V-COB packaging device and method for ultra-high-definition display screen module

Abstract

The invention relates to the technical field of display screen chip packaging, in particular to a V-COB packaging device and method for an ultra-high-definition display screen module, the V-COB packaging device comprises a workbench and a plurality of glue sealing heads mounted above the workbench, a packaging table is placed on the top surface of the workbench, a board placing box is arranged behind one side of the packaging table, and a plurality of placing boxes are placed in the board placing box; the storage box is used for neatly storing a plurality of display screen module circuit boards And a conveying group is arranged in the top surface of one side of the packaging table, a chip bonding group is arranged above the board placing box, and the chip bonding group is matched with the conveying group to pull the placing box forwards, so that chips are glued and bonded to the plurality of display screen module circuit boards. According to the invention, through the dynamic cooperation of the core bonding group, the conveying group and the core pressing wheel, the full-process automation from circuit board feeding, chip taking and placing, gluing to pressing is completed, the efficiency of a single process is improved, the bonding yield of the chip is improved, and an efficient basis is determined for subsequent lead bonding and sealing glue curing.

Description

Technical Field

[0001] The present invention relates to the technical field of display screen chip packaging, and specifically to a V-COB packaging device and method for ultra-high-definition display screen modules. Background Art

[0002] The COB packaging technology adheres bare chips to an interconnection substrate with conductive or non-conductive glue, and then performs wire bonding to achieve its electrical connection. It has become the mainstream of LED display screens due to its advantages such as ultra-thinness, anti-collision and anti-compression, large viewing angle, and bendability. V-COB is an optimized version developed on the basis of the standard COB technology. The "V" here emphasizes that it has been specifically optimized and enhanced for visual display effects. For example, improving the encapsulation glue, materials, and manufacturing process to enhance the light efficiency and reduce halos and glares.

[0003] The patent with the application number CN202322652279.9 discloses a COB packaged display screen, including a mounting plate assembly; a display screen assembly fixed on the mounting plate assembly, the display screen assembly includes a plurality of COB display structures and a light-shielding layer, the plurality of COB display structures are interconnected, and the light-shielding layer covers the circumferential side surface of the COB display structure; a dust removal assembly movably arranged on the light-emitting surface of the display screen assembly. The technical solution of this patent effectively solves the problem in the prior art that when multiple COB modules are spliced together, there is interference of refracted light between adjacent modules, resulting in light mixing.

[0004] In the COB packaging process of ultra-high-definition display screens, the chip bonding efficiency directly affects the overall production capacity. The traditional bonding method has problems such as low positioning accuracy and poor operation consistency. Although the above patent solves the problem of light interference after the COB display screen is spliced through the light-shielding layer design, its technical core focuses on the optical optimization and dust removal after the packaging is completed, and does not involve the automation improvement of the chip bonding link. Especially in mass production, the precise alignment of the chip and the circuit board, uniform glue application, and non-destructive pressing are still technical bottlenecks, resulting in low efficiency in the front-end process of packaging and restricting the improvement of the overall production capacity. Summary of the Invention

[0005] In order to overcome the defects in the prior art, the purpose of the present invention is to provide a V-COB packaging device and method for ultra-high-definition display screen modules. Through the dynamic coordination of the chip bonding group, the conveying group, and the pressing mechanism in the bonding process in the early stage of chip packaging, the full-process automation from circuit board feeding, chip picking and placing, glue application to pressing is completed, and the efficiency of a single process is improved to solve the problems raised in the above background art.

[0006] To achieve the above objectives, on the one hand, the present invention provides a V-COB packaging device for an ultra-high-definition display screen module, comprising a workbench and several sealing heads installed above it, a packaging table placed on the top surface of the workbench, a board box provided behind one side of the packaging table, and several placement boxes placed inside the board box for neatly storing several display module circuit boards;

[0007] A conveying group is provided on the top surface of one side of the packaging table, and a core sticking group is provided above the board box, which cooperates with the conveying group to pull the placement box forward, and the chips are glued and glued to a number of display module circuit boards; a shifting block is provided at the middle of the front end of the placement box, and the conveying group includes a conveyor belt and a servo motor provided flush with the top surface of the packaging table, and shifting teeth are symmetrically provided on the outer sides of both ends of the conveyor belt. A spring-loaded support plate is installed inside the board box, and the top surface of the board box is open and an inclined guide platform is provided on the top of the rear side surface thereof, which is used to guide the placement box on the top layer to move forward and displace, and then the shifting block is driven by the contact of the shifting teeth;

[0008] The core sticking group includes a pair of vertically arranged core placing tubes, a pair of vertically arranged glue liquid tubes and a core delivering group rotatably connected to the bottom of the core placing tubes. The core delivering group consists of a pair of core delivering sleeves, a pair of ventilation sleeves and a ventilation tube coaxially connected, wherein the core delivering sleeve is adapted to fit the outer side surface of the ventilation sleeve, and the outer side surface of the core delivering sleeve is symmetrically provided with core placing grooves, and an air extraction channel is provided between the ventilation tube and the core placing groove. The inner wall of the bottom of the air extraction channel is provided with a sealing rod, the rotation ratio of the conveyor belt and the core delivering sleeve is 2:1, and the bottom end of the glue liquid tube is open and is slidably connected to a rubber wheel.

[0009] The above-mentioned setting significantly improves the automation level of the chip bonding process through innovative mechanical linkage design and modular structure.

[0010] As a further improvement of the present technical solution, a box delivery port is provided on the rear side wall of the board box and at the bottom of the inclined guide platform. The placement box is adapted to be slidably plugged into the box delivery port. Limit platforms are fixed on both sides of the top port of the board box, and the limit platforms protrude from the inner side wall of the board box.

[0011] As a further improvement of the present technical solution, one end of the roller of the conveyor belt near the end of the plate box is coaxially connected to a driving pulley, one end of the ventilation pipe is provided with a driven pulley through a bearing sleeve, the driven pulley and a pair of ventilation sleeves are coaxially connected through straight pipes, the other end of the ventilation pipe is connected to an air pump, the circumference of the driving pulley is equal to the side length of the display module circuit board in the forward movement direction, the circumference of the driven pulley is twice the circumference of the driving pulley, and the driven pulley and the driving pulley are connected by a transmission belt.

[0012] As a further improvement of the technical solution, a through hole is opened on the bottom surface of the core placement groove. A plurality of ventilation holes are arranged at equal intervals in a ring shape on the outer side surface of the ventilation sleeve, and the ventilation holes are communicated with the straight pipe. Sleeve rings are fixedly arranged above both ends of the sealing rod, and the sleeve rings are tangent to the arc surface on the bottom side of the sealing rod. The sealing rod is inserted into the straight pipe and contacts its bottom side wall. A hook is fixedly arranged on the bottom surface of the sleeve ring at the outer end of the sealing rod, and the hook is clamped and matched with the side wall of the support at both ends of the straight pipe.

[0013] As a further improvement of the technical solution, through grooves are symmetrically opened on both side walls of the core placement cylinder. The outer side of the bottom end of the core placement cylinder is tightly sleeved with a clamping cover, and the clamping cover is sleeved with the core feeding sleeve.

[0014] As a further improvement of the technical solution, an inclined through port is arranged obliquely at the bottom end of the glue liquid cylinder. Waist-shaped holes are opened on both side walls of the inclined through port, and both ends of the wheel shaft of the glue wheel are correspondingly inserted and slid in the two waist-shaped holes.

[0015] As a further improvement of the technical solution, linkage rods are also sleeved at both ends of the wheel shaft of the glue wheel. The bottom end of the linkage rod is slidably clamped and matched with the outer side surface of the core feeding sleeve. Chute grooves are opened on both end faces of the core feeding sleeve and outside the core placement groove. An elastic sheet abuts against the upper end of the linkage rod, and both ends of the elastic sheet are fixed on the outer side wall of the glue liquid cylinder. The elastic sheet is in a straight sheet shape in the natural state and is close to the bottom position of the waist-shaped hole. When the core feeding sleeve drives the chip to rotate to the linkage rod, under the elastic force of the elastic sheet, the linkage rod slides into the chute groove, driving the glue wheel to contact the surface of the chip and relatively roll for gluing.

[0016] As a further improvement of the technical solution, a pair of core pressing wheels are supported and arranged on the top surface of the packaging table and at the rear end of the conveyor belt. The pair of core pressing wheels are arranged in front and back alignment with a pair of core feeding sleeves. A transmission gear is sleeved at one end of the wheel shaft of the pair of core pressing wheels. Another transmission gear is coaxially connected to the outside of the driving belt wheel, and the two transmission gears are meshed and transmitted.

[0017] As a further improvement of the technical solution, a portal-shaped support frame is erected above the middle of the plate placement box. A pressing rod is inserted in the middle of the top surface of the support frame. A hemispherical pressing pad is sleeved at the bottom end of the pressing rod. The core placement cylinder and the glue liquid cylinder are both sleeved in the support frame extending and fixed on the top surface of the support frame.

[0018] On the other hand, the present invention provides a V-COB packaging method for an ultra-high-definition display screen module, using the above-mentioned V-COB packaging device for an ultra-high-definition display screen module, including the following steps:

[0019] S1. Place a plurality of chips in the core placement cylinder, fill the glue liquid cylinder with glue liquid, then neatly place a plurality of display screen module circuit boards in the placement box, and then put a plurality of placement boxes filled with display screen module circuit boards into the plate placement box;

[0020] Several placement boxes are bounced by the pallet, and the rear end of the placement box on the top layer is guided by the inclined guide platform to slide and lean against the front of the top port of the board box, thereby forming a misaligned state with the placement box below;

[0021] S2, at this time, the servo motor is started to drive the conveyor belt to circulate. When a shifting tooth moves to the front end of the board box, it contacts the shifting block and drives the placement box to move to the top surface of the packaging table;

[0022] S3. When all the cassettes are moved to the top of the packaging table, the vacuum pump is started to extract air through the through-hole of the core feeding sleeve to suck a chip. The speed of the conveyor belt is reduced by the driving pulley and the driven pulley, and the core feeding sleeve is driven to put down the chip every half a circle.

[0023] S4, during step S3, the chip is transferred to the glue cylinder along with the core feeding sleeve, and is contacted by the glue wheel and rolled to apply glue;

[0024] S5, the chip is then bonded into place by the flexible rolling of the core pressing wheel;

[0025] S6. After the chips of the circuit boards in the placement box are bonded, wire bonding is performed to achieve electrical connection, and then the placement box is transferred to the bottom of the sealing head for sealing curing.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] 1. The V-COB packaging device and method for the ultra-high-definition display screen module completes the automation of the entire process from circuit board feeding, chip placement, glue coating to pressing through the dynamic coordination of the core bonding group, conveying group and core pressing wheel, thereby improving the efficiency of each single process and the chip bonding yield, laying an efficient foundation for subsequent wire bonding and sealing curing.

[0028] 2. The V-COB packaging device and method for the ultra-high-definition display screen module uses the offset guidance design of the spring support plate and the inclined guide table in the board box to complete the automatic lifting and forward displacement of the placement box. This achieves the effect that the placement box can be accurately grasped by the conveyor belt without human intervention, realizes the continuous supply of circuit boards, and reduces the interval time between processes.

[0029] 3. The V-COB packaging device and method of the ultra-high-definition display screen module, through the design of the rotary exhaust channel of the core feeding sleeve and the vent sleeve, cooperates with the sealing control of the sealing rod to the lower vent hole, completes the adsorption of the chip in the core placement groove and the directional downward release; achieves the effect of zero displacement in the chip transfer process, and the landing position is precisely matched with the circuit board pad; and through the clamping structure of the linkage rod and the core feeding sleeve slide, combined with the spring force storage to drive the rubber wheel to slide obliquely, completes the rolling quantitative glue coating on the back of the chip; achieves the effect of uniform and controllable thickness of the glue layer, and avoids bonding failure caused by incomplete coverage of the glue liquid.

[0030] 4. The V-COB encapsulation device and method for the ultra-high definition display screen module complete the tangential rolling of the chip through the reverse rotation design of the gear drive between the core pressing wheel and the conveyor belt, achieving the effect of flexible pressing and bonding and preventing chip displacement or damage caused by static pressing.

[0031] 5. The V-COB encapsulation device and method for the ultra-high definition display screen module complete the compatible adaptation of different sizes of circuit boards and chip layouts through the customized design of the core feeding sleeve specifications and the core placement groove layout, achieving the effect of plug-and-play of the device and supporting the rapid production conversion of multiple models of products. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The drawings described herein are for illustrative purposes only and are not intended to limit the scope of the disclosure of the present invention in any way. Additionally, the shapes and proportional dimensions of the components in the drawings are only schematic and are used to assist in understanding the present invention, rather than specifically defining the shapes and proportional dimensions of the components of the present invention. Those skilled in the art can select various possible shapes and proportional dimensions according to specific circumstances to implement the present invention under the teaching of the present invention.

[0033] Figure 1 is a schematic diagram of the overall assembly structure of the present invention;

[0034] Figure 2 For the present invention Figure 1 is a top view;

[0035] Figure 3 is a schematic diagram of the partial assembly structure of the present invention;

[0036] Figure 4 is a schematic diagram of the assembly structure of the encapsulation table, conveying group and chip bonding group of the present invention;

[0037] Figure 5 For the present invention Figure 4 is a partial cross-sectional view in the side view state;

[0038] Figure 6 is a schematic diagram of the encapsulation table structure of the present invention;

[0039] Figure 7 is a disassembled view of the assembly of the conveying group and the core feeding group of the present invention;

[0040] Figure 8 is a schematic diagram of the assembly structure of the core placement cylinder, glue cylinder and core feeding sleeve of the present invention;

[0041] Figure 9 is a schematic diagram of the core feeding sleeve structure of the present invention;

[0042] Figure 10 is a disassembled view of the assembly of the glue cylinder and the glue wheel of the present invention;

[0043] Figure 11 Schematic diagram of the assembly structure of the pressure rod and the support frame of the present invention;

[0044] Figure 12 Schematic diagram of the assembly structure of the core pressing wheel of the present invention;

[0045] The meanings of each label in the figure are as follows:

[0046] 100, workbench; 110, sealing head; 120, encapsulation table; 121, limit strip; 122, avoidance groove; 130, plate placing box; 131, box feeding port; 132, inclined guide table; 133, limit table; 140, placing box; 141, dialing block;

[0047] 200, conveying group; 210, conveyor belt; 211, dialing teeth; 220, servo motor; 230, driving pulley;

[0048] 300, core sticking group; 310, core placing cylinder; 311, through groove; 312, card cover; 320, core feeding group; 321, core feeding sleeve; 3211, core placing groove; 3212, through hole; 3213, sliding groove; 322, ventilation sleeve; 3221, ventilation hole; 323, ventilation pipe; 324, driven pulley; 325, sealing rod; 330, glue cylinder; 3301, inclined through port; 3302, waist-shaped hole; 331, glue wheel; 332, linkage rod; 333, elastic piece;

[0049] 340, core pressing wheel; 341, transmission gear; 350, pressure rod; 351, pressure pad; 360, support frame; 361, support frame. Specific embodiments

[0050] Combined with the description of the specific embodiments of the present invention and the accompanying drawings, the details of the present invention can be more clearly understood. However, the specific embodiments of the present invention described herein are only for the purpose of explaining the present invention and cannot be understood in any way as a limitation of the present invention. Under the teaching of the present invention, the concepts of those skilled in the art based on any possible deformation of the present invention should all be regarded as belonging to the scope of the present invention. The terms "installation" and "connection" should be understood in a broad sense, which can be directly connected or indirectly connected through an intermediate medium.

[0051] The orientation or positional relationship indicated by the terms "central axis", "vertical", "horizontal", "front", "rear", "upper", "lower", "left", "right", "top", "bottom", "inner", "outer", etc. used herein is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, in the description of the present invention, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.

[0052] Please refer to Figures 1-7 As shown, the present invention provides a V-COB encapsulation device for an ultra-high definition display screen module, including a workbench 100 and a plurality of encapsulation heads 110 installed above it. There is a glue supply tank for supplying epoxy resin glue to the plurality of encapsulation heads 110 behind the workbench 100. This is the prior art and will not be elaborated here. On the top surface of the workbench 100, there is an encapsulation table 120. Behind one side of the encapsulation table 120, there is a plate placing box 130. Inside the plate placing box 130, there are a plurality of placing boxes 140 for neatly storing a plurality of display screen module circuit boards. On the top surface of the encapsulation table 120 and below the entirety of the plurality of encapsulation heads 110, there is an embedded limiting strip 121 for limiting the placing box 140, so that the chips on the circuit board are aligned with the encapsulation heads 110 and then are injected with glue for encapsulation.

[0053] Specifically, a conveying group 200 is arranged inside the top surface of one side of the encapsulation table 120, and a chip sticking group 300 is arranged above the plate placing box 130. Cooperating with the conveying group 200 to pull the placing box 140 forward, the chips are coated with glue and stuck to a plurality of display screen module circuit boards. In the middle of the front end of the placing box 140, there is a dialing block 141. The conveying group 200 includes a conveyor belt 210 and a servo motor 220 that are flush with the top surface of the encapsulation table 120. On the top surface of the encapsulation table 120 and in front of the plate placing box 130, there is an avoidance groove 122 for placing the conveyor belt 210 to contact the placing box 140 and drive it to move onto the encapsulation table 120.

[0054] Furthermore, on the outer sides of both ends of the conveyor belt 210, there are symmetrically arranged dialing teeth 211. Inside the plate placing box 130, there is an upwardly resilient support plate. By symmetrically embedding a plurality of springs on the bottom surface of the support plate to form an upward resilient force, so that a plurality of placing boxes 140 placed in the plate placing box 130 are always pushed upward and horizontally taken out by the conveyor belt 210. The top surface of the plate placing box 130 is open, and at the top of its rear side, there is an inclined guide platform 132. Its longitudinal section is a right triangle and the inclined surface faces forward, for guiding the topmost placing box 140 to move forward and be misaligned, and then the dialing block 141 is contacted and driven by the dialing teeth 211. By chamfering the rear top edge of the placing box 140 to be slidably matched with the inclined guide platform 132, when the placing box 140 is pushed upward by the support plate, it contacts the inclined guide platform 132 and is smoothly guided to move forward.

[0055] Furthermore, on the rear side wall of the plate placing box 130 and at the bottom of the inclined guide platform 132, there is a box feeding port 131. The placing box 140 is slidably inserted into the box feeding port 131 in a matching manner. By pressing the upper placing box 140 to expose the box feeding port 131, a new placing box 140 can be inserted. On both sides of the top port of the plate placing box 130, there are fixed limiting platforms 133. The limiting platforms 133 protrude from the inner side wall of the plate placing box 130 for limiting a plurality of placing boxes 140 from being pushed out of the plate placing box 130.

[0056] AsFigures 8-12 As shown, the chip sticking group 300 includes a pair of vertically arranged chip placing cylinders 310, a pair of vertically arranged glue cylinders 330, and a chip feeding group 320 rotatably connected to the bottom of the chip placing cylinder 310. The chip feeding group 320 is coaxially connected and composed of a pair of chip feeding sleeves 321, a pair of air vent sleeves 322, and an air vent pipe 323. Among them, the outer side surface of the chip feeding sleeve 321 is properly sleeved and connected with the outer side surface of the air vent sleeve 322. Chip placing grooves 3211 are symmetrically arranged on the outer side surface of the chip feeding sleeve 321. An air extraction channel is provided between the air vent pipe 323 and the chip placing grooves 3211. The specifications of the chip feeding sleeve 321, as well as the specifications, positions, and quantities of the chip placing grooves 3211 arranged, are adapted and customized according to the size of the circuit board and the chip bonding position for quick replacement and use; both ends of the straight pipe are fixedly connected to the top surface of the placing board box 130 through brackets, and the chip feeding sleeve 321 can be replaced by removing one end of the bracket; a sealing rod 325 is sleeved on the inner wall of the bottom of this air extraction channel, which is used to seal the air extraction channel when the chip placing groove 3211 rotates to the lower side, so that the chip in the chip placing groove 3211 loses suction and falls onto the circuit board; the rotation ratio of the conveyor belt 210 and the chip feeding sleeve 321 is 2:1. The bottom end of the glue cylinder 330 is open and is slidably connected with a glue wheel 331, which is used to contact the chip for gluing and then stick it to the circuit board.

[0057] Specifically, one end of the roller of the conveyor belt 210 near the end of the placing board box 130 is coaxially connected with a driving pulley 230. One end of the air vent pipe 323 is sleeved with a driven pulley 324 through a bearing. The driven pulley 324 is coaxially connected and matched with a pair of air vent sleeves 322 through a straight pipe. The other end of the air vent pipe 323 is connected to an air extraction pump. The perimeter of the driving pulley 230 is equal to the side length of the circuit board of the display module in the forward movement direction. The perimeter of the driven pulley 324 is twice the perimeter of the driving pulley 230. The driven pulley 324 and the driving pulley 230 are connected by a transmission belt. That is, when the placing box 140 is pulled by the conveyor belt 210 to move forward one stroke according to the length of the circuit board, through the rotation ratio conversion of the driven pulley 324 and the driving pulley 230, the chip feeding sleeve 321 drives the chip to rotate half a circle, and just drops the chip onto the predetermined position of the circuit board for bonding.

[0058] Further, a through hole 3212 is opened on the bottom surface of the core placement groove 3211. A plurality of vent holes 3221 are arranged at equal intervals in a ring shape on the outer side surface of the vent sleeve 322, and the vent holes 3221 are communicated with the straight pipe. Above both ends of the sealing rod 325, a collar is fixedly provided, and the collar is tangent to the arc surface on the bottom side of the sealing rod 325. The sealing rod 325 is inserted into the straight pipe and contacts its bottom side wall. The collar rotates relative to the inner wall of the straight pipe. A silica gel sheet is adhered to the bottom side wall of the sealing rod 325, which serves to seal the vent hole 3221 rotated to the lower side, thereby losing the adsorption effect on the chip in the core placement groove 3211; a hook is fixedly provided on the bottom surface of the collar at the outer end of the sealing rod 325, and the hook is engaged with the side wall of the bracket at both ends of the straight pipe, so that the sealing rod 325 is fixed and does not rotate synchronously with the vent sleeve 322 and the straight pipe, always sealing the vent hole 3221 rotated to the lower side, and allowing the chip to fall out of the core placement groove 3211 when it faces downward; a rubber plug is sleeved inside the collar located outside, which is used to seal the straight pipe, so that air can only be extracted from the plurality of vent holes 3221, ensuring the adsorption force of the chip.

[0059] Further, through grooves 311 are symmetrically opened on both side walls of the core placement cylinder 310, which is convenient for observing the chips placed in the core placement cylinder 310 and adjusting a plurality of chips to be horizontally stacked and piled up from the through grooves 311; the bottom end outside of the core placement cylinder 310 is tightly sleeved with a clamping cover 312, the clamping cover 312 is sleeved with the core feeding sleeve 321, and both sides of the clamping cover 312 extend to the outside of the vent sleeve 322, thereby axially limiting the core feeding sleeve 321. In addition, a groove in the axial direction is opened on the outer wall of the vent sleeve 322, and a rib in the axial direction protrudes from the inner wall of the core feeding sleeve 321. The rib and the groove are arranged opposite to each other and are inserted and matched, so that the through hole 3212 and the vent hole 3221 are correspondingly communicated.

[0060] Further, an inclined through port 3301 is obliquely provided at the bottom end of the glue liquid cylinder 330. When installing the glue liquid cylinder 330, the inclined through port 3301 is placed facing the core feeding sleeve 321; waist-shaped holes 3302 are opened on both side walls of the inclined through port 3301, and both ends of the wheel shaft of the glue wheel 331 are correspondingly inserted and slid in the two waist-shaped holes 3302, so that the glue wheel 331 slides obliquely in the inclined through port 3301, and at the same time, the glue liquid in the glue liquid cylinder 330 does not leak.

[0061] Specifically, in order to apply glue to the back surface of the chip, linkage rods 332 are further sleeved at both ends of the wheel shaft of the glue wheel 331. The bottom ends of the linkage rods 332 are slidably clamped and adapted to the outer side surface of the core feeding sleeve 321, thereby forming a limiting structure to prevent the linkage rods 332 from rotating with the glue wheel 331. By increasing the arc length of the linkage rods 332 in contact with the core feeding sleeve 321, the limiting stability is increased;

[0062] The two end surfaces of the core feeding sleeve 321 and the outer side of the core setting groove 3211 are provided with a slide groove 3213, the linkage rod 332 is engaged and slid with the slide groove 3213, and the central angle of the slide groove 3213 is at least equal to the central angle of the core setting groove 3211. By increasing the sliding stroke of the linkage rod 332 and the slide groove 3213, the range of contact between the rubber wheel 331 and the chip is controlled, and the glue is fully applied; the upper end of the linkage rod 332 is abutted with a spring piece 333, which is made of spring steel and has a straight sheet structure. When the core sleeve 321 is transferred to the linkage rod 332 with the chip, the linkage rod 332 slides into the slide groove 3213 under the elastic force of the spring piece 333, driving the rubber wheel 331 to contact the chip surface and roll relative to the glue.

[0063] In addition, in order to ensure that the chip is firmly bonded, a pair of core pressing wheels 340 are supported on the top surface of the packaging platform 120 and located at the rear end of the conveyor belt 210. The pair of core pressing wheels 340 are aligned front and back with the pair of core feeding sleeves 321. One end of the wheel shaft of the pair of core pressing wheels 340 is sleeved with a transmission gear 341, and both ends of the wheel shaft are also sleeved with rings and fixed to the top surface of the packaging platform 120; the outside of the active pulley 230 is coaxially connected to another transmission gear 341, and the two transmission gears 341 are engaged for transmission, thereby transmitting the rotational force of the conveyor belt 210 to the core pressing wheel 340, and rotating in the opposite direction, and tangentially rolling the chip on the circuit board to prevent the chip from being touched and squeezed by the stationary core pressing wheel 340 and shifting.

[0064] Furthermore, a door-shaped support frame 360 is set above the middle of the board box 130, and a pressure rod 350 is inserted in the middle of the top surface of the support frame 360. A spring is sleeved on the outer wall of the pressure rod 350 and located above the top surface of the support frame 360. By pressing the pressure rod 350 to contact the placement box 140 located above and exposing the box delivery port 131, a new placement box 140 can be inserted; when the hand is released, the pressure rod 350 is reset upward under the rebound action of the spring; the bottom end of the pressure rod 350 is sleeved with a hemispherical pressure pad 351, which is made of silicone material, so that it can flexibly contact the circuit board to avoid damage due to pressure; the core tube 310 and the glue tube 330 are both sleeved in a support frame 361 that is fixedly extended from the top surface of the support frame 360, so that the two can work stably in the air.

[0065] The present invention also provides a V-COB packaging method for an ultra-high-definition display screen module, using the above-mentioned V-COB packaging device for an ultra-high-definition display screen module, comprising the following steps:

[0066] S1. Place several chips into the chip placement cylinder 310, fill the conductive adhesive into the adhesive cylinder 330, then neatly place several display module circuit boards into the placement box 140, and then put several placement boxes 140 filled with display module circuit boards into the board placement box 130; by opening air holes on the top cover of the adhesive cylinder 330, the adhesive can smoothly fall and contact the surface of the adhesive wheel 331.

[0067] Several placement boxes 140 are bounced up by the support plate, and the rear end of the uppermost placement box 140 is guided and slid by the inclined guide table 132 and leans against the front of the top port of the board placement box 130, thus forming a dislocation state with the placement box 140 below.

[0068] S2. At this time, start the servo motor 220 to drive the conveyor belt 210 to move in a cycle. When a tooth 211 rotates to the front end of the board placement box 130, it contacts the dial block 141 and drives the placement box 140 to move to the top surface of the encapsulation table 120.

[0069] S3. During the process of all placement boxes 140 moving to the top surface of the encapsulation table 120, start the air pump to pump air through the through hole 3212 of the core feeding sleeve 321 to suck a chip, and the rotation speed of the conveyor belt 210 is reduced by the driving pulley 230 and the driven pulley 324, so that the core feeding sleeve 321 drops a chip every half turn.

[0070] S4. During step S3, the chip rotates with the core feeding sleeve 321 to the adhesive cylinder 330. Under the elastic force of the elastic piece 333, the linkage rod 332 is bounced into the chute 3213, driving the adhesive wheel 331 to contact the surface of the chip and roll relatively to apply glue.

[0071] S5. Then, the chip is bonded in place by the flexible rolling of the core pressing wheel 340.

[0072] S6. After the chips on the circuit boards in the placement box 140 are bonded, wire bonding is carried out to achieve their electrical connection, and then this placement box 140 is transferred under the sealing head 110 for sealing and curing.

[0073] It should be noted that the fixed connections and fixed settings in the present invention are realized by conventional fixing means such as bolt connection or welding. The above embodiments are only used to illustrate the technical concept and features of the present invention, and their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and cannot be used to limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. V-COB encapsulation device for ultra-high definition display screen module, including a workbench and a number of glue dispensing heads installed above the workbench, and a glue supply tank for supplying epoxy resin glue to the number of glue dispensing heads is arranged behind the workbench, characterized in that: On the top surface of the workbench, there is a packaging table. Behind one side of the packaging table, there is a plate placing box, and several placing boxes are placed inside the plate placing box; Inside the top surface of one side of the packaging table, there is a conveying group. Above the plate placing box, there is a chip sticking group. By pulling the placing box forward in cooperation with the conveying group, glue is applied to the chips and they are stuck to several display module circuit boards; The conveying group includes a conveyor belt and a servo motor that are flush with the top surface of the packaging table. On the outer sides of both ends of the conveyor belt, there are symmetrically arranged teeth. The top surface of the plate placing box is open, and at the top of its rear side, there is an inclined guide platform for guiding the topmost placing box to move forward and be misaligned, and then be contacted and driven by the teeth; The chip sticking group includes a pair of vertically arranged chip placing cylinders, a pair of vertically arranged glue liquid cylinders, and a chip feeding group that is rotatably connected to the bottom of the chip placing cylinder. The bottom end of the glue liquid cylinder is open and is slidably connected with a glue wheel.

2. The V-COB packaging device for the ultra-high definition display screen module according to claim 1, wherein: On the rear side wall of the plate placing box and at the bottom of the inclined guide platform, there is a box feeding port. Inside the plate placing box, there is an upward elastic support plate. The placing box is slidably inserted in a matching manner with the box feeding port. On both sides of the top port of the plate placing box, there are fixed limiting platforms that protrude from the inner side wall of the plate placing box. In the middle of the front end of the placing box, there is a shifting block.

3. The V-COB packaging device for the ultra-high definition display screen module according to claim 2, wherein: The chip feeding group is composed of a pair of chip feeding sleeves, a pair of ventilation sleeves, and a ventilation pipe coaxially connected. Among them, the outer sides of the chip feeding sleeve and the ventilation sleeve are properly sleeved. On the outer side of the chip feeding sleeve, there are symmetrically arranged chip placing grooves. Between the ventilation pipe and the chip placing groove, there is an air extraction channel. The bottom inner wall of this air extraction channel is sleeved with a sealing rod. The rotation ratio of the conveyor belt to the chip feeding sleeve is 2:1; One end of the roller of the conveyor belt close to the end of the plate placing box is coaxially connected with a driving pulley. One end of the ventilation pipe is sleeved with a driven pulley through a bearing. The driven pulley is coaxially connected and matched with a pair of ventilation sleeves through a straight pipe. The other end of the ventilation pipe is connected to an air extraction pump. The circumference of the driving pulley is equal to the side length in the forward movement direction of the display module circuit board. The circumference of the driven pulley is twice the circumference of the driving pulley. The driven pulley and the driving pulley are connected by a transmission belt.

4. The V-COB packaging device for the ultra-high definition display screen module according to claim 3, wherein: The bottom surface of the chip placing groove is provided with a through hole. On the outer side of the ventilation sleeve, there are several ventilation holes arranged at equal intervals in a ring shape, and the ventilation holes are communicated with the straight pipe. Above both ends of the sealing rod, there are fixed collar rings that are tangent to the bottom arc surface of the sealing rod. The sealing rod is inserted into the straight pipe and contacts its bottom side wall. On the bottom surface of the collar ring at the outer end of the sealing rod, there is a hook that is clamped and matched with the side wall of the bracket at both ends of the straight pipe.

5. The V-COB packaging device for the ultra-high definition display screen module according to claim 4, wherein: On both side walls of the chip placing cylinder, there are symmetrically arranged through grooves. The outer side of the bottom end of the chip placing cylinder is tightly sleeved with a cover. The cover is sleeved with the chip feeding sleeve.

6. The V-COB encapsulation device for the ultra-high definition display screen module according to claim 5, characterized in that: At the bottom end of the glue liquid cylinder, there is an inclined through port. On both side walls of the inclined through port, there are waist-shaped holes. The two ends of the axle of the glue wheel are inserted and slid in correspondence with the two waist-shaped holes.

7. The V-COB packaging device for the ultra-high definition display screen module according to claim 6, characterized in that: Both ends of the axle of the rubber wheel are also sleeved with linkage rods. The bottom end of the linkage rod is slidably and snap-fitted to the outer side of the core feeding sleeve. Both end faces of the core feeding sleeve and outside the core placing groove are provided with sliding grooves. The upper end of the linkage rod abuts against an elastic sheet, and both ends of the elastic sheet are fixed to the outer side wall of the glue cylinder. The elastic sheet is in a straight sheet shape in its natural state and is close to the bottom of the waist-shaped hole. When the core feeding sleeve drives the chip to rotate to the linkage rod, under the elastic force of the elastic sheet, the linkage rod slides into the sliding groove, driving the rubber wheel to contact the surface of the chip and relatively roll for gluing.

8. The V-COB encapsulation device for the ultra-high definition display screen module according to claim 7, wherein: On the top surface of the encapsulation table and at the rear end of the conveyor belt, a pair of core pressing wheels are supported. The pair of core pressing wheels are arranged in front and back alignment with the pair of core feeding sleeves. One end of the axle of the pair of core pressing wheels is sleeved with a transmission gear, and another transmission gear is coaxially connected to the outside of the driving pulley. The two transmission gears are meshed for transmission.

9. The V-COB packaging device for the ultra-high definition display screen module according to claim 8, wherein: Above the middle of the placing box, a gantry-shaped support frame is erected. In the middle of the top surface of the support frame, a pressing rod is inserted. The bottom end of the pressing rod is sleeved with a hemispherical pressing pad. Both the core placing cylinder and the glue cylinder are sleeved in the support frame extending and fixedly arranged on the top surface of the support frame.

10. The V-COB packaging method for an ultra-high definition display screen module, using the V-COB packaging device for the ultra-high definition display screen module described in claim 9, characterized in that, Including the following steps: S1. Place a number of chips into the core placing cylinder, fill the glue cylinder with glue, then neatly place a number of display module circuit boards into the placing box, and then put a number of placing boxes filled with display module circuit boards into the placing box. A number of placing boxes are bounced by the supporting plate. The rear end of the uppermost placing box is guided by the inclined guide table to slide and lean against the front of the top port of the placing box, thus forming a staggered state with the placing box below. S2. At this time, start the servo motor to drive the conveyor belt to move in a cycle. When a tooth of the conveyor belt rotates to the front end of the placing box, it contacts the dialing block and drives the placing box to move to the top surface of the encapsulation table. S3. During the process of all the placing boxes moving to the top surface of the encapsulation table, start the air extraction pump to extract air through the through hole of the core feeding sleeve to suck a chip. The rotation speed of the conveyor belt is reduced by the driving pulley and the driven pulley, and the core feeding sleeve is driven to put down the chip every half turn. S4. During the process of step S3, the chip rotates with the core feeding sleeve to the glue cylinder and is contacted and rolled for gluing by the rubber wheel. S5. Then, the chip is flexibly rolled and pressed by the core pressing wheel to be bonded in place. S6. After the chips on the circuit boards in the placing box are bonded, wire bonding is carried out to realize their electrical connection, and then this placing box is transferred under the encapsulation head for encapsulation and curing.

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