Anti-diffusion agent for PCB glass substrate as well as preparation method and application of anti-diffusion agent

Abstract

The invention discloses an anti-diffusion agent for a PCB glass substrate and a preparation method and application thereof, and relates to the technical field of printed circuit board manufacturing. The anti-diffusion agent is prepared from the following components in mass concentration: 0.5 to 2.5 percent of a surface reinforcing agent, 0.5 to 2.5 percent of a bonding agent, 1.0 to 3.0 percent of a wetting agent, 0.5 to 2.5 percent of a stabilizing agent, 0.2 to 1.5 percent of a cosolvent and the balance of water, the surface enhancer is a sulfonate compound containing a fluorine functional group and a silicon functional group, the bonding agent is an azole compound containing a sulfur functional group, the wetting agent is a benzyl alcohol compound containing a hydroxyl functional group, the stabilizer is a piperidine derivative, and the cosolvent is an ether solvent. According to the anti-diffusion agent for the PCB glass substrate, the surface tension of the glass substrate can be reduced, the interface bonding force between the substrate and ink can be enhanced, the diffusion phenomenon of jet printing ink on the surface of the substrate can be fundamentally inhibited, and the product yield of a solder resist process can be remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board manufacturing, and particularly relates to an anti-diffusion agent for a PCB glass substrate, a preparation method thereof, and an application thereof. Background Art

[0002] With the rapid development of electronic information technology, printed circuit boards (PCBs) are evolving towards high density, high precision, and miniaturization. In the field of high-end PCB manufacturing, glass substrates have gradually become the core materials for products such as high-frequency and high-speed PCBs and packaging substrates due to their excellent dimensional stability, insulation performance, and low dielectric constant. Inkjet printing technology, with its advantages of not requiring a mask and being able to achieve customized processing of complex patterns, is widely used in the circuit patterning, surface marking production, and other links of PCB glass substrates.

[0003] However, during the inkjet printing process of PCB glass substrates, the problem of ink diffusion seriously affects product quality and production efficiency. The accuracy of PCB circuit patterns is directly related to the accuracy and stability of signal transmission. Once the line width error is too large or the line spacing is reduced due to ink diffusion, it is easy to cause faults such as short circuits and signal crosstalk, reducing the yield rate of PCBs. At the same time, PCB manufacturing has extremely high requirements for the clarity and durability of surface markings. The diffused ink will make the markings unclear, affecting product identification and traceability. Traditional anti-diffusion measures, such as adjusting printing parameters and optimizing ink formulations, are difficult to meet the current requirements for high precision and high reliability in the inkjet printing of PCB glass substrates. In addition, PCB production often pursues large-scale and continuous manufacturing. The defects of existing anti-diffusion technologies in terms of stability and cost control have also become obstacles to the further development of the industry. Therefore, developing an anti-diffusion agent specifically suitable for the inkjet printing of PCB glass substrates is of great significance for improving the level of PCB manufacturing technology and promoting the development of the electronic information industry.

[0004] Currently, developing an anti-diffusion agent suitable for the inkjet printing of PCB glass substrates faces multiple technical challenges: 1. The problem of process chain compatibility: The anti-diffusion agent needs to seamlessly adapt to the complex multi-process flow of PCBs (pretreatment, printing, curing, etching, etc.), ensuring effectiveness in each link without interfering with the process; 2. The dilemma of performance balance: While suppressing diffusion, it is necessary to strictly ensure the electrical performance of PCBs. The anti-diffusion agent cannot damage the insulation of the glass substrate, increase the line resistance, and especially avoid introducing conductive impurities or polar groups that affect high-frequency signal transmission (dielectric constant, loss tangent). The formed protective layer must also be dense and defect-free (such as pinholes, cracks) to prevent partial discharge under the electric field and endanger reliability; 3. Compatibility challenges in multi-ink systems: It is necessary to be compatible with a variety of significantly different inks (conductive, insulating, solder resist) in PCB inkjet printing. For conductive inks, it should not cause agglomeration of metal particles and reduce conductivity; for insulating inks, it should not damage the cured insulation performance; for solder resist inks, it should not weaken their bonding strength and chemical resistance. 4. Paradox of scale and cost: To meet the huge demand of the PCB industry, it is required that the anti-diffusion agent is easy to produce on a large scale and the cost is controllable. However, high-performance solutions (such as complex organic synthesis, nano-materials / layer-by-layer self-assembled coatings) often have cumbersome processes, expensive raw materials, and long cycles. Simplifying the process or reducing the cost is likely to lead to a decline in performance. How to achieve a balance between high performance and low-cost mass production is the key bottleneck.

[0005] Some existing patents introduce methods related to inkjet printing technology. Chinese Patent CN114845474A introduces a method for PCB spray printing pattern solder resist, which uses an anti-diffusion liquid to pretreat the PCB. This method introduces a method to improve the contact angle between the substrate surface and the ink, but the diffusion performance between the copper surface and the ink is very poor. Chinese Patent CN119855060A discloses a pretreatment agent for PCB inkjet printing, its preparation method, and a PCB inkjet printing method. This technology can not only effectively reduce the surface tension of the copper surface and the substrate surface, but also promote the uniform arrangement of the ink, improving the product yield of the fine line inkjet printing process.

[0006] It can be seen that for the diffusion problem in inkjet printing on ordinary PCB boards, the existing technologies can already provide certain solutions. However, in the face of glass substrates, the anti-diffusion effects of these technologies are unsatisfactory. As the core material for high-end PCB manufacturing, the ink diffusion phenomenon that occurs during the inkjet printing process on glass substrates has become the key bottleneck restricting the performance improvement and industrial upgrading of PCBs. Previous anti-diffusion means are difficult to meet the strict requirements of high-precision and high-reliability in high-end PCB manufacturing; the existing anti-diffusion technologies, due to high costs and poor stability, seriously restrict the large-scale production of PCBs. Summary of the Invention

[0007] Aiming at the deficiencies of the existing technology, the present invention provides an anti-diffusion agent for PCB glass substrates, its preparation method, and application, which are mainly used for the pretreatment link in the solder resist process of PCB inkjet printing on glass substrates.

[0008] Specifically, it includes the following technical solutions: In the first aspect, a diffusion inhibitor for PCB glass substrates is provided, which is composed of components with the following mass concentrations: 0.5 - 2.5% of a surface enhancer, 0.5 - 2.5% of a bonding agent, 1.0 - 3.0% of a wetting agent, 0.5 - 2.5% of a stabilizer, 0.2 - 1.5% of a co-solvent, and the balance is water; the surface enhancer is a sulfonate compound containing a fluorine functional group and a silicon functional group, the bonding agent is a nitrogenazole compound containing a sulfur functional group, the wetting agent is a benzyl alcohol compound containing a hydroxyl functional group, the stabilizer is a piperidine derivative, and the co-solvent is an ether solvent.

[0009] Among them, the synergistic mechanism of each component is as follows: Surface enhancer: Through covalent bonding reaction between the functional group and the glass surface, and at the same time, a cross-linked structure is formed with the organic phase such as ink at the other end, constructing a bridging system of "inorganic substrate - enhancer - organic coating", greatly improving the interfacial adhesion. Bonding agent: Optimize the interfacial compatibility between the glass surface and the resin matrix, enhance the structural stability of the composite system, effectively improve the bending strength and impact resistance of the material, and avoid the problem of interfacial debonding. Wetting agent: As an amphiphilic compound with both hydrophilic and lipophilic functional groups, it can reduce the surface tension of the copper surface and the substrate surface, promote the full contact between the oil-repellent components in the diffusion inhibitor and the surface of the circuit board, and provide ideal interfacial conditions for ink bonding. Stabilizer: By maintaining the chemical balance of each component in the system, inhibiting photochemical, thermal or oxidative decomposition reactions, ensuring that the potion maintains a stable bonding efficiency for a long time. Co-solvent: Solve the dissolution problem of hydrophobic components in the system, promote the formation of a homogeneous and stable solution system of each component, and ensure the process applicability.

[0010] Furthermore, the diffusion inhibitor for PCB glass substrates is composed of components with the following mass concentrations: 0.5 - 1.5% of a surface enhancer, 0.5 - 1.5% of a bonding agent, 1.0 - 2.0% of a wetting agent, 0.5 - 1.5% of a stabilizer, 0.2 - 1.0% of a co-solvent, and the balance is water.

[0011] Among them, the water is tap water or DI water.

[0012] Furthermore, the surface enhancer is one or more of trimethylsilyl trifluoromethanesulfonate (CAS No.: 27607 - 77 - 8), (trimethylsilyl)methyl trifluoromethanesulfonate (CAS No.: 64035 - 64 - 9), and triisopropylsilyl trifluoromethanesulfonate (CAS No.: 80522 - 42 - 5).

[0013] Further, the bonding agent is one or more of 5-benzylthiotetrazole (CAS No.: 21871-47-6), 5-ethylthiotetrazole (CAS No.: 89797-68-2), and 3-amino-1-methyl-5-methylthio-1,2,4-triazole (CAS No.: 84827-78-1).

[0014] Further, the wetting agent is one or more of 2-hydroxy-3-methoxybenzyl alcohol (CAS No.: 4383-05-5), 2-hydroxy-5-nitrobenzyl alcohol (CAS No.: 39224-61-8), and 4-fluoro-3-hydroxybenzyl alcohol (CAS No.: 934241-78-8).

[0015] Further, the stabilizer is one or more of 3-(1H-1,2,4-triazol-1-yl)piperidine (CAS No.: 774511-83-0), 4-(4-methyl-4H-1,2,4-triazole)piperidine (CAS No.: 297172-18-0), and 4-(1,3-dioxolan-2-yl)piperidine (CAS No.: 202062-80-4).

[0016] Further, the cosolvent is one or more of benzoin isopropyl ether (CAS No.: 6652-28-4), rum ether (CAS No.: 8030-89-5), and methyl cedryl ether (CAS No.: 19870-74-7).

[0017] In a second aspect, a method for preparing the anti-diffusion agent for PCB glass substrates as described in the first aspect is provided, including the following steps: sequentially weighing a surface enhancer, a bonding agent, a wetting agent, a stabilizer, and a cosolvent and adding the remaining water into a reaction kettle, and stirring and mixing at a normal temperature of 25-28°C for 30-35 minutes to obtain the anti-diffusion agent for PCB glass substrates.

[0018] In a third aspect, a method for spraying and printing a solder mask on a PCB glass substrate is provided, including the following steps: using the anti-diffusion agent for PCB glass substrates described in the first aspect to perform surface treatment on the glass substrate.

[0019] Further, the temperature of the surface treatment is 25±1°C, the segment length of the surface treatment is 1.0 m, and the linear velocity is 2.0±0.1 m / min.

[0020] The beneficial effects of the present invention are as follows: The present invention provides an anti-diffusion agent for PCB glass substrates, its preparation method and application. The anti-diffusion agent is compounded by a surface enhancer, a bonding agent, a wetting agent, a stabilizer, a co-solvent and the balance of water, and can construct an organic functional layer on the surface of the glass substrate. The performance is optimized through a dual action mechanism: on the one hand, the surface tension of the glass substrate is reduced, and on the other hand, the interfacial bonding force between the substrate and the ink is strengthened, fundamentally inhibiting the diffusion phenomenon of the printed ink on the substrate surface and significantly improving the product yield of the solder mask process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 It is the ink contact angle diagram of the surface of the glass substrate treated with the anti-diffusion agent for PCB glass substrate of Example 1 of the present invention; Figure 2 It is the ink contact angle diagram of the surface of the glass substrate treated with the anti-diffusion agent for PCB glass substrate of Example 2 of the present invention; Figure 3 It is the ink contact angle diagram of the surface of the glass substrate treated with the anti-diffusion agent for PCB glass substrate of Example 3 of the present invention; Figure 4 It is the ink contact angle diagram of the surface of the glass substrate treated with the anti-diffusion agent for PCB glass substrate of Comparative Example 1 of the present invention; Figure 5 It is the ink contact angle diagram of the surface of the glass substrate treated with the anti-diffusion agent for PCB glass substrate of Comparative Example 11 of the present invention; Figure 6 It is the ink contact angle diagram of the surface of the glass substrate treated with the anti-diffusion agent for PCB glass substrate of Comparative Example 12 of the present invention; Figure 7 It is the ink contact angle diagram of the surface of the glass substrate treated with the anti-diffusion liquid of Comparative Example 13 of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0024] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, wholes, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or their combinations.

[0025] It should also be understood that the terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. As used in this specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include the plural forms.

[0026] It should be further understood that the term "and / or" used in this specification of the present invention and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0027] To more fully understand the technical content of the present invention, the technical solutions of the present invention will be further introduced and described below in conjunction with specific embodiments.

[0028] It should be noted that the white dots on the ink in the drawings are the reflection points when the ink is photographed.

[0029] Example 1 An anti-diffusion agent for PCB glass substrates is composed of the following components by mass concentration: Surface enhancer 1.0%, specifically: trimethylsilyl trifluoromethanesulfonate; Bonding agent 1.0%, specifically: 5-benzylthiotetrazole; Wetting agent 1.5%, specifically 2-hydroxy-3-methoxybenzyl alcohol; Stabilizer 1.0%, specifically 3-(1H-1,2,4-triazol-1-yl)piperidine; Co-solvent 0.5%, specifically isopropyl benzoate; The balance is DI water.

[0030] The preparation method of the anti-diffusion agent for PCB glass substrates includes the following steps: sequentially weigh the surface enhancer, bonding agent, wetting agent, stabilizer and co-solvent and the balance of water, add them to a reaction kettle, and stir and mix at room temperature of 25°C for 30 minutes to obtain the anti-diffusion agent for PCB glass substrates.

[0031] Example 2 An anti-diffusion agent for PCB glass substrates is composed of the following components by mass concentration: Surface enhancer 1.0%, specifically: (trimethylsilyl)methyl trifluoromethanesulfonate; Bonding agent: 1.0%, specifically: 5-ethylthiotetrazole; Wetting agent: 1.5%, specifically: 2-hydroxy-5-nitrobenzyl alcohol; Stabilizer: 1.0%, specifically: 4-(4-methyl-4H-1,2,4-triazol-1-yl)piperidine; Cosolvent: 0.5%, specifically: rum ether; The balance is DI water.

[0032] Example 3 An anti-diffusion agent for PCB glass substrates, composed of components with the following mass concentrations: Surface enhancer: 1.0%, specifically: triisopropylsilyl trifluoromethanesulfonate; Bonding agent: 1.0%, specifically: 3-amino-1-methyl-5-methylthio-1,2,4-triazole; Wetting agent: 1.5%, specifically: 4-fluoro-3-hydroxybenzyl alcohol; Stabilizer: 1.0%, specifically: 4-(1,3-dioxolan-2-yl)piperidine; Cosolvent: 0.5%, specifically: methyl cedryl ether; The balance is DI water.

[0033] Example 4 An anti-diffusion agent for PCB glass substrates, composed of components with the following mass concentrations: Surface enhancer: 0.5%, specifically: trimethylsilyl trifluoromethanesulfonate; Bonding agent: 0.5%, specifically: 5-benzylthiotetrazole; Wetting agent: 1.0%, specifically: 2-hydroxy-3-methoxybenzyl alcohol; Stabilizer: 0.5%, specifically: 3-(1H-1,2,4-triazol-1-yl)piperidine; Cosolvent: 0.2%, specifically: isopropyl benzoate; The balance is D1 water.

[0034] Example 5 An anti-diffusion agent for PCB glass substrates, composed of components with the following mass concentrations: Surface enhancer: 1.5%, specifically: trimethylsilyl trifluoromethanesulfonate; Bonding agent: 1.5%, specifically: 5-benzylthiotetrazole; Wetting agent: 2.0%, specifically: 2-hydroxy-3-methoxybenzyl alcohol; Stabilizer: 1.5%, specifically: 3-(1H-1,2,4-triazol-1-yl)piperidine; Cosolvent: 1.0%, specifically: isopropyl benzoate; The balance is D1 water.

[0035] Comparative Example 1 Comparing with Example 1, the only difference is that the component does not contain a surface enhancer.

[0036] Comparative Example 2 Comparing with Example 1, the only difference is that the component does not contain a binder.

[0037] Comparative Example 3 Comparing with Example 1, the only difference is that the component does not contain a wetting agent.

[0038] Comparative Example 4 Comparing with Example 1, the only difference is that the component does not contain a stabilizer.

[0039] Comparative Example 5 Comparing with Example 1, the only difference is that the component does not contain a cosolvent.

[0040] Comparative Example 6 Comparing with Example 1, the only difference is that the mass concentration of the surface enhancer in the component is 3.0%.

[0041] Comparative Example 7 Comparing with Example 1, the only difference is that the mass concentration of the binder in the component is 3.0%.

[0042] Comparative Example 8 Comparing with Example 1, the only difference is that the mass concentration of the wetting agent in the component is 4.0%.

[0043] Comparative Example 9 Comparing with Example 1, the only difference is that the mass concentration of the stabilizer in the component is 3.0%.

[0044] Comparative Example 10 Comparing with Example 1, the only difference is that the mass concentration of the cosolvent in the component is 2.0%.

[0045] Comparative Example 11 Comparing with Example 1, the only difference is that the surface enhancer component is replaced with an equal mass of trimethylsilyl methanesulfonate (CAS No.: 10090-05-8).

[0046] Comparative Example 12 Comparing with Example 1, the only difference is that the surface enhancer component is replaced with an equal mass of 1-fluoro-2,4,6-trimethylpyridinium trifluoromethanesulfonate (CAS No.: 107264-00-6).

[0047] Comparative Example 13 Comparative Example 13 provides an anti-diffusion liquid. Compared with Example 1, the difference lies in the use of the prior art (Chinese Patent Application CN202210765329.1). Specifically, by mass fraction, its components include: a bonding agent (bis-epoxy phenyl mercaptan compound) 4.0%; a strengthening agent (phenoldisulfonic acid) 2.0%; a wetting agent (3-dodecylbenzene-1,2-diol) 2.5%; an accelerator (2,4-thiazolidinedione) 1.5%; and a stabilizer (2,4-dihydroxybenzophenone) 2.0%.

[0048] The preparation methods of the anti-diffusion agents for the PCB glass substrates in Examples 2-5 and Comparative Examples 1-12 are the same as those in Example 1. In addition, the preparation method of the anti-diffusion liquid in Comparative Example 13 is the same as that in Example 1.

[0049] Performance Detection Test The present invention discloses a method for inkjet printing solder mask on a PCB glass substrate, which includes the following steps: S1 feeding section; S2 degreasing section; S3 water washing section; S4 anti-diffusion section; S5 water washing section; S6 drying section; S7 inkjet printing section.

[0050] The S1 feeding section is for placing the glass substrate to be inkjet printed. The process parameters of the feeding section are: the length of the feeding section is 1.0 m, and the linear velocity is 5.0 ± 0.2 m / min.

[0051] The S2 degreasing section is for cleaning the glass substrate passing through the S1 feeding section to remove surface impurities. The process parameters of the degreasing section are: the mass concentration of sulfuric acid is 1.5%, and the balance is tap water; the temperature is 25 ± 1 °C, the length of the degreasing section is 4.0 m; the linear velocity is 1.0 ± 0.2 m / min, and the pressure is 1.5 ± 0.2 kg / cm , 2 ,

[0054] , 2 ,

[0053] , ,

[0052] , ,

[0051] , , and this section is an immersion type.

[0052] The S3 water washing section is for washing the glass substrate passing through the S2 degreasing section with tap water. The process parameters of the water washing section are: the temperature is 25 ± 1 °C, the length of the water washing section is 1.0 m; the linear velocity is 4.0 ± 0.2 m / min, and the pressure is 1.5 ± 0.2 kg / cm 2 , and this section is a spray type.

[0053] The S4 anti-diffusion section is for surface treatment of the glass substrate passing through the S3 water washing section. The liquid medicine used is the solution prepared in the examples or comparative examples of the present invention, and the use ratio is the original solution. The process parameters of the anti-diffusion section are: the temperature is 25 ± 1 °C, the length of the anti-diffusion section is 1.0 m; the linear velocity is 2.0 ± 0.1 m / min, and this section is an immersion type.

[0054] The described S5 water washing section is to wash the glass substrate that has passed through the S4 anti-diffusion section with tap water. The process parameters of the water washing section are: temperature 25 ± 1°C, length of the water washing section 1.0 m; linear velocity 4.0 ± 0.2 m / min, pressure 1.5 ± 0.2 kg / cm 2 , and this section is of the spray type.

[0055] The drying section of S6 is to dry the glass substrate after the process of the S5 water washing section. The process parameters of drying are: temperature 70 ± 2°C, length of the drying section 2.0 m; linear velocity 2.0 ± 0.2 m / min.

[0056] The inkjet printing section of S7 performs inkjet printing on the glass substrate that has passed through the process of the S6 drying section. The ink model used is H-9100 of Shenzhen Rongda Photosensitive Technology Co., Ltd. The process parameters of the solder mask inkjet printing section are: temperature 25 ± 5°C, single-sided printing time 1 min, and double-sided printing is carried out.

[0057] Perform performance tests on the glass substrate after using the anti-diffusion agent or anti-diffusion liquid of the embodiment / control example of the present invention for the PCB glass substrate spray printing solder mask method. The performance of the anti-diffusion agent of the present invention is mainly judged from three aspects: The first is the ink contact angle: that is, the contact angle detection between the glass substrate and the solder mask ink. Use a contact angle measuring instrument of model JYC-1 to measure the contact angle between the surface of the glass substrate after the PCB glass substrate spray printing solder mask method and the solder mask ink. The method is to drop the ink on the surface of the glass substrate with a syringe, and measure the specific value through the instrument. The required contact angle is between 80 - 90°; The second is the 3m tape adhesion grade: that is, the ink adhesion detection. Adopt the 3m tape test method. Specifically, stick the tape of model 3m600# flat on the ink area of the glass substrate after the process of the inkjet printing section, and then quickly peel off the tape at a uniform speed, and observe the ink peeling situation in the test area.

[0058] Rating standard for the cross-cut method: Grade 0: No ink peeling at all, no residue on the back of the tape; Grade 1: Slight peeling at the edge of the small grid, peeling area ≤ 5%; Grade 2: Peeling area 5% - 15%; Grade 3: Peeling area 15% - 35%; Grade 4: Peeling area 35% - 65%; Grade 5: Peeling area > 65%, extremely poor adhesion.

[0059] It is required that the test result is Grade 0 or Grade 1 to be qualified, otherwise the test result is unqualified.

[0060] The third is whether it foams after being soaked in strong alkali: that is, the chemical corrosion resistance test. The glass substrate after the inkjet printing process is put into a 10% NaOH solution by mass concentration and soaked for 30 minutes. It is required that there is no foaming phenomenon on the surface of the glass substrate after soaking.

[0061] The PCB glass substrates of Examples 1-5 were tested for performance with an anti-diffusion agent, and the test results are shown in Table 1 below: Table 1 Performance test results of the anti-diffusion agent for the PCB glass substrates of Examples 1-5

[0062] Figure 1 It is the ink contact angle diagram of the surface of the glass substrate treated with the anti-diffusion agent for the PCB glass substrate of Example 1 of the present invention; Figure 2 It is the ink contact angle diagram of the surface of the glass substrate treated with the anti-diffusion agent for the PCB glass substrate of Example 2 of the present invention; Figure 3 It is the ink contact angle diagram of the surface of the glass substrate treated with the anti-diffusion agent for the PCB glass substrate of Example 3 of the present invention. From Figures 1-3 As can be seen from the experimental data of Examples 1-5 in Table 1, the anti-diffusion agent for the PCB glass substrate of the embodiments of the present invention can effectively prevent the ink from spreading on the surface of the glass substrate during the printing process. Among them, the test data of the ink contact angle show that the contact angle between the glass substrate and the solder mask ink is between 86.5 - 87.0°, meeting the requirements of the ink anti-diffusion performance; the detection result of the 3m tape adhesion grade shows that the adhesion grade is 0, without any ink peeling off, and there is no residue on the back of the tape, indicating that the binding force provided by the anti-diffusion agent and the compatibility of anti-diffusion and ink are excellent, meeting the requirements of the adhesion performance; the chemical corrosion resistance test shows that after the glass substrate is soaked in a 10% NaOH solution by mass concentration for 30 minutes, there is no foaming phenomenon on the surface of the glass substrate, meeting the requirements of the chemical corrosion resistance. The anti-diffusion agent can form an organic layer on the surface of the glass substrate, while reducing the surface tension of the glass substrate, strengthening the binding force between the surface of the glass substrate and the ink, preventing the printed ink from spreading on the surface of the glass substrate, and improving the product qualification rate of the printed solder mask process.

[0063] The PCB glass substrates of Comparative Examples 1-5 were tested for performance with an anti-diffusion agent, and the test results are shown in Table 2 below: Table 2 Performance test results of the anti-diffusion agent for the PCB glass substrates of Comparative Examples 1-5

[0064] Figure 4 It is the ink contact angle diagram of the surface of the glass substrate treated with the anti-diffusion agent for the PCB glass substrate of Comparative Example 1 of the present invention. From Figure 4As can be seen from Table 2 and the test results, the differences between Comparative Examples 1-5 and Example 1 are that the anti-diffusion agent lacks a surface enhancer, a bonding agent, a wetting agent, a stabilizer, and a co-solvent single component, respectively. The experimental data shows that the surface enhancer and the bonding agent are the core active substances of the anti-diffusion function. When any one of the components is lacking, the contact angle on the surface of the glass substrate decreases significantly, confirming that the two dominate the anti-diffusion performance of the anti-diffusion agent through synergistic effects; at the same time, the adhesion and chemical corrosion resistance on the surface of the glass substrate decrease synchronously, specifically manifested as ink peeling and blistering after soaking in strong alkali. The wetting agent, stabilizer, and co-solvent, as auxiliary functional components, the absence of any one of them will cause different degrees of deterioration of the contact angle between the glass substrate and the ink, the adhesion on the surface of the glass substrate, and the chemical corrosion resistance, fully indicating that the comprehensive performance of the anti-diffusion agent for PCB glass substrates of the present invention is the result of the synergistic effects of each effective component.

[0065] The anti-diffusion agents for PCB glass substrates of Comparative Examples 6-12 and the anti-diffusion liquid of Comparative Example 13 were subjected to performance tests, and the test results are shown in Table 3 below: Table 3 Performance test results of the anti-diffusion agents for PCB glass substrates of Comparative Examples 6-12 and the anti-diffusion liquid of Comparative Example 13

[0066] Figure 5 It is the ink contact angle diagram of the surface of the glass substrate treated with the anti-diffusion agent for PCB glass substrates of Comparative Example 11 of the present invention; Figure 6 It is the ink contact angle diagram of the surface of the glass substrate treated with the anti-diffusion agent for PCB glass substrates of Comparative Example 12 of the present invention; Figure 7 It is the ink contact angle diagram of the surface of the glass substrate treated with the anti-diffusion liquid of Comparative Example 13 of the present invention. From Figures 5-7 As can be seen from Table 3 and the test results, the differences between Comparative Examples 6-10 and Example 1 are that the surface enhancer, bonding agent, wetting agent, stabilizer, and co-solvent in the single component of the anti-diffusion agent are respectively higher than the upper limit of the mass concentration defined by the anti-diffusion liquid of the present invention. The experimental data shows that by comparing the test results of Examples 1-5 and Comparative Examples 6-10, when the mass concentrations of the surface enhancer, bonding agent, wetting agent, stabilizer, and co-solvent exceed the range defined by the present invention, the contact angle between the glass substrate and the ink, the adhesion on the substrate surface, and the chemical corrosion resistance hardly change significantly. This indicates that when the concentration of each component is too high, the surface energy of the organic layer formed by the anti-diffusion agent and the substrate tends to be stable and the anti-diffusion ability is not enhanced due to the increase in concentration; at the same time, the excessive addition of components not only cannot improve the performance, but will instead push up the preparation cost of the chemical solution. Therefore, the mass concentrations of each component of the anti-diffusion agent for PCB glass substrates of the present invention need to be controlled within the range defined by the examples, which can not only ensure that the performance of the chemical solution meets the standards, but also avoid cost waste caused by too high mass concentration.

[0067] The differences between Comparative Examples 11-12 and Example 1 lie in the surface enhancer components: trimethylsilyl trifluoromethanesulfonate was replaced with equal masses of fluorine-free functional group-similar compounds and silicon-free functional group-similar compounds respectively. The experimental data show that fluorine functional groups and silicon functional groups play important roles in the surface enhancer. The lack of either of the two functional groups will lead to a decline in the performance of the anti-diffusion agent, indicating that fluorine functional groups and silicon functional groups in the surface enhancer have an important impact on the performance of the anti-diffusion agent.

[0068] The difference between Comparative Example 13 and Example 1 lies in using the prior art (Chinese Patent Application CN202210765329.1) for comparison with the anti-diffusion agent of the present invention. The experimental data show that the anti-diffusion agent of the present invention has better anti-diffusion performance for PCB glass substrates.

[0069] In summary, the present invention discloses an anti-diffusion agent for PCB glass substrates, its preparation method and application, which are mainly used in the pretreatment process of the PCB inkjet printing solder mask process for glass substrates. The anti-diffusion agent is compounded by a surface enhancer, a bonding agent, a wetting agent, a stabilizer, a co-solvent and the balance of water, and can construct an organic functional layer on the surface of the glass substrate. The performance is optimized through a dual action mechanism: on the one hand, the surface tension of the glass substrate is reduced, and on the other hand, the interfacial binding force between the substrate and the ink is strengthened, fundamentally inhibiting the diffusion of the printed ink on the surface of the substrate and significantly improving the product yield of the solder mask process.

[0070] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A diffusion-preventing agent for PCB glass substrates, characterized in that, It is composed of components with the following mass concentrations: 0.5 - 2.5% of a surface enhancer, 0.5 - 2.5% of a bonding agent, 1.0 - 3.0% of a wetting agent, 0.5 - 2.5% of a stabilizer, 0.2 - 1.5% of a co-solvent, and the balance is water; the surface enhancer is a sulfonate compound containing a fluorine functional group and a silicon functional group, the bonding agent is a nitrogenazole compound containing a sulfur functional group, the wetting agent is a benzyl alcohol compound containing a hydroxyl functional group, the stabilizer is a piperidine derivative, and the co-solvent is an ether solvent.

2. The anti-diffusion agent for PCB glass substrates according to claim 1, wherein It is composed of components with the following mass concentrations: 0.5 - 1.5% of a surface enhancer, 0.5 - 1.5% of a bonding agent, 1.0 - 2.0% of a wetting agent, 0.5 - 1.5% of a stabilizer, 0.2 - 1.0% of a co-solvent, and the balance is water.

3. The anti-diffusion agent for PCB glass substrates according to claim 1, wherein The surface enhancer is one or more of trimethylsilyl trifluoromethanesulfonate, (trimethylsilyl)methyl trifluoromethanesulfonate, and triisopropylsilyl trifluoromethanesulfonate.

4. The anti-diffusion agent for PCB glass substrates according to claim 1, wherein The bonding agent is one or more of 5-benzylthiotetrazole, 5-ethylthiotetrazole, and 3-amino-1-methyl-5-methylthio-1,2,4-triazole.

5. The anti-diffusion agent for PCB glass substrates according to claim 1, wherein The wetting agent is one or more of 2-hydroxy-3-methoxybenzyl alcohol, 2-hydroxy-5-nitrobenzyl alcohol, and 4-fluoro-3-hydroxybenzyl alcohol.

6. The anti-diffusion agent for PCB glass substrates according to claim 1, characterized in that, The stabilizer is one or more of 3-(1H-1,2,4-triazol-1-yl)piperidine, 4-(4-methyl-4H-1,2,4-triazol)piperidine, and 4-(1,3-dioxolan-2-yl)piperidine.

7. The anti-diffusion agent for PCB glass substrates according to claim 1, wherein The co-solvent is one or more of isopropyl benzoate, rum ether, and methyl cedryl ether.

8. The preparation method of the anti-diffusion agent for PCB glass substrates according to any one of claims 1-7, characterized in that, It includes the following steps: sequentially weigh the surface enhancer, bonding agent, wetting agent, stabilizer, and co-solvent and the balance water, add them to a reaction kettle, and stir and mix at room temperature of 25 - 28°C for 30 - 35 min to obtain the anti-diffusion agent for PCB glass substrates.

9. A method for spray printing solder mask on a PCB glass substrate, characterized in that, It includes the following steps: use the anti-diffusion agent for PCB glass substrates described in any one of claims 1 - 7 to perform surface treatment on the glass substrate.

10. The solder mask spraying method for PCB glass substrates according to claim 9, wherein The temperature of the surface treatment is 25 ± 1°C, the section length of the surface treatment is 1.0 m, and the linear velocity is 2.0 ± 0.1 m / min.

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