Ultrahigh-brightness display module based on Micro LED and preparation method thereof

Abstract

The invention discloses a Micro LED-based ultra-high brightness display module and a preparation method thereof, the Micro LED-based ultra-high brightness display module comprises a display module body, a transparent packaging layer is packaged on the top surface of the display module body, and Micro LED chips which are located on one side of the transparent packaging layer and are distributed in an array are installed on the topmost layer in the display module body. A heat dissipation assembly used for dissipating heat of the MicroLED chips is arranged in the display module body, and the light emitting surfaces of the MicroLED chips face the transparent packaging layer; the heat dissipation assembly comprises a porous silica gel buffer layer covering the non-light-emitting face of the back face of the MicroLED chip, the porous silica gel buffer layer is used for covering welding spots and a driving motor of the MicroLED chip, and a copper-diamond vapor chamber is arranged below the porous silica gel buffer layer. According to the invention, the heat dissipation assembly is arranged, so that good ultrahigh heat conduction efficiency can be achieved, stable work of the chip is ensured, the thermal decoupling design is adopted, the structural reliability is improved, and the heat dissipation module has the advantages of light weight, compactness, adaptability to movable occasions and high applicability.

Description

Technical Field

[0001] The present invention relates to the technical field of brightness display modules, and particularly to an ultra-high brightness display module based on MicrLED and a preparation method thereof. Background Art

[0002] The display module is a core component of an electronic device, which is composed of a display and a driving circuit, and its main function is to convert an electrical signal into a visual image. The LED display module is one of the main components of the finished LED display, and is mainly composed of LED lights, a PCB circuit board, a driving IC, resistors, capacitors and a plastic kit.

[0003] During the use of the current ultra-high brightness display module based on MicrLED, since the temperature generated when the MicrLED chip works cannot be discharged in time, it may affect the normal operation of the MicrLED chip, and even its service life. Even if there is a heat dissipation structure for dissipating heat from the ultra-high brightness display module based on MicrLED, the current heat dissipation structure has poor heat dissipation effect, and still affects the normal use of the ultra-high brightness display module based on MicrLED. Summary of the Invention

[0004] To solve the defects existing in the prior art, the present invention provides an ultra-high brightness display module based on MicrLED and a preparation method thereof.

[0005] To solve the above technical problems, the present invention provides the following technical solutions:

[0006] An ultra-high brightness display module based on MicrLED of the present invention includes a display module body. A transparent encapsulation layer is encapsulated on the top surface of the display module body. At the topmost layer inside the display module body, MicroLED chips are installed in an array on one side of the transparent encapsulation layer. A heat dissipation component for dissipating heat from the MicroLED chips is provided inside the display module body, and the light-emitting surface of the MicroLED chips faces the transparent encapsulation layer; the heat dissipation component includes a porous silica gel buffer layer covering the non-light-emitting surface of the back of the MicroLED chips, and the porous silica gel buffer layer is used to cover the solder joints and driving motors of the MicroLED chips. A copper-diamond heat pipe is provided below the porous silica gel buffer layer. A fishbone-shaped directional graphene layer is covered on the lower surface of the copper-diamond heat pipe. A micro-fin array is welded to the back of the copper-diamond heat pipe, and a hydrophobic coating and a flow disturbance structure are coated on the surface of the micro-fin array. An active heat dissipation component is provided on the inner wall of the display module body under the lower surface of the micro-fin array.

[0007] As a preferred technical solution of the present invention, the main vein direction of the fishbone-shaped oriented graphene layer is parallel to the arrangement of the MicroLED chip rows, and the width of the main vein of the fishbone-shaped oriented graphene layer is 0.5 mm.

[0008] As a preferred technical solution of the present invention, the branch veins of the fishbone-shaped oriented graphene layer extend obliquely at 45°, and the distance between adjacent branch veins of the fishbone-shaped oriented graphene layer is set to 1 mm.

[0009] As a preferred technical solution of the present invention, the diamond volume fraction of the copper-diamond heat pipe is 40%-60%. The surface of the copper-diamond heat pipe is provided with honeycomb-shaped micro-grooves, and the inside of the honeycomb-shaped micro-grooves is filled with a phase change material. The phase change material uses a paraffin-based composite material, with a melting point of 80-100 °C, a latent heat > 200 J / g, and graphene nanosheets are doped in the paraffin-based composite material.

[0010] As a preferred technical solution of the present invention, the micro-fin array includes a copper-aluminum laminate. The copper-aluminum laminate includes an outer pure copper layer and an aluminum alloy layer provided on the inner layer of the pure copper layer. The surface of the copper-aluminum laminate is sprayed with a nano-silica coating.

[0011] As a preferred technical solution of the present invention, the active heat dissipation component includes an air-cooling heat dissipation module and a liquid-cooling heat dissipation module. The air-cooling heat dissipation module includes a micro vortex fan installed on the inner wall of the display module body. There is a diversion air hood between the micro vortex fan and the micro-fin array. An angle of 30° is formed between the air outlet of the diversion air hood and the micro-fin array. V-shaped grooves are opened at the roots of the fins of the micro-fin array. An air outlet is provided on the frame of the display module body, and a dust-proof net is provided at the air outlet.

[0012] As a preferred technical solution of the present invention, the liquid-cooling heat dissipation module includes a liquid-cooling pipeline adhesively bonded to the back of the copper-diamond heat pipe by thermal conductive adhesive and arranged in a serpentine circuit. The liquid-cooling pipeline includes a plurality of branch pipelines connected in parallel. The materials of the liquid-cooling pipeline and the branch pipelines are both copper. The connection between the liquid-cooling pipeline and the copper-diamond heat pipe is welded, and an epoxy resin and nano-silver glue are coated at the welding joint of the liquid-cooling pipeline and the copper-diamond heat pipe. A liquid-cooling pump is embedded on the frame of the display module body. The water outlet of the liquid-cooling pump is connected to the water inlet of the liquid-cooling pipeline, and the water inlet of the liquid-cooling pump is connected to an external liquid storage tank through a hose.

[0013] As a preferred technical solution of the present invention, a temperature sensor is installed on the MicroLED chip, and a PID controller is embedded on the display module body. The temperature sensor, the liquid-cooling pump, and the micro vortex fan are all electrically connected to the PID controller through wires.

[0014] A preparation method of an ultra-high brightness display module based on MicrLED, including an ultra-high brightness display module based on MicrLED as described above.

[0015] As a preferred technical solution of the present invention, it further includes the following preparation steps:

[0016] Step 1: Manufacture a copper-diamond heat pipe: Weld a copper-diamond composite plate using a diffusion welding process, etch honeycomb micro-grooves on the copper-diamond composite plate using femtosecond laser, and fill the honeycomb micro-grooves with a phase change material using a vacuum-assisted injection technique;

[0017] Step 2: Form a porous silica gel buffer layer: Mix and stir silica gel prepolymer and a pore-forming agent in a ratio of 3:1, and cover the solder joints of the MicroLED chips by screen printing;

[0018] Step 3: Prepare a fishbone-shaped oriented graphene layer: Reduce graphene oxide using a 532nm pulsed laser with a scanning speed of 200mm / s, optimize the scanning path through a genetic algorithm so that the parallelism deviation between the main vein direction of the fishbone-shaped oriented graphene layer and the row arrangement of the MicroLED chips is <0.5°, and etch the branch veins of the fishbone-shaped oriented graphene layer at a 45° inclination using a focused ion beam;

[0019] Step 4: Prepare a micro-fin array: Prepare a copper-aluminum composite plate for the interface transition layer using magnetron sputtering, spray nano-silica on the surface of the copper-aluminum composite plate, process V-shaped grooves using a femtosecond laser double pulse, and spray a fluorosilane solution on the surface of the V-shaped grooves.

[0020] The beneficial effects of the present invention are:

[0021] 1. For this ultra-high brightness display module based on MicrLED and its preparation method, through the provided heat dissipation component, it can achieve very high heat conduction efficiency, ensure the stable operation of the chip, the thermal decoupling design improves the structural reliability, has light weight and compactness, is suitable for movable occasions, and has high applicability; among them, the heat generated by the MicroLED chip is quickly transferred to the copper-diamond heat pipe through the porous silica gel buffer layer, and then laterally diffused through the fishbone-shaped oriented graphene layer to form an ultra-low thermal resistance link, and the thermal expansion difference between the MicroLED chip and the copper-diamond heat pipe is absorbed through compression deformation, greatly reducing the interfacial shear stress.

[0022] 2. The ultra-high brightness display module based on MicrLED and its manufacturing method adjust the rotation speed of the micro-vortex fan and the flow rate of the liquid cooling pump through the PID algorithm of the PID controller to achieve on-demand heat dissipation, reduce energy consumption. The temperature sensor can monitor the temperature distribution of the MicroLED chip in real time. A temperature threshold can be set through the PID controller. When the temperature of the MicroLED chip monitored by the temperature sensor is greater than the set temperature threshold, the liquid cooling pump and the micro-vortex fan are started. The liquid cooling pump will draw the coolant inside the external liquid storage tank into the inside of the liquid cooling pipeline and the branch pipeline through a hose. On the basis of passive heat dissipation, active heat dissipation is combined, so that the heat dissipation effect of the MicroLED chip is better, avoiding the situation that the MicroLED chip affects the normal use of the MicroLED chip due to too high temperature or even causes damage, and improving the practical safety of the MicroLED chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention. In the drawings:

[0024] Figure 1 is a structural cross-sectional view of an ultra-high brightness display module based on MicrLED and its manufacturing method of the present invention;

[0025] Figure 2 is a schematic diagram of the fishbone-shaped directional graphene layer structure of an ultra-high brightness display module based on MicrLED and its manufacturing method of the present invention;

[0026] Figure 3 is a schematic diagram of the copper-diamond heat pipe structure of an ultra-high brightness display module based on MicrLED and its manufacturing method of the present invention;

[0027] Figure 4 is a cross-sectional view of the micro-fin array material of an ultra-high brightness display module based on MicrLED and its manufacturing method of the present invention;

[0028] Figure 5 is a schematic diagram of the micro-fin array structure of an ultra-high brightness display module based on MicrLED and its manufacturing method of the present invention;

[0029] Figure 6 is a cross-sectional view of the connection structure of the liquid cooling pipeline, the branch pipeline and the liquid cooling pump of an ultra-high brightness display module based on MicrLED and its manufacturing method of the present invention.

[0030] In the figure: 1. Display module body; 2. Transparent encapsulation layer; 3. MicroLED chip; 4. Heat dissipation component; 5. Porous silica gel buffer layer; 6. Copper-diamond heat pipe; 7. Fishbone-shaped directional graphene layer; 8. Micro fin array; 801. Copper-aluminum laminate; 8011. Pure copper layer; 8012. Aluminum alloy layer; 802. Micron silica coating; 9. Active heat dissipation component; 10. Honeycomb micro-groove; 11. Micro vortex fan; 12. Air guide hood; 13. V-shaped groove; 14. Liquid cooling pipeline; 15. Branch pipeline; 16. Liquid cooling pump; 17. Temperature sensor; 18. PID controller; 19. Dust-proof net. Detailed implementation manners

[0031] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only for the purpose of illustrating and explaining the present invention, and are not intended to limit the present invention.

[0032] Embodiment: As Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 shown, an ultra-high brightness display module based on MicrLED of the present invention includes a display module body 1. A transparent encapsulation layer 2 is encapsulated on the top surface of the display module body 1. At the topmost layer inside the display module body 1, MicroLED chips 3 distributed in an array are installed on one side of the transparent encapsulation layer 2. A heat dissipation component 4 for dissipating heat from the MicroLED chips 3 is provided inside the display module body 1, and the light-emitting surface of the MicroLED chips 3 faces the transparent encapsulation layer 2; the heat dissipation component 4 includes a porous silica gel buffer layer 5 covering the non-light-emitting surface of the back of the MicroLED chips 3. The porous silica gel buffer layer 5 is used to cover the solder joints and driving motors of the MicroLED chips 3. A copper-diamond heat pipe 6 is provided below the porous silica gel buffer layer 5. A fishbone-shaped directional graphene layer 7 is covered on the lower surface of the copper-diamond heat pipe 6. A micro fin array 8 is welded to the back of the copper-diamond heat pipe 6. A hydrophobic coating and a flow disturbance structure are coated on the surface of the micro fin array 8. An active heat dissipation component 9 is provided on the inner wall of the display module body 1 below the lower surface of the micro fin array 8. By providing the heat dissipation component 4, it can achieve very high heat conduction efficiency, ensure the stable operation of the chip, the thermal decoupling design improves the structural reliability, has lightweight and compactness, is suitable for movable occasions, and has high applicability; among them, the heat generated by the operation of the MicroLED chips 3 is quickly transferred to the copper-diamond heat pipe 6 through the porous silica gel buffer layer 5, and then laterally diffused through the fishbone-shaped directional graphene layer 7 to form an ultra-low thermal resistance link, and the thermal expansion difference between the MicroLED chips 3 and the copper-diamond heat pipe 6 is absorbed by compression deformation, greatly reducing the interfacial shear stress.

[0033] Among them, the main vein direction of the fishbone-shaped oriented graphene layer 7 is parallel to the row arrangement of the MicroLED chips 3. The width of the main vein of the fishbone-shaped oriented graphene layer 7 is 0.5 mm. The branch veins of the fishbone-shaped oriented graphene layer 7 extend obliquely at 45°. The distance between adjacent branch veins of two fishbone-shaped oriented graphene layers 7 is set to 1 mm.

[0034] Among them, the diamond volume fraction of the copper-diamond heat pipe 6 is 40%-60%. The surface of the copper-diamond heat pipe 6 is provided with honeycomb-shaped micro-grooves 10. The inside of the honeycomb-shaped micro-grooves 10 is filled with a phase change material. The phase change material uses a paraffin-based composite material with a melting point of 80-100 °C and a latent heat > 200 J / g. The paraffin-based composite material is doped with graphene nanosheets to improve the thermal conductivity. The paraffin-based composite material filled inside the honeycomb-shaped micro-grooves 10 can absorb instantaneous high heat and avoid sudden temperature rise.

[0035] Among them, the micro-fin array 8 includes a copper-aluminum laminate 801. The copper-aluminum laminate 801 includes an outer pure copper layer 8011 and an aluminum alloy layer 8012 provided on the inner layer of the pure copper layer 8011. The surface of the copper-aluminum laminate 801 is sprayed with a nano-silica coating 802. The outer pure copper layer 8011 is in direct contact with the copper-diamond heat pipe 6 to ensure efficient heat conduction. The inner aluminum alloy layer 8012 has a lower density than that made entirely of copper, achieving lightweight. The sprayed nano-silica coating 802 can prevent dust accumulation and water stain residue.

[0036] Among them, the active heat dissipation component 9 includes an air-cooled heat dissipation module and a liquid-cooled heat dissipation module. The air-cooled heat dissipation module includes a micro-vortex fan 11 installed on the inner wall of the display module body 1. There is a flow guiding air hood 12 between the micro-vortex fan 11 and the micro-fin array 8. An included angle of 30° is formed between the air outlet of the flow guiding air hood 12 and the micro-fin array 8, and the air flow sweeps spirally along the fin surface. A V-shaped groove 13 is provided at the root of the fins of the micro-fin array 8 to guide the air flow to penetrate into the high heat density area. An air outlet is provided on the frame of the display module body 1, and a dust-proof net 19 is provided at the air outlet, which can dissipate heat and take the heat out of the air outlet, improving the heat dissipation effect. The dust-proof net 19 can play a dust-proof role and prevent dust from entering from the air outlet. The liquid-cooled heat dissipation module includes a liquid-cooled pipeline 14 arranged in a serpentine circuit by being bonded to the back of the copper-diamond heat pipe 6 through a heat-conducting adhesive. The liquid-cooled pipeline 14 includes a plurality of branch pipelines 15 connected in parallel. The materials of the liquid-cooled pipeline 14 and the branch pipelines 15 are both made of copper. The connection between the liquid-cooled pipeline 14 and the copper-diamond heat pipe 6 is welded, and an epoxy resin and nano-silver glue are coated at the welding part of the liquid-cooled pipeline 14 and the copper-diamond heat pipe 6. A liquid-cooled pump 16 is embedded on the frame of the display module body 1. The water outlet of the liquid-cooled pump 16 is communicated with the water inlet of the liquid-cooled pipeline 14. The water inlet of the liquid-cooled pump 16 is connected to an external liquid storage tank through a hose. A temperature sensor 17 is installed on each sub-module of the MicroLED chip 3, and a PID controller 18 is embedded on the display module body 1. The temperature sensor 17, the liquid-cooled pump 16 and the micro-vortex fan 11 are all electrically connected to the PID controller 18 through wires. The rotation speed of the micro-vortex fan 11 and the flow rate of the liquid-cooled pump 16 are adjusted through the PID algorithm of the PID controller 18 to achieve heat dissipation on demand and reduce energy consumption. The temperature sensor 17 can monitor the temperature distribution of the MicroLED chip 3 in real time. A temperature threshold can be set through the PID controller 18. For example, when the temperature of the MicroLED chip 3 monitored by the temperature sensor 17 is greater than the set temperature threshold, the liquid-cooled pump 16 and the micro-vortex fan 11 are started. The liquid-cooled pump 16 will pump the coolant inside the external liquid storage tank into the inside of the liquid-cooled pipeline 14 and the branch pipelines 15 through the hose. On the basis of passive heat dissipation and combined with active heat dissipation, the heat dissipation effect of the MicroLED chip 3 is better, avoiding the situation that the MicroLED chip 3 is affected by too high temperature and even damaged during normal use, improving the practical safety of the MicroLED chip 3; when the temperature of the MicroLED chip 3 monitored by the temperature sensor 17 is lower than the set temperature threshold, only passive heat dissipation is enabled;

[0037] Among them, the control targets of the PID controller 18 are the liquid cooling pump 16 and the micro-vortex fan 11. Among them, by adjusting the PWM duty cycle through the PID controller 18, the rotation speed of the micro-vortex fan 11 is minimized with the real-time rotation speed error. According to the temperature difference (inlet / outlet water) and flow feedback, the valve or motor speed of the liquid cooling pump 16 is dynamically adjusted. The following formula is applicable to both the liquid cooling pump 16 and the micro-vortex fan 11 in the PID algorithm:

[0038] Δu(n)=Kp[e(n)-e(n-1)]+Kie(n)+Kd[e(n)-2e(n-1)+e(n-2)]

[0039] Among them, e(n) = set value - current value (such as rotation speed error or temperature difference);

[0040] Δu(n) is the control quantity increment (such as the PWM duty cycle adjustment amount);

[0041] Among them, the rotation speed of the micro-vortex fan 11 includes the following control steps:

[0042] 1. Parameter initialization of the micro-vortex fan 11

[0043] Set the target rotation speed Rtarget of the micro-vortex fan 11;

[0044] Initialize the PID parameters as Kp∈010, Ki∈01, Kd∈02;

[0045] 2. Real-time calculation

[0046] Read the current rotation speed Rnow through the encoder of the PID controller 18;

[0047] Calculate the error: e(n) = Rtarget - Rnow;

[0048] Substitute into the incremental PID formula to calculate the adjustment amount of PWM;

[0049] Update the PWM duty cycle: Dnew = Dold + Δu(n);

[0050] 3. Anti-saturation processing

[0051] Limit the PWM output range (such as 10%-90% duty cycle) to avoid integral saturation.

[0052] Among them, the rotation speed of the liquid cooling pump 16 includes the following control steps:

[0053] 1. Temperature-flow mapping

[0054] Establish a theoretical flow model, Ftarget = f(Tin,Tout) (such as 5 L / min corresponding to every 1 °C temperature difference);

[0055] 2. Double closed-loop control

[0056] Outer loop (temperature control):

[0057] The calculated temperature difference error of the outer loop eT = Ttarget - (Tout - Tin);

[0058] Inner loop (flow control):

[0059] According to the flowmeter feedback Fnow, calculate the flow error eF = Ftarget - Fnow;

[0060] 3. Composite PID regulation

[0061] Adopt a cascade PID structure, the output of the outer loop is used as the set value of the inner loop, and finally output the pump motor control signal (voltage or frequency)

[0062] During operation, this kind of ultra-high brightness display module based on MicrLED and its preparation method can achieve very high thermal conduction efficiency through the provided heat dissipation component 4, ensure the stable operation of the chip, the thermal decoupling design improves the structural reliability, has light weight and compactness, is suitable for movable occasions, and has high applicability; among them, the heat generated by the MicroLED chip 3 is quickly transferred to the copper-diamond heat spreader 6 through the porous silica gel buffer layer 5, and then laterally diffused through the fishbone-shaped directional graphene layer 7 to form an ultra-low thermal resistance link. The thermal expansion difference between the MicroLED chip 3 and the copper-diamond heat spreader 6 is absorbed through compressive deformation, greatly reducing the interfacial shear stress. The rotation speed of the micro vortex fan 11 and the flow rate of the liquid cooling pump 16 are adjusted through the PID algorithm of the PID controller 18 to achieve on-demand heat dissipation, reducing energy consumption. The temperature sensor 17 can monitor the temperature distribution of the MicroLED chip 3 in real time. A temperature threshold can be set through the PID controller 18. For example, when the temperature of the MicroLED chip 3 monitored by the temperature sensor 17 is greater than the set temperature threshold, the liquid cooling pump 16 and the micro vortex fan 11 are started. The liquid cooling pump 16 will pump the coolant inside the external liquid storage tank into the liquid cooling pipeline 14 and the branch pipeline 15 through the hose. Based on passive heat dissipation and combined with active heat dissipation, the heat dissipation effect of the MicroLED chip 3 is better, avoiding the situation that the MicroLED chip 3 is affected by too high temperature and even damaged, improving the practical safety of the MicroLED chip 3.

[0063] A preparation method of an ultra-high brightness display module based on MicrLED includes the above-mentioned ultra-high brightness display module based on MicrLED.

[0064] Among them, the following preparation steps are also included:

[0065] Step 1. Fabricate the copper-diamond heat pipe 6: Weld the copper-diamond composite plate using the diffusion welding process, etch honeycomb micro-grooves 10 on the copper-diamond composite plate using femtosecond laser, and fill the phase change material into the honeycomb micro-grooves 10 using the vacuum-assisted injection technique;

[0066] Step 2. Form the porous silica gel buffer layer 5: Mix and stir the silica gel prepolymer and the pore-forming agent in a ratio of 3:1, and cover the solder joints of the MicroLED chip 3 by screen printing;

[0067] Step 3. Prepare the fishbone-shaped oriented graphene layer 7: Reduce graphene oxide using a 532nm pulsed laser with a scanning speed of 200mm / s, optimize the scanning path through the genetic algorithm so that the parallelism deviation between the main vein direction of the fishbone-shaped oriented graphene layer 7 and the row arrangement of the MicroLED chip 3 is < 0.5°, and etch the branch veins of the fishbone-shaped oriented graphene layer 7 at a 45° inclination angle using a focused ion beam;

[0068] Step 4. Prepare the micro-fin array 8: Prepare a copper-aluminum composite plate for the interface transition layer using magnetron sputtering, spray nano-silica on the surface of the copper-aluminum composite plate, machine V-grooves 13 using femtosecond laser double pulses, and spray a fluorosilane solution on the surface of the V-grooves 13.

[0069] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An ultra-high brightness display module based on MicrLED, characterized in that, It includes a display module body (1), a transparent encapsulation layer (2) is encapsulated on the top surface of the display module body (1), MicroLED chips (3) arranged in an array are installed on the topmost layer inside the display module body (1) on one side of the transparent encapsulation layer (2), a heat dissipation component (4) for dissipating heat from the MicroLED chips (3) is provided inside the display module body (1), and the light-emitting surface of the MicroLED chips (3) faces the transparent encapsulation layer (2). The heat dissipation component (4) includes a porous silica gel buffer layer (5) covering the non-light-emitting surface of the back of the MicroLED chips (3), and the porous silica gel buffer layer (5) is used to cover the solder joints and driving motors of the MicroLED chips (3). A copper-diamond heat pipe (6) is provided below the porous silica gel buffer layer (5), a fishbone-shaped directional graphene layer (7) is covered on the lower surface of the copper-diamond heat pipe (6), a micro-fin array (8) is welded to the back of the copper-diamond heat pipe (6), a hydrophobic coating and a flow disturbance structure are coated on the surface of the micro-fin array (8), and an active heat dissipation component (9) is provided on the inner wall of the display module body (1) below the micro-fin array (8).

2. The ultra-high brightness display module based on MicrLED according to claim 1, wherein The main vein direction of the fishbone-shaped directional graphene layer (7) is parallel to the row arrangement of the MicroLED chips (3), and the width of the main vein of the fishbone-shaped directional graphene layer (7) is 0.5 mm.

3. The ultra-high brightness display module based on MicrLED according to claim 2, characterized in that, The branch veins of the fishbone-shaped directional graphene layer (7) extend obliquely at 45°, and the distance between adjacent branch veins of the fishbone-shaped directional graphene layer (7) is set to 1 mm.

4. A super-high brightness display module based on MicrLED according to claim 1, characterized in that, The diamond volume fraction of the copper-diamond heat pipe (6) is 40%-60%, honeycomb-shaped micro-grooves (10) are provided on the surface of the copper-diamond heat pipe (6), a phase change material is filled inside the honeycomb-shaped micro-grooves (10), the phase change material uses a paraffin-based composite material, the melting point is 80-100 °C, the latent heat > 200 J / g, and graphene nanosheets are doped in the paraffin-based composite material.

5. The ultra-high brightness display module based on MicrLED according to claim 1, characterized in that, The micro-fin array (8) includes a copper-aluminum laminate (801), the copper-aluminum laminate (801) includes an outer pure copper layer (8011) and an aluminum alloy layer (8012) provided on the inner layer of the pure copper layer (8011), and a nano-silica coating (802) is sprayed on the surface of the copper-aluminum laminate (801).

6. The ultra-high brightness display module based on MicrLED according to claim 1, characterized in that, The active heat dissipation component (9) includes an air-cooling heat dissipation module and a liquid-cooling heat dissipation module. The air-cooling heat dissipation module includes a micro vortex fan (11) installed on the inner wall of the display module body (1). A diversion air hood (12) is provided between the micro vortex fan (11) and the micro-fin array (8). An included angle of 30° is formed between the air outlet of the diversion air hood (12) and the micro-fin array (8). A V-shaped groove (13) is opened at the root of the fins of the micro-fin array (8). An air outlet is provided on the frame of the display module body (1), and a dust-proof net (19) is provided at the air outlet.

7. The ultra-high brightness display module based on MicrLED according to claim 1, characterized in that, The liquid cooling heat dissipation module includes a liquid cooling pipeline (14) adhesively bonded to the back of a copper-diamond heat pipe (6) in a serpentine circuit. The liquid cooling pipeline (14) includes a plurality of branch pipelines (15) connected in parallel with each other. The materials of the liquid cooling pipeline (14) and the branch pipelines (15) are both copper. The connection between the liquid cooling pipeline (14) and the copper-diamond heat pipe (6) is welded, and the welded joint of the liquid cooling pipeline (14) and the copper-diamond heat pipe (6) is coated with epoxy resin and nano silver glue. A liquid cooling pump (16) is embedded in the frame of the display module body (1). The water outlet of the liquid cooling pump (16) is communicated with the water inlet of the liquid cooling pipeline (14), and the water inlet of the liquid cooling pump (16) is connected to an external liquid storage tank through a hose.

8. The ultra-high brightness display module based on MicrLED according to claim 1, characterized in that A temperature sensor (17) is installed on the MicroLED chip (3), and a PID controller (18) is embedded in the display module body (1). The temperature sensor (17), the liquid cooling pump (16), and the micro vortex fan (11) are all electrically connected to the PID controller (18) through wires.

9. A preparation method of an ultra-high brightness display module based on MicrLED, characterized in that, It includes a super-high brightness display module based on MicrLED according to any one of claims 1-8.

10. The preparation method of an ultra-high brightness display module based on MicrLED according to claim 9, characterized in that, It further includes the following preparation steps: Step 1, manufacturing the copper-diamond heat pipe (6): Welding a copper-diamond composite plate by diffusion welding process, using femtosecond laser to etch honeycomb micro-grooves (10) on the copper-diamond composite plate, and filling phase change materials in the honeycomb micro-grooves (10) by vacuum-assisted injection technology; Step 2, forming the porous silica gel buffer layer (5): Mixing and stirring silica gel prepolymer and pore-forming agent in a ratio of 3:1, and covering the solder joints of the MicroLED chips (3) by screen printing; Step 3, preparing the fishbone-shaped oriented graphene layer (7): Using 532nm pulsed laser to reduce graphene oxide, with a scanning speed of 200mm / s, optimizing the scanning path by genetic algorithm to make the parallelism deviation between the main vein direction of the fishbone-shaped oriented graphene layer (7) and the row arrangement of the MicroLED chips (3) <0.5°, and using a focused ion beam to etch the branch veins of the fishbone-shaped oriented graphene layer (7) at an angle of 45°; Step 4, preparing the micro fin array (8): Preparing a copper-aluminum composite plate for the interface transition layer by magnetron sputtering, spraying nano-silica on the surface of the copper-aluminum composite plate, using femtosecond laser double-pulse to process V-shaped grooves (13), and spraying a fluorosilane solution on the surface of the V-shaped grooves (13).

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