Automatic chip transmission method and device of laser-assisted bonding device

Abstract

The invention provides a laser-assisted bonding equipment automatic chip transmission method and equipment. The method comprises the following steps: reading transmission information in a record file; carrying out automatic transmission and bonding according to the transmission information in the record file and a plurality of pre-divided technological processes; the multiple technological processes comprise a wafer ring / substrate positioning process, a chip positioning process, a picking and overturning process, a transfer head handover process, a chip transfer handover process, a pre-bonding head handover process, a transfer reset process, a glue dipping process, a glue scraping process, a substrate and chip positioning process, a bonding process, a bonding reset process and a subsequent bonding process. According to the embodiment of the invention, the working step units are modularly packaged, automatic control is realized through a computer program, idle time of each equipment part can be efficiently distributed to the maximum extent, manual work is replaced, the yield is improved, and faults and unforeseen circumstances are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor process equipment, and more particularly, to a method and device for automatically transporting chips in a laser-assisted bonding device. Background Art

[0002] During the production process of a laser-assisted bonding device, chips need to be picked up from a wafer ring, and then transported to the substrate bonding area through steps such as pick-up and flip, transfer, and glue application. This entire chip transportation process is very complex and involves wafer ring stage positioning, chip positioning, motors responsible for each step moving to the correct position, step operation sequence, motor movement interlock, nozzle vacuum adsorption value, substrate stage positioning, substrate and chip positioning, etc.

[0003] During the process, the steps are numerous and very delicate. Any error in any step will cause the chip transportation process to be interrupted or even cause damage to the device components due to collision, resulting in economic losses. Among them, the entire process requires manual repeated confirmation of relevant states, and the efficiency is very low. Summary of the Invention

[0004] To solve the above problems, the present invention provides a method for automatically transporting chips in a laser-assisted bonding device. The method includes: reading transmission information in a record file; the record file includes a chip record file and a substrate record file, and the transmission information recorded in the chip record file includes the position information of the chips to be picked up on the wafer ring, and the transmission information of the substrate record file includes the position information of the chips to be bonded on the substrate; according to the transmission information in the record file and a plurality of pre-divided process flows, automatic transportation and bonding are performed; the plurality of process flows include: wafer ring / substrate positioning process, chip positioning process, pick-up and flip process, transfer head handover process, chip transfer handover process, pre-bonding head handover process, transfer reset process, glue dipping process, glue scraping process, substrate and chip positioning process, bonding process, bonding reset process, and post-bonding process.

[0005] The method for automatically transporting chips in a laser-assisted bonding device provided by an embodiment of the present invention includes a transmission process that efficiently and reasonably allocates the collaborative work of each step, modularly encapsulates the work step units, and realizes automatic control through a computer program. It can maximize the allocation of the idle time of each device component, replace manual labor, improve productivity, and reduce the occurrence of failures and accidents.

[0006] Optionally, the sequence of the multiple process flows is as follows: crystal ring / substrate positioning process, chip positioning process, pick-up and flip process, transfer head handover process, chip transfer and handover process, pre-bonding head handover process, transfer reset process, glue dipping process, glue scraping process, substrate and chip positioning process, bonding process, bonding reset process, subsequent bonding process; wherein, the transfer reset process and the glue dipping process are executed successively or in parallel, and the glue scraping process and the substrate and chip positioning process are executed successively or in parallel.

[0007] In the embodiment of the present invention, the overall bonding process is modularly encapsulated into working step units. The steps of each modular process are reasonably allocated, and the connections between the processes are tight. Each process is automatically controlled and executed through a computer program. The computer program can automatically read record files, collect numerical values of various component devices, etc., so as to maximize efficiency, improve productivity, and reduce the occurrence of accidents such as failures.

[0008] Optionally, the automatic transfer and bonding includes: judging whether the process state of the previous process flow is the completed state, and judging whether the process state of the current process flow is the idle state. If both are yes, then change the process state of the current process flow to in-process, change the process state of the previous process flow to idle state, and execute the current process flow.

[0009] In the embodiment of the present invention, during the execution of the process, by accurately and timely changing the process states of each process flow, it can clearly and real-time indicate what state it is in (idle, in-process, failure, pause, completed, etc.), which is beneficial to efficient transfer.

[0010] Optionally, the automatic transfer and bonding further includes: judging whether the process state of the current process flow is a failure. If so, stop immediately; or, judging whether the process state of the current process flow is a pause. If so, continue to wait.

[0011] In the embodiment of the present invention, strategies of stopping and waiting are respectively formulated for the states of failure and pause to achieve automatic control.

[0012] Optionally, the transfer head handover process includes: controlling the transfer Z-axis motor to lower the transfer head to the chip handover height, and judging whether the transfer head touches the chip; if it touches the chip, then control the vacuum suction nozzle of the transfer head to turn on the vacuum suction, turn off the vacuum suction of the pick-up vacuum nozzle, and control the transfer Z-axis motor to move away the transfer head.

[0013] In the embodiment of the present invention, modular transfer steps are formulated for each process flow, and automatic control is realized through a computer program, replacing manual work, improving productivity, and reducing the occurrence of failures and accidents.

[0014] Optionally, the chip transfer and handover process includes: controlling the transfer X-axis motor to move the transfer head to the chip transfer area, and controlling the vacuum adsorption of the chip transfer station to turn on; controlling the transfer Z-axis motor to lower the transfer head to the handover position with the chip transfer station, placing the chip on the chip transfer station, turning off the vacuum adsorption of the vacuum suction nozzle of the transfer head, controlling the transfer Z-axis motor to move the transfer head away, and the chip transfer station adsorbing the chip.

[0015] Optionally, the pre-bonding head handover process includes: controlling the pre-bonding Y-axis motor to move the pre-bonding head to the handover position with the chip transfer station, and the pre-bonding Z-axis motor to lower the pre-bonding head to the handover position with the chip transfer station; controlling the vacuum adsorption of the pre-bonding head to turn on, and the vacuum adsorption of the chip transfer station to turn off; controlling the pre-bonding Z-axis motor to raise the pre-bonding head to the glue dipping height or the alignment height.

[0016] Optionally, the chip positioning process includes: reading the chip record file to obtain information on all chips to be transferred; determining whether there are chips to be transferred, and if there are chips to be transferred and its own process status is the idle state, changing the process status of the chip positioning process to in-process, and sequentially starting chip positioning; the substrate and chip positioning process includes: reading the substrate record file to obtain information on all chips to be pasted; determining whether there are chips to be pasted, and if there are chips to be pasted, the process status of the glue dipping process and the subsequent bonding process is completed, and its own process status is the idle state, changing its own process status to in-process, changing the process status of the glue dipping process and the subsequent bonding process to idle, and sequentially starting substrate and chip positioning.

[0017] Optionally, the transfer reset process includes: controlling the transfer Z-axis motor to move to the initial position, controlling the RZ-axis motor to move to the initial position, and controlling the transfer Y-axis motor to move to the initial position; the bonding reset process includes: controlling the pre-bonding RZ-axis motor to move to the initial position, and controlling the pre-bonding Y-axis motor to move to the initial position.

[0018] An embodiment of the present invention provides a laser-assisted bonding device, which is used to execute the above-mentioned method for automatically transferring chips by the laser-assisted bonding device.

[0019] The above-mentioned laser-assisted bonding device provided by the embodiment of the present invention can achieve the same technical effects as the method for automatically transferring chips by the laser-assisted bonding device. Description of the Drawings

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0021] Figure 1 Schematic diagram of the module composition of the laser-assisted bonding equipment in an embodiment of the present invention;

[0022] Figure 2 A schematic flow chart of a method for automatically transferring chips using a laser-assisted bonding device according to an embodiment of the present invention;

[0023] Figure 3 This is an overall flow chart of the chip transmission method using laser-assisted bonding equipment provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0024] In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the following detailed description of the specific embodiments of the present invention is given in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0025] The embodiment of the present invention realizes automated control through a computer program. The program automatically collects the numerical values of each component equipment, plans a set of transmission processes that efficiently and reasonably allocate the coordinated work of each step, and modularly encapsulates the work step units. It can maximize the efficiency of allocating the idle time of each equipment component, replace manual labor, improve productivity, and reduce the occurrence of failures and accidents.

[0026] Figure 1 The figure shows a schematic diagram of the module composition of the laser-assisted bonding equipment in an embodiment of the present invention. The laser-assisted bonding equipment includes: a wafer ring process module 1, a transport module 2, a substrate process module 3, an alignment module 4, a cooling module 5, a wafer ring cassette 6, and multiple substrate cassettes 7.

[0027] During the bonding process, the substrate is removed from the substrate cassette, aligned by the alignment module, and placed on the substrate stage. The wafer ring is then removed from the wafer ring cassette and placed on the wafer ring stage. Chip transfer is then performed, with the chip picked up from the wafer ring, transferred to the substrate, and then bonded to the substrate. After bonding, the wafer ring is returned to the wafer ring cassette, and the substrate is transferred to the cooling module for cooling. After cooling, it is returned to the substrate cassette in this automated bonding process.

[0028] The existing transmission method of laser-assisted bonding equipment is that the wafer ring carrier first moves to the chip pickup position, the wafer ring carrier starts to locate and determine the physical position of the wafer ring carrier, and then finds the position with the chip, controls the pickup motor to pick up the chip, and then reverses the motor to the handover position with the transfer motor, hands the chip to the transfer motor, and then controls the transfer motor to transport it to the chip transfer station handover area and hands it over to the chip transfer station, and then the pre-bonding head motor picks up the chip from the chip transfer station, and then transfers the chip to the dipping area to dip the chip in glue, and the post-bonding motor transfers the chip to the chip mounting position, and the substrate carrier moves to the chip mounting position, and the substrate carrier starts to locate and determine the physical position of the substrate carrier, and looks for the position where the chip can be mounted. After finding it, the post-bonding motor is controlled to move to the position where the chip can be mounted, and the laser-assisted bonding process is performed.

[0029] However, the aforementioned process involves numerous complex and delicate steps. Any error in any step can interrupt the chip transfer process, leading to a loss of precision in the final placement process and even damage to equipment components, resulting in financial losses. The entire process requires repeated manual verification of relevant status, making it very inefficient.

[0030] The embodiment of the present invention designs a record file, such as a mapping file, which records the location where chips need to be picked up and attached on the substrate or wafer ring, basic chip information, etc. Optionally, mapping files are configured for the wafer ring and substrate separately.

[0031] In the embodiment of the present invention, the manual transmission process of the laser-assisted bonding equipment is streamlined and optimized and divided into a wafer ring / substrate positioning process, a chip positioning process, a picking and flipping process, a transfer head handover process, a chip transfer handover process, a pre-bonding head handover process, a transfer reset process, a glue dipping process, a glue scraping process, a substrate & chip positioning process, a bonding process, a bonding reset process, and a bonding subsequent process. Except for the wafer ring / substrate positioning process, other processes have their own process status. The process status includes idle, in-process, faulty, paused, completed, and other states. The processes are connected end to end, and whether the next process starts transmission depends on whether the previous process is completed. Through such a flow relationship, closed-loop automatic transmission of chips is achieved.

[0032] Figure 2 A schematic flow chart of a method for automatically transferring chips using a laser-assisted bonding device according to an embodiment of the present invention is provided. The method comprises the following steps:

[0033] S202: Read the transmission information in the record file. The record file includes a chip record file and a substrate record file. The transmission information recorded in the chip record file may include the position information of the chip to be picked up on the wafer ring, and the transmission information recorded in the substrate record file may include the position information of the chip to be attached on the substrate.

[0034] Optionally, in this embodiment, the function of configuring the mapping file is designed and implemented. The mapping file records the positions where the substrate or the crystal ring needs to pick up and place the chips, as well as the basic information of the chips, etc.

[0035] S204. According to the transmission information in the record file and multiple pre-divided process flows, perform automatic transmission and bonding.

[0036] In this embodiment, the overall bonding process is modularly encapsulated into working step units. The steps of each modular process are reasonably allocated, and the connections between the processes are tight. Each process is automatically controlled and executed through a computer program. The computer program can automatically read the record file, collect the numerical values of each component device, etc., so as to maximize the efficiency, improve the production rate, and reduce the occurrence of accidents such as failures.

[0037] Among them, the above-mentioned multiple process flows include: crystal ring / substrate positioning process, chip positioning process, pick-up and flip process, transfer head handover process, chip transfer handover process, pre-bonding head handover process, transfer reset process, dipping process, scraping process, substrate and chip positioning process, bonding process, bonding reset process, subsequent bonding process, etc.

[0038] Specifically, the above-mentioned multiple process flows are connected end to end, and their order is as follows:

[0039] Crystal ring / substrate positioning process, chip positioning process, pick-up and flip process, transfer head handover process, chip transfer handover process, pre-bonding head handover process, transfer reset process, dipping process, scraping process, substrate and chip positioning process, bonding process, bonding reset process, subsequent bonding process;

[0040] Among them, the transfer reset process and the dipping process can be executed successively or in parallel, and the scraping process and the substrate and chip positioning process can be executed successively or in parallel.

[0041] During the execution of the above-mentioned processes, the following judgment conditions need to be carried out to achieve efficient and reasonable allocation of each step to work together and maximize the efficiency.

[0042] Specifically, the above steps of performing automatic transmission and bonding may include:

[0043] First, judge whether the process state of the previous process flow is the completed state, and judge whether the process state of the current process flow is the idle state. The previous process flow refers to the process flow that is adjacent and in front of the current process flow in sequence.

[0044] If all are "yes", change the process status of the current process flow to "in process", change the process status of the previous process flow to "idle", and execute the current process flow. During the process of flow execution, by accurately and timely changing the process status of each process flow, it can clearly and real - time indicate what status it is in (idle, in process, faulty, paused, completed, etc.), which is beneficial to efficient transfer.

[0045] Specifically, the above steps of automatic transfer and bonding further include:

[0046] Judge whether the process status of the current process flow is faulty. If so, stop immediately; or, judge whether the process status of the current process flow is paused. If so, continue to wait.

[0047] The method for automatically transferring chips by the laser - assisted bonding equipment provided by the embodiment of the present invention includes a transfer process that efficiently and reasonably distributes the cooperation of each step, modularly encapsulates the working - step units, and realizes automatic control through a computer program. It can maximize the distribution of the idle time of each equipment component, replace manual labor, improve productivity, and reduce the occurrence of faults and accidents.

[0048] The following specifically introduces the specific process of the above - mentioned partial process.

[0049] Exemplarily, the above transfer - head handover process includes: controlling the transfer Z - axis motor to lower the transfer head to the chip - handover height, and judging whether the transfer head touches the chip; if it touches the chip, control the vacuum suction of the vacuum suction nozzle of the transfer head to turn on, the pick - up vacuum suction to turn off, and control the transfer Z - axis motor to move the transfer head away.

[0050] The chip is picked up by the suction nozzle from the wafer on the crystal ring. The transfer - head handover process transfers the chip from this suction nozzle to the transfer head, that is, the transfer head adsorbs the chip, and then transfers it to the chip transfer station.

[0051] Exemplarily, the above chip - transfer - station handover process includes: controlling the transfer X - axis motor to move the transfer head to the chip - transfer area, controlling the vacuum suction of the chip transfer station to turn on; controlling the transfer Z - axis motor to lower the transfer head to the handover position with the chip transfer station, placing the chip on the chip transfer station, turning off the vacuum suction of the vacuum suction nozzle of the transfer head, controlling the transfer Z - axis motor to move the transfer head away, and the chip transfer station adsorbs the chip.

[0052] In this process, the chip is transferred from the transfer head to the chip transfer station, and the chip transfer station adsorbs the chip.

[0053] Exemplarily, the above-mentioned pre-bonding head handover process includes: controlling the pre-bonding Y-axis motor to move the pre-bonding head to the handover position of the chip transfer station, and the pre-bonding Z-axis motor to lower the pre-bonding head to the handover position with the chip transfer station; controlling the vacuum adsorption of the pre-bonding head to turn on, and the vacuum adsorption of the chip transfer station to turn off; controlling the pre-bonding Z-axis motor to rise the pre-bonding head to the dipping height or alignment height.

[0054] In this process, the pre-bonding head absorbs the chip from the chip transfer station, and the chip is transferred from the chip transfer station to the pre-bonding head.

[0055] Exemplarily, the above chip positioning process includes: reading the chip record file to obtain the information of all chips to be transferred; judging whether there are chips to be transferred; if there are chips to be transferred and their own process status is idle, then the process status of the chip positioning process is changed to in process, and the chip positioning is started in sequence.

[0056] In the chip positioning process, positioning is required based on the information recorded in the above chip record file. This process is the starting process of the transmission process. The purpose is to determine the precise alignment of the chip to be picked up and the nozzle of the pickup head. Specifically, the position of the chip to be picked up can be corrected through image correction.

[0057] The above-mentioned substrate and chip positioning process includes: reading the substrate record file to obtain the information of all chips to be mounted; judging whether there are chips to be mounted, if there are chips to be mounted, the process status of the dipping process and the subsequent bonding process is completed, and its own process status is idle, then its own process status is changed to in process, and the process status of the dipping process and the subsequent bonding process is changed to idle, and the substrate and chip positioning are started in sequence.

[0058] In the chip positioning process, positioning needs to be performed based on the information recorded in the above-mentioned substrate record file, that is, the position on the substrate where the chip needs to be bonded is determined. If there are multiple chips, the positioning operation is performed in sequence.

[0059] Exemplarily, the above-mentioned transport resetting process includes: controlling the transport Z-axis motor to move to the initial position, controlling the RZ-axis motor to move to the initial position, and controlling the transport Y-axis motor to move to the initial position;

[0060] The above bonding reset process includes: controlling the pre-bonding RZ-axis motor to move to the initial position, and controlling the pre-bonding Y-axis motor to move to the initial position.

[0061] After the transport and pre-bonding operations, a reset process is provided to reset the motors used for transport and pre-bonding to their initial positions.

[0062] The following describes the exemplary specific processes of each of the above-mentioned process flows. Figure 3Shows the overall flowchart of the method for transferring chips by the laser-assisted bonding device provided in the embodiments of the present invention.

[0063] The crystal ring / substrate positioning process is a preparatory work before the transfer starts, and this process is only executed once at the very beginning. The crystal ring stage and the substrate stage start positioning simultaneously. Among them, the crystal ring stage reaches the calculated position, the light source is turned on, the camera starts to collect images, and after the image collection is completed, the image is analyzed to determine whether the crystal ring stage deviates from the correct position. If it deviates, the position is corrected, and finally the light source is turned off. The substrate stage positioning is the same.

[0064] The chip positioning process is the starting step of the transfer process. Read the configured crystal ring mapping file to obtain all the chips to be transferred, and determine whether there are chips to be transferred. If not, no transfer action is performed. Determine whether the process status of the current module is faulty. If it is faulty, stop immediately. Determine whether the process status of the current module is paused. If it is paused, continue to wait. If there are chips to be transferred and the process status is idle, change the process status of this module to in-process, and start chip positioning in sequence.

[0065] First, turn on the light source to make the center of the chip to be picked up coaxial with the suction nozzle of the pick-up head. Then the camera starts to collect, analyze the collected image to correct the position of the chip to be picked up, and finally turn off the light source. The chip positioning module ends. Change the process status of the chip positioning module to the completed status.

[0066] The pick-up and flip process monitors whether the chip positioning process is in the completed state, determines whether its own process status is faulty. If it is faulty, stop immediately. Determine whether the process status of the current process is paused. If it is paused, continue to wait. If the process status of the chip positioning module is completed and its own process status is idle, change its own process status to in-process and start the pick-up and flip process.

[0067] First, the lower lifting motor lifts the chip, the inner and outer vacuum chambers turn on the vacuum adsorption to adsorb the blue film. The flip motor flips to the lower side, clears the upper pick-up force sensor, the upper pick-up motor extends so that the pick-up head touches the chip, and the inner ejector pin or the outer ejector pin rises to separate the blue film from the chip.

[0068] Judge whether the pick-up head touches the chip through the pressure value of the upper pick-up sensor. If it touches, turn on the vacuum suction nozzle to adsorb the chip. The inner ejector pin or the outer ejector pin returns to the initial position. The upper pick-up motor cooperates with the flip motor to move to the transfer and handover position. Immediately afterwards, the inner and outer vacuum chambers break the vacuum, the lower lifting motor descends to the initial position, and the pick-up and flip pick-up head ends. Change the process status of the pick-up and flip process to the completed status, and change the process status of the chip positioning process to the idle status.

[0069] Transfer head handover process, monitor whether the pick-up and flip module is in the completed state, monitor whether the transfer reset module is in the completed state, judge whether its own process state is faulty, if faulty, stop immediately, judge whether the process state of the current process is paused, if paused, continue to wait. If the process states of the pick-up and flip module and the transfer reset module are completed, and its own process state is in the idle state, change its own process state to in-process, change the process state of the transfer reset process to idle, and start the transfer head handover process.

[0070] First, the transfer Z-axis motor descends to the chip handover height. Determine whether the transfer head touches the chip through the pressure value of the upper pick-up sensor. If the transfer head touches the chip, turn on the vacuum adsorption of the transfer vacuum suction nozzle, turn off the vacuum adsorption of the upper pick-up vacuum suction nozzle, and move the transfer Z-axis away. The transfer head handover is completed. Change the process state of the transfer head handover module to the completed state, and change the process state of the pick-up and flip module to the idle state.

[0071] Chip transfer and handover process, monitor whether the transfer head handover process is in the completed state, judge whether its own process state is faulty, if faulty, stop immediately, judge whether the process state of the current process is paused, if paused, continue to wait. If the process state of the transfer head handover process is completed, and its own process state is in the idle state, change its own process state to in-process, change the process state of the transfer head handover process to idle, and start the chip transfer and handover process.

[0072] First, the transfer X-axis motor moves to the chip transfer area, turn on the vacuum adsorption of the chip transfer station, the transfer Z-axis descends to the handover position with the chip transfer station, and place the chip on the chip transfer station. Turn off the vacuum adsorption of the transfer vacuum suction nozzle, and move the transfer Z-axis away. The transfer station adsorbs the chip. Then the transfer Y-axis motor moves to the handover position with the pre-bonding head, the RZ-axis motor rotates to the handover angle, the transfer X-axis returns to the initial position, and the chip transfer and handover is completed. Change the process state of the chip transfer and handover process to the completed state.

[0073] Pre-bonding head handover process, monitor whether the chip transfer and handover process is in the completed state, monitor whether the bonding reset process is in the completed state, judge whether its own process state is faulty, if faulty, stop immediately, judge whether the process state of the current process is paused, if paused, continue to wait. If the process states of the chip transfer and handover process and the bonding reset process are completed, and its own process state is in the idle state, change its own process state to in-process, and start the pre-bonding head handover process.

[0074] First, pre-bond the Y-axis motor to move to the handover position with the chip transfer station, pre-bond the Z-axis to lower to the handover position with the chip transfer station, set the comparison value of the force sensor, start the handover of the pre-bonding head, turn on the vacuum adsorption of the pre-bonding quartz chuck, and turn off the vacuum adsorption of the chip transfer station. After contacting the chip, if dipping glue is required, raise the pre-bonding Z-axis motor to the dipping height, and if not, raise it to the alignment height. The handover of the pre-bonding head is completed. Change the process status of the pre-bonding head handover process to the completed status, and change the process status of the chip transfer handover process and the bonding reset process to the idle status.

[0075] For the dipping glue process, monitor whether the pre-bonding head handover process is in the completed state, judge whether the process status of itself is faulty, if faulty, stop immediately, judge whether the process status of the current process is paused, if paused, continue to wait. If the process status of the pre-bonding head handover process is completed and the process status of itself is idle, change the process status of itself to in-process, change the process status of the pre-bonding head handover process to idle, and start the dipping glue process.

[0076] First, move the pre-bonding Y-axis to the dipping position, and move the pre-bonding Z-axis to the height ready for dipping glue. Set the contact comparison force of the force sensor, lower the pre-bonding head to contact the glue. Then hold for a period of time. Immediately after that, move the pre-bonding Z-axis away and raise the pre-bonding head. The dipping glue is completed. Change the process status of the dipping glue process to the completed status.

[0077] For the transfer and reset process, monitor whether the pre-bonding head handover process is in the completed state, judge whether the process status of itself is faulty, if faulty, stop immediately, judge whether the process status of the current process is paused, if paused, continue to wait. If the process status of the pre-bonding head handover module is completed and the process status of itself is idle, change the process status of itself to in-process, and change the process status of the pre-bonding head handover module to idle. Start the transfer and reset process.

[0078] First, move the transfer Z-axis to the initial position, then move the RZ-axis motor to the initial position, and move the transfer Y-axis to the initial position. The transfer and reset is completed, and change the process status of the transfer and reset process to the completed status.

[0079] For the substrate & chip positioning process, read the configured substrate mapping file, obtain all the chips to be pasted, judge whether there are chips to be pasted, if not, do not perform the pasting operation, monitor whether the dipping glue process is in the completed state, monitor whether the subsequent bonding process is in the completed state, judge whether the process status of the current process is faulty, if faulty, stop immediately, judge whether the process status of the current process is paused, if paused, continue to wait.

[0080] If there is a chip to be surface-mounted, when the process status of the glue dipping process and the subsequent bonding process is completed and its own process status is idle, change its own process status to "in process", change the process status of the glue dipping process and the subsequent bonding process to idle, and then start the substrate & chip positioning in sequence.

[0081] First, determine whether coaxial alignment is required for this alignment. If it is required, perform coaxial calibration; otherwise, skip it. Then turn on the light source, move the substrate stage to the lower camera shooting position, move the pre-bonding Y-axis to the lower camera shooting position, and move the pre-bonding Z-axis to the calculated position. At this time, the substrate lower camera starts to collect images, analyze the collected images, and calculate the RZ rotation amount of the chip and the horizontal position of the rotation correction in the image. Move the pre-bonding RZ-axis motor to the same angle as the substrate, and the substrate lower camera starts to collect images and analyze the images to update the RZ rotation amount and horizontal position of the chip. Remove the pre-bonding Z-axis, zero the pre-bonding force sensor, call the positioning algorithm, move the substrate stage to the calculated position, the pre-bonding upper camera starts to collect images, analyze the images to calculate the horizontal position of the substrate in the image, calculate the alignment position of the substrate, and move the substrate stage to the calculated position. Move the pre-bonding Y-axis to the alignment and chip placement position, turn off the substrate & pre-bonding light source, change the process status of the substrate & chip positioning process to the completed state, and the substrate & chip positioning ends.

[0082] For the glue scraping process, monitor whether the glue dipping process is in the completed state, determine whether its own process status is faulty. If it is faulty, stop immediately. Determine whether the process status of the current process is paused. If it is paused, continue to wait. If the process status of the glue dipping process is completed and its own process status is idle, change its own process status to "in process", change the process status of the glue dipping process to idle, and start the glue scraping process.

[0083] First, the glue supply motor steps. Determine whether the flux is insufficient. If it is insufficient, interrupt the transmission and give a prompt. If it is sufficient, move the pre-bonding Y-axis to the glue scraping position, move the glue dipping X-axis to the glue scraping position, then move the glue dipping X-axis to the initial position, change the process status of the glue scraping process to the completed state, and the glue scraping ends.

[0084] For the bonding process, monitor whether the substrate & chip positioning process is in the completed state, determine whether its own process status is faulty. If it is faulty, stop immediately. Determine whether the process status of the current process is paused. If it is paused, continue to wait. If the process status of the substrate & chip positioning process is completed and its own process status is idle, change its own process status to "in process", change the process status of the substrate & chip positioning process to idle, and start the bonding process.

[0085] First, enable the laser, set the force for the pre-bonding head, move the pre-bonding Z-axis motor to the ready bonding position, switch the mode to force control, then attach the chip to the substrate. Immediately afterwards, the pre-bonding quartz indenter closes the vacuum adsorption and the pre-bonding Z-axis is moved away. The pre-bonding head rises away from the chip. Change the process state of the bonding process to the completed state, and the bonding process ends.

[0086] Bonding reset process: Monitor whether the bonding process is in the completed state, monitor whether the glue scraping process is in the completed state, determine whether its own process state is faulty, and if it is faulty, stop immediately. Determine whether the process state of the current process is paused, and if it is paused, continue to wait. If the process states of the bonding process and the glue scraping process are completed, and its own process state is in the idle state, then change its own process state to in-process, change the process states of the bonding process and the glue scraping process to idle, and start the bonding reset process.

[0087] The pre-bonding RZ-axis motor moves to the initial position, zero the pre-bonding force sensor, move the pre-bonding Y-axis away, and then change the process state of the bonding reset process to the completed state, and the bonding reset process ends.

[0088] Subsequent bonding process: Monitor whether the bonding reset process is in the completed state, determine whether its own process state is faulty, and if it is faulty, stop immediately. Determine whether the process state of the current process is paused, and if it is paused, continue to wait. If the process state of the bonding reset process is completed, and its own process state is in the idle state, then change its own process state to in-process, change the process state of the bonding reset process to idle, and start the subsequent bonding process.

[0089] First, move the post-bonding Y-axis to the bonding position, move the post-bonding Z-axis to the bonding position. Immediately afterwards, switch the laser to the multi-point & temperature mode, and the laser output turns on the auxiliary bonding. After the laser output is turned off, move the post-bonding Z-axis and the post-bonding Y-axis away, change the process state of the subsequent bonding process to the completed state, and the subsequent bonding process ends.

[0090] Thus, the computer program operates each module to automatically complete the transfer of all chips.

[0091] In this embodiment, the manual transfer process of the laser-assisted bonding equipment is streamlined and can be divided into multiple functional modules after optimization as follows:

[0092] Crystal ring / substrate positioning module, chip positioning module, pick-up and flip module, transfer head handover module, chip transfer and handover module, pre-bonding head handover module, transfer and reset module, glue dipping module, glue scraping module, substrate & chip positioning module, bonding module, bonding reset module, subsequent bonding module.

[0093] All modules other than the crystal removal ring / substrate positioning module have their respective process states. The process states include idle, in process, faulty, paused, completed, etc. The modules are connected end to end, and whether the next module starts running depends on whether the previous module has completed its operation. Through such a flow relationship, a closed-loop automatic chip transfer is achieved.

[0094] In the embodiments of the present invention, automatic control is achieved through a computer program. The program automatically collects the numerical values of each component device, plans an efficient and reasonable transfer process for coordinating the work of each step, and modularly encapsulates the work step units. The idle time of each device component is allocated to maximize efficiency, replacing manual labor, increasing productivity, and reducing the occurrence of faults and accidents.

[0095] The embodiments of the present invention also provide a laser-assisted bonding device for performing the method of automatically transferring chips by the above-mentioned laser-assisted bonding device.

[0096] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be determined by the scope defined by the claims.

[0097] Finally, it should also be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0098] In this specification, the various embodiments are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other. For the laser-assisted bonding device disclosed in the embodiments, since it corresponds to the method of automatically transferring chips by the laser-assisted bonding device disclosed in the above embodiments, the description is relatively simple, and the relevant parts can be referred to the description in the method section.

[0099] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An automatic chip transfer method for a laser-assisted bonding device, characterized in that, The method includes: Reading the transfer information in the record file; the record file includes a chip record file and a substrate record file, and the transfer information recorded in the chip record file includes the position information of the chips to be picked up on the crystal ring, and the transfer information of the substrate record file includes the position information of the chips to be attached on the substrate; Performing automatic transfer and bonding according to the transfer information in the record file and multiple pre-divided process flows; the multiple process flows include: crystal ring / substrate positioning process, chip positioning process, picking and flipping process, transfer head handover process, chip transfer handover process, pre-bonding head handover process, transfer reset process, glue dipping process, glue scraping process, substrate and chip positioning process, bonding process, bonding reset process, and subsequent bonding process.

2. The method according to claim 1, wherein The sequence of the multiple process flows is as follows: Crystal ring / substrate positioning process, chip positioning process, picking and flipping process, transfer head handover process, chip transfer handover process, pre-bonding head handover process, transfer reset process, glue dipping process, glue scraping process, substrate and chip positioning process, bonding process, bonding reset process, and subsequent bonding process; Among them, the transfer reset process and the glue dipping process are executed successively or in parallel, and the glue scraping process and the substrate and chip positioning process are executed successively or in parallel.

3. The method according to claim 2, wherein The performing of automatic transfer and bonding includes: Judging whether the process state of the previous process is the completed state, and judging whether the process state of the current process is the idle state. If both are yes, then change the process state of the current process to in-process, change the process state of the previous process to idle, and execute the current process.

4. The method according to claim 3, characterized in that, The performing of automatic transfer and bonding further includes: Judging whether the process state of the current process is a fault. If so, stop immediately; or, Judging whether the process state of the current process is a pause. If so, continue to wait.

5. The method according to any one of claims 1 to 4, characterized in that, The transfer head handover process includes: Controlling the transfer Z-axis motor to lower the transfer head to the chip handover height, and judging whether the transfer head touches the chip; If the chip is touched, then control the vacuum suction of the vacuum suction nozzle of the transfer head to turn on, turn off the vacuum suction of the picking vacuum suction nozzle, and control the transfer Z-axis motor to move away the transfer head.

6. The method according to any one of claims 1-4, characterized in that The chip transfer handover process includes: Controlling the transfer X-axis motor to move the transfer head to the chip transfer area, and controlling the vacuum suction of the chip transfer station to turn on; Controlling the transfer Z-axis motor to lower the transfer head to the handover position with the chip transfer station, placing the chip on the chip transfer station, turning off the vacuum suction of the vacuum suction nozzle of the transfer head, controlling the transfer Z-axis motor to move away the transfer head, and the chip transfer station adsorbs the chip.

7. The method according to any one of claims 1-4, characterized in that, The pre-bonding head handover process includes: Controlling the pre-bonding Y-axis motor to move the pre-bonding head to the handover position with the chip transfer station, and the pre-bonding Z-axis motor to lower the pre-bonding head to the handover position with the chip transfer station; Controlling the vacuum suction of the pre-bonding head to turn on, and turning off the vacuum suction of the chip transfer station; Controlling the pre-bonding Z-axis motor to raise the pre-bonding head to the glue dipping height or the alignment height.

8. The method according to any one of claims 1 to 4, characterized in that The chip positioning process includes: Read the chip record file to obtain information about all chips to be transferred; determine whether there are chips to be transferred. If there are chips to be transferred and the process status of itself is the idle state, then change the process status of the chip positioning process to in-process, and start chip positioning in sequence. The substrate and chip positioning process includes: Read the substrate record file to obtain information about all chips to be pasted; determine whether there are chips to be pasted. If there are chips to be pasted, the process status of the glue dipping process and the subsequent bonding process is completed, and the process status of itself is the idle state, then change the process status of itself to in-process, change the process status of the glue dipping process and the subsequent bonding process to idle, and start substrate and chip positioning in sequence.

9. The method according to any one of claims 1-4, characterized in that, The transfer and reset process includes: Control the transfer Z-axis motor to move to the initial position, control the RZ-axis motor to move to the initial position, and control the transfer Y-axis motor to move to the initial position; The bonding reset process includes: Control the pre-bonding RZ-axis motor to move to the initial position, and control the pre-bonding Y-axis motor to move to the initial position.

10. A laser-assisted bonding device, characterized in that, The device is used to execute the method for automatically transferring chips of the laser-assisted bonding device according to any one of claims 1-9 above.

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