Wafer automatic cleaning and drying integrated equipment and method

Abstract

The invention discloses automatic wafer cleaning and drying integrated equipment and method, and relates to the technical field of wafer cleaning equipment.The automatic wafer cleaning and drying integrated equipment comprises a frame body, a first pipeline, a second pipeline and a third pipeline are sequentially arranged at the upper end of the frame body from left to right, an ultrasonic cleaning machine is arranged in the middle of the frame body, and a driving motor is fixed to the middle of the frame body; a fixing rod is fixed to the driving end of the driving motor, a containing frame is fixed to the upper end of the fixing rod, a plurality of through grooves are formed in the middle of the containing frame, and sliding grooves are formed in the two sides of the containing frame. The sealing cover is manually pulled to move, on one hand, the effect of integrating cleaning, spin-drying and drying is achieved, the effect of improving the working efficiency of the integrated equipment is achieved, on the other hand, the effect of scraping and cleaning is achieved, the effect of improving the use convenience of the integrated equipment is achieved, on the other hand, the effect of flexible pressing is achieved, and the working efficiency of the integrated equipment is improved. And the effect of improving the use stability of the integrated equipment is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning equipment, and in particular to an integrated device and method for automatic wafer cleaning and drying. Background Art

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. Its starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. Silicon ingots are ground, polished, and sliced to form silicon wafers. In the semiconductor manufacturing process, wafer cleaning and drying are core steps to ensure chip yield and performance. After cleaning, if water stains or particles remain on the wafer surface, they can cause corrosion of the metal interconnect layer and failure of photoresist stripping. Therefore, high-cleanliness drying equipment achieves "zero water mark" residue on the wafer surface by precisely controlling the drying process, providing a clean substrate for chip manufacturing.

[0003] In the traditional wafer cleaning process, wafers need to go through multiple cleaning steps, and each step relies on manual handling of wafers one by one. This process is not only inefficient, but also easily introduces contamination due to manual operation, reducing the cleanliness of the wafer. What is more cumbersome is that the spin-drying and drying steps require the use of special equipment. This increases the equipment space occupied by the entire production chain, extends the production cycle, increases labor costs, and greatly reduces overall production efficiency, which in turn makes the cleaning equipment less efficient.

[0004] Therefore, it is necessary to invent an integrated device and method for automatic wafer cleaning and drying to solve the above problems. Summary of the Invention

[0005] The object of the present invention is to provide an integrated device and method for automatic wafer cleaning and drying to solve the problems raised in the above background technology.

[0006] The cleaning machine is installed in the middle of the frame, and a driving motor is fixed on the middle of the frame, and a fixing rod is fixed on the driving end of the driving motor, and a placing rack is fixed on the upper end of the fixing rod, and a plurality of through slots are provided in the middle of the placing rack, and slide slots are provided on both sides of the placing rack, and two sliding plates are slidably connected to the inner walls of the two sliding slots, and a first spring is fixed on both sides of each sliding plate, and a support rod is fixed on the upper ends of the two sliding plates, and a tray is fixed on the upper ends of the two support rods, and a vibration motor is fixed in the middle of the tray, and a closing cover is slidably connected to the middle of the upper end of the frame, and a plurality of filter holes are provided in the middle of the closing cover, and a hot air blower is provided in the middle of the closing cover; The closure cover is provided with connecting structures on both sides, and a cleaning rack is provided on the connecting structures. The connecting structures can slide the cleaning rack in the height direction of the inner wall of the ultrasonic cleaning machine to scrape and clean impurities attached to the inner wall of the ultrasonic cleaning machine.

[0007] Preferably, the connection structure includes two fixed blocks, one end of each of the two fixed blocks is rotatably connected to a connecting frame, the other end of each of the two connecting frames is rotatably connected to a driving block, and the other end of each of the two driving blocks is fixed to a cleaning frame.

[0008] Preferably, the upper ends of the two fixing blocks are fixed on both sides of the closing cover, the lower ends of the two fixing blocks are rotatably connected to the upper ends of the two connecting frames, and the lower ends of the two connecting frames are rotatably connected to the upper ends of the two driving blocks.

[0009] Preferably, the lower ends of the two driving blocks are fixed on both sides of the upper end of the cleaning frame, the middle part of the cleaning frame is hollowed out, and the outer surface of the cleaning frame is slidably connected to the inner wall of the ultrasonic cleaning machine.

[0010] Preferably, a drain pipe is provided on one side of the ultrasonic cleaning machine, and a control valve is provided on the side of the drain pipe away from the ultrasonic cleaning machine, the fixing rod passes through the middle of the ultrasonic cleaning machine, the upper end of the fixing rod is fixed to the middle of the lower end of the placement rack, the placement rack is arranged in the ultrasonic cleaning machine, the outer surfaces of the two sliding plates are slidably connected to the inner walls of the two slide grooves, the proximal ends of each adjacent two first springs are fixed to the two sides of one of the sliding plates, and the separated ends of each adjacent two first springs are fixed to the inner walls of both ends of one of the slide grooves, each of the support rods passes through the middle of each slide groove, one end of each support rod is fixed to one side of the tray, and the outer surface of the tray is slidably connected to the inner wall of the placement rack.

[0011] Preferably, the outer surface of the closing cover is slidably connected to the inner wall of the middle part of the frame, the outer surface of the closing cover is slidably connected to the upper surface of the ultrasonic cleaning machine, several filter holes pass through the middle part of the closing cover, and the hot air blower is arranged in the middle part of the upper side of the closing cover.

[0012] Preferably, two stabilizing grooves are provided on the lower side of the closing cover, and stabilizing frames are slidably connected to the inner walls of the two stabilizing grooves. Second springs are fixed on both sides of the stabilizing frames, and a pressing frame is fixed to the lower end of the stabilizing frames.

[0013] Preferably, the outer surface of the stabilizing frame is slidably connected to the inner walls of the two stabilizing grooves, the upper ends of the two second springs are fixed to the inner walls of the upper ends of the two stabilizing grooves, and the lower ends of the two second springs are fixed to both sides of the stabilizing frame.

[0014] Preferably, the lower end of the stabilizing frame is fixed to the middle of the upper side of the pressing frame, the vertical section of the stabilizing frame is T-shaped, the vertical section of the pressing frame is arc-shaped, and the outer surface of the pressing frame contacts the outer surface of the frame body, ultrasonic cleaning machine and placement frame.

[0015] In a second aspect, a method for automatically cleaning and drying wafers is implemented by the above-mentioned integrated automatic wafer cleaning and drying device, comprising the following steps: S1. Wafer placement: Place the wafer box containing the wafers on the tray of the placement rack in the ultrasonic cleaning machine; S2, hydrofluoric acid soaking: injecting hydrofluoric acid into the ultrasonic cleaning machine through the first pipe to soak the wafer. After the soaking is completed, open the control valve, drain the hydrofluoric acid through the drain pipe, and then close the control valve; S3, cold water primary rinse: inject cold water into the ultrasonic cleaning machine through the second pipe to rinse the wafer. After the rinse is completed, open the control valve, drain the cold water through the drain pipe, and then close the control valve; S4, hot water oscillation: hot water is injected into the ultrasonic cleaning machine through the third pipe, and the vibration motor is started at the same time to drive the tray to oscillate and clean the wafer; S5. Hot water ultrasonic treatment: Start the ultrasonic cleaning machine to perform ultrasonic treatment on the wafer. After the treatment is completed, open the control valve to drain the hot water through the drain pipe, and then close the control valve. S6, cold water ultrasonic: inject cold water into the ultrasonic cleaning machine through the second pipe, start the ultrasonic cleaning machine, and perform ultrasonic treatment on the wafer. After the treatment is completed, open the control valve and drain the cold water through the drain pipe; S7, cold water secondary rinse: inject cold water into the ultrasonic cleaning machine again through the second pipe to rinse the wafer. After the rinse is completed, open the control valve and drain the cold water through the drain pipe; S8. Closing the cover: Pulling the cover to cover the ultrasonic cleaning machine, the cover drives the cleaning rack to slide along the inner wall of the ultrasonic cleaning machine and drives the pressing rack to flexibly press the wafer box containing the wafers. S9, drying: Start the drive motor to drive the fixed rod, causing the placement frame to rotate under the flexible limit of the smooth surface of the pressing frame, so that the wafer box containing the wafers rotates accordingly to achieve drying of the wafers; S10, drying: Start the hot air blower, the air is filtered through the filter holes and then heated, and then the heated hot air is transported to the ultrasonic cleaning machine, and the hot air is used to dry the wafers; S11. Take out the wafers: open the closed cover and take out the wafer box containing the processed wafers.

[0016] Compared with the prior art, the present invention has the following beneficial effects: (1) The present invention moves the closing cover by human power, and cooperates with the driving motor, vibration motor and ultrasonic cleaning machine to achieve the integrated effect of cleaning, drying and drying, without the need for manual transfer processing, shortening the processing time, and thus achieving the effect of improving the working efficiency of the integrated equipment; (2) The present invention moves the closing cover by pulling it manually, so that the fixed block, the connecting frame, the driving block, the cleaning frame, and the closing cover cooperate with each other to achieve the effect of scraping and cleaning. Manual cleaning by staff is unnecessary, which reduces the complexity of operation and improves the convenience of use, thereby achieving the effect of improving the convenience of use of the integrated equipment; (3) The present invention moves the closing cover by pulling it manually, so that the stabilizing groove, stabilizing frame, second spring, pressing frame and closing cover work together to achieve a flexible pressing effect, which not only maintains the stability of the wafer box, but also provides a certain buffer at the time of startup to avoid the position displacement of the wafer box during drying, thereby achieving the effect of improving the stability of the integrated equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is the overall structural diagram of the present invention; Figure 2 It is a front cross-sectional view of the frame of the present invention; Figure 3 is a side sectional view of the frame of the present invention; Figure 4 For the present invention Figure 3 A magnified view of the structure of the middle part A; Figure 5 For the present invention Figure 3 A magnified view of the structure of the middle B section; Figure 6 It is a schematic diagram of the local structure of the present invention.

[0018] In the figure: 1. frame; 2. first pipe; 3. second pipe; 4. third pipe; 5. ultrasonic cleaning machine; 6. driving motor; 7. fixing rod; 8. placement rack; 9. through groove; 10. slide groove; 11. slide plate; 12. first spring; 13. support rod; 14. tray; 15. vibration motor; 16. closing cover; 17. filter hole; 18. hot air blower; 19. fixing block; 20. connecting frame; 21. driving block; 22. cleaning frame; 23. stabilizing groove; 24. stabilizing frame; 25. second spring; 26. pressing frame; 27. drain pipe; 28. control valve. DETAILED DESCRIPTION

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] See also Figure 1-6As shown, this embodiment provides an integrated device for automatic wafer cleaning and drying, including a frame 1, wherein the upper end of the frame 1 is provided with a first pipe 2, a second pipe 3 and a third pipe 4 from left to right in sequence, an ultrasonic cleaning machine 5 is provided in the middle of the frame 1, a driving motor 6 is fixed in the middle of the frame 1, a fixing rod 7 is fixed to the driving end of the driving motor 6, a placement rack 8 is fixed on the upper end of the fixing rod 7, a plurality of through slots 9 are provided in the middle of the placement rack 8, slide slots 10 are provided on both sides of the placement rack 8, and sliding plates 11 are slidably connected to the inner walls of the two slide slots 10, and a first spring 12 is fixed on both sides of each sliding plate 11, and a support rod 13 is fixed to the upper end of the two support rods 13, and a tray 14 is fixed to the upper end of the two support rods 13, and a vibration motor 15 is fixed in the middle of the tray 14, a closing cover 16 is slidably connected to the middle of the upper end of the frame 1, a plurality of filter holes 17 are provided in the middle of the closing cover 16, and a hot air blower 18 is provided in the middle of the closing cover 16.

[0021] In this embodiment, a drain pipe 27 is provided on one side of the ultrasonic cleaning machine 5, and a control valve 28 is provided on the side of the drain pipe 27 away from the ultrasonic cleaning machine 5. The fixing rod 7 runs through the middle of the ultrasonic cleaning machine 5, and the upper end of the fixing rod 7 is fixed to the middle of the lower end of the placement rack 8. The placement rack 8 is arranged in the ultrasonic cleaning machine 5. The outer surfaces of the two sliding plates 11 are slidably connected to the inner walls of the two slide grooves 10. The proximal ends of each adjacent two first springs 12 are fixed to both sides of one of the sliding plates 11, and the separated ends of each adjacent two first springs 12 are fixed to the inner walls of both ends of one of the slide grooves 10. Each support rod 13 runs through the middle of each slide groove 10, and one end of each support rod 13 is fixed to one side of the tray 14. The outer surface of the tray 14 is slidably connected to the inner wall of the placement rack 8, the outer surface of the closing cover 16 is slidably connected to the inner wall of the middle of the frame 1, and the outer surface of the closing cover 16 is slidably connected to the upper surface of the ultrasonic cleaning machine 5. Several filter holes 17 run through the middle of the closing cover 16, and the hot air blower 18 is arranged in the middle of the upper side of the closing cover 16, such as Figure 1-6 shown.

[0022] The specific implementation process is as follows: First, place the wafer box containing the wafers on the tray 14 of the placement rack 8 in the ultrasonic cleaning machine 5. Then, inject hydrofluoric acid into the ultrasonic cleaning machine 5 through the first pipe 2 to soak the wafers therein. After the soaking is completed, open the control valve 28, discharge the hydrofluoric acid through the drain pipe 27, and then close the control valve 28. Then, inject cold water into the ultrasonic cleaning machine 5 through the second pipe 3 to rinse the wafers. After the rinsing is completed, open the control valve 28 again, discharge the cold water through the drain pipe 27, and close the control valve 28. Next, inject hot water into the ultrasonic cleaning machine 5 through the third pipe 4, and at the same time start the vibration motor 15 to drive the tray 14 to oscillate. The oscillating tray 14 drives the two support rods 13 fixed to it to move, and the moving support rod 13 drives the sliding plate 11 fixed at the other end to slide in the slide groove 10, compressing or stretching the two connected first springs 12 to ensure the normal oscillation operation of the tray 14 to clean the wafers. During this process, the ultrasonic cleaning machine 5 is started, and ultrasonic waves are transmitted to the cleaning liquid through the transducer, producing a cavitation effect. The cavitation bubbles in the cleaning liquid continue to grow and close, impacting the surface of the wafer, peeling off the attached impurities, and performing ultrasonic treatment on the wafer. After the treatment is completed, open the control valve 28, drain the hot water through the drain pipe 27, and close the control valve 28. Afterwards, inject cold water into the ultrasonic cleaning machine 5 again through the second pipe 3, start the ultrasonic cleaning machine 5 again, and perform ultrasonic treatment on the wafer. After the treatment is completed, open the control valve 28, and drain the cold water through the drain pipe 27. Subsequently, inject cold water into the ultrasonic cleaning machine 5 again through the second pipe 3 to rinse the wafer. After rinsing is completed, open the control valve 28 and drain the cold water through the drain pipe 27; Next, the closing cover 16 is moved by human force. After that, the drive motor 6 is started, driving the fixing rod 7, causing the placement rack 8 to rotate under the flexible limit of the smooth surface of the pressing rack 26, so that the wafer box containing the wafers rotates accordingly, and the wafers are dried. Finally, the hot air blower 18 set in the middle of the closing cover 16 is started. The air is heated after being filtered through the filter hole 17, and the heated hot air is then transported to the ultrasonic cleaning machine 5, and the hot air is used to dry the wafers. Through the above series of operations, the effect of cleaning, drying and drying is achieved in an integrated manner, without the need for manual transfer processing, shortening the time required for processing, and thus achieving the effect of improving the working efficiency of the integrated equipment.

[0023] When using ultrasonic cleaning equipment to clean wafers, impurities on the surface of the wafers will be washed off, but these washed impurities tend to adhere to the inner wall of the ultrasonic cleaning equipment and need to be cleaned separately by subsequent staff. This not only brings inconvenience to the staff, but also reduces the ease of use of the integrated equipment.

[0024] See also Figure 1-6As shown, a connecting structure is provided on both sides of the closing cover 16, and the connecting structure includes two fixed blocks 19, one end of the two fixed blocks 19 is rotatably connected to a connecting frame 20, the other end of the two connecting frames 20 is rotatably connected to a driving block 21, and the other end of the two driving blocks 21 is fixed to a cleaning frame 22, the upper ends of the two fixed blocks 19 are fixed on both sides of the closing cover 16, the lower ends of the two fixed blocks 19 are rotatably connected to the upper ends of the two connecting frames 20, the lower ends of the two connecting frames 20 are rotatably connected to the upper ends of the two driving blocks 21, and the lower ends of the two driving blocks 21 are fixed on both sides of the upper end of the cleaning frame 22, the middle part of the cleaning frame 22 is hollowed out, and the outer surface of the cleaning frame 22 is slidably connected to the inner wall of the ultrasonic cleaning machine 5.

[0025] The specific implementation process is as follows: The closing cover 16 is manually pulled to move, causing the two fixed blocks 19 fixed on either side of the closing cover 16 to move synchronously. Driven by the two connecting brackets 20, which are pivotally connected to the lower ends of the fixing blocks 19, the two connecting brackets 20 move, thereby driving the two driving blocks 21, which are pivotally connected to the lower ends of the connecting brackets 20. Because a cleaning rack 22 is fixed to the lower ends of the driving blocks 21, the movement of the driving blocks 21 causes the cleaning rack 22 to slide along the inner wall of the ultrasonic cleaning machine 5. When the closing cover 16 slides to the middle of the ultrasonic cleaning machine 5, the cleaning rack 22, driven by the connecting brackets 20, moves to the bottom of the inner wall of the ultrasonic cleaning machine 5. As the cleaning rack 22 continues to slide until it completely covers the inner wall of the ultrasonic cleaning machine 5, it slides from the bottom of the inner wall of the ultrasonic cleaning machine 5 to the top of the inner wall. During this sliding process, the cleaning rack 22 scrapes away impurities adhering to the inner wall, achieving a scraping and cleaning effect. This eliminates the need for manual cleaning by the operator, reduces operational complexity, improves user convenience, and thus enhances the ease of use of the integrated device.

[0026] When attaching the wafer cassette to the integrated equipment, a rigid connection is required using a clamp. However, due to the lack of a buffer structure after the wafer cassette is connected, the clamp is prone to positional displacement due to stress concentration during the drying operation, causing the wafer cassette to wobble, which in turn affects the stability of the integrated equipment.

[0027] See also Figure 1-6 As shown, the outer surface of the closing cover 16 is slidably connected to the inner wall of the middle part of the frame 1, and the outer surface of the closing cover 16 is slidably connected to the upper surface of the ultrasonic cleaning machine 5. A number of filter holes 17 pass through the middle of the closing cover 16, and the hot air blower 18 is arranged in the middle of the upper side of the closing cover 16. Two stabilizing grooves 23 are provided on the lower side of the closing cover 16. The inner walls of the two stabilizing grooves 23 are slidably connected to the stabilizing frames 24. Second springs 25 are fixed on both sides of the stabilizing frames 24. A pressing frame 26 is fixed to the lower end of the stabilizing frames 24. The outer surface of the stabilizing frames 24 is slidably connected to the inner walls of the two stabilizing grooves 23. The upper ends of the two second springs 25 are fixed to the inner walls of the upper ends of the two stabilizing grooves 23, and the lower ends of the two second springs 25 are fixed on both sides of the stabilizing frames 24.

[0028] The specific implementation process is as follows: The closing cover 16 is manually pulled to move. Since the closing cover 16 has a stabilizing groove 23 on its underside and the stabilizing frame 24 is slidably connected to the inner wall of the stabilizing groove 23, the movement of the closing cover 16 drives the stabilizing frame 24 to move. A pressing frame 26 is fixed to the lower end of the stabilizing frame 24, so when the stabilizing frame 24 moves, the pressing frame 26 also moves. When the pressing frame 26 moves to the upper side of the ultrasonic cleaning machine 5, its curved surface presses against the wafer cassette loaded with wafers placed on the tray 14. Under the reaction force of the wafer cassette, the pressing frame 26 drives the stabilizing frame 24 upward along the inner wall of the stabilizing groove 23. Second springs 25 are fixed to each end of the stabilizing frame 24. The upward movement of the stabilizing frame 24 compresses the second springs 25, generating an elastic force. This elastic force reacts against the pressing frame 26, pressing it against the wafer cassette. It is worth noting that the surface of the pressing frame 26 is extremely smooth. Although it can hold the wafer cassette tightly, it can still rotate normally during the spin drying process without affecting the spin drying process. Furthermore, the dimensions of the placement rack 8 match the size of the wafer cassette when placed, preventing any shaking during rotation. In conjunction with the pressing rack 26, it can flexibly compress the wafer cassette, achieving a flexible compression effect that not only maintains the stability of the wafer cassette but also provides a certain buffer during startup, preventing the wafer cassette from shifting during drying, thereby improving the operational stability of the integrated device.

[0029] A method for automatically cleaning and drying a wafer comprises the following steps: S1. Wafer placement: Place the wafer box containing the wafers on the tray 14 of the placement rack 8 in the ultrasonic cleaning machine 5; S2, hydrofluoric acid soaking: injecting hydrofluoric acid into the ultrasonic cleaning machine 5 through the first pipe 2, soaking the wafer therein. After the soaking is completed, the control valve 28 is opened, the hydrofluoric acid is discharged through the drain pipe 27, and then the control valve 28 is closed; S3, cold water primary rinse: inject cold water into the ultrasonic cleaning machine 5 through the second pipe 3 to rinse the wafer. After the rinse is completed, open the control valve 28, drain the cold water through the drain pipe 27, and then close the control valve 28; S4, hot water oscillation: hot water is injected into the ultrasonic cleaning machine 5 through the third pipe 4, and the vibration motor 15 is started at the same time to drive the tray 14 to oscillate and clean the wafer; S5, hot water ultrasonic treatment: start the ultrasonic cleaning machine 5 to perform ultrasonic treatment on the wafer. After the treatment is completed, open the control valve 28 to drain the hot water through the drain pipe 27, and then close the control valve 28; S6, cold water ultrasonic: inject cold water into the ultrasonic cleaning machine 5 through the second pipe 3, start the ultrasonic cleaning machine 5, and perform ultrasonic treatment on the wafer. After the treatment is completed, open the control valve 28 and drain the cold water through the drain pipe 27; S7, cold water secondary rinse: cold water is injected into the ultrasonic cleaning machine 5 again through the second pipe 3 to rinse the wafer. After the rinse is completed, the control valve 28 is opened and the cold water is discharged through the drain pipe 27; S8. Closing the cover 16: Pulling the cover 16 to cover the ultrasonic cleaning machine 5, the cover 16 drives the cleaning rack 22 to slide along the inner wall of the ultrasonic cleaning machine 5 and drives the pressing rack 26 to flexibly press the wafer cassette containing the wafers. S9, drying: start the drive motor 6, drive the fixing rod 7, drive the placement frame 8 to rotate under the flexible limit of the smooth surface of the pressing frame 26, so that the wafer box containing the wafers rotates accordingly, and the wafers are dried; S10, drying: start the hot air blower 18, the air is filtered through the filter hole 17 and then heated, and then the heated hot air is transported to the ultrasonic cleaning machine 5, and the hot air is used to dry the wafer; S11 , taking out wafers: opening the sealing cover 16 and taking out the wafer box containing the processed wafers.

[0030] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An integrated device for automatic wafer cleaning and drying, comprising a frame (1), characterized in that: The upper end of the frame (1) is provided with a first pipe (2), a second pipe (3) and a third pipe (4) in sequence from left to right, an ultrasonic cleaning machine (5) is provided in the middle of the frame (1), a driving motor (6) is fixed in the middle of the frame (1), a fixing rod (7) is fixed to the driving end of the driving motor (6), a placement rack (8) is fixed to the upper end of the fixing rod (7), a plurality of through slots (9) are provided in the middle of the placement rack (8), and slide slots (10) are provided on both sides of the placement rack (8), and two slide slots (10) are provided in the inner portion. The walls are slidably connected to a sliding plate (11), a first spring (12) is fixed on both sides of each sliding plate (11), a support rod (13) is fixed to the upper ends of the two sliding plates (11), a tray (14) is fixed to the upper ends of the two support rods (13), a vibration motor (15) is fixed to the middle of the tray (14), a closing cover (16) is slidably connected to the middle of the upper end of the frame (1), a plurality of filter holes (17) are opened in the middle of the closing cover (16), and a hot air blower (18) is provided in the middle of the closing cover (16); The closure cover (16) is provided with a connecting structure on both sides, and a cleaning frame (22) is provided on the connecting structure. The connecting structure can slide with the cleaning frame (22) in the height direction of the inner wall of the ultrasonic cleaning machine (5) to scrape and clean impurities attached to the inner wall of the ultrasonic cleaning machine (5).

2. The wafer automatic cleaning and drying integrated equipment according to claim 1, characterized in that: The connection structure comprises two fixed blocks (19), one end of each of the two fixed blocks (19) is rotatably connected to a connecting frame (20), the other end of each of the two connecting frames (20) is rotatably connected to a driving block (21), and the other end of each of the two driving blocks (21) is fixed to a cleaning frame (22).

3. The wafer automatic cleaning and drying integrated equipment according to claim 2, characterized in that: The upper ends of the two fixing blocks (19) are fixed on both sides of the closing cover (16), the lower ends of the two fixing blocks (19) are rotatably connected to the upper ends of the two connecting frames (20), and the lower ends of the two connecting frames (20) are rotatably connected to the upper ends of the two driving blocks (21).

4. The wafer automatic cleaning and drying integrated equipment according to claim 2, characterized in that: The lower ends of the two driving blocks (21) are fixed to both sides of the upper end of the cleaning frame (22), the middle part of the cleaning frame (22) is hollowed out, and the outer surface of the cleaning frame (22) is slidably connected to the inner wall of the ultrasonic cleaning machine (5).

5. The wafer automatic cleaning and drying integrated equipment according to claim 1, characterized in that: A drain pipe (27) is provided on one side of the ultrasonic cleaning machine (5), and a control valve (28) is provided on the side of the drain pipe (27) away from the ultrasonic cleaning machine (5). The fixed rod (7) runs through the middle of the ultrasonic cleaning machine (5), and the upper end of the fixed rod (7) is fixed to the middle of the lower end of the placement rack (8). The placement rack (8) is arranged in the ultrasonic cleaning machine (5). The outer surfaces of the two sliding plates (11) are slidably connected to the inner walls of the two slide grooves (10). The proximal ends of each adjacent two first springs (12) are fixed to the two sides of one of the sliding plates (11), and the separated ends of each adjacent two first springs (12) are fixed to the inner walls of both ends of one of the slide grooves (10). Each of the support rods (13) runs through the middle of each slide groove (10), and one end of each support rod (13) is fixed to one side of the tray (14). The outer surface of the tray (14) is slidably connected to the inner wall of the placement rack (8).

6. The wafer automatic cleaning and drying integrated equipment according to claim 1, characterized in that: The outer surface of the closing cover (16) is slidably connected to the inner wall of the middle part of the frame (1), and the outer surface of the closing cover (16) is slidably connected to the upper surface of the ultrasonic cleaning machine (5). A plurality of filter holes (17) pass through the middle part of the closing cover (16), and the hot air blower (18) is arranged in the middle part of the upper side of the closing cover (16).

7. The wafer automatic cleaning and drying integrated equipment according to claim 1, characterized in that: Two stabilizing grooves (23) are provided on the lower side of the closing cover (16), and the inner walls of the two stabilizing grooves (23) are slidably connected to stabilizing frames (24). Second springs (25) are fixed on both sides of the stabilizing frames (24), and a pressing frame (26) is fixed at the lower end of the stabilizing frames (24).

8. The wafer automatic cleaning and drying integrated equipment according to claim 7, characterized in that: The outer surface of the stabilizing frame (24) is slidably connected to the inner walls of the two stabilizing grooves (23), the upper ends of the two second springs (25) are fixed to the inner walls of the upper ends of the two stabilizing grooves (23), and the lower ends of the two second springs (25) are fixed to both sides of the stabilizing frame (24).

9. The wafer automatic cleaning and drying integrated equipment according to claim 7, characterized in that: The lower end of the stabilizing frame (24) is fixed to the middle of the upper side of the pressing frame (26); the vertical section of the stabilizing frame (24) is T-shaped; the vertical section of the pressing frame (26) is arc-shaped; the outer surface of the pressing frame (26) is in contact with the outer surfaces of the frame body (1), the ultrasonic cleaning machine (5), and the placement frame (8).

10. A wafer automatic cleaning and drying method, using the wafer automatic cleaning and drying integrated equipment according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. Wafer placement: placing a wafer box containing wafers on a tray (14) of a placement rack (8) in an ultrasonic cleaning machine (5); S2, hydrofluoric acid soaking: injecting hydrofluoric acid into the ultrasonic cleaning machine (5) through the first pipe (2) to soak the wafer therein. After the soaking is completed, opening the control valve (28), draining the hydrofluoric acid through the drain pipe (27), and then closing the control valve (28); S3, cold water primary rinse: inject cold water into the ultrasonic cleaning machine (5) through the second pipe (3) to rinse the wafer. After the rinse is completed, open the control valve (28), drain the cold water through the drain pipe (27), and then close the control valve (28); S4, hot water oscillation: hot water is injected into the ultrasonic cleaning machine (5) through the third pipe (4), and the vibration motor (15) is started at the same time to drive the tray (14) to oscillate and clean the wafer; S5, hot water ultrasonic treatment: start the ultrasonic cleaning machine (5) to perform ultrasonic treatment on the wafer. After the treatment is completed, open the control valve (28) to discharge the hot water through the drain pipe (27), and then close the control valve (28); S6, cold water ultrasound: inject cold water into the ultrasonic cleaning machine (5) through the second pipe (3), start the ultrasonic cleaning machine (5), perform ultrasonic treatment on the wafer, and after the treatment is completed, open the control valve (28) and discharge the cold water through the drain pipe (27); S7, secondary cold water rinse: inject cold water into the ultrasonic cleaning machine (5) again through the second pipe (3) to rinse the wafer. After the rinse is completed, open the control valve (28) and drain the cold water through the drain pipe (27); S8, closing the closing cover (16): by pulling the closing cover (16) to cover the ultrasonic cleaning machine (5), the closing cover (16) drives the cleaning frame (22) to slide on the inner wall of the ultrasonic cleaning machine (5), and drives the pressing frame (26) to flexibly press the wafer box containing the wafers; S9, drying: starting the driving motor (6), driving the fixing rod (7), driving the placement rack (8) to rotate under the flexible limit of the smooth surface of the pressing rack (26), so that the wafer box containing the wafers rotates accordingly, thereby drying the wafers; S10, drying: starting the hot air blower (18), filtering the air through the filter hole (17) and then heating it, then transporting the heated hot air to the ultrasonic cleaning machine (5), and using the hot air to dry the wafer; S11, taking out the wafers: opening the closing cover (16) and taking out the wafer box containing the processed wafers.

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