Sample preparation device and sample preparation method of chip sample
Through the sample preparation device that rotates the ultrasonic assembly and nozzle, the problem of low sample preparation efficiency and poor quality of chip sample is solved, and efficient and accurate chip sample preparation is achieved.
Patent Information
- Application Number
- CN202510311179.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-17
- Publication Date
- 2025-08-01
AI Technical Summary
The existing chip sample preparation methods are inefficient, and the chip sample is prone to collapse or rupture, resulting in poor sample preparation quality.
A sample preparation device for chip samples is adopted, including a rotary ultrasonic assembly, a cutting knife and a polishing pad. Samples are prepared by ultrasonic cutting and polishing methods, combined with nozzle spraying cutting solution and polishing solution to improve cutting accuracy and polishing efficiency, and reduce the risk of edge collapse and fracture.
The sample preparation efficiency is improved, the cutting surface is smooth and not easy to deform, and the production quality of chip samples is significantly improved.
Smart Images
Figure CN120404263A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of semiconductor chips, and particularly to a sample preparation device and method for chip samples. Background Art
[0002] During the production or detection process of chips, it is often necessary to perform failure analysis on chip samples.
[0003] Currently, the sample preparation of chip samples mainly relies on metallographic sample preparation technology, that is, the chip to be subjected to failure analysis is sealed in epoxy resin by cold embedding to obtain a sealed body, and then the sealed body is ground and polished multiple times with sandpapers of different particle sizes to obtain a smooth cross-section on the sealed body, thereby forming a chip sample. However, in the current chip sample preparation, since the chip to be subjected to failure analysis needs to be sealed in epoxy resin and is ground multiple times with sandpapers, the efficiency is low, and the chip sample is prone to chipping or cracking, and the quality of the obtained chip sample is poor. Summary of the Invention
[0004] Based on this, in view of the above problems, it is necessary to provide a sample preparation device and method for chip samples, which have high operation efficiency and good quality of the obtained chip samples.
[0005] On the one hand, a sample preparation device for chip samples is provided, including:
[0006] A first mechanism, including a first support, a sliding plate, a rotary ultrasonic component, a cutting knife, and a polishing pad. The first support includes a first support rod and a mounting plate. The first support rod is erected vertically. One end of the mounting plate is slidably connected to the first support rod so that the height of the mounting plate on the first support rod is adjustable. The length of the mounting plate extends along the horizontal direction. The upper end of the sliding plate is slidably connected to the mounting plate, and the lower end of the sliding plate is connected to the rotary ultrasonic component. The cutting knife and the polishing pad are selectively detachably mounted at one end of the rotary ultrasonic component away from the mounting plate;
[0007] The second mechanism includes a second bracket, a fixing component and a nozzle. The second bracket is arranged on one side of the first support rod in the horizontal direction. The second bracket includes a second support rod and a support seat hinged to the second support rod. The second support rod can rotate relative to the support seat so that the second support rod can switch between a first use state and a second use state. When the second support rod is in the first use state, the second support rod is located on one side of the rotary ultrasonic component in the horizontal direction. When the second support rod is in the second use state, the second support rod is located below the rotary ultrasonic component. One side of the fixing component is used to fix the chip to be sampled, and the nozzle protrudes from the fixing component. The nozzle is used to spray liquid onto the side of the fixing component where the chip is located.
[0008] In one embodiment, the fixing component includes a fixing seat and a fixing plate arranged on one side of the fixing seat. The fixing seat is connected to the second support rod, and the fixing plate is detachably connected to the fixing seat. The fixing plate is used to temporarily fix the chip, and the nozzle protrudes from the side of the fixing seat where the fixing plate is located.
[0009] In one embodiment, the fixing component further includes a connecting screw. The fixing plate is provided with a first connecting hole, and the fixing seat is provided with a second connecting hole. One end of the connecting screw passes through the first connecting hole and is tightened in the second connecting hole.
[0010] In one embodiment, the fixing component further includes a third locking screw. The fixing seat is provided with a mounting hole, and the second support rod passes through the mounting hole. The fixing seat is provided with a third locking hole communicating with the mounting hole. One end of the third locking screw is tightened in the third locking hole, and one end of the third locking screw passes through the third locking hole and abuts against the second support rod.
[0011] In one embodiment, the rotary ultrasonic component includes a ultrasonic generator, a ultrasonic transducer and a rotary horn connected in sequence. The ultrasonic generator is connected to the sliding plate, and the cutting tool or the polishing pad is mounted on the rotary horn.
[0012] On the other hand, a method for preparing a chip sample is also provided. The above-mentioned sample preparation device is provided, including the following steps:
[0013] Temporarily fix the chip to be sampled on the fixing plate of the sample preparation device;
[0014] Use the rotary ultrasonic component of the sample preparation device to drive the cutting tool to cut the chip on the fixing plate, and spray cutting solution onto the chip with the nozzle while cutting to obtain a cutting surface on the chip.
[0015] Spray the polishing solution onto the polishing pad and the cutting surface using the nozzle, and drive the polishing pad to vibrate and rotate using the rotary ultrasonic assembly to polish the cutting surface to obtain the sample.
[0016] In one embodiment, the following steps are further included: removing the sample from the fixing plate.
[0017] In one embodiment, before removing the sample from the fixing plate, use the nozzle to spray a cleaning solution onto the chip to remove the particulate foreign matter remaining on the cutting surface.
[0018] In one embodiment, the sample preparation method further provides a first polishing pad, a second polishing pad, a first polishing solution, and a second polishing solution. The hardness of the first polishing pad is greater than that of the second polishing pad, and the particle diameter in the first polishing solution is greater than that in the second polishing solution. The specific steps for polishing the cutting surface include:
[0019] Spray the first polishing solution onto the first polishing pad and the cutting surface using the nozzle, and drive the first polishing pad to vibrate and rotate using the rotary ultrasonic assembly to perform a first polishing on the cutting surface;
[0020] Spray the second polishing solution onto the second polishing pad and the cutting surface using the nozzle, and drive the second polishing pad to vibrate and rotate using the rotary ultrasonic assembly to perform a second polishing on the cutting surface.
[0021] In one embodiment, the chip is temporarily fixed on the fixing plate using a bonding adhesive.
[0022] The sample preparation device for a chip sample with such a structure performs ultrasonic cutting on the chip to be sampled through a rotary ultrasonic assembly. The ultrasonic cutting has high precision, fast cutting speed, and a smooth cut surface that is not easily deformed. At the same time, the cutting surface of the chip is polished through the cooperation of the rotary ultrasonic assembly, the polishing pad, and the nozzle, effectively improving the sample preparation efficiency, greatly reducing the risk of the sample having chipping and cracking, and effectively improving the production quality of the sample. Description of the Drawings
[0023] Figure 1 Structural diagram of the sample preparation device for some embodiments of the present application (when the second support column is in the first use state and the cutting tool is installed on the rotary ultrasonic assembly).
[0024] Figure 2 Structural diagram of the sample preparation device for some embodiments of the present application (when the second support column is in the second use state and the polishing pad is installed on the rotary ultrasonic assembly).
[0025] Figure 3 Connection structure diagram of a chip, bonding adhesive, and fixing plate according to some embodiments of the present application.
[0026] 100. Chip; 200. Bonding adhesive; 300. First mechanism; 400. Second mechanism; 1. First bracket; 11. First support rod; 12. Mounting plate; 13. Sliding plate; 14. Rotary ultrasonic component; 141. Ultrasonic generator; 142. Ultrasonic transducer; 143. Rotary horn; 15. Polishing pad; 16. Cutting tool; 17. First locking screw; 18. Second locking screw; 19. Nozzle; 110. Base; 2. Second bracket; 21. Second support rod; 22. Fixing component; 221. Fixing plate; 222. Fixing seat; 23. Support seat; 24. Third locking screw; 25. Hinge shaft; 26. Connecting screw. Specific embodiments
[0027] To make the above objects, features, and advantages of the present application more apparent and understandable, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to facilitate a thorough understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.
[0028] In the description of the present application, it should be understood that if terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present application.
[0029] In addition, if terms such as "first" and "second" appear, these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present application, if the term "plural" appears, the meaning of "plural" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.
[0030] In this application, unless otherwise clearly specified or limited, if terms such as "installed", "connected", "joined", "fixed", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0031] In this application, unless otherwise clearly specified or limited, if there is a description such as a first feature being "on" or "under" a second feature, its meaning can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is at a higher horizontal level than the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is at a lower horizontal level than the second feature.
[0032] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If so, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.
[0033] Refer to Figure 1 and Figure 2 , Figure 1 shows a structural diagram of a sample preparation device according to some embodiments of the present application (when the second support column is in the first use state and the cutting tool is installed on the rotary ultrasonic assembly), Figure 2The structural diagram of the sample preparation device according to some embodiments of the present application is shown (when the second support column is in the second use state and the polishing pad is installed on the rotary ultrasonic component). Some embodiments of the present application provide a sample preparation device for a chip sample (hereinafter referred to as the sample preparation device), including a first mechanism 300 and a second mechanism 400. The first mechanism 300 includes a first support 1, a sliding plate 13, a rotary ultrasonic component 14, a cutting tool 16, and a polishing pad 15. The first support 1 includes a first support rod 11 and a mounting plate 12. The first support rod 11 is vertically arranged, and one end of the mounting plate 12 is slidably connected to the first support rod 11 so that the height of the mounting plate 12 on the first support rod 11 is adjustable. The length of the mounting plate 12 extends along the horizontal direction. The upper end of the sliding plate 13 is slidably connected to the mounting plate 12, and the lower end of the sliding plate 13 is connected to the rotary ultrasonic component 14. The cutting tool 16 and the polishing pad 15 are selectively and detachably installed at one end of the rotary ultrasonic component 14 away from the mounting plate 12. The second mechanism 400 includes a second support 2, a fixing component 22, and a nozzle 19. The second support 2 is arranged on one side of the first support rod 11 in the horizontal direction. The second support 2 includes a second support rod 21 and a support seat 23 hinged to the second support rod 21. The second support rod 21 can rotate relative to the support seat 23 so that the second support rod 21 can be switched between the first use state and the second use state. When the second support rod 21 is in the first use state, the second support rod 21 is located on one side of the rotary ultrasonic component 14 in the horizontal direction. When the second support rod 21 is in the second use state, the second support rod 21 is located below the rotary ultrasonic component 14. One side of the fixing component 22 is used to fix the chip 100 to be prepared for sampling. The nozzle 19 protrudes from the fixing component 22, and the nozzle 19 is used to spray liquid on the side of the fixing component 22 with the chip 100. In actual implementation, the nozzle 19 is connected to a plurality of containers through pipelines, and each container contains different solutions. In this way, during the sample preparation process, the solution sprayed by the nozzle 19 can be controlled through valves according to different needs. When the cutting tool 16 cuts the chip 100, the nozzle 19 sprays a cutting solution on the cutting tool 16 and the chip 100 to cool the cutting tool 16 and the chip 100 through the cutting solution, preventing high temperature from damaging the chip 100 and affecting subsequent detection and analysis of the sample. In addition, since the particle diameter of the cutting solution is relatively large, spraying the cutting solution can accelerate the cutting speed; when polishing the chip 100, the nozzle 19 sprays a corresponding polishing solution on the polishing pad 15 and the chip 100, and the cutting surface of the chip 100 is polished under the interaction of the polishing pad 15 and the polishing solution; after polishing is completed, the nozzle 19 sprays a cleaning solution on the chip 100 to clean the residual particulate foreign matter on the cutting surface to keep the sample surface clean and facilitate subsequent detection and analysis of the sample.
[0034] The first support 1 provides support for the rotary ultrasonic assembly 14, and the second support 2 provides support for the fixing assembly 22 and the nozzle 19. The rotary ultrasonic assembly 14 can vibrate and rotate by using the energy of ultrasonic waves, driving the cutting tool 16 or the polishing pad 15 to vibrate and rotate. The chip 100 is temporarily fixed on one side of the fixing assembly 22, facilitating the cutting or polishing of the chip 100. After the chip 100 is cut and polished to form a sample, the sample is removed from the fixing assembly 22 for subsequent detection and analysis of the sample. Since the fixing assembly 22 is installed on the second support rod 21, the second support rod 21 rotates relative to the support base 23 so that the second support rod 21 can switch between the first use state and the second use state. When the second support rod 21 is in the first use state, that is, when the fixing assembly 22 is located on one side of the rotary ultrasonic assembly 14 in the horizontal direction, the cutting tool 16 is installed on the rotary ultrasonic assembly 14. At this time, the rotary ultrasonic assembly 14 is located on one side of the chip 100 on the fixing assembly 22. By driving the cutting tool 16 to vibrate and rotate through the rotary ultrasonic assembly 14, the chip 100 can be cut, and a cutting surface is formed on the chip 100. After the chip 100 is cut, the second support rod 21 is rotated 90° relative to the support base 23, so that the side of the fixing assembly 22 with the chip 100 is located below the rotary ultrasonic assembly 14. The cutting tool 16 on the rotary ultrasonic assembly 14 is replaced with a polishing pad 15, and the height of the mounting plate 12 on the first support rod 11 and the horizontal position of the sliding plate 13 on the mounting plate 12 are adjusted so that the polishing pad 15 contacts the cutting surface. The polishing solution is sprayed by the nozzle 19. The polishing pad 15 absorbs the polishing solution. During the process of driving the polishing pad 15 to vibrate and rotate by the rotary ultrasonic assembly 14, the polishing solution on the polishing pad 15 polishes the cutting surface, and then a sample is obtained. The cleaning solution is sprayed onto the sample through the nozzle 19 to clean the sample. In such a sample preparation device, the chip 100 to be sampled is ultrasonically cut by the rotary ultrasonic assembly 14. The ultrasonic cutting has high precision, fast cutting speed, and a smooth cut surface that is not easily deformed. At the same time, the cutting surface of the chip 100 is polished by the cooperation of the rotary ultrasonic assembly 14, the polishing pad 15, and the nozzle 19, effectively improving the sample preparation efficiency and greatly reducing the risk of chipping and cracking of the sample, and effectively improving the production quality of the sample.
[0035] Continue to refer to Figure 1 and Figure 2 As shown in FIGS. 1 and 2, the first support 1 further includes a base 110. The first support rod 11 is disposed on the base 110. The mounting plate 12 is respectively provided with a first sliding hole (not shown in the figure) and a first locking hole communicating with the first sliding hole. The first support rod 11 passes through the first sliding hole. The sample preparation device further includes a first locking screw 17 screwed into the first locking hole. One end of the first locking screw 17 passes through the first locking hole and abuts against the first support rod 11, thereby locking the position of the mounting plate 12.
[0036] Continue to refer to Figure 1 and Figure 2 Figure 2
[0037] Continue to refer to Figure 1 and Figure 2 Figure 2
[0038] In some embodiments, continue to refer to Figure 1 and Figure 2 Figure 2
[0039] In this embodiment, refer to Figure 3 Figure 3
[0040] In some embodiments, continue to refer to Figure 1 and Figure 2, the fixing component 22 further includes a connecting screw 26. The fixing plate 221 is provided with a first connecting hole (not shown in the figure), and the fixing base 222 is provided with a second connecting hole (not shown in the figure). One end of the connecting screw 26 passes through the first connecting hole and is tightened in the second connecting hole. The fixing plate 221 and the fixing base 222 are connected by the connecting screw 26, reducing the assembly difficulty between the fixing plate 221 and the fixing base 222. In this embodiment, there are at least two first connecting holes and at least two second connecting holes. The first connecting holes and the second connecting holes correspond to each other one by one. There are at least two connecting screws 26, and the connecting screws 26 and the second connecting holes correspond to each other one by one. The connecting screws 26 are tightened in the corresponding second connecting holes, so that there are two connection points between the fixing plate 221 and the fixing base 222, preventing the fixing plate 221 from loosening on the fixing plate 221.
[0041] Of course, in other embodiments, the fixing plate 221 can also be detachably connected to the fixing base 222 through other structures, such as buckles or magic tapes, etc. The connection structure between the fixing plate 221 and the fixing base 222 is not specifically limited herein.
[0042] In some embodiments, continue to refer to Figure 1 and Figure 2 , the fixing component 22 further includes a third locking screw 24. The fixing base 222 is provided with a mounting hole (not shown in the figure), the second support rod 21 passes through the mounting hole, and the fixing base 222 is provided with a third locking hole (not shown in the figure) communicating with the mounting hole. One end of the third locking screw 24 is tightened in the third locking hole, and one end of the third locking screw 24 passes through the third locking hole and abuts against the second support rod 21. In this embodiment, the fixing base 222 is a cuboid. When the second support rod 21 is in the first use state, the fixing plate 221 is arranged on the side surface of the fixing base 222 parallel to the second support rod 21. In this way, the second support rod 21 can be rotated 90° to be converted to the second use state when in the first use state. The fixing base 222 can be locked at any position in the length direction of the second support rod 21 through the third locking screw 24. When the second support rod 21 is in the first use state, the position of the fixing base 222 on the second support rod 21 can be adjusted in height so that the cutting tool 16 contacts the tool chip 100 on the fixing plate 221. Moreover, when the second support rod 21 is in the second use state, by adjusting the position of the fixing base 222 in the length direction of the second support rod 21, the polishing pad 15 can be made to contact the chip 100 on the fixing plate 221.
[0043] In some embodiments, continue to refer to Figure 1 and Figure 2, the rotary ultrasonic assembly 14 includes a ultrasonic generator 141, a ultrasonic transducer 142 and a rotary horn 143 connected in sequence. The ultrasonic generator 141 is connected to the sliding plate 13, and the cutting tool 16 or the polishing pad 15 is installed on the rotary horn 143. The ultrasonic generator 141 provides ultrasonic signals for the ultrasonic transducer 142. After passing through the rotary horn 143, the signals drive the cutting tool 16 and the polishing pad 15 to vibrate and rotate rapidly.
[0044] In some embodiments, with continued reference to Figure 1 and Figure 2 , a sample preparation method for chip samples (hereinafter referred to as the sample preparation method) is also provided. In this sample preparation method, a sample preparation device with any of the above structures is provided, including the following steps:
[0045] Step S10: Temporarily fix the chip 100 to be sampled on the fixing plate 221 of the sample preparation device. Among them, the chip 100 can be a flip-chip package chip, a fan-out package chip, a 2.5D package chip, a 3D package chip, etc.
[0046] Step S20: Use the rotary ultrasonic assembly 14 of the sample preparation device to drive the cutting tool 16 to cut the chip 100 on the fixing plate 221. While cutting, use the nozzle 19 to spray the cutting solution onto the chip 100 to obtain a cutting surface on the chip 100. This step is operated when the second support rod 21 is in the first use state. Therefore, before step S20, adjust the second support rod 21 to the first use state. When cutting the chip 100, the ultrasonic frequency of the ultrasonic generator 141 in the rotary ultrasonic assembly 14 is 20 kHz - 40 kHz, the ultrasonic power is less than 1 KW, the ultrasonic amplitude is less than 0.2 µm. The electrical signal transmitted by the ultrasonic generator 141 in the rotary ultrasonic assembly 14 is converted into a vibrating and rotating motion by the ultrasonic transducer 142 and the rotary horn 143. In this embodiment, the amplitude of vibration is less than 1 µm, and the rotation speed is less than 1000 r / min. The solution matrix in the cutting fluid is deionized water or water-based emulsion, and the particle diameter in the cutting fluid is 50 µm - 100 µm. In this embodiment, water-based emulsion is used as the solution matrix of the cutting fluid.
[0047] Step S30: Use the nozzle 19 to spray the polishing solution onto the polishing pad 15 and the cutting surface, and use the rotary ultrasonic assembly 14 to drive the polishing pad 15 to vibrate and rotate to polish the cutting surface to obtain a sample.
[0048] In this sample preparation method, under the cooperation of the rotary ultrasonic assembly 14, the nozzle 19 and the cutting tool 16, the chip 100 is cut by ultrasonic technology. The ultrasonic cutting has high precision, fast cutting speed and smooth cut surface that is not easy to deform, effectively improving the cutting speed and reducing the risk of sample chipping and cracking. Moreover, the cutting surface of the chip 100 is polished by the cooperation of the rotary ultrasonic assembly 14, the polishing pad 15 and the nozzle 19, effectively improving the production quality of the sample.
[0049] In order to further improve the sample preparation efficiency, in step S10, at least two chips 100 are temporarily fixed on the fixing plate 221, so that two or more samples can be produced at one time using the same sample preparation device.
[0050] This sample preparation method also includes step S40: removing the sample from the fixing plate 221 for subsequent detection and analysis of the sample.
[0051] In the case where at least two chips 100 are temporarily fixed on the fixing plate 221, in step S40, at least two samples are correspondingly removed from the fixing plate 221.
[0052] Since step S30 is operated when the second support rod 21 is in the second use state, before performing step S30, it further includes step 21: switching the second support rod 21 from the first use state to the second use state. In this embodiment, the second support rod 21 is rotated 90° in the first use state to switch to the second use state.
[0053] In step S20, when the cutting tool 16 cuts the chip 100, the ultrasonic frequency of the ultrasonic generator 141 in the rotary ultrasonic assembly 14 is adjusted to f, 20 kHz ≤ f ≤ 40 kHz, and the power of the ultrasonic generator 141 in the rotary ultrasonic assembly 14 is adjusted to P1, 0 < P1 ≤ 1 KW. In this way, on the basis of ensuring the cutting quality of the chip 100, it is beneficial to improve the cutting efficiency.
[0054] In step S30, when polishing the cutting surface, the power of the ultrasonic generator 141 is adjusted to P2, 0 < P2 ≤ 0.3 KW. Setting the power of the ultrasonic generator 141 within this range is beneficial to improve the polishing quality on the basis of ensuring the polishing quality.
[0055] In actual operation, the sample preparation method also provides a first polishing pad, a second polishing pad, a first polishing solution, and a second polishing solution. The hardness of the first polishing pad is greater than that of the second polishing pad, and the particle diameter in the first polishing solution is greater than that in the second polishing solution, enabling the nozzle 19 to spray the first polishing solution and the second polishing solution respectively. The first polishing solution is an alumina, diamond, or silica suspension, and the particle diameter of the first polishing solution is 3 µm - 6 µm. In this embodiment, the first polishing solution is an alumina solution. In actual implementation, the particle diameter in the first polishing solution can be set to 3 µm, 3.5 µm, 4 µm, 4.5 µm, 5 µm, 5.5 µm, or 6 µm, etc.; the second polishing solution is an alumina suspension, a diamond suspension, or a silica suspension, and the particle diameter in the second polishing solution is 0.05 µm - 1 µm. In actual implementation, the particle diameter in the second polishing solution can be set to 0.05 µm, 0.06 µm, 0.07 µm, 0.08 µm, 0.09 µm, or 1 µm, etc. In this embodiment, the second polishing solution is a diamond suspension.
[0056] In step S30, the specific steps for polishing the cutting surface include:
[0057] Step S31: Use the nozzle 19 to spray the first polishing solution on the first polishing pad and the cutting surface, and use the rotary ultrasonic assembly 14 to drive the first polishing pad to vibrate and rotate to perform the first polishing on the cutting surface.
[0058] Step S32: Use the nozzle 19 to spray the second polishing solution on the second polishing pad and the cutting surface, and use the rotary ultrasonic assembly 14 to drive the second polishing pad to vibrate and rotate to perform the second polishing on the cutting surface.
[0059] Among them, the first polishing pad is a short-pile polishing pad, and the second polishing pad is a long-pile polishing pad. Since the hardness of the first polishing pad is greater than that of the second polishing pad, and the particle diameter of the first polishing solution is greater than that of the second polishing solution, when performing the first polishing on the cutting surface, the larger edges and corners and uneven parts on the cutting surface can be smoothed, and the cutting surface can be preliminarily polished. When performing the second polishing on the cutting surface, the cutting surface can be further corrected and finely polished, which is beneficial to both ensuring the polishing efficiency and improving the polishing quality.
[0060] In some embodiments, this sample preparation method further includes S50. Before removing the sample from the fixing plate 221, a cleaning liquid is sprayed onto the chip 100 using the nozzle 19 to remove the particulate foreign matter remaining on the cutting surface. The cleaning liquid is deionized water or ethanol, etc. In this embodiment, the cleaning liquid is deionized water. By cleaning the chip 100 with the cleaning liquid, the particulate foreign matter remaining during the polishing process of the chip 100 can be removed, thus avoiding the influence of particulate foreign matter on the subsequent detection and analysis. During actual implementation, a long-pile polishing pad can be installed on the side of the rotary ultrasonic assembly 14 away from the sliding plate 13. By driving the long-pile polishing pad to vibrate and rotate through the rotary ultrasonic assembly 14, the particulate foreign matter on the surface of the sample can be quickly washed away, which is beneficial to saving the cleaning solution.
[0061] In some embodiments, referring to Figure 3 , in step S10, the chip 100 to be prepared is temporarily fixed to the fixing plate 221 using the bonding adhesive 200. The bonding adhesive 200 can be a heat-curing bonding adhesive and a UV-curing bonding adhesive. To facilitate the removal of the bonding adhesive 200 from the fixing plate 221, before disassembling the sample from the fixing plate 221, the fixing plate 221 is removed from the fixing base 222. The specific steps for removing the sample from the fixing plate 221 in step S40 are: removing the bonding adhesive 200 from between the chip 100 and the fixing plate 221. Specifically, methods such as mechanical peeling, thermal slip, and laser debonding can be used to remove the bonding adhesive 200. In this embodiment, the laser debonding method is used to remove the bonding adhesive 200 between the chip 100 and the fixing plate 221.
[0062] The above-described embodiments merely represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.
Claims
1. A sample preparation device for a chip sample, characterized in that, Comprising: A first mechanism, including a first support, a sliding plate, a rotary ultrasonic assembly, a cutting tool, and a polishing pad. The first support includes a first support rod and a mounting plate. The first support rod is erected vertically. One end of the mounting plate is slidably connected to the first support rod, so that the height of the mounting plate on the first support rod is adjustable. The length of the mounting plate extends along the horizontal direction. The upper end of the sliding plate is slidably connected to the mounting plate, and the lower end of the sliding plate is connected to the rotary ultrasonic assembly. The cutting tool and the polishing pad are alternatively detachably mounted at one end of the rotary ultrasonic assembly away from the mounting plate; A second mechanism, including a second support, a fixing assembly, and a nozzle. The second support is disposed on one side of the first support rod in the horizontal direction. The second support includes a second support rod and a support seat hinged to the second support rod. The second support rod is rotatable relative to the support seat, so that the second support rod can be switched between a first use state and a second use state. When the second support rod is in the first use state, the second support rod is located on one side of the rotary ultrasonic assembly in the horizontal direction. When the second support rod is in the second use state, the second support rod is located below the rotary ultrasonic assembly. One side of the fixing assembly is used to fix the chip to be sampled. The nozzle protrudes from the fixing assembly, and the nozzle is used to spray liquid onto the side of the fixing assembly having the chip.
2. The sample preparation device for the chip sample according to claim 1, characterized in that, The fixing assembly includes a fixing seat and a fixing plate disposed on one side of the fixing seat. The fixing seat is connected to the second support rod, and the fixing plate is detachably connected to the fixing seat. The fixing plate is used to temporarily fix the chip. The nozzle protrudes from the side of the fixing seat having the fixing plate.
3. The sample preparation device for the chip sample according to claim 2, characterized in that, The fixing assembly further includes a connecting screw. The fixing plate is provided with a first connecting hole, and the fixing seat is provided with a second connecting hole. One end of the connecting screw passes through the first connecting hole and is tightened in the second connecting hole.
4. The sample preparation device for the chip sample according to claim 2, wherein The fixing assembly further includes a third locking screw. The fixing seat is provided with a mounting hole, and the second support rod passes through the mounting hole. The fixing seat is provided with a third locking hole communicating with the mounting hole. One end of the third locking screw is tightened in the third locking hole, and one end of the third locking screw passes through the third locking hole and abuts against the second support rod.
5. The sample preparation device for the chip sample according to any one of claims 1 to 4, characterized in that, The rotary ultrasonic assembly includes a ultrasonic generator, a ultrasonic transducer, and a rotary horn connected in sequence. The ultrasonic generator is connected to the sliding plate, and the cutting tool or the polishing pad is mounted on the rotary horn.
6. A method for preparing a chip sample, characterized in that, There is provided a sample preparation device according to any one of claims 1 to 5, including the following steps: Temporarily fix the chip to be sampled on the fixing plate of the sample preparation device; Use the rotary ultrasonic assembly of the sample preparation device to drive the cutting tool to cut the chip on the fixing plate, and while cutting, use the nozzle to spray a cutting solution onto the chip to obtain a cutting surface on the chip; Spray the polishing solution onto the polishing pad and the cutting surface using the nozzle, and drive the polishing pad to vibrate and rotate using the rotary ultrasonic assembly to polish the cutting surface to obtain the sample.
7. The method for preparing a sample of a chip sample according to claim 6, characterized in that, It further includes the following steps: Remove the sample from the fixing plate.
8. The sample preparation method of the chip sample according to claim 7, wherein, Before removing the sample from the fixing plate, spray the cleaning solution onto the chip using the nozzle to remove the particulate foreign matter remaining on the cutting surface.
9. The sample preparation method of the chip sample according to claim 6, wherein The sample preparation method also provides a first polishing pad, a second polishing pad, a first polishing solution, and a second polishing solution. The hardness of the first polishing pad is greater than that of the second polishing pad, and the particle diameter in the first polishing solution is greater than that in the second polishing solution. The specific steps for polishing the cutting surface include: Spray the first polishing solution onto the first polishing pad and the cutting surface using the nozzle, and drive the first polishing pad to vibrate and rotate using the rotary ultrasonic assembly to perform the first polishing on the cutting surface; Spray the second polishing solution onto the second polishing pad and the cutting surface using the nozzle, and drive the second polishing pad to vibrate and rotate using the rotary ultrasonic assembly to perform the second polishing on the cutting surface.
10. The sample preparation method of the chip sample according to claim 6, characterized in that, Temporarily fix the chip on the fixing plate using the bonding adhesive.