Wedge bonding tools, wire bonding systems, and related methods

Abstract

A wedge bonding tool is provided. The wedge bonding tool includes a body portion and a tip portion at an end of the body portion. The tip portion includes a groove surface defining a groove. The recess is configured to receive a wire during a wire bonding operation. The groove surface includes a plurality of laser scribed recesses.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Provisional Application No. 63 / 549,989, filed February 5, 2024, the contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to a wedge bonding tool and related methods for use in a wire bonding system. Background Art

[0004] In the assembly of electronic devices, wire bonding continues to be the primary method for providing electrical interconnection between two locations (e.g., between the die pad of a semiconductor die and the lead portion of a lead frame). More specifically, a wire bonding system (also referred to as a wire bonder) is used to form a wire loop between corresponding locations to be electrically interconnected. The primary methods for forming wire loops are ball bonding and wedge bonding. When forming a wire bond between (a) the end of a wire loop and (b) a bonding location (e.g., a die pad, a lead portion, etc.), different types of bonding energy can be used, including, for example, ultrasonic energy, thermosonic energy, thermocompression energy, etc. Wire bonding systems are also used to form conductive bumps from portions of the leads.

[0005] In wedge bonding applications, certain types of wire bonding tools are used. For example, wedge bonding tools that include grooves (e.g., U-shaped grooves, V-shaped grooves, etc.) may be used in certain applications (e.g., aluminum wire bonding applications, copper wire bonding applications, etc.). Such grooves may be used to couple the wedge bonding tool to the wire, thereby transferring tool tip motion from the wedge bonding tool to the wire during formation of the wire bond. U.S. Patent No. 8,820,609, entitled "WIREBONDING TOOL," assigned to Kulicke and Soffa Industries, Inc., illustrates an example of such a wedge bonding tool.

[0006] It is desirable to provide an improved wedge bonding tool including a wedge bonding tool defining a groove at a tip portion of the tool. Summary of the Invention

[0007] According to an exemplary embodiment of the present invention, a wedge bonding tool is provided. The wedge bonding tool includes a main body portion and a tip portion located at a distal end of the main body portion. The tip portion includes a groove surface defining a groove. The groove is configured to receive a wire during a wire bonding operation. The groove surface includes a plurality of laser-scribed recesses.

[0008] According to another exemplary embodiment of the present invention, another wedge bonding tool is provided. The wedge bonding tool includes a main body portion and a tip portion located at a distal end of the main body portion. The tip portion includes a groove surface defining a groove. The groove is configured to receive a wire during a wire bonding operation. The groove surface includes a plurality of laser-scribed recesses. The wedge bonding tool includes a coating applied to the groove surface.

[0009] According to another exemplary embodiment of the present invention, a wire bonding system is provided. The wire bonding system includes a bond head assembly, a support structure for supporting a workpiece, and a wedge bonding tool configured to be carried by the bond head assembly, wherein the wedge bonding tool has a body portion and a tip portion located at a distal end of the body portion, the tip portion including a groove surface defining a groove configured to receive a wire during a wire bonding operation, the groove surface including a plurality of laser-scribed recesses.

[0010] According to other embodiments of the present invention, the wedge bonding tool and wire bonding system described in the three immediately preceding paragraphs may have any one or more of the following features: a portion of the groove surface including the plurality of laser-scribed recesses has a surface texture having an average area roughness (AAR) of 0.03-1.5 μm. a ); a portion of the groove surface including the plurality of laser-scribed concave portions has a surface texture having an average area roughness (S) of 0.1-0.9 μm a ); a portion of the groove surface including the plurality of laser-scribed concave portions has a surface texture having an average area roughness (S) of 0.3-1.5 μm a); the end portion includes a carbide material; the end portion includes a cubic boron nitride material; a coating applied to the surface of the groove; the coating has a thickness of 0.5-10 μm; the coating has a thickness of 5-10 μm; the coating has a thickness of 1-5 μm; the coating has a thickness of 1-20 μm; the coating has a thickness of 10-20 μm; the coating includes a diamond-like carbon material and has a thickness of 0.5-5 μm; the coating includes a cubic boron nitride material and has a thickness of 10-100 μm; the coating includes a tetrahedralamorphous carbon material and has a thickness of 1-50 μm; the coating includes a cubic boron nitride material and has a thickness of 1-10 μm; the coating includes tetrahedral amorphous carbon (chromium nitride the coating layer comprises a titanium nitride material and has a thickness of 0.5-6 μm; the coating layer comprises a titanium nitride material and has a thickness of 1-10 μm; the coating layer comprises a chromium nitride material and has a thickness of 0.2-7 μm; the coating layer comprises a chromium nitride material and has a thickness of 1-15 μm; the depth of each of the plurality of laser-scribed recesses extends along an axis substantially perpendicular to the groove surface; the depth of each of the plurality of laser-scribed recesses is at least ten times greater than the width of each of the plurality of laser-scribed recesses; a portion of the groove surface including the plurality of laser-scribed recesses has a surface texture, wherein a plurality of peaks included in the portion of the groove surface each have a width of 2-50 μm; and the portion of the groove surface including the plurality of laser-scribed recesses has a first surface texture, and another portion of the groove surface has a second surface texture different from the first surface texture.

[0011] According to another exemplary embodiment of the present invention, a method for processing a wedge bonding tool is provided. The method includes the following steps: (a) providing a wedge bonding tool having a body portion and a tip portion located at a distal end of the body portion, the tip portion including a groove surface defining a groove configured to receive a wire during a wire bonding operation; and (b) forming a plurality of recesses in the groove surface using a laser beam, the laser beam contacting the groove surface orthogonally to the groove surface to form each of the plurality of recesses.

[0012] According to another exemplary embodiment of the present invention, another method for processing a wedge bonding tool is provided. The method includes the following steps: (a) providing a wedge bonding tool having a body portion and a tip portion at a distal end of the body portion, the tip portion including a groove surface defining a groove configured to receive a wire during a wire bonding operation; (b) forming a plurality of recesses in the groove surface using a laser beam; and (c) applying a coating to the groove surface.

[0013] According to other embodiments of the present invention, the method described in the two immediately preceding paragraphs may have any one or more of the following features: step (b) includes reflecting a laser beam by at least one optical element before contacting the groove surface; step (b) includes pulsing the laser beam while causing relative movement between the laser beam and the groove surface to form the plurality of recesses; step (b) includes pulsing the laser beam while causing the laser beam to move relative to the groove surface to form the plurality of recesses; step (b) includes forming the plurality of recesses to have a depth extending along an axis substantially perpendicular to the groove surface; step (b) includes forming the plurality of recesses to have a depth at least ten times greater than a width of each of the plurality of recesses; step (b) includes forming the plurality of recesses so that the groove surface including the plurality of recesses has a surface texture, wherein the plurality of peaks included in the portion of the groove surface each have a width of 2-50 μm; step (b) includes forming the plurality of recesses a plurality of recesses such that the recessed surface including the plurality of recesses has a first surface texture, and another portion of the recessed surface has a second surface texture different from the first surface texture; step (b) comprising pulsing the laser beam while moving the recessed surface relative to the laser beam to form the plurality of recesses; the recessed surface includes a first wall portion and a second wall portion, and step (b) comprises a sub-step (b1) of forming a first portion of the plurality of recesses in the first wall portion, and a sub-step (b2) of forming a second portion of the plurality of recesses in the second wall portion; step (b) comprises providing relative movement between the laser beam and the recessed surface after step (b1) and before step (b2) such that the second wall portion is perpendicular to the laser beam during step (b2); step (b) comprises forming the plurality of recesses such that the surface texture of a portion of the recessed surface including the plurality of recesses has an average area roughness (AAR) between 0.03 μm and 1.5 μm. a ); Step (b) comprises forming the plurality of recesses so that the surface texture of the groove surface including a portion of the plurality of recesses has an average area roughness (S) between 0.1 and 0.9 μm. a); Step (b) comprises forming the plurality of recesses so that the surface texture of the groove surface including a portion of the plurality of recesses has an average area roughness (S) between 0.3-1.5 μm a ); a step of forming a groove of a wedge bonding tool using a laser before step (a); a step (c) of applying a coating to the surface of the groove after step (b); step (c) comprising applying the coating by chemical vapor deposition; step (c) comprising applying the coating by physical vapor deposition; step (c) comprising applying the coating by thermal spraying; step (c) comprising applying the coating to a thickness of 0.5-10 μm; step (c) comprising applying the coating to a thickness of 5-10 μm; step (c) comprising applying the coating to a thickness of 1-5 μm; step (c) comprising applying the coating to a thickness of 1-20 μm; step (c) comprising applying the coating to a thickness of 10-20 μm; step (c) comprising applying a coating comprising a diamond-like carbon material to a thickness of 0.5-5 μm; step step (c) comprising applying the coating comprising cubic boron nitride material to a thickness of 10-100 μm; step (c) comprising applying the coating comprising cubic boron nitride material to a thickness of 1-50 μm; step (c) comprising applying the coating comprising cubic boron nitride material to a thickness of 1-10 μm; step (c) comprising applying the coating comprising tetrahedral amorphous carbon material to a thickness of 0.5-6 μm; step (c) comprising applying the coating comprising titanium nitride material to a thickness of 1-10 μm; step (c) comprising applying the coating comprising chromium nitride material to a thickness of 0.2-7 μm; step (c) comprising applying the coating comprising chromium nitride material to a thickness of 1-15 μm; and during step (b), the laser beam contacts the groove surface orthogonally to the groove surface to form each of the plurality of recesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention is best understood from the following detailed description when read in conjunction with the accompanying drawings. It is emphasized that, according to common practice, the various features of the drawings are not drawn to scale. Instead, the dimensions of the various components are arbitrarily expanded or reduced for the sake of clarity. The drawings include the following views:

[0015] Figure 1A to Figure 1B are front and side views of a wedge bonding tool for illustrating various exemplary embodiments of the present invention;

[0016] Figure 2A is a block diagram perspective end view of a tool blank for forming a wedge bonding tool according to an exemplary embodiment of the present invention;

[0017] Figure 2B Is to Figure 2Aa block diagram perspective end view of a wedge bonding tool after machining a tool blank;

[0018] Figure 2C According to an exemplary embodiment of the present invention Figure 2B a block diagram perspective end view of a wedge bonding tool after forming a plurality of recesses in a groove surface;

[0019] Figure 2D According to an exemplary embodiment of the present invention Figures 2B to 2C a block diagram side view of a wedge bonding tool after a coating has been applied thereto;

[0020] Figures 3A to 3D is a series of block diagrams illustrating a method of forming a plurality of recesses in a groove surface of a wedge bonding tool according to an exemplary embodiment of the present invention;

[0021] Figures 4A to 4C is a series of block diagrams illustrating another method of forming a plurality of recesses in a groove surface of a wedge bonding tool according to another exemplary embodiment of the present invention;

[0022] Figures 5A to 5C is a series of block diagrams illustrating yet another method of forming a plurality of recesses in a groove surface of a wedge bonding tool according to another exemplary embodiment of the present invention;

[0023] Figures 6A to 6B is a block diagram perspective end view of a wedge bonding tool showing various patterns of recesses in a groove surface of the wedge bonding tool according to various exemplary embodiments of the present invention;

[0024] Figure 7 is a block diagram illustrating a wire bonding system according to an exemplary embodiment of the present invention; and

[0025] Figure 8 is a flow chart illustrating a method of processing a wedge bonding tool according to an exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0026] According to various exemplary embodiments of the present invention, a groove surface of a wedge bonding tool (e.g., a wedge bonding tool configured for bonding copper wires, a wedge bonding tool configured for bonding aluminum wires, etc.) is textured using a laser beam (e.g., by laser micromachining). After texturing, a coating (e.g., a low-friction coating) may be applied to the groove surface.

[0027] Texturing and / or applying a coating can provide: improved wedge bond tool performance; improved wedge bond tool wear resistance; improved coupling between the wedge bond tool and the wire; and / or improved ability to form wire bonds on sensitive surfaces. While the present invention is applicable to a variety of wire (conductor) types and wire (conductor) materials, aspects of the present invention are particularly applicable to copper wire bonding and / or aluminum wire bonding.

[0028] According to various exemplary embodiments of the present invention, laser machining (eg, laser micromachining) may be accomplished using a laser machining system that includes five-axis machining capabilities.

[0029] Laser texturing of the groove surface can enhance energy transfer from the wedge bonding tool to the wire (and the substrate to which the wire is being bonded). Certain exemplary laser processing techniques may be referred to as "blasting." The blast density and laser parameters may be selected to achieve a surface morphology suitable for a particular wire bonding application.

[0030] Applying a coating (e.g., a low-friction coating) to the groove surface can reduce damage to the substrate's bonding surface (e.g., die pad) during debonding after forming wire bonds. Certain coatings can be used to: reduce stiction between the groove surface of a wedge bonding tool and the wire; reduce debris generation during wire bonding; and / or reduce tool wear.

[0031] Examples of coatings (e.g., low-friction coatings) that can be applied to the groove surface (and / or other portions of the wedge bonding tool) include, but are not limited to, diamond-like carbon (DLC) materials (with or without an interlayer such as Cr), cubic boron nitride (c-BN) materials, tetrahedral amorphous carbon (ta-C) materials (with or without an interlayer such as Cr), titanium nitride (TiN) materials, and / or chromium nitride (CrN) materials. The coating can be applied to any desired portion of the wedge bonding tool, such as the groove surface, the tip portion of the wedge bonding tool including the groove surface, and / or the entire wedge bonding tool. The coating can be applied using techniques such as chemical vapor deposition (CVD), physical vapor deposition (PVD), thermal spraying, and the like.

[0032] Figure 1A to Figure 1B A wedge bonding tool 100 is shown that includes a body portion 102 and a tip portion 104 at the distal end of the body portion 102. The tip portion 104 includes a groove surface 106 (described in greater detail herein). The groove surface 106 defines a groove 108. Figure 1A is a front view of the wedge bonding tool 100, and Figure 1B1 is a side view of a wedge bonding tool 100. The wedge bonding tool 100 is used to bond a wire to a bonding location in a wire bonding system. More specifically, the groove 108 is configured to receive the wire during a wire bonding operation on the wire bonding system. The primary difference between conventional wedge bonding tools and certain wedge bonding tools described herein relates to the tip portion 104, and more specifically, the groove surface 106. The wedge bonding tools described below (i.e., wedge bonding tools 100a, 100b, 100c, 100d, 100e, and 100f) each represent a different embodiment of the present invention. Similar components are represented by similar reference numerals (e.g., in each embodiment, the tip portion 104 may be represented as 104a, 104b, etc., all of which refer to different exemplary tip portions).

[0033] Details of various examples of wedge bonding tools 100 including a body portion 102 (including various tip portions 104) are provided in the accompanying drawings. Figures 2B to 2D (wherein the wedge bonding tool 100a includes a tip portion 104a), Figures 3A to 3D (wherein the wedge bonding tool 100b includes a tip portion 104b), Figures 4A to 4C (wherein the wedge bonding tool 100c includes a tip portion 104c), Figures 5A to 5C (wherein the wedge bonding tool 100d includes a tip portion 104d), Figure 6A (wherein the wedge bonding tool 100e includes a tip portion 104e) and Figure 6B (wherein the wedge bonding tool 100f includes the tip portion 104f).

[0034] Figures 2A to 2D An exemplary formation and processing of a wedge bonding tool 100a is shown. Figure 2A A tool blank 10 is shown that is configured to be machined (e.g., laser machined) or otherwise transformed into a wedge bonding tool. The tool blank 10 can be formed from any desired material, such as a carbide material. For example, a laser system can be used to remove material from the tool blank 10 to form the grooves. Alternatively, the tool blank 10 can include a body portion and be configured to be joined to a tip portion (e.g., via brazing, welding, adhesives, etc.). Figure 2B The tip portion 104a of the wedge bonding tool 100a is shown after a machining process removes material to create a groove surface 106a in the tip portion 104a. The groove surface 106a defines a groove 108a. The groove surface 106a includes an apex 104a2 (i.e., the "peak" of the groove surface, which may be "U"-shaped, "V"-shaped, etc.). The tip portion 104a includes two legs 104a1 at the end of the tip portion 104a.

[0035] Figure 2C FIG. 1 shows the tip portion 104a after a plurality of laser scribed recesses 106a1 have been formed on the groove surface 106a (due to the inclusion of the laser scribed recesses, the groove surface 106a is now Figure 2C denoted as groove surface 106a'). Although Figure 2C Only one wall of the groove surface including the laser-scribed recess is shown, but it should be understood that such a laser-scribed recess can be formed on any portion of the groove surface (e.g., the vertex 104a2) and / or the end portion (e.g., the foot portion 104a1 of the end portion) as desired.

[0036] Figure 2D The tip portion 104a is shown after a coating 120 has been applied to the tip portion 104a (including the grooved surface 106a' having the plurality of laser-scored recesses 106a1, the apex 104a2, each of the legs 104a1, and the outer surface of the tip portion 104a. Figure 2D The coating is shown as being applied after the plurality of laser-scribed recesses 106a1 have been formed, but the invention is not limited thereto, as it is contemplated that the coating 120 could be applied to the groove surface 106a (i.e., a groove surface without laser-scribed recesses, or a groove surface before laser-scribed recesses are formed) without departing from the scope of the invention.

[0037] like Figure 2D As shown, the coating 120 has a thickness t. Exemplary ranges of thickness t include: 0.5-10 μm, 5-10 μm, 1-5 μm, 1-20 μm, and 10-20 μm. In exemplary embodiments of the present invention, the thickness t may depend on the type of coating. For example, a diamond-like carbon (DLC) coating may have an exemplary thickness of 0.5-5 μm; a cubic boron nitride (c-BN) coating may have an exemplary thickness of 10-100 μm, 1-50 μm, or 1-10 μm; a tetrahedral amorphous carbon (ta-C) coating may have an exemplary thickness of 0.5-6 μm; a titanium nitride (TiN) coating may have an exemplary thickness of 1-10 μm; and a chromium nitride (CrN) coating may have an exemplary thickness of 0.2-7 μm or 1-15 μm.

[0038] although Figure 2D The coating is shown as being applied to the entire tip portion 104a, but the present invention is not limited thereto. For example, the coating may be applied to selected portions of the tip portion 104a (e.g., all or a portion of the groove surface 106a, each leg portion 104a1, the outer surface of the tip portion 104a, etc.) as desired.

[0039] although Figures 2A to 2D Shows aspects of the overview of the invention, but Figures 3A to 3D 、 Figures 4A to 4C 、 Figures 5A to 5C as well as Figures 6A to 6B More specifically, Figure 2B and Figure 2C In the step between, a plurality of laser-scribed recesses are formed. Figures 3A to 3D , the tip portion 104b of the wedge bonding tool 100b is shown in a laser processing system 310 at the time of initiating the formation of a laser-scribed recess. The laser processing system 310 includes an optical element 312 and a laser source 314. Figures 3A to 3D Throughout the process shown, the laser source 314 and the optical element 312 are fixed in place.

[0040] exist Figure 3A , laser source 314 emits laser beam 314a toward optical element 312. Optical element 312 reflects and / or focuses laser beam 314a toward first wall portion 106b1 of groove surface 106b of tip portion 104b. Laser beam 314a contacts first wall portion 106b1 perpendicular to (i.e., perpendicular to) groove surface 106b. Laser beam 314a removes material from first wall portion 106b1 to create a recess. Because laser beam 314a strikes first wall portion 106b1 at a right angle, the recess has a depth that extends along an axis substantially perpendicular to first wall portion 106b1.

[0041] exist Figure 3B , the end portion 104b has been moved to the left, as indicated by the arrow. The laser source 314 and the optical element 312 remain stationary, thereby enabling relative movement between the laser beam 314a and the groove surface 106b. During the movement, the laser source 314 continues to emit the laser beam 314a in pulses, wherein each pulse generates another laser-scribed recess in the first wall portion 106b1, thereby generating a plurality of laser-scribed recesses in the first wall portion 106b1. Figure 3C , the head portion 104b has been moved (e.g., rotated 180°) so that the laser beam 314a is now incident on the second wall portion 106b2. Figure 3D , the end portion 104b has been moved to the right, as indicated by the arrow. During the movement, the laser source 314 continues to emit the laser beam 314a in pulses, wherein each pulse generates a recess, thereby generating a plurality of laser-scribed recesses in the second wall portion 106b2.

[0042] although Figures 3A to 3D A single optical element (ie, optical element 312) is shown, but the invention is not limited thereto. An exemplary laser processing system may include multiple optical elements (eg, see Figures 5A to 5C), including mirrors and / or lenses for controlling the laser beam (e.g., reflecting, focusing, etc.). Similarly, the laser processing system may not include optical elements at all (e.g., see Figures 4A to 4C ). Furthermore, the present invention is not limited to keeping the laser source and / or optical elements stationary, as further described below.

[0043] For example, Figures 4A to 4C A laser processing system 410 including a laser source 414 is shown. The laser source 414 is used to form a plurality of recesses on the groove surface 106c of the tip portion 104c of the wedge bonding tool 100c. Figure 4A In FIG. 4 , the laser source 414 is aligned so that the laser beam 414a will contact the groove surface 106c orthogonally (ie, perpendicularly) to the groove surface 106c when emitted from the laser source 414. Figure 4A 1. In FIG. 1, laser beam 414a is shown emitting a laser beam 414a to form a recess in groove surface 106c. Because laser beam 414a strikes groove surface 106c at a right angle, the recess has a depth extending along an axis that is substantially perpendicular to groove surface 106c.

[0044] exist Figure 4B , the laser source 414 has been moved (e.g., diagonally) so that the laser beam 414a contacts another portion of the groove surface 106c. Figure 4A and Figure 4B Between the illustrated positions, the laser source 414 continues to emit the laser beam 414a in pulses during movement, wherein each pulse creates another laser-scribed recess in the groove surface 106c, thereby creating a plurality of laser-scribed recesses in the groove surface 106c.

[0045] exist Figure 4C In FIG, the laser source 414 has been continuously moved to complete the processing of the groove surface 106c. Figures 4A to 4C Throughout the process shown, the laser source 414 is aligned so that the laser beam 414a contacts the groove surface 106c orthogonally to the groove surface 106c. In some embodiments, the entire groove surface 106c includes a plurality of laser-scribed recesses, but the invention is not limited thereto and only a portion of the groove surface may include laser-scribed recesses.

[0046] Figures 5A to 5C Another laser processing system 510 is shown. The laser processing system 510 includes a laser source 514 and optical elements 512 and 513. The laser source 514 is configured to emit a laser beam 514a. Figure 5A, the laser source 514 is emitting a laser beam 514a toward the optical element 512. The optical element 512 is aligned so that it reflects the laser beam 514a so that the laser beam 514a contacts the groove surface 106d (of the tip portion 104d of the wedge bonding tool 100d) orthogonally (i.e., perpendicular to the groove surface 106d). Figure 5B , the optical element 512 has been moved (e.g., upward) to direct the laser beam 514a to a different location on the groove surface 106d. Figure 5A and Figure 5B During this time, the optical element 512 continues to move, as indicated by the arrows, and the laser source 514 pulses the laser beam 514a to generate a plurality of laser-scribed recesses in the groove surface 106d. Figure 5C , optical element 512 has been moved (eg, rotated) to reflect laser beam 514a toward optical element 513. Optical element 513 reflects laser beam 514a toward different portions of groove surface 106d.

[0047] although Figures 3A to 3D 、 Figures 4A to 4C as well as Figures 5A to 5C Only one element of the laser processing system is shown in motion, but the invention is not limited thereto. It is also within the scope of the invention that multiple elements of the laser processing machine are movable to produce relative motion between the groove surface and the laser beam (e.g., where the optical elements and the laser source are in motion).

[0048] Figures 3A to 3D 、 Figures 4A to 4C and Figures 5A to 5C A two-dimensional block diagram of the laser scribing process is shown. To more clearly illustrate aspects of the present invention, Figure 6A and Figure 6B Perspective views of wedge bonding tools 100e and 100f are shown. Figure 6A The laser source 614 and the tip portion 104e of the wedge bonding tool 100e are shown. The laser source 614 is emitting a laser beam 614a toward the groove surface 106e of the tip portion 104e. The laser beam 614a contacts the groove surface 106e orthogonally (i.e., perpendicularly) to the groove surface 106e. A motion profile 600 is shown on the groove surface 106e. At least one of the laser source 614, the tip portion 104e, and the optical system (not shown) is moved to achieve relative motion between the laser beam 614a and the groove surface 106e (e.g., as shown in FIG. 1 ). Figures 3A to 3D 、 Figures 4A to 4C and Figures 5A to 5CAs described in any of the foregoing, the laser 614 emits a laser beam 614a in pulses while emitting relative motion, wherein each pulse creates a laser-scribed recess in the groove surface 106e. Since the laser beam 614a strikes the groove surface 106e at a right angle, each recess has a depth extending along an axis substantially perpendicular to the groove surface 106e. Figure 6A As shown, the motion (eg, of the laser beam 614a along the groove surface 106e) is a predetermined motion profile, but the present invention is not limited thereto. Figure 6B As shown, a motion profile 602 is implemented on the grooved surface 106f of the tip portion 104f. The motion profile 602 is random (or pseudo-random).

[0049] Various methods described herein produce a wedge-shaped bonding tool having a plurality of laser-scribed recesses on at least a portion of the groove surface. The portion of the groove surface including the plurality of laser-scribed recesses has a surface texture. According to an exemplary embodiment of the present invention, the surface texture may have a mean area roughness (S a ). Average area roughness (S a ) are 0.03-1.5 μm, 0.1-0.9 μm, and 0.3-1.5 μm. Specific embodiments may have different S a For example, a wedge bonding tool including a cubic boron nitride (c-BN) tip portion may have an exemplary S range of 0.1-0.9 μm, 0.3-1.5 μm, or 0.4-1.5 μm. a Wedge bonding tools including carbide (eg, tungsten carbide) tips may have exemplary S values of 0.03-0.15 μm, 0.1-0.9 μm, 0.3-1.5 μm, or 0.4-1.5 μm. a Specific tools can be selected for specific applications. a The average area roughness (S a The recess may have a depth that is, for example, at least ten times greater than its width / diameter.

[0050] In conjunction with various aspects of the present invention, material is typically removed from the groove surface to form a plurality of laser-scribed recesses. This material removal results in a plurality of "peaks" in the surface texture of the groove surface. For example, each of the plurality of peaks included in the groove surface may have a width of 2-50 μm. The combination of the plurality of laser-scribed recesses and the resulting plurality of peaks can be considered to define the surface texture of the treated area of the groove surface.

[0051] Although aspects of the present invention have been described as having a single surface texture, the present invention is not limited thereto. It is contemplated that a wedge bonding tool may have a portion of the groove surface having a first surface texture and another portion of the groove surface having a second surface texture that is different from the first surface texture (e.g., the first surface texture has a different average area roughness than the second surface texture, etc.).

[0052] The wedge bonding tools described herein, or other tools within the scope of the present invention, may be used in conjunction with wire bonding operations on a wire bonding system. Figure 7 An exemplary wire bonding system 710 is shown. The wire bonding system 710 includes a bond head assembly 712 and a support structure 720. The support structure 720 is shown supporting a workpiece 110 (e.g., a semiconductor component, a die, etc.). The bond head assembly 712 includes a transducer 714 configured to receive a wedge bonding tool 100 (e.g., any of wedge bonding tools 100a, 100b, 100c, 100d, 100e, 100f, or any other wedge bonding tool within the scope of the present invention). The wedge bonding tool 100 is configured to be carried by the bond head assembly 712, wherein the wedge bonding tool 100 includes a body portion 102 and a head portion 104 at a distal end of the body portion 102. The tip portion 104 includes a groove surface 106 defining a groove 108 configured to receive a wire during a wire bonding operation, and the groove surface 106 includes a plurality of laser-scribed recesses (not shown). As described above, each of the laser-scribed recesses has a depth extending along an axis substantially perpendicular to the groove surface 106.

[0053] Combine Figures 2A to 2D 、 Figures 3A to 3D 、 Figures 4A to 4C 、 Figures 5A to 5C and Figures 6A to 6B The method of forming a wedge bonding tool as described in Figure 8 As will be appreciated by those skilled in the art, certain steps included in the flowchart may be omitted; certain additional steps may be added; and the order of the steps may be changed from the order shown within the scope of the present invention.

[0054] Now refer to Figure 8 At optional step 800, a groove is formed at the end portion of the tool blank using a laser (e.g., see Figures 2A to 2B). In step 802, a wedge bonding tool is provided, or if step 800 is performed, a wedge bonding tool from step 800 is provided. The provided wedge bonding tool, whether from step 800 or otherwise, has a body portion and a tip portion at a distal end of the body portion. The tip portion includes a groove surface defining a groove, and the groove is configured to receive a wire during a wire bonding operation. At step 804, a plurality of recesses are formed in the groove surface using a laser beam (e.g., see Figures 2A to 2D 、 Figures 3A to 3D 、 Figures 4A to 4C 、 Figures 5A to 5C and Figures 6A to 6B In step 804, a laser beam contacts the groove surface perpendicular to the groove surface to form each of the plurality of recesses; however, it should be understood that according to certain embodiments of the present invention, the laser beam may contact the groove surface at a different angle. At optional step 806, after step 804, a coating (e.g., a low-friction coating, a wear-resistant coating, etc.) is applied to the groove surface.

[0055] Laser systems can be used in conjunction with the present invention to form a plurality of recesses in the groove surface in many different ways. For example, laser parameters can be selected based on a number of variables, such as the material of the tip portion of the wedge bonding tool, the desired depth / size of each recess, etc. Examples of such laser parameters include, for example, pulse frequency, pulse duration, amplitude, wavelength, etc. The specific laser parameters used to form a given plurality of recesses in a particular wedge bonding tool can be considered a laser recipe. As will be appreciated by those skilled in the art, a number of different laser recipes can be used in conjunction with the treatment of the groove surface of the wedge bonding tool to achieve a desired surface texture.

[0056] Aspects of the present invention are described with respect to a wedge bonding tool comprising (i) a main body portion and (ii) a tip portion located at a distal end of the main body portion. As will be appreciated by those skilled in the art, such a wedge bonding tool can be formed from a single piece of material (e.g., a carbide material such as tungsten carbide) or multiple pieces of material. For example, the multiple pieces of material can include a main body portion formed from a first material (e.g., a carbide material such as tungsten carbide) and a tip portion formed from a second material (e.g., cubic boron nitride or any other suitable material). In such an example, the tip portion can be coupled to the main body portion using any desired technique (e.g., brazing).

[0057] While the invention has been shown and described herein with reference to specific embodiments, the invention is not intended to be limited to the details shown. Rather, various modifications may be made in the details within the range and range of equivalents of the claims without departing from the invention.

Claims

1. A wedge bonding tool, characterized in that: The wedge bonding tool comprises: the main body; and a tip portion located at the end of the main body portion, The tip portion includes a recessed surface defining a recess configured to receive a wire during a wire bonding operation, Wherein, the groove surface includes a plurality of laser-scribed concave portions.

2. The wedge bonding tool according to claim 1, characterized in that A portion of the groove surface including the plurality of laser-scribed concave portions has a surface texture having an average area roughness (S) of 0.03-1.5 μm. a ).

3. The wedge bonding tool according to claim 1, wherein: A portion of the groove surface including the plurality of laser-scribed concave portions has a surface texture having an average area roughness (S) of 0.1-0.9 μm. a ).

4. The wedge bonding tool according to claim 1, wherein A portion of the groove surface including the plurality of laser-scribed concave portions has a surface texture having an average area roughness (S) of 0.3-1.5 μm. a ).

5. The wedge bonding tool according to claim 1, wherein The tip portion includes a carbide material.

6. The wedge bonding tool according to claim 1, wherein: The tip portion includes cubic boron nitride material.

7. The wedge bonding tool according to claim 1, wherein: The wedge bonding tool also includes a coating applied to the groove surface.

8. The wedge bonding tool according to claim 7, characterized in that The coating has a thickness of 0.5-10 μm.

9. The wedge bonding tool according to claim 7, wherein: The coating has a thickness of 5-10 μm.

10. The wedge bonding tool according to claim 7, wherein: The coating has a thickness of 1-5 μm.

11. The wedge bonding tool according to claim 7, wherein: The coating has a thickness of 1-20 μm.

12. The wedge bonding tool according to claim 7, wherein: The coating has a thickness of 10-20 μm.

13. The wedge bonding tool according to claim 7, wherein: The coating includes a diamond-like carbon material and has a thickness of 0.5-5 μm.

14. The wedge bonding tool according to claim 7, wherein: The coating comprises cubic boron nitride material and has a thickness of 10-100 μm.

15. The wedge bonding tool according to claim 7, wherein The coating comprises a cubic boron nitride material and has a thickness of 1-50 μm.

16. The wedge bonding tool according to claim 7, wherein: The coating comprises a cubic boron nitride material and has a thickness of 1-10 μm.

17. The wedge bonding tool according to claim 7, wherein: The coating layer includes a tetrahedral amorphous carbon material and has a thickness of 0.5-6 μm.

18. The wedge bonding tool according to claim 7, wherein: The coating layer includes a titanium nitride material and has a thickness of 1-10 μm.

19. The wedge bonding tool according to claim 7, wherein: The coating includes a chromium nitride material and has a thickness of 0.2-7 μm.

20. The wedge bonding tool according to claim 7, wherein The coating includes a chromium nitride material and has a thickness of 1-15 μm.

21. The wedge bonding tool according to claim 1, wherein A depth of each of the plurality of laser-scribed recesses extends along an axis that is substantially perpendicular to the groove surface.

22. The wedge bonding tool according to claim 1, wherein A depth of each of the plurality of laser-scribed recesses is at least ten times greater than a width of each of the plurality of laser-scribed recesses.

23. The wedge bonding tool according to claim 1, wherein A portion of the groove surface including the plurality of laser-scribed concave portions has a surface texture, wherein a plurality of peaks included in the portion of the groove surface each have a width of 2-50 μm.

24. The wedge bonding tool according to claim 1, wherein A portion of the groove surface including the plurality of laser-scribed concavities has a first surface texture, and another portion of the groove surface has a second surface texture different from the first surface texture.

25. A wedge bonding tool, characterized in that: The wedge bonding tool comprises: Main body; a tip portion at a distal end of the body portion, the tip portion including a recessed surface defining a recess configured to receive a wire during a wire bonding operation, the recessed surface including a plurality of laser-scribed recesses; and A coating is applied to the groove surface.

26. The wedge bonding tool according to claim 25, wherein A portion of the groove surface including the plurality of laser-scribed concave portions has a surface texture having an average area roughness (S) of 0.03-1.5 μm. a ).

27. The wedge bonding tool according to claim 25, wherein: A portion of the groove surface including the plurality of laser-scribed concave portions has a surface texture having an average area roughness (S) of 0.1-0.9 μm. a ).

28. The wedge bonding tool according to claim 25, wherein A portion of the groove surface including the plurality of laser-scribed concave portions has a surface texture having an average area roughness (S) of 0.3-1.5 μm. a ).

29. The wedge bonding tool according to claim 25, wherein The tip portion includes a carbide material.

30. The wedge bonding tool according to claim 25, wherein: The tip portion includes cubic boron nitride material.

31. The wedge bonding tool according to claim 25, wherein A depth of each of the plurality of laser-scribed recesses extends along an axis that is substantially perpendicular to the groove surface.

32. The wedge bonding tool according to claim 25, wherein: A depth of each of the plurality of laser-scribed recesses is at least ten times greater than a width of each of the plurality of laser-scribed recesses.

33. The wedge bonding tool according to claim 25, wherein: A portion of the groove surface including the plurality of laser-scribed concave portions has a surface texture, wherein a plurality of peaks included in the portion of the groove surface each have a width of 2-50 μm.

34. The wedge bonding tool according to claim 25, wherein: A portion of the groove surface including the plurality of laser-scribed concavities has a first surface texture, and another portion of the groove surface has a second surface texture different from the first surface texture.

35. A wire bonding system, characterized in that: The wire bonding system comprises: bond head assembly; a support structure for supporting the workpiece; and A wedge bonding tool is configured to be carried by the bond head assembly, wherein the wedge bonding tool has a body portion and a tip portion located at a distal end of the body portion, the tip portion including a groove surface defining a groove, the groove being configured to receive a wire during a wire bonding operation, the groove surface including a plurality of laser-scribed recesses.

36. The wire bonding system according to claim 35, wherein: A portion of the groove surface including the plurality of laser-scribed concave portions has a surface texture having an average area roughness (S) of 0.03-1.5 μm. a ).

37. The wire bonding system according to claim 35, wherein: A portion of the groove surface including the plurality of laser-scribed concave portions has a surface texture having an average area roughness (S) of 0.1-0.9 μm. a ).

38. The wire bonding system according to claim 35, wherein: A portion of the groove surface including the plurality of laser-scribed concave portions has a surface texture having an average area roughness (S) of 0.3-1.5 μm. a ).

39. The wire bonding system according to claim 35, wherein: The tip portion includes a carbide material.

40. The wire bonding system according to claim 35, wherein The tip portion includes cubic boron nitride material.

41. The wire bonding system according to claim 35, wherein: The wire bonding system also includes a coating applied to a surface of the recess.

42. The wire bonding system according to claim 41, wherein: The coating has a thickness of 0.5-10 μm.

43. The wire bonding system according to claim 41, wherein: The coating has a thickness of 5-10 μm.

44. The wire bonding system according to claim 41, wherein: The coating has a thickness of 1-5 μm.

45. The wire bonding system according to claim 41, wherein The coating has a thickness of 1-20 μm.

46. The wire bonding system according to claim 41, wherein The coating has a thickness of 10-20 μm.

47. The wire bonding system according to claim 41, wherein: The coating includes a diamond-like carbon material and has a thickness of 0.5-5 μm.

48. The wire bonding system of claim 41, wherein: The coating comprises cubic boron nitride material and has a thickness of 10-100 μm.

49. The wire bonding system of claim 41, wherein: The coating comprises a cubic boron nitride material and has a thickness of 1-50 μm.

50. The wire bonding system according to claim 41, wherein The coating comprises a cubic boron nitride material and has a thickness of 1-10 μm.

51. The wire bonding system according to claim 41, wherein: The coating layer includes a tetrahedral amorphous carbon material and has a thickness of 0.5-6 μm.

52. The wire bonding system according to claim 41, wherein: The coating layer includes a titanium nitride material and has a thickness of 1-10 μm.

53. The wire bonding system according to claim 41, wherein: The coating includes a chromium nitride material and has a thickness of 0.2-7 μm.

54. The wire bonding system of claim 41, wherein: The coating includes a chromium nitride material and has a thickness of 1-15 μm.

55. The wire bonding system of claim 35, wherein: A depth of each of the plurality of laser-scribed recesses extends along an axis that is substantially perpendicular to the groove surface.

56. The wire bonding system of claim 35, wherein: A depth of each of the plurality of laser-scribed recesses is at least ten times greater than a width of each of the plurality of laser-scribed recesses.

57. The wire bonding system of claim 35, wherein: A portion of the groove surface including the plurality of laser-scribed concave portions has a surface texture, wherein a plurality of peaks included in the portion of the groove surface each have a width of 2-50 μm.

58. The wire bonding system of claim 35, wherein: A portion of the groove surface including the plurality of laser-scribed concavities has a first surface texture, and another portion of the groove surface has a second surface texture different from the first surface texture.

59. A method of processing a wedge bonding tool, the method comprising the steps of: (a) providing a wedge bonding tool having a body portion and a tip portion at a distal end of the body portion, the tip portion including a groove surface defining a groove configured to receive a wire during a wire bonding operation; as well as (b) forming a plurality of recesses in the groove surface using a laser beam, the laser beam contacting the groove surface orthogonally to the groove surface to form each of the plurality of recesses.

60. The method according to claim 59, wherein Step (b) includes reflecting the laser beam through at least one optical element before contacting the groove surface.

61. The method according to claim 59, wherein Step (b) includes pulsing the laser beam while causing relative movement between the laser beam and the groove surface to form the plurality of grooves.

62. The method according to claim 59, wherein Step (b) includes pulsing the laser beam while moving the laser beam relative to the groove surface to form the plurality of recesses.

63. The method according to claim 59, wherein Step (b) includes forming the plurality of recesses to have a depth extending along an axis substantially perpendicular to the groove surface.

64. The method according to claim 59, wherein Step (b) includes forming the plurality of grooves to have a depth at least ten times greater than a width of each of the plurality of grooves.

65. The method according to claim 59, wherein Step (b) includes forming the plurality of recesses so that the groove surface including the plurality of recesses has a surface texture, wherein a plurality of peaks included in the portion of the groove surface each have a width of 2-50 μm.

66. The method according to claim 59, wherein Step (b) includes forming the plurality of recesses so that a surface of the groove including the plurality of recesses has a first surface texture, and another portion of the surface of the groove has a second surface texture different from the first surface texture.

67. The method according to claim 59, wherein Step (b) includes pulsing the laser beam while moving the groove surface relative to the laser beam to form the plurality of recesses.

68. The method according to claim 59, wherein The groove surface includes a first wall portion and a second wall portion, and step (b) includes a sub-step (b1) of forming a first portion of the plurality of recesses in the first wall portion, and a sub-step (b2) of forming a second portion of the plurality of recesses in the second wall portion.

69. The method according to claim 68, characterized in that Step (b) comprises providing relative movement between the laser beam and the groove surface after step (b1) and before step (b2) such that the second wall portion is perpendicular to the laser beam during step (b2).

70. The method according to claim 59, wherein Step (b) includes forming the plurality of recesses so that the surface texture of a portion of the groove surface including the plurality of recesses has an average area roughness (S) between 0.03 and 1.5 μm. a ).

71. The method according to claim 59, wherein Step (b) includes forming the plurality of recesses so that the surface texture of a portion of the groove surface including the plurality of recesses has an average area roughness (S) between 0.1 and 0.9 μm. a ).

72. The method according to claim 59, wherein Step (b) includes forming the plurality of recesses so that the surface texture of a portion of the groove surface including the plurality of recesses has an average area roughness (S) between 0.3 and 1.5 μm. a ).

73. The method according to claim 59, characterized in that The method further includes the step of forming the groove of the wedge bonding tool using a laser before step (a).

74. The method according to claim 59, wherein The method further comprises the step (c) of applying a coating to the surface of the groove after step (b).

75. The method according to claim 74, characterized in that Step (c) comprises applying the coating by chemical vapor deposition.

76. The method according to claim 74, characterized in that Step (c) comprises applying the coating by physical vapor deposition.

77. The method according to claim 74, characterized in that Step (c) comprises applying the coating by thermal spraying.

78. The method according to claim 74, characterized in that Step (c) comprises applying the coating to a thickness of 0.5-10 μm.

79. The method according to claim 74, wherein Step (c) comprises applying the coating to a thickness of 5-10 μm.

80. The method of claim 74, wherein: Step (c) comprises applying the coating to a thickness of 1-5 μm.

81. The method of claim 74, wherein: Step (c) comprises applying the coating to a thickness of 1-20 μm.

82. The method of claim 74, wherein: Step (c) comprises applying the coating to a thickness of 10-20 μm.

83. The method according to claim 74, wherein Step (c) comprises applying said coating comprising diamond-like carbon material to a thickness of 0.5-5 μm.

84. The method of claim 74, wherein: Step (c) comprises applying said coating comprising cubic boron nitride material to a thickness of 10-100 μm.

85. The method of claim 74, wherein: Step (c) comprises applying said coating comprising cubic boron nitride material to a thickness of 1-50 μm.

86. The method of claim 74, wherein: Step (c) comprises applying said coating comprising cubic boron nitride material to a thickness of 1-10 μm.

87. The method of claim 74, wherein: Step (c) comprises applying said coating comprising tetrahedral amorphous carbon material to a thickness of 0.5-6 μm.

88. The method of claim 74, wherein: Step (c) comprises applying said coating comprising titanium nitride material to a thickness of 1-10 μm.

89. The method of claim 74, wherein: Step (c) comprises applying said coating comprising chromium nitride material to a thickness of 0.2-7 μm.

90. The method of claim 74, wherein: Step (c) comprises applying said coating comprising chromium nitride material to a thickness of 1-15 μm.

91. A method of processing a wedge bonding tool, the method comprising the steps of: (a) providing a wedge bonding tool having a body portion and a tip portion at a distal end of the body portion, the tip portion including a groove surface defining a groove configured to receive a wire during a wire bonding operation; (b) forming a plurality of recesses in the groove surface using a laser beam; as well as (c) applying a coating to the groove surface.

92. The method according to claim 91, wherein Step (b) includes reflecting the laser beam through at least one optical element before contacting the groove surface.

93. The method according to claim 91, wherein Step (b) includes pulsing the laser beam while causing relative movement between the laser beam and the groove surface to form the plurality of grooves.

94. The method according to claim 91, wherein Step (b) includes pulsing the laser beam while moving the laser beam relative to the groove surface to form the plurality of recesses.

95. The method according to claim 91, wherein Step (b) includes forming the plurality of recesses to have a depth extending along an axis substantially perpendicular to the groove surface.

96. The method according to claim 91, characterized in that Step (b) includes forming the plurality of recesses to have a depth at least ten times greater than a width of each of the plurality of recesses.

97. The method according to claim 91, wherein Step (b) includes forming the plurality of recesses so that the groove surface including the plurality of recesses has a surface texture, wherein a plurality of peaks included in the portion of the groove surface each have a width of 2-50 μm.

98. The method according to claim 91, characterized in that Step (b) includes forming the plurality of recesses so that a surface of the groove including the plurality of recesses has a first surface texture, and another portion of the surface of the groove has a second surface texture different from the first surface texture.

99. The method according to claim 91, characterized in that Step (b) includes pulsing the laser beam while moving the groove surface relative to the laser beam to form the plurality of recesses.

100. The method according to claim 91, wherein The groove surface includes a first wall portion and a second wall portion, and step (b) includes a sub-step (b1) of forming a first portion of the plurality of grooves in the first wall portion, and a sub-step (b2) of forming a second portion of the plurality of grooves in the second wall portion.

101. The method according to claim 100, characterized in that Step (b) comprises providing relative movement between the laser beam and the groove surface after step (b1) and before step (b2) such that the second wall portion is perpendicular to the laser beam during step (b2).

102. The method according to claim 91, wherein Step (b) includes forming the plurality of recesses so that the surface texture of a portion of the groove surface including the plurality of recesses has an average area roughness (S) between 0.03 and 1.5 μm. a ).

103. The method according to claim 91, characterized in that Step (b) includes forming the plurality of recesses so that the surface texture of a portion of the groove surface including the plurality of recesses has an average area roughness (S) between 0.1 and 0.9 μm. a ).

104. The method according to claim 91, wherein Step (b) includes forming the plurality of recesses so that the surface texture of a portion of the groove surface including the plurality of recesses has an average area roughness (S) between 0.3 and 1.5 μm. a ).

105. The method according to claim 91, characterized in that The method further includes the step of forming the groove of the wedge bonding tool using a laser before step (a).

106. The method according to claim 91, characterized in that Step (c) comprises applying the coating by chemical vapor deposition.

107. The method according to claim 91, characterized in that Step (c) comprises applying the coating by physical vapor deposition.

108. The method according to claim 91, characterized in that Step (c) comprises applying the coating by thermal spraying.

109. The method according to claim 91, characterized in that Step (c) comprises applying the coating to a thickness of 0.5-10 μm.

110. The method according to claim 91, characterized in that Step (c) comprises applying the coating to a thickness of 5-10 μm.

111. The method according to claim 91, characterized in that Step (c) comprises applying the coating to a thickness of 1-5 μm.

112. The method according to claim 91, wherein Step (c) comprises applying the coating to a thickness of 1-20 μm.

113. The method according to claim 91, characterized in that Step (c) comprises applying the coating to a thickness of 10-20 μm.

114. The method according to claim 91, wherein Step (c) comprises applying said coating comprising diamond-like carbon material to a thickness of 0.5-5 μm.

115. The method according to claim 91, wherein Step (c) comprises applying said coating comprising cubic boron nitride material to a thickness of 10-100 μm.

116. The method according to claim 91, characterized in that Step (c) comprises applying said coating comprising cubic boron nitride material to a thickness of 1-50 μm.

117. The method according to claim 91, characterized in that Step (c) comprises applying said coating comprising cubic boron nitride material to a thickness of 1-10 μm.

118. The method according to claim 91, characterized in that Step (c) comprises applying said coating comprising tetrahedral amorphous carbon material to a thickness of 0.5-6 μm.

119. The method according to claim 91, characterized in that Step (c) comprises applying said coating comprising titanium nitride material to a thickness of 1-10 μm.

120. The method according to claim 91, characterized in that Step (c) comprises applying said coating comprising chromium nitride material to a thickness of 0.2-7 μm.

121. The method according to claim 91, characterized in that Step (c) comprises applying said coating comprising chromium nitride material to a thickness of 1-15 μm.

122. The method according to claim 91, wherein During step (b), the laser beam contacts the groove surface orthogonally to the groove surface to form each of the plurality of recesses.

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