Vapor chamber

Abstract

The invention discloses a vapor chamber, relates to the technical field of heat dissipation and cooling, and aims to solve the problem that the heat dissipation efficiency of the vapor chamber is reduced due to the fact that steam and a liquid working medium in the current vapor chamber share the same flowing channel and mutually hinder flowing. The vapor chamber comprises a plate body, an upper cavity and a lower cavity which are sequentially arranged in the thickness direction of the plate body are formed in the plate body, the upper cavity is communicated with the lower cavity, the orthographic projection area of the upper cavity on the plate surface of the plate body is larger than that of the lower cavity on the plate surface, and the orthographic projection area of the upper cavity on the plate surface of the plate body is larger than that of the lower cavity on the plate surface of the plate body. The upper cavity is arranged in the plate body, the lower cavity is arranged in the plate body, the height of the upper cavity is smaller than that of the lower cavity in the thickness direction of the plate body, the lower cavity is filled with a liquid phase change medium, and a gap exists between the liquid phase change medium and the top surface of the upper cavity.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation and cooling technology, and in particular to a temperature homogenizing plate. Background Art

[0002] Electronic products such as mobile phones, tablets, and laptops generate heat during operation. If this heat is not dissipated promptly and accumulates inside the electronic product, it will cause the electronic product temperature to rise, affecting its performance and user experience. In severe cases, it may even cause the electronic product to malfunction and even damage. Therefore, the industry has been continuously developing various heat dissipation solutions for electronic products to solve this problem.

[0003] Currently, vapor chambers are used in electronic products to dissipate heat. They utilize the principle of gas-liquid phase change for heat exchange and are characterized by low thermal resistance, small size, and excellent temperature uniformity. The liquid working fluid in a phase change radiator evaporates after absorbing heat from heat-generating components such as chips at the evaporation surface. The gaseous working fluid carries the heat to the condensation end, dissipating the heat to the outside through natural convection and other methods. After condensation, the working fluid quickly flows back to the evaporation surface through capillary structures or gravity, and the cycle repeats. Traditional vapor chambers share the same flow channel with the steam and liquid working fluid, hindering each other's flow and reducing the heat dissipation efficiency of the vapor chamber. Summary of the Invention

[0004] The object of the present invention is to provide a temperature homogenizing plate to solve the problem that the heat dissipation efficiency of the existing temperature homogenizing plate is reduced due to the mutual interference between the steam and liquid working media flows.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] A temperature equalizing plate comprises a plate body, wherein the plate body has an upper cavity and a lower cavity arranged in sequence along the thickness direction of the plate body, the upper cavity and the lower cavity are connected, the orthographic projection area of the upper cavity on the plate surface of the plate body is larger than the orthographic projection area of the lower cavity on the plate surface, and in the thickness direction of the plate body, the height of the upper cavity is smaller than the height of the lower cavity, the lower cavity is filled with a liquid phase change medium, and there is a gap between the liquid phase change medium and the top surface of the upper cavity.

[0007] Optionally, in the above-mentioned temperature equalizing plate, the plate body includes a first plate and a second plate which are stacked in sequence from bottom to top and sealed together. The surface of the first plate facing the second plate is provided with a first groove and a second groove arranged in a stepped manner. The second groove is located in the first groove. The second groove constitutes a lower cavity, and the first groove and the second plate form an upper cavity.

[0008] Optionally, in the above-mentioned temperature homogenizing plate, the height of the lower cavity is greater than or equal to 3 mm and less than or equal to 8 mm, and the height of the upper cavity is greater than or equal to 1 mm and less than or equal to 2.5 mm.

[0009] Optionally, in the above-mentioned temperature equalizing plate, a plurality of liquid return portions are further fixedly provided on the top surface of the upper cavity, the liquid return portions extend toward the first plate, and the outer surfaces of the liquid return portions are used to guide the condensed liquid phase change medium.

[0010] Optionally, in the above-mentioned temperature equalizing plate, one end of the liquid return portion extends into the lower cavity.

[0011] Optionally, in the above-mentioned temperature equalizing plate, the liquid return portion is a columnar structure.

[0012] Optionally, in the above-mentioned temperature homogenizing plate, the material of the liquid return portion includes one or more of metal materials, ceramic materials, polymer materials, composite materials, and silicon-based materials.

[0013] Optionally, in the above-mentioned temperature equalizing plate, a capillary structure is provided on the surface of the first plate facing the second plate and / or the outer surface of the liquid return portion, and the capillary structure is used to drive the liquid to flow by capillary force.

[0014] Optionally, in the above-mentioned temperature homogenizing plate, the capillary structure includes one or more of a braided layer, a sintered layer, a coating layer, a deposited layer, and an etched layer.

[0015] Optionally, in the above-mentioned temperature homogenizing plate, the area of the surface of the first plate facing the second plate covered by the capillary structure accounts for 10%-90% of the total area of the surface;

[0016] and / or, the cross-sectional area of the lower cavity is 10%-70% of the cross-sectional area of the upper cavity;

[0017] And / or, the coverage area of the liquid return portion on the top surface of the upper cavity accounts for 10%-90% of the area of the surface.

[0018] Compared to the prior art, the heat spreader provided by the present invention has an upper cavity and a lower cavity arranged sequentially along the thickness of the plate body. The upper cavity has a larger orthographic projection area than the lower cavity and a smaller height. The lower cavity is filled with a liquid phase-change medium, forming a gap with the top surface of the upper cavity. During operation, the liquid phase-change medium filling the lower cavity is heated and evaporates. The vapor rises into the upper cavity through the vapor riser formed by the connection between the upper and lower cavities until it reaches the top surface of the upper cavity and condenses. After the vapor condenses on the top surface of the upper cavity, the liquid phase-change medium, under the action of surface tension, flows back along the wall of the upper cavity, passes through the lower surface of the upper cavity, and finally reaches the lower cavity, thus completing the phase change cycle. The lower cavity acts as a heat source contact area. The static pressure of the liquid column formed by its larger height acts on the interface of the bubbles filled in the lower cavity, forcing the bubbles to quickly detach from the evaporation surface of the liquid phase change medium filled in the lower cavity, thereby blocking the formation of the vapor film here and effectively increasing the critical heat flux density. The upper cavity, with its larger area and smaller height, forms a liquid film on the lower surface of the upper cavity under the dominance of the surface tension of the liquid. The bubble residence time in the smaller space is prolonged, and the vortex generated when the bubble collapses enhances the disturbance of the gas-liquid interface and improves the heat transfer coefficient. The heat spreader provided by the present invention separates the gas-liquid two-phase flow path, so that the liquid phase change medium flows back along the wall of the upper cavity, passes through the lower surface of the upper cavity, and finally flows back to the lower cavity. The gaseous phase change medium rises to the upper cavity through the steam rising channel formed by the connection between the upper and lower cavities until it reaches the top surface of the upper cavity and condenses, eliminating the problems of high flow resistance and low phase change efficiency caused by the shared channel of the traditional heat spreader. The synergistic effect of the two forms a double-bubble separation enhancement mechanism, which not only simultaneously improves the critical heat flux density and heat transfer coefficient, but also solves the problem of heat dissipation efficiency attenuation caused by the inconvenience of working fluid circulation in traditional temperature dispersion plates, thereby improving heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0020] Figure 1 This is a schematic diagram of an exploded view of the overall structure of a temperature vapor chamber proposed in an embodiment of the present invention;

[0021] Figure 2 This is a schematic top view of a first plate of a temperature homogenizing plate proposed in an embodiment of the present invention;

[0022] Figure 3 Schematic cross-sectional view of a temperature vapor chamber proposed in an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of an exploded view of the overall structure of another temperature vapor chamber proposed in an embodiment of the present invention;

[0024] Figure 5 A schematic top view of a first plate of another temperature vapor chamber proposed in an embodiment of the present invention;

[0025] Figure 6 A schematic cross-sectional view of another temperature vapor chamber proposed in an embodiment of the present invention;

[0026] Figure 7 This is a schematic diagram of an exploded view of the overall structure of another temperature vapor chamber proposed in an embodiment of the present invention;

[0027] Figure 8 A schematic top view of a first plate of another temperature vapor chamber proposed in an embodiment of the present invention;

[0028] Figure 9 Schematic cross-sectional view of another temperature vapor chamber proposed in an embodiment of the present invention.

[0029] Reference numerals: 1 is a plate body, 110 is an upper cavity, 111 is a liquid return portion, 120 is a lower cavity, 130 is a first plate, 131 is a first groove, 132 is a second groove, 133 is a capillary structure, and 140 is a second plate. DETAILED DESCRIPTION

[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0031] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined. "Several" means one or more, unless otherwise specifically defined.

[0033] In the description of the present invention, it should be understood that the terms "up", "down", "front", "back", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0034] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and may encompass internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0035] See also Figure 1 The temperature equalizing plate provided in an embodiment of the present invention includes a plate body 1, which has an upper cavity 110 and a lower cavity 120 arranged in sequence along the thickness direction of the plate body 1, the upper cavity 110 and the lower cavity 120 are connected, the orthographic projection area of the upper cavity 110 on the plate surface of the plate body 1 is larger than the orthographic projection area of the lower cavity 120 on the plate surface, and in the thickness direction of the plate body 1, the height of the upper cavity 110 is smaller than the height of the lower cavity 120, the lower cavity 120 is filled with a liquid phase change medium, and there is a gap between the liquid phase change medium and the top surface of the upper cavity 110.

[0036] For specific implementation: please refer to Figure 1The temperature homogenizing plate provided by the present invention has an upper cavity 110 and a lower cavity 120 arranged in sequence along the thickness direction within the plate body 1. The orthographic projection area of the upper cavity 110 is larger than that of the lower cavity 120 and is smaller in height. The lower cavity is filled with a liquid phase change medium, forming a gap with the top surface of the upper cavity 110. During operation, the liquid phase change medium filled in the lower cavity 120 is heated and evaporated. The vapor rises into the upper cavity 110 through the vapor rising channel formed by the connection between the upper cavity 110 and the lower cavity 120 until it reaches the top surface of the upper cavity 110 and condenses. After the vapor condenses on the top surface of the upper cavity 110, the liquid phase change medium, under the action of surface tension, flows back along the wall of the upper cavity 110, passes through the lower surface of the upper cavity 110, and finally reaches the lower cavity 120, thereby completing the phase change cycle. The lower cavity 120 serves as the heat source contact area. The static pressure of the liquid column formed by its larger height acts on the interface of the bubbles filled in the lower cavity 120, forcing the bubbles to quickly detach from the evaporation surface of the liquid phase change medium filled in the lower cavity 120, thereby blocking the formation of the steam film here, and effectively improving the critical heat flux density; the upper cavity 110, with its larger area and smaller height, forms a liquid film on the lower surface of the upper cavity 110 under the dominance of the surface tension of the liquid, and the residence time of the bubbles in the smaller space is prolonged. The vortex generated when the bubbles collapse enhances the disturbance of the gas-liquid interface, thereby improving the heat transfer coefficient. The heat spreader provided by the present invention separates the gas-liquid two-phase flow paths, allowing the liquid phase change medium to flow back along the wall of the upper cavity 110, through the lower surface of the upper cavity 110, and finally back to the lower cavity 120. The gaseous phase change medium rises into the upper cavity 110 through the steam rising channel formed by the connection between the upper cavity 110 and the lower cavity 120, until it reaches the top surface of the upper cavity 110 and condenses. This eliminates the problems of high flow resistance and low phase change efficiency caused by the shared channel in traditional heat spreaders. The synergistic effect of the two forms a double bubble separation enhancement mechanism, which simultaneously improves the critical heat flux density and heat transfer coefficient while solving the problem of heat dissipation efficiency attenuation caused by the inconvenience of working medium circulation in traditional heat spreaders, thereby improving heat dissipation efficiency.

[0037] As a possible implementation, see Figures 1-9The plate body 1 includes a first plate 130 and a second plate 140 stacked and sealed from bottom to top. The surface of the first plate 130 facing the second plate 140 is provided with a first groove 131 and a second groove 132 arranged in a stepped manner. The second groove 132 is located in the first groove 131. The second groove 132 constitutes the lower cavity 120. The first groove 131 and the second plate 140 enclose the upper cavity 110. Specifically, the first plate 130 and the second plate 140 are tightly stacked up and down and connected by welding or integral molding, so that the entire plate body 1 forms a closed cavity structure. The surface of the first plate 130 facing the second plate 140 is provided with a first groove 131 and a second groove 132 arranged in a stepped manner. The interior space of the second groove 132 is the lower cavity 120. The outer side of the lower cavity 120 is used to directly contact the heat source, and the liquid phase change medium filled inside is heated and evaporated here. The space between the first groove 131 and the second plate 140 constitutes the upper cavity 110. The vapor generated by evaporation rises in the upper cavity 110 to the surface of the second plate 140 and condenses into liquid after being cooled.

[0038] During operation, the heat generated by the heat source is transferred to the lower cavity 120 area of the first plate 130. The liquid phase change medium in the lower cavity 120 absorbs the heat and evaporates, turning into steam and diffusing upward into the upper cavity 110. During the rising process of the steam, due to the specific space formed by the groove structure of the lower cavity 120, the steam is subjected to static pressure when it leaves the evaporation surface, which promotes the rapid detachment of bubbles and inhibits the formation of the steam film, thereby increasing the critical heat flux density. In the upper cavity 110, the steam condenses into liquid after contacting the surface of the second plate 140 with a lower temperature. Under the action of gravity, the liquid flows back to the lower cavity 120 from the wall of the first groove 131, completing a phase change cycle.

[0039] Through this structural design of the plate body 1, the natural separation of the vapor diffusion path and the liquid reflux path is achieved, effectively avoiding the problem of mutual interference between the vapor and liquid working fluids when flowing in the same channel in the traditional temperature equalizing plate. At the same time, the second groove 132 structure of the lower cavity 120 uses the static pressure generated by the liquid level difference to drive the working fluid circulation, thereby enhancing the bubble detachment effect; the relatively large plane space and lower liquid level of the upper cavity 110 enhance the surface tension's inhibitory effect on bubble detachment, strengthen the gas-liquid interface disturbance, and improve the heat transfer coefficient. The two work together to improve the heat dissipation efficiency of the temperature equalizing plate. It should be noted that the cross-section of the lower cavity 120 is circular or rectangular. When the cross-section of the lower cavity 120 is circular, it has a uniform curvature, and the structural strength in all directions is relatively consistent, which can better withstand internal pressure, reduce stress concentration, and reduce the risk of deformation or rupture due to pressure. Moreover, the circular shape is conducive to the flow and distribution of the liquid phase change medium inside, which can make the working medium evaporate more evenly due to heat, promote the uniform generation and separation of bubbles, and improve the overall heat transfer efficiency and stability of the temperature homogenizer; when the cross-section of the lower cavity 120 is rectangular, when the temperature homogenizer is working, the corners of the rectangle can play a certain guiding role, guiding the flow of liquid phase change medium and steam, helping to form a more regular flow path, enhancing the gas-liquid separation effect, and further optimizing the heat dissipation performance of the temperature homogenizer.

[0040] As a possible implementation, the height of the lower cavity 120 is greater than or equal to 3 mm and less than or equal to 8 mm, and the height of the upper cavity 110 is greater than or equal to 1 mm and less than or equal to 2.5 mm. The vertical height of the lower cavity 120, i.e., the depth of the groove, is in the range of 3 mm to 8 mm, and can be any value within this range, such as 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, etc. The vertical height of the upper cavity 110 is in the range of 1 mm to 2.5 mm, and can be any value within this range, such as 1 mm, 1.5 mm, 2 mm, 2.5 mm, etc. In a specific implementation, the outer side of the lower cavity 120 area of the first plate 130 is in contact with a heat source. The contact heat source causes the liquid working medium in the lower cavity 120 to vaporize after being heated. The vapor diffuses through the connecting area to the upper cavity 110 and condenses on the second plate 140. Under the action of gravity, the condensed working medium stably refluxes from the upper cavity 110 to the lower cavity 120, forming a closed-loop circulation. With this configuration, the lower chamber 120, with a maximum vertical height between 3mm and 8mm, provides ample storage space for the liquid working fluid, preventing local drying caused by excessive evaporation rates. Furthermore, if the lower chamber 120's value range is too large, while the storage capacity increases, the working fluid circulation path becomes too long, increasing flow resistance and hindering smooth recirculation of the working fluid. Simultaneously, its design, which is greater than the vertical height of the upper chamber 110, generates a pressure gradient through the static pressure effect of the liquid column, driving the condensed liquid back from a high position to a low position, forming a stable self-circulation. The smaller vertical height of the upper chamber 110 limits the free liquid surface range. When the height is less than this value range, the liquid film is prone to rupture, resulting in heat transfer failure. When the height is greater than this value range, the expansion of the free liquid surface weakens the surface tension effect, accelerating the bubble detachment speed but reducing the disturbance, which is not conducive to improving heat transfer efficiency. When its value is within this range, the bubble detachment suppression effect dominated by surface tension is enhanced in this area. The frequent formation and disappearance of tiny bubbles strengthens gas-liquid interaction, thereby improving heat transfer efficiency.

[0041] As a possible implementation, see Figure 4-Figure 9, a plurality of liquid return portions 111 are also fixedly provided on the top surface of the upper cavity 110, and the liquid return portions 111 extend toward the first plate 130. The outer surface of the liquid return portion 111 is used to guide the condensed liquid phase change medium. In specific implementation, when the phase change medium is heated and evaporated in the lower cavity 120 close to the chip, the vapor rises to the second plate 140 to cool and condense into liquid. The condensed liquid needs to flow back to the lower cavity 120 to continue participating in the phase change cycle. Through the design of the liquid return portion 111, it can not only flow back along the wall surface of the first groove 131, that is, the wall surface of the upper cavity 110, but also flow back along the outer surface of the liquid return portion 111 to the lower cavity 120 to repeat the next cycle. It also provides a directional flow path for the condensate, which can guide the liquid to overcome gravity or other resistance and smoothly return to the lower cavity 120 along the outer surface of the return liquid part 111. In an anti-gravity environment, the guide design of the return liquid part 111 effectively improves the liquid return efficiency, ensures the stability of the working medium circulation, and enables the temperature equalizing plate to work stably in complex spatial postures such as tilt and inversion; and by setting the return liquid part 111, not only the return path of the working medium is optimized and the anti-gravity characteristics of the temperature equalizing plate are improved, but also the structural strength of the temperature equalizing plate is enhanced to avoid deformation caused by internal and external pressure difference; at the same time, during operation, when steam condenses at the second plate 140 to release latent heat, the return liquid part 111, as a heat medium, can transfer part of the heat directly to the first plate 130 or the outside of the temperature equalizing plate through heat conduction, forming a composite heat transfer of gas-liquid phase change heat transfer and heat conduction, effectively reducing the overall thermal resistance.

[0042] In some embodiments, see Figure 7 and Figure 9 The outer surface of the liquid return portion 111 is also provided with a guide groove, which extends from the end of the liquid return portion 111 close to the second plate 140 to the end of the liquid return portion 111 close to the first plate 130. After the liquid phase change working medium is condensed from the second plate 140, it can flow back to the first plate 130 along the guide groove provided on the liquid return portion 111 until it enters the lower cavity 120. The setting of the guide groove provides a clear and efficient flow guide path for the liquid phase change working medium. The liquid phase change working medium can flow back to the first plate 130 along the guide groove quickly and orderly, shortening the reflux time, reducing possible local accumulation and reflux turbulence, and improving the circulation efficiency and stability of the working medium in the temperature uniformity plate.

[0043] Further, see Figure 4-Figure 9, one end of the liquid return portion 111 extends into the lower cavity 120. Specifically, one end of the liquid return portion 111 extends downward from the second plate 140 and is inserted into the interior of the second groove 132. Its end can be directly connected or maintain a gap according to the structural design of the bottom surface of the second groove 132. The other end is fixedly connected to the second plate 140 to form a supporting and diverting structure that penetrates the upper cavity 110 and extends deep into the lower cavity 120. This design allows the liquid return portion 111 to be closer to the interior of the second groove 132. Regardless of whether the bottom surface of the second groove 132 is smooth and flat or has a complex microstructure, it can achieve effective cooperation with the lower cavity 120 through a reasonable layout, and the liquid condensed on the second plate 140 can be directly returned to the lower cavity 120 along the outer surface of the liquid return portion 111. During operation, the portion of the liquid return portion 111 that extends deep into the second groove 132 directly participates in the working fluid circulation: when the condensate flows back along the outer surface of the liquid return portion 111, the solid conduction path enhances heat transfer between the upper and lower cavities 120, while also serving as a structural support to enhance the overall strength of the three-dimensional cavity. This arrangement, by extending the liquid return portion 111 into the groove, ensures the smooth flow of the working fluid return path and the effectiveness of the solid heat conduction path, thereby improving the heat dissipation performance of the temperature spreader. This design not only enhances the anti-gravity liquid return capability, but also provides stable support for phase change heat dissipation in complex scenarios.

[0044] In specific implementation, if the bottom surface of the second groove 132 is a smooth and flat structure, the end of the liquid return part 111 can be directly fixed to the bottom surface by welding or an integrated molding process, and a high thermal conductivity material is used to improve the heat transfer efficiency; if the bottom surface of the second groove 132 is provided with a guide groove or other uneven structure, the liquid return part 111 can be designed to have a chamfered or streamlined end, and at the same time does not interfere with the bottom surface structure, ensuring stable operation under different working conditions.

[0045] As a possible implementation method, the liquid return portion 111 includes a cylindrical structure or a rectangular column structure. When the liquid return portion 111 is a cylindrical structure, that is, when the outer surface of the liquid return portion 111 is set as a cylindrical surface, since the cylindrical surface has the isotropic property, the liquid phase change working medium is subjected to relatively uniform resistance during the reflux process, no matter from which direction it contacts the cylindrical surface, which is conducive to guiding the liquid phase change working medium to flow smoothly along its surface, reducing the liquid flow disorder caused by the surface shape, and thus improving the reflux efficiency. In addition, the cylindrical surface is relatively smooth, and compared with some surfaces with edges or complex shapes, the contact area with the working medium is relatively small, which can reduce the adhesion between the liquid and the surface and further promote the rapid sliding of the liquid. At the same time, the cylindrical surface is relatively simple in processing and manufacturing, which can reduce the difficulty and cost of the production process and improve production efficiency.

[0046] Specifically, after the vapor condenses into liquid at the top of the upper cavity 110, liquid return sections 111 with different cross-sectional shapes guide the liquid back to the lower cavity 120 in different ways. If the cross-section of the liquid return section 111 is circular, the liquid can flow more evenly around its surface. The rounded surface can reduce the resistance to liquid flow and ensure a smooth return process. For liquid return sections 111 with a rectangular cross-section, because they have clear corners, they can guide the liquid to form a specific flow path through the corner effect. In certain layouts, the liquid can be more accurately directed to a specific area of the lower cavity 120.

[0047] In a specific implementation, in a small vapor chamber, to save space and ensure good reflux, a liquid return portion 111 with a circular cross-section can be used, evenly distributed on the second plate 140 in a thin cylindrical structure. For a large vapor chamber with a more regular internal structure, the liquid return portion 111 with a rectangular cross-section can be designed to be arranged in a grid pattern to achieve efficient liquid guidance.

[0048] As a possible implementation method, the material of the liquid return section 111 includes one or more of metal materials, ceramic materials, polymer materials, composite materials, and silicon-based materials. The liquid return section 111 made of metal material has good thermal conductivity and can quickly transfer heat from the condensation area to the evaporation area, accelerating the heat transfer process. At the same time, its good mechanical strength ensures a stable structure under complex working conditions and guides the condensate to return efficiently. The liquid return section 111 made of ceramic material has high hardness, high temperature resistance and strong chemical stability, and can maintain its performance in high temperature and highly corrosive environments, ensuring the long-term stable operation of the liquid return section 111. The liquid return section 111 made of polymer material has a small mass, which can reduce the overall weight of the temperature equalizing plate, and the flexibility of some polymer materials can enable it to adapt to slight deformations inside the temperature equalizing plate. The liquid return section 111 made of composite materials, such as plastic and metal, combines the advantages of multiple materials to meet the needs of different working environments. The liquid return section 111 made of silicon-based material has good compatibility with electronic components such as silicon-based chips, which can reduce thermal stress problems caused by differences in the thermal expansion coefficients of materials and improve structural stability. Furthermore, the liquid return portion 111 can be made of a variety of materials, thereby ensuring the reliability and applicability of the structure.

[0049] As a possible implementation, see Figures 1-9 A capillary structure 133 is provided on the surface of the first plate 130 facing the second plate 140 and / or the outer surface of the liquid return portion 111. The capillary structure 133 is used to drive liquid flow through capillary force. Specifically, the capillary structure 133 may be provided only on the surface of the first plate 130 facing the second plate 140, or only on the outer surface of the liquid return portion 111, or both on the surface of the first plate 130 facing the second plate 140 and on the outer surface of the liquid return portion 111.

[0050] In a specific implementation, after the steam condenses into liquid at the top of the upper cavity 110, the liquid flows downward under the action of gravity. At this time, the first plate 130 has a capillary structure 133 on the surface facing the second plate 140. Since the liquid phase change medium is driven by the temperature gradient at this capillary structure 133, a driving force pointing to the high-temperature lower cavity 120 area is generated through the thermal capillary effect, ensuring that the liquid phase change medium can stably return to the lower cavity 120. For the capillary structure 133 on the outer surface of the return liquid portion 111, the capillary characteristics of the capillary structure 133 are also utilized. During the process of the liquid phase change medium refluxing along the surface of the return liquid portion 111, the capillary force is used to assist, ensuring that the liquid can stably and efficiently reflux to the lower cavity 120 even in complex environments such as anti-gravity.

[0051] The provision of such capillary structure 133 improves the reflux efficiency of the liquid phase-change fluid within the vapor chamber, enhancing its adaptability under various operating conditions. In particular, under conditions of unstable gravity, capillary force becomes the key driving force for the reflux of the liquid phase-change fluid, ensuring the continuity of the fluid circulation and, in turn, improving the overall heat dissipation performance of the vapor chamber, effectively avoiding the problem of reduced heat dissipation efficiency caused by poor reflux of the liquid phase-change fluid.

[0052] It should be noted that, in some embodiments, a guide groove can be provided on the lower surface of the upper cavity 110, which connects the lower cavity 120 and the side wall of the upper cavity 110, and is used to guide the liquid flowing back from the side wall of the upper cavity 110 into the lower cavity 120 to ensure the phase change cycle.

[0053] As a possible implementation, the capillary structure 133 includes one or more of a braided layer, a sintered layer, a coating, a deposited layer, and an etched layer. That is, different capillary structures can be provided on the surface of the first plate 130 facing the second plate 140 or on the outer surface of the liquid return portion 111. In other words, different capillary structures can coexist on the surface of the first plate 130 facing the second plate 140 or on the outer surface of the liquid return portion 111. The capillary structures 133 formed in different forms are provided on the surface of the first plate 130 facing the second plate 140 and / or on the outer surface of the liquid return portion 111, and are in direct contact with the liquid phase change medium within the temperature equalization plate.

[0054] In specific implementation, if the capillary structure 133 is a woven layer, the woven layer woven by fibers absorbs and guides the flow of liquid phase change medium through the capillary force generated by the tiny gaps between the fibers; for the sintered layer, a porous structure is formed by sintering tiny particles together, and the capillary action of the pores is used to assist the liquid backflow; the coating is a layer of material with special properties covered on the surface, such as a hydrophilic coating, which can enhance the surface's adsorption of liquid and promote the flow of liquid along the surface; the deposition layer constructs a microstructure with capillary effect by depositing specific materials on the surface, guiding the liquid to flow to a specific area; the etching layer uses an etching process to create micron- or nanometer-level grooves or holes on the surface, and drives the liquid flow with the help of the capillary force generated by these microstructures.

[0055] In this arrangement, if the surface of the first plate 130 facing the second plate 140 has a micron-scale or nano-scale column array structure surface, these closely arranged column arrays can increase the contact area between the liquid phase change medium and the surface, and use the narrow gaps between the columns to generate capillary force to adsorb the liquid phase change medium and guide it to the evaporation area of the lower cavity 120. For the first plate 130 with a wettable surface, its special surface chemical properties can reduce the contact angle between the liquid and the surface, making the liquid easier to spread, and accelerating the flow of the liquid to the evaporation area under the cooperation of capillary force; if the first plate 130 adopts a coated surface, by applying a layer of hydrophilic polymer coating, the surface's adsorption capacity for the liquid phase change medium can be enhanced, the capillary effect can be strengthened, and the liquid phase change medium can be assisted to flow quickly to the evaporation area; by adopting the first plate 130 with an electrochemical deposition surface, by depositing specific metals or compounds on the surface, a microstructure with a capillary effect is constructed, and the liquid phase change medium is accurately guided to flow to the heat source area, thereby improving the heat dissipation efficiency; the surface can also be laser etched, and micron or nanometer-scale grooves or holes can be etched on the first plate 130 by laser to form an efficient capillary channel to guide the flow of the liquid phase change medium.

[0056] By providing these different types of capillary structures 133, the reflux efficiency of the liquid phase-change fluid within the vapor chamber is improved. Especially under conditions where gravity is weak or unstable, capillary force becomes the key driving force for the liquid phase-change fluid, ensuring the continuity of the fluid's circulation. This in turn improves the overall heat dissipation performance of the vapor chamber and avoids the problem of reduced heat dissipation efficiency caused by poor liquid reflux. Furthermore, different types of capillary structures 133 can be flexibly combined based on the vapor chamber's actual application scenario and heat dissipation requirements, further optimizing the heat dissipation effect.

[0057] As a possible implementation, the capillary structure 133 covers an area of the surface of the first plate 130 facing the second plate 140 that accounts for 10%-90% of the total area of that surface; and / or the cross-sectional area of the lower chamber 120 is 10%-70% of the cross-sectional area of the upper chamber 110; and / or the coverage area of the liquid return portion 111 on the top surface of the upper chamber 110 accounts for 10%-90% of the area of that surface. The capillary structure 133 is disposed on the surface of the first plate 130 facing the second plate 140, and its coverage area accounts for a ratio of 10%-90% of the total area of the first surface, specifically 10%, 30%, 50%, 70%, 90%, or any other percentage within this range.

[0058] In a specific implementation, when the steam condenses into liquid at the top of the upper cavity 110, the liquid flows toward the first surface under the action of gravity or capillary force. If the capillary structure 133 covers a small area, accounting for 10% of the total area of the first surface, the capillary effect is only exerted in some areas, and the liquid is quickly adsorbed in these areas by capillary force and guided to the evaporation area of the lower cavity 120. It is suitable for scenarios with small liquid working fluid flow and low demand for capillary action. It can reduce production costs and avoid affecting other heat dissipation factors due to too many capillary structures 133. When the capillary structure 133 covers a large area, reaching 90% of the total area of the first surface, almost the entire first surface can guide the flow of liquid with the help of capillary force, and can quickly adsorb and guide liquid in all directions to ensure efficient circulation of the working fluid.

[0059] This arrangement, by providing capillary structures 133 with varying coverage areas, allows for adaptability to different use cases. Smaller coverage areas are suitable for simpler operating conditions or for lower-cost vapor chambers, while larger coverage areas are suitable for vapor chambers with extremely high heat dissipation requirements. This effectively improves the vapor chamber's heat dissipation adaptability under varying conditions, ensuring stable working fluid circulation and preventing reduced heat dissipation efficiency due to poor liquid reflux.

[0060] In some embodiments, the cross-sectional area of the lower cavity 120 is 10%-70% of the cross-sectional area of the upper cavity 110. Specifically, it can be 10%, 30%, 50%, 70%, or any proportion within this range.

[0061] In specific implementation, when the heat source causes the liquid phase change medium in the lower cavity 120 to evaporate due to heat, the generated steam will diffuse upward into the upper cavity 110. If the cross-sectional area of the lower cavity 120 is relatively small, accounting for about 10% of the cross-sectional area of the upper cavity 110, it means that the evaporation area is relatively concentrated and the heat flux density per unit area is high, which is conducive to the rapid generation of a large amount of steam in a smaller space, and promotes the lower cavity 120 to strengthen the bubbles out of the boiling mode. The larger cross-sectional area of the upper cavity 110 provides sufficient condensation space for the steam, where the steam can fully contact the top surface of the upper cavity 110 and efficiently condense into liquid. When the ratio is close to 70%, the lower cavity 120 has a relatively large evaporation area, which can meet the evaporation needs of liquid working fluids with a higher flow rate. At the same time, the upper cavity 110 can still ensure that there is enough space for steam condensation and liquid reflux, maintaining the stability of the working fluid circulation in the temperature equalization plate.

[0062] By setting this cross-sectional area ratio range, the functions of upper chamber 110 and lower chamber 120 can be flexibly optimized based on the actual use case and heat dissipation requirements of the vapor chamber. A smaller ratio is suitable for scenarios with concentrated heat sources, high heat flux density, and a large requirement for steam condensation space; a larger ratio is suitable for scenarios that require evaporative heat dissipation of large liquid flows. This ratio range ensures that the vapor chamber can achieve efficient heat dissipation under different operating conditions by properly allocating evaporation and condensation space, maintaining stable working medium circulation, and avoiding inefficient heat dissipation caused by improper space allocation.

[0063] In some embodiments, the coverage area of the liquid return portion 111 on the top surface of the upper cavity 110 accounts for 10%-90% of the area of the top surface.

[0064] Specifically, the liquid return portions 111 are fixed to the surface of the second plate 140 facing the upper chamber 110, and their distribution range is within a certain percentage of the surface area. Specifically, the area ratio can be 10%, 30%, 50%, 70%, 90%, or another percentage within this range. When the steam condenses into liquid on the second plate 140, these liquid return portions 111, distributed across different coverage areas of the second plate 140 surface, can provide different degrees of diversion paths for the condensate. If the liquid return portions 111 cover a smaller area, the condensate can be directed back to the lower chamber 120 via fewer but relatively concentrated liquid return portions 111. In scenarios where return paths are less demanding or space is limited, this layout can effectively utilize space and ensure basic return functionality. In contrast, when the liquid return portions 111 cover a larger area, they can provide more and more dispersed return channels for the condensate, allowing the condensate to be more evenly directed across the surface of the second plate 140 toward the lower chamber 120. This can better maintain working fluid circulation in scenarios where return efficiency and uniformity are critical.

[0065] By setting a specific coverage ratio of the liquid return portion 111 on the surface of the second plate 140 facing the cavity, the liquid return effect can be flexibly adjusted according to the actual application scenario and heat dissipation requirements of the vapor chamber. This ensures that the liquid return portion 111 is rationally arranged within a limited space, avoiding excessive space occupation due to too many liquid return portions 111 or failure to meet liquid return requirements due to too few liquid return portions 111; alternatively, it can optimize the uniformity and stability of the working fluid circulation, thereby improving the overall heat dissipation performance of the vapor chamber. In some embodiments, a solution with a smaller coverage ratio of the liquid return portion 111, such as 10% or 20%, can be adopted. The liquid return portions 111 are spaced apart and only occupy a small proportion of the surface of the second plate 140 to accommodate compact space designs. In other embodiments, the liquid return portion 111 can be designed as a large-area grid structure, such as 70% or 90%, with the liquid return portion 111 covering a larger proportion of the surface of the second plate 140, providing an efficient and uniform return path for large amounts of condensate.

[0066] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0067] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A temperature equalizing plate, characterized in that: The invention comprises a plate body, wherein the plate body has an upper cavity and a lower cavity arranged in sequence along the thickness direction of the plate body, the upper cavity and the lower cavity are connected, the orthographic projection area of the upper cavity on the plate surface of the plate body is larger than the orthographic projection area of the lower cavity on the plate surface, and in the thickness direction of the plate body, the height of the upper cavity is smaller than the height of the lower cavity, the lower cavity is filled with a liquid phase change medium, and there is a gap between the liquid phase change medium and the top surface of the upper cavity.

2. The temperature vapor chamber according to claim 1, wherein: The plate body includes a first plate and a second plate stacked in sequence from bottom to top and sealed together. The surface of the first plate facing the second plate is provided with a first groove and a second groove arranged in a stepped manner. The second groove is located in the first groove. The second groove constitutes the lower cavity. The first groove and the second plate enclose the upper cavity.

3. The temperature vapor chamber according to claim 1, wherein: The height of the lower cavity is greater than or equal to 3 mm and less than or equal to 8 mm, and the height of the upper cavity is greater than or equal to 1 mm and less than or equal to 2.5 mm.

4. The temperature vapor chamber according to claim 2, wherein: A plurality of liquid return portions are further fixedly provided on the top surface of the upper cavity. The liquid return portions extend toward the first plate. The outer surfaces of the liquid return portions are used for guiding the condensed liquid phase change medium.

5. The temperature vapor chamber according to claim 4, wherein: One end of the liquid return portion extends into the lower cavity.

6. The temperature vapor chamber according to claim 4, wherein: The liquid return portion includes a cylindrical structure or a rectangular column structure.

7. The temperature vapor chamber according to claim 4, wherein: The material of the liquid return portion includes one or more of metal materials, ceramic materials, polymer materials, composite materials, and silicon-based materials.

8. The temperature vapor chamber according to claim 4, wherein: A capillary structure is provided on the surface of the first plate facing the second plate and / or the outer surface of the liquid return portion, and the capillary structure is used to drive the liquid to flow by capillary force.

9. The temperature vapor chamber according to claim 8, wherein: The capillary structure includes one or more of a braided layer, a sintered layer, a coating layer, a deposited layer, and an etched layer.

10. The temperature vapor chamber according to claim 8, wherein: The capillary structure covers an area of the surface of the first plate facing the second plate that accounts for 10% to 90% of the total area of the surface; and / or, the cross-sectional area of the lower cavity is 10%-70% of the cross-sectional area of the upper cavity; And / or, the coverage area of the liquid return portion on the top surface of the upper cavity accounts for 10%-90% of the area of the surface.

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