Infrared imaging device and method

Abstract

The invention provides an infrared imaging device and method, and the device comprises a detection module which is used for detecting an infrared radiation signal emitted by an object to be imaged; the processing module is used for generating a first electric signal according to the infrared radiation signal and converting the first electric signal into a display signal; the temperature measuring module is used for measuring the first temperature of the environment where the to-be-imaged object is located; the correction module is used for determining a first correction parameter according to the first temperature and the first mapping relation, and correcting the first electric signal and / or the display signal according to the first correction parameter; and the imaging module is used for imaging according to the corrected display signal. In the device, through the mapping relation between the pre-configured temperature and the correction parameter, the corresponding correction parameter is used for correcting imaging according to the environment where the object to be imaged is located, it is guaranteed that detection of the device adapts to the environment, the measurement precision is improved, and a better imaging effect is obtained.

Description

Technical Field

[0001] This application relates to the field of optoelectronic detection technology, and particularly to an infrared imaging device and method. Background Art

[0002] An infrared imaging device detects infrared radiation signals emitted by a target object through non-contact, converts the infrared radiation signals into electrical signals, and presents an infrared image of the target object after signal processing and image display. Among them, uncooled infrared imaging devices generally use, for example, vanadium oxide and amorphous silicon as detection elements. When the infrared radiation signal is received by the detection element, the resistance of the detection element changes with temperature. Therefore, the detection of infrared radiation can be achieved by measuring the resistance of the detection element.

[0003] However, the imaging effect and detection accuracy of uncooled infrared imaging devices are greatly affected by the ambient temperature. With different ambient temperatures, the detector noise in the device will also change correspondingly, resulting in poor signal quality and stability. Therefore, how to make the detection of uncooled infrared imaging devices adapt to the environment and obtain a better imaging effect is an urgent problem to be solved. Summary of the Invention

[0004] This application provides an infrared imaging device and method. By pre-configuring correction parameters corresponding to the target temperature and using the corresponding correction parameters to correct the imaging according to the environment where the object to be imaged is located, the detection of the infrared imaging device is adapted to the environment, the measurement accuracy is improved, and a better imaging effect is obtained.

[0005] In a first aspect, an infrared imaging device is provided, including: a detection module for detecting infrared radiation signals emitted by an object to be imaged; a processing module for generating a first electrical signal according to the infrared radiation signals and converting the first electrical signal into a display signal; a temperature measurement module for measuring a first temperature of the environment where the object to be imaged is located; a correction module for determining a first correction parameter according to the first temperature and a first mapping relationship, and performing correction processing on the first electrical signal and / or the display signal according to the first correction parameter, where the first mapping relationship is used to indicate the mapping relationship between a plurality of correction parameters and a plurality of temperatures, the first correction parameter is the correction parameter corresponding to a second temperature indicated by the first mapping relationship, and the second temperature corresponds to the first temperature; an imaging module for imaging according to the display signal after the correction processing.

[0006] In the above infrared imaging device, by pre-configuring the mapping relationship between temperature and correction parameters, the imaging is corrected using the corresponding correction parameters according to the environment where the object to be imaged is located, ensuring that the detection of the device is adapted to the environment, improving the measurement accuracy, and obtaining a better imaging effect.

[0007] In combination with the first aspect, in some implementations of the first aspect, the correspondence between the second temperature and the first temperature includes: the second temperature is the temperature closest to the first temperature among multiple temperatures, or the deviation between the second temperature and the first temperature is within a preset range. Thus, the correction parameters corresponding to the infrared imaging device are determined according to the external environment.

[0008] In combination with the first aspect, in some implementations of the first aspect, the correction parameters are used to correct at least one of the following for the display signal: black level, noise, or sensitivity.

[0009] In combination with the first aspect, in some implementations of the first aspect, a thermal shielding cavity is provided inside the device, the processing module is located in the thermal shielding cavity, and the device further includes a temperature control module, where: the temperature control module is used for refrigeration or heating to adjust the temperature in the thermal shielding cavity to the second temperature. Thus, it is ensured that the infrared detection element in the processing module is at a constant second temperature, ensuring the correction accuracy of the display signal.

[0010] In combination with the first aspect, in some implementations of the first aspect, the thermal shielding cavity is filled with an inert gas. Thus, water vapor is isolated to protect the normal operation of the module.

[0011] In combination with the first aspect, in some implementations of the first aspect, where: the processing module is further used to generate a second electrical signal according to the infrared radiation signal and convert the second electrical signal into detection information corresponding to the object to be formed; the correction module is further used to perform correction processing on the second electrical signal and / or the detection information according to the first correction parameter; the imaging module is further used to display the detection information. Thus, the displayed detection information is adapted to the ambient temperature, improving the calculation accuracy of the information.

[0012] In combination with the first aspect, in some implementations of the first aspect, the detection information includes at least one of the following: temperature, emissivity, component content, or concentration.

[0013] In a second aspect, an infrared imaging method is provided, including: detecting an infrared radiation signal emitted by an object to be imaged; generating a first electrical signal according to the infrared radiation signal and converting the first electrical signal into a display signal; measuring a first temperature of the environment where the object to be imaged is located; determining a first correction parameter according to the first temperature and a first mapping relationship, and performing correction processing on the first electrical signal and / or the display signal according to the first correction parameter, where the first mapping relationship is used to indicate the mapping relationship between multiple correction parameters and multiple temperatures, the first correction parameter is the correction parameter corresponding to the second temperature indicated by the first mapping relationship, and the second temperature corresponds to the first temperature; performing imaging according to the display signal after the correction processing.

[0014] In the above infrared imaging method, by pre-configuring the mapping relationship between temperature and correction parameters, the imaging is corrected using the corresponding correction parameters according to the environment where the object to be imaged is located, so as to ensure that the detection is adapted to the environment, improve the measurement accuracy, and obtain a better imaging effect.

[0015] Combined with the second aspect, in some implementation manners of the second aspect, the correspondence between the second temperature and the first temperature includes: the second temperature is the temperature closest to the first temperature among multiple temperatures, or the deviation between the second temperature and the first temperature is within a preset range. Thus, the correction parameters to be used by the infrared imaging device are determined according to the external environment.

[0016] Combined with the second aspect, in some implementation manners of the second aspect, the correction parameters are used to correct at least one of the following for the display signal: black level, noise, or sensitivity.

[0017] Combined with the second aspect, in some implementation manners of the second aspect, the method is for an infrared imaging device. There is a thermal shielding cavity inside the device, and a processing module is arranged in the thermal shielding cavity. The processing module is used to execute the step of generating a display signal according to the infrared radiation signal. The method further includes: performing refrigeration or heating to adjust the temperature in the thermal shielding cavity to the second temperature. Thus, it is ensured that the method operates at a constant second temperature, and the correction accuracy of the display signal is guaranteed.

[0018] Combined with the second aspect, in some implementation manners of the second aspect, it further includes: generating a second electrical signal according to the infrared radiation signal, and converting the second electrical signal into detection information corresponding to the object to be imaged; performing correction processing on the second electrical signal and / or the detection information according to the first correction parameter; displaying the detection information. Thus, the displayed detection information is adapted to the environmental temperature, and the calculation accuracy of the information is improved.

[0019] Combined with the second aspect, in some implementation manners of the second aspect, the detection information includes at least one of the following: temperature, emissivity, component content, or concentration.

[0020] In a third aspect, a computer-readable medium is provided. The computer-readable medium stores program code for a device to execute, and the program code includes the infrared imaging method in the second aspect or any one of the implementation manners of the second aspect.

[0021] In a fourth aspect, a chip is provided. The chip includes a processor and a communication interface. The processor reads instructions stored on a memory through the communication interface and executes the infrared imaging method in the second aspect or any one of the implementation manners of the second aspect. Description of the Drawings

[0022] Figure 1 It is a schematic structural diagram of an infrared imaging device provided by an embodiment of the present application.

[0023] Figure 2 It is a schematic diagram of temperature control by a temperature control module provided in an embodiment of the present application.

[0024] Figure 3 It is an infrared imaging method provided in an embodiment of the present application. Detailed implementation manners

[0025] Next, the technical solutions in the present application will be described with reference to the accompanying drawings.

[0026] An infrared imaging device detects infrared radiation signals emitted by a target object through non-contact, converts the infrared radiation signals into electrical signals, and presents an infrared image of the target object after signal processing and image display. Infrared imaging devices are widely used in fields such as monitoring, target tracking, navigation, aviation, aerospace, military reconnaissance, and security monitoring. Among them, infrared imaging devices can be subdivided into cooled infrared imaging devices and uncooled infrared imaging devices. Uncooled infrared imaging devices generally use semiconductor materials such as vanadium oxide and amorphous silicon as detection elements. When the infrared radiation signal is received by the detection element, the resistance of the detection element changes with temperature. Therefore, the detection of infrared radiation can be achieved by measuring the resistance of the detection element. Since it does not require cooling the environment around the detection element to a low temperature like a cooled infrared imaging device, it has characteristics such as small volume, light weight, and low price. Compared with cooled infrared imaging devices, it is more convenient to manufacture and use. At the same time, uncooled infrared imaging devices also have the characteristics of fast response speed and wide-band applicability. Therefore, they have advantages in some specific application scenarios, such as fire alarm, industrial detection, gas cloud imaging, and harmful gas detection.

[0027] However, the imaging effect and detection accuracy of uncooled infrared imaging devices are greatly affected by the ambient temperature. With different ambient temperatures, the detector noise in the device will also change correspondingly, resulting in poor signal quality and stability. Therefore, how to make the detection of uncooled infrared imaging devices adapt to the environment and obtain a better imaging effect is an urgent problem to be solved.

[0028] In view of this, the embodiments of the present application provide an infrared imaging device and method. By pre-configuring correction parameters corresponding to the target temperature and using the corresponding correction parameters to correct the imaging according to the environment where the object to be imaged is located, the detection of the infrared imaging device is adapted to the environment, the measurement accuracy is improved, and a better imaging effect is obtained.

[0029] Figure 1 It is a schematic structural diagram of an infrared imaging device provided in an embodiment of the present application. As Figure 1As shown in the figure, the infrared imaging device includes a detection module 110, a processing module 120, a temperature measurement module 130, a calibration module 140, and an imaging module 150.

[0030] The detection module 110 is configured to detect the infrared radiation signal emitted by the object to be imaged. Among them, the infrared radiation signal can be generated by the object to be imaged itself. Alternatively, the device may further include a transmitting unit configured to emit an infrared radiation signal to the object to be imaged, and the detection module 110 is configured to detect the infrared radiation signal reflected by the object to be imaged. The detection module 110 may include an optical imaging system. The optical imaging system may specifically include lenses such as an eyepiece and an objective lens to receive the infrared radiation signal.

[0031] The processing module 120 is configured to generate a display signal according to the infrared radiation signal. Among them, the processing module 120 may include a conversion module 121 and a data processing module 122. The conversion module 121 may include an infrared detection element and an electrical signal processing circuit. The conversion module 121 is configured to perform optoelectronic conversion on the infrared radiation signal to generate a corresponding first electrical signal. The infrared detection element may be a non-cooled type. The infrared detection element may refer to semiconductor materials such as vanadium oxide and amorphous silicon. When the infrared radiation signal is received by the optical imaging system and transmitted to the infrared detection element, the resistance of the detection element changes with temperature. The electrical signal processing circuit is configured to process the first electrical signal converted by the infrared detection element and perform processing such as amplification on the first electrical signal. The data processing module 122 is configured to convert the first electrical signal output by the electrical signal processing circuit into a display signal.

[0032] The temperature measurement module 130 is configured to measure the first temperature of the environment where the object to be imaged is located. Among them, the environment where the object to be imaged is located can also be understood as the environment where the infrared imaging device is located, or the external environmental temperature.

[0033] The calibration module 140 is configured to determine a first calibration parameter according to the first temperature and the first mapping relationship. And perform calibration processing on the first electrical signal and / or the display signal according to the first calibration parameter. Among them, the first mapping relationship is used to indicate the mapping relationship between multiple calibration parameters and multiple temperatures. The first calibration parameter is the calibration parameter corresponding to the second temperature indicated by the first mapping relationship, and the second temperature corresponds to the first temperature.

[0034] Among them, the first mapping relationship can be pre-configured in the calibration module 140. For example, during the production process, the working environment is divided into multiple temperature ranges in advance according to the working environment of the infrared imaging device, and the calibration parameters corresponding to each temperature range in the multiple temperature ranges are determined through experiments, so as to obtain the first mapping relationship. The first mapping relationship can specifically refer to the mapping relationship between multiple calibration parameters and multiple temperature points, or the mapping relationship between multiple calibration parameters and multiple temperature ranges. There can be a one-to-one correspondence between multiple calibration parameters and multiple temperatures.

[0035] In some implementation manners, the second temperature corresponding to the first temperature includes: the second temperature is the temperature closest to the first temperature among multiple temperatures, or the deviation between the second temperature and the first temperature is within a preset range. Thus, the calibration parameters corresponding to the infrared imaging device are determined according to the external environment.

[0036] In some implementation manners, the calibration parameters can be used to calibrate at least one of the following items of the display signal: black level, sensitivity, or noise. The noise can include readout noise, pattern noise (PN). The black level can be understood as the value corresponding to the display signal when displaying the darkest picture (brightness is 0). The sensitivity can be understood as the proportional relationship between the infrared radiation signal and the photoelectric conversion to the first electrical signal. The readout noise can be understood as the noise generated during the photoelectric conversion process of the first electrical signal by the conversion module 121. The pattern noise can refer to the noise caused by the non-uniformity of the signal response corresponding to each pixel during imaging in the detection module 110 and the conversion module 121. In addition, this calibration process can also be understood as compensation according to the actual signal processing process.

[0037] The imaging module 150 is configured to perform imaging according to the calibrated display signal.

[0038] In the above infrared imaging device, by pre-configuring the mapping relationship between temperature and calibration parameters, the imaging is calibrated using the corresponding calibration parameters according to the environment where the object to be imaged is located, ensuring that the detection of the device adapts to the environment, improving the measurement accuracy, and obtaining a better imaging effect. For example, after calibrating the black level of the display signal according to the first calibration parameter, the output voltage or current of the display signal will be adjusted, so that the imaging obtains a better contrast ratio. For another example, after calibrating the sensitivity of the infrared radiation signal photoelectric conversion to the first electrical signal according to the first calibration parameter, the relationship between the current / voltage and the incident light power / flux can be changed to avoid the distortion of the first electrical signal. For another example, after calibrating the readout noise and pattern noise of the display signal according to the first calibration parameter, the imaging effect when the received infrared radiation signal is weak can be improved.

[0039] In some implementations, such as Figure 1 As shown in Figure 1 , the infrared imaging device includes a housing 100 and a thermal shielding cavity 200 disposed inside. The temperature measurement module 130 can be attached to the outside of the housing 100. The processing module 120 and the calibration module 140 are located inside the thermal shielding cavity 200. In some implementations, the infrared imaging device includes a temperature control module for cooling or heating to adjust the temperature in the thermal shielding cavity 200 to a second temperature, thereby ensuring that the infrared detection element in the processing module 120 is at a constant second temperature and ensuring the calibration accuracy of the display signal. For example, the temperature measurement module may include a temperature sensor 161 and a thermoelectric cooler 162. The temperature sensor 161 is located inside the thermal shielding cavity 200. One side of the thermoelectric cooler 162 is in contact with the housing 100, and the other side is in contact with the outside of the thermal shielding cavity 200. The thermoelectric cooler 162 can be a thermoelectric cooler (TEC). In some implementations, the detection module 110 can also be located inside the thermal shielding cavity 200, and a transparent window can be provided on one side of the housing 100 and the thermal shielding cavity 200.

[0040] In some implementations, the thermal shielding cavity 200 is filled with an inert gas to isolate water vapor and protect the normal operation of the module.

[0041] In addition, when imaging with a non-cooled infrared imaging device and calculating the information of the object to be imaged from the imaging screen, such as the temperature and gas composition of the object to be imaged, since the calculation process often assumes a constant external environment, the accuracy of the detection information will be reduced.

[0042] In some implementations, the processing module 120 is further configured to generate a second electrical signal according to the infrared radiation signal and convert the second electrical signal into detection information corresponding to the object to be imaged. The calibration module 140 is further configured to perform calibration processing on the second electrical signal and / or the detection information according to the first calibration parameter. The imaging module 150 is further configured to display the detection information. Thus, the detection information displayed by the imaging module 150 is adapted to the ambient temperature, improving the calculation accuracy of the information. In some implementations, the detection information includes at least one of the following: temperature, emissivity, component content, or concentration. For example, when the object to be imaged is a gas, the detection information can be the temperature, emissivity, component content, concentration, etc. of the corresponding gas.

[0043] In some implementations, there is a corresponding relationship between the detection information and the display signal. For example, the imaging module can display the specific color of the object to be imaged according to the detection information and the display signal. In some implementations, multiple detection information corresponds one-to-one with multiple first display signals. The first display signal among the multiple first display signals is used for imaging of the pixel region, and each pixel region includes one or more pixels.

[0044] Figure 2 It is a schematic diagram of temperature control by a temperature control module provided in an embodiment of the present application. As Figure 2 shown, the first mapping relationship pre-configured in the infrared imaging device provided in the embodiment of the present application indicates multiple temperatures, such as Figure 2 the second temperature, the third temperature, the fourth temperature, etc. shown in

[0045] The device system embodiment of the embodiment of the present application has been described above. Next, the corresponding method embodiment will be introduced. The device system embodiment and the method embodiment correspond to each other, so the parts not described in detail can be referred to each other.

[0046] Figure 3 It is an infrared imaging method provided in an embodiment of the present application. As Figure 3 shown, the method may include steps S310 - S350.

[0047] S310, Detect the infrared radiation signal emitted by the object to be imaged.

[0048] S320, Generate a first electrical signal according to the infrared radiation signal and convert the first electrical signal into a display signal.

[0049] S330, Measure the first temperature of the environment where the object to be imaged is located.

[0050] S340, Determine a first correction parameter according to the first temperature and the first mapping relationship, and perform correction processing on the first electrical signal and / or the display signal according to the first correction parameter. Among them, the first mapping relationship is used to indicate the mapping relationship between multiple correction parameters and multiple temperatures, and the first correction parameter is the correction parameter corresponding to the second temperature indicated by the first mapping relationship, and the second temperature corresponds to the first temperature.

[0051] Among them, the first mapping relationship may be pre-configured. The first mapping relationship may specifically refer to the mapping relationship between multiple correction parameters and multiple temperature points, or the mapping relationship between multiple correction parameters and multiple temperature ranges. There may be a one-to-one correspondence between multiple correction parameters and multiple temperatures.

[0052] In some implementations, the correspondence between the second temperature and the first temperature includes: the second temperature is the temperature closest to the first temperature among multiple temperatures, or the deviation between the second temperature and the first temperature is within a preset range. Thus, the correction parameters corresponding to the infrared imaging device are determined according to the external environment.

[0053] In some implementations, the correction parameters can be used to correct at least one of the following for the display signal: black level, readout noise, pattern noise (PN). The black level can be understood as the voltage corresponding to the display signal when displaying the darkest picture (brightness is 0). The readout noise can be understood as the noise generated by the electrical signal during the photoelectric conversion process. The pattern noise can refer to the noise caused by the non-uniformity of the signal response of each pixel during imaging.

[0054] In addition, this correction process can also be understood as compensation according to the actual signal processing process.

[0055] S350, perform imaging according to the display signal after the correction process.

[0056] In the above infrared imaging method, by pre-configuring the mapping relationship between the temperature and the correction parameters, the imaging is corrected using the corresponding correction parameters according to the environment where the object to be imaged is located, ensuring that the detection adapts to the environment, improving the measurement accuracy, and obtaining a better imaging effect. For example, after correcting the black level of the display signal according to the first correction parameter, the output voltage or current of the display signal is adjusted, so that the imaging obtains a better contrast. For another example, after correcting the sensitivity of the infrared radiation signal photoelectric conversion to the first electrical signal according to the first correction parameter, the relationship between the current / voltage and the incident light power / flux can be changed to avoid the distortion of the first electrical signal. For another example, after correcting the readout noise and pattern noise of the display signal according to the first correction parameter, the imaging effect when the received infrared radiation signal is weak can be improved.

[0057] In some implementations, such as Figure 3 The method shown is used for an infrared imaging device. There is a thermal shielding cavity inside the device, and a processing module is arranged in the thermal shielding cavity. The processing module is used to execute the step of generating a display signal according to the infrared radiation signal. The method further includes: performing refrigeration or heating to adjust the temperature in the thermal shielding cavity to the second temperature. Thus, it is ensured that the method works at a constant second temperature, ensuring the correction accuracy of the display signal.

[0058] In addition, during the process of imaging using an uncooled infrared imaging device and calculating the information of the object to be imaged from the imaging picture, such as the temperature and gas composition of the object to be imaged, since the calculation process often assumes a constant external environment, this will lead to a decrease in the accuracy of the detection information.

[0059] In some implementations, such as Figure 3 the method shown also includes the following steps: generating a second electrical signal according to the infrared radiation signal, and converting the second electrical signal into detection information corresponding to the object to be imaged. Correcting the second electrical signal and / or the detection information according to the first correction parameter. Displaying the detection information. Thus, the displayed detection information is adapted to the ambient temperature, improving the calculation accuracy of the information.

[0060] In some implementations, the detection information includes at least one of the following: temperature, emissivity, component content, or concentration. For example, when the object to be imaged is a gas, the detection information can be the temperature, emissivity, component content, concentration, etc. of the corresponding gas.

[0061] In some implementations, there is a corresponding relationship between the detection information and the display signal. For example, the specific color of the object to be imaged can be displayed according to the detection information and the display signal. In some implementations, multiple detection information corresponds one-to-one with multiple first display signals. The first display signal among the multiple first display signals is used for imaging of the pixel area, and each pixel area includes one or more pixels.

[0062] In addition, an embodiment of the present application also provides a computer-readable medium, which stores a computer program (which can also be referred to as code or instruction). When it runs on a computer, it causes the computer to execute the optical monitoring method or the optical line protection method in any of the above method embodiments.

[0063] In addition, an embodiment of the present application also provides a chip, which includes a processor and a communication interface. The processor reads the instructions stored on the memory through the communication interface and executes the optical monitoring method or the optical line protection method in any of the above method embodiments.

[0064] Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or by a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of this application.

[0065] Those skilled in the art can clearly understand that for the convenience and conciseness of description, the specific working processes of the systems, devices, and units described above can refer to the corresponding processes in the foregoing method embodiments, and will not be described herein again.

[0066] In several embodiments provided in the present application, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units is only a logical function division. In actual implementation, there can be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection between each other can be through some interfaces. The indirect coupling or communication connection of the devices or units can be in electrical, mechanical, or other forms.

[0067] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they can be located in one place, or they can be distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0068] In addition, in each embodiment of the present application, the functional units can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit.

[0069] If the above functions are implemented in the form of software function units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art or part of this technical solution can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in each embodiment of the present application. The foregoing storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs that can store program codes.

[0070] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed in the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An infrared imaging device, characterized in that, Comprising: A detection module, configured to detect an infrared radiation signal emitted by an object to be imaged; A processing module, configured to generate a first electrical signal according to the infrared radiation signal and convert the first electrical signal into a display signal; A temperature measurement module, configured to measure a first temperature of the environment where the object to be imaged is located; A correction module, configured to determine a first correction parameter according to the first temperature and a first mapping relationship, and perform correction processing on the first electrical signal and / or the display signal according to the first correction parameter, wherein the first mapping relationship is used to indicate a mapping relationship between a plurality of correction parameters and a plurality of temperatures, the first correction parameter is the correction parameter corresponding to a second temperature indicated by the first mapping relationship, and the second temperature corresponds to the first temperature; An imaging module, configured to perform imaging according to the display signal after the correction processing.

2. The device according to claim 1, characterized in that, The second temperature corresponding to the first temperature includes: The second temperature is the temperature closest to the first temperature among the plurality of temperatures, or the deviation between the second temperature and the first temperature is within a preset range.

3. The device according to claim 1 or 2, characterized in that, The correction parameter is used to correct at least one of the following for the display signal: black level, noise, or sensitivity.

4. The device according to any one of claims 1 to 3, characterized in that A thermal shielding cavity is provided inside the device, the processing module is located in the thermal shielding cavity, and the device further includes a temperature control module, wherein: The temperature control module is configured to perform refrigeration or heating to adjust the temperature in the thermal shielding cavity to the second temperature.

5. The device according to claim 4, characterized in that, The thermal shielding cavity is filled with an inert gas.

6. The device according to any one of claims 1 to 5, characterized in that Wherein: The processing module is further configured to generate a second electrical signal according to the infrared radiation signal and convert the second electrical signal into detection information corresponding to the object to be imaged; The correction module is further configured to perform correction processing on the second electrical signal and / or the detection information according to the first correction parameter; The imaging module is further configured to display the detection information.

7. The device according to claim 6, characterized in that, The detection information includes at least one of the following: temperature, emissivity, component content, or concentration.

8. An infrared imaging method, characterized in that, Comprising: Detecting an infrared radiation signal emitted by an object to be imaged; Generating a first electrical signal according to the infrared radiation signal and converting the first electrical signal into a display signal; Measuring a first temperature of the environment where the object to be imaged is located; Determining a first correction parameter according to the first temperature and a first mapping relationship, and performing correction processing on the first electrical signal and / or the display signal according to the first correction parameter, wherein the first mapping relationship is used to indicate a mapping relationship between a plurality of correction parameters and a plurality of temperatures, the first correction parameter is the correction parameter corresponding to a second temperature indicated by the first mapping relationship, and the second temperature corresponds to the first temperature; Performing imaging according to the display signal after the correction processing.

9. The method according to claim 8, characterized in that, The second temperature corresponding to the first temperature includes: The second temperature is the temperature closest to the first temperature among the plurality of temperatures, or the deviation between the second temperature and the first temperature is within a preset range.

10. The method according to claim 8 or 9, characterized in that, The correction parameter is used to correct at least one of the following for the display signal: black level, noise, or sensitivity.

11. The method according to any one of claims 8 to 10, characterized in that, The method is used for an infrared imaging device, and a thermal shielding cavity is provided inside the device. A processing module is arranged in the thermal shielding cavity, and the processing module is configured to perform the step of generating a display signal according to the infrared radiation signal. The method further includes: Performing refrigeration or heating to adjust the temperature in the thermal shielding cavity to the second temperature.

12. The method according to any one of claims 8 to 11, characterized in that It further includes: Generating a second electrical signal according to the infrared radiation signal and converting the second electrical signal into detection information corresponding to the object to be imaged; Performing correction processing on the second electrical signal and / or the detection information according to the first correction parameter; Displaying the detection information.

13. The method according to claim 12, characterized in that, The detection information includes at least one of the following: temperature, emissivity, component content, or concentration.

14. A computer-readable storage medium, characterized in that, It includes a computer program which, when running on a computer, causes the computer to execute the method according to any one of claims 8 to 13.

15. A chip, characterized in that, The chip includes a processor and a communication interface. The processor reads instructions stored on a memory through the communication interface and executes the method according to any one of claims 8 to 13.

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