A PCB etching liquid homogenization system based on liquid dynamic mixing structure

Abstract

The present invention relates to the technical field of circuit board etching, and discloses a PCB etching liquid homogenization system based on a liquid dynamic mixing structure, comprising an etching tank; a protective plate is detachably mounted on the top of the etching tank, a rotating shaft is rotatably mounted in the space formed by the protective plate and the etching tank, a limiting member for clamping the PCB board is provided on the outer surface of the rotating shaft, and a swinging member for disturbing the etching liquid is provided in the etching tank; wherein the limiting member comprises a limiting frame fixedly connected to the outer surface of the rotating shaft, and an abutment block is fixedly connected to the bottom of the limiting frame. The PCB etching liquid homogenization system based on a liquid dynamic mixing structure can effectively solve the problem in the prior art that products such as copper ions generated by the reaction accumulate locally, and this concentration gradient forms a diffusion boundary layer, which hinders the replenishment of fresh etching liquid to the board surface, resulting in a decrease in etching rate, thereby causing inconsistent etching rate on the circuit board surface and affecting the etching quality of the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board etching, and in particular to a PCB etching liquid homogenization system based on a liquid dynamic mixing structure. Background Art

[0002] In the printed circuit board (PCB) manufacturing process, etching is the core process for transferring circuit patterns. The precision of the etching process plays a decisive role in the PCB's electrical conductivity and reliability. During the etching process, the uniformity of the etching solution's dynamic flow distribution and the efficiency of the mass transfer reaction between the etching solution and the substrate surface are key technical parameters determining etching quality.

[0003] In existing etching equipment, circuit boards mostly move slowly in a translational manner. As etching proceeds, the active ingredients in the etching solution continuously react with the copper on the surface of the circuit board, causing the etching solution concentration near the board surface to drop rapidly, while the copper ions and other products generated by the reaction accumulate locally. This concentration gradient will form a diffusion boundary layer, hindering the replenishment of fresh etching solution to the board surface, resulting in a decrease in etching rate, which in turn leads to inconsistent etching rate on the board surface, affecting the etching quality of the circuit board. Summary of the Invention

[0004] In response to the above-mentioned shortcomings of the prior art, the present invention provides a PCB etching liquid homogenization system based on a liquid dynamic mixing structure, which can effectively solve the problem in the prior art that products such as copper ions generated by the reaction accumulate locally. This concentration gradient will form a diffusion boundary layer, hindering the replenishment of fresh etching liquid to the board surface, resulting in a decrease in etching rate, thereby causing inconsistent etching rate on the circuit board surface and affecting the etching quality of the circuit board.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0006] The present invention provides a PCB etching liquid homogenization system based on a liquid dynamic mixing structure, comprising:

[0007] Etched tank;

[0008] A protective plate is detachably mounted on the top of the etching tank, a rotating shaft is rotatably mounted in the space formed by the protective plate and the etching tank, a limiter is provided on the outer surface of the rotating shaft for clamping the PCB board, and a swinging member is provided in the etching tank for disturbing the etching liquid;

[0009] The limiting member includes a limiting frame fixedly connected to the outer surface of the rotating shaft, and the limiting frame is provided with a plurality of limiting frames and distributed in a circular array along the center of the rotating shaft. The bottom of the limiting frame is fixedly connected to an abutment block, and the top of the abutment block is designed in an arc surface.

[0010] A driving member for driving the rotating shaft to rotate is detachably mounted on the top of the protective plate. When the rotating shaft rotates, the abutment block triggers the swinging member to move so as to disturb the etching liquid around it.

[0011] Furthermore, the swinging member includes a guide plate fixedly connected to the inner wall of the etching groove, and the guide plates are provided in plurality and distributed in a circular array along the center of the etching groove. The guide plate is slidably connected to a movable plate that fits the arc surface of the abutment block through a slide groove provided inside the guide plate, and a counterweight plate is fixedly connected inside the movable plate. The movable plate is connected to the inner wall of the slide groove through an elastic member provided at its top.

[0012] Furthermore, the guide plate is rotatably connected to a connecting shaft via a pin shaft arranged inside it, and the connecting shaft is connected to the outer side of the movable plate via a universal joint arranged at its end. A plurality of connecting shafts are provided and distributed in an array along the center of the guide plate, and a disturbance plate is fixedly connected to the side of the connecting shaft away from the movable plate.

[0013] Furthermore, a slot is provided at the top of the limit frame, and the cross-section of the slot is trapezoidal in design. The limit frame is fixedly connected to a guide sleeve through a slot hole provided on its outer side. The guide sleeves are provided in two groups, and the two groups of guide sleeves are symmetrically distributed along the center of the limit frame. Each group of guide sleeves includes two, and the two guide sleeves in the same group are staggered.

[0014] Furthermore, the inner wall of the guide sleeve is provided with symmetrically distributed guide grooves along the axial direction, and the guide groove is slidably connected to a guide block via a compression spring arranged therein, the guide block is fixedly connected to a swing shaft on the side away from the guide groove, the adjacent surfaces of the two swing shafts are rotatably connected to a limit rod, and the limit rod is L-shaped, and the outer surface of the swing shaft is sleeved with a torsion spring connected to the limit rod and the outer side of the guide block;

[0015] A guide portion is provided at one end of the limiting rod away from the PCB board, and the guide portion includes an inclined guiding surface and a limiting protrusion provided on the top of the guiding surface.

[0016] Furthermore, the limiting frame is slidably connected to the abutment rod through a guide frame arranged on its outside, and both ends of the abutment rod are respectively designed as arc surfaces, and a limiting groove that fits with the limiting protrusion is provided on the outside of the arc surface at the bottom of the abutment rod.

[0017] Furthermore, a ring plate is fixedly connected to the bottom of the protective plate, and the bottom of the ring plate is provided with a resistance portion that fits with the arc surface of the top of the resistance rod. The resistance portion is designed in a stepped shape, and there are multiple groups of resistance portions distributed in a circular array along the center of the ring plate.

[0018] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0019] The present invention is provided with a swinging part and a limiting part. The arc surface of the abutting block at the bottom of the limiting frame fits with the movable plate. When the rotating shaft rotates, the movable plate is pushed up along the guide plate slide groove, and the connecting shaft and the disturbance plate are driven to swing through the universal shaft. When the abutment block is disengaged, the movable plate is reset under the action of the counterweight plate, and the disturbance plate swings back and forth to stir the etching liquid. The serrated structure on the edge of the disturbance plate can generate high-frequency eddy currents, destroy the laminar boundary layer, and improve the diffusion efficiency of etching ions. As the limiter rotates, the stepped abutment portion of the ring plate at the bottom of the protective plate contacts the arc surface at the top of the abutment rod, and the abutment rod falls into the first-level area of ​​the abutment portion. The downward displacement pushes the limit rod to move horizontally through the guide slope, so that its end face fits tightly with the edge of the PCB board. The elastic deformation of the arc-shaped flexible buffer pad is used to achieve damage-free rigid positioning. The abutment rod enters the second-level area, and the second downward displacement drives the limit rod to rotate around the swing axis through the engagement of the limit groove and the limit protrusion, lifting the PCB board so that its bottom is separated from the support surface, forming a contactless suspension state, avoiding the support surface from blocking the etching liquid, and ensuring uniform etching of the board surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0021] Figure 1 This is a schematic diagram of the main three-dimensional structure of an embodiment of the present invention;

[0022] Figure 2 Schematic diagram of the three-dimensional separation structure of an embodiment of the present invention;

[0023] Figure 3 Schematic diagram of the three-dimensional separation structure of the limiting member according to an embodiment of the present invention;

[0024] Figure 4 For the embodiment of the present invention Figure 3 A schematic diagram of the partially enlarged structure at point A in the middle;

[0025] Figure 5 Schematic diagram of the cross-sectional structure of a guide sleeve according to an embodiment of the present invention;

[0026] Figure 6 For the embodiment of the present invention Figure 5 A schematic diagram of the structure with a partial enlargement at point B in the middle;

[0027] Figure 7 Schematic diagram of the three-dimensional separation structure of the swing member according to an embodiment of the present invention;

[0028] Figure 8It is a schematic diagram of the three-dimensional separation structure of the protective plate and the ring plate in an embodiment of the present invention.

[0029] The numbers in the figure represent: 1. etching groove; 2. protective plate; 21. ring plate; 22. interference part; 3. rotating shaft; 4. limiting member; 41. limiting frame; 411. notch; 42. abutment block; 43. guide sleeve; 431. guide groove; 432. guide block; 433. swing shaft; 434. torsion spring; 44. limiting rod; 441. guide part; 45. guide frame; 46. abutment rod; 5. swing member; 51. guide plate; 52. movable plate; 521. counterweight plate; 53. connecting shaft; 54. disturbance plate; 6. driving member. DETAILED DESCRIPTION

[0030] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0031] The present invention will be further described below with reference to the embodiments.

[0032] Example:

[0033] See also Figures 1-8 The present invention provides a technical solution: a PCB etching liquid homogenization system based on a liquid dynamic mixing structure, comprising:

[0034] Etching tank 1;

[0035] A protective plate 2 is detachably mounted on the top of the etching tank 1. A rotating shaft 3 is rotatably mounted in the space formed by the protective plate 2 and the etching tank 1. A limiter 4 for clamping the PCB is provided on the outer surface of the rotating shaft 3. A swinging member 5 for disturbing the etching liquid is provided in the etching tank 1.

[0036] The limiting member 4 includes a limiting frame 41 fixedly connected to the outer surface of the rotating shaft 3, and the limiting frame 41 is provided with a plurality of limiting frames 41 and distributed in a circular array along the center of the rotating shaft 3. The bottom of the limiting frame 41 is fixedly connected to an abutment block 42, and the top of the abutment block 42 is designed in an arc surface.

[0037] A driving member 6 for driving the rotating shaft 3 to rotate is detachably mounted on the top of the protective plate 2. When the rotating shaft 3 rotates, the abutment block 42 triggers the swing member 5 to move to disturb the etching liquid around it.

[0038] The swinging member 5 includes a guide plate 51 fixedly connected to the inner wall of the etching groove 1, and the guide plates 51 are provided in plurality and distributed in a circular array along the center of the etching groove 1. The guide plate 51 is slidably connected to a movable plate 52 that fits the arc surface of the abutment block 42 through a slide groove provided therein, and a counterweight plate 521 is fixedly connected to the inside of the movable plate 52. The movable plate 52 is connected to the inner wall of the slide groove through an elastic member provided at its top.

[0039] The guide plate 51 is rotatably connected to a connecting shaft 53 via a pin arranged inside the guide plate 51, and the connecting shaft 53 is connected to the outer side of the movable plate 52 via a universal joint arranged at its end. There are multiple connecting shafts 53 and they are distributed in an array along the center of the guide plate 51. A disturbance plate 54 is fixedly connected to the side of the connecting shaft 53 away from the movable plate 52.

[0040] A slot 411 is provided at the top of the limit frame 41, and the cross-section of the slot 411 is trapezoidal in design. The limit frame 41 is fixedly connected to a guide sleeve 43 through a slot hole provided on its outer side. The guide sleeve 43 is provided in two groups, and the two groups of guide sleeves 43 are symmetrically distributed along the center of the limit frame 41. Each group of guide sleeves 43 includes two, and the two guide sleeves 43 in the same group are staggered.

[0041] The inner wall of the guide sleeve 43 is provided with symmetrically distributed guide grooves 431 along the axial direction. The guide grooves 431 are slidably connected to the guide blocks 432 via compression springs provided therein. The guide blocks 432 are fixedly connected to a swing shaft 433 on the side away from the guide grooves 431. The adjacent surfaces of the two swing shafts 433 are rotatably connected to a limit rod 44. The limit rod 44 is L-shaped. The outer surface of the swing shaft 433 is sleeved with a torsion spring 434 connected to the limit rod 44 and the outer side of the guide block 432.

[0042] A guide portion 441 is provided at one end of the limiting rod 44 away from the PCB board. The guiding portion 441 includes an inclined guiding surface and a limiting protrusion provided on the top of the guiding surface.

[0043] The limiting frame 41 is slidably connected to the abutting rod 46 through a guide frame 45 arranged on its outside, and the two ends of the abutting rod 46 are respectively designed as arc surfaces. A limiting groove is provided on the outside of the arc surface at the bottom of the abutting rod 46 to fit with the limiting protrusion.

[0044] The bottom of the protective plate 2 is fixedly connected to a ring plate 21, and the bottom of the ring plate 21 is provided with a resistance portion 22 that fits with the arc surface of the top of the resistance rod 46. The resistance portion 22 is designed in a stepped shape. There are multiple groups of resistance portions 22 and they are distributed in a circular array along the center of the ring plate 21.

[0045] The working principle and advantages of the PCB etching liquid homogenization system based on liquid dynamic mixing structure:

[0046] PCB placement process:

[0047] During the actual operation, the operator must first remove the protective plate 2 and driver 6 from the top of the etching tank 1 using the quick-release mechanism. The PCB is then loaded along the notch 411 at the top of the retaining frame 41, sliding along the notch 411 into the internal positioning space of the retaining frame 41. By repeating this process, multiple PCBs can be sequentially loaded into corresponding retaining frames 41. After the PCBs are loaded, an etching solution that meets the required process parameters is injected into the etching tank 1. Finally, the protective plate 2 and driver 6 are reinstalled in sequence.

[0048] It is worth noting that quick-release connection mechanisms are used between the protective plate 2 and the etching tank 1, and between the protective plate 2 and the driving member 6. This mechanism can be in the form of a snap, magnetic connection, or bolt connection, with the bolt connection solution being preferred based on reliability. When the PCB board enters the interior of the limit frame 41 along the notch 411, the bottom surface of the PCB board contacts the bottom support surface of the limit frame 41. In conjunction with the preset limit stop bar in the limit frame 41, this can effectively prevent the PCB board from falling out of the limit frame 41. At the same time, it can ensure that the PCB board maintains a vertical posture in the etching tank 1. Compared with the horizontal placement of traditional PCB boards, this avoids the difference in concentration gradient between the upper and lower layers of the etching solution caused by gravity, effectively eliminating the problem of inconsistent etching rates on the surface of the PCB board.

[0049] The slot 411 at the top of the limit frame 41 is wide at the top and narrow at the bottom (the width of the open end is wider than the width of the bottom), forming a natural guiding slope. When the PCB board is inserted into the slot 411, the slope can guide the PCB board to automatically align with the center position of the slot bottom, reducing manual adjustment time.

[0050] PCB board limit switching process:

[0051] After the PCB board is placed in the workstation, the driving member 6 is started, and the multiple groups of limit frames 41 are driven to rotate synchronously and uniformly along their central axes through the rotating shaft 3. In the initial stage of rotation, the abutment rod 46 away from the limit frame 41 forms an initial contact with the stepped abutment portion 22 at the bottom of the ring plate 21 through the arc surface structure at its top. Since the abutment portion 22 is designed as a stepped structure with two levels of height difference, when the abutment rod 46 just contacts the abutment portion 22, as the limit frame 41 rotates, the abutment rod 46 first falls into the first level height area of ​​the abutment portion 22, forcing the abutment rod 46 to move downward along the guide frame 45. A guide mechanism is configured between the abutment rod 46 and the guide frame 45. A guide hole is provided on the outside of the guide frame 45, and a guide column that fits the guide hole is provided on the inside of the abutment rod 46. When the abutment rod 46 moves vertically along the guide frame 45, the guide column and the guide hole form a guide constraint, which limits the lateral freedom of the abutment rod 46 so that it can only move in the vertical direction, effectively suppressing lateral deviation during movement and ensuring the operating accuracy of the abutment rod 46.

[0052] The downward displacement of the abutment rod 46, through the guide slope at the top of the limit rod 44, generates a lateral thrust on the limit rod 44, forcing the limit rod 44 to translate along the guide groove 431 within the guide sleeve 43 toward the sidewall of the PCB board until the end face of the limit rod 44 is firmly in contact with the edge of the PCB board, thus completing the rigid positioning of the PCB board. A curved, flexible cushion provided at the contact end of the limit rod 44 elastically absorbs the impact of positioning, preventing mechanical deformation and damage to the PCB board caused by rigid compression. At this point, the limit groove at the bottom of the abutment rod 46 forms a clearance fit with the limit protrusion at the top of the limit rod 44 (the limit groove is larger than the limit protrusion).

[0053] As the limit frame 41 continues to rotate, the abutment rod 46 enters the second-level height area of ​​the abutment portion 22, resulting in a second downward displacement. At this time, the abutment rod 46 transmits force to the limit rod 44 through the engagement structure of the limit groove and the limit protrusion. When the driving torque exceeds the pre-tightening threshold of the torsion spring 434 assembled on the swing shaft 433, the limit rod 44 rotates around the central axis of the swing shaft 433, forming a lever mechanical structure with the swing shaft 433 as the fulcrum. This lever mechanism causes the positioned PCB board to lift upward, causing its bottom to detach from the internal support surface of the limit frame 41, forming a contactless suspension state, eliminating the shielding area caused by physical contact during the etching process.

[0054] Etching solution disturbance process:

[0055] As the limit frame 41 rotates with the rotating shaft 3, the abutment block 42 at the bottom of the limit frame 41 contacts the curved surface structure at the bottom of the movable plate 52, pushing the movable plate 52 upward along the chute inside the guide plate 51 through the abutment plate. When the connecting shaft 53 receives the axial thrust transmitted by the movable plate 52, the pin on the connecting shaft 53 drives the disturbance plate 54 to perform a swing-rod motion around the central axis of the pin. As the limit frame 41 continues to rotate, the abutment block 42 disengages from the curved surface structure at the bottom of the movable plate 52. Under the action of the counterweight plate 521, the movable plate 52 is reset along the chute in the opposite direction. During this process, the disturbance plate 54 exerts a toggling effect on the surrounding etching liquid. There is a transition window during the switching process between the two sets of limit rods 44. That is, the first set of limit rods 44 has just disengaged from the PCB board, and the second set of limit rods 44 has not yet completed contact positioning. At this time, the PCB board is in a state without mechanical limit. In the etching liquid immersion environment, the PCB board naturally settles in the internal cavity of the limiting frame 41 due to gravity. The fluid damping effect in this dynamic process can prevent the PCB board from being damaged by impact.

[0056] It is worth noting that the side of the perturbation plate 54 away from the connecting shaft 53 adopts a sawtooth shape. The sawtooth edge can generate high-frequency eddies in the etching liquid, significantly increasing the turbulence intensity of the flow field, destroying the laminar boundary layer between the etching liquid and the workpiece surface, and improving the diffusion efficiency of the etching ions. In addition, the multi-tip design of the sawtooth structure can produce local high shear rate areas, breaking down large-scale eddies into micron-scale vortices, and improving the uniformity of PCB etching. Because traditional etching liquid stirring devices can only produce unidirectional laminar flow and cannot form reciprocating turbulence, it is difficult to effectively destroy the boundary layer. The periodic perturbation of the swinging member 5 can achieve efficient and controllable flow field homogenization, which is beneficial to the etching of PCB boards.

[0057] After the PCB board etching is completed, the operator removes the protective plate 2 and the driving member 6 from the etching tank 1 in sequence, and then takes out the etched PCB boards one by one from the limit frame 41. The protective plate 2 is also provided with an observation window for observing the etching situation inside the etching tank 1.

[0058] The present invention adopts the limiting member 4 and the swinging member 5, which has the following advantages:

[0059] Advantage 1: Multiple PCBs are loaded and rotated simultaneously, improving processing efficiency. Multiple retaining brackets 41 are arranged in a circular array along the outer surface of the rotating shaft 3, each capable of independently loading a single PCB. When the drive member 6 rotates the rotating shaft 3, multiple sets of retaining brackets 41 rotate synchronously, enabling simultaneous etching of multiple PCBs within the etching tank 1 and reducing equipment idle time.

[0060] The second advantage is that it vertically positions the PCB, eliminating concentration gradients in the etching solution. The top of the retaining frame 41 features a trapezoidal notch 411 (wider at the top and narrower at the bottom). When the PCB is inserted, it automatically aligns along the beveled edge to the center of the slot bottom, with the bottom surface contacting the bottom support surface of the retaining frame 41. The internal retaining bar maintains the vertical position. This avoids the uneven concentration of the etching solution between the upper and lower layers caused by gravity during traditional horizontal placement (e.g., faster ion consumption at the bottom and slower renewal at the top), thereby eliminating the problem of inconsistent etching rates caused by position differences on the PCB surface.

[0061] Advantage three, the stepped resistance part 22 cooperates with the resistance rod 46 to realize dynamic positioning and suspension of the PCB board. The stepped resistance part 22 (two-level height difference) of the ring plate 21 at the bottom of the protective plate 2 contacts the arc surface of the top of the resistance rod 46, and the resistance rod 46 falls into the first-level area of ​​the resistance part 22. The downward displacement pushes the limit rod 44 to move horizontally through the guide slope, so that its end face fits tightly with the edge of the PCB board. The elastic deformation of the arc-shaped flexible buffer pad is used to achieve damage-free rigid positioning. The resistance rod 46 enters the second-level area, and the second downward displacement is engaged with the limit groove and the limit protrusion, driving the limit rod 44 to rotate around the swing axis 433, lifting the PCB board so that its bottom is separated from the support surface, forming a contactless suspension state, avoiding the support surface from blocking the etching liquid, and ensuring uniform etching of the board surface.

[0062] Advantage three: The swinging member 5 disturbs the etching liquid, enhancing the uniformity of the flow field. The curved surface of the abutment block 42 at the bottom of the limit frame 41 mates with the movable plate 52. When the rotating shaft 3 rotates, it pushes the movable plate 52 up along the guide plate 51 slot, driving the connecting shaft 53 and the agitator plate 54 to swing through the universal joint. When the abutment block 42 disengages, the movable plate 52 returns to its original position under the action of the counterweight plate 521. The agitator plate 54 swings back and forth to stir the etching liquid. The serrated edge of the agitator plate 54 generates high-frequency eddy currents, disrupting the laminar boundary layer and improving the diffusion efficiency of the etching ions.

[0063] Advantage four: the elastic member cooperates with the counterweight plate 521 to realize the adaptive reset of the disturbance plate 54. The elastic member is set on the top of the movable plate 52 to cooperate with the counterweight plate 521. When the abutment block 42 pushes the movable plate 52 to rise, the elastic member is compressed to store potential energy. After the abutment block 42 is disengaged, the gravity of the counterweight plate 521 overcomes the potential energy of the elastic member, driving the movable plate 52 to quickly reset along the slide groove, so that the disturbance plate 54 continues to swing back and forth. No additional power source is required, energy consumption is reduced, and the structure is simple and reliable.

[0064] Advantage Five: The serrated edge of the perturbation plate 54 enhances turbulence and ion diffusion. The serrated edge on the side of the perturbation plate 54 away from the connecting shaft 53 cuts through the fluid in the etching solution as it swings, generating high-frequency eddies. The localized high shear rate at the sawtooth tips breaks large-scale eddies into tiny vortices, increasing the contact area between the etching solution and the PCB surface, accelerating the diffusion of etching ions, shortening reaction time, and uniforming the etching rate across the board, reducing defects such as line width deviation.

[0065] Advantage 6: When the PCB is placed vertically, the etching liquid flows rapidly along the board surface under the action of gravity, forming a uniform liquid film. Vertical flow ensures uniform etching liquid concentration and flow rate across the entire board, reducing "over-etching" or "under-etching" phenomena. In addition, bubbles generated by the etching reaction quickly detach from the board surface due to buoyancy, avoiding stagnation, thereby improving the flatness of the etched surface and the accuracy of the circuit. It also prevents gas from accumulating on the board surface when placed horizontally, forming bubbles, which block contact between the etching liquid and the copper foil, resulting in incomplete etching and the formation of "bubble spots."

[0066] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A PCB etching liquid homogenization system based on liquid dynamic mixing structure, characterized in that: include: Etching groove (1); A protective plate (2) is detachably mounted on the top of the etching tank (1); a rotating shaft (3) is rotatably mounted in the space formed by the protective plate (2) and the etching tank (1); a limiting member (4) for vertically clamping the PCB board is provided on the outer surface of the rotating shaft (3); and a swinging member (5) for disturbing the etching liquid is provided in the etching tank (1); The limiting member (4) includes a limiting frame (41) fixedly connected to the outer surface of the rotating shaft (3), and the limiting frame (41) is provided with a plurality of limiting frames distributed in a circular array along the center of the rotating shaft (3), and an abutment block (42) is fixedly connected to the bottom of the limiting frame (41), and the top of the abutment block (42) is designed in an arc surface; A driving member (6) for driving the rotating shaft (3) to rotate is detachably mounted on the top of the protective plate (2); when the rotating shaft (3) rotates, the abutment block (42) triggers the swing member (5) to move so as to disturb the etching liquid around it; The swinging member (5) includes a guide plate (51) fixedly connected to the inner wall of the etching groove (1), and the guide plate (51) is provided with a plurality of guide plates and distributed in a circumferential array along the center of the etching groove (1). The guide plate (51) is slidably connected to a movable plate (52) that fits the arc surface of the abutment block (42) through a sliding groove provided therein, and a counterweight plate (521) is fixedly connected inside the movable plate (52). The movable plate (52) is connected to the inner wall of the sliding groove through an elastic member provided at the top thereof. The guide plate (51) is rotatably connected to a connecting shaft (53) through a pin provided therein, and the connecting shaft (53) is connected to the outer side of the movable plate (52) through a universal shaft provided at its end. The connecting shaft (53) is provided with a plurality of guide plates and distributed in an array along the center of the guide plate (51). The connecting shaft (53) is fixedly connected to a disturbance plate (54) on the side away from the movable plate (52). The arc surface of the abutment block (42) at the bottom of the limit frame (41) fits with the movable plate (52), and when the rotating shaft (3) rotates, the movable plate (52) is pushed up along the guide plate (51) slide groove, and the connecting shaft (53) and the disturbance plate (54) are driven to swing through the universal shaft. When the abutment block (42) is disengaged, the movable plate (52) is reset under the action of the counterweight plate (521), and the disturbance plate (54) swings back and forth to move the etching liquid.

2. A PCB etching liquid homogenization system based on a liquid dynamic mixing structure according to claim 1, characterized in that: The top of the limiting frame (41) is provided with a notch (411), and the cross section of the notch (411) is designed to be trapezoidal. The limiting frame (41) is fixedly connected to a guide sleeve (43) through a slot hole provided on the outside thereof. The guide sleeve (43) is provided with two groups. The two groups of guide sleeves (43) are symmetrically distributed along the center of the limiting frame (41). Each group of guide sleeves (43) includes two, and the two guide sleeves (43) in the same group are staggered.

3. A PCB etching liquid homogenization system based on a liquid dynamic mixing structure according to claim 2, characterized in that: The inner wall of the guide sleeve (43) is provided with symmetrically distributed guide grooves (431) along the axial direction, and the guide groove (431) is slidably connected to a guide block (432) via a compression spring arranged therein, and the guide block (432) is fixedly connected to a swing shaft (433) on the side away from the guide groove (431), and the adjacent surfaces of the two swing shafts (433) are rotatably connected to a limit rod (44), and the limit rod (44) is designed in an L shape, and the outer surface of the swing shaft (433) is provided with a torsion spring (434) connected to the limit rod (44) and the outer side of the guide block (432); A guide portion (441) is provided at one end of the limiting rod (44) away from the PCB board, and the guiding portion (441) comprises an inclined guiding surface and a limiting protrusion provided on the top of the guiding surface.

4. A PCB etching liquid homogenization system based on a liquid dynamic mixing structure according to claim 1, characterized in that: The limiting frame (41) is slidably connected to an abutting rod (46) via a guide frame (45) arranged on the outside thereof, and both ends of the abutting rod (46) are respectively designed as arc surfaces, and a limiting groove is provided on the outside of the arc surface at the bottom of the abutting rod (46) to fit with the limiting protrusion.

5. The PCB etching liquid homogenization system based on liquid dynamic mixing structure according to claim 1, characterized in that: The bottom of the protective plate (2) is fixedly connected to a ring plate (21), and the bottom of the ring plate (21) is provided with a contact portion (22) that fits with the arc surface of the top of the contact rod (46), and the contact portion (22) is designed in a stepped shape. The contact portions (22) are provided in multiple groups and are distributed in a circular array along the center of the ring plate (21).

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