Wafer slicing mechanism

Abstract

The present application discloses a wafer slicing mechanism, comprising: a placement assembly, comprising two limiting axes, the limiting axes extending in a first direction, the distance between the two limiting axes being less than the diameter of the wafer; a suction assembly, comprising a plurality of suction nozzles, the suction planes of the plurality of suction nozzles being flush; the suction plane having a suction position perpendicular to the first direction and a placement position perpendicular to the vertical direction; a first driving member connected to the suction assembly, for driving the suction assembly to rotate about a rotation axis extending in a second direction so that the suction plane switches between the suction position and the placement position; a first air blowing port and a second air blowing port connected to the suction assembly, the first air blowing port and the second air blowing port being located on either side of the suction assembly in the second direction, respectively; the first air blowing port being circular in shape, and the second air blowing port being oblate in shape; a moving assembly connected to the suction assembly, for driving the suction assembly to move in the first direction and the vertical direction. The wafer slicing mechanism can achieve rapid wafer retrieval.

Description

Technical Field

[0001] This specification relates to the field of semiconductor equipment technology, and in particular to a wafer slicing mechanism. Background Art

[0002] A wafer is a circular silicon wafer or substrate used in semiconductor manufacturing, also known as a silicon wafer or liner. It is the fundamental material for manufacturing integrated circuits. Wafers are generally made of single-crystal silicon and have a very flat surface. The process of manufacturing wafers is called wafer fabrication or semiconductor manufacturing and involves multiple process steps such as wafer growth, cutting, polishing, and cleaning. On wafers, the various components and layers of integrated circuits are manufactured through processes such as photolithography, thin film deposition, ion implantation, diffusion, and metal deposition. Multiple chips can be manufactured on a single wafer, and through cutting and packaging, each chip is used as an independent IC product. Wafer manufacturing is a crucial step in the semiconductor industry, affecting the quality, efficiency, and cost of integrated circuits. After wafer fabrication is completed, the wafers need to be inspected. Wafer inspection is a core step in semiconductor manufacturing to ensure chip quality and yield, involving multi-dimensional technologies such as physical defect identification, dimensional measurement, and electrical performance testing.

[0003] In the prior art, when performing preliminary inspection on wafers, there are certain obstacles in taking out a single wafer for inspection because multiple wafers are stacked together, there is a large adsorption force between the wafers, and there are water stains between some wafers. Summary of the Invention

[0004] In view of the deficiencies in the prior art, one purpose of this specification is to provide a wafer slicing mechanism that can achieve rapid wafer retrieval.

[0005] To achieve the above objectives, the present invention provides a wafer separation mechanism, comprising:

[0006] A placement assembly, comprising two limiting shafts for placing a wafer, wherein the limiting shafts extend along a first direction, and a distance between the two limiting shafts is smaller than a diameter of the wafer;

[0007] The suction assembly includes a plurality of suction nozzles, wherein the suction planes of the plurality of suction nozzles are flush with each other; the suction planes have a suction position perpendicular to the first direction and a placement position perpendicular to the vertical direction;

[0008] a first driving member connected to the suction assembly, configured to drive the suction assembly to rotate about a rotation axis extending in a second direction, so that the suction plane switches between the suction position and the placement position; the first direction, the second direction, and the vertical direction are perpendicular to each other;

[0009] a first air blowing port and a second air blowing port connected to the suction component, the first air blowing port and the second air blowing port being located on both sides of the suction component in the second direction; the first air blowing port being circular in shape, and the second air blowing port being oblate in shape;

[0010] The moving assembly connected to the suction assembly is used to drive the suction assembly to move in the first direction and the vertical direction.

[0011] As a preferred embodiment, the second air blowing port includes a plurality of sub-air blowing ports arranged in a straight line, and the sub-air blowing ports are circular in shape; and the diameter of the sub-air blowing ports is smaller than the diameter of the first air blowing port.

[0012] As a preferred embodiment, the first air blowing port is fixedly connected to the suction assembly via a copper tube; the second air blowing port is connected to the suction assembly via a flexible tube, and the position and orientation of the second air blowing port are adjustable.

[0013] As a preferred embodiment, at the same time, only one of the first air blowing port and the second air blowing port is in operation at most.

[0014] As a preferred embodiment, the moving assembly includes a first slide rail extending along the first direction, a second slide rail extending along the vertical direction, a first slider slidably connected to the first slide rail, a second slider slidably connected to the second slide rail, and a fixed frame fixedly connected below the first slider; one end of the first air blowing port and one end of the second air blowing port are fixedly connected to an end of the first slider close to the placement assembly along the first direction; the fixed end of the first driving member is fixedly connected to the fixed frame, and the moving end of the first driving member is rotatably connected to the fixed frame; the first slide rail is fixedly connected to the second slider.

[0015] As a preferred embodiment, the placement component further includes:

[0016] Two fixing plates perpendicular to the first direction, with both ends of the limiting shaft respectively fixed to the inner sides of the two fixing plates;

[0017] A fixing base fixedly connected to the bottom of the fixing plate;

[0018] A third slide rail extends along the first direction, and the bottom of the fixing seat is slidably connected to the third slide rail.

[0019] As a preferred embodiment, the placement component further includes:

[0020] a fourth slide rail extending along the first direction, the fourth slide rail being fixedly disposed on the upper surface of the fixing seat and passing through the two fixing plates;

[0021] A baffle is slidably connected to the fourth slide rail, and the baffle is located between the two fixed plates and passes through the two limiting shafts.

[0022] As a preferred embodiment, there are multiple placement components, and the multiple placement components are spaced apart in the second direction; the moving component includes a fifth slide rail extending along the second direction and a third slider slidably connected to the fifth slide rail; the second slide rail is fixedly connected to the third slider.

[0023] As a preferred embodiment, the suction assembly includes three first suction nozzles spaced apart in the circumferential direction, and a second suction nozzle located at the center of the three first suction nozzles, and the suction area of ​​the second suction nozzle is larger than the suction area of ​​the first suction nozzle.

[0024] As a preferred embodiment, the wafer slicing mechanism further includes a conveyor belt extending along a first direction, wherein the conveyor belt is located on a side of the placement component close to the suction component in the first direction, and the suction component is located above the conveyor belt. Beneficial effects

[0025] The wafer slicing mechanism provided in this embodiment includes a placement component, a suction component, a first air blow port, a second air blow port, a moving component and a first driving component. The wafer is sucked by the suction component, and the first air blow port and the second air blow port are respectively located on both sides of the suction component in the second direction, and the first air blow port is circular in shape, and the second air blow port is oblong in shape. When the suction component sucks the target wafer, the first air blow port can first blow away multiple wafers adjacent to the target wafer, and then blow air to the gap between the target wafer and its adjacent wafers through the oblong second air blow port, so that the suction component can easily take out the target wafer under the drive of the moving component, and can achieve fast wafer retrieval.

[0026] Furthermore, a first drive member is connected to the suction assembly and can drive the suction assembly to rotate, switching the suction plane between a suction position and a placement position. When the suction plane is in the suction position, the suction assembly and the placement assembly face each other, enabling rapid wafer retrieval. When the suction plane is in the placement position, the suction assembly faces downward, allowing the wafer to be stably placed on a horizontal surface for subsequent inspection. The vertical orientation of the wafer reduces resistance during retrieval.

[0027] With reference to the following description and the accompanying drawings, the specific embodiments of the present invention are disclosed in detail, indicating the manner in which the principles of the present invention can be employed. It should be understood that the embodiments of the present invention are not limited in scope thereby.

[0028] Features described and / or illustrated with respect to one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0029] It should be emphasized that the term "include / comprising" when used herein refers to the presence of features, integers, steps or components, but does not exclude the presence or addition of one or more other features, integers, steps or components. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative labor.

[0031] Figure 1 A schematic diagram of the three-dimensional structure of a wafer slicing mechanism provided in this embodiment;

[0032] Figure 2 for Figure 1 A front view of the middle suction assembly, the first air blowing port, and the second air blowing port;

[0033] Figure 3 This is a schematic diagram of the enlarged structure of a second air outlet provided in this embodiment;

[0034] Figure 4 This is a structural diagram of a placement component provided in this embodiment.

[0035] Description of reference numerals:

[0036] 1. Placement component; 11. Limiting axis; 12. Fixed plate; 13. Fixed seat; 14. Third slide rail; 15. Fourth slide rail; 16. Baffle; 2. Suction component; 21. First suction nozzle; 22. Second suction nozzle; 3. First air blowing port; 31. Copper tube; 4. Second air blowing port; 41. Sub-air blowing port; 42. Flexible tube; 5. Moving component; 51. First slide rail; 52. Second slide rail; 53. First slider; 54. Second slider; 55. Fixed frame; 56. Fifth slide rail; 57. Third slider; 6. Conveyor belt; 71. First drive member; 72. Second drive member; 73. Third drive member; 74. Fourth drive member; 75. Fifth drive member; 10. Wafer; X, first direction; Y, second direction; Z, vertical direction. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0038] It should be noted that when an element is referred to as being "disposed on" another element, it may be directly on the other element or there may be another element centered thereon. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be another element centered thereon. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0040] See also Figures 1 to 4 The embodiment of the present application provides a wafer 10 slicing mechanism, comprising: a placement component 1 , a suction component 2 , a first air blowing port 3 , a second air blowing port 4 , a moving component 5 and a first driving member 71 .

[0041] The placement assembly 1 includes two limiting shafts 11 for placing the wafer 10. The limiting shafts 11 extend along a first direction X, with the distance between the two limiting shafts 11 being less than the diameter of the wafer 10. The two limiting shafts 11 are spaced apart in a second direction Y. The first direction X, the second direction Y, and the vertical direction Z are mutually perpendicular. Specifically, the first direction X and the second direction Y are two directions perpendicular to each other in a horizontal plane.

[0042] The suction assembly 2 includes a plurality of suction nozzles. The suction planes of the plurality of suction nozzles are flush with each other. The suction plane has a suction position perpendicular to the first direction X and a placement position perpendicular to the vertical direction Z. The first driving member 71 is connected to the suction assembly 2, and is used to drive the suction assembly 2 to rotate around a rotation axis extending in the second direction Y, so that the suction plane switches between the suction position and the placement position. The first blowing port 3 and the second blowing port 4 are both connected to the suction assembly 2. The first blowing port 3 and the second blowing port 4 are respectively located on both sides of the suction assembly 2 in the second direction Y. The first blowing port 3 is circular in shape, and the second blowing port 4 is oblong in shape. The moving assembly 5 is connected to the suction assembly 2, and is used to drive the suction assembly 2 to move in the first direction X and the vertical direction Z.

[0043] The wafer 10 slicing mechanism provided in this embodiment includes a placement component 1, a suction component 2, a first air blow port 3, a second air blow port 4, a moving component 5 and a first driving component 71. The wafer 10 is sucked by the suction component 2, and the first air blow port 3 and the second air blow port 4 are respectively located on both sides of the suction component 2 in the second direction Y, and the first air blow port 3 is circular and the second air blow port 4 is oblong. When the suction component 2 sucks the target wafer 10, the first air blow port 3 can first blow away the multiple wafers 10 adjacent to the target wafer 10, and then blow air to the gap between the target wafer 10 and its adjacent wafers 10 through the oblong second air blow port 4, so that the suction component 2 can easily take out the target wafer 10 under the drive of the moving component 5, and can achieve rapid wafer retrieval.

[0044] Furthermore, a first drive member 71 is connected to the suction assembly 2 and can drive the suction assembly 2 to rotate, switching the suction plane between the suction position and the placement position. When the suction plane is in the suction position, the suction assembly 2 faces the placement assembly 1, enabling rapid wafer retrieval. When the suction plane is in the placement position, the suction assembly 2 faces downward, allowing the wafer 10 to be stably placed on a horizontal surface for subsequent inspection. The vertical orientation of the wafer 10 reduces resistance during retrieval.

[0045] In one embodiment, the second blowing port 4 may include only one opening, which is longer in one direction and very short in another direction (perpendicular to the longer direction), thereby forming a prolate second blowing port 4.

[0046] In a preferred embodiment, Figure 3 As shown, the second air outlet 4 includes multiple sub-air outlets 41 arranged in a straight line, resulting in an oblate shape. Specifically, the sub-air outlets 41 are circular in shape, and their diameter is smaller than that of the first air outlet 3. The multiple sub-air outlets 41 arranged at intervals make the airflow from the second air outlet 4 more powerful, facilitating separation of adjacent wafers 10.

[0047] Preferably, if Figure 2 As shown, the first air outlet 3 is fixedly connected to the suction assembly 2 via a copper tube 31. The second air outlet 4 is connected to the suction assembly 2 via a flexible tube 42. The position and orientation of the second air outlet 4 are adjustable. During actual operation, the position and orientation of the second air outlet 4 can be adjusted as needed. The arrangement direction of the multiple sub-air outlets 41 intersects the first direction X, the second direction Y, and the vertical direction Z.

[0048] like Figure 1 As shown, the moving assembly 5 includes a first slide rail 51 extending along a first direction X, a second slide rail 52 extending along a vertical direction Z, a first slider 53 slidably connected to the first slide rail 51, a second slider 54 slidably connected to the second slide rail 52, and a fixing frame 55 fixedly connected below the first slider 53. One end of the first air blowing port 3 and one end of the second air blowing port 4 are fixedly connected to an end of the first slider 53 along the first direction X that is close to the placement assembly 1. The fixed end of the first driving member 71 is fixedly connected to the fixing frame 55, and the movable end of the first driving member 71 is rotatably connected to the fixing frame 55. The first slide rail 51 is fixedly connected to the second slider 54.

[0049] Specifically, the first slider 53 is connected to a second driving member 72, which can drive the first slider 53 to drive the fixing frame 55 to move along the first direction X, thereby achieving movement of the suction assembly 2 along the first direction X. The second slider 54 is connected to a third driving member 73, which can drive the second slider 54 to drive the suction assembly 2 to move along the vertical direction Z.

[0050] In this embodiment, if Figure 4 As shown, the placement component 1 also includes: a fixed seat 13, a third slide rail 14 and two fixed plates 12. The two fixed plates 12 are perpendicular to the first direction X. The two ends of the limiting shaft 11 are respectively fixed to the inner sides of the two fixed plates 12. The fixed seat 13 is fixedly connected to the bottom of the fixed plate 12, and the two fixed plates 12 can be connected. The third slide rail 14 extends along the first direction X. The bottom of the fixed seat 13 is slidably connected to the third slide rail 14, so that the structure on the fixed seat 13 can move along the first direction X, which is convenient for loading and removing the wafer 10. During manual loading, the fixed seat 13 is located at the end of the third slide rail 14 away from the suction component 2; after manual loading is completed, the fixed seat 13 can be moved to the end of the third slide rail 14 close to the suction component 2, which is convenient for the suction component 2 to remove the material.

[0051] Specifically, the placement component 1 also includes a fourth slide rail 15 and a baffle 16. The fourth slide rail 15 extends along the first direction X. The fourth slide rail 15 is fixedly arranged on the upper surface of the fixed seat 13 and passes through the two fixed plates 12. The baffle 16 is slidably connected to the fourth slide rail 15. The baffle 16 is located between the two fixed plates 12 and is passed through the two limit shafts 11. The vertically stacked wafers 10 can be fixed by the baffle 16, a fixed plate 12 away from the suction component 2, and the two limit shafts 11 so that they will not fall over. When the suction component 2 moves to the vicinity of the wafer 10 to pick up the material, the baffle 16 moves a predetermined distance in the direction close to the suction component 2; when the suction component 2 takes out a wafer 10, the baffle 16 moves in the direction away from the suction component 2.

[0052] In this embodiment, there are multiple placement assemblies 1 (e.g., 3-5), spaced apart in the second direction Y. This allows for the placement of multiple wafers 10 during manual loading, reducing the frequency of manual loading. Accordingly, the moving assembly 5 includes a fifth rail 56 extending along the second direction Y and a third slider 57 slidably connected to the fifth rail 56. The second rail 52 is fixedly connected to the third slider 57. The third slider 57 is connected to a fourth drive member 74, which drives the third slider 57 to move the suction assembly 2 along the second direction Y, enabling material to be retrieved from different placement assemblies 1.

[0053] like Figure 2 As shown, the suction assembly 2 includes three first suction nozzles 21 spaced apart in the circumferential direction and a second suction nozzle 22 located at the center of the three first suction nozzles 21. The suction area of ​​the second suction nozzle 22 is larger than that of the first suction nozzle 21, so that the wafer 10 can be stably sucked.

[0054] Specifically, the wafer 10 separation mechanism further includes a conveyor belt 6 extending along a first direction X. Conveyor belt 6 is located on the side of the placement assembly 1 near the suction assembly 2 in the first direction X, with the suction assembly 2 positioned above the conveyor belt 6. After the suction assembly 2 separates a wafer 10 by suction, the first drive member 71 switches the suction assembly 2 to the placement position, allowing the suction assembly 2 to place the wafer 10 on the conveyor belt 6. A fifth drive member 75 is connected to the conveyor belt 6 for driving the conveyor belt 6 in the first direction X to transfer the wafer 10 to the next station.

[0055] In this embodiment, at the same time, only one of the first air blowing port 3 and the second air blowing port 4 is in operation. In a specific application scenario, when using the wafer 10 slicing mechanism provided in the embodiment of the present application, the following steps are included:

[0056] 1. Load the wafers 10. Specifically, position the fixed seat 13 of the placement assembly 1 at the end of the third slide 14 away from the suction assembly 2, and position the baffle 16 close to the fixed plate 12 near the suction assembly 2. Vertically stack multiple wafers 10 between the fixed plate 12 away from the suction assembly 2 and the two limiting shafts 11. Then, move the baffle 16 along the fourth slide 15 to the surface of the wafers 10. The stacked wafers 10 are then secured by the baffle 16, the two limiting shafts 11, and the fixed plate 12 away from the suction assembly 2. Then, move the fixed seat 13 of the placement assembly 1 to the end of the third slide 14 near the suction assembly 2.

[0057] 2. The suction component 2 takes the material. Specifically, the suction component 2 is driven to move in the first direction X, the second direction Y and the vertical direction Z, so that the suction component 2 is facing the wafer 10. Then the second driving member 72 drives the suction component 2 to move along the first direction X, approaching and sticking to the wafer 10. At this time, the baffle 16 moves a predetermined distance in the direction close to the suction component 2, and the first air blowing port 3 is opened (the second air blowing port 4 is closed), blowing away the multiple wafers 10 adjacent to the target wafer 10. After the suction component 2 is in close contact with the wafer 10, the third driving member 73 drives the suction component 2 to move along the vertical direction Z. At this time, the first air blowing port 3 is closed, and the second air blowing port 4 is opened, blowing air into the gap between the target wafer 10 and its adjacent wafer 10, and the baffle 16 moves away from the suction component 2 to the wafer 10. When the wafer 10 sucked by the suction component 2 is completely separated from the adjacent wafer 10, the second air blowing port 4 is closed.

[0058] 3. The suction component 2 discharges the material. Specifically, the suction component 2 is driven to move in the first direction X, the second direction Y and the vertical direction Z, so that the suction component 2 is facing the conveyor belt 6. At the same time, the first driving member 71 can drive the suction component 2 to rotate to the placement position. Then the third driving member 73 drives the suction component 2 to move along the vertical direction Z, close to the conveyor belt 6, and then the wafer 10 on the suction component 2 is placed on the conveyor belt 6, and then steps 2 and 3 are repeated. The wafer 10 slicing mechanism of the present application can complete the collection and discharge of a wafer 10 in about 6 seconds, which is extremely efficient.

[0059] It should be noted that, in the description of this specification, the terms "first," "second," etc., are used solely for descriptive purposes and to distinguish similar objects. There is no order of precedence between the two, nor should they be understood to indicate or imply relative importance. Furthermore, in the description of this specification, unless otherwise specified, "plurality" means two or more.

[0060] Any numerical value cited herein includes all values ​​of the lower and upper values ​​in increments of one unit from the lower value to the upper value, provided that there is at least a two-unit interval between any lower value and any higher value. For example, if the value of a component quantity or process variable (e.g., temperature, pressure, time, etc.) is stated to be from 1 to 90, preferably from 20 to 80, and more preferably from 30 to 70, it is intended to illustrate that values ​​such as 15 to 85, 22 to 68, 43 to 51, 30 to 32, etc. are also explicitly listed in this specification. For values ​​less than 1, one unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1. These are merely examples intended to be clearly stated, and it is to be understood that all possible combinations of the values ​​listed between the minimum and maximum values ​​are explicitly stated in this specification in a similar manner.

[0061] Unless otherwise indicated, all ranges include the endpoints and all numbers between the endpoints. When used with a range, "about" or "approximately" applies to both endpoints of the range. Thus, "about 20 to 30" is intended to cover "about 20 to about 30," including at least the specified endpoints.

[0062] All articles and references disclosed herein, including patent applications and publications, are incorporated herein by reference for all purposes. The term "consisting essentially of..." when describing a combination should include the identified elements, ingredients, components, or steps and other elements, ingredients, components, or steps that do not materially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe a combination of elements, ingredients, components, or steps herein also contemplates embodiments consisting essentially of these elements, ingredients, components, or steps. By using the term "may," it is intended to indicate that any attribute described as "may" be optional.

[0063] Multiple elements, ingredients, parts or steps can be provided by a single integrated element, ingredient, part or step. Alternatively, a single integrated element, ingredient, part or step can be divided into separate multiple elements, ingredients, parts or steps. The disclosure of "a" or "an" to describe an element, ingredient, part or step is not intended to exclude other elements, ingredients, parts or steps.

[0064] It should be understood that the above description is for illustration and not for limitation. Many embodiments and many applications beyond the examples provided will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of the present teachings should not be determined with reference to the above description, but rather with reference to the appended claims and the full scope of equivalents to which such claims are entitled. For the purpose of comprehensiveness, all articles and references, including disclosures of patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein from the foregoing claims is not intended to be a disclaimer of such subject matter, nor should it be assumed that the inventors did not consider such subject matter to be part of the disclosed inventive subject matter.

Claims

1. A wafer slicing mechanism, characterized in that: include: A placement assembly, comprising two limiting shafts for placing a wafer, wherein the limiting shafts extend along a first direction, and a distance between the two limiting shafts is smaller than a diameter of the wafer; The suction assembly includes a plurality of suction nozzles, wherein the suction planes of the plurality of suction nozzles are flush with each other; the suction planes have a suction position perpendicular to the first direction and a placement position perpendicular to the vertical direction; a first driving member connected to the suction assembly, configured to drive the suction assembly to rotate about a rotation axis extending in a second direction, so that the suction plane switches between the suction position and the placement position; the first direction, the second direction, and the vertical direction are perpendicular to each other; a first air blowing port and a second air blowing port connected to the suction component, the first air blowing port and the second air blowing port being located on both sides of the suction component in the second direction; the first air blowing port being circular in shape, and the second air blowing port being oblate in shape; a moving assembly connected to the suction assembly, used to drive the suction assembly to move in the first direction and the vertical direction; The second air blowing port includes a plurality of sub-air blowing ports arranged in a straight line, and the sub-air blowing ports are circular in shape; and the diameter of the sub-air blowing ports is smaller than the diameter of the first air blowing port.

2. The wafer separation mechanism according to claim 1, wherein: The first air blowing port is fixedly connected to the suction component through a copper tube; the second air blowing port is connected to the suction component through a flexible tube, and the position and direction of the second air blowing port are adjustable.

3. The wafer separation mechanism according to claim 1, wherein: At the same time, only one of the first air blowing port and the second air blowing port is in operation at most.

4. The wafer separation mechanism according to claim 1, wherein: The moving assembly includes a first slide rail extending along the first direction, a second slide rail extending along the vertical direction, a first slider slidably connected to the first slide rail, a second slider slidably connected to the second slide rail, and a fixed frame fixedly connected below the first slider; one end of the first air blowing port and one end of the second air blowing port are fixedly connected to an end of the first slider close to the placement assembly along the first direction; the fixed end of the first driving member is fixedly connected to the fixed frame, and the moving end of the first driving member is rotatably connected to the fixed frame; the first slide rail is fixedly connected to the second slider.

5. The wafer separation mechanism according to claim 4, characterized in that: The placement component also includes: Two fixing plates perpendicular to the first direction, with both ends of the limiting shaft respectively fixed to the inner sides of the two fixing plates; A fixing base fixedly connected to the bottom of the fixing plate; A third slide rail extends along the first direction, and the bottom of the fixing seat is slidably connected to the third slide rail.

6. The wafer separation mechanism according to claim 5, characterized in that: The placement component also includes: a fourth slide rail extending along the first direction, the fourth slide rail being fixedly disposed on the upper surface of the fixing seat and passing through the two fixing plates; A baffle is slidably connected to the fourth slide rail, and the baffle is located between the two fixed plates and passes through the two limiting shafts.

7. The wafer separation mechanism according to claim 6, wherein: There are multiple placement components, and the multiple placement components are spaced apart in the second direction; the moving component includes a fifth slide rail extending along the second direction and a third slider slidably connected to the fifth slide rail; the second slide rail is fixedly connected to the third slider.

8. The wafer separation mechanism according to claim 1, wherein: The suction assembly includes three first suction nozzles spaced apart in a circumferential direction, and a second suction nozzle located at the center of the three first suction nozzles, wherein a suction area of ​​the second suction nozzle is larger than a suction area of ​​the first suction nozzle.

9. The wafer separation mechanism according to claim 1, wherein: The wafer separating mechanism further comprises a conveyor belt extending along a first direction. The conveyor belt is located on a side of the placement component close to the suction component in the first direction. The suction component is located above the conveyor belt.

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