Vehicle-mounted refrigerator with novel heat dissipation system

Abstract

The invention discloses a vehicle-mounted refrigerator with a novel heat dissipation system, and belongs to the technical field of vehicle-mounted refrigerators.The vehicle-mounted refrigerator comprises an outer shell, a cooling fan, a computer cooler, a semiconductor refrigeration module, an inner container, a detachable partition plate and a damping module, and the cooling fan, the computer cooler and the inner container are fixedly installed in the outer shell; the cooling fan and the computer cooler are located on the right side of the inner container, and the cooling fan is fixedly connected with the computer cooler; a detachable partition plate is detachably installed in the inner container, the semiconductor refrigeration module is fixedly installed in the inner container and connected with the computer cooler, and the lower end of the outer shell is connected with the damping module. By means of the mode, the semiconductor refrigeration module has the advantages of being free of noise, high in portability, capable of supporting two-way temperature control, high in low-voltage adaptability and the like, the working efficiency of the vehicle-mounted refrigerator is improved, and the controllable temperature range of the vehicle-mounted refrigerator is widened.

Description

Technical Field

[0001] The present invention relates to the technical field of vehicle-mounted refrigerators, and particularly relates to a vehicle-mounted refrigerator with a novel heat dissipation system. Background Art

[0002] A vehicle-mounted refrigerator is a refrigerated cabinet that can be carried on a vehicle and directly connected to the vehicle power supply, mainly used for refrigerating, freezing or keeping warm food, beverages, drugs and other items during driving; the working principle of a semiconductor vehicle-mounted refrigerator is that a semiconductor refrigeration chip is the core component, which is composed of two different semiconductor materials (N-type and P-type) connected in series. After the power is turned on, when the current passes through the semiconductor material, one end absorbs heat and the other end releases heat to achieve temperature difference refrigeration. By changing the direction of the current, the refrigeration and heating modes can be switched.

[0003] However, the existing vehicle-mounted refrigerators have low refrigeration efficiency, the refrigeration temperature is affected by the ambient temperature, and the refrigeration cannot reach below zero degrees. The controllable temperature range of the vehicle-mounted refrigerator is from 0 degrees to 20 degrees, there is a problem of relatively low controllable temperature, and the heat dissipation system of the vehicle-mounted refrigerators on the market dissipates heat through a cooling fan, and the heat dissipation effect is poor.

[0004] Based on this, the present invention designs a vehicle-mounted refrigerator with a novel heat dissipation system to solve the above problems. Summary of the Invention

[0005] In view of the above-mentioned drawbacks of the prior art, the present invention provides a vehicle-mounted refrigerator with a novel heat dissipation system.

[0006] To achieve the above object, the present invention is realized through the following technical solutions:

[0007] A vehicle-mounted refrigerator with a novel heat dissipation system, including an outer shell, a cooling fan, a computer cooler, a semiconductor refrigeration module, an inner liner, a detachable partition and a shock absorption module. The cooling fan, the computer cooler are fixedly installed inside the outer shell, and the cooling fan and the computer cooler are located on the right side of the inner liner, and the cooling fan is fixedly connected to the computer cooler; a detachable partition is detachably installed inside the inner liner, the semiconductor refrigeration module is fixedly installed inside the inner liner and the semiconductor refrigeration module is located on the right side of the detachable partition, the semiconductor refrigeration module is connected to the computer cooler, and the lower end of the outer shell is connected to the shock absorption module.

[0008] Furthermore, a plurality of the cooling fans and the computer coolers are provided and arranged in a cross pattern.

[0009] Furthermore, the semiconductor refrigeration module includes a semiconductor refrigeration chip, a refrigeration end, a heating end and a cooling copper pipe, and the semiconductor refrigeration chip is fixedly installed inside the inner liner;

[0010] The semiconductor refrigeration chip includes a refrigeration end and a heating end. The refrigeration end is fixedly installed on the left side of the semiconductor refrigeration chip, and the heating end is fixedly installed on the right side of the semiconductor refrigeration chip;

[0011] The heating end is fixedly connected to one end of the cooling copper tube, and the other end of the cooling copper tube is fixedly connected and communicated with the computer cooler.

[0012] Furthermore, the shock absorption module includes a mounting plate, a first slider, an air chamber, a second slider, a bottom plate, spring shock absorbers, a buffer module and a connection module. The mounting plate is fixedly installed at the lower end of the outer housing. The lower end of the mounting plate is fixedly connected to the first slider. The side wall of the first slider is slidably connected to the upper side wall of the air chamber. The lower side wall of the air chamber is slidably connected to the second slider. The second slider is fixedly installed at the upper end of the bottom plate. There are multiple spring shock absorbers, and the upper ends of the multiple spring shock absorbers are fixedly connected to the lower end of the outer housing. There are two sets of the buffer module and the connection module, which are respectively located on the left and right sides of the air chamber.

[0013] Furthermore, the buffer module includes a fixed frame, a moving block and a spring. The inside of the fixed frame is slidably connected to the moving block. One end of the spring is fixedly connected to the moving block, and the other end of the spring is fixedly connected to the inner wall of the fixed frame.

[0014] Furthermore, the two fixed frames are respectively installed on the left and right side walls of the air chamber.

[0015] Furthermore, the connection module includes a first connecting rod and a second connecting rod. One end of the first connecting rod is rotatably connected to the lower end of the mounting plate, the other end of the first connecting rod is rotatably connected to the moving block, one end of the second connecting rod is rotatably connected to the moving block, and the other end of the second connecting rod is rotatably connected to the bottom plate.

[0016] Furthermore, there are two first connecting rods and two second connecting rods in one group, which are respectively located in front of and behind the fixed frame.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. When the present invention is in use, the vehicle-mounted power supply powers the semiconductor refrigeration chip. Subsequently, the refrigeration end of the semiconductor refrigeration chip absorbs the heat inside the refrigerator, and the temperature of the refrigerator decreases. The semiconductor refrigeration chip is connected to the cooling copper tube, and the coolant flows inside the cooling copper tube. The heat generated by the semiconductor refrigeration chip is brought to the computer cooler through the heating end for circulation. The heat generated by the heating end is dissipated by the computer cooler and the cooling fan, and the heat is discharged to the external environment. The simultaneous operation of multiple computer coolers and multiple cooling fans improves the working efficiency of heat dissipation.

[0018] 2. When the computer cooler is added, the temperature controllable range of the present utility model can be changed to about minus 5 degrees to 20 degrees;

[0019] 3. In the present invention, the high-pressure gas in the air chamber compresses and absorbs mechanical energy, and the spring shock absorber cooperates to buffer the impact force. The automatic rebound and reset are achieved by gas expansion, and the rebound speed is restricted by the first slider driving the connecting rod to squeeze the spring. All components cooperate closely to effectively cope with the vibrations on the vehicle and ensure the stable operation of equipment such as refrigerators. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention, and those of ordinary skill in the art can also obtain other drawings based on these drawings without creative efforts.

[0021] Figure 1 is a three-dimensional view of a vehicle-mounted refrigerator with a novel heat dissipation system according to the present invention Figure 1 ;

[0022] Figure 2 is a front view of a vehicle-mounted refrigerator with a novel heat dissipation system according to the present invention;

[0023] Figure 3 is a three-dimensional view of a vehicle-mounted refrigerator with a novel heat dissipation system according to the present invention Figure 2 ;

[0024] Figure 4 is a schematic structural view of a part cut along the A-A direction of Figure 2 ;

[0025] Figure 5 is a schematic connection view of a computer cooler and a semiconductor refrigeration module;

[0026] Figure 6 is a schematic structural view of the shock absorption module of the present invention.

[0027] The reference numerals in the drawings respectively represent:

[0028] 1. Outer housing; 2. Cooling fan; 3. Computer cooler; 4. Semiconductor refrigeration module; 41. Semiconductor refrigeration chip; 42. Refrigeration end; 43. Heating end; 44. Cooling copper pipe; 5. Inner liner; 6. Removable partition; 7. Shock absorption module; 71. Mounting plate; 72. First slider; 73. Air chamber; 74. Second slider; 75. Fixed frame; 76. Moving block; 77. First connecting rod; 78. Second connecting rod; 79. Spring; 710. Bottom plate; 711. Spring shock absorber. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0029] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0030] The "left", "right", "front", "rear", "top" and "bottom" mentioned in the following description are oriented in the perspective direction of the front view.

[0031] In some embodiments, referring to the Figures 1 - 6 of the accompanying drawings of the specification, a vehicle-mounted refrigerator with a new cooling system includes a housing 1, a cooling fan 2, a computer cooler 3, a semiconductor refrigeration module 4, an inner liner 5, a detachable partition 6 and a shock-absorbing module 7. The cooling fan 2, the computer cooler 3 and the inner liner 5 are fixedly installed inside the housing 1. The cooling fan 2 and the computer cooler 3 are located on the right side of the inner liner 5, and the cooling fan 2 is fixedly connected to the computer cooler 3. The detachable partition 6 is detachably installed inside the inner liner 5. The semiconductor refrigeration module 4 is fixedly installed inside the inner liner 5 and the semiconductor refrigeration module 4 is located on the right side of the detachable partition 6. The semiconductor refrigeration module 4 is connected to the computer cooler 3. The lower end of the housing 1 is connected to the shock-absorbing module 7.

[0032] Both the cooling fan 2 and the computer cooler 3 are provided with multiple ones and are arranged in a cross pattern. The semiconductor refrigeration module 4 is provided with multiple ones, and the semiconductor refrigeration module 4 is respectively connected to multiple computer coolers 3.

[0033] Both the cooling fan 2 and the computer cooler 3 adopt existing mature devices.

[0034] The cross-arranged cooling fan 2 and computer cooler 3 together constitute a cooling system, effectively improving the working efficiency and controllable temperature range of the vehicle-mounted refrigerator.

[0035] The semiconductor refrigeration module 4 includes a semiconductor refrigeration chip 41, a refrigeration end 42, a heating end 43 and a cooling copper tube 44. The semiconductor refrigeration chip 41 is fixedly installed inside the inner liner 5.

[0036] The semiconductor refrigeration chip 41 includes a refrigeration end 42 and a heating end 43. The refrigeration end 42 is fixedly installed on the left side of the semiconductor refrigeration chip 41, and the heating end 43 is fixedly installed on the right side of the semiconductor refrigeration chip 41.

[0037] The heating end 43 is fixedly connected to one end of the cooling copper tube 44, and the other end of the cooling copper tube 44 is fixedly connected to and communicated with the computer cooler 3.

[0038] The vehicle power supply powers the semiconductor refrigeration chip 41. Subsequently, the refrigerating end 42 of the semiconductor refrigeration chip 41 absorbs the heat inside the refrigerator, reducing the temperature of the refrigerator. The semiconductor refrigeration chip 41 is connected to the cooling copper pipe 44, and a coolant flows through the cooling copper pipe 44. The heat generated by the semiconductor refrigeration chip 41 is taken to the computer cooler 3 through the heating end 43 for circulation. The heat generated by the heating end 43 is dissipated by the computer cooler 3 and the cooling fan 2, and the heat is discharged to the external environment. The simultaneous operation of multiple computer coolers 3 and multiple cooling fans 2 improves the working efficiency of heat dissipation.

[0039] The semiconductor refrigeration module 4 of this utility model has the advantages of no noise, strong portability, support for two-way temperature control, and strong low-voltage adaptability, improving the working efficiency and controllable temperature range of the vehicle-mounted refrigerator.

[0040] In this utility model, when the computer cooler 3 is added, the controllable temperature range can be changed to about minus 5 degrees to 20 degrees.

[0041] The shock absorption module 7 includes a mounting plate 71, a first slider 72, an air chamber 73, a second slider 74, a bottom plate 710, a spring shock absorber 711, a buffer module, and a connection module. The mounting plate 71 is fixedly installed at the lower end of the outer shell 1. The lower end of the mounting plate 71 is fixedly connected to the first slider 72. The side wall of the first slider 72 is slidably connected to the upper side wall of the air chamber 73. The lower side wall of the air chamber 73 is slidably connected to the second slider 74. The second slider 74 is fixedly installed at the upper end of the bottom plate 710. A plurality of spring shock absorbers 711 are provided, and the upper ends of the plurality of spring shock absorbers 711 are fixedly connected to the lower end of the outer shell 1. The buffer module and the connection module are both provided in two groups and are respectively located on the left and right sides of the air chamber 73.

[0042] Suction cups are installed at the lower ends of the plurality of spring shock absorbers 711 for fixing the refrigerator.

[0043] The buffer module includes a fixed frame 75, a moving block 76, and a spring 79. The inside of the fixed frame 75 is slidably connected to the moving block 76. One end of the spring 79 is fixedly connected to the moving block 76, and the other end of the spring 79 is fixedly connected to the inner wall of the fixed frame 75.

[0044] The two fixed frames 75 are respectively installed on the left and right side walls of the air chamber 73.

[0045] The connection module includes a first connecting rod 77 and a second connecting rod 78. One end of the first connecting rod 77 is rotatably connected to the lower end of the mounting plate 71. The other end of the first connecting rod 77 is rotatably connected to the moving block 76. One end of the second connecting rod 78 is rotatably connected to the moving block 76. The other end of the second connecting rod 78 is rotatably connected to the bottom plate 710.

[0046] There are two of each of the first link 77 and the second link 78, which are respectively located on the front and rear sides of the fixed frame 75.

[0047] When the present invention is in use, the inside of the air chamber 73 is filled with high-pressure gas (usually nitrogen). When the vehicle shakes, the outer housing 1 will squeeze the first slider 72, causing the first slider 72 to squeeze the high-pressure gas and slide in the air chamber 73, so that the gas inside the air chamber 73 is compressed. The gas is compressible and can absorb a large amount of mechanical energy during the compression process and convert it into the internal energy of the gas, thereby playing a role in buffering the impact force. At the same time, the spring shock absorber 711 also plays a buffering role.

[0048] When the external force disappears, the compressed gas begins to expand, releases the absorbed energy, and pushes the first slider 72 back to its original position to achieve rebound. During the rebound process, the pressure of the gas gradually returns to the initial state, and at the same time, part of the internal energy is converted into mechanical energy. In order to prevent the first slider 72 from rebounding excessively and causing new vibrations, when the first slider 72 is reset, it drives the first link 77 to move, the first link 77 drives the moving block 76 to move, the moving block 76 drives the second link 78 to move, and at the same time, the moving block 76 squeezes the spring 79 inward to achieve the effect of restricting the rebound speed and ensure the stability of the refrigerator.

[0049] The present invention compresses and absorbs mechanical energy through the high-pressure gas in the air chamber 73, and the spring shock absorber 711 cooperates to buffer the impact force. It uses gas expansion to achieve automatic rebound and reset, and uses the first slider 72 to drive the first link 77 and the second link 78 to squeeze the spring 79 to restrict the rebound speed. Each component cooperates closely to effectively cope with vehicle vibrations and ensure the stable operation of equipment such as refrigerators.

[0050] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements will not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An in-vehicle refrigerator with a novel heat dissipation system, comprising an outer casing (1), characterized in that, It also includes a cooling fan (2), a computer cooler (3), a semiconductor refrigeration module (4), an inner container (5) and a detachable partition (6). Inside the outer shell (1), the cooling fan (2), the computer cooler (3) and the inner container (5) are fixedly installed. The cooling fan (2) and the computer cooler (3) are located on the right side of the inner container (5), and the cooling fan (2) is fixedly connected to the computer cooler (3). The detachable partition (6) is detachably installed inside the inner container (5). The semiconductor refrigeration module (4) is fixedly installed inside the inner container (5) and is located on the right side of the detachable partition (6), and the semiconductor refrigeration module (4) is connected to the computer cooler (3).

2. The vehicle-mounted refrigerator with a new cooling system according to claim 1, characterized in that, Both the cooling fan (2) and the computer cooler (3) are provided with a plurality of them.

3. The vehicle-mounted refrigerator with a novel heat dissipation system according to claim 2, characterized in that, The plurality of cooling fans (2) and the plurality of computer coolers (3) are arranged in a cross pattern.

4. The in-vehicle refrigerator with a novel heat dissipation system according to claim 1, characterized in that, The semiconductor refrigeration module (4) includes a semiconductor refrigeration chip (41) and a cooling copper pipe (44). The semiconductor refrigeration chip (41) is fixedly installed inside the inner container (5), and the semiconductor refrigeration chip (41) is connected to the cooling copper pipe (44).

5. The vehicle-mounted refrigerator with a novel heat dissipation system according to claim 4, characterized in that, The semiconductor refrigeration chip (41) includes a refrigerating end (42) and a heating end (43). The refrigerating end (42) is fixedly installed on the left side of the semiconductor refrigeration chip (41), and the heating end (43) is fixedly installed on the right side of the semiconductor refrigeration chip (41).

6. The vehicle-mounted refrigerator with a new cooling system according to claim 5, characterized in that, The heating end (43) is fixedly connected to one end of the cooling copper pipe (44), and the other end of the cooling copper pipe (44) is fixedly connected to and communicated with the computer cooler (3).

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