Processing method of sapphire source rod special for sapphire optical fiber drawing

Abstract

The invention relates to the field of sapphire crystal processing, in particular to a sapphire source rod processing method special for sapphire optical fiber drawing, which comprises the following steps: 1) crystal orientation control: controlling the orientation angle deviation to be within + / -0.1 degrees, and ensuring that a drawn rod is parallel to a C axis; (2) drawing out a bar: drawing out a bar with the diameter phi of 20mm, the length of more than 0.5 m and the perpendicularity of less than 0.5 mm; 3) cutting off the end surface, and controlling the length to be 51 + / -1cm; (4) multi-stage grinding is conducted, and the diameter is controlled to be 2 mm + / -0.05 mm; (5) multi-stage polishing is conducted, and the end face roughness Ra is controlled to be smaller than 5 micrometers; according to the method, the problems of directional deviation, diameter tolerance and perpendicularity control of the high-hardness brittleness ultra-long and ultra-fine sapphire crystal bar are solved, efficient and high-consistency machining of the high-hardness brittleness ultra-long and ultra-fine sapphire crystal bar (phi 2 mm + / -0.05 mm, the length larger than or equal to 0.5 m and the perpendicularity smaller than 0.5 mm) is achieved, and core material guarantee is provided for optical fiber drawing.

Description

Technical Field

[0001] The present invention relates to the field of sapphire crystal processing, and in particular to a method for processing a sapphire source rod dedicated to sapphire optical fiber drawing. Background Art

[0002] Sapphire is widely used in aerospace, military, semiconductor, and other fields due to its excellent optical, physical, and chemical properties. In recent years, with the development of laser technology, sapphire fiber, as a new optical material, has become an important candidate for high-power fiber lasers due to its advantages such as high thermal conductivity, high melting point, and low Brillouin scattering coefficient. However, existing sapphire fiber preparation processes still have some problems, such as misalignment, insufficient verticality of the rod, and surface defects, which directly affect the optical performance and mechanical strength of the fiber.

[0003] Traditional sapphire source rod processing typically uses a laser-heated pedestal method to create tapered optical fibers. However, this method struggles to meet the geometric precision requirements of large source rods (over 0.5 meters). Furthermore, existing grinding and polishing techniques often struggle to balance processing speed and surface quality. This is particularly true when processing small, high-precision sapphire rods, where defects such as edge chipping and cracking are common. These issues severely hinder the application and development of sapphire optical fibers.

[0004] Therefore, there is an urgent need to develop a new sapphire source rod processing technology specifically for sapphire fiber drawing to address existing issues such as large orientation angle deviation, excessive rod verticality, and surface defects, while also improving processing efficiency and product quality. By adopting technologies such as crystal orientation control, rod drawing parameter optimization, and innovative multi-stage grinding and polishing processes, the accuracy of crystal orientation angle control can be effectively improved, and the diameter tolerance, verticality, and end face roughness of the source rod can be reduced, thus meeting the requirements for the production of high-quality sapphire fiber. Summary of the Invention

[0005] To effectively address the aforementioned challenges in the existing technology, the present invention provides a method for processing sapphire source rods specifically for sapphire optical fiber drawing. This innovative process achieves high-quality sapphire source rod processing through crystal orientation control, optimized rod drawing parameters, and innovative multi-stage grinding and polishing techniques. This innovative process overcomes the challenges of controlling orientation deviation, diameter tolerance, and perpendicularity for ultra-long, ultra-fine, hard, and brittle sapphire crystal rods. This enables efficient and highly consistent processing of ultra-long, ultra-fine, hard, and brittle sapphire crystal rods (φ2mm±0.05mm, length ≥0.5m, perpendicularity <0.5mm), providing a core material guarantee for optical fiber drawing.

[0006] A method for processing a sapphire source rod specifically for sapphire optical fiber drawing comprises the following steps:

[0007] Step 1: Crystal orientation control: Use an X-ray diffractometer to accurately measure the C-axis direction of the sapphire crystal ingot, control the orientation angle deviation within ±0.1°, and use crystal plane marking technology to ensure that the subsequent rod is parallel to the C-axis;

[0008] Step 2: Rod extraction: A dynamic cooling system is used, along with a diamond composite-coated rod extraction tool and a vibration sensing suppression platform. A laser-machine vision collaborative calibration system is used to calibrate verticality in real time. Rods with a diameter of 20 mm and a length greater than 0.5 m are extracted from the sapphire ingot, ensuring that the rods have a verticality of less than 0.5 mm.

[0009] Step 3, end face cutting: Use a diamond wire cutting machine to cut off the head and tail defect areas, with a cutting volume of no less than 5mm. The final rod length is 51cm±1cm. The cutting parameters are wire speed 10-30m / s, tension 20-40N, and coolant flow 5-10L / min.

[0010] Step 4: External cylindrical multi-stage grinding: A multi-stage grinding process is used, including rough grinding, semi-finishing grinding and finishing grinding, to control the final diameter tolerance within ±0.05mm;

[0011] Step 5: Polishing: Use a nylon-based brush inlaid with diamond abrasives for step-by-step polishing at a rotation speed of 2500-4000 rpm and a feed speed of 5-20 mm / min. The single removal amount is controlled to be less than 0.01 mm, and the end surface roughness is controlled to be less than 5 μm Ra.

[0012] Step 6: Cleaning and packaging: Use multi-stage ultrasonic cleaning, including deionized water cleaning, ethanol cleaning, ultra-pure nitrogen purging, cleaning and drying, and then vacuum shockproof packaging to ensure that the surface is not contaminated.

[0013] The step 4 includes:

[0014] Step 401, rough grinding: using a high-speed diamond wheel grinder with a grinding wheel grit of #300-#400, a feed speed of 200-300 mm / min, and a grinding depth of less than 0.1 mm to achieve a target ingot diameter of φ2.5 mm±0.2 mm.

[0015] Step 402, semi-finishing grinding: using a centerless grinder with a grinding wheel grit of #500, longitudinal grinding method, feed speed of 50-100 mm / min, controlled grinding depth of 0.01 mm, and target diameter of φ2.1 mm ± 0.1 mm;

[0016] Step 403, fine grinding: using a precision centerless grinder with a grinding wheel grit of #2000, a feed speed of 20-50 mm / min, and a controlled grinding depth of 0.002 mm, ultimately achieving the processing of a sapphire source rod with a diameter of φ2.0 mm±0.05 mm and a verticality of less than 0.5 mm.

[0017] In step 5, polishing is performed sequentially using diamond abrasive grains with particle sizes gradually decreasing from coarse to fine, including:

[0018] Step 501: Polishing is performed using F120 diamond abrasive (particle size of 106 μm to 125 μm) to remove large burrs and line marks;

[0019] Step 502: Polishing is performed using F400 diamond abrasive (with a particle size of 17 μm to 23 μm) to make the surface uniform;

[0020] Step 503: Polishing is performed using F800 diamond abrasives (with a particle size of 6 μm to 12 μm) to make the surface smooth.

[0021] In step 1, the X-ray diffraction method is used to accurately determine the C-axis direction of the crystal. Combined with crystal plane marking technology, the C-direction orientation angle deviation is controlled within ±0.1°, significantly improving the optical performance uniformity of the optical fiber and solving the orientation deviation problem in traditional processes.

[0022] Step 2 overcomes the drawback of traditional machining methods, which make it difficult to remove rods with high aspect ratios and low verticality. The synergy between the diamond composite-coated rod-removing tool and the vibration sensing suppression platform effectively controls the mechanical vibrations generated during the rod-removing process. Combined with a dynamic cooling system, it achieves real-time suppression of cutting thermal stress. Combined with a laser-machine vision collaborative calibration system, it enables simultaneous calibration of verticality.

[0023] Furthermore, through the deep collaboration between the vibration sensing suppression platform and the dynamic cooling system, a dynamic balance between the mechanical vibration field and the cutting temperature field is achieved, creating a stable physical environment foundation for the laser-machine vision collaborative calibration system, thereby improving the verticality calibration accuracy. The calibration system provides real-time feedback to the vibration suppression system and the cooling system to form a closed-loop control system. While achieving high-precision and damage-free rod extraction, it also ensures autonomous optimization and stable control of verticality. Through efficient collaborative control of multiple systems, the technical difficulties of the existing technology, such as the deterioration of rod extraction verticality due to cutting heat accumulation and mechanical vibration, and the high rod breakage rate that makes it difficult to process large aspect ratio crystal rods, are successfully overcome. Rods with a diameter of 20 mm and a length of more than 0.5 m are successfully extracted from sapphire crystal ingots, greatly optimizing the efficiency and stability of optical fiber drawing, while ensuring that the rod verticality is less than 0.5 mm, effectively reducing the risk of breakage during the optical fiber drawing process.

[0024] Among them, step 4 overcomes the dual difficulties of traditional external cylindrical grinding technology in simultaneously ensuring extremely fine diameters and extremely small diameter tolerances, as well as grinding speed and accuracy: the stringent requirements for the extremely fine diameter and extremely small diameter tolerance of the optical fiber source rod make external cylindrical grinding extremely difficult: to achieve extremely fine diameter processing, a larger grinding wheel grit and feed speed are required to achieve a larger grinding depth. However, if the grinding wheel grit is too large, there is a risk of rod breakage due to the accumulation of mechanical and thermal stresses during grinding, resulting in insufficient source rod length and difficulty in ensuring rod processing accuracy and verticality. To ensure diameter accuracy and achieve extremely small tolerance requirements, a smaller grinding wheel grit and feed speed are required to ensure a smaller grinding depth and higher processing accuracy. However, if the grinding wheel grit is too small, it is difficult to reach the target diameter range and the processing efficiency is low.

[0025] Step 4: By designing a multi-stage cylindrical grinding process, establishing grinding targets and grinding removal models for each grinding level, and optimizing grinding parameters such as the optimal grinding wheel particle size, feed rate, and grinding depth for each grinding level, the team achieved efficient and consistent machining of ultra-long, ultra-fine sapphire ingots (φ2mm, length ≥0.5m) while ensuring extremely high precision (diameter tolerance within ±0.05mm) and maintaining a small perpendicularity (less than 0.5mm). This addresses the dual challenges of existing technologies: the difficulty in simultaneously ensuring extremely fine diameters and extremely small diameter tolerances, and the difficulty in balancing grinding speed and precision.

[0026] Step 5 addresses the inherent "quality-efficiency" contradiction in traditional single-stage diamond polishing processes: when using small-grain abrasives, low rotation speeds, and slow feeds, the material removal rate is very low and the initial damage layer on the end face cannot be effectively removed. Conversely, using large-grain abrasives, high rotation speeds, and fast feeds can improve the material removal rate but can cause defects such as scratches and microcracks, leading to a worsening of roughness. In addition, if the abrasive grit size and polishing process parameters are not balanced, a small end face roughness cannot be achieved.

[0027] Furthermore, step 5 uses a diamond brush step-by-step polishing technique, precisely designs the abrasive grain sizes at each level, and optimizes process parameter control to achieve an end face roughness Ra of less than 5μm. This effectively reduces optical fiber transmission loss, overcomes the difficulties of surface quality and crack control in traditional processes, and improves processing efficiency.

[0028] This method optimizes various indicators (such as diameter tolerance, perpendicularity, end surface roughness, etc.) during the processing by more than 50% through precise control and optimization of the entire process, significantly improving the overall quality and precision of the sapphire source rod and meeting the geometric precision requirements of large-size source rods.

[0029] 1) The orientation process ensures the precise crystal orientation for subsequent processes, avoiding unevenness in subsequent processing due to large differences in crystal orientation;

[0030] 2) The rod cutting process provides the geometric accuracy foundation for subsequent processes. The rod cutting diameter is small (φ20mm), which reduces the amount of subsequent grinding to achieve ultra-fine diameters. The rod cutting length is long (>0.5m), avoiding the risk of insufficient rod length after end face removal. The verticality is small (<0.5mm), and external cylindrical grinding only requires maintaining the verticality without correction, which reduces the processing difficulty.

[0031] 3) External cylindrical grinding adopts a multi-level gradient grinding process, which ensures extremely high diameter accuracy while achieving the target ultra-fine diameter processing. And through the precise design of the gradient grinding particle size, it is possible to maintain a small verticality, avoiding the mechanical stress caused by a single coarse particle size, resulting in breakage and insufficient source rod length.

[0032] 4) The polishing process adopts diamond brush step-by-step polishing technology, combined with precise process parameter control, to achieve the precision requirement of smaller end surface roughness.

[0033] The close coordination and cooperation of each process form a complete optimization technology chain of "crystal orientation reference-geometry pre-control-precision forming-surface optimization", which ultimately realizes the efficient and high-consistency processing of high-hardness and brittle ultra-long and ultra-fine sapphire source rods with small diameter (φ2mm), small diameter tolerance (within ±0.05mm), long length (length ≥0.5m), and small verticality (less than 0.5mm), providing core material guarantee for optical fiber drawing.

[0034] The present invention provides a method for processing a sapphire source rod specifically for sapphire optical fiber drawing, which has the following beneficial effects compared with the prior art:

[0035] 1. The X-ray diffraction method combined with crystal plane marking technology achieves precise control of the C direction (angle deviation within ±0.1°), significantly improving the uniformity of the optical performance of the optical fiber;

[0036] 2. A vibration sensing suppression platform, dynamic cooling system, and laser-machine vision collaborative calibration system are used to collaboratively optimize the rod-drawing process, achieving effective control of mechanical vibration, cutting thermal stress, and verticality. This allows for non-destructive drawing of rods with high aspect ratios (φ20mm, length greater than 0.5m) and small verticality (less than 0.5mm), significantly improving fiber drawing efficiency and stability and effectively reducing the risk of fiber breakage during the drawing process.

[0037] 3. In response to the stringent requirements for the minimum diameter and diameter tolerance of the source rod, by optimizing the multi-stage grinding process parameters, while ensuring high processing accuracy (diameter tolerance within ±0.05mm) and maintaining a small verticality of the rod (less than 0.5mm), we have achieved efficient and highly consistent processing of ultra-long and ultra-fine sapphire crystal rods (φ2mm, length ≥0.5m);

[0038] 4. By optimizing the step-by-step polishing process parameters, the end face roughness Ra is achieved to be less than 5μm, effectively reducing the optical fiber transmission loss, effectively improving processing efficiency, and overcoming the difficulty of surface quality and defect control in traditional processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 Schematic diagram of the process of this method. DETAILED DESCRIPTION

[0040] Example 1

[0041] A method for processing a sapphire source rod specifically for sapphire optical fiber drawing, the flow diagram of which is shown as follows: Figure 1 The specific steps are as follows:

[0042] Step 1: Crystal orientation control: Place the sapphire crystal ingot in an X-ray diffractometer for precise measurement of the C-axis direction, with the orientation angle deviation controlled within ±0.1°. The C-axis angle measured by the X-ray diffractometer is 30.0°. Combined with crystal plane marking technology, ensure that the subsequent rod is parallel to the C-axis.

[0043] Step 2: Rod extraction: A dynamic cooling system with a coolant flow rate of 5 L / min was used. A diamond composite-coated rod extraction tool was used in conjunction with a vibration sensing suppression platform to extract a 20 mm diameter, 0.6 m long rod from the single crystal ingot. The verticality was calibrated in real time using a laser-machine vision collaborative calibration system to ensure that the rod's verticality was less than 0.5 mm. Laser measurement showed that the verticality of the extracted rod was 0.48 mm.

[0044] Step 3: End face removal: A diamond wire cutting machine was used to remove the head and tail defect areas. The cutting parameters were a wire speed of 20 m / s, a tension of 25 N, a coolant flow of 5 L / min, a removal volume of 9 cm, and a final rod length of 51 cm. The end face flatness after cutting was measured to be 0.02 mm.

[0045] Step 4: Multi-stage grinding of the outer circle: a multi-stage grinding process is used, including three stages: rough grinding, semi-finishing grinding and fine grinding.

[0046] Step 401, rough grinding: using a high-speed diamond wheel grinder with a grinding wheel grit of #400, a feed speed of 250 mm / min, a controlled grinding depth of 0.08 mm, a target ingot diameter of φ2.5 mm ± 0.2 mm, and a diameter of φ2.45 mm after grinding, as measured;

[0047] Step 402, semi-finishing grinding: using a centerless grinder with a grinding wheel grit of #500, longitudinal grinding method, feed speed of 80 mm / min, controlled grinding depth of 0.01 mm, target diameter of φ2.1 mm ± 0.1 mm, and the diameter after grinding is measured to be φ2.08 mm;

[0048] Step 403, fine grinding: using a precision centerless grinder, with a grinding wheel grit of #2000, a feed speed of 30 mm / min, a controlled grinding depth of 0.002 mm, and a target diameter of φ2.0 mm ± 0.05 mm. The diameter after grinding is measured to be φ1.98 mm, and the verticality is less than 0.5 mm.

[0049] Step 5: Polishing: Use a brush with a nylon matrix embedded with diamond abrasives for polishing. Use diamond abrasives with particle sizes of F120, F400, and F800 for step-by-step polishing. The rotation speed is 3000 rpm and the feed speed is 10 mm / min. The single removal amount is controlled to be less than 0.01 mm. The target end surface roughness Ra is controlled to be less than 5 μm. The end surface roughness Ra after polishing is measured to be 3.2 μm.

[0050] Step 6: Cleaning and packaging: Use multi-stage ultrasonic cleaning, then use deionized water and ethanol to clean, then blow with ultrapure nitrogen to clean and dry, and finally use shockproof vacuum bags for packaging to ensure that the surface is not contaminated.

[0051] Example 2

[0052] A method for processing a sapphire source rod specifically for sapphire optical fiber drawing, comprising the following specific steps:

[0053] Step 1: Crystal Orientation Control: Place the sapphire crystal ingot in an X-ray diffractometer for precise measurement of the C-axis orientation, with the orientation angle deviation controlled within ±0.1°. The C-axis angle measured by the X-ray diffractometer is 29.8°. Combined with crystal plane marking technology, this ensures that the subsequent rod is parallel to the C-axis.

[0054] Step 2: Rod extraction: A dynamic cooling system with a coolant flow rate of 6 L / min was used. A diamond composite-coated rod extraction tool was used in conjunction with a vibration sensing suppression platform to extract a 20 mm diameter, 0.6 m long rod from the single crystal ingot. The verticality was calibrated in real time using a laser-machine vision collaborative calibration system to ensure that the rod's verticality was less than 0.5 mm. Laser measurement showed that the verticality of the extracted rod was 0.45 mm.

[0055] Step 3: End face removal: A diamond wire cutting machine was used to remove the head and tail defect areas. The cutting parameters were a wire speed of 18 m / s, a tension of 28 N, a coolant flow of 6 L / min, a removal volume of 8 cm, and a final rod length of 52 cm. The end face flatness after cutting was measured to be 0.03 mm.

[0056] Step 4: Multi-stage grinding of the outer circle: a multi-stage grinding process is used, including three stages: rough grinding, semi-finishing grinding and fine grinding.

[0057] Step 401, rough grinding: using a high-speed diamond wheel grinder with a grinding wheel grit of #300, a feed rate of 280 mm / min, and a grinding depth of 0.09 mm, to achieve a target ingot diameter of φ2.5 mm ± 0.2 mm. The diameter after grinding was measured to be φ2.48 mm.

[0058] Step 402, semi-finishing grinding: using a centerless grinder with a grinding wheel grit of #500, longitudinal grinding method, feed speed of 70 mm / min, controlled grinding depth of 0.01 mm, target diameter of φ2.1 mm±0.1 mm, and the diameter after grinding is measured to be φ2.07 mm.

[0059] Step 403, fine grinding: using a precision centerless grinder, the grinding wheel grit size is #2000, the feed speed is 40mm / min, the grinding depth is controlled to be 0.002mm, the target diameter is φ2.0mm±0.05mm, and the diameter after grinding is measured to be φ1.99mm, and the verticality is less than 0.5mm.

[0060] Step 5: Polishing: Use a nylon-based brush inlaid with diamond abrasives for polishing. Use diamond abrasives with particle sizes of F120, F400, and F800 for step-by-step polishing. The rotation speed is 3000 rpm and the feed speed is 12 mm / min. The single removal amount is controlled to be less than 0.01 mm. The target end surface roughness Ra is controlled to be less than 5 μm. The end surface roughness Ra after polishing is measured to be 3.8 μm.

[0061] Step 6: Cleaning and packaging: Use multi-stage ultrasonic cleaning, then use deionized water and ethanol to clean, then blow with ultrapure nitrogen to clean and dry, and finally use shockproof vacuum bags for packaging to ensure that the surface is not contaminated.

[0062] Comparative Example 1

[0063] A method for processing a sapphire source rod specifically for sapphire optical fiber drawing, comprising the following specific steps:

[0064] Step 1: Crystal orientation control: Place the sapphire crystal ingot in an X-ray diffractometer to measure the C-axis direction, and control the orientation angle deviation within ±0.2°. The C-axis angle measured by the X-ray diffractometer is 30.2°. Combined with crystal plane marking technology, ensure that the subsequent rod is parallel to the C-axis.

[0065] Step 2: Rod removal: Use a diamond-coated rod removal tool to remove a φ30 mm, 0.4 m long rod from the single crystal ingot. Manually measure the verticality of the removed rod using a verticality measuring ruler to obtain a verticality of 1.15 mm.

[0066] Step 3: End face removal: A diamond wire cutting machine was used to remove the head and tail defect areas. The cutting parameters were a wire speed of 15 m / s, a tension of 23 N, a coolant flow of 5 L / min, a removal volume of 15 cm, and a final rod length of 25 cm. The end face flatness after cutting was measured to be 0.05 mm.

[0067] Step 4: External cylindrical grinding: A two-stage grinding process is used, including coarse grinding and fine grinding.

[0068] Step 401, rough grinding: using a high-speed diamond wheel grinder with a grinding wheel grit of #600, a feed speed of 300 mm / min, a controlled grinding depth of 0.15 mm, and a target ingot diameter of φ5 mm ± 0.5 mm. The diameter after grinding is measured to be φ5.35 mm.

[0069] Step 402, fine grinding: a centerless grinder is used, the grinding wheel grit size is #1200, the feed speed is 100 mm / min, the grinding depth is controlled to be 0.005 mm, the target diameter is φ2.0 mm±0.15 mm, and the diameter after grinding is measured to be φ2.08 mm and the verticality is 1.07 mm.

[0070] Step 5, polishing: polishing is performed using a brush with a nylon matrix inlaid with F320 diamond abrasive particles at a rotation speed of 3200 rpm and a feed speed of 15 mm / min. The end surface roughness Ra after polishing is measured to be 8.9 μm;

[0071] Step 6: Cleaning and packaging: Use multi-stage ultrasonic cleaning, then use deionized water and ethanol to clean, then blow with ultrapure nitrogen to clean and dry, and finally use shockproof vacuum bags for packaging to ensure that the surface is not contaminated.

[0072] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in the field should understand that the specific implementation methods of the present invention can still be modified or replaced by equivalents. Any modification or equivalent replacement that does not depart from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A method for processing a sapphire source rod for sapphire optical fiber drawing, characterized in that: The following steps are involved: Step 1: Crystal orientation control: Use an X-ray diffractometer to accurately measure the C-axis direction of the sapphire crystal ingot, control the orientation angle deviation within ±0.1°, and use crystal plane marking technology to ensure that the subsequent rod is parallel to the C-axis direction; Step 2: Rod extraction: A dynamic cooling system is used, along with a diamond composite-coated rod extraction tool and a vibration sensing suppression platform. A laser-machine vision collaborative calibration system is used to calibrate verticality in real time. Rods with a diameter of 20 mm and a length greater than 0.5 m are extracted from the sapphire ingot, ensuring that the rods have a verticality of less than 0.5 mm. Step 3: End face removal: Use a diamond wire cutting machine to remove the head and tail defect areas. The removal volume should be no less than 5mm. The control rod length is 51cm±1cm. Step 4, outer cylindrical multi-stage grinding: outer cylindrical grinding is performed by a multi-stage grinding process, the multi-stage grinding process includes three stages: rough grinding, semi-finishing grinding and fine grinding. The rough grinding target diameter is φ2.5mm±0.2mm, the semi-finishing target diameter is φ2.1mm±0.1mm, and the fine grinding target diameter is φ2.0mm±0.05mm; Step 5: Polishing: Use a brush with a nylon matrix embedded with diamond abrasives to perform step-by-step polishing to control the roughness Ra of the rod end surface to be less than 5μm; Step 6: Cleaning and packaging: Use multi-stage ultrasonic cleaning, then use deionized water and ethanol to clean, blow nitrogen to clean and dry, and then perform vacuum shockproof packaging.

2. The method for processing a sapphire source rod for sapphire optical fiber drawing according to claim 1, characterized in that: In step 3, the cutting parameters are: line speed 10-30 m / s, tension 20-40 N, and coolant flow rate 5-10 L / min.

3. The method for processing a sapphire source rod for sapphire optical fiber drawing according to claim 1, characterized in that: In step 4, the rough grinding is performed using a high-speed diamond wheel grinder with a grinding wheel grit of #300-#400, a feed speed of 200-300 mm / min, and a grinding depth controlled to be less than 0.1 mm.

4. The method for processing a sapphire source rod for sapphire optical fiber drawing according to claim 1, wherein: In step 4, the semi-finishing grinding is performed using a centerless grinder with a grinding wheel size of #500, a longitudinal grinding method, a feed speed of 50-100 mm / min, and a grinding depth of 0.01 mm.

5. The method for processing a sapphire source rod for sapphire optical fiber drawing according to claim 1, characterized in that: In step 4, a precision centerless grinder is used for fine grinding, the grinding wheel used has a grit size of #2000, a feed speed of 20-50 mm / min, and a grinding depth of 0.002 mm.

6. The method for processing a sapphire source rod for sapphire optical fiber drawing according to claim 1, characterized in that: In step 5, the step-by-step polishing specifically includes: polishing using diamond abrasives with particle sizes of F120, F400, and F800 in sequence.

7. The method for processing a sapphire source rod for sapphire optical fiber drawing according to claim 1 or 6, characterized in that: In step 5, the step-by-step polishing rotation speed is 2500-4000 rpm, the feed speed is 5-20 mm / min, and the single polishing removal amount is controlled within 0.01 mm.

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