 2, and the antistatic epoxy packaging film 3 described in the first aspect. The filter component 1 is connected to the substrate 2 through a number of spaced metal balls 4 to form a cavity 5. The antistatic epoxy packaging film 3 is covered on the top and around the filter component 1 by vacuum hot pressing and is bonded to the substrate 2 below.

[0044] The present application will be further described below in conjunction with specific examples. It should be understood that these examples are intended to illustrate the present application only and are not intended to limit the scope of the present application. The experimental methods in the following examples where specific conditions are not specified are usually measured in accordance with national standards. If there are no corresponding national standards, then the methods are carried out in accordance with general international standards, conventional conditions, or according to the conditions recommended by the manufacturer.

[0045] The raw materials used in the embodiments and comparative examples are as follows:

[0046] Bisphenol F epoxy resin: Nan Ya Epoxy Resin (Kunshan) Co., Ltd.: NPEF-170;

[0047] Antistatic epoxy resin: Dalian Liansheng New Materials Group Co., Ltd.: LSE-107;

[0048] Phenoxy resin: Mitsubishi Chemical: 1256;

[0049] Solid phenolic resin: Shandong Shengquan New Materials Co., Ltd.: SH-4064;

[0050] Liquid phenolic resin: MEWA Chemical: MTH-8000;

[0051] Accelerator: Jinan Zhongwei Chemical Co., Ltd.: 2-MI;

[0052] Antistatic agent: Nanbao Advanced Materials Co., Ltd.: S-20;

[0053] Conductive carbon black: CABOT: XC72;

[0054] Carbon black: Orion (China) Investment Co., Ltd.;

[0055] Silicon dioxide: Jiangsu Lianrui New Materials Co., Ltd.

[0056] The raw material components in Examples 1-5 and Comparative Examples 1-8 of this application are shown in Table 1-2 below in terms of mass percentage:

[0057] Table 1 Distribution ratio of each group of raw materials in the embodiment

[0058]

[0059] Table 2 Distribution ratio of each group of raw materials in the comparative example

[0060]

[0061] The performance test of the epoxy encapsulation films provided in Examples 1-5 and Comparative Examples 1-8 was performed, and the specific test process is as follows:

[0062] 1. Surface resistance: Reference standard: GB / T33398: Cut a 90×90mm film material, heat transfer it to a thickness of 1000-1200μm on a hot plate at 100℃, and then cure it at 150℃ / 2H. After curing, use a resistance meter to test the surface resistance value, measure it three times at different positions and take the maximum value;

[0063] 2. Membrane tensile strength: Cut a 10mm×50mm film material, tear off the light release film, stick the two ends of the sample with tape, clamp the tape at both ends of the universal material testing machine, tear off the heavy release film, and test the tensile strength of the film;

[0064] 3. Storage modulus: Reference standard: ASTM E2254-2018, take a sample that is fully cured at 150℃ / 2H, the size of the test sample is 55mm×10mm×2mm, measurement mode: dual cantilever mode, vibration frequency: 1Hz, amplitude: 10μm, heating rate: 5℃ / min, and the storage modulus is the value at 25℃;

[0065] 4. Glass transition temperature Tg: Reference standard: ASTM E2254-2018, take a sample that is fully cured at 150℃ / 2H, prepare a test sample with a size of 55mm×10mm×2mm, and use DMA for measurement, measurement mode: dual cantilever mode, vibration frequency: 1Hz, amplitude: 10μm, heating rate: 5℃ / min;

[0066] 5. Water absorption rate: Cut a 50mm×50mm film material, weigh it after curing at 150℃ / 2h (initial weight), then immerse the cured film sample vertically and completely in a glass container filled with 25±1℃ distilled water. After soaking for 24h, take it out, wipe off the surface moisture and weigh it immediately (wet weight). Calculate the water absorption rate according to the following formula:

[0067] Water absorption rate = (wet weight − initial weight) / initial weight × 100%;

[0068] 6. Rheological test: Cut a 50×50mm film material, heat transfer it to a thickness of 1000-1200μm on a hot plate at 100℃, and then cut it into discs with a diameter of 20mm. Test its viscosity with a rheometer. Set the fixing force to 2N and use the heating program: 25℃ to 150℃, heating rate: 5℃ / min, and read the rheological viscosity at 60℃ and 70℃.

[0069] The test results are shown in Table 3 below:

[0070] Table 3 Test results

[0071]

[0072] From the above table we can see that:

[0073] (1) In Comparative Example 1, no antistatic epoxy resin is used. In Comparative Example 2, the amount of antistatic epoxy resin added is relatively low, and the surface resistance of the prepared epoxy encapsulation film is relatively high, which fails to achieve the antistatic effect and affects the subsequent sorting process of the filter chip. In Comparative Example 3, the amount of antistatic epoxy resin added is relatively high. Although the prepared epoxy encapsulation film has a relatively low surface resistance, its rheological viscosity increases significantly, and it is easy to have poor embedding during vacuum hot pressing, resulting in the epoxy encapsulation film being unable to fit with the substrate, and foreign matter easily entering the cavity, affecting the normal operation of the filter chip. Therefore, in this application, it is necessary to control the addition ratio of the antistatic epoxy resin;

[0074] (2) Comparative Examples 4 and 5 did not use antistatic epoxy resin, but chose to add antistatic agent S-20 to the system. From the experimental data, it can be seen that more antistatic agent needs to be added so that the prepared epoxy encapsulation film can meet the antistatic requirements. However, its corresponding rheological viscosity will also drop sharply, causing the glue to penetrate into the filter cavity during the vacuum hot pressing stage, affecting the normal operation of the filter chip;

[0075] (3) Comparative Examples 6 and 7 did not use antistatic epoxy resin. Instead, conductive carbon black, an antistatic material, was added to the system. Experimental data show that even if the proportion of conductive carbon black added was much greater than that of antistatic epoxy resin, the surface resistance of the prepared epoxy encapsulation film was still relatively large, and the filter chips were not screened using a subsequent sorting machine.

[0076] (4) Although the addition ratio of the antistatic epoxy resin in Comparative Example 8 is within the specified range, the addition ratios of silicon dioxide, bisphenol F epoxy resin and phenolic curing agent are not within the specified range. Although the surface resistance value of the prepared epoxy encapsulation film can meet the use requirements, the rheological viscosity is low and the water absorption rate is high. During the vacuum hot pressing stage, the glue liquid easily penetrates into the filter cavity, affecting the normal operation of the filter chip. Furthermore, in Comparative Examples 4-8, the water absorption rate of the epoxy encapsulation film is relatively high. Water molecules easily diffuse from the outside through the epoxy encapsulation film into the filter chip, causing damage to the filter chip.

[0077] (5) The addition amount of the antistatic epoxy resin in Examples 1-5 is 0.5%-2%. The surface resistance of the epoxy encapsulation film can be reduced by an extremely low addition ratio, and the rheological viscosity, film tensile strength and storage modulus of the epoxy encapsulation film are all within the required range of use, and there will be no problems of poor embedding or severe glue seepage during the vacuum hot pressing stage.

[0078] To sum up, the present application uses a specific formula composition and adjusts the ratio between the raw material components to make the prepared epoxy encapsulation film have excellent anti-static properties, which can solve the problem of electrostatic adsorption in the subsequent sorting stage, and can be completely bonded to the surface and substrate of the filter chip structure in the vacuum hot pressing stage to form a cavity, preventing foreign matter from penetrating the cavity, thereby improving the reliability and life of the filter chip packaging.

[0079] Finally, it should be noted that the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0080] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0081] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. An antistatic epoxy packaging film, characterized in that: The antistatic epoxy packaging film comprises the following components by mass percentage: 50% to 60% silicon dioxide, 17% to 23% bisphenol F epoxy resin, 0.5% to 2% antistatic epoxy resin, 2% to 5% phenoxy resin, 18% to 24% phenolic curing agent, 0.3% to 0.5% imidazole accelerator, and 0.2% to 0.3% carbon black; the antistatic epoxy resin contains single-walled carbon nanotubes; the phenoxy resin has a molecular weight of 50,000 to 53,000, and the phenolic curing agent is composed of solid phenolic resin and liquid phenolic resin; The mass ratio of the solid phenolic resin to the liquid phenolic resin is 2:1; The hydroxyl equivalent of the solid phenolic resin is 165 to 177 g / eq; the hydroxyl equivalent of the liquid phenolic resin is 130 to 152 g / eq; The epoxy equivalent of the bisphenol F epoxy resin is 150 to 166 g / eq; the epoxy equivalent of the antistatic epoxy resin is 210 to 250 g / eq; The imidazole accelerator includes 2-methylimidazole.

2. The antistatic epoxy packaging film according to claim 1, characterized in that: The silica has a particle size D50 of 6 μm and a particle size D99 of 20 μm.

3. A method for preparing the antistatic epoxy packaging film according to any one of claims 1 to 2, characterized in that: The preparation method comprises: The raw material components are stirred and mixed according to their respective mass percentages, and the mixed components are ground into a colloid by a bead mill. Then, the mixed components are vacuum degassed to obtain a slurry, and the slurry is coated on a base film by a coater. After drying, the base film is removed to obtain an antistatic epoxy packaging film; the thickness of the antistatic epoxy packaging film is 200-300 μm.

4. A packaging method for a filter chip packaging structure, characterized in that: The packaging method comprises: Stirring and mixing the components of the antistatic epoxy encapsulation film according to any one of claims 1 to 2, bead milling and vacuum degassing to obtain a mixed slurry; The mixed slurry is coated on a base film and dried to obtain an antistatic epoxy packaging film on the base film; The antistatic epoxy encapsulation film is covered on and around the filter chip by vacuum hot pressing and bonded to the substrate below to complete the encapsulation of the filter chip; the vacuum hot pressing conditions include: pressure of 0.1-0.2 MPa, temperature of 60-70°C, and time of 10-30 seconds; The well-packaged filter chip structure is cut to obtain a well-packaged single filter product.

5. A filter chip packaging structure, characterized in that: The filter chip packaging structure includes: a filter component, a substrate, and the antistatic epoxy packaging film according to any one of claims 1-2. The filter component is connected to the substrate through a number of spaced metal balls to form a cavity. The antistatic epoxy packaging film is covered on and around the filter component by vacuum hot pressing and is bonded to the substrate below.

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