Vehicle-mounted computing device in intelligent automobile and intelligent automobile

Abstract

The invention provides a vehicle-mounted computing device in an intelligent automobile and the intelligent automobile. The vehicle-mounted computing device comprises two main boards which are arranged in a stacked mode and further comprises a radiator which is arranged between the two main boards and used for dissipating heat of the two main boards. The closing plate is arranged on one surface, deviating from the radiator, of each main board and is connected with the radiator; wherein each sealing plate and the radiator seal the corresponding mainboard between the sealing plate and the radiator. In this way, the vehicle-mounted computing device comprising the two mainboards can be cooled through the shared radiator, the size of the computing device in the intelligent automobile is reduced, and the cooling capacity of the computing device in the intelligent automobile is improved.

Description

[0001] This application is a divisional application. The application number of the original application is 201980025464.9, the original application date is July 12, 2019, and the entire content of the original application is incorporated herein by reference. Technical Field

[0002] This application relates to the technical field of intelligent vehicles, and particularly to an in-vehicle computing device and an intelligent vehicle in an intelligent vehicle. Background Art

[0003] Automated driving is a key technology for realizing intelligent vehicles and intelligent transportation, and is also an inevitable trend for the future development of intelligent vehicles. With the continuous improvement of the intelligent driving level, the demand for the computing power of in-vehicle computing devices is continuously increasing, and the challenge to the heat dissipation devices of in-vehicle computing devices is also becoming greater and greater. For example, the heat dissipation requirement has increased from at least 20W to more than 200W. When the traditional in-vehicle computing device dissipates heat through natural wind, it cannot meet the heat dissipation requirements of the in-vehicle computing device in an intelligent vehicle. On the other hand, with the improvement of the driving level of automated driving, it is necessary for the in-vehicle computing device to physically achieve a 1+1 redundant design, that is, two in-vehicle computing devices need to be set up, and each in-vehicle computing device needs to be cooled by an independent heat dissipation device. In the traditional design, the two in-vehicle computing devices are respectively arranged at the front and rear ends of the intelligent vehicle body, and each in-vehicle computing device is equipped with a heat dissipation device, which is large in volume and occupies a relatively large amount of space inside the vehicle. Therefore, how to provide an in-vehicle computing device in an intelligent driving vehicle with a small volume and good heat dissipation has become a technical problem to be solved urgently. Summary of the Invention

[0004] This application provides an in-vehicle computing device and an intelligent vehicle in an intelligent vehicle, aiming to reduce the volume of the computing device in the intelligent vehicle and improve the heat dissipation capacity of the computing device in the intelligent vehicle.

[0005] In a first aspect, an in-vehicle computing device for an intelligent vehicle is provided. The in-vehicle computing device includes: two main boards arranged in a stacked manner, each main board including a plurality of devices for controlling the driving state and monitoring the state of the intelligent vehicle; and the two main boards are designed as a 1+1 redundancy. The in-vehicle computing device further includes a radiator disposed between the two main boards and thermally connected to each main board, and the radiator serves as a common radiator for the two main boards. In addition, the in-vehicle computing device further includes a closing plate disposed on a side of each main board facing away from the radiator and connected to the radiator; wherein, each closing plate and the radiator seal the corresponding main board between the closing plate and the radiator. In the above technical solution, two main boards are designed in the in-vehicle computing device, and the two main boards are cooled by a common radiator. With an approximate volume of one in-vehicle computing device in the prior art, the effect of two in-vehicle computing devices in the prior art is achieved, meeting the redundancy design of the vehicle, reducing the space area occupied by the in-vehicle computing device, and improving the waterproof effect of the main board by sealing the main board with the closing plate and the radiator.

[0006] In a possible implementation, the radiator includes a housing, a heat dissipation channel disposed in the housing, and a air supply module; the air supply module includes: a first fan module and a second fan module arranged along the length direction of the heat dissipation channel, wherein the air supply directions of the first fan module and the second fan module are the same. The first fan module sends the air outside the radiator into the heat dissipation channel, and the second fan module discharges the air in the heat dissipation channel, improving the fluidity in the heat dissipation channel, and thus improving the heat dissipation effect of the radiator.

[0007] In another possible implementation, the intelligent vehicle includes an in-vehicle power supply system, and the in-vehicle power supply system supplies power to the first fan module or the second fan module through at least one of the two main boards; the first fan module is electrically connected to one of the two main boards, and the second fan module is electrically connected to the other of the two main boards; or the first fan module is respectively electrically connected to the two main boards, and the second fan module is respectively electrically connected to the two main boards. By connecting the first fan module and the second fan module to the two main boards respectively, the power supply system can supply power to the first fan module and the second fan module through at least one main board, ensuring that at least one fan module is in a working state, improving the reliability of the air-cooled radiator, and also improving the reliability of the in-vehicle computing device.

[0008] In another possible implementation, the first fan module and the second fan module are respectively detachably and fixedly connected to the housing. Each fan module is connected to the housing in a detachable manner, and when a fan module fails, the fan module can be detached and repaired or replaced separately.

[0009] In another possible embodiment, the housing is provided with a first jack and a second jack; the first fan module is detachably fixed in the first jack, and the second fan module is detachably fixed in the second jack. The cooperation of the jacks and the fan modules facilitates the installation of the fan modules.

[0010] In another possible embodiment, the first fan module and the second fan module are directly snapped onto the air inlet and the air outlet of the heat dissipation channel. By directly snapping the fan modules onto the housing, it facilitates the installation and maintenance of the fan modules.

[0011] In another possible embodiment, a plurality of heat dissipation fins are provided inside the housing, and the heat dissipation channel is formed between the plurality of heat dissipation fins. When air flows in the heat dissipation channel, the heat on the heat dissipation fins is carried away, increasing the heat exchange effect.

[0012] In another possible embodiment, both the first fan module and the second fan module include: a bracket, at least one mounting hole provided on the bracket, and a fan fixed in each mounting hole through a connecting member. By using a detachable connection method between the fan and the bracket, it is convenient to disassemble and repair the fan when the fan fails.

[0013] In another possible embodiment, the heat dissipation channel is a straight channel; and the length direction of the heat dissipation channel is perpendicular to the stacking direction of the two main boards. By using a straight heat dissipation channel, air can flow directly from the air inlet to the air outlet without being obstructed during the flow process, improving the air fluidity, and thus improving the heat dissipation effect of the radiator.

[0014] In another possible embodiment, the first fan module sends the air outside the radiator into the heat dissipation channel, and the second fan module extracts the air in the heat dissipation channel to the outside of the radiator. By sucking air into the heat dissipation channel through the first fan module and extracting the air in the heat dissipation channel to the outside of the radiator through the second fan module, the air fluidity in the heat dissipation channel is improved, the heat dissipation effect between the air and the heat dissipation fins is improved, and thus the heat dissipation efficiency of the radiator is improved.

[0015] In another possible embodiment, the radiator is a liquid-cooled radiator. By using a liquid medium to dissipate heat from the main board, the heat dissipation effect on the main board is improved.

[0016] In another possible implementation, the intelligent vehicle includes a refrigeration system for controlling the liquid-cooled radiator. The liquid-cooled radiator includes a housing and heat dissipation pipes disposed within the housing, and an inlet pipe and an outlet pipe communicating with the heat dissipation pipes are provided on the housing. Wherein, two opposite surfaces of the housing are respectively in heat conduction connection with the two main boards one by one. The main boards are cooled by the liquid medium carried by the heat dissipation pipes.

[0017] In another possible implementation, a plurality of first heat dissipation fins arranged at intervals are provided within the housing, and a communicating S-shaped heat dissipation pipe is formed between the plurality of first heat dissipation fins. The S-shaped heat dissipation pipe increases the fluidity of the liquid medium within the housing and improves the heat dissipation effect of the radiator.

[0018] In another possible implementation, a plurality of second heat dissipation fins are provided between any adjacent first heat dissipation fins, and the plurality of second heat dissipation fins are arranged at intervals. The heat transferred to the housing is transferred to the second heat dissipation fins, and the contact area with the liquid medium is increased by the provided second heat dissipation fins, thereby increasing the heat dissipation effect of the liquid medium.

[0019] In another possible implementation, the refrigeration system is used to pump the liquid medium into the heat dissipation pipes, and the liquid medium dissipates heat from the two chips in the heat dissipation pipes. The refrigeration system provides the power for the flow of the liquid medium.

[0020] In another possible implementation, when the heat dissipation pipes are formed by the plurality of first heat dissipation fins, the volume of the liquid medium pumped into the heat dissipation pipes by the refrigeration system each time is greater than or equal to the volume of the liquid medium accommodated between two adjacent first fins. By pumping a certain amount of the liquid medium, the fluidity of the liquid medium in the heat dissipation pipes is ensured.

[0021] In another possible implementation, each main board has a first surface facing the radiator, at least one first functional device is provided on the first surface, and the at least one first functional device is in heat conduction connection with the radiator. The first functional device is a device with a relatively high power among the devices on the main board. By directly contacting the first functional device with the radiator, the heat generated by the first functional device can be directly taken away by the radiator, improving the heat dissipation effect of the radiator on the main board.

[0022] In another possible implementation, each main board has a second surface facing away from the radiator, and at least one second functional device is provided on the second surface; the corresponding closed board for each main board is a heat dissipation board; and each second functional device of each main board is thermally connected to the heat dissipation board. The second functional device is a device with relatively low power among the devices on the main board. By using the closed board as the heat dissipation board and thermally connecting the heat dissipation board to the radiator, the heat generated by the second functional device is transferred to the radiator through the heat dissipation board and dissipated, further improving the heat dissipation effect of the main board.

[0023] In a second aspect, an intelligent vehicle is provided. The intelligent vehicle includes an intelligent vehicle body and the above-mentioned in-vehicle computing device provided in the intelligent vehicle body. In the above technical solution, two main boards are designed in the in-vehicle computing device, and a common radiator is used to dissipate heat from the two main boards, achieving the volume of approximately one in-vehicle computing device in the prior art and achieving the effects of two in-vehicle computing devices in the prior art, meeting the redundancy design of the vehicle and reducing the space area occupied by the in-vehicle computing device.

[0024] In another possible implementation, the in-vehicle computing device is provided at one end of the intelligent vehicle body. The in-vehicle computing device can be arranged at different positions in the intelligent vehicle body according to needs.

[0025] In another possible implementation, the intelligent vehicle further includes a refrigeration system provided in the intelligent vehicle body. The refrigeration system includes: a condenser, a cooling plate and the radiator communicated with the condenser through a pipeline, wherein the radiator is a liquid-cooled radiator. The refrigeration system in the vehicle is used to dissipate heat from the in-vehicle computing device.

[0026] In another possible implementation, the refrigeration system further includes a liquid pump (such as a water pump) provided on the pipeline. The heat dissipation effect is improved.

[0027] Based on the implementation manners provided in the above aspects of the present application, further combinations can be made to provide more implementation manners. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic structural diagram of an in-vehicle computing device in an intelligent vehicle provided by the present application;

[0029] Figure 2 It is an exploded schematic diagram of an in-vehicle computing device in an intelligent vehicle provided by the present application;

[0030] Figure 3a is Figure 1 a cross-sectional view taken along line A-A in

[0031] Figure 3b isFigure 1 Cross-sectional view taken along line B-B;

[0032] [[ID=\\(4\\)]] Figure 4a Specific structural schematic diagram of another air-cooled radiator provided by the present application;

[0033] Figure 4b Structural schematic diagram of a heat dissipation fin provided by the present application;

[0034] Figure 5 Structural schematic diagram of another air-cooled radiator provided by the present application;

[0035] Figure 6a Exploded schematic diagram of a fan module and an air-cooled radiator provided by the present application;

[0036] Figure 6b Assembly schematic diagram of a fan module and an air-cooled radiator provided by the present application;

[0037] Figure 7 Structural schematic diagram of a first fan module provided by the present application;

[0038] Figure 8 Exploded schematic diagram of another cooperation mode between a fan module and an air-cooled radiator provided by the present application;

[0039] Figure 9 Exploded schematic diagram of a second in-vehicle computing device provided by the present application;

[0040] Figure 10a Cross-sectional view of the second in-vehicle computing device along the vertical direction;

[0041] Figure 10b Cross-sectional view of the second in-vehicle computing device along the horizontal wind direction;

[0042] Figure 11 Schematic diagram of an intelligent vehicle provided by the present application;

[0043] Figure 12 Schematic diagram of another intelligent vehicle provided by the present application;

[0044] Figure 13 Specific schematic diagram of the refrigeration system provided by the present application.

[0045] Reference numerals

[0046] 10 - Air-cooled radiator 11 - Housing 111 - Protrusion 12 - Heat dissipation fin 121 - Bending structure

[0047] 13 - Heat dissipation channel 14 - Top wall 15 - Bottom wall 20 - First closing plate 30 - Second closing plate

[0048] 40 - First main board 41 - First functional device 42 - First surface 43 - Second surface 44 - Second functional device

[0049] 50 - Second main board 60 - Air supply module 61 - First fan module 62 - Second fan module 63 - Cable

[0050] 64 - Bracket 65 - Mounting hole 66 - Connection terminal 70 - Liquid - cooled radiator 71 - Housing 711 - First side wall

[0051] 712 - Second side wall 72 - Water outlet 73 - Water inlet 74 - Heat dissipation pipe 75 - First heat sink fin

[0052] 751 - First heat sink fin 752 - First heat sink fin 753 - First heat sink fin 754 - First heat sink fin

[0053] 76 - Second heat sink fin Detailed implementation manners

[0054] The embodiments of the present application will be further described below in conjunction with the accompanying drawings.

[0055] First, the application scenario of the in-vehicle computing device provided by the embodiments of the present application will be described. The in-vehicle computing device provided by the embodiments of the present application is applied to the automated driving of intelligent vehicles, including electric vehicles or gasoline-powered vehicles that support unmanned driving, driver assistance / ADAS, intelligent driving, connected driving, intelligent network driving, and car sharing. The in-vehicle computing device is used to control the driving state and monitor the state of intelligent vehicles, including but not limited to in-vehicle mobile data centers (MDCs), hardware monitors (HMIs) that implement the functions of human-machine interaction controllers, in-vehicle infotainment (IVI) controllers, body control modules (BCMs), and vehicle control units (VCUs). The in-vehicle computing device can specifically be a chip with computing and processing capabilities, or it can be a collection of multiple devices such as a processor and a memory integrated in a printed circuit board (PCB). Among them, the processor includes but is not limited to a central processing unit (CPU), a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, a graphics processing unit (GPU), a system on chip (SoC), and an artificial intelligence (AI) chip. The general-purpose processor can be a microprocessor or any conventional processor, etc. The printed circuit board integrated with the above-mentioned processor is also called a main board.

[0056] Next, the specific structure of the in-vehicle computing device provided by the embodiments of the present application will be described with reference to the accompanying drawings.

[0057] As Figure 1 and Figure 2 shown,Figure 1 A schematic structural diagram of an in-vehicle computing device in an intelligent vehicle provided by an embodiment of the present application Figure 2 A schematic exploded view of a computing module in an intelligent vehicle provided by an embodiment of the present application. The in-vehicle computing provided by the embodiment of the present application includes two main boards, and each main board includes a plurality of devices. The plurality of devices are used to control the driving state and monitor the state of the intelligent vehicle. For the convenience of description, the two main boards are respectively named the first main board 40 and the second main board 50, and the structures and functions of the first main board 40 and the second main board 50 are the same. When specifically setting the first main board 40 and the second main board 50, refer to Figure 3a , Figure 3a shows Figure 1 a cross-sectional view taken at A-A in Figure 1 The cross-sectional view taken at A-A refers to a schematic diagram of the cross-section of the in-vehicle computing device shown along a vertical plane parallel to the stacking direction of the first main board 40 and the second main board 50. Both the first main board 40 and the second main board 50 include opposite first surfaces 42 and second surfaces 43. Among them, at least one first functional device 41 is provided on the first surface 42, and at least one second functional device 44 is provided on the second surface 43. The power of the first functional device 41 is greater than that of the second functional device 44, that is, the heat generation of the first functional device 41 is greater than that of the second functional device 44. Of course, only the first functional device may be provided on the first surface 41, and no device is provided on the second surface 42. When the first main board is connected to other devices, connection terminals for connecting to other devices are provided on the first main board 40. The connection terminals are electrically connected to the above-mentioned first functional device 41 and second functional device 44. The connection methods of the connection terminals to the first functional device 41 and the second functional device 44 can adopt welding, slotting or surface mounting connection methods. Surface mounting refers to surface mount technology, which specifically includes applying solder paste on the pads of the main board, mounting the device on the corresponding position on the surface of the main board printed with solder paste or patch glue, and then remelting the pre-distributed paste-like soft solder on the pads to realize the electrical connection between the solder ends or pins of the surface-mounted device and the pads.

[0058] Both the first main board 40 and the second main board 50 are used to control the driving state and monitor the state of the intelligent vehicle. When specifically used, only one of the first main board 40 and the second main board 50 is in the working state, and the other main board is used as a standby main board to achieve a 1+1 redundant design and ensure the reliability of the entire autonomous driving system. Optionally, the two main boards can also jointly complete the data processing process in the intelligent vehicle in a load-sharing manner to accelerate the data processing speed.

[0059] Continue to refer to Figure 1 and Figure 2, the in-vehicle computing device provided by the embodiment of the present application further includes a radiator and two closed plates, where the radiator is an air-cooled radiator 10. As Figure 2 shown, the air-cooled radiator 10 is arranged between the first main board 40 and the second main board 50 to dissipate heat from the first main board 40 and the second main board 50. The first main board 40 and the second main board 50 are respectively thermally connected to the air-cooled radiator 10. Each closed plate is arranged on the side of the main board facing away from the air-cooled radiator 10. For the convenience of description, the two closed plates are respectively named the first closed plate 20 and the second closed plate 30, where the first closed plate 20 corresponds to the first main board 40, and the second closed plate 30 corresponds to the second main board 50. The connection method of each closed plate to the corresponding main board is the same. The following takes the cooperation between the first closed plate 20 and the first main board 40 as an example to illustrate the connection method of the air-cooled radiator 10, the closed plate and the main board.

[0060] For the convenience of description, in Figure 3a two opposite surfaces of the air-cooled radiator 10 are defined: the third surface c and the fourth surface d, where the third surface c faces the first main board 40, and the fourth surface d faces the second main board 50.

[0061] Continue to refer to Figure 3a , the first main board 40 is fixed on the third surface c of the air-cooled radiator 10. Specifically, the first main board 40 can be fixed on the third surface c of the air-cooled radiator 10 through a threaded connection member (such as a bolt or a screw), and the first surface of the first main board 40 faces the air-cooled radiator 10. The first functional device 41 on the first main board 40 faces the air-cooled radiator 10 and is thermally connected to the third surface c of the air-cooled radiator 10 through a thermal conductive adhesive or other thermal conductive medium. When there are multiple first functional devices 41 on the first main board 40, each first functional device 41 is thermally connected to the third surface c of the air-cooled radiator 10 through a thermal conductive adhesive or other thermal conductive medium. When the heights of different first functional devices 41 are different, the third surface c of the air-cooled radiator 10 is provided with corresponding protrusions or grooves (not shown in Figure 3a ) to ensure that each first functional device 41 can be in full contact with the third surface c of the air-cooled radiator 10. During heat dissipation, the heat generated by the first functional device 41 is transferred to the third surface c of the air-cooled radiator 10 through a thermal conductive adhesive or other thermal conductive medium, and the heat is dissipated through the air-cooled radiator 10.

[0062] Continue to refer to Figure 3a , the first closed plate 2 is fixedly connected to the air-cooled radiator 10, such as fixing the first closed plate 20 on the third surface c of the air-cooled radiator 10 through a bolt or a screw. Refer to Figure 2 and Figure 3a, a circular protrusion 111 is provided on the first surface of the air-cooled radiator 10. The first closing plate 20 covers the protrusion 111 and forms an accommodation cavity (not marked in the figure) for accommodating the first main board 40 with the protrusion 111. The first main board 40 is located in this accommodation cavity. The air-cooled radiator 10, the first main board 40 and the first closing plate 20 form a sandwich-like laminated structure.

[0063] The first main board 40 needs to meet certain waterproof requirements during use. Therefore, the first closing plate 20 is hermetically connected to the air-cooled radiator 10 to seal the first main board 40 in the accommodation cavity formed by the first closing plate 20 and the air-cooled radiator 10. During sealing, the connection terminals of the first main board 40 need to be exposed outside the air-cooled radiator 10 to connect with other devices. Therefore, the connection terminals adopt connection terminals that reach the set waterproof level, and the connection terminals and the air-cooled radiator 10 are also subjected to sealing and waterproof treatment, such as sealing the connection terminals and the air-cooled radiator 10 through a sealant or a gasket.

[0064] Continue to refer to Figure 3a , when the first main board 40 is placed in the accommodation cavity, the second surface 43 of the first main board 40 faces the first closing plate 20. When a second functional device 44 is provided on the second surface 42, the heat generated by the second functional device 44 can be dissipated through the first closing plate 20. At this time, the first closing plate adopts a heat dissipation plate, and the second functional device 44 on the second surface 43 is thermally connected to the first closing plate 20. For example, heat conduction is achieved by filling a heat-conducting adhesive or other common heat-conducting materials between the second functional device 44 and the first closing plate 20. In Figure 3a As shown, the number of the second functional devices 44 is three, but the number of the second functional devices 44 is not limited to Figure 3a the number shown in

[0065] It can also adopt other numbers of the second functional devices 44, such as one, two, four, etc. In addition, the heights of different second functional devices 44 can be the same or different; when the heights of the second functional devices 44 are different, corresponding protrusions or recessed structures (not shown in the figure) are also provided on the second closing plate 30 to ensure that the second functional devices 44 can be in full contact with the second closing plate 30.

[0066] Optionally, the first main board 40 and the first closing board 20 can also be fixedly connected. For example, the first main board 40 is fixedly connected to the first closing board 20 by using a snap or a threaded connector (such as a bolt or a screw), and then the first closing board 20 is fixedly connected to the air-cooled radiator 10, which can also achieve fixing the first main board 40 in the accommodation cavity.

[0067] The setting method of the second main board 50 is the same as that of the first main board 40 described above, so it will not be elaborated here.

[0068] Refer to Figure 2 , Figure 3a and Figure 3b , Figure 3b is Figure 1 the sectional view taken along line B-B in Figure 1 where the sectional view taken along line B-B refers to the schematic view of the in-vehicle computing device sectioned along the horizontal plane perpendicular to the stacking direction of the first main board 20 and the second main board 30. First, refer to Figure 2 , the air-cooled radiator 10 includes a housing 11. The housing 11 has four side walls (not labeled in the figure), a top wall and a bottom wall connected to the four side walls. The top wall has the above-mentioned third surface c, and the bottom wall has the above-mentioned fourth surface d. Refer to Figure 3a and Figure 3b , a heat dissipation channel 13 is provided inside the housing 11, and an air inlet a and an air outlet b communicating with the heat dissipation channel 13 are provided on two opposite side walls of the housing 11. Continuing to refer to Figure 3a and Figure 3b , a plurality of heat dissipation fins 12 are provided inside the housing 11. Each heat dissipation fin 12 is a rectangular (or rhombic, elliptical or other shapes) heat dissipation fin, and its length direction is along the direction from the air inlet a to the air outlet b; each heat dissipation fin 12 is thermally connected to the top wall and the bottom wall respectively. The heat transferred from the above-mentioned first main board 40 and second main board 50 to the air-cooled radiator 10 is dissipated through the housing 11 to the heat dissipation fins 12.

[0069] Continuing to refer to Figure 3a and Figure 3b , the plurality of heat dissipation fins 12 are arranged in a single row, and the arrangement direction of the plurality of heat dissipation fins 12 is perpendicular to the direction from the air inlet a to the air outlet b. Specifically, refer to Figure 3b , when the plurality of heat dissipation fins 12 are arranged, there is a gap (not labeled in the figure) between adjacent heat dissipation fins 12. In Figure 3b , the adjacent heat dissipation fins 12 are arranged at equal intervals, but in the embodiments of the present application, the size of the gap between the heat dissipation fins 12 is not limited, and the gap between the heat dissipation fins 12 can be set as needed. Continuing to refer to Figure 3bThe multiple fins 12 form a heat dissipation channel 13 of the air-cooled radiator 10. During heat dissipation, cold air flows from air inlet a into the heat dissipation channel 13 and through the gaps between the fins 12. Through heat exchange, it removes heat from the fins 12 and ultimately flows out through air outlet b. The air inlet a and air outlet b are positioned opposite each other, and the heat dissipation channel is a straight channel, eliminating airflow losses and improving heat dissipation.

[0070] like Figure 4a and Figure 4b As shown, Figure 4a The specific structure of another air-cooled radiator is shown. The shell 11 of the air-cooled radiator 10 only includes a top wall 14 and a bottom wall 15, and the top wall 14 and the bottom wall 15 are fixedly connected by heat dissipation fins 12. Figure 4b , Figure 4b The specific structure of the heat sink 12 is shown. The side where the heat sink 12 connects to the top wall 14 and the bottom wall 15 has a bent structure 121. The heat sink 12 is welded to the top wall 14 and the bottom wall 15 via the bent structure 121, or fixedly connected to the top wall 14 and the bottom wall 15 via rivets or threaded fasteners (such as bolts or screws). To improve heat conduction, a common heat-conducting medium such as thermal adhesive can be applied between the bent structure 121 of the heat sink 12 and the top wall 14 or the bottom wall 15.

[0071] like Figure 5 As shown, Figure 5 The specific structure of another air-cooled radiator is shown. The fins 12 are integrally formed with the housing 11 through an extrusion process. Each fin 12 is rectangular (or prismatic, elliptical, or other shapes), with its length pointing from the air inlet toward the air outlet. This integral structure ensures good thermal conductivity between the housing 11 and the fins 12.

[0072] When the above-mentioned housing and heat dissipation fins are used, the housing and heat dissipation fins of the air-cooled radiator can be made of materials with good thermal conductivity, such as common metal materials such as aluminum and iron.

[0073] Continue to refer Figure 2 and Figure 3b In order to improve the heat dissipation effect of the air-cooled radiator, the air-cooled radiator further includes an air supply module 60 to increase the air circulation speed in the heat dissipation channel. The air supply module 60 includes: a first fan module 61 and a second fan module 62 arranged along the length direction of the heat dissipation channel. The first fan module 61 and the second fan module 62 are respectively arranged at the air inlet a and the air outlet b of the heat dissipation channel, and the air supply direction of the first fan module 61 and the second fan module 62 is the same, as shown in FIG. Figure 3bAs shown by the arrow in the figure, the air supply directions of the first fan module 61 and the second fan module 62 are the same as the direction of air flow. In Figure 3b As shown in Figure 3b , the first fan module 61 is used to send the cold air from the outside into the heat dissipation channel, while the second fan module 62 is used to extract the air in the heat dissipation channel to the outside. Through the cooperation of the first fan module 61 and the second fan module 62, the air flow speed in the heat dissipation channel is increased, thereby improving the heat dissipation efficiency of the air-cooled radiator.

[0074] The intelligent vehicle to which the in-vehicle computing device is applied includes an in-vehicle power supply system, and the in-vehicle power supply system supplies power to the first fan module or the second fan module through at least one of the two main boards. For example, the first fan module 61 is electrically connected to one of the two main boards, and the second fan module 62 is electrically connected to the other main board. Taking the first fan module 61 being connected to the first main board 20 and the second fan module 62 being connected to the second main board 30 as an example to illustrate the relationship between the fan module and the main board. The first fan module 61 is electrically connected to the first main board 20. When the first main board 20 is the main board in the working state, the in-vehicle power supply system supplies power to the first fan module 61 through the first main board 20, while the second fan module 62 is in the standby state. When the first main board 20 fails, the second main board 30 starts to work, and the in-vehicle power supply system supplies power to the second fan module 62 through the second main board 30, and the first fan module 61 is in the standby state. From the above description, it can be seen that no matter which main board fails, there can still be ensured that one fan module is in the working state, guaranteeing the heat dissipation effect of the air-cooled radiator, so that the first main board 20 or the second main board 30 can have a reliable heat dissipation effect.

[0075] In one possible implementation, the first fan module 61 can be electrically connected to the two main boards respectively, and the second fan module 62 can be electrically connected to the two main boards respectively. That is, the vehicle-mounted power supply system supplies power to the first fan module 61 through the first main board 20 and the second main board 30, and at the same time supplies power to the second fan module 62 through the first main board 20 and the second main board 30. Taking the first fan module 61 as an example, when the first main board 20 is in the working state and the second main board 30 is used as the standby main board, the vehicle-mounted power supply system supplies power to the first fan module 61 through the first main board 20, and the first fan module 61 is in the working state; when the first main board 20 fails and the second main board 30 starts to work, the vehicle-mounted power supply system supplies power to the first fan module 61 through the second main board 30 for operation. The working mode of the second fan module 62 is the same as that of the first fan module 61, so it will not be elaborated here. It can be seen from the above description that when the first main board 20 or the second main board 30 fails, the first fan module 61 and the second fan module 62 can still work normally, ensuring that the air-cooled radiator can dissipate heat normally and ensuring that the first main board 20 or the second main board 30 can have a reliable heat dissipation effect. Moreover, by using a shared radiator to dissipate heat from the two main boards at the same time, the occupied space of the vehicle-mounted computing device is reduced. With the volume of one vehicle-mounted computing device approximately the same as that in the prior art, the effect of two vehicle-mounted computing devices in the prior art can be achieved. At the same time, by connecting the first fan module 61 and the second fan module 62 to the two main boards respectively, it is ensured that at least one fan module is in the working state, improving the reliability of the air-cooled radiator and also improving the reliability of the vehicle-mounted computing device.

[0076] As Figure 6a and Figure 6b shown, Figure 6a shows an exploded view of the fan module and the air-cooled radiator; Figure 6b shows an assembled view of the fan module and the air-cooled radiator. Figure 6a and Figure 6b The same reference numerals in Figure 2 and Figure 3b can be referred to. The first fan module 61 and the second fan module 62 are both connected to the air-cooled radiator in a detachable manner. Taking the first fan module 61 as an example, the connection method between the fan module and the air-cooled radiator is described below.

[0077] Continue to refer to Figure 6a and Figure 6b , the first fan module 61 is detachably and fixedly connected to the housing 11 of the air-cooled radiator. The housing 11 of the air-cooled radiator is provided with a first jack 112 that cooperates with the first fan module 61. The first jack 112 is opened on a side wall of the housing 11 (not marked in the figure), and the length direction of the first jack 112 is perpendicular to the length direction of the heat dissipation channel. Also refer to Figure 3b, when the first fan module 61 is inserted into the first jack 112, the length direction of the first fan module 61 is perpendicular to the length direction of the heat dissipation channel 13, and the air supply direction of the first fan module 61 is the same as the length direction of the heat dissipation channel 13. Continue to refer to Figure 6b , the first fan module 61 is fixed to the side wall of the housing 11 by a threaded connection member (such as a bolt or a screw), for example, the first fan module 61 is fixedly connected to the side wall of the housing 11 by a screw. When maintenance is required, the screw can be removed and the first fan module 61 can be directly pulled out.

[0078] Refer to together Figure 7 , Figure 7 shows the structure of the first fan module 61. The first fan module 61 includes a bracket 64 and at least one mounting hole 65 provided on the bracket 64, and a fan is fixed in each mounting hole 65 by a connecting member, for example, the fan is fixed in the corresponding mounting hole 65 by a bolt, a screw or a buckle. In Figure 7 the shown structure, two mounting holes 65 are provided on the bracket 64, and the two mounting holes 65 are arranged along the length direction of the bracket 64. Refer to together Figure 3b as shown in, when the first fan module 61 is assembled into the air-cooled radiator, the arrangement direction of the fans is perpendicular to the length direction of the heat dissipation channel. Continue to refer to Figure 7 , a cable 63 connected to each fan is further provided on the bracket 64, and a connection terminal 66 for connecting to the first main board or the second main board, and the connection terminal 66 is electrically connected to each fan through the cable 63. When the first fan module 61 is inserted into the first jack, it is electrically connected to the first main board or the second main board through the connection terminal 66, or is electrically connected to the first main board and the second main board at the same time. The connection manner between the first fan module 61 and the first main board through the connection terminal 66 is a common connection manner in the prior art and will not be described in detail here.

[0079] When assembling the second fan module 62, a corresponding second jack 113 is provided on the housing 11, and the matching manner between the second fan module 62 and the second jack 113 is the same as the matching manner between the first fan module 61 and the first jack 112 described above, and will not be elaborated here. For the structure of the second fan module 62, reference can be specifically made to the description of the structure of the first fan module 61 above.

[0080] As a possible implementation manner, Figure 8Another way of cooperating between the fan module and the air-cooled radiator is shown. As shown in the figure, the first fan module 61 and the second fan module 62 are respectively located at both ends of the housing 11 of the air-cooled radiator, and both ends of the housing 11 of the air-cooled radiator are open. The two openings respectively correspond to the air inlet and the air outlet of the heat dissipation channel. When assembling the first fan module 61 and the second fan module 62, the first fan module 61 covers the air inlet of the heat dissipation channel, and the first fan module 61 is fixedly connected to the housing 11 through a threaded connector (such as a bolt or a screw); the second fan module 62 covers the air outlet of the heat dissipation channel, and the second fan module 62 is fixedly connected to the housing 11 through a threaded connector (bolt or screw). When adopting Figure 7 the shown connection method, the fan module is convenient to assemble, directly covers and fixes on the housing 11, reducing the assembly error.

[0081] As another possible implementation Figure 9 FIG. shows an exploded view of the second in-vehicle computing device provided by the embodiment of the present application. Figure 9 The same reference numerals in [] can refer to the reference numerals in the above Figure 2 . Different from Figures 1 to 8 , the radiator of the in-vehicle computing device provided by [] is a liquid-cooled radiator 70. Referring to Figure 9 together, FIG. shows a vertical cross-sectional view of the second in-vehicle computing device, Figure 10a and Figure 10b , Figure 10a FIG. shows a horizontal cross-sectional view of the second in-vehicle computing device. The liquid-cooled radiator 70 includes a housing 71 and heat dissipation pipes 74 arranged in the housing 71. Two opposite surfaces of the housing 71 are respectively in one-to-one heat conduction connection with the first main board 20 and the second main board 30. The arrangement of the heat dissipation pipes 74 is as shown in Figure 10b . The heat dissipation pipes 74 are laid horizontally (taking the placement direction of the liquid-cooled radiator in [] as the reference direction) in the housing 71, and the flat heat dissipation pipes 74 are coiled into an S-shaped heat dissipation pipe, and both ends of the heat dissipation pipes 74 are respectively communicated with the water inlet 73 and the water outlet 72 arranged on the housing 71. Figure 10b As shown in [], Figure 10b continuing to refer to FIG., a plurality of first heat dissipation fins 75 arranged at intervals are provided in the housing 71. Each first heat dissipation fin 75 has a first length, and the first length is less than the width of the housing 71. One end of each first fin 75 is connected to a side wall of the housing, and adjacent two first fins are connected to different side walls of the housing, so that a communicating "S"-shaped heat dissipation pipe is formed between the plurality of first heat dissipation fins 75. In

[0082] Continuing to refer to Figure 10b , a plurality of first heat dissipation fins 75 arranged at intervals are provided in the housing 71. Each first heat dissipation fin 75 has a first length, and the first length is less than the width of the housing 71. One end of each first fin 75 is connected to a side wall of the housing, and adjacent two first fins are connected to different side walls of the housing, so that a communicating "S"-shaped heat dissipation pipe is formed between the plurality of first heat dissipation fins 75. In Figure 10bAmong them, the number of the first heat dissipation fins 75 is four. The four first heat dissipation fins are respectively the first heat dissipation fin 751, the first heat dissipation fin 752, the first heat dissipation fin 753, and the first heat dissipation fin 754. And the four first heat dissipation fins are arranged along the arrangement direction of the water inlet 73 and the water outlet 72. The multiple first heat dissipation fins 75 divide the interior of the housing into multiple regions. To facilitate the description of the setting manner of the first heat dissipation fins 75, first define two opposite first side walls 711 and second side walls 712 of the lower housing 71. Among them, the first side wall 711 is the side wall provided with the water inlet 73, and the second side wall 712 is the other side wall opposite to the first side wall 711. Both ends of the first heat dissipation fin 751 are hermetically connected to the first side wall 711 and the second side wall 712 respectively; the first heat dissipation fin 752 is hermetically connected to the first side wall 711; the first heat dissipation fin 753 is hermetically connected to the second side wall 712; the first heat dissipation fin 754 is hermetically connected to the first side wall 711; and the first heat dissipation fin 754 and the side wall of the housing 71 (the side wall between the first side wall 711 and the second side wall 712) enclose a part of the heat dissipation pipe 74 communicating with the water outlet 72. It can be seen from the above description that by alternately hermetically connecting the first heat dissipation fins 752, 753, and 754 in the middle part to the first side wall 711 and the second side wall 712, a connected S-shaped heat dissipation pipe 74 can be formed. When the number of the first heat dissipation fins 75 is m (m is a positive integer and greater than 2), m - 1 bent S-shaped heat dissipation pipes can be formed. And through the S-shaped heat dissipation pipe, the fluidity of the liquid medium in the housing is increased, and the heat dissipation effect of the radiator is improved. As Figure 10b the direction of the liquid medium flow shown by the arrow in: the liquid medium flows into the heat dissipation pipe 74 from the water inlet 73, and then flows out through the water outlet 72. During the flowing process, the liquid medium takes away the heat transferred from the first main board or the second main board to the housing 71. The above liquid medium can adopt common media such as oil and water.

[0083] It should be understood that Figure 10b only the setting position of the heat dissipation pipe 74 is schematically shown in, and it does not represent the actual shape of the heat dissipation pipe 74.

[0084] Continue to refer to Figure 10b, in order to enhance the heat dissipation effect of the liquid-cooled radiator. A plurality of second heat dissipation fins are arranged between any adjacent first heat dissipation fins, and the plurality of second heat dissipation fins are arranged at intervals. The second heat dissipation fins have a second length, and the second length is less than the first length. Each second heat dissipation fin does not contact the side wall of the housing, so that a plurality of channels are formed between two adjacent first heat dissipation fins. The liquid can flow in the housing, conduct the heat of the components on the first main board and / or the second main board to the outside of the radiator, and achieve the heat dissipation of the computing device. For example, four second heat dissipation fins 76 are arranged between the first heat dissipation fin 751 and the first heat dissipation fin 752. The arrangement direction of the second heat dissipation fins 76 is the same as that of the first heat dissipation fins 75, and both ends of each second heat dissipation fin 76 are not sealed with the first side wall 711 and the second side wall 712, and there is a gap with a certain distance therebetween to allow the liquid medium to flow through. During use, the heat transferred to the housing 71 is transferred to the first heat dissipation fins 75 and the second heat dissipation fins 76; when the liquid medium flows in the liquid pipeline 74, the liquid medium contacts the first heat dissipation fins 75 and the second heat dissipation fins 76 respectively, thereby increasing the contact area between the liquid medium and the housing 71, and further enhancing the heat dissipation effect of the liquid medium.

[0085] When the liquid-cooled radiator is in use, an intelligent vehicle is equipped with a refrigeration system, which is used to control the liquid-cooled radiator. Specifically, the refrigeration system provides the power for the flow of the liquid medium in the liquid-cooled radiator. The liquid medium is pumped into the heat dissipation pipeline by a pump in the refrigeration system and driven to flow in the heat dissipation pipeline, so that the liquid medium dissipates heat from two chips in the heat dissipation pipeline. In addition, the liquid medium flowing through the liquid radiator is cooled by the refrigeration system and then enters the liquid radiator again, thus forming a circulating loop to continuously dissipate heat from the first main board and the second main board.

[0086] When the refrigeration system pumps the liquid medium into the heat dissipation pipeline, the volume of the liquid medium pumped into the heat dissipation pipeline by the refrigeration system each time is greater than or equal to the volume of the liquid medium accommodated between two adjacent first fins, so that the liquid medium pumped each time can fill the gap between the two first heat dissipation fins, avoiding the high-temperature liquid medium remaining between the two first heat dissipation fins and ensuring the fluidity of the liquid medium in the heat dissipation pipeline.

[0087] Optionally, when a plurality of first heat dissipation fins 75 divide the inside of the housing into a plurality of regions of the same size, the volume of the liquid medium pumped into the heat dissipation pipeline by the refrigeration system each time is greater than or equal to the volume of the liquid that can be accommodated in any one region, so that the liquid medium pumped each time can fill the space of one region. Under the action of the power, the liquid medium can flow in the housing, carry out the heat conducted by the chip liquid medium out of the housing, and the refrigeration system completes the cooling of the liquid medium, ensuring the effective heat dissipation of the liquid radiator for the components on the main board.

[0088] An embodiment of the present application further provides an intelligent vehicle, which can be a new energy vehicle or a vehicle powered by gasoline. However, no matter which type of vehicle is adopted, it includes an intelligent vehicle body and an automatic driving system arranged in the intelligent vehicle body, and the automatic driving system includes the above-mentioned in-vehicle computing device.

[0089] When specifically setting the in-vehicle computing device, due to the requirements of dust-proof / water-proof, one end inside the vehicle body of the in-vehicle computing device is, for example, at the front position or the rear position of the vehicle, or inside the passenger compartment.

[0090] As Figure 11 shown, Figure 11 shows a schematic diagram of an intelligent vehicle. The intelligent vehicle includes a power supply system 300, which is electrically connected to the first main board and the second main board of the in-vehicle computing device 100 respectively, and is electrically connected to the first fan module and the second fan module through the first main board or the second main board. When in use, the power supply system 300 supplies power to the first main board, the second main board, the first fan module and the second fan module, and improves the air fluidity in the radiator through the first fan module and the second fan module, so as to improve the heat dissipation effect on the first main board and the second main board. In addition, the intelligent vehicle further includes a refrigeration system 200, which is an air-conditioning system in the intelligent vehicle, and the air outlet of the air-conditioning system is communicated with the heat dissipation channel of the radiator, and the cold air blown out by the air-conditioning system can enter the heat dissipation channel to dissipate heat from the first main board and the second main board.

[0091] As Figure 12 shown, another internal structure schematic diagram of the intelligent vehicle. A refrigeration system 400 is arranged in the intelligent vehicle body, and the refrigeration system 400 includes: a condenser, a cooling plate communicated with the condenser through a pipeline, and the above-mentioned radiator, and the radiator is a liquid-cooled radiator. In addition, the intelligent vehicle further includes a power supply system 300, which supplies power to the in-vehicle computing device 100, and the specific power supply method can specifically refer to the corresponding description in Figure 12 . And the refrigeration system 400 is also used to cool the power supply system 300.

[0092] As Figure 13 shown, Figure 13The specific structure of the refrigeration system is shown. During specific heat dissipation, the intelligent vehicle uses coolant (a mixture of ethylene glycol and water, etc.) as a medium to form an independent refrigeration system to cool the battery pack. The refrigeration system includes components such as a liquid pump (such as a water pump), an electronic expansion valve (or a solenoid valve and a thermal expansion valve), a cooling plate (also known as a water-cooled plate), and a condenser. Among them, the water pump can be an electric water pump, and the water pump, as a driving component, provides a power source for the coolant circulation; the electronic expansion valve (not shown in the figure), as a control component, can actively adjust the flow rate of the refrigeration system according to the pressure and temperature of the refrigeration system; the cooling plate is used to dissipate heat from the battery, and the radiator in the in-vehicle computing device dissipates heat from the first main board and the second main board. During use, the coolant passing through the electronic expansion valve is respectively supplied to the cooling plate and the radiator, and the cooling plate and the radiator respectively dissipate heat from the battery and the first main board and the second main board. The heat-exchanged coolant flows into the battery cooler. The battery cooler is a heat-exchanging device. The battery cooler exchanges heat with the air-conditioning system through a pipeline. The air-conditioning system includes a condenser, an evaporator, an electric compressor, and an expansion valve and other devices. The structure of this air-conditioning system is the in-vehicle air-conditioning system in the prior art and will not be described in detail here. The battery cooler is connected in parallel with the evaporator in the air-conditioning system, and the cooling medium is provided by the condenser, and exchanges heat with the heat-exchanged coolant in the battery cooler. In the above refrigeration system, the original refrigeration system and air-conditioning system in the intelligent vehicle are used to provide heat dissipation for the radiator, which has a lower cost than the air-cooled radiator and better cooling effect than the air-cooled one.

[0093] In Figure 13 the example, in addition to the parallel arrangement of the in-vehicle computing device and the cooling plate, however, the specific connection manner of the in-vehicle computing device and the cooling plate is not limited in the embodiments of the present application. It can also be arranged in series, and the heat dissipation effect on the first main board and the second main board can be achieved.

[0094] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these changes and modifications.

Claims

1. An in-vehicle computing device in an intelligent vehicle, characterized in that, Including: Two main boards arranged in a stacked manner, each main board including a plurality of devices; wherein, only one of the two main boards, i.e., the first main board and the second main board, is in a working state, or the two main boards jointly complete data processing in a load-sharing manner; A radiator disposed between the two main boards and thermally connected to each main board; A closed plate disposed on a side of each main board facing away from the radiator and connected to the radiator.

2. The vehicle-mounted computing device according to claim 1, wherein The radiator is an air-cooled radiator.

3. The in-vehicle computing device according to claim 2, wherein The air-cooled radiator includes a housing, a heat dissipation channel disposed in the housing, and a air supply module; the air supply module includes: A first fan module and a second fan module arranged along the length direction of the heat dissipation channel, wherein the air supply directions of the first fan module and the second fan module are the same.

4. The vehicle-mounted computing device according to claim 3, wherein The intelligent vehicle includes a vehicle-mounted power supply system, and the vehicle-mounted power supply system supplies power to the first fan module or the second fan module through at least one of the two main boards; the first fan module is electrically connected to one of the two main boards, and the second fan module is electrically connected to the other of the two main boards; or The first fan module is electrically connected to the two main boards respectively, and the second fan module is electrically connected to the two main boards respectively.

5. The vehicle-mounted computing device according to claim 3 or 4, wherein The first fan module and the second fan module are respectively detachably and fixedly connected to the housing.

6. The vehicle-mounted computing device according to claim 5, wherein The housing is provided with a first jack and a second jack; the first fan module is detachably and fixedly mounted in the first jack, and the second fan module is detachably and fixedly mounted in the second jack.

7. The vehicle-mounted computing device according to any one of claims 2 to 6, characterized in that A plurality of heat dissipation fins are arranged in the housing, and the heat dissipation channel is formed between the plurality of heat dissipation fins.

8. The vehicle-mounted computing device according to any one of claims 2 to 7, characterized in that, The heat dissipation channel is a straight channel; and the length direction of the heat dissipation channel is perpendicular to the stacking direction of the two main boards.

9. The in-vehicle computing device according to claim 8, wherein, The first fan module sends the air outside the radiator into the heat dissipation channel, and the second fan module pumps the air in the heat dissipation channel out of the radiator.

10. The in-vehicle computing device according to claim 1, wherein, The radiator is a liquid-cooled radiator.

11. The in-vehicle computing device according to claim 10, wherein, The intelligent vehicle includes a refrigeration system for controlling the liquid-cooled radiator; the liquid-cooled radiator includes a housing and a heat dissipation pipe disposed in the housing, and a water inlet pipe and a water outlet pipe communicating with the heat dissipation pipe are disposed on the housing; wherein, two opposite surfaces of the housing are respectively connected to the two main boards.

12. The vehicle-mounted computing device according to claim 11, wherein, A plurality of first heat dissipation fins arranged at intervals are disposed in the housing, and a communicating S-shaped heat dissipation pipe is formed between the plurality of first heat dissipation fins.

13. The in-vehicle computing device according to claim 12, wherein, A plurality of second heat dissipation fins are disposed between any adjacent first heat dissipation fins, and the plurality of second heat dissipation fins are arranged at intervals.

14. The vehicle-mounted computing device according to any one of claims 11 to 13, wherein: The refrigeration system is used to pump a liquid medium into the heat dissipation pipe, and the liquid medium dissipates heat from the two chips in the heat dissipation pipe.

15. The in-vehicle computing device according to claim 14, wherein, A plurality of first fins are disposed inside the housing. The plurality of first fins divide the inside of the housing into a plurality of regions. The first fins have a first length. One end of each first fin abuts against the inner wall of the housing, and adjacent two first fins abut against different inner walls of the housing. The two different inner walls are arranged in parallel. A plurality of second fins are arranged at intervals in each region. Each of the plurality of second fins has a second length. The first length is greater than the second length. Each second fin does not abut against the inner wall of the housing.

16. The vehicle-mounted computing device according to claim 14, wherein When the heat dissipation pipe is formed by the plurality of first heat dissipation fins, the volume of the liquid medium pumped into the heat dissipation pipe by the refrigeration system each time is greater than or equal to the volume of the liquid medium accommodated between two adjacent first fins.

17. The vehicle-mounted computing device according to any one of claims 1 to 16, characterized in that, Each main board has a first surface facing the radiator. At least one first functional device is arranged on the first surface, and the at least one first functional device is thermally connected to the radiator.

18. The vehicle-mounted computing device according to any one of claims 1 to 17, characterized in that, Each main board has a second surface facing away from the radiator. At least one second functional device is arranged on the second surface; The closing plate corresponding to each main board is a heat dissipation plate; and each second functional device of each main board is thermally connected to the heat dissipation plate.

19. The in-vehicle computing device according to any one of claims 1 to 16, characterized in that, Each main board has a first surface facing the radiator. At least one first functional device is arranged on the first surface, and the at least one first functional device is thermally connected to the radiator; And, Each main board has a second surface facing away from the radiator. At least one second functional device is arranged on the second surface; the closing plate corresponding to each main board is a heat dissipation plate; and each second functional device of each main board is thermally connected to the heat dissipation plate The power of the first functional device on each main board is greater than the power of the second functional device.

20. A smart car, characterized in that: It includes an intelligent vehicle body and an in-vehicle computing device as described in any one of claims 1 to 19 provided in the intelligent vehicle body.

21. The intelligent vehicle according to claim 20, wherein: The in-vehicle computing device is arranged at one end of the intelligent vehicle body.

22. The intelligent vehicle according to claim 20, wherein, It further includes a refrigeration system provided in the intelligent vehicle body. The refrigeration system includes: a condenser, a cooling plate and the radiator communicated with the condenser through a pipeline, wherein the radiator is a liquid-cooled radiator.

23. The intelligent vehicle according to claim 20, characterized in that, The refrigeration system further includes a liquid pump arranged on the pipeline.

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