A thin film laser micro-hole drilling device

Abstract

The present invention relates to the field of laser processing technology, and specifically discloses a thin film laser micro-hole drilling device, including: a thin film laser micro-hole drilling device body; and also including: a thickness detection mechanism, which is arranged in the thin film laser micro-hole drilling device body, and is used to detect the thickness of different types of films. The present invention has at least the following beneficial effects: by arranging the thickness detection mechanism and the laser drilling power adjustment mechanism, the thickness of films with different conveying specifications can be detected, and then the thickness detection mechanism can be used to drive the laser drilling power adjustment mechanism, so that the laser drilling power adjustment mechanism is connected to the thin film laser micro-hole drilling device body through a wire, and then the laser drilling device in the thin film laser micro-hole drilling device body can be adjusted to a drilling energy corresponding to the film thickness during conveying drilling through the laser drilling power adjustment mechanism.

Description

Technical Field

[0001] The present invention relates to the technical field of laser processing, in particular to a thin film laser micro-hole drilling device. Background Art

[0002] The working principle of thin film laser micro-hole drilling equipment is to transport the film through a conveyor roller, and then use a laser beam to heat the surface area of ​​the film, so that the local area reaches high temperature and high pressure, forming bubbles or pressure burst areas, thereby generating holes. Specifically, the laser beam generated by the laser is focused to form a high-intensity heat source, which is irradiated onto the surface of the film, causing the surface of the material to heat, melt and vaporize rapidly, and finally form micro-holes.

[0003] The currently available thin film laser micro-hole drilling equipment may cause a heat-affected zone to appear around the thin film material due to local high temperature during the laser drilling process, which may cause material deformation or change material properties. In addition, the thickness specifications of the film are different. For thinner films, the energy density of the laser needs to be precisely controlled to avoid excessive ablation or penetration, while for thicker films, higher energy may be required to ensure that the hole can completely penetrate the material. If the energy is set improperly, it may result in poor hole quality, such as rough hole edges and burrs. Moreover, if the tension of films of different thicknesses is affected during transportation, the punching quality will be affected. If the film tension is insufficient, the film may become loose or fluctuate, resulting in position offset during the punching process, affecting the positioning accuracy of the punching, and excessive tension may cause the film to deform or stretch, which will also lead to inaccurate punching positions. For this reason, we propose a thin film laser micro-hole drilling equipment. Summary of the Invention

[0004] The purpose of the present invention is to provide a thin film laser micro-hole drilling device to solve the problem of the currently existing thin film laser micro-hole drilling device proposed in the above background technology. During the laser drilling process, due to local high temperature, a heat-affected zone may appear around the thin film material, which may cause material deformation or change the material properties, and the thickness specifications of the film are different. For thinner films, the energy density of the laser needs to be precisely controlled to avoid excessive ablation or penetration, while for thicker films, higher energy may be required to ensure that the hole can completely penetrate the material. If the energy is set improperly, the quality of the hole may be poor, such as the edge of the hole is not smooth, burrs appear, etc. Not only that, if the tension of films of different thicknesses is affected during transportation, the punching quality will be affected. If the film tension is insufficient, the film may become loose or fluctuate, resulting in position offset during the punching process, affecting the positioning accuracy of the punching, and too high tension may cause the film to deform or stretch, which will also lead to inaccurate punching positions.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solutions: a thin film laser micro-hole drilling device, comprising: a thin film laser micro-hole drilling device body;

[0006] It also includes: a thickness detection mechanism, which is arranged in the body of the thin film laser micro-hole drilling equipment and is used to detect the thickness of different types of films;

[0007] The laser drilling power adjustment mechanism is arranged between the thin film laser micro-hole drilling device body and the thickness detection mechanism. The laser drilling power adjustment mechanism adjusts the laser drilling power in the thin film laser micro-hole drilling device body according to the film thickness detected by the thickness detection mechanism.

[0008] The tension adjustment mechanism is arranged between the laser drilling power adjustment mechanism and the body of the film laser micro-hole drilling equipment. The tension adjustment mechanism is driven by the thickness detection mechanism to adjust the tension to the tension suitable for the film of the corresponding conveying thickness;

[0009] The air blowing and cooling mechanism is arranged in the body of the thin film laser micro-hole drilling equipment, and is used to cool the film on which the laser drilling is completed;

[0010] The cooling power regulating mechanism is arranged between the tension regulating mechanism and the body of the thin film laser microporous drilling equipment. The cooling power regulating mechanism drives the tension regulating mechanism to adjust the cooling wind force to be suitable for the conveying thickness of the film.

[0011] Among them, the thickness detection mechanism includes a first limit slider that is slidably connected to the inside of the thin film laser microporous drilling equipment body, one side of the first limit slider is rotatably connected to a rotating pressure roller, the top of the first limit slider is fixedly connected to a first insulating rack, one side of the first insulating rack is meshed with a first differential gear, and the first differential gear is rotatably connected to the thin film laser microporous drilling equipment body.

[0012] Wherein, the top of the first limiting sliding block is fixedly connected with a first spring.

[0013] Among them, the laser drilling power adjustment mechanism includes a second differential gear that is rotatably connected to the internal body of the thin film laser microporous drilling equipment. One side of the second differential gear is meshed with a second insulating rack, and the second insulating rack is slidably connected to the body of the thin film laser microporous drilling equipment.

[0014] Among them, a first conductive block is fixedly connected to one side of the second insulating rack, a second conductive block is fixedly connected inside the thin film laser microporous drilling equipment body, and the first conductive block is located on one side of the second conductive block.

[0015] Among them, the tension adjustment mechanism includes a first connecting rod that is rotatably connected to the inside of the thin film laser microporous drilling equipment body, one end of the first connecting rod is fixedly connected to the third differential gear, one side of the third differential gear is meshed with the fourth differential gear, the fourth differential gear is rotatably connected to the thin film laser microporous drilling equipment body, the other side of the fourth differential gear is meshed with an adjustment rack, the bottom of the adjustment rack is fixedly connected to a limiting slide, the limiting slide is slidably connected to the thin film laser microporous drilling equipment body, one side of the limiting slide is rotatably connected to two tensioning adjustment rollers, and the first connecting rod is fixedly connected to the first differential gear.

[0016] Among them, an electromagnet is fixedly connected to the inside of the thin film laser micro-hole drilling equipment body, and the electromagnet is located on one side of the adjustment rack.

[0017] Among them, the air blowing cooling mechanism includes a hair dryer fixedly connected to the inside of the thin film laser microporous drilling equipment body, the output end of the hair dryer is fixedly connected to an air collecting tube, and the bottom of the air collecting tube is fixedly connected to multiple air outlets at equal distances.

[0018] Among them, the cooling power adjustment mechanism includes a second connecting rod rotatably connected to the internal structure of the thin film laser microporous drilling equipment body, one end of the second connecting rod is fixedly connected to the fifth differential gear, one side of the fifth differential gear is meshed with the sixth differential gear, the sixth differential gear is rotatably connected to the thin film laser microporous drilling equipment body, the other side of the sixth differential gear is meshed with the third insulating rack, the third insulating rack is slidably connected to the thin film laser microporous drilling equipment body, and the second connecting rod is fixedly connected to the third differential gear.

[0019] Among them, a third conductive block is fixedly connected to one side of the third insulating rack, a fourth conductive block is fixedly connected inside the thin film laser microporous drilling equipment body, and the third conductive block is located on one side of the fourth conductive block.

[0020] The present invention has at least the following beneficial effects:

[0021] By setting up a thickness detection mechanism and a laser drilling power adjustment mechanism, the thickness of films with different conveying specifications can be detected, and then the thickness detection mechanism can be used to drive the laser drilling power adjustment mechanism, so that the laser drilling power adjustment mechanism is connected to the film laser micro-hole drilling device body through a wire, and then the laser drilling device in the film laser micro-hole drilling device body can be adjusted to the drilling energy corresponding to the film thickness during conveying and punching through the laser drilling power adjustment mechanism, so that the adjustment ratio of the film thickness and the laser drilling energy can be achieved through the laser drilling power adjustment mechanism, and thus the phenomenon of insufficient or excessive drilling energy when the thickness of the film changes can be avoided, so that the punching quality can be guaranteed; by setting up a tension adjustment mechanism, driven by the thickness detection mechanism and the laser drilling power adjustment mechanism, the film can be adjusted according to different specifications. The thickness of the film is adjusted to the appropriate tension, so that the differential speed ratio of the tension adjusting mechanism can be adjusted to the corresponding tension when conveying films of different thicknesses, thereby preventing the accuracy of punching positioning from being affected by insufficient or excessive tension when conveying films of different thicknesses; by setting a blowing cooling mechanism and a cooling power adjusting mechanism, the thickness of the film during conveyance is detected by the thickness detection mechanism, and the cooling power adjusting mechanism is driven by the thickness detection mechanism and the tension adjusting mechanism to adjust the cooling power to a proportion suitable for the film of corresponding thickness, thereby when the thickness of the conveyed film is too thick, the blowing power of the blowing cooling mechanism is increased, and when the thickness of the conveyed film is too thin, the blowing power of the blowing cooling mechanism can be reduced in real time, thereby ensuring the cooling effect and preventing thinner films from being damaged by excessive wind force. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 Schematic diagram of the internal structure of the present invention;

[0024] Figure 3 Schematic diagram of the internal structure of the cooling power adjustment mechanism of the present invention;

[0025] Figure 4 Schematic diagram of the internal structure of the tension adjustment mechanism of the present invention;

[0026] Figure 5 Schematic diagram of the internal structure of the thickness detection mechanism and the laser drilling power adjustment mechanism of the present invention;

[0027] Figure 6 It is a rear structural schematic diagram of the thickness detection mechanism, laser drilling power adjustment mechanism, tension adjustment mechanism, air blowing and cooling mechanism, and cooling power adjustment mechanism of the present invention;

[0028] Figure 7It is a structural schematic diagram of the thickness detection mechanism and the laser drilling power adjustment mechanism of the present invention;

[0029] Figure 8 Schematic diagram of the structure of the tension adjustment mechanism of the present invention;

[0030] Figure 9 It is a structural schematic diagram of the air blowing cooling mechanism and the cooling power adjustment mechanism of the present invention;

[0031] Figure 10 It is a structural schematic diagram of the air blowing and cooling mechanism of the present invention.

[0032] In the figure: 1. Thin film laser micro-hole drilling equipment body; 2. Thickness detection mechanism; 21. First limiting slider; 22. Rotating pressure roller; 23. First insulating rack; 24. First differential gear; 25. First spring; 3. Laser drilling power adjustment mechanism; 31. Second differential gear; 32. Second insulating rack; 33. First conductive block; 34. Second conductive block; 4. Tension adjustment mechanism; 41. First connecting rod; 42. Third differential gear; 43. Fourth differential gear; 44. Adjusting rack; 45. Limiting slide; 46. Tension adjustment roller; 47. Electromagnet; 5. Blowing and cooling mechanism; 51. Hair dryer; 52. Air collecting tube; 53. Air outlet; 6. Cooling power adjustment mechanism; 61. Second connecting rod; 62. Fifth differential gear; 63. Sixth differential gear; 64. Third insulating rack; 65. Third conductive block; 66. Fourth conductive block. DETAILED DESCRIPTION

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] Example 1

[0035] See also Figures 1 to 10 , the present invention provides a technical solution: a thin film laser micro-hole drilling device, comprising: a thin film laser micro-hole drilling device body 1;

[0036] The device further comprises: a thickness detection mechanism 2, which is arranged in the body 1 of the thin film laser micro-hole drilling device and is used to detect the thickness of different types of thin films;

[0037] The laser drilling power adjustment mechanism 3 is arranged between the thin film laser micro-hole drilling device body 1 and the thickness detection mechanism 2. The laser drilling power adjustment mechanism 3 adjusts the laser drilling power in the thin film laser micro-hole drilling device body 1 according to the film thickness detected by the thickness detection mechanism 2;

[0038] The tension adjustment mechanism 4 is arranged between the laser drilling power adjustment mechanism 3 and the film laser micro-hole drilling device body 1. The tension adjustment mechanism 4 is driven by the thickness detection mechanism 2 to adjust the tension to the corresponding thickness of the film to be conveyed;

[0039] The air blowing and cooling mechanism 5 is provided in the body 1 of the thin film laser micro-hole drilling device and is used to cool down the film on which the laser drilling is completed;

[0040] The cooling power regulating mechanism 6 is arranged between the tension regulating mechanism 4 and the film laser microporous drilling equipment body 1. The cooling power regulating mechanism 6 is driven by the tension regulating mechanism 4 to adjust the cooling wind force to be suitable for the conveying thickness of the film.

[0041] The above-mentioned thickness detection mechanism 2 and the laser drilling power adjustment mechanism 3 are set to detect the thickness of the films with different conveying specifications, and then the thickness detection mechanism 2 can be used to drive the laser drilling power adjustment mechanism 3, so that the laser drilling power adjustment mechanism 3 is connected to the film laser micro-hole drilling device body 1 through a wire, and then the laser drilling device in the film laser micro-hole drilling device body 1 can be adjusted to the drilling energy corresponding to the film thickness during conveying and punching through the laser drilling power adjustment mechanism 3, so that the adjustment ratio of the film thickness and the laser drilling energy can be achieved through the laser drilling power adjustment mechanism 3, and thus the phenomenon of insufficient or excessive drilling energy when the thickness of the film changes can be avoided, so that the punching quality can be guaranteed; by setting the tension adjustment mechanism 4, the thickness detection mechanism 2 and the laser drilling power adjustment mechanism 3 can be driven according to the specifications. Films of different thicknesses are adjusted to appropriate tensions, so that the tension adjusting mechanism 4 can be used to adjust the differential ratio when conveying films of different thicknesses to the corresponding tensions, thereby preventing the accuracy of punching positioning from being affected by insufficient or excessive tension when conveying films of different thicknesses; by setting up a blowing and cooling mechanism 5 and a cooling power adjusting mechanism 6, the thickness of the film during conveyance is detected by the thickness detection mechanism 2, and the cooling power adjusting mechanism 6 is driven by the thickness detection mechanism 2 and the tension adjusting mechanism 4 to adjust the cooling power to a proportion suitable for the film of corresponding thickness, so that when the thickness of the conveyed film is too thick, the blowing power of the blowing and cooling mechanism 5 is increased, and when the thickness of the conveyed film is too thin, the blowing power of the blowing and cooling mechanism 5 can be reduced in real time, thereby ensuring the cooling effect and preventing the thinner film from being damaged by excessive wind force.

[0042] The thickness detection mechanism 2 includes a first limit slider 21 slidably connected to the interior of the thin film laser microporous drilling device body 1. A rotating pressure roller 22 is rotatably connected to one side of the first limit slider 21. A first insulating rack 23 is fixedly connected to the top of the first limit slider 21. A first differential gear 24 is meshedly connected to one side of the first insulating rack 23. The first differential gear 24 is rotatably connected to the thin film laser microporous drilling device body 1.

[0043] During use, the unpunched film is wound up and placed on the roller body below the rotating pressure roller 22, and then one end of the film is tied to the outside of the winding roller on the other side. The motor is then controlled to rotate the winding roller to wind up the punched film, and the roller body of the unpunched film is driven by the pulley and the belt. By rotating the pressure roller 22 to fit tightly against the film, the thickness of the conveyed film can be detected in conjunction with the limiting roller below, so that the upward moving rotating pressure roller 22 drives the first limiting slider 21 to slide upward in the film laser microporous drilling equipment body 1, and the upward moving first limiting slider 21 can drive the first insulating rack 23 to move upward, and the first insulating rack 23 drives the first differential gear 24 to rotate.

[0044] A first spring 25 is fixedly connected to the top of the first limiting slider 21;

[0045] During use, when the thickness of the film is detected, the upward-moving first limit slider 21 can compress the first spring 25. In this way, a reaction force can be applied to the first limit slider 21 through the compressed first spring 25, so that the rotating pressure roller 22 on one side of the first limit slider 21 is close to the film, and the rotating pressure roller 22 can be driven to rotate when conveying the film to prevent affecting the conveyance of the film.

[0046] The laser drilling power adjustment mechanism 3 includes a second differential gear 31 rotatably connected to the interior of the thin film laser microporous drilling device body 1. A second insulating rack 32 is meshedly connected to one side of the second differential gear 31. The second insulating rack 32 is slidably connected to the thin film laser microporous drilling device body 1. The first differential gear 24 is meshedly connected to the second differential gear 31.

[0047] During use, when the first differential gear 24 rotates, the teeth on the outside of the first differential gear 24 and the second differential gear 31 can be set to a proportional number, and the laser drilling energy in the film laser microporous drilling equipment body 1 can be adjusted to an adaptive ratio corresponding to the thickness of the film, so that when the first differential gear 24 rotates, the second differential gear 31 can be driven.

[0048] A first conductive block 33 is fixedly connected to one side of the second insulating rack 32. A second conductive block 34 is fixedly connected to the inside of the thin film laser microporous drilling device body 1. The first conductive block 33 is located on one side of the second conductive block 34.

[0049] During use, the second differential gear 31 rotates proportionally to drive the first conductive block 33 to move upward, thereby driving the first conductive block 33 on one side of the second insulating rack 32 to move upward. When the thickness of the film is greater, the contact area between the first conductive block 33 and the second conductive block 34 is greater, and when the thickness of the film is smaller, the contact area between the first conductive block 33 and the second conductive block 34 is smaller, so that the bottom of the first conductive block 33 can be connected to an external power supply through a wire, and the top of the second conductive block 34 is connected to the laser drilling structure in the film laser microporous drilling device body 1 through a wire. When the film is thicker, the larger the contact area between the first conductive block 33 and the second conductive block 34, the greater the conductivity, and the greater the energy of the laser drilling structure. When the thickness of the film is smaller, the smaller the contact area between the first conductive block 33 and the second conductive block 34, the smaller the conductivity, and the smaller the energy of the laser drilling structure.

[0050] The tension adjustment mechanism 4 includes a first connecting rod 41 rotatably connected to the inside of the thin film laser microporous drilling device body 1, one end of the first connecting rod 41 is fixedly connected to a third differential gear 42, one side of the third differential gear 42 is meshedly connected to a fourth differential gear 43, the fourth differential gear 43 is rotatably connected to the thin film laser microporous drilling device body 1, the other side of the fourth differential gear 43 is meshedly connected to an adjustment rack 44, the bottom of the adjustment rack 44 is fixedly connected to a limiting slide 45, the limiting slide 45 is slidably connected to the thin film laser microporous drilling device body 1, one side of the limiting slide 45 is rotatably connected to two tension adjustment rollers 46, and the first connecting rod 41 is fixedly connected to the first differential gear 24;

[0051] During use, when the thickness of the film is detected, the first differential gear 24 can drive the third differential gear 42 to rotate through the first connecting rod 41 when it rotates. The number of teeth on the two outer sides of the rotating third differential gear 42 and the fourth differential gear 43 can be set proportionally, and the tension of the corresponding thickness can be set according to the thickness of the film. Then, the fourth differential gear 43 can drive the adjustment rack 44 to move downward, and the downward adjustment rack 44 drives the limiting slide 45 to slide downward in the body 1 of the film laser microporous drilling equipment, and the conveyed film is located below the two tensioning adjustment rollers 46, so that the tensioning adjustment roller 46 and the two limiting rollers in the upper position drive the film to cooperate in adjusting the tension of the conveyed film, and the conveyed film can drive the two tensioning adjustment rollers 46 to rotate.

[0052] An electromagnet 47 is fixedly connected to the interior of the thin film laser microporous drilling device body 1, and the electromagnet 47 is located on one side of the adjustment rack 44;

[0053] During use, when the thickness detection of the conveying film is completed, the electromagnet 47 can be energized, and the material of the adjustment rack 44 is iron material, so that the energized electromagnet 47 adsorbs the adjustment rack 44, and then the position of the tensioning adjustment roller 46 can be fixed, thereby ensuring the stability of the tension adjustment position.

[0054] Example 2

[0055] like Figures 9 and 10 In the second embodiment, other structures remain unchanged, and the difference from the first embodiment is:

[0056] The air blowing and cooling mechanism 5 includes a blower 51 fixedly connected to the interior of the thin film laser microporous drilling device body 1. The output end of the blower 51 is fixedly connected to an air collecting tube 52. The bottom of the air collecting tube 52 is fixedly connected to multiple air outlets 53 at equal intervals.

[0057] When using, according to Figure 10As shown, an air inlet slot is provided at the position of the hair dryer 51, so that the hair dryer 51 can be controlled to blow air into the air collecting tube 52, and then the air can be exhausted through multiple air outlets 53 at the bottom of the air collecting tube 52, and the film below the air outlet 53 has been laser punched, so that the punched film can be cooled.

[0058] The cooling power adjustment mechanism 6 includes a second connecting rod 61 rotatably connected to the inside of the thin film laser microporous drilling device body 1. One end of the second connecting rod 61 is fixedly connected to a fifth differential gear 62. One side of the fifth differential gear 62 is meshedly connected to a sixth differential gear 63. The sixth differential gear 63 is rotatably connected to the thin film laser microporous drilling device body 1. The other side of the sixth differential gear 63 is meshedly connected to a third insulating rack 64. The third insulating rack 64 is slidably connected to the thin film laser microporous drilling device body 1. The second connecting rod 61 is fixedly connected to the third differential gear 42.

[0059] During use, after completing the thickness detection of the conveying film, the rotating third differential gear 42 drives the second connecting rod 61, and the rotating second connecting rod 61 drives the fifth differential gear 62 to rotate, and the number of teeth on the outer sides of the fifth differential gear 62 and the sixth differential gear 63 is set to an adjustment ratio adapted to the film of corresponding thickness, so that the rotating sixth differential gear 63 can drive the third insulating rack 64 to move upward. When the thickness of the conveying film is greater, the upward position of the third insulating rack 64 is higher, and when the thickness of the conveying film is smaller, the upward position of the third insulating rack 64 is lower.

[0060] A third conductive block 65 is fixedly connected to one side of the third insulating rack 64. A fourth conductive block 66 is fixedly connected to the inside of the thin film laser microporous drilling device body 1. The third conductive block 65 is located on one side of the fourth conductive block 66.

[0061] During use, the top of the fourth conductive block 66 is connected to the hair dryer 51 through a wire, and the bottom of the third conductive block 65 is connected to an external power supply through a wire. The third conductive block 65 of the external power supply contacts the fourth conductive block 66 to supply power to the hair dryer 51. In this way, when the thickness of the conveying film is greater, the contact area between the third conductive block 65 and the fourth conductive block 66 is larger, and thus the operating power of the hair dryer 51 is greater, which can ensure the cooling effect of the thick film. When the thickness of the conveying film is smaller, the contact area between the third conductive block 65 and the fourth conductive block 66 is smaller, and thus the operating power of the hair dryer 51 can be reduced, so that it can be adjusted to a blowing and cooling power suitable for thin films with smaller thickness.

[0062] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0063] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A thin film laser micro-hole drilling device, characterized by: include: Thin film laser micro-hole drilling equipment body; The device further comprises: a thickness detection mechanism, the thickness detection mechanism being arranged in the body of the thin film laser micro-hole drilling device, and the thickness detection mechanism being used to detect the thickness of different types of thin films; A laser drilling power adjustment mechanism, which is disposed between the thin film laser micro-hole drilling device body and the thickness detection mechanism, and which adjusts the laser drilling power within the thin film laser micro-hole drilling device body according to the film thickness detected by the thickness detection mechanism; A tension adjustment mechanism, which is arranged between the laser drilling power adjustment mechanism and the body of the thin film laser micro-hole drilling device, and is driven by the thickness detection mechanism to adjust the tension to a tension suitable for the film of the corresponding conveying thickness; An air-blowing cooling mechanism is provided in the body of the thin film laser micro-hole drilling device and is used to cool the film on which the laser drilling has been completed; A cooling power adjustment mechanism, which is arranged between the tension adjustment mechanism and the body of the thin film laser microporous drilling device, and is driven by the tension adjustment mechanism to adjust the cooling wind force to a suitable cooling wind force for the conveying thickness of the thin film; The thickness detection mechanism includes a first limit slider slidably connected to the interior of the thin film laser microporous drilling device body, a rotating pressure roller is rotatably connected to one side of the first limit slider, a first insulating rack is fixedly connected to the top of the first limit slider, a first differential gear is meshedly connected to one side of the first insulating rack, and the first differential gear is rotatably connected to the thin film laser microporous drilling device body; The laser drilling power adjustment mechanism includes a second differential gear that is rotatably connected to the internal structure of the thin film laser microporous drilling equipment body, a second insulating rack is meshedly connected to one side of the second differential gear, the second insulating rack is slidably connected to the thin film laser microporous drilling equipment body, and the first differential gear is meshedly connected to the second differential gear.

2. The thin film laser micro-hole drilling device according to claim 1, characterized in that: The top of the first limiting sliding block is fixedly connected with a first spring.

3. The thin film laser micro-hole drilling device according to claim 1, characterized in that: A first conductive block is fixedly connected to one side of the second insulating rack, a second conductive block is fixedly connected inside the thin film laser microporous drilling device body, and the first conductive block is located on one side of the second conductive block.

4. The thin film laser micro-hole drilling device according to claim 1, characterized in that: The tension adjustment mechanism includes a first connecting rod rotatably connected to the inside of the thin film laser microporous drilling equipment body, one end of the first connecting rod is fixedly connected to the third differential gear, one side of the third differential gear is meshedly connected to the fourth differential gear, the fourth differential gear is rotatably connected to the thin film laser microporous drilling equipment body, the other side of the fourth differential gear is meshedly connected to the adjustment rack, the bottom of the adjustment rack is fixedly connected to a limiting slide, the limiting slide is slidably connected to the thin film laser microporous drilling equipment body, one side of the limiting slide is rotatably connected to two tensioning adjustment rollers, and the first connecting rod is fixedly connected to the first differential gear.

5. The thin film laser micro-hole drilling device according to claim 4, characterized in that: An electromagnet is fixedly connected to the interior of the thin film laser micro-hole drilling device body, and the electromagnet is located on one side of the adjustment rack.

6. The thin film laser micro-hole drilling device according to claim 1, characterized in that: The air blowing and cooling mechanism includes a hair dryer fixedly connected to the inside of the thin film laser microporous drilling equipment body, the output end of the hair dryer is fixedly connected to an air collecting tube, and the bottom of the air collecting tube is fixedly connected to multiple air outlets at equal intervals.

7. The thin film laser micro-hole drilling device according to claim 4, characterized in that: The cooling power adjustment mechanism includes a second connecting rod rotatably connected to the inside of the thin film laser microporous drilling equipment body, one end of the second connecting rod is fixedly connected to the fifth differential gear, one side of the fifth differential gear is meshed with the sixth differential gear, the sixth differential gear is rotatably connected to the thin film laser microporous drilling equipment body, the other side of the sixth differential gear is meshed with the third insulating rack, the third insulating rack is slidably connected to the thin film laser microporous drilling equipment body, and the second connecting rod is fixedly connected to the third differential gear.

8. The thin film laser micro-hole drilling device according to claim 7, characterized in that: A third conductive block is fixedly connected to one side of the third insulating rack, a fourth conductive block is fixedly connected inside the thin film laser microporous drilling device body, and the third conductive block is located on one side of the fourth conductive block.

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