Wafer detection equipment

Abstract

The invention discloses wafer detection equipment. The wafer detection equipment comprises a base, a carrying disc, a first lifting device and a bridging assembly, wherein the base can move in a first axial direction; the carrying disc can be used for carrying a to-be-tested assembly. The first lifting device is used for enabling the carrying disc to be lifted or descended relative to the base in a first axial direction so as to correspondingly contact with or be far away from the to-be-tested assembly; the bridging assembly comprises an electrical connection device and a second lifting device, the electrical connection device is provided with a first connection module and a second connection module which are electrically connected with each other, and the second lifting device is used for enabling the electrical connection device to be lifted or lowered relative to the base in the first axial direction so that the first connection module can make contact with or be away from the probe card correspondingly. And correspondingly enabling the second connecting module to be in contact with or away from the carrying disc. Therefore, the integrity and continuity of the test signal are ensured, and the compatibility with the existing equipment is also improved.

Description

Technical field

[0001] The present invention relates to a testing device, and more particularly, to a wafer testing device for providing a shorter signal transmission path for a wafer to be tested. [Background Technology]

[0002] The manufacturing process of semiconductor devices includes the wafer probe process, which tests the electrical functions of each die in the wafer. It is used to identify electrically defective die before the IC assembly process, thereby preventing these defective die from entering the back-end process.

[0003] The wafer probe process involves contacting the probes of a probe card with the test points on the wafer that serve as input terminals (such as the solder pads on the die). The test signals are then input to the corresponding die through the probes to detect the electrical condition of the circuit and determine whether the die is good or bad.

[0004] Wafer inspection equipment contains numerous components and actuators. However, after the test signal output by the probe card enters the die under test, new components need to be installed to shorten the transmission path back to the probe card. This often creates difficulties in arranging the space within the narrow wafer inspection equipment, resulting in the need to redesign and relocate the components and actuators within the wafer inspection equipment, which significantly increases the construction cost. [Summary of the invention]

[0005] In some embodiments disclosed herein, a configuration is provided that allows a device for shortening a signal transmission path to be easily configured in an existing device through modification and / or retrofitting.

[0006] According to some embodiments, a wafer inspection device is provided, comprising: a base, a carrier, a first lifting device, and at least one bridge component. The base is movable in a first axial direction, and is used to lift or lower a component to be tested so as to contact or move away from a probe card accordingly; the carrier is made of a conductive material and is used to selectively support the component to be tested; the first lifting device is arranged on the base and bears against the carrier, and the first lifting device is used to lift or lower the carrier relative to the base in the first axial direction so as to contact or move away from the component to be tested accordingly; the bridge component comprises: an electrical connection device and a second lifting device, the electrical connection device having a first connection module and a second connection module electrically connected to each other; the second lifting device is arranged on the base and bears against the electrical connection device, and the second lifting device is used to lift or lower the electrical connection device relative to the base in the first axial direction so as to contact or move away from the probe card accordingly, and to contact or move away from the carrier accordingly.

[0007] According to some embodiments, when the first connection module contacts the probe card and the second connection module contacts the carrier, a bridge path can be established between the device under test and the probe card, providing a shorter signal transmission path between the wafer under test and the probe card.

[0008] According to some embodiments, a device under test may include a wafer under test and a carrier for carrying the wafer under test.

[0009] According to some embodiments, the electrical connection device may have a stepped portion at its top. The stepped portion may have a high portion and a low portion opposite the high portion. The first connection module is disposed on the high portion, and the second connection module is disposed on the low portion. When the second lifting device elevates the electrical connection device until the second connection module contacts the lower surface of the carrier, the first connection module protrudes from the upper surface of the carrier at the periphery of the carrier.

[0010] According to some embodiments, the carrier may have at least one protruding ear portion disposed on a periphery thereof, wherein the lower surface of the protruding ear portion is configured to provide contact for the second connection module.

[0011] According to some embodiments, the carrier may have a plurality of lugs arranged in a spaced-apart arrangement. The number of bridge components corresponds to the number of lugs. Each bridge component corresponds to a lug, so that when the electrical connection device is lifted by the second lifting device, the second connection module of each bridge component contacts the corresponding lug.

[0012] According to some embodiments, each of the first connection modules can be electrically connected to a conductive sheet at the bottom of the probe card through a plurality of first terminals protruding upward, and each of the second connection modules can be electrically connected to the bottom surface of the corresponding lug portion through a plurality of second terminals protruding upward.

[0013] According to some embodiments, the carrier may have a plurality of notches on its periphery, each of which is for a fork portion of a corresponding supporting device to extend into. The supporting device is fixed on the base. When the carrier has not yet contacted the component to be tested, the component to be tested is supported by such fork portions of the two supporting devices.

[0014] In this way, with the combination of the carrier, the first lifting device and the bridge assembly, not only can they be directly configured on the existing base and move with the base, but they can also form a configuration relationship between the bridge assembly and the carrier that allows them to operate independently without restraining each other, ensuring the integrity and continuity of the test signal and greatly improving compatibility with existing equipment.

Brief Description of the Drawings

[0015] Figure 1 is a side cross-sectional view of a wafer inspection apparatus according to some embodiments; Figure 2 for Figure 1A schematic diagram of the embodiment after the base is moved upward; Figure 3 for Figure 1 A schematic diagram of an embodiment in which the base and the bridge assembly move downward; Figure 4 is a schematic perspective view of a portion of a wafer inspection device according to some embodiments; Figure 5 for Figure 4 A perspective schematic diagram of a bridge assembly according to an embodiment. [Specific implementation method]

[0016] In order to fully understand the purpose, features and effects of the present invention, the present invention is now described in detail with the help of the following specific embodiments and the accompanying drawings, as follows:

[0017] Throughout this disclosure, the terms "a" or "an" are used to describe a unit, component, structure, device, module, system, part, or region. This is for convenience only and to provide a general understanding of the scope of the present invention. Therefore, unless otherwise apparent, such descriptions should be understood to include one or at least one, and the singular also includes the plural.

[0018] In the content disclosed in the present invention, the terms "comprise, include, have" or any other similar terms are not limited to such elements listed in this document, but may include other elements that are not explicitly listed but are generally inherent to the units, components, structures, devices, modules, systems, parts or regions.

[0019] In the present disclosure, ordinal terms such as "first" or "second" are used to distinguish or refer to elements, structures, parts, or regions that are identical or similar, and do not necessarily imply a spatial order of these elements, structures, parts, or regions. It should be understood that in certain situations or configurations, ordinal terms may be used interchangeably without affecting the practice of the present invention.

[0020] Please refer to Figure 1 and Figure 2 , Figure 1 is a side cross-sectional view of a wafer inspection apparatus according to some embodiments, Figure 2 for Figure 1 Schematic diagram of the embodiment after the base is moved upward. The wafer inspection equipment includes: a base 100, a carrier 200 (chuck), a first lifting device 300 and at least one bridge component 400.

[0021] The base 100 is usually configured to have multiple axial motion capabilities in the wafer inspection equipment, which will be configured as the wafer inspection equipment provides a way to inspect the wafer. For example: the base 100 may be able to move in a first axial direction (Z axis), a second axial direction (X axis, not shown in the figure, refer to Figure 4 ), the third axis (Y axis, not shown, refer to Figure 4 ) direction and has the ability to rotate on at least one axis.

[0022] In the present embodiment, the base 100 provides movement capability in the first axis (Z axis) so that there can be a certain degree of movement relationship between the carrier 200 and the probe card 500. Usually, the carrier 200 carrying the component to be tested 600 is moved closer by driving the base 100, so that the test point of the wafer to be tested 610 of the component to be tested 600 can be close to the probe card 500 for the needle test step to be performed. For example, the base 100 allows the component to be tested 600 to be raised or lowered so as to contact the bottom of the probe card 500 or move away from the probe card 500 accordingly. However, the needle test step can be performed by moving the probe card 500 to approach the component to be tested 600, or by moving both the carrier 200 and the probe card 500, etc., which are all applicable to the embodiments disclosed in the present invention.

[0023] The carrier 200 is used to support the component under test 600. The carrier 200 is made of a conductive material with electrical conductivity, which may include metal or non-metallic but conductive materials. The carrier 200 provides a bridge assembly 400 that can establish an electrical connection with the component under test 600 on the carrier 200 by contacting the carrier 200. The bridge assembly 400 includes an electrical connection device 410 and a second lifting device 420. The electrical connection device 410 has a first connection module 411 for contacting the bottom of the probe card 500 and a second connection module 412 for contacting the carrier 200.

[0024] For example, when the second lifting device 420 configured on the base 100 is in operation, the electrical connection device 410 can be lifted or lowered relative to the base 100 in the first axis Z, so as to correspondingly move the first connection module 411 closer to or away from the bottom of the probe card 500, and correspondingly move the second connection module 412 closer to or away from the bottom of the carrier 200.

[0025] like Figure 1 and Figure 2As shown, the electrical connection device 410 has a stepped portion at its top, which has a high portion and a lower portion opposite the high portion. A first connection module 411 is positioned on the high portion, and a second connection module 412 is positioned on the lower portion. When the second lifting device 420 elevates the electrical connection device 410 to the point where the second connection module 412 contacts the lower surface of the carrier 200, the first connection module 411 is positioned at the periphery of the carrier 200 and protrudes from the upper surface of the carrier 200.

[0026] like Figure 2 As shown, when the base 100 is moved upward, the first connection module 411 can establish an electrical connection with the probe card 500, and the second connection module 412 can establish an electrical connection with the bottom of the carrier 200. In the electrical connection device 410, for example, the first connection module 411 is electrically connected to the second connection module 412 via a wire or other means. This creates a short path from the carrier 200 to the probe card 500, forming a bridge path between the device under test 600 and the probe card 500. This bridge path provides a shorter signal transmission path between the wafer under test 610 and the probe card 500.

[0027] The first lifting device 300 is arranged on the base 100 and is used to support the carrier 200. The first lifting device 300 is used to lift or lower the carrier 200 relative to the base 100 in the first axial direction Z, so as to be closer to or farther away from the component to be tested 600 accordingly. Among them, when the first lifting device 300 is extended on the base 100, and then the carrier 200 is lifted and contacted with the bottom surface of the component to be tested 600, the first stage of positioning is completed, and then the second lifting device 420 is extended on the base 100, and then the electrical connection device 410 is lifted and the second connection module 412 is contacted with the bottom surface of the carrier 200, and the second stage of positioning is completed, thereby completing the pre-steps of the test procedure. Then, the base 100 is operated in the first axial direction Z, and the first lifting device 300 and the second lifting device 420 fixed on the base 100 are lifted together, so that the component to be tested 600 is lifted and contacts the detection part 510 (such as the probe card 500) of the probe card 500. Figure 2 As shown, the first connection module 411 simultaneously contacts the conductive pad 520 on the bottom surface of the probe card 500, completing a shorter signal transmission path between the device under test 600 and the probe card 500. Subsequently, under the control of the base 100, each die of the wafer under test 610 on the device under test 600 is brought into contact with the probing portion 510 at the bottom of the probe card 500 for probe testing.

[0028] The first lifting device 300 and the second lifting device 420 can be, for example, a pneumatic moving mechanism that can be used in an extension or compression manner. Other devices that can achieve an axial movement effect are also applicable.

[0029] Please refer to Figure 3 ,for Figure 1 Schematic diagram of the embodiment in which the base moves downward and the bridge component also moves downward. On the other hand, after the probe test step of the wafer 610 on the component 600 is completed, the base 100 will first move downward to move the component 600 away from the probe card 500. Then, the second lifting device 420 is compressed to move the first connection module 411 away from the probe card 500 and the carrier 200 and to make the top surface of the first connection module 411 lower than the bottom surface of the carrier 200. At the same time, the second connection module 412 is also away from the carrier 200, forming a Figure 3 In this manner, the bridge assembly 400 does not interfere with the placement of the component under test 600 by other mechanical components. In some embodiments, during subsequent motion control, the first lifting device 300 may be compressed to allow the carrier 200 to descend along the first axis Z, freeing up space for other mechanical components to place the component under test 600.

[0030] Please also refer to Figures 1 to 3 As mentioned above, the probe card 500 includes a probe portion 510, a conductive sheet 520, and a substrate 530. After the alignment and movement steps in the detection process are completed, the probe portion 510 can contact the selected test die on the wafer 610 to be tested (the probe portion 510 is, for example, a probe) so that the test signal can be transmitted to the test die. Figure 1 and Figure 2 The detection portion 510 may be fixed on the substrate 530 .

[0031] The substrate 530 is typically configured with various electronic components and related circuits arranged on the top surface of the substrate and within the substrate. The bottom surface of the substrate 530 has an insulating layer. The conductive sheet 520 is typically attached below the insulating layer, thereby forming a contact surface at the bottom of the probe card 500 for electrical connection to the bridge assembly 400. The conductive sheet 520 can be arranged around the probe portion 510. The conductive sheet 520 arranged on the bottom surface of the substrate 530 can electrically connect to the electronic components on the probe card 500 via circuits arranged on and / or within the substrate 530, allowing the received test signals to be transmitted to the corresponding functional modules for performing certain electrical analysis steps.

[0032] Please refer to Figure 4 and Figure 5 , Figure 4 is a three-dimensional schematic diagram of a portion of a wafer inspection device according to some embodiments. Figure 5 for Figure 4 A perspective schematic diagram of a bridge assembly according to an embodiment of the present invention. Figure 4In the figure, the component under test 600 has not yet been placed on the supporting device 700 or the carrier 200 so as to facilitate visualization of the spatial arrangement relationship of the various structures.

[0033] Two supporting devices 700 are fixed to the base 100. Each supporting device 700 includes a pair of upright posts 710 and a fork portion 720 supported by the upright posts 710. The front end of the fork portion 720 is used to support the component under test 600, allowing other mechanical components to pick up or place the component under test 600. The component under test 600 includes a wafer under test 610 and a carrier 620 for supporting the wafer under test 610. The carrier 620 is, for example, a conductive material (including a metal material or a non-metallic but conductive material) with conductive properties and can be in the form of a thin sheet.

[0034] The carrier 200 has a plurality of notches 210 along its periphery. Each notch 210 is designed to receive the front end of a corresponding prong 720 of the support device 700. Specifically, when the carrier 200 is raised so that its upper surface contacts the lower surface of the carrier 620 of the device under test 600 to establish an electrical connection, each notch 210 of the carrier 200 precisely accommodates the front end of the corresponding prong 720. Consequently, when the carrier 200 is lowered, the device under test 600 remains supported by the support device 700.

[0035] In some embodiments, the carrier 200 has at least one protruding ear portion 220 disposed on the periphery thereof. The lower surface of the protruding ear portion 220 is provided for contact with the second connection module 412 to form an electrical connection.

[0036] exist Figure 4 and Figure 5 In the embodiment, the carrier 200 has four spaced-apart lugs 220 . The number of bridge assemblies 400 corresponds to the number of lugs 220 , also four. Each bridge assembly 400 corresponds to a lug 220 . When the electrical connection device 410 is lifted by the second lifting device 420 , the second connection module 412 of each bridge assembly 400 contacts the bottom surface of the corresponding lug 220 .

[0037] In some embodiments, each first connection module 411 can be connected to the probe card 500 ( Figure 4 The conductive sheet 520 (not shown) at the bottom Figure 4 Each second connection module 412 can be electrically connected to the bottom surface of the corresponding lug portion 220 through a plurality of second terminals protruding upward. Figure 4 In the illustrated embodiment, the first connection module 411 and the second connection module 412 are exemplified by pogo pins.

[0038] In summary, through the configuration and arrangement of the first lifting device and the bridge component, a short path from the carrier to the middle of the probe card is established through the bridge component, forming a bridge path between the component to be tested and the probe card, thereby providing a shorter signal transmission path. In addition, through the configuration of the first lifting device and the second lifting device, the carrier and the electrical connection device can be properly arranged in the wafer inspection equipment, forming a configuration relationship that can operate independently without mutual restraint, thereby ensuring the integrity and continuity of the test signal and greatly improving compatibility with existing equipment.

[0039] The present invention has disclosed preferred embodiments above. However, those skilled in the art will appreciate that the embodiments herein are intended only to illustrate the present invention and should not be construed as limiting the scope of the present invention. It should be noted that all variations and substitutions equivalent to the embodiments are intended to be encompassed within the scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the claims.

Explanation of symbols

[0040] 100 base 200 trays 210 notch 220 lug 300 First Lifting Device 400 Bridge Component 410 Electrical connection device 411 First Connection Module 412 Second connection module 420 Second lifting device 500 probe cards 510 Detection Department 520 conductive sheet 530 base plate 600 components under test 610 wafers to be tested 620 carrier 700 support device 710 vertical column 720 Teeth Z first axis X Second axis Y third axis.

Claims

1. A wafer inspection device comprising: a base movable in a first axial direction for raising or lowering a component under test to contact or distance from a probe card; A carrier plate, made of conductive material and used to selectively carry the component under test; a first lifting device, disposed on the base and bearing against the carrier, the first lifting device being used to raise or lower the carrier relative to the base in the first axial direction so as to contact or distance the carrier from the component under test accordingly; and At least one bridging component, the bridging component comprising: An electrical connection device having a first connection module and a second connection module electrically connected to each other; and A second lifting device is arranged on the base and supports the electrical connection device. The second lifting device is used to lift or lower the electrical connection device relative to the base in the first axial direction, so as to correspondingly make the first connection module contact or move away from the probe card, and correspondingly make the second connection module contact or move away from the carrier.

2. The wafer inspection device according to claim 1, wherein: When the first connection module contacts the probe card and the second connection module contacts the carrier, a bridge path is established between the DUT and the probe card.

3. The wafer inspection device according to claim 1, wherein: The component to be tested includes a wafer to be tested and a carrier for carrying the wafer to be tested.

4. The wafer inspection device according to claim 3, wherein: The carrier is a thin sheet of conductive material.

5. The wafer inspection device according to claim 1, wherein: The electrical connection device has a stepped portion at the top, and the stepped portion has a high portion and a low portion relative to the high portion. The first connection module is configured on the high portion, and the second connection module is configured on the low portion. When the second lifting device lifts the electrical connection device to allow the second connection module to contact the lower surface of the carrier, the first connection module protrudes from the upper surface of the carrier at the periphery of the carrier.

6. The wafer inspection device according to any one of claims 1 to 5, wherein: The carrier has at least one protruding ear portion disposed on the periphery thereof, and the lower surface of the protruding ear portion is used to provide contact for the second connection module.

7. The wafer inspection device according to claim 6, wherein: The carrier has a plurality of lug portions arranged at intervals, and the number of the bridging components corresponds to the number of the lug portions. Each of the bridging components corresponds to one lug portion, so that after the electrical connecting device is lifted by the second lifting device, the second connecting module of each bridging component contacts the corresponding lug portion.

8. The wafer inspection device according to claim 7, wherein: Each of the first connection modules is electrically connected to a conductive sheet at the bottom of the probe card through a plurality of first terminals protruding upward, and each of the second connection modules is electrically connected to the bottom surface of the corresponding lug portion through a plurality of second terminals protruding upward.

9. The wafer inspection device according to claim 8, wherein: Each of the first terminals and each of the second terminals is a spring probe.

10. The wafer inspection device according to claim 6, wherein: The carrier has a plurality of notches on its periphery, each notch being for a corresponding fork portion of a supporting device to extend into. The supporting device is fixed on the base, and when the carrier has not yet contacted the component to be tested, the fork portions of the two supporting devices support the component to be tested.

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