A chip cooling system based on voice-controlled phase change capsule and its cooling method

Abstract

The present invention relates to the field of chip heat sinks, and more specifically, to a chip heat dissipation system based on acoustically controlled phase change capsules and a heat dissipation method thereof. The chip heat dissipation system comprises a heat sink substrate, phase change capsules, an acoustic field generating unit, and a microcontroller. The acoustic field generating units are arranged in a rectangular array adjacent to the heat dissipation surface of the chip and integrated onto the heat sink substrate. The acoustic field generating units are configured to generate an acoustic field and exert a combined attractive force on the phase change capsules directed toward the heat dissipation surface. The microcontroller is configured to control the operation of the acoustic field generating units near the hotspot. Embodiments of the present invention control the position of the phase change capsules in the coolant based on acoustic radiation force, capturing the phase change capsules at the hotspot of the chip. Simultaneously, utilizing the acoustic characteristic of the phase change capsule core, which experiences a reduced acoustic radiation force after transitioning from solid to liquid, the phase change capsules, which have already completed phase change and absorbed heat, are released from the hotspot of the chip, thereby significantly improving the cooling effect on the hotspot of the chip.

Description

Technical Field

[0001] The present invention relates to the field of chip radiators, and in particular to a chip heat dissipation system based on a voice-controlled phase change capsule.

[0002] The present invention also relates to a heat dissipation method of a chip heat dissipation system based on a voice-controlled phase change capsule. Background Art

[0003] Two different areas of the same integrated circuit chip may dissipate different amounts of heat during operation, resulting in local overheating. In this case, while the water cooling device can fully cool the hottest area of ​​the chip, the cooling effect of the coldest area of ​​the chip exceeds the necessary level, causing the pump circulating the coolant in the device to generate unnecessary power consumption. Summary of the Invention

[0004] The purpose of the present invention is to provide a chip heat dissipation system and heat dissipation method based on sound-controlled phase change capsules to solve the inefficient problem of indiscriminate cooling of non-uniform overheating areas by traditional water cooling.

[0005] In order to solve the above technical problems, the present invention specifically provides the following technical solutions:

[0006] A chip heat dissipation system based on a sound-controlled phase change capsule, comprising:

[0007] The heat sink substrate contacts the heat dissipation surface of the chip and has a cooling liquid flow channel formed therein for the cooling liquid to flow through;

[0008] a plurality of phase change capsules suspended in a cooling liquid, wherein the phase change capsules include a core capable of undergoing a solid-liquid phase change to absorb heat;

[0009] a plurality of sound field generating units, arranged in a rectangular array adjacent to the heat dissipation surface of the chip and integrated on the heat sink substrate, the sound field generating units being used to generate a sound field in the coolant, the sound field generating a combined attractive force on the phase change capsules directed toward the heat dissipation surface;

[0010] a microcontroller, configured to receive signals sent by the temperature sensor to monitor the temperature of the chip in real time, and, upon detecting a hot spot, control the sound field generating unit near the hot spot to operate so that the phase change capsules gather at the hot spot;

[0011] The chip cooling system is configured to meet the following operating conditions:

[0012] When the core is solid, the phase change capsules have a first acoustic characteristic that is easily controlled by the acoustic field, and the attractive force can overcome the buoyancy and fluid drag generated by the coolant, so that the phase change capsules approach and remain on the heat dissipation surface, forming a high-density capsule layer for heat absorption;

[0013] When the core turns into liquid due to heat absorption, the phase change capsule changes to a second acoustic characteristic that is difficult to be controlled by the sound field, so that the buoyancy and fluid drag generated by the coolant can overcome the weakened attractive force, driving the phase change capsule that has completed phase change and heat absorption to flow downstream with the coolant.

[0014] Furthermore, it also includes an external heat exchanger and a liquid pump. The external heat exchanger is connected to the coolant flow channel through a coolant pipeline. The liquid pump is used to drive the coolant and the phase change capsules to circulate between the coolant flow channel and the external heat exchanger. After absorbing heat through phase change, the phase change capsules release the absorbed heat through phase change in a colder area of ​​the coolant or in the external heat exchanger to complete regeneration.

[0015] Furthermore, the phase change capsule includes a shell, a core and weight particles, and the weight particles are mixed in the shell and / or the core so that the density of the phase change capsule is greater than the density of the coolant.

[0016] Furthermore, the density of the phase change capsule is 1.04-1.09 g / cm³.

[0017] Furthermore, the size of the phase change capsules ranges from 30 microns to 200 microns.

[0018] Furthermore, the phase transition temperature of the core ranges from 50°C to 80°C.

[0019] Furthermore, the shell is a polymer material, the core is an RT65 paraffin-based material, and the weight particles are zinc oxide.

[0020] Furthermore, the sound field generating unit includes a piezoelectric ceramic sheet, a fixing plate and a pressure ring. The piezoelectric ceramic sheet and the pressure ring are fixedly connected to the radiator substrate. The center of the fixing plate is fixedly connected to the vibration part of the piezoelectric ceramic, and the edge of the fixing plate is fixedly connected to the pressure ring. When the piezoelectric ceramic sheet is energized, it drives the fixing plate to generate bending vibration, and the fixing plate generates a sound field in the coolant to attract the phase change capsule to approach.

[0021] Furthermore, the radiator substrate is integrated with a micro-limiter adjacent to and suspended above the sound field generating unit. The micro-limiter is a column array or a pit array. The depth or height of the micro-limiter can partially hinder the phase change capsule, so that the phase change capsule with a solid core cannot cross over the micro-limiter, while the phase change capsule with a liquid core can cross over the micro-limiter after the sound radiation force it receives is reduced.

[0022] A heat dissipation method for a chip heat dissipation system based on a voice-controlled phase change capsule comprises the following steps:

[0023] Conventional circulation and heat transfer: driving the coolant and the phase change capsules suspended in the coolant to circulate between the radiator substrate and the external heat exchanger, transferring the heat of the chip to the external heat exchanger through the coolant to release it to the external environment;

[0024] Overheat detection and enhanced cooling: The microcontroller continuously monitors the temperature of the chip through a temperature sensor. When it detects that the temperature of a local heat dissipation area of ​​the chip exceeds a preset first threshold and is determined to be an overheating point, the microcontroller controls the sound field generating unit near the overheating point to generate an acoustic field in the coolant, thereby driving the phase change capsule close to the sound field generating unit through an attractive force and causing it to remain at the overheating point. After the attractive force on the phase change capsule decreases, the phase change capsule, which has completed phase change heat absorption, flows downstream with the coolant and releases the absorbed heat through phase change heat release in a cooler area of ​​the coolant or in the external heat exchanger, completing regeneration.

[0025] Overheating relief and capsule regeneration: When the temperature of the overheating point is lower than the preset second threshold, the microcontroller determines that the overheating point is controlled, thereby shutting down the control of the sound field generating unit, allowing the phase change capsule to flow downstream with the coolant and release the absorbed heat through phase change in a cooler area of ​​the coolant or in an external heat exchanger, completing regeneration.

[0026] Compared with the prior art, this application has the following beneficial effects:

[0027] The embodiments of the present invention control the position of the phase change capsules in the coolant based on the acoustic radiation force generated by the momentum transfer of the sound field to the microparticles, fix the phase change capsules at the hot spots of the chip, and at the same time utilize the acoustic property of the phase change capsules that is subjected to reduced acoustic radiation force after the core changes from solid to liquid to release the phase change capsules that have completed phase change and heat absorption and are fixed at the hot spots of the chip, thereby significantly improving the cooling effect on the hot spots of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are merely exemplary, and those skilled in the art can derive other implementation drawings based on the provided drawings without inventive effort.

[0029] Figure 1 A perspective view of a partial structure of an embodiment of the present invention shows the distribution of phase change capsules in the coolant flow channel when the sound field generating unit is not working;

[0030] Figure 2Another perspective view of a partial structure of an embodiment of the present invention shows the distribution of phase change capsules in the coolant flow channel when the sound field generating unit is working;

[0031] Figure 3 for Figure 2 A half-section view of the working condition shown;

[0032] Figure 4 Schematic diagram of the relative positional relationship between the micro-stopper and the sound field generating unit according to an embodiment of the present invention;

[0033] The numbers in the figure represent the following:

[0034] 1- radiator substrate; 11- coolant flow channel; 2- phase change capsule; 3- sound field generating unit; 31- piezoelectric ceramic piece; 32- support plate; 33- pressure ring; 4- micro limiter. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0036] The core technical means of the present invention is: adding phase change capsules 2 to the coolant, using the sound field to control the phase change capsules 2 to gather at the hot spots of the chip, thereby enhancing the cooling effect of the hot spots through phase change heat absorption, and based on the changes in the acoustic characteristics of the phase change capsules 2 before and after the phase change, the phase change capsules 2 that have completed phase change heat absorption automatically leave the hot spots of the chip.

[0037] Among them, the core technical means is based on two physical properties of the phase change capsule 2.

[0038] Physical characteristic 1: The phase change capsule 2 is a spherical microparticle. The microparticle suspended in the sound field will be affected by the time-averaged force caused by the scattering of sound waves. This force is called the acoustic radiation force.

[0039] The acoustic radiation force is the net force acting on particles due to the momentum transfer from the acoustic field to the particles. In microfluidic devices, it can be used to move, control, and sort particles. This control of particles is called acoustophoresis, which is the movement generated by sound. The acoustic radiation force acts directly on the particles, while the acoustic flow induces a drag force on the particles. The magnitude and / or direction of the acoustophoretic effect depends on the size and mechanical properties of the particles, as well as the fluid properties.

[0040] Current research results (Formation of inverse Chladni patterns in liquids atmicroscale: roles of acoustic radiation and streaming-induced drag forces, Junjun Lei, 2017) show that on a vibrating fixed circular plate in contact with water, microparticles suspended in the water are affected by the combined effects of acoustic radiation, acoustic streaming, gravity, and buoyancy. Among them, the acoustic radiation force and the drag force induced by acoustic streaming can both drive the microparticles to the nearest vibration antinode, that is, make the microparticles close to the fixed circular plate.

[0041] In this study, the radius of the clamped circular plate is 800 µm and the thickness is 5.9 µm. The researchers used a piezoelectric ceramic piece to drive the clamped circular plate to undergo bending vibration. The vibration amplitude of the clamped circular plate was 0.4 µm and the frequency was 83,448 Hz. The microparticles were polystyrene microspheres with a radius of 30 µm and a density of 1.04-1.09 g / cm³. Among them, the critical value of the microparticle radius is 9.4 µm. Microparticles with a radius less than 9.4 µm find it difficult to approach the clamped circular plate.

[0042] Based on the physical property 1, it can be concluded that: a fixed support plate 32 driven by a piezoelectric ceramic plate 31 is set in the coolant. When the fixed support plate 32 vibrates to form an acoustic field in the coolant, if the density of the phase change capsule 2 is greater than the coolant (the density of deionized water is 1g / cm 3 ), and the radius of the phase change capsule 2 is greater than a critical value (for example, 9.4 μm calculated in the above research results), the phase change capsule 2 can approach and stably remain near the surface of the fixing plate 32. This feature helps to use the acoustic field to capture the phase change capsule 2 in the coolant, so that the phase change capsule 2 remains at the hot spot of the chip.

[0043] Physical characteristic 2: Under the same acoustic field conditions, when the core of the phase change capsule 2 is made of paraffin, its acoustic response changes significantly with the phase state of the core.

[0044] When paraffin is in solid state, it has greater density, acoustic impedance and lower compressibility, forming a stronger acoustic contrast with water and being subject to greater acoustic radiation force. When paraffin is in liquid state, its density and acoustic impedance decrease, while its compressibility increases, and the acoustic radiation force it is subject to is significantly weakened.

[0045] Based on the second physical characteristic, it can be concluded that when the core of the phase change capsule 2 is solid, the phase change capsule 2 is subjected to a larger attractive force, making it easier to approach the surface of the fixed support plate 32. When the core of the phase change capsule 2 is liquid, the phase change capsule 2 is subjected to a smaller attractive force and is more easily carried away by the flow of the coolant.

[0046] The basic principle of the present invention is to use physical property 1 to capture the phase change capsule 2 at the hot spot of the chip, and use physical property 2 to release the phase change capsule 2 that has completed phase change and heat absorption, so that it leaves the hot spot of the chip.

[0047] Based on the above principles, the following provides a chip cooling system and cooling method based on acoustically controlled phase change capsules to solve the inefficient problem of indiscriminate cooling of non-uniform overheating areas by traditional water cooling.

[0048] refer to Figure 1 The chip cooling system includes: a radiator substrate 1, a number of phase change capsules 2, a number of sound field generating units 3 and a microcontroller. Figure 1 The figure shows a coolant flow channel 11 inside the radiator substrate 1, a number of phase change capsules 2 flowing in the coolant flow channel 11, and an acoustic field generating unit 3 inside the coolant flow channel. The figure does not show a microcontroller.

[0049] The heat sink substrate 1 contacts a heat dissipation surface of the chip, and has a cooling liquid flow channel 11 formed therein for the cooling liquid to flow through.

[0050] A plurality of phase change capsules 2 are suspended in the cooling liquid. The phase change capsules 2 include a core that can undergo solid-liquid phase change to absorb heat.

[0051] Several sound field generating units 3 are arranged in a rectangular array and integrated on the radiator substrate 1 and adjacent to the heat dissipation surface of the chip. The sound field generating units 3 are used to generate a sound field in the coolant, and the sound field generates an attractive force on the phase change capsule 2 pointing to the heat dissipation surface.

[0052] The microcontroller is used to receive signals sent by the temperature sensor to monitor the temperature of the chip in real time. The temperature sensor can be a temperature sensor distributed in a rectangular array integrated inside the radiator substrate 1, or a temperature sensor integrated inside the chip.

[0053] When the microcontroller detects a hot spot, it controls the sound field generating unit 3 near the hot spot to operate, so that the phase change capsules 2 gather at the hot spot.

[0054] The chip cooling system is configured to meet the following operating conditions:

[0055] When the core is solid, the phase change capsule 2 has a first acoustic characteristic. Under the first acoustic characteristic, the attractive force generated by the acoustic field can overcome the buoyancy and fluid drag generated by the coolant, causing the phase change capsule 2 to approach and remain on the heat dissipation surface, forming a high-density capsule layer for heat absorption.

[0056] When the core turns into liquid due to heat absorption, the phase change capsule 2 changes to have the second acoustic characteristic. Under the second acoustic characteristic, the attractive force generated by the sound field is weakened, so that the buoyancy and fluid drag generated by the coolant are sufficient to overcome the weakened attractive force, driving the phase change capsule 2 to flow downstream with the coolant.

[0057] The chip cooling system also includes an external heat exchanger and a liquid pump. The external heat exchanger and the liquid pump are not shown in the figure. The external heat exchanger is connected to the coolant channel 11 through a coolant pipeline. The liquid pump is used to drive the coolant and the phase change capsule 2 to circulate between the coolant channel 11 and the external heat exchanger. After absorbing heat through phase change, the phase change capsule 2 releases the absorbed heat through phase change in a colder area of ​​the coolant or in the external heat exchanger, completing regeneration to prepare for absorbing heat again.

[0058] Deionized water is used as the coolant, and a liquid pump is selected that can smoothly transport the fluid containing the suspended microcapsules, such as a centrifugal pump with low shear force.

[0059] Figure 2 The sphere in the figure represents the phase change capsule 2, and the thin line connecting the center of the sphere represents the moving trajectory of the phase change capsule 2. Figure 2 The core of the phase change capsule 2 near the sound field generating unit 3 is solid. Figure 2 The core of the phase change capsule 2 far away from the sound field generating unit 3 is liquid.

[0060] refer to Figure 2 The heat dissipation method based on the above chip heat dissipation system includes the following steps.

[0061] Conventional circulation and heat transfer: Drive the coolant and the phase change capsules 2 suspended in the coolant to circulate between the coolant channel 11 of the radiator substrate 1 and the external heat exchanger, and transfer the heat of the chip to the external heat exchanger through the coolant to release it to the external environment.

[0062] Overheat detection and enhanced cooling: The microcontroller continuously monitors the temperature of the local heat dissipation area of ​​the chip. When it detects that the temperature of a local heat dissipation area exceeds the preset first threshold and is determined to be an overheat point, the sound field generating unit 3 is controlled to generate a sound field in the coolant, and the phase change capsule 2 is driven to approach the sound field generating unit 3 through the attraction force and stay at the overheat point, thereby enhancing the cooling effect on the overheat point through the phase change heat absorption of the phase change capsule 2.

[0063] Overheating relief and capsule regeneration: When the temperature of the overheating point is lower than the preset second threshold, the overheating point is determined to be under control, and the microcontroller turns off the control of the sound field generating unit 3, so that the phase change capsule 2 flows downstream with the coolant and releases the absorbed heat through phase change in a cooler area of ​​the coolant or in an external heat exchanger, completing regeneration and preparing to absorb heat again.

[0064] In the above embodiment, the phase change capsule 2 includes a shell, a core and counterweight particles, and the counterweight particles are mixed in the shell and / or the core so that the density of the phase change capsule 2 is slightly greater than the density of deionized water. For example, the density of the phase change capsule 2 is 1.04-1.09 g / cm³.

[0065] The manufacturing method of the phase change capsule 2 includes the following two methods:

[0066] Preparation of single-layer phase change capsules: The counterweight particles are evenly dispersed into the liquid core to form a suspension, and then a one-step microencapsulation technology (such as interfacial polymerization, in situ polymerization) is used to directly form a polymer shell on the outside of the suspension droplets to prepare a single-layer capsule containing phase change materials. After cooling, the interior solidifies.

[0067] Preparation of double-layer phase change capsules: First, the core is encapsulated into a microcapsule with an outer shell as the inner core. Subsequently, the counterweight particles are firmly fixed to the outer surface of the formed inner capsule through surface modification and adsorption, bonding or secondary coating, thereby preparing a double-layer structure capsule.

[0068] Preferably, the shell of the phase change capsule 2 is made of polymer material, and the size of the capsule is in the range of 30 microns to 200 microns, so as to be suspended and flow in the flow channel.

[0069] Preferably, the phase change temperature of the core of the phase change capsule 2 is in the range of 50°C to 80°C.

[0070] Furthermore, the core of the phase change capsule 2 is RT65 paraffin-based material.

[0071] Furthermore, the weight particles are made of a material having both high density and thermal conductivity, such as zinc oxide.

[0072] refer to Figure 3 The sound field generating unit 3 includes a piezoelectric ceramic piece 31 and a fixing plate 32. The fixing plate 32 is preferably circular. The piezoelectric ceramic piece 31 is fixedly connected to the radiator substrate 1. The center of the fixing plate 32 is adhered to the vibration part of the piezoelectric ceramic. The edge of the fixing plate 32 is fixed to the radiator substrate 1 using a pressure ring 33 or a bracket.

[0073] When the piezoelectric ceramic piece 31 is energized, it drives the fixing plate 32 to generate bending vibration, and the fixing plate 32 generates an acoustic field in the coolant to attract the phase change capsule 2 to approach.

[0074] Furthermore, based on the above embodiment, a micro-stopper 4 adjacent to each sound field generating unit 3 is integrated on the radiator substrate 1. The micro-stopper 4 is used to provide mechanical constraints on the phase change capsule 2 under the action of the attractive force, thereby enhancing the ability of the sound field to capture the phase change capsule 2.

[0075] refer to Figure 4The micro-stopper 4 is a column array or a pit array suspended above the sound field generating unit 3. The depth or height of the micro-stopper 4 can partially hinder the phase change capsule 2, so that the phase change capsule 2 with a solid core cannot cross the micro-stopper 4, while the phase change capsule 2 with a liquid core can cross the micro-stopper 4 after the sound radiation force it receives is reduced.

[0076] Figure 4 What is shown is a column array, the lateral spacing between each column (perpendicular to the coolant flow direction) is smaller than the diameter of the phase change capsule 2, and the longitudinal spacing between each column (parallel to the coolant flow direction) is larger than the diameter of the phase change capsule 2.

[0077] The above embodiments are merely exemplary embodiments of the present invention and are not intended to limit the scope of the present invention. The scope of protection of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the spirit and scope of protection of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the scope of protection of the embodiments of the present invention.

Claims

1. A chip cooling system based on voice-controlled phase change capsules, characterized in that: include: A heat sink substrate (1) is in contact with the heat dissipation surface of the chip and has a cooling liquid flow channel (11) formed therein for the cooling liquid to flow through; A plurality of phase change capsules (2) are suspended in a cooling liquid, wherein the phase change capsules (2) include a core capable of undergoing a solid-liquid phase change to absorb heat; A plurality of sound field generating units (3) are arranged in a rectangular array adjacent to the heat dissipation surface of the chip and integrated on the heat sink substrate (1), wherein the sound field generating units (3) are used to generate a sound field in the coolant, and the sound field generates an attractive force directed toward the heat dissipation surface on the phase change capsule (2); A microcontroller is used to receive a signal sent by a temperature sensor to monitor the temperature of the chip in real time, and when a hot spot is detected, controls the sound field generating unit (3) near the hot spot to operate so that the phase change capsules (2) gather at the hot spot; The chip cooling system is configured to meet the following operating conditions: When the core is solid, the phase change capsule (2) has a first acoustic characteristic that is easily controlled by the sound field, and the attraction force can overcome the buoyancy and fluid drag generated by the coolant, so that the phase change capsule (2) approaches and stays on the heat dissipation surface, forming a high-density capsule layer for heat absorption; When the core is transformed into a liquid state due to heat absorption, the phase change capsule (2) is transformed into a second acoustic characteristic that is difficult to be controlled by the sound field, so that the buoyancy and fluid drag generated by the coolant can overcome the weakened attractive force, driving the phase change capsule (2) that has completed phase change and heat absorption to flow downstream with the coolant.

2. A chip heat dissipation system based on voice-controlled phase change capsules according to claim 1, characterized in that: It also includes an external heat exchanger and a liquid pump, wherein the external heat exchanger is connected to the coolant flow channel (11) through a coolant pipeline, and the liquid pump is used to drive the coolant and the phase change capsule (2) to circulate between the coolant flow channel (11) and the external heat exchanger. After the phase change absorbs heat, the phase change capsule (2) releases the absorbed heat in a colder area of ​​the coolant or in the external heat exchanger through phase change exothermicity, thereby completing regeneration.

3. The chip heat dissipation system based on voice-controlled phase change capsule according to claim 1, characterized in that: The phase-change capsule (2) comprises an outer shell, a core, and weight particles, wherein the weight particles are mixed in the outer shell and / or the core so that the density of the phase-change capsule (2) is greater than the density of the coolant.

4. The chip heat dissipation system based on voice-controlled phase change capsule according to claim 3, characterized in that: The density of the phase change capsule (2) is 1.04-1.09 g / cm³.

5. The chip heat dissipation system based on voice-controlled phase change capsule according to claim 3, characterized in that: The size of the phase change capsules (2) ranges from 30 microns to 200 microns.

6. The chip heat dissipation system based on voice-controlled phase change capsule according to claim 5, characterized in that: The phase transition temperature of the core ranges from 50°C to 80°C.

7. The chip heat dissipation system based on voice-controlled phase change capsule according to claim 6, characterized in that: The shell is a polymer material, the core is an RT65 paraffin-based material, and the weight particles are zinc oxide.

8. The chip heat dissipation system based on voice-controlled phase change capsule according to claim 1, characterized in that: The sound field generating unit (3) includes a piezoelectric ceramic piece (31), a fixing plate (32) and a pressure ring (33), wherein the piezoelectric ceramic piece (31) and the pressure ring (33) are fixedly connected to the radiator substrate (1), the center of the fixing plate (32) is fixedly connected to the vibration part of the piezoelectric ceramic, and the edge of the fixing plate (32) is fixedly connected to the pressure ring (33), and when the piezoelectric ceramic piece (31) is energized, it drives the fixing plate (32) to generate bending vibration, and the fixing plate (32) generates a sound field in the coolant to attract the phase change capsule (2) to approach.

9. The chip heat dissipation system based on voice-controlled phase change capsule according to claim 1, characterized in that: The radiator substrate (1) is integrated with a micro-stopper (4) adjacent to and suspended above the sound field generating unit (3). The micro-stopper (4) is a column array or a pit array. The depth or height of the micro-stopper (4) can partially hinder the phase change capsule (2), so that the phase change capsule (2) with a solid core cannot climb over the micro-stopper (4), while the phase change capsule (2) with a liquid core can climb over the micro-stopper (4) after the sound radiation force it receives is reduced.

10. The heat dissipation method of a chip heat dissipation system based on a voice-controlled phase change capsule according to claim 2, characterized in that: The steps include: Conventional circulation and heat transfer: driving the coolant and the phase change capsules (2) suspended in the coolant to circulate between the radiator substrate (1) and the external heat exchanger, transferring the heat of the chip to the external heat exchanger through the coolant to release it to the external environment; Overheat detection and enhanced cooling: The microcontroller continuously monitors the temperature of the chip through a temperature sensor. When it is detected that the temperature of a local heat dissipation area of ​​the chip exceeds a preset first threshold value and is determined to be an overheat point, the microcontroller controls the sound field generating unit (3) adjacent to the overheat point to generate a sound field in the coolant, thereby driving the phase change capsule (2) close to the sound field generating unit (3) through an attractive force and staying at the overheat point. After the attractive force is reduced, the phase change capsule (2) that has completed phase change heat absorption flows downstream with the coolant, and releases the absorbed heat through phase change heat release in a colder area of ​​the coolant or in the external heat exchanger, completing regeneration. Overheating relief and capsule regeneration: When the temperature of the overheating point is lower than a preset second threshold, the microcontroller determines that the overheating point is controlled, thereby shutting down the control of the sound field generating unit (3), causing the phase change capsule (2) to flow downstream with the coolant and release the absorbed heat through phase change in a cooler area of ​​the coolant or in an external heat exchanger, thereby completing regeneration.

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