Power conversion device
By configuring a shield between high and low voltage electronic components and using a cooling plate for thermal management, the problem of noise and heat influence of low voltage DC-DC converter circuits in electric motor-driven vehicles is solved, and the stable operation of the power conversion device is achieved.
Patent Information
- Application Number
- CN202510123629.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-01-31
- Filing Date
- 2025-01-26
- Publication Date
- 2025-08-01
AI Technical Summary
In electric motor-driven vehicles, low voltage DC-DC converter circuits are susceptible to noise and heat from other power conversion circuits, resulting in malfunctions.
A shield is arranged between the electronic components for high voltage and the electronic components for low voltage. The shield is suppressed by the propagation of heat and noise, and heat management is used to use a cooling plate, and the high and low voltage areas are isolated by a combined structure of the shield and the cooling plate.
It effectively suppresses the impact of noise and heat on low voltage circuits, ensuring that the power conversion device works normally in noise and thermal environments.
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Figure CN120415064A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a power conversion device. Background Art
[0002] In Patent Document 1, the following structure is described: In a DC-DC converter mounted on an automobile that obtains driving force from an electric motor, there is a first wall portion that separates a low-voltage circuit portion and a high-voltage circuit portion. Specifically, the following structure is disclosed: As shown in FIG. 12 of the document, a first wall (120) is disposed between a first space (150) that houses the high-voltage circuit portion and a second space (151) that houses the low-voltage circuit portion.
[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2014-131371
[0004] In a vehicle that travels with the driving force of an electric motor, a power conversion device that controls the power supplied to the electric motor is considered to be provided in a housing that houses the electric motor, a reduction gear, etc.
[0005] In a vehicle that travels using the driving force of an electric motor, in order to be able to charge a battery that supplies power to the electric motor with commercial power supplied from the outside, a charging circuit that performs voltage conversion and rectification is sometimes required. In addition, in order to supply power to an in-vehicle air conditioning device and operate displays of instruments, a car navigation system, etc., a DC-DC converter circuit that converts the power of the battery into low-voltage power is also sometimes required. Therefore, it is also considered to configure a power conversion device by integrating a charging circuit, a DC-DC converter circuit, etc. into one package and housing the power conversion device in a housing.
[0006] However, in a structure in which a power conversion device configured as one package is housed in a housing that houses an electric motor, for example, for a low-voltage DC-DC converter circuit, there is also a concern that the action of noise from other power conversion circuits and heat from other circuits may cause malfunction.
[0007] For these reasons, there is a need for a power conversion device in which a low-voltage circuit can operate properly even in an environment affected by noise and heat. Summary of the Invention
[0008] The characteristic structure of the power conversion device according to the present invention is as follows: it includes a housing; a power conversion circuit housed in the housing for converting power; and a cooling plate housed in the housing for cooling the power conversion circuit with a cooling fluid. The power conversion circuit has high-voltage electronic components through which high-voltage power flows and low-voltage electronic components through which power lower than that of the high-voltage electronic components flows. A shielding body branching out from the cooling plate and protruding is disposed between the high-voltage electronic components and the low-voltage electronic components in the power conversion circuit.
[0009] According to this structure, since a shielding body is disposed between the high-voltage electronic components and the low-voltage electronic components, the phenomenon that heat and noise from the high-voltage electronic components act on the low-voltage electronic components is suppressed. Therefore, a power conversion device is constituted such that the low-voltage circuit can operate properly even in an environment affected by noise and heat. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 It is a cross-sectional view showing the positional relationship of the shielding body, the parallel shielding portion, and the OBC substrate.
[0011] Figure 2 It is a top view of the OBC substrate.
[0012] Figure 3 It is a perspective view showing the positional relationship of the shielding body, the parallel shielding portion, and the OBC substrate.
[0013] REFERENCE NUMERAL DESCRIPTION
[0014] 1... OBC circuit (power conversion circuit); 1a... OBC substrate (power conversion substrate); 1E... substrate end; 2... cooling plate; 2E... plate end; 11... shielding body; 11a... erected portion; 14... high-voltage electronic component; 15... low-voltage electronic component; AH... housing; B... power conversion device; C... between (boundary); DS... dead zone; M... driving motor; P... motor shaft center; X... high-voltage region; Y... low-voltage region. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0015] Hereinafter, embodiments of the power conversion device according to the present invention will be described based on the drawings. In the present embodiment, it is not limited to the following embodiments, and various modifications can be made without departing from the gist thereof.
[0016] 〔Basic Structure〕
[0017] Figure 1This represents a part of the cross-section of a vehicle drive device A that transmits the driving force of a driving motor M to wheels (not shown). The vehicle drive device A houses the driving motor M, a gear mechanism (not shown) that decelerates and transmits the driving force of the driving motor M to the drive wheels (not shown), and a power conversion device B in the internal space AS of a housing AH.
[0018] The vehicle drive device A is arranged in the vehicle in the Figure 1 vertical relationship shown. Therefore, in this embodiment, the vertical relationship is described in the Figure 1 vertical direction shown.
[0019] The power conversion device B includes: an OBC circuit 1 for charging (an example of a power conversion circuit) that converts AC power from an AC power source (basically a commercial power source) supplied from outside the vehicle into high-voltage DC power and charges a battery (not shown), a DC-DC converter that steps down the DC power of the battery to the voltage used by in-vehicle devices and outputs it, and a voltage conversion unit that steps down the power of the battery to the voltage of the commercial power source and outputs it as AC power, etc. The OBC in the above-mentioned OBC circuit is an abbreviation for On Bord charger.
[0020] This power conversion device B is provided in a vehicle having the same power structure as a plug-in hybrid electric vehicle (PHEV: Plug-in Hybrid Electric Vehicle). In addition, the vehicle is not limited to a plug-in hybrid electric vehicle, and can also be a hybrid electric vehicle (HEV: Hybrid Electric Vehicle), a battery electric vehicle (BEV: Battery Electric Vehicle), or a fuel cell electric vehicle (FCEV: Fuel Cell Electric Vehicle).
[0021] As Figure 1 shown, the power conversion device B has a structure in which the OBC circuit 1 is arranged at the upper part as a power conversion circuit, a cooling plate 2 is arranged in the middle in the vertical direction, a filter circuit board 3 is arranged at the lower end position, and these are connected by a plurality of connecting frames 4. This power conversion device B includes the above-mentioned DC-DC converter, voltage conversion unit, etc., and is arranged in the internal space AS of the housing AH on the side close to the driving motor M.
[0022] The filter circuit board 3 includes a plurality of electronic components, a plurality of coil modules, a plurality of AC filters, etc.
[0023] The cooling plate 2 functions in such a way that the cooling fluid supplied from the outside flows through the internal flow path, thereby reducing the temperatures of both the front and back surfaces of the cooling plate 2. The cooling plate 2 can use cooling water such as long-life coolant (LLC), insulating oil such as paraffin, or refrigerants such as hydrofluorocarbon (HFC) and hydrofluoroolefin (HFO) as the cooling fluid. In this embodiment, cooling water such as long-life coolant (LLC) containing ethylene glycol, propylene glycol, etc. is used.
[0024] The cooling plate 2 is configured to be connected to the lower filter circuit board 3 through a plurality of connection frames 4. Since the temperature of the connection frames 4 is reduced, heat of the filter substrate is removed through the connection frames 4. In addition, electronic components and the like mounted on the filter circuit board 3 are arranged in a state close to or in contact with the lower surface of the filter circuit board 3. Thus, for the cooling plate 2, the cooling plate 2 directly removes the heat generated in the electronic components and the like mounted on the filter circuit board 3, suppressing the temperature rise.
[0025] A transformer 6 (transformer) is arranged at a position close to the upper side of the cooling plate 2. The cooling plate 2 has a cooling wall 10 that protrudes upward on the opposite side of the driving motor M with respect to the transformer 6. In addition, the cooling plate 2 has a plate-shaped shielding body 11 that protrudes upward on the side close to the driving motor M. The shielding body 11 is arranged close to the OBC circuit 1 between the driving motor M and the power conversion device B.
[0026] And, a shielding plate 7 whose both ends are supported by the cooling wall 10 and the shielding body 11 is arranged above the transformer 6. The shielding plate 7 uses a metal material that blocks electromagnetic noise.
[0027] The cooling wall 10 and the shielding body 11 are not configured for the cooling fluid to flow through, and function in such a way that the temperature around them is reduced through temperature reduction based on heat conduction. The cooling wall 10 and the shielding body 11 use a metal material with high thermal conductivity, and may also use a conductive resin material or a resin with high thermal conductivity. When the shielding body 11 uses a metal material or a conductive resin material, a structure is adopted such that they are electrically connected to the ground side of the power conversion device B.
[0028] As Figure 1 、 Figure 2 shown, the OBC circuit 1 (power conversion circuit) has electronic components such as electronic components and capacitors capable of voltage conversion on the lower surface side of the OBC substrate 1a (an example of a power conversion substrate). The OBC substrate 1a has a plurality of high-voltage electronic components 14 and a plurality of low-voltage electronic components 15 as electronic components (the arrangement and the like of these electronic components will be described later).
[0029] The OBC substrate 1a (power conversion substrate) of the OBC circuit 1 is connected to the cooling plate 2 through a plurality of connecting frames 4, so heat dissipation can also be carried out via the connecting frames 4. In particular, the standing portion 11a that becomes the extended protruding end of the upper end portion of the shielding body 11 is connected to the OBC substrate 1a, and the parallel shielding portion 12 integrally formed in a balcony shape at the upper end portion of the shielding body 11 is arranged to extend in the direction of the driving motor M in a posture along the lower surface of the OBC substrate 1a.
[0030] As Figure 1 , Figure 3 shown, the end portion of the parallel shielding portion 12 and the standing portion 11a of the upper end portion of the shielding body 11 are connected to the OBC substrate 1a through a plurality of small screws 13. With this structure, heat of electronic components and the like of the OBC circuit 1 can be transferred to the small screws 13, the parallel shielding portion 12, and the shielding body 11, and cooled in the cooling plate 2. In addition, bolts or rivets can be used to connect the end portion of the parallel shielding portion 12 and the upper end portion of the shielding body 11. Further, when the parallel shielding portion 12 and the shielding body 11 are made of metal, they can also be fixed to the ground side of the OBC substrate 1a by soldering or welding.
[0031] In addition, the shielding body 11 is a component that functions as a standing portion 11a that stands up from the board end 2E as a whole. In the present embodiment, the base end side is connected to the cooling plate 2, and the structure that branches from the cooling plate 2 and protrudes upward is called the shielding body 11. Further, the standing portion 11a is at the upper end portion of the shielding body 11, and the position along the gap C (the boundary in the present embodiment) between the high voltage region X and the low voltage region Y when viewed from above is recorded as the connection portion.
[0032] 〔Noise countermeasures〕
[0033] The direction of the motor axis P around which the rotor of the driving motor M rotates is set as Figure 1 shown. In addition, the OBC substrate 1a, the cooling plate 2, and the filter circuit substrate 3 are arranged in a posture along the motor axis P and in a posture where the OBC substrate 1a, the cooling plate 2, and the filter circuit substrate 3 are parallel to each other.
[0034] The substrate end 1E of the OBC substrate 1a (power conversion substrate) close to the outer periphery of the driving motor M protrudes more than the plate end 2E of the cooling plate 2 close to the outer periphery of the driving motor M. As a result, a dead zone DS in a triangular shape when viewed in the direction of the motor axis P is formed between the lower side of the OBC substrate 1a and the outer periphery of the driving motor M. That is, a dead zone DS is formed in an inverted triangular shape on the upper side from the plate end 2E of the cooling plate 2 close to the outer periphery of the driving motor M and on the lower side of the region where the OBC circuit 1 is arranged above the driving motor M.
[0035] AsFigure 2 As shown, the OBC substrate 1a is arranged such that the substrate end 1E overlaps with the upper side of the driving motor M, and the parallel shielding portion 12 overlaps with the upper side of the driving motor M.
[0036] In the OBC substrate 1a of the OBC circuit 1, a high-voltage region X is arranged at a position separated from the driving motor M, and a low-voltage region Y is arranged at a position close to the driving motor M. High-voltage electronic components 14 (such as switching elements and capacitors for high-voltage battery charging and discharging) for controlling high voltage are arranged in the high-voltage region X, and low-voltage electronic components 15 (such as switching elements and capacitors for low-voltage battery charging and discharging) for controlling low voltage are arranged in the low-voltage region Y.
[0037] The OBC substrate 1a is arranged at a position where a part of the outer end side of the low-voltage region Y overlaps with the upper side of the driving motor M. Such an arrangement is determined by circuit design based on the positional relationship with other substrates, the size of the substrate, and the reasonable arrangement of electronic components, etc.
[0038] The driving motor M is a motor that generates electromagnetic noise accompanied by heat during operation. In the OBC substrate 1a, the low-voltage electronic components 15 used in the low-voltage region Y are more susceptible to temperature and noise effects compared to the high-voltage electronic components 14 used in the high-voltage region X. In addition, the low-voltage electronic components 15 are sometimes affected by the noise and heat generated in the high-voltage region X. The high-voltage electronic components 14 are not limited to the high-voltage electronic components 14 mounted on the OBC substrate 1a, and include the transformer 6 and the coil module constituting the filter circuit board 3. Therefore, the high-voltage region X includes the high-voltage electronic components 14, the transformer 6, the coil module, etc. mounted on the OBC substrate 1a.
[0039] For such reasons, as Figure 1 shown, in the longitudinal region adjacent to the dead zone DS, the shielding body 11 is arranged at a position along the region C between the high-voltage region X and the low-voltage region Y in a top view, and inside the dead zone DS, the parallel shielding portion 12 is arranged in a manner that follows the lower side of the portion of the OBC substrate 1a arranged on the upper side of the driving motor M.
[0040] As Figure 1 , Figure 3 shown, the standing portion 11a at the upper end of the shielding body 11 is arranged at a position (boundary) that overlaps with the region C between the high-voltage region X and the low-voltage region Y in a top view of the OBC substrate 1a, thereby disconnecting the high-voltage region X and the low-voltage region Y. The parallel shielding portion 12 is arranged at a position separated by a set distance downward from the lower surface of the OBC substrate 1a. Thus, the parallel shielding portion 12 covers the lower side of the low-voltage electronic components 15 of the OBC substrate 1a.
[0041] Due to such a positional relationship, the shielding body 11 and the parallel shielding portion 12 block the heat and electromagnetic noise acting from the driving motor M and the heat and electromagnetic noise acting from the high-voltage region X, and can suppress malfunction in the low-voltage region Y. Furthermore, since the shielding body 11 can block the heat and electromagnetic noise acting from the driving motor M, malfunction in the high-voltage region X is also suppressed.
[0042] 〔Other Embodiments〕
[0043] In addition to the above-described embodiments, the present invention may also be configured as follows (structures having the same functions as those of the embodiments are denoted by the same numbers and reference numerals as those of the embodiments).
[0044] (a) Not limited to the OBC substrate 1a, the shielding body 11 may be disposed in a region C between the high-voltage electronic component 14 disposed in the high-voltage region X and the low-voltage electronic component 15 disposed in the low-voltage region Y in a power control circuit including the high-voltage region X having the high-voltage electronic component 14 and the low-voltage region Y having the low-voltage electronic component 15. Also, as partly described in the embodiment, the shielding body 11 can use a material having at least one of the properties of good electromagnetic shielding and good heat conductivity.
[0045] (b) In the embodiment, it is configured that a cooling fluid flows through the shielding body 11. By configuring in this way, heat of the electronic component can also be actively removed in the shielding body 11, and good heat dissipation can be performed.
[0046] (c) It may also be configured that electronic components are disposed on either the upper surface or the lower surface or both the upper surface and the lower surface of the substrate constituting the power conversion circuit. That is, for example, for a substrate having a high-voltage region X with a high-voltage electronic component 14 formed on the upper surface and a low-voltage region Y with a low-voltage electronic component 15, the shielding body 11 may be disposed such that the standing portion 11a of the shielding body 11 approaches the region C between them from the lower side of the substrate, and the parallel shielding portion 12 may be disposed along the lower surface of the substrate.
[0047] In addition, in the other embodiment (c), it may also be configured that electronic components are disposed on both surfaces of the substrate constituting the electric control circuit, thereby forming a high-voltage region X having a high-voltage electronic component 14 and a low-voltage region Y having a low-voltage electronic component 15, and the standing portion 11a of the shielding body 11 is made to approach the region C between them.
[0048] (d) It may also be configured that the power control circuit is disposed in a positional relationship in which a unit having a high-voltage region X including a high-voltage electronic component 14 and a unit having a low-voltage region Y including a low-voltage electronic component 15 are adjacent to each other.
[0049] In the structure of this other embodiment (d), when there is a gap between the cell with the high-voltage region X and the cell with the low-voltage region Y, the shielding body 11 can be disposed in this gap. In addition, when there is no gap, the shielding body 11 can also be disposed at a position close to the region C between them.
[0050] (e) In the above-described embodiment, the standing portion 11a at the upper end of the shielding body 11 is disposed at a position (boundary) that overlaps the region C between the high-voltage region X and the low-voltage region Y when viewed from above in the OBC substrate 1a, thereby disconnecting the high-voltage electronic component 14 disposed in the high-voltage region X and the low-voltage electronic component 15 disposed in the low-voltage region Y. Instead of this, the standing portion 11a at the upper end of the shielding body 11 can also be disposed slightly on the high-voltage region X side or the low-voltage region Y side with respect to the boundary between the high-voltage region X and the low-voltage region Y when viewed from above. In this case, the shielding body 11 is also disposed between the high-voltage electronic component 14 in the high-voltage region X and the low-voltage electronic component 15 in the low-voltage region Y.
[0051] In addition, as long as there is no contradiction, the structures disclosed in the above-described embodiments (including other embodiments, the same applies hereinafter) can be combined and applied with the structures disclosed in other embodiments. In addition, the embodiments disclosed in this specification are examples, and the embodiments of the present invention are not limited thereto, and can be appropriately changed without departing from the purpose of the present invention.
[0052] In the above-described embodiment, the following structure is recalled.
[0053] (1) It includes: a housing AH; a power conversion circuit (OBC circuit 1) housed in the housing AH for converting power; and a cooling plate 2 housed in the housing AH for cooling the power conversion circuit (OBC circuit 1) with a cooling fluid. The power conversion circuit (OBC circuit 1) has: a high-voltage electronic component 14 through which high-voltage power flows, and a low-voltage electronic component 15 through which power lower than that of the high-voltage electronic component 14 flows. The shielding body 11 branched and protruding from the cooling plate 2 is disposed in the region C between the high-voltage electronic component 14 and the low-voltage electronic component 15 in the power conversion circuit (OBC circuit 1).
[0054] Accordingly, since the shielding body 11 is disposed in the region C between the high-voltage electronic component 14 and the low-voltage electronic component 15, the phenomenon that the heat and noise from the high-voltage electronic component 14 act on the low-voltage electronic component 15 is suppressed.
[0055] (2) In the power conversion device B of (1), it is preferably further provided with a traveling motor M housed in the housing AH, and the shielding body 11 is disposed between the traveling motor M and the power conversion circuit (OBC circuit 1).
[0056] Accordingly, the noise or heat generated in the traveling motor M can be blocked by the shielding body 11, and the malfunction of the power conversion circuit (OBC circuit 1) caused by the influence of these noise or heat can be suppressed.
[0057] (3) In the power conversion device B of (1) or (2), it is preferable that the power conversion substrate (OBC substrate 1a) on which the power conversion circuit (OBC circuit 1) is mounted and the cooling plate 2 are in a positional relationship parallel to each other along the motor axis P of the traveling motor M, and the substrate end portion 1E on the outer peripheral side of the traveling motor M in the power conversion substrate (OBC substrate 1a) protrudes more than the plate end portion 2E on the outer peripheral side of the traveling motor M in the cooling plate 2, so that a triangular dead zone DS is formed between the power conversion substrate (OBC substrate 1a) and the outer periphery of the traveling motor M when viewed in the direction along the motor axis P. The shielding body 11 has a standing portion 11a standing up from the plate end portion 2E toward the power conversion substrate (OBC substrate 1a) at a position adjacent to the dead zone DS.
[0058] Accordingly, a triangular dead zone DS is formed between the power conversion substrate (OBC substrate 1a) and the outer periphery of the traveling motor M when viewed in the direction along the motor axis P. The shielding body 11 adjacent to the dead zone DS is effectively arranged by making use of the dead zone DS, so that the arrangement of the shielding body 11 is reasonable. For example, even if a part of the shielding body 11 protrudes toward the dead zone DS, it can be easily arranged.
[0059] (4) In any one of the power conversion devices B in (1) to (3), it is preferable that the shielding body 11 is formed with a parallel shielding portion 12 extending and protruding toward the power conversion substrate (OBC substrate 1a) side of the standing portion 11a along the posture of the power conversion substrate (OBC substrate 1a) toward the dead zone DS.
[0060] Accordingly, the parallel shielding portion 12 is formed at the end portion on the extending and protruding side of the shielding body 11 along the posture of the power conversion substrate (OBC substrate 1a). Therefore, the parallel shielding portion 12 blocks the noise and heat radiated from the traveling motor M toward the power conversion substrate (OBC substrate 1a), and can suppress the malfunction of the electronic components of the power conversion substrate (OBC substrate 1a). In addition, since the parallel shielding portion 12 is formed toward the dead zone DS, no design change for ensuring the space for arrangement is required.
[0061] (5) In the power conversion device B of (1), it is preferable that the power conversion circuit (OBC circuit 1) has a high voltage region X in which high voltage electronic components 14 are arranged and a low voltage region Y in which low voltage electronic components 15 are arranged.
[0062] Accordingly, the power conversion circuit (OBC circuit 1) can be constituted by the high voltage region X in which high voltage electronic components 14 are arranged and the low voltage region Y in which low voltage electronic components 15 are arranged.
[0063] (6) In the power conversion device B of (5), it is preferable that the high voltage region X is arranged at a position farther from the traveling motor M housed in the housing AH than the low voltage region Y, and the shielding body 11 has a standing portion 11a standing up from the plate end portion 2E on the outer peripheral side of the traveling motor M in the cooling plate 2 toward the power conversion substrate (OBC substrate 1a) on which the power conversion circuit (OBC circuit 1) is mounted, and the standing portion 11a is arranged at a position where the high voltage region X and the low voltage region Y are disconnected.
[0064] Accordingly, the noise and heat acting on the low voltage region Y from the high voltage region X can be reliably blocked by the standing portion 11a arranged at the position where the high voltage region X and the low voltage region Y are disconnected.
[0065] Industrial applicability
[0066] The present invention can be used for power conversion devices.
Claims
1. A power conversion device, comprising: A housing; A power conversion circuit, housed in the housing, for converting power; and A cooling plate, housed in the housing, for cooling the power conversion circuit with a cooling fluid, The power conversion circuit has: high-voltage electronic components through which high-voltage power flows, and low-voltage electronic components through which power lower in voltage than the high-voltage electronic components flows, A shielding body branching out from the cooling plate and protruding is disposed between the high-voltage electronic components and the low-voltage electronic components in the power conversion circuit.
2. The power conversion device according to claim 1, wherein It further comprises a driving motor housed in the housing, The shielding body is disposed between the driving motor and the power conversion circuit.
3. The power conversion device according to claim 2, wherein The power conversion substrate on which the power conversion circuit is mounted and the cooling plate are in a positional relationship parallel to each other along the motor axis of the driving motor, The end of the substrate on the outer peripheral side of the driving motor in the power conversion substrate protrudes more than the end of the plate on the outer peripheral side of the driving motor in the cooling plate, so that a triangular dead zone is formed between the power conversion substrate and the outer periphery of the driving motor when viewed in the direction along the motor axis, The shielding body has a standing portion standing up from the end of the plate on the outer peripheral side of the driving motor in the cooling plate toward the power conversion substrate at a position adjacent to the dead zone.
4. The power conversion device according to claim 3, wherein The shielding body forms a parallel shielding portion along the posture of the power conversion substrate toward the dead zone at the extended protruding end on the power conversion substrate side of the standing portion.
5. The power conversion device according to claim 1, wherein The power conversion circuit has: a high-voltage region where the high-voltage electronic components are disposed, and a low-voltage region where the low-voltage electronic components are disposed.
6. The power conversion device according to claim 5, wherein The high-voltage region is disposed at a position farther from the driving motor housed in the housing than the low-voltage region, The shielding body has a standing portion standing up from the end of the plate on the outer peripheral side of the driving motor in the cooling plate toward the power conversion substrate on which the power conversion circuit is mounted, and this standing portion is disposed at a position disconnecting the high-voltage region and the low-voltage region.
7. The power conversion device according to claim 1, wherein The shielding body is a structure through which the cooling fluid flows.
8. The power conversion device according to claim 3, wherein The upper end of the shielding body is connected to the power conversion substrate.
Citation Information
Patent Citations
DC-DC converter
JP2014131371A