Transfer substrate and preparation method of light-emitting substrate

Abstract

The embodiment of the invention provides a transfer substrate and a preparation method of a light-emitting substrate, relates to the technical field of display, and is used for improving the preparation efficiency of the light-emitting substrate. The transfer substrate includes a first substrate and a plurality of adhesives. The plurality of bonding pieces are arranged on the first substrate and are configured to be bonded with the light-emitting devices; the adhesive force of the bonding piece at the first preset temperature is the first adhesive force, the adhesive force of the bonding piece at the second preset temperature is the second adhesive force, the first preset temperature is smaller than the second preset temperature, and the first adhesive force is larger than the second adhesive force. The transfer substrate is used for transferring the light-emitting device.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a method for preparing a transfer substrate and a light-emitting substrate. Background Art

[0002] Micro LEDs (Micro Light Emitting Diodes) or sub-millimeter LEDs (Mini LEDs) are gaining increasing attention due to their advantages, including high resolution, low power consumption, high brightness, high color saturation, fast response, thinness, long lifespan, and splicing capabilities.

[0003] In the related art, a transfer substrate is used to transfer the light-emitting device to the driving backplane so as to connect the light-emitting device to the driving backplane. However, the preparation efficiency of the light-emitting substrate is low. Summary of the Invention

[0004] An object of the embodiments of the present disclosure is to provide a method for preparing a transfer substrate and a light-emitting substrate, so as to improve the preparation efficiency of the light-emitting substrate.

[0005] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0006] In one aspect, a transfer substrate is provided. The transfer substrate includes a first substrate and a plurality of adhesive members. The plurality of adhesive members are disposed on the first substrate and configured to adhere to the light-emitting device. The adhesive members have a first adhesive force at a first preset temperature and a second adhesive force at a second preset temperature. The first preset temperature is lower than the second preset temperature, and the first adhesive force is higher than the second adhesive force.

[0007] In the above-mentioned transfer substrate, under the condition of a first preset temperature, the adhesive member can be bonded to the light-emitting device. The first adhesive force is relatively strong, so that the adhesive member and the light-emitting device are firmly bonded and difficult to separate. Under the condition of a second preset temperature, the light-emitting device is separated from the transfer substrate. The second adhesive force is relatively weak, so that the light-emitting device and the adhesive member are not firmly bonded, and separation is easy. Exemplarily, the first preset temperature may be room temperature (e.g., less than or equal to 30°C), and the second preset temperature is the temperature when the light-emitting device and the driving backplane are bonded (e.g., greater than or equal to 150°C. At this time, under the condition of the first preset temperature, the adhesive is bonded to the light-emitting device. The first adhesion force is relatively large, so that the adhesive is bonded to the optical device more firmly and is not easy to separate. Under the condition of the second preset temperature, the light-emitting device and the driving backplane are bonded, and the adhesion force between the adhesive and the light-emitting device is relatively small, and the adhesion force is smaller than the bonding force between the light-emitting device and the driving backplane. After the light-emitting device and the driving backplane are bonded, the transfer substrate can be directly removed. In other words, the bonding process and the dissociation (separation) process are carried out almost simultaneously, which can shorten the preparation time of the light-emitting substrate and improve the preparation efficiency of the light-emitting substrate.

[0008] In some embodiments, at least one accommodating hole is provided on a side of the adhesive away from the first substrate; the transfer substrate further comprises a plurality of ejectors, one of the ejectors being provided in one of the accommodating holes; under the condition of the first preset temperature, the surface of the ejector away from the first substrate is lower than the surface of the adhesive away from the first substrate; under the condition of the second preset temperature, the surface of the ejector away from the first substrate is higher than the surface of the adhesive away from the first substrate; the first preset temperature is lower than the second preset temperature.

[0009] In some embodiments, under the condition of the first preset temperature, the minimum distance between the ejection member away from the surface of the first substrate and the adhesive member away from the surface of the first substrate is 1 μm to 2 μm.

[0010] In some embodiments, the material of the ejector includes at least one of graphite, copper, polyethylene, polypropylene, polystyrene, polycarbonate, and polyamide.

[0011] In some embodiments, at least one accommodating hole is provided on a side of the adhesive away from the first substrate; the transfer substrate further comprises a plurality of ejectors, each of which is elastic, and one ejector is provided in one of the accommodating holes, wherein the ejector can undergo elastic deformation and shrink into the accommodating hole, and the elastic force of the ejector is less than the first adhesive force and greater than the second adhesive force.

[0012] In some embodiments, one adhesive member includes a plurality of accommodating holes, and the plurality of accommodating holes are arranged at intervals along a first direction and / or a second direction, wherein the first direction intersects the second direction.

[0013] In some embodiments, under the condition of the first preset temperature, the first adhesion force is greater than or equal to 100 gf / inch; and / or, under the condition of the second preset temperature, the second adhesion force is less than or equal to 10 gf / inch.

[0014] In some embodiments, the adhesive member is made of polyurethane or acrylic resin.

[0015] In another aspect, a method for preparing a light-emitting substrate is provided. The method comprises providing a transfer substrate and a driver backplane at a first preset temperature; the transfer substrate comprises a transfer substrate and a plurality of light-emitting devices, the plurality of light-emitting devices being disposed on one side of the transfer substrate; the transfer substrate comprises a first substrate and a plurality of adhesives, the plurality of adhesives being disposed on the first substrate, each adhesive being bonded to one of the light-emitting devices. At a second preset temperature, the light-emitting devices are connected to the driver backplane using a bonding process; the transfer substrate and the driver backplane are disposed opposite each other.

[0016] The preparation method of the above-mentioned light-emitting substrate has the same structure and beneficial technical effects as the transfer substrate provided in some of the above-mentioned embodiments, and will not be described in detail here.

[0017] In some embodiments, the adhesive member is provided with at least one receiving hole on a side away from the first substrate; the transfer substrate further comprises a plurality of ejectors, one of which is disposed within each receiving hole; during the step of providing the intermediate substrate and the driver backplane, the surface of the ejector member away from the first substrate is lower than the surface of the adhesive member away from the first substrate; during the step of connecting the light-emitting device and the driver backplane using a bonding process, the ejector member abuts against the light-emitting device. The abutting force of the ejector member on the light-emitting device is less than the bonding force of the adhesive member on the light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0019] Figure 1 is a structural diagram of a display device according to some embodiments;

[0020] Figure 2 is another structural diagram of a display device according to some embodiments;

[0021] Figure 3 for Figure 1 A cross-sectional view along section line AA;

[0022] Figure 4 for Figure 1 Another cross-sectional view along section line AA;

[0023] Figure 5 is a structural diagram of a light-emitting substrate according to some embodiments;

[0024] Figure 6 is a structural diagram of a transfer substrate according to some embodiments;

[0025] Figure 7A A structural diagram showing a rectangular adhesive member according to some embodiments;

[0026] Figure 7B A structural diagram showing a circular adhesive member according to some embodiments;

[0027] Figure 7C A structural diagram showing a triangular shape of an adhesive member according to some embodiments;

[0028] Figure 8 A structural diagram of an adhesive member having a receiving hole according to some embodiments;

[0029] Figure 9 A structural diagram showing an ejector having elasticity according to some embodiments;

[0030] Figure 10 is a structural diagram of a through hole according to some embodiments;

[0031] Figure 11A is a structural diagram of a plurality of receiving holes arranged along a first direction according to some embodiments;

[0032] Figure 11B is a structural diagram of a plurality of receiving holes arranged along the second direction according to some embodiments;

[0033] Figure 11C A structural diagram of a plurality of receiving holes arranged along an array according to some embodiments;

[0034] Figure 12A is a structural diagram of a bonding member and a receiving hole according to some embodiments, both of which are rectangular;

[0035] Figure 12B is a structural diagram of an adhesive member and a receiving hole according to some embodiments, both of which are circular;

[0036] Figure 12C is a structural diagram showing that both the adhesive member and the receiving hole are triangular according to some embodiments;

[0037] Figure 13 is a preparation flow chart of a light-emitting substrate according to some embodiments;

[0038] Figure 14 is a diagram of a preparation step of a light-emitting substrate according to some embodiments;

[0039] Figure 15 is a flow chart of preparing a transfer substrate according to some embodiments;

[0040] Figure 16 Schematic diagram of steps for preparing a transfer substrate according to some embodiments;

[0041] Figure 17 is another step diagram for preparing a light-emitting substrate according to some embodiments;

[0042] Figure 18 FIG. 4 is another diagram illustrating steps for preparing a light-emitting substrate according to some embodiments. DETAILED DESCRIPTION

[0043] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0044] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to." In the description of the specification, the terms "one embodiment," "some embodiments," "exemplary embodiments," "examples," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials, or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0045] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0046] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0047] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0048] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0049] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [stated condition or event] is detected" are optionally interpreted to mean "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0050] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0051] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values may, in practice, be based on additional conditions or values beyond those stated.

[0052] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0053] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0054] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0055] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0056] like Figure 1 As shown, some embodiments of the present disclosure provide a display device 1000 , which may be any device that displays either moving (eg, video) or fixed (eg, still image) content and either text or images.

[0057] Exemplarily, the display device 1000 can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a wearable device, an augmented reality (AR) device, a virtual reality (VR) device, a vehicle display, or an aircraft display.

[0058] In some examples, such as Figure 1 As shown, the display device 1000 may be a portable display product. For example, the display device 1000 may be Figure 1 The phone shown.

[0059] In some other examples, such as Figure 2 As shown, the display device 1000 may be a wearable device. For example, the display device 1000 may be Figure 2 The watch shown in.

[0060] In some embodiments, as Figure 3 and Figure 4 As shown, the display device 1000 includes a light emitting substrate 100 , a driving circuit board 200 , a housing 300 and a cover plate 400 .

[0061] The cover plate 400 is disposed on the light-emitting side of the light-emitting substrate 100. The driving circuit board 200 is disposed on the non-light-emitting side of the light-emitting substrate 100 and is connected to the light-emitting substrate 100 to provide a light-emitting signal to the light-emitting substrate 100.

[0062] The light-emitting substrate 100 has a light-emitting side 100A and a non-light-emitting side 100B opposite to each other. The light-emitting side 100A refers to the side of the light-emitting substrate 100 that can emit light ( Figure 3 and Figure 4 The non-light emitting side 100B refers to the other side opposite to the light emitting side 100A ( Figure 3 and Figure 4 The lower side of the light emitting substrate 100).

[0063] In addition, the shell 300 can be a box-shaped structure with an opening, the light-emitting substrate 100 and the driving circuit board 200 can be arranged in the shell 300, and the cover plate 400 is arranged on the light-emitting side of the light-emitting substrate 100 and is located at the opening of the shell 300.

[0064] It is understandable that the display device 1000 may be a liquid crystal display (LCD) or a mini / micro light emitting display (MLED), which is not specifically limited in the embodiments of the present disclosure.

[0065] In some embodiments, as Figure 3 As shown, the display device 1000 can be a liquid crystal display device. The liquid crystal display device also includes a display panel 500. The display panel 500 is disposed on the light-emitting side 100A of the light-emitting substrate 100. The display panel 500 can adjust the intensity (grayscale) of the light passing through it, thereby realizing image display. In this case, the light-emitting substrate 100 serves as a backlight source in the liquid crystal display device, providing backlight for the display panel 500.

[0066] like Figure 3 As shown, the display device 1000 further includes a plurality of optical films 600. The plurality of optical films 600 are disposed between the display panel 500 and the light emitting substrate 100. The plurality of optical films 600 are configured to perform uniformization and / or color conversion processing on the light emitted by the light emitting substrate 100.

[0067] For example, the light emitting substrate 100 can directly emit white light, and the white light is emitted toward the display panel 500 after being uniformed by the multiple optical films 600 .

[0068] Alternatively, illustratively, the light emitting substrate 100 may also emit light of other colors (eg, blue light), which is then emitted toward the display panel 500 after undergoing color conversion and light homogenization processing by the multiple optical films 600 .

[0069] In other embodiments, see Figure 4 The display device 1000 may be a micro-luminescent display device. In this case, the luminescent substrate 100 may serve as a display panel of the micro-luminescent display device and directly display the image. The luminescent substrate 100 may emit light of multiple colors (e.g., red, blue, and green) to achieve full-color display.

[0070] The following uses the display device 1000 as a micro-luminescent display device as an example to exemplify some embodiments of the present disclosure, but the implementation of the present disclosure is not limited thereto, and any other display device can also be considered as long as the same technical concept is applied.

[0071] In some embodiments, as Figure 4 As shown, the light emitting substrate 100 includes a driving backplane 10 and a plurality of light emitting devices 20. The light emitting devices 20 are disposed on the driving backplane 10.

[0072] In some embodiments, as Figure 5 As shown, a plurality of light-emitting devices 20 are arranged in a plurality of rows and columns, each row including at least two light-emitting devices 20 arranged along a first direction X, and each column including at least two light-emitting devices 20 arranged along a second direction Y. The first direction X intersects the second direction Y, for example, the first direction X and the second direction Y are perpendicular.

[0073] In some examples, the light emitting devices 20 emit the same color. In this case, the light emitting substrate 100 emits light of only one color. In this case, the light emitting substrate 100 serves as a backlight source in a liquid crystal display device to provide backlight for the display panel 500 .

[0074] In other examples, the plurality of light-emitting devices 20 include a plurality of red light-emitting devices, a plurality of blue light-emitting devices, and a plurality of green light-emitting devices. The red light-emitting devices emit red, the blue light-emitting devices emit blue, and the green light-emitting devices emit green. In this way, the light-emitting substrate 100 can emit light of multiple colors to achieve full-color display.

[0075] In related art, in methods for preparing light-emitting substrates, a transfer substrate is used to transfer light-emitting devices to a driver backplane for connection. The transfer substrate secures the light-emitting devices with a temporary bonding adhesive layer. Consequently, the preparation steps for the light-emitting substrate are as follows: first, the light-emitting devices are bonded to the driver backplane, and then the light-emitting devices are separated from the first substrate. This results in a long preparation time and low efficiency for the light-emitting substrate.

[0076] In order to solve the above technical problems, the embodiment of the present disclosure provides a transfer substrate 1. Figure 6 As shown, the transfer substrate 1 includes a first substrate 101 and a plurality of adhesive members 102 .

[0077] The first substrate 101 may be a flexible first substrate 101 or a rigid first substrate 101. The material used for the first substrate 101 may include a polymer resin or glass. For example, the first substrate 101 may be flexible, and the material used for the first substrate 101 may include a polymer resin, such as polyimide (PI). Alternatively, for example, the first substrate 101 may be rigid, and the material used for the first substrate 101 may include glass containing SiO2 as a main component.

[0078] like Figure 6 As shown, a plurality of adhesive members 102 are provided on the first substrate 101 and are configured to adhere the light emitting device 20. For example, the adhesive members 102 may be formed by a photolithography process.

[0079] The adhesive strength of the adhesive 102 at a first preset temperature is a first adhesive strength, and the adhesive strength of the adhesive 102 at a second preset temperature is a second adhesive strength. When the first preset temperature is lower than the second preset temperature, the first adhesive strength is greater than the second adhesive strength. For example, the adhesive strength of the adhesive 102 decreases as the temperature increases.

[0080] Under the condition of the first preset temperature, the adhesive 102 can be bonded to the light emitting device 20. The first adhesive force is relatively large, so that the adhesive 102 and the light emitting device 20 are bonded more firmly and are not easily separated, thereby reducing the risk of the light emitting device 20 falling off the adhesive 102 during the transfer process.

[0081] Illustratively, under the condition of the first preset temperature, the first adhesion force is greater than 100 gf / inch, for example, the first adhesion force is 100 gf / inch, 120 gf / inch, 135 gf / inch, 140 gf / inch, 142 gf / inch, 144 gf / inch, 148 gf / inch, 150 gf / inch, or 160 gf / inch.

[0082] In some embodiments, the first preset temperature is room temperature, illustratively, the first preset temperature is less than or equal to 30° C. For example, the first preset temperature is 10° C., 15° C., 18° C., 20° C., 21° C., 23° C., 25° C., 26° C., 28° C., or 30° C.

[0083] Under the condition of the second preset temperature, the light emitting device 20 is separated from the transfer substrate. The second adhesive force is relatively small, so that the light emitting device 20 is not firmly bonded to the adhesive member 102, and is easy to separate.

[0084] Illustratively, under the condition of the second preset temperature, the second adhesion force is less than 10 gf / inch, for example, the second adhesion force is 10 gf / inch, 9 gf / inch, 8.1 gf / inch, 7.2 gf / inch, 6 gf / inch, 5 gf / inch, 4 gf / inch, 3 gf / inch, 2 gf / inch, 1 gf / inch, or 0 gf / inch.

[0085] In some embodiments, the second preset temperature is the temperature when the light emitting device 20 and the driving backplane 10 are bonded. For example, the second preset temperature is greater than or equal to 150° C. For example, the second preset temperature is 150° C., 155° C., 163° C., 170° C., 181° C., 195° C., 204° C., 220° C., 260° C., 275° C., 284° C., 290° C., 292° C., 299° C., or 300° C.

[0086] In summary, under the conditions of the first preset temperature, the adhesive 102 is bonded to the light-emitting device 20. The first adhesive force is relatively large, so the adhesive 102 is firmly bonded to the light-emitting device 20 and is not easily separated. Under the conditions of the second preset temperature, the light-emitting device 20 is bonded to the driving backplane 10, and the bonding force between the adhesive 102 and the light-emitting device is relatively small, and this bonding force is smaller than the bonding force between the light-emitting device 20 and the driving backplane 10. After the light-emitting device 20 and the driving backplane 10 are bonded, the transfer substrate 1 can be directly removed. In other words, the bonding process and the dissociation (separation) process are carried out almost simultaneously, which can shorten the preparation time of the light-emitting substrate 100 and improve the preparation efficiency of the light-emitting substrate 100.

[0087] In some embodiments, as Figure 7A 、 Figure 7B and Figure 7C As shown, the shape of the orthographic projection of the adhesive member 102 on the substrate is at least one of a rectangle, a circle, a triangle, a regular polygon, a cross, and a rhombus.

[0088] In some embodiments, as Figure 8 As shown, at least one receiving hole 1021 is provided on the side of the adhesive member 102 away from the first substrate 101. For example, one, two, three, or four receiving holes 1021 are provided on the side of the adhesive member 102 away from the first substrate 101. For example, the adhesive member 102 can be formed by a half-tone mask process or an imprint process.

[0089] like Figure 8 As shown, the transfer substrate 1 further includes a plurality of ejectors 103. Each ejector 103 is disposed within a receiving hole 1021. Under conditions of a first predetermined temperature, the ejector 103 is disposed within the receiving hole 1021, and the surface of the ejector 103 away from the first substrate 101 is lower than the surface of the adhesive 102 away from the first substrate 101. This prevents the ejector 103 from protruding beyond the receiving hole 1021 and prevents the adhesive 102 from adhering to the light-emitting device 20. Exemplarily, the ejector 103 can be formed using an inkjet printing process.

[0090] Under the condition of the second preset temperature, the ejector 103 is disposed within the receiving hole 1021, and the surface of the ejector 103 away from the first substrate 101 is higher than the surface of the adhesive 102 away from the first substrate 101. In this way, during the bonding process between the light-emitting device 20 and the driver backplane 10, the ejector 103 will thermally expand and abut against the light-emitting device 20. After the driver backplane 10 and the light-emitting device 20 are bonded, the pressure applied to the driver backplane 10 and the transfer substrate 1 is removed, and the ejector 103 will continue to expand and extend out of the receiving hole 1021, driving the adhesive 102 to move away from the light-emitting device 20, thereby separating the light-emitting device 20 from the adhesive 102, thereby making it easier to remove the transfer substrate 1. At this time, the ejector 103 is arranged in the receiving hole 1021, and the surface of the ejector 103 away from the first substrate 101 is higher than the surface of the adhesive 102 away from the first substrate 101. The staff can remove the transfer substrate 1 before the ejector 103 retracts into the receiving hole 1021.

[0091] Based on the above embodiment, under the first predetermined temperature, the minimum distance between the surface of ejector 103 away from first substrate 101 and the surface of adhesive 102 away from first substrate 101 is 1 μm to 2 μm. This arrangement places the surface of adhesive 102 away from first substrate 101 closer to the surface of ejector 103 away from first substrate 101, reducing the risk of ejector 103 failing to extend out of receiving hole 1021.

[0092] In other embodiments, Figure 9 As shown, an ejector 103 is disposed in an accommodating hole 1021 , and a surface of the ejector 103 away from the first substrate 101 is higher than a surface of the adhesive 102 away from the first substrate 101 .

[0093] The ejector 103 can undergo elastic deformation and shrink into the receiving hole 1021 . In this way, the ejector 103 will not affect the bonding of the adhesive 102 to the light emitting device 20 .

[0094] Under the first preset temperature, the ejector 103 is positioned within the receiving hole 1021 and abuts against the light-emitting device 20. At this point, the elastic force of the ejector 103 is less than the first adhesive force. That is, the force (thrust) exerted by the ejector 103 on the light-emitting device 20 is less than the force (adhesive force) exerted by the adhesive 102 on the light-emitting substrate 100. This allows the adhesive 102 to adhere to the light-emitting device 20.

[0095] Under the condition of the second preset temperature, during the bonding process of the light-emitting device 20 and the driving backplane 10, the ejector 103 is disposed within the receiving hole 1021, and the ejector 103 abuts against the light-emitting device 20. At this time, the elastic force of the ejector 103 is greater than the second adhesive force, that is, the force exerted by the ejector 103 on the light-emitting device 20 is less than the force exerted by the adhesive 102 on the light-emitting substrate 100. After the driving backplane 10 and the light-emitting device 20 are bonded, the pressure applied to the driving backplane 10 and the transfer substrate 1 is removed, and the ejector 103 drives the adhesive 102 to move away from the light-emitting device 20, so that the light-emitting device 20 is separated from the adhesive 102, thereby making it easier to remove the transfer substrate 1. At this time, the ejector 103 is disposed within the receiving hole 1021, and the surface of the ejector 103 away from the first substrate 101 is higher than the surface of the adhesive 102 away from the first substrate 101.

[0096] It can be understood that as long as the light-emitting device 20 is separated from the adhesive 102, in the absence of external force, the ejector 103 will continue to separate the light-emitting device 20 from the adhesive 102, thereby reducing the risk of the light-emitting device 20 and the adhesive 102 being bonded again, thereby reducing the risk of the light-emitting device 20 being damaged due to the separation of the light-emitting device 20 from the adhesive 102.

[0097] Based on the above embodiments, Figure 9 As shown, the maximum distance between the surface of the ejector 103 away from the first substrate 101 and the surface of the adhesive 102 away from the first substrate 101 is 1μm to 2μm. This arrangement places the surface of the adhesive 102 away from the first substrate 101 closer to the surface of the ejector 103 away from the first substrate 101. This reduces the risk of excessive compression of the ejector 103, which in turn causes a significant force to be applied by the ejector 103 to the light-emitting device 20. This reduces the risk of damage to the light-emitting device 20 due to the excessive force, and improves the bonding yield of the light-emitting substrate 100.

[0098] In some embodiments, as Figure 8 As shown, the ejector 103 is away from the surface of the first substrate 101 and protrudes toward the surface away from the first substrate 101. Exemplarily, the surface of the ejector 103 away from the first substrate 101 is a curved surface.

[0099] In some embodiments, the receiving hole 1021 may be a blind hole (eg, Figure 8 as shown) or through holes (as Figure 10 shown).

[0100] For example, Figure 8As shown, the receiving hole 1021 is a blind hole, and the size of the adhesive member 102 along the third direction is 5 μm to 10 μm. For example, the size of the adhesive member 102 along the third direction Z is 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, 8 μm, 8.5 μm, 9 μm, or 10 μm. The third direction Z is perpendicular to the first direction X and perpendicular to the second direction Y.

[0101] The depth of the receiving hole 1021 is 2 μm to 8 μm. For example, the depth of the receiving hole 1021 is 2 μm, 2.5 μm, 3 μm, 4 μm, 5.5 μm, 6 μm, 7 μm, 7.5 μm or 8 μm.

[0102] In some embodiments, as Figure 11A 、 Figure 11B and Figure 11C As shown, one adhesive member 102 includes a plurality of receiving holes 1021. The plurality of receiving holes 1021 are arranged at intervals along the first direction X and / or the second direction Y.

[0103] For example, Figure 11A As shown, the plurality of receiving holes 1021 are arranged at intervals along the first direction X. For example, the receiving holes 1021 are long holes, and the receiving holes 1021 extend along the second direction Y.

[0104] Or, for example, Figure 11B As shown, the plurality of receiving holes 1021 are arranged at intervals along the second direction Y. For example, the receiving holes 1021 are long holes, and the receiving holes 1021 extend along the first direction X.

[0105] Or, for example, Figure 11C As shown, the plurality of receiving holes 1021 are arranged in multiple rows and columns, each row includes at least two receiving holes 1021 arranged along the first direction X, and each column includes at least two receiving holes 1021 arranged along the second direction Y.

[0106] In some embodiments, the orthographic projection boundary of the accommodating hole 1021 on the substrate is disposed within the orthographic projection boundary range of the light-emitting device 20 on the substrate and is spaced apart from the orthographic projection boundary.

[0107] In some embodiments, as Figure 12A 、 Figure 12B and Figure 12C As shown, the shape of the positive projection of the receiving hole 1021 on the substrate is at least one of a rectangle, a circle, a triangle, a regular polygon, a cross and a rhombus.

[0108] In some embodiments, as Figure 12A 、 Figure 12B and Figure 12CAs shown, the shape of the orthographic projection of the adhesive member 102 on the substrate is the same as the shape of the orthographic projection of the receiving hole 1021 on the substrate, for example, both are rectangular, circular or triangular.

[0109] In other embodiments, the shape of the orthographic projection of the adhesive member 102 on the substrate is the same as the shape of the orthographic projection of the receiving hole 1021 on the substrate. For example, the shape of the orthographic projection of the adhesive member 102 on the substrate is rectangular, and the shape of the orthographic projection of the receiving hole 1021 on the substrate is circular or triangular.

[0110] The embodiment of the present disclosure also provides a method for preparing a transfer substrate, such as Figure 13 and Figure 14 As shown, the preparation method includes:

[0111] S100: providing a transfer substrate 2 and a driving backplane 10 under a first preset temperature condition;

[0112] In the above steps, the transfer substrate 2 includes a transfer substrate 1 and multiple light-emitting devices 20, which are arranged on one side of the transfer substrate 1. The transfer substrate 1 includes a first substrate 101 and multiple adhesives 102. The multiple adhesives 102 are arranged on the first substrate 101, with each adhesive 102 bonded to each light-emitting device 20. In this case, the first adhesive force is relatively strong, and the adhesive 102 and the light-emitting device 20 are bonded more firmly, thereby reducing the risk of the light-emitting device 20 falling off the adhesive 102 during the transfer process.

[0113] For example, Figure 15 and Figure 16 As shown, providing the transfer substrate includes S110 and S120.

[0114] S110: Providing a transfer substrate 1 and a donor substrate 3:

[0115] In the above steps, the donor substrate 3 includes a second substrate 301 and a plurality of light-emitting devices 20. The plurality of light-emitting devices 20 are placed on the second substrate 301.

[0116] S120: bonding the transfer substrate 1 and the light-emitting device 20 together under a first preset temperature condition.

[0117] In the above steps, one adhesive member 102 is bonded to one light emitting device 20 .

[0118] In some embodiments, the adhesive 102 is elastic, that is, the adhesive 102 can be compressed. In this way, during the process of forming the transfer substrate 2, the risk of inconsistent heights of the plurality of light-emitting devices 20 resulting in the failure of some of the adhesive 102 to bond with the light-emitting devices 20 can be reduced, thereby improving the bonding yield of the light-emitting substrate 100.

[0119] Exemplarily, the material of the adhesive member 102 includes polyurethane and / or acrylic resin.

[0120] like Figure 13 and Figure 14 As shown, S200: under the condition of a second preset temperature, the light emitting device 20 and the driving backplane 10 are connected by a bonding process.

[0121] In the above steps, the adhesive force between the adhesive member 102 and the light emitting device is relatively small, and the adhesive force is smaller than the bonding force between the light emitting device 20 and the driving backplane 10 .

[0122] After the light-emitting device 20 and the driving backplane 10 are bonded, the transfer substrate 1 can be directly removed. That is, the bonding process and the dissociation process are carried out almost simultaneously, which can shorten the preparation time of the light-emitting substrate 100 and improve the preparation efficiency of the light-emitting substrate 100.

[0123] For example, the light emitting device 20 and the driving backplane 10 may be connected by using a metal bonding process.

[0124] In some embodiments, as Figure 17 As shown, at least one receiving hole 1021 is provided on a side of the adhesive member 102 away from the first substrate 101 . The transfer substrate 1 further includes a plurality of ejectors 103 , with one ejector 103 being provided in one receiving hole 1021 .

[0125] like Figure 17 As shown, in step S100 (providing the transfer substrate 2 and the driving backplane 10), the ejector 103 is arranged in the accommodating hole 1021, and the surface of the ejector 103 away from the first substrate 101 is lower than the surface of the adhesive 102 away from the first substrate 101. In this way, the ejector 103 will not exceed the accommodating hole 1021, and the ejector 103 will not affect the bonding of the adhesive 102 to the light-emitting device 20.

[0126] like Figure 17 As shown, in step S200 (connecting the light-emitting device 20 and the driving backplane 10 using a bonding process), the ejector 103 abuts against the light-emitting device 20, and the abutting force of the ejector 103 on the light-emitting device 20 is smaller than the adhesive force of the adhesive 102 on the light-emitting device 20.

[0127] After the driver backplate 10 and the light-emitting device 20 are bonded, the pressure applied to the driver backplate 10 and the transfer substrate 1 is removed, and the ejector 103 continues to expand and extend out of the receiving hole 1021, driving the adhesive 102 to move away from the light-emitting device 20, thereby separating the light-emitting device 20 from the adhesive 102, thereby making it easier to remove the transfer substrate 1. At this time, the ejector 103 is disposed within the receiving hole 1021, and the surface of the ejector 103 away from the first substrate 101 is higher than the surface of the adhesive 102 away from the first substrate 101. During thermal expansion, the sidewalls of the ejector 103 adhere to the adhesive 102. In this way, the edge of the ejector 103 expands more slowly, and the middle portion of the ejector 103 is not bonded to the adhesive, causing the ejector 103 to protrude away from the surface of the first substrate 101.

[0128] In some embodiments, as Figure 18 As shown, an ejector 103 is disposed within an accommodating hole 1021. The surface of the ejector 103 away from the first substrate 101 is higher than the surface of the adhesive 102 away from the first substrate 101. The ejector 103 can elastically deform and shrink into the accommodating hole 1021. The elastic force of the ejector 103 is less than the first adhesive force and greater than the second adhesive force.

[0129] like Figure 18 As shown, in step S100 (providing the transfer substrate 2 and the driving backplane 10), the ejector 103 is disposed in the receiving hole 1021 and abuts against the light-emitting device 20. At this time, the elastic force of the ejector 103 is less than the first adhesive force, that is, the force (thrust) exerted by the ejector 103 on the light-emitting device 20 is less than the force (adhesive force) exerted by the adhesive 102 on the light-emitting substrate 100.

[0130] In step S200 (connecting the light-emitting device 20 to the driver backplane 10 using a bonding process), the ejector 103 is disposed in the receiving hole 1021 and abuts against the light-emitting device 20. At this point, the elastic force of the ejector 103 is greater than the second adhesive force, that is, the force exerted by the ejector 103 on the light-emitting device 20 is less than the force exerted by the adhesive 102 on the light-emitting substrate 100.

[0131] After the driver backplate 10 and the light-emitting device 20 are bonded, the pressure applied to the driver backplate 10 and the transfer substrate 1 is removed, and the ejector 103 drives the adhesive 102 away from the light-emitting device 20, separating the light-emitting device 20 from the adhesive 102, thereby making it easier to remove the transfer substrate 1. At this point, the ejector 103 is positioned within the receiving hole 1021, and the surface of the ejector 103 away from the first substrate 101 is higher than the surface of the adhesive 102 away from the first substrate 101.

[0132] As long as the light-emitting device 20 is separated from the adhesive 102, in the absence of external force, the ejector 103 will continue to separate the light-emitting device 20 from the adhesive 102, thereby reducing the risk of the light-emitting device 20 and the adhesive 102 being re-adhered, thereby reducing the risk of the light-emitting device 20 being damaged due to the separation of the light-emitting device 20 from the adhesive 102.

[0133] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0134] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A transfer substrate for transferring a light-emitting device to a driving backplane, characterized in that: include: a first substrate; a plurality of adhesive members, disposed on the first substrate and configured to adhere the light-emitting device; The adhesive strength of the adhesive at a first preset temperature is a first adhesive strength, and the adhesive strength of the adhesive at a second preset temperature is a second adhesive strength, wherein the first preset temperature is lower than the second preset temperature, and the first adhesive strength is greater than the second adhesive strength.

2. The transfer substrate according to claim 1, wherein At least one receiving hole is provided on a side of the adhesive component away from the first substrate; The transfer substrate further includes a plurality of ejectors, one of which is disposed in one of the receiving holes; under the condition of the first preset temperature, the ejector is away from the surface of the first substrate and lower than the surface of the adhesive away from the first substrate; under the condition of the second preset temperature, the ejector is away from the surface of the first substrate and higher than the surface of the adhesive away from the first substrate.

3. The transfer substrate according to claim 2, wherein: Under the condition of the first preset temperature, the minimum distance between the surface of the ejection member away from the first substrate and the surface of the adhesive member away from the first substrate is 1 μm to 2 μm.

4. The transfer substrate according to claim 2, wherein: The material of the ejector includes at least one of graphite, copper, polyethylene, polypropylene, polystyrene, polycarbonate and polyamide.

5. The transfer substrate according to claim 1, wherein: At least one receiving hole is provided on a side of the adhesive component away from the first substrate; The transfer substrate further includes a plurality of ejection members, one of the ejection members being disposed in one of the accommodating holes, the ejection member being away from the surface of the first substrate and being higher than the surface of the adhesive member being away from the first substrate; wherein the ejection member can undergo elastic deformation and shrink into the accommodating hole, and the elastic force of the ejection member is less than the first adhesive force and greater than the second adhesive force.

6. The transfer substrate according to any one of claims 1 to 5, characterized in that: One of the adhesive components includes a plurality of the accommodating holes; the plurality of accommodating holes are spaced apart along the first direction and / or the second direction; wherein the first direction intersects the second direction.

7. The transfer substrate according to any one of claims 1 to 5, characterized in that Under the condition of the first preset temperature, the first adhesion force is greater than or equal to 100 gf / inch; and / or, under the condition of the second preset temperature, the second adhesion force is less than or equal to 10 gf / inch.

8. The transfer substrate according to any one of claims 1 to 5, characterized in that The material of the adhesive comprises polyurethane or acrylic resin.

9. A method for preparing a light-emitting substrate, characterized in that: Under the condition of a first preset temperature, a transfer substrate and a driving backplane are provided; the transfer substrate includes a transfer substrate and a plurality of light-emitting devices, wherein the plurality of light-emitting devices are arranged on one side of the transfer substrate; the transfer substrate includes a first substrate and a plurality of adhesive members, wherein the plurality of adhesive members are arranged on the first substrate, and each adhesive member is bonded to each light-emitting device; Under the condition of a second preset temperature, the light-emitting device and the driving backplane are connected by a bonding process; the transfer substrate and the driving backplane are arranged relative to each other, and the bonding force between the adhesive and the light-emitting device is smaller than the bonding force between the light-emitting device and the driving backplane.

10. The preparation method according to claim 9, characterized in that At least one receiving hole is provided on a side of the adhesive member away from the first substrate; the transfer substrate further comprises a plurality of ejectors, one of the ejectors being provided in one of the receiving holes; In the step of providing the transfer substrate and the driving backplane, the surface of the ejector away from the first substrate is lower than the surface of the adhesive away from the first substrate; In the step of connecting the light emitting device and the driving backplane by a bonding process, the ejector abuts against the light emitting device; and the abutting force of the ejector on the light emitting device is smaller than the adhesive force of the adhesive on the light emitting device.

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