A laser repair apparatus and method for large circuit boards

Abstract

The present application relates to the field of circuit board laser processing, and discloses a laser repairing device and processing method for large circuit board, which can detect large flexible circuit board products. The present application comprises at least one detection device and a laser repairing device, and the detection device is electrically connected with the laser repairing device. The detection device comprises a mounting base, an adsorption mechanism arranged on the mounting base, the adsorption mechanism being used for adsorbing products on the mounting base, a conveying mechanism arranged on the mounting base, the conveying mechanism being capable of moving along the Y direction, a plurality of detection mechanisms arranged on the conveying mechanism along the X direction, the detection mechanism comprising a detection support, a position adjusting assembly and a detection piece, the detection support being movably arranged on the conveying mechanism along the Z direction, the position adjusting assembly and the detection piece being arranged on the detection support, a plurality of positioning mechanisms, the positioning mechanism being electrically connected with the position adjusting assembly in one-to-one correspondence, and the positioning mechanism being used for positioning a positioning point on the product and determining the distance of the detection mechanism to the product in the Z direction.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of laser processing of circuit boards, and in particular to a laser repair device and processing method for large circuit boards. BACKGROUND

[0002] In the current OLED display screen body lighting detection link, the conventional operation is to connect the PG (Pattern Generator, image generator, i.e. power supply) adapter board with the flexible circuit board, and then to accurately align, tightly adhere and press the flexible circuit board with the display screen body. Through this way, the PG current signal can be successfully transmitted to the display screen body, so that it can be successfully lit up, and the possible bad points on the circuit board can be accurately identified, thereby providing strong support for the subsequent bad point repair work.

[0003] However, in the existing laser processing field, the traditional operation mode is usually to cut the large whole flexible circuit board into small flexible circuit boards required finally, and then to detect and process these small circuit boards respectively. This mode has many shortcomings, especially in terms of efficiency. Since the feeding and discharging operations need to be carried out for each product separately, the whole process is tedious and time-consuming, which greatly reduces the work efficiency and has been difficult to meet the urgent needs of the current technological development for high efficiency.

[0004] If the large circuit board is directly used for laser detection, there will be two major difficulties. On the one hand, the large circuit board is composed of multiple small circuit boards which are not cut yet, and each small circuit board is independent of each other. In this case, if a single detection head is used to detect each small circuit board in turn, the detection efficiency will inevitably be low, which is difficult to meet the timeliness requirements of large-scale production. On the other hand, the flexible circuit board itself has a certain flexible deformation ability. During the detection process, it is difficult to ensure that the large flexible circuit board always maintains good flatness, and it is impossible to guarantee that it is completely in the same plane. This leads to the deviation of the pressing position during detection, and further affects the final test results, which lays many hidden dangers for the subsequent production process. SUMMARY

[0005] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a laser repair device for large circuit boards, which can ensure the accurate correspondence between the detection piece and the product positioning point, so as to realize high-precision pressing detection during the detection process, effectively avoid the pressing position deviation problem caused by the flexible deformation of the flexible circuit board, and ensure the accuracy and reliability of the detection results.

[0006] The present application also proposes a processing method for the laser repair device with the above large circuit board.

[0007] In one aspect, the laser repair device for large circuit board according to the embodiments of the present application comprises: at least one detection device and a laser repair device, wherein the detection device is electrically connected with the laser repair device;

[0008] The detection device comprises:

[0009] A mounting base;

[0010] An adsorption mechanism arranged on the mounting base, wherein the adsorption mechanism is used for adsorbing products on the mounting base;

[0011] A conveying mechanism arranged on the mounting base, wherein the conveying mechanism is capable of moving along a Y direction;

[0012] A plurality of detection mechanisms arranged on the conveying mechanism along an X direction, wherein each detection mechanism comprises a detection support, a position adjusting assembly and a detection piece, the detection support is movably arranged on the conveying mechanism along a Z direction, the position adjusting assembly and the detection piece are arranged on the detection support, and the position adjusting assembly drives the detection piece to move along a straight line direction of X and Y and rotate around the Z direction;

[0013] A plurality of positioning mechanisms electrically connected with the position adjusting assembly one by one, wherein the positioning mechanisms are used for positioning a positioning point on a product and determining a distance from the detection mechanism to the product in the Z direction.

[0014] According to some embodiments of the present application, the mounting base is provided with a plurality of support frames along the X direction, gaps are arranged between adjacent support frames, and the adsorption mechanism is arranged on the support frames.

[0015] According to some embodiments of the present application, the device further comprises a driving assembly, wherein the driving assembly is capable of driving the support frames to slide along left and right directions.

[0016] According to some embodiments of the present application, the mounting base further comprises a sliding support frame, a plurality of the support frames are arranged on the sliding support frame, and the driving assembly is capable of driving the sliding support frame to slide along the X direction. The mounting base comprises at least two groups of the support frames, the driving assemblies and the sliding support frames, each group of the driving assemblies is capable of driving the support frames to slide by driving one sliding support frame.

[0017] According to some embodiments of the present application, the device further comprises a transfer mechanism, wherein the transfer mechanism comprises a transfer support frame and a transfer driving piece, the transfer support frame is provided with a plurality of support rods, the support rods are capable of being inserted into the gaps between the support frames, and the transfer driving piece is used for driving the transfer support frame to move.

[0018] According to some embodiments of the present application, the transport mechanism comprises a gantry and a slide rail, the gantry is capable of sliding along the slide rail, and a plurality of the detection mechanisms are sequentially arranged along the X direction on the gantry.

[0019] According to some embodiments of the present application, the position adjusting assembly comprises:

[0020] a first driving member capable of driving the detection member to move along the X direction;

[0021] a second driving member capable of driving the detection member and the first driving member to move along the Y direction;

[0022] a third driving member capable of driving the first driving member, the second driving member and the detection member to rotate around the Z direction as the center.

[0023] According to some embodiments of the present application, the detection mechanism further comprises a buffer member, one end of the buffer member is connected to the detection support, and the other end is connected to the position adjusting assembly.

[0024] According to some embodiments of the present application, the positioning mechanism comprises a distance sensor and a photographing assembly, the distance sensor is used to determine the distance between the detection mechanism and the product in the Z direction, and the photographing assembly is used to locate the positioning point on the product.

[0025] In another aspect, the processing method according to the embodiments of the present application comprises the laser repair device for large circuit boards according to the above-mentioned embodiments of the present application, and comprises the following steps:

[0026] S1, feeding;

[0027] S2, the transport mechanism moves the detection mechanism along the Y direction, and a plurality of the detection mechanisms are located above the positions to be detected of the product, and the detection mechanism moves downward to the first height;

[0028] S3, the positioning mechanism detects the position of the positioning point of the product, determines the distance between the detection mechanism and the product in the Z direction, and the position adjusting assembly adjusts the position of the detection member, so that the calibration needle of the detection member corresponds to the positioning point of the product;

[0029] S4, the detection mechanism moves downward, and the detection member and the product are in contact and pressed to detect.

[0030] The embodiments of the present application have at least the following beneficial effects:

[0031] After the product is laid on the mounting base, the product is fixed by the adsorption mechanism, so as to be closely attached to the mounting base, and the stability of the product in the detection and processing process is ensured; the detection mechanism is moved to the above of the corresponding position by the transport mechanism, the detection mechanism moves downward to the first height, and a plurality of the detection mechanisms complete the preliminary positioning of the detection member;

[0032] The positioning mechanism detects the position of the positioning point on the product. The position adjustment component finely adjusts the corresponding detection part in the X, Y and Z axis rotation directions respectively to accurately position the detection part. The detection pressure height and movement distance are controlled according to the distance between the detection mechanism and the product in the Z direction. The detection part completes the inspection of a row of small circuit boards.

[0033] Through the mobile transport mechanism, the inspection mechanism can process multiple rows of small products. After the inspection is completed, the large products are uniformly laser processed and finally cut into small products.

[0034] With the help of the positioning mechanism's precise detection of the product's positioning points and the position adjustment component's fine adjustment of the detection part's position, it is possible to ensure that the detection part and the product's positioning point are accurately corresponded, thereby achieving high-precision crimping detection during the detection process, effectively avoiding the crimping position deviation problem caused by the flexible deformation of the flexible circuit board, ensuring the accuracy and reliability of the test results, and providing a solid data foundation for subsequent laser repair work, thereby ensuring product quality and improving overall production efficiency and product quality stability.

[0035] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0037] Figure 1 This is a schematic diagram of the overall structure of a laser repair device for a large circuit board according to an embodiment of the present invention;

[0038] Figure 2 for Figure 1 A schematic diagram of a detection mechanism of a laser repair device for a large circuit board is shown;

[0039] Figure 3 for Figure 1 A schematic diagram showing a mounting base of a laser repair device for large circuit boards.

[0040] Reference numerals:

[0041] Name Reference Name Reference Mounting base 100 Slide rail 320 Support frame 110 Detection mechanism 400 Gap 120 Detection bracket 410 Slip bracket 130 Position adjusting assembly 420 Suction mechanism 200 Detection piece 430 Transport mechanism 300 Driving assembly 600 Gantry 310 Buffer piece 700 DETAILED DESCRIPTION

[0042] The following content will describe several embodiments of the present invention, including embodiments corresponding to the accompanying drawings. It can be understood that the accompanying drawings are used to assist in understanding the technical features and technical solutions of the present invention, and should not be understood as limiting the scope of protection of the present invention.

[0043] The concept, specific structure and generated technical effects of the present application will be described clearly and completely in combination with the embodiments and drawings, so as to fully understand the purposes, schemes and effects of the present application. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0044] It should be noted that, unless otherwise explicitly limited, when a certain feature is referred to as being "fixed", "connected", "mounted" on another feature, it can be directly fixed, connected or mounted on the other feature, or indirectly fixed, connected or mounted on the other feature. The words "fixed", "connected", "mounted" and the like should be understood in a broad sense, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0045] It should be noted that the orientation or positional relationship described in the present application, such as up, down, left, right, top, bottom, front, back, inside and outside, is based on the orientation or positional relationship of the drawings or embodiments, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0046] It should be noted that the term "and / or" used in the present application includes any combination of one or more related listed items, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, more than, etc. are not included in the number, above, below, within, etc. are understood to include the number.

[0047] It should be noted that in the present application, if the first, second is described for the purpose of distinguishing technical features, it cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the sequence of indicated technical features.

[0048] It should be noted that, unless otherwise explicitly limited, all technical and scientific terms used herein have the same meaning as understood by those skilled in the art. The terms used in the specification are only used to describe the specific embodiments, and are not intended to limit the present application.

[0049] Reference Figures 1-3 The basic embodiment of the first aspect of the present application provides a laser repair device for large circuit boards, comprising: at least one detection device and a laser repair device, the detection device is electrically connected with the laser repair device;

[0050] The detection device comprises:

[0051] The mounting base 100;

[0052] The adsorption mechanism 200 is arranged on the mounting base 100, and the adsorption mechanism 200 is used for adsorbing products on the mounting base 100.

[0053] The conveying mechanism 300 is arranged on the mounting base 100, and the conveying mechanism 300 can move along the Y direction.

[0054] The plurality of detection mechanisms 400 are arranged on the conveying mechanism 300 along the X direction, the detection mechanism 400 comprises a detection support 410, a position adjusting assembly 420 and a detection piece 430, the detection support 410 is movably arranged on the conveying mechanism 300 along the Z direction, the position adjusting assembly 420 and the detection piece 430 are arranged on the detection support 410, and the position adjusting assembly 420 drives the detection piece 430 to move along the linear direction of the X and Y directions and rotate around the Z direction as the center.

[0055] The plurality of positioning mechanisms are electrically connected with the position adjusting assembly 420 in one-to-one correspondence, and the positioning mechanism is used for positioning a positioning point on the product and determining the distance of the detection mechanism 400 to the product in the Z direction.

[0056] Further, when the detection device is provided with two, the first detection device and the second detection device are provided, the first detection device, the laser repair device and the second detection device are sequentially arranged, the flexible circuit board is moved through the transfer mechanism, the bad point position is detected through the first detection device, the product is repaired through the laser repair device, the bad point position is detected again through the second detection device, and it is determined whether the repair is completed, and the efficiency is higher by adopting two detection devices; when the detection device is provided with one, the product is transported back and forth between the detection device and the laser repair device through the transfer mechanism, the detection device is used twice in one processing process, and the detection device detects the product before and after processing, respectively, so that the equipment use is saved.

[0057] The basic embodiment of the second aspect of the application provides a processing method applied to a laser repair device of a large circuit board, and the method comprises the following steps:

[0058] S1, feeding;

[0059] S2, the conveying mechanism 300 moves the detection mechanism 400 along the Y direction, and the plurality of detection mechanisms 400 are located above the to-be-detected position of the product, and the detection mechanism 400 moves downward to the first height;

[0060] S3, the positioning mechanism detects the position of the positioning point of the product, determines the distance of the detection mechanism 400 to the product in the Z direction, the position adjusting assembly 420 adjusts the position of the detection piece 430, and the calibration needle of the detection piece 430 corresponds to the positioning point of the product;

[0061] S4, the detection mechanism 400 moves downward, the detection piece 430 contacts and presses the product for detection.

[0062] According to the embodiment of the present application, by being thus arranged, some effects can be achieved as follows. After the product is laid on the mounting base 100, the product is fixed by the adsorption mechanism 200 to tightly adhere to the mounting base 100, ensuring the stability of the product during detection and processing. The detection mechanism 400 is moved to the above of the corresponding position by the transportation mechanism 300, the detection mechanism 400 is lowered to the first height, and the plurality of detection mechanisms 400 complete the preliminary positioning of the detection pieces 430. The position of the positioning point on the product is detected by the positioning mechanism, and the position adjusting assembly 420 respectively finely adjusts the X, Y direction and the rotation direction of the Z axis of the corresponding detection piece 430, so that the detection piece 430 is precisely positioned. The detection height is controlled according to the distance from the detection mechanism 400 to the product in the Z direction, the moving distance is controlled, and the detection piece 430 completes the detection of a row of small circuit boards. After the detection mechanism 400 is moved by the transportation mechanism 300, the detection of multiple columns of small products is completed, and then the large product is uniformly laser processed, and finally the large product is cut into small products. With the accurate detection of the positioning point of the product by the positioning mechanism and the fine adjustment of the position of the detection piece 430 by the position adjusting assembly 420, the accurate correspondence between the detection piece 430 and the positioning point of the product can be ensured, so that high-precision crimping detection can be realized during detection, the crimping position deviation problem caused by the flexible deformation of the flexible circuit board can be effectively avoided, the accuracy and reliability of the detection result can be ensured, a solid data foundation is provided for subsequent laser repair work, and the product quality is thus guaranteed, and the overall production efficiency and product quality stability are improved. The product is transferred from the first detection device to the laser repair device by the transfer mechanism, the laser repair device performs laser repair on the product according to the data obtained by the first detection device, and after the repair is completed, the transfer mechanism transfers the product to the second detection device, and the product is detected again by the second detection device to confirm whether the product is repaired qualified.

[0063] It should be noted that the large circuit board can be cut into M(X direction) * N(Y direction) small circuit boards, and the corresponding detection mechanism 400 is provided with M corresponding to the X direction, and the transportation mechanism 300 is moved N times corresponding to the Y direction. Through positioning, each small module in the large circuit board can be detected.

[0064] It should be noted that the positioning point of the product is the pin of the circuit board, also known as the pin, in English, it is called pin. The main function of the circuit board pin is to realize the functions of signal input, output, power supply or ground connection. They are physical connection points on electronic components, integrated circuits or circuit boards, used for electrical connection with external circuits or devices. The pin is usually made of metal and can form reliable electrical contact with other metal parts such as wires, sockets or other pins.

[0065] It should be noted that the detection piece 430 is the existing mechanism for detecting the bad points of the circuit board, generally provided with a PG, which can be connected with the circuit board to provide power supply for the circuit board and control the circuit board to light up, and also provided with an identification structure, which can identify and locate the bad points of the circuit board.

[0066] It should be noted that the power structure used in the above structure is a common rotating motor, linear motor, cylinder or other structure that can provide linear or rotating power.

[0067] It should be noted that the laser repair device is an existing laser repair device, and its structure is not the main protection content of the present application, so it is not provided in the figure.

[0068] In some embodiments, the mounting base 100 is provided with a plurality of support frames 110 in the X direction, gaps 120 are provided between adjacent support frames 110, and the adsorption mechanism 200 is arranged on the support frame 110. It also includes a transfer mechanism, which includes a transfer bracket and a transfer driving piece, the transfer bracket is provided with a plurality of supporting rods which can be inserted into the gap 120 between the support frames 110, and the transfer driving piece is used to drive the transfer bracket to move. A plurality of support frames 110 are arranged on the rack in the left and right directions, so that a gap 120 is formed between the adjacent two support frames 110, and the supporting rods of the transfer bracket can be inserted into the gap 120 between the support frames 110; when transporting the flexible circuit board, the supporting rods of the transfer bracket are lifted from bottom to top, and the transfer bracket is moved from top to bottom by driving the transfer bracket to move above the support frame 110 by the second driving piece, so that the supporting rods are inserted into the gap 120 of the support frame 110, and the flexible circuit board falls on the support frame 110, and the transfer bracket moves out of the support frame 110 from the side, completing the product transportation; the adsorption mechanism 200 is arranged on the support frame 110, so that the product at the corresponding position of the support frame 110 can be attached to the support frame 110, and at this time the detection mechanism 400 detects the small modules on the support frame 110, which have higher flatness and are beneficial to detection.

[0069] In some embodiments, it also includes a driving assembly 600 which can drive the support frame 110 to slide in the left and right directions. By moving the support frame 110 left and right through the driving assembly 600, the position of the support frame 110 can be adjusted, so that the product originally on the gap 120 can also be adsorbed, ensuring the flatness effect of the corresponding position of the product.

[0070] In some embodiments, the mounting base 100 further comprises a sliding bracket 130, and the plurality of support frames 110 are arranged on the sliding bracket 130. The driving assembly 600 is capable of driving the sliding bracket 130 to slide in the X direction. The mounting base 100 comprises at least two groups of support frames 110, driving assemblies 600 and sliding brackets 130. Each group of driving assemblies 600 is capable of driving the support frames 110 to slide by driving one sliding bracket 130. By connecting a plurality of support frames 110 to one sliding bracket 130, the driving assembly 600 can drive a plurality of support frames 110 to move by driving one sliding bracket 130, thereby reducing the use of the power assembly. Each group of driving assemblies 600 is provided with a suction mechanism 200. When one group of sliding brackets 130 moves, the support frames 110 of the other group of sliding brackets 130 are used to suck the product, so as to avoid the product from moving with the support frames 110.

[0071] In some embodiments, the conveying mechanism 300 comprises a gantry 310 and a sliding rail 320. The gantry 310 is capable of sliding along the sliding rail 320. A plurality of detection mechanisms 400 are arranged on the gantry 310 in sequence in the X direction. By arranging a plurality of detection mechanisms 400 on the gantry 310, the detection mechanisms 400 can be moved in the Y direction synchronously by the gantry 310.

[0072] In some embodiments, the position adjusting assembly 420 comprises:

[0073] A first driving member capable of driving the detection member 430 to move in the X direction;

[0074] A second driving member capable of driving the detection member 430 and the first driving member to move in the Y direction;

[0075] A third driving member capable of driving the first driving member, the second driving member and the detection member 430 to rotate around the Z direction as the center.

[0076] In this arrangement, the first driving member can drive the detection member 430 to move in different directions, so that the detection member 430 can be accurately aligned, closely attached and crimped.

[0077] It should be noted that the positions of the first driving member, the second driving member and the third driving member can be exchanged as long as they can realize horizontal alignment.

[0078] In some embodiments, the detection mechanism 400 further comprises a buffer 700. One end of the buffer 700 is connected to the detection bracket 410, and the other end is connected to the position adjusting assembly 420. By arranging the buffer 700, the detection member 430 can avoid moving too far during crimping, which may damage the product.

[0079] In some embodiments, the positioning mechanism comprises a distance sensor for determining the distance of the detection mechanism 400 to the product Z direction, and a photographing assembly for positioning the positioning point on the product. The distance sensor, also known as a displacement sensor, is a kind of sensor for sensing the distance between it and an object to complete a predetermined function. The photographing assembly is generally a CCD camera, which can accurately position the position of an object. The data obtained is transmitted to the detection mechanism 400 to complete the adjustment of the position.

[0080] In some embodiments, the adsorption mechanism 200 is arranged on the corresponding support frame 110, and the support frame 110 is provided with a plurality of suction ports for adsorbing the product. The plurality of suction ports can adsorb the product, so that the circuit board is fixed on the support frame 110

[0081] In some embodiments, the adsorption mechanism 200 further comprises a negative pressure generating piece and a negative pressure pipeline, the negative pressure generating piece is connected to the negative pressure pipeline, the plurality of suction ports are distributed along the Y direction on the support frame 110, and the suction ports are communicated with the negative pressure pipeline. The negative pressure generating piece works to form negative pressure in the negative pressure pipeline, and the negative pressure pipeline can provide negative pressure for the plurality of suction ports, so that the plurality of suction ports can adsorb the circuit board, and the circuit board is fixed on the support frame 110.

[0082] It should be noted that the terms such as "one embodiment", "some embodiments", "basic embodiment", "extended embodiment" and the like are used in the present specification to describe several embodiments of the present application, and the specific features, structures, materials or characteristics of several embodiments can be combined as long as they meet the principles and purposes of the present application.

[0083] Although some embodiments of the present application have been shown and described in the present specification, the present application should not be limited to the above-mentioned embodiments, but any changes, modifications, equivalent replacements and equivalent variations of the embodiments within the spirit and principles of the present application, without departing from the principles and purposes of the present application, should be included in the protection scope of the present application, and should be considered to be within the protection scope of the present application.

Claims

1. A laser repair device for large circuit boards, characterized in that: comprising at least one detection device and a laser repair device, wherein the detection device is electrically connected to the laser repair device; The detection devices all include: Mounting base (100); an adsorption mechanism (200), provided on the mounting base (100), the adsorption mechanism (200) being used to adsorb products on the mounting base (100); A transport mechanism (300) is provided on the mounting base (100), and the transport mechanism (300) is movable along the Y direction; A plurality of detection mechanisms (400) are arranged on the transport mechanism (300) along the X direction, the detection mechanism (400) comprising a detection bracket (410), a position adjustment component (420) and a detection member (430), the detection bracket (410) being movably arranged on the transport mechanism (300) along the Z direction, the position adjustment component (420) and the detection member (430) being both arranged on the detection bracket (410), and the position adjustment component (420) driving the detection member (430) to move along the X and Y linear directions and to rotate around the Z direction; A plurality of positioning mechanisms are electrically connected to the position adjustment components (420) in a one-to-one correspondence, and the positioning mechanisms are used to locate positioning points on the product and determine the distance from the detection mechanism (400) to the product in the Z direction.

2. The laser repair equipment for large circuit boards according to claim 1, characterized in that: The mounting base (100) is provided with a plurality of support frames (110) along the X direction, gaps (120) are provided between adjacent support frames (110), and the adsorption mechanism (200) is provided on the support frames (110).

3. The laser repair equipment for large circuit boards according to claim 2, characterized in that: It also includes a driving assembly (600), and the driving assembly (600) can drive the supporting frame (110) to slide in the left and right directions.

4. The laser repair equipment for large circuit boards according to claim 3, characterized in that: The mounting base (100) further includes a sliding bracket (130), a plurality of the support brackets (110) are arranged on the sliding bracket (130), and the driving assembly (600) can drive the sliding bracket (130) to slide along the X direction. The mounting base (100) includes at least two groups of the support brackets (110), the driving assembly (600) and the sliding bracket (130), and each group of the driving assembly (600) can simultaneously drive the support brackets (110) to slide by driving one of the sliding brackets (130).

5. The laser repair equipment for large circuit boards according to claim 2, characterized in that: It also includes a transfer mechanism, which includes a transfer bracket and a transfer power piece. The transfer bracket is provided with a plurality of support rods, and the support rods can be inserted into the gap (120) between the support brackets (110). The transfer power piece is used to drive the transfer bracket to move.

6. The laser repair equipment for large circuit boards according to claim 1, characterized in that: The transport mechanism (300) comprises a gantry (310) and a slide rail (320); the gantry (310) is capable of sliding along the slide rail (320); and a plurality of detection mechanisms (400) are sequentially arranged on the gantry (310) along an X direction.

7. The laser repair equipment for large circuit boards according to claim 1, characterized in that: The position adjustment component includes: a first driving member capable of driving the detection member (430) to move along the X direction; a second driving member capable of driving the detection member (430) and the first driving member to move along the Y direction; The third driving member is capable of driving the first driving member, the second driving member, and the detection member (430) to rotate with the Z direction as the center.

8. The laser repair equipment for large circuit boards according to claim 1, characterized in that: The detection mechanism (400) further comprises a buffer member (700), one end of the buffer member (700) being connected to the detection bracket (410) and the other end being connected to the position adjustment assembly (420).

9. The laser repair equipment for large circuit boards according to claim 1, characterized in that: The positioning mechanism comprises a distance sensor and a photographing component, wherein the distance sensor is used to determine the distance between the detection mechanism (400) and the product in the Z direction, and the photographing component is used to locate a positioning point on the product.

10. A processing method, applied to the laser repair equipment for large circuit boards according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, loading; S2, the transport mechanism (300) moves the detection mechanism (400) along the Y direction, a plurality of the detection mechanisms (400) are located above the position of the product to be tested, and the detection mechanism (400) moves down to a first height; S3, the positioning mechanism detects the position of the positioning point of the product, determines the distance between the detection mechanism (400) and the product in the Z direction, and the position adjustment component (420) adjusts the position of the detection member (430) so that the calibration needle of the detection member (430) corresponds to the product positioning point; S4, the detection mechanism (400) moves downward, and the detection member (430) contacts the product for crimping detection. Determine the location of the product's bad points.

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