Projection lamp assembly and vehicle

Abstract

The invention provides a projection lamp assembly and a vehicle, and belongs to the technical field of vehicle parts. The projection lamp assembly comprises a shell and a metal heat dissipation base which are matched with each other; the first circuit board is arranged in the shell, the bottom face of the first circuit board is attached to one surface of the metal heat dissipation base, and a light-emitting element is installed on the top face of the first circuit board. The heat conduction layer is arranged outside the lens barrel module and attached to the outer wall face of the lens barrel module, one part of the heat conduction layer corresponds to the position of the film assembly, the other part of the heat conduction layer is attached to or makes contact with the top face of the first circuit board, and the heat conductivity of the heat conduction layer is larger than that of the lens barrel module; the beneficial effects of the invention are that the heat conduction layer can guide the heat gathered in the lens barrel module to the first circuit board, so that the heat is released, and the temperature in the lens barrel module is reduced, thereby reducing the deformation of the imaging lens group caused by heating, and avoiding the reduction of the projection definition caused by long-time use.

Description

Technical Field

[0001] The present invention belongs to the technical field of vehicle parts and relates to a projection lamp assembly and a vehicle. Background Art

[0002] A car welcome light is a device used to provide lighting effects and project personalized patterns (such as brand logos, geometric shapes, and text) onto the ground. It works by using LEDs to illuminate film, which is then magnified by an imaging lens and projected onto the ground to form an image.

[0003] However, the existing technology suffers from a problem: after a period of continuous operation, the projected image of a vehicle's welcome light begins to blur. This phenomenon occurs because the LED generates heat over time, which accumulates within the lens assembly, causing the lens to slightly deform due to the heat. This causes the projected image to shift focus, blurring the image.

[0004] To address the problem of heat accumulation within the projection lamp lens assembly, current products on the market replace the back cover, which is originally bonded to the PCB or aluminum substrate, with a metal component with better thermal conductivity. This allows the heat generated by the LED to be transferred to the heat sink through the PCB assembly, thereby reducing the internal temperature of the lens module, minimizing focus shift of the projected pattern, and improving projection clarity. However, while this solution can reduce the average temperature of the projection lamp to a certain extent, it is not significantly effective in improving the clarity of the projected pattern. Summary of the Invention

[0005] The present invention aims to solve the above problems in the prior art and proposes a projection lamp assembly, comprising:

[0006] A housing, comprising an outer shell and a metal heat dissipation base that cooperate with each other;

[0007] a first circuit board, the first circuit board being disposed in the housing, the bottom surface of the first circuit board being in contact with a surface of the metal heat dissipation base and the top surface of the first circuit board being provided with a light-emitting element;

[0008] a projection assembly fixedly mounted on the first circuit board, comprising a lens barrel module located on the optical axis path of the light-emitting element, and an illumination lens group, a film assembly, and an imaging lens group disposed within the lens barrel module and arranged along the optical axis direction of the light-emitting element;

[0009] A heat-conducting layer is provided on the outside of the lens barrel module and is in contact with the outer wall surface of the lens barrel module; along the axial direction of the lens barrel module, the heat-conducting layer covers the outer wall surface of the lens barrel module at the location of the film assembly and extends to be in contact with or in contact with the top surface of the first circuit board, and the thermal conductivity of the heat-conducting layer is greater than the thermal conductivity of the lens barrel module.

[0010] Preferably, the heat-conducting layer is configured as a heat-conducting foil, which is in a cylindrical surrounding structure and fits against the outer wall surface of the lens barrel module, and the heat-conducting foil fits against or contacts the top surface of the first circuit board.

[0011] Preferably, the heat-conducting layer is a metal plating layer covering the outer surface of the lens barrel module.

[0012] Preferably, the outer wall surface of the imaging lens barrel is provided with a plurality of heat dissipation ribs.

[0013] Preferably, the lens barrel module includes an illumination lens barrel and an imaging lens barrel, the illumination lens barrel is mounted on the first circuit board, and the imaging lens barrel is mounted on the illumination lens barrel;

[0014] The illumination lens barrel is provided with one of an internal thread and an external thread, the imaging lens barrel is provided with the other of an internal thread and an external thread, and the imaging lens barrel is threadedly connected to the illumination lens barrel through the internal thread and the external thread.

[0015] Preferably, the outer wall surface of the lighting lens barrel and one of the internal thread and the external thread are provided with a continuous first metal coating, and the outer wall surface of the imaging lens barrel and the other of the internal thread and the external thread are provided with a continuous second metal coating, the first metal coating is in contact with the first circuit board, and the second metal coating is in contact with the first metal coating through the cooperation of the internal thread and the external thread.

[0016] Preferably, the gap between the internal thread and the external thread is filled with thermal conductive glue or thermal conductive silicone grease.

[0017] Preferably, it further includes a second circuit board arranged in the shell and electrically connected to the first circuit board, the bottom surface of the second circuit board is not in contact with the surface of the metal heat dissipation base and there is a gap; the first circuit board is set to be an aluminum substrate.

[0018] Preferably, the other surface of the metal heat dissipation base is provided with heat dissipation fins, and the heat dissipation fins correspond to the area where the first circuit board is located.

[0019] A vehicle comprises the projection lamp assembly.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. The heat-conducting layer can guide the heat accumulated in the lens barrel module to the first circuit board, so that the heat is released and the temperature inside the lens barrel module is reduced, thereby reducing the deformation of the imaging lens group caused by heat and avoiding the reduction of projection clarity due to long-term use.

[0022] 2. Because the film assembly is typically located at the junction between the illumination and imaging lens barrels, the primary heat generation within the lens barrel module is concentrated there. Therefore, this solution specifically incorporates a thermally conductive layer at the junction between the lens barrel and the illumination lens barrel. Heat is transferred via the first circuit board to the metal heat sink, effectively addressing the heat dissipation issue and ensuring system stability and projection quality.

[0023] 3. The thermal conductive foil is designed to fit tightly against the junction of the imaging lens barrel and the illumination lens barrel. Most of the heat generated by the light-emitting element will be refracted by the lens group and concentrated in this area. By using thermal conductive foil to directly cover this critical area, the accumulated heat can be quickly absorbed and conducted.

[0024] 4. A metal coating with high thermal conductivity is used as the heat conduction layer. When the two lighting lens barrels and the imaging lens barrel are connected by threads, the second metal coating will be in close contact with the first metal coating, forming a continuous heat conduction path, so that the heat from the lighting lens barrel, the imaging lens barrel and the threaded connection area between the two can be transferred to the first circuit board.

[0025] 5. Due to the excellent thermal conductivity of the aluminum substrate, it is suitable for installing components that generate a lot of heat, such as light-emitting components (such as LEDs), lighting tubes, and imaging tubes. The heat generated by these high-heat-generating components is quickly conducted through the aluminum substrate to the metal heat dissipation base in close contact with it, thereby effectively reducing the operating temperature of the components and avoiding performance degradation or damage due to overheating. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a structural diagram of embodiment 1 of the present invention.

[0027] Figure 2 This is a structural decomposition diagram of embodiment 1 of the present invention.

[0028] Figure 3 This is a structural diagram of embodiment 2 of the present invention.

[0029] Figure 4 It is a structural exploded view of the vehicle of the present invention.

[0030] Figure 5 It is a schematic structural diagram of the vehicle of the present invention.

[0031] Figure 6It is a structural schematic diagram of the vehicle of the present invention from another perspective.

[0032] In the figure, 100, first circuit board; 110, light-emitting element; 200, lighting lens barrel; 210, external thread; 300, imaging lens barrel; 310, internal thread; 320, heat dissipation rib; 400, thermal conductive foil; 510, first metal coating; 520, second metal coating; 600, metal heat dissipation base; 610, heat dissipation fins; 700, housing; 800, second circuit board; 900, lens barrel module. DETAILED DESCRIPTION

[0033] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solutions of the present invention, but the present invention is not limited to these embodiments.

[0034] like Figures 1 to 6 As shown, a projection lamp assembly includes: a housing, the housing including a shell 700 and a metal heat dissipation base 600 that cooperate with each other;

[0035] The first circuit board 100 is disposed in the housing. The bottom surface of the first circuit board 100 is bonded to one surface of the metal heat dissipation base 600 and the light-emitting element 110 is mounted on the top surface.

[0036] The projection assembly is fixedly mounted on the first circuit board 100 and includes a barrel module 900 located on the optical axis of the light-emitting element 110, and an illumination lens assembly, a film assembly, and an imaging lens assembly arranged inside the barrel module 900 and along the optical axis of the light-emitting element 110.

[0037] The thermal conductive layer is arranged on the outside of the lens barrel module 900 and is in contact with the outer wall surface of the lens barrel module 900. Along the axial direction of the lens barrel module, the thermal conductive layer covers the outer wall surface of the lens barrel module at the location of the film assembly and extends to be in contact with the top surface of the first circuit board 100. The thermal conductivity of the thermal conductive layer is greater than the thermal conductivity of the lens barrel module 900.

[0038] The metal heat sink 600 is typically made of a metal material with excellent thermal conductivity, allowing it to quickly absorb heat and effectively dissipate it. The housing 700 is connected to the metal heat sink 600, forming a sealed space between them. This means that the heat within the lens barrel module 900 must pass through the first circuit board 100 to be directed to the metal heat sink 600. Otherwise, the heat will simply accumulate within the sealed space.

[0039] The lens barrel module 900 includes an illumination lens barrel 200 and an imaging lens barrel 300. The illumination lens barrel 200 is mounted on the first circuit board 100, and the imaging lens barrel 300 is mounted on the illumination lens barrel 200. The illumination lens barrel 200 is directly mounted on the first circuit board 100, and the light-emitting element 110 is located inside the illumination lens barrel 200. The illumination lens assembly is located inside the illumination lens barrel 200, and the film assembly is located between the illumination lens barrel 200 and the imaging lens barrel 300. The imaging lens assembly is located inside the imaging lens barrel 300.

[0040] The working principle of the projection lamp of this embodiment is as follows: when the light-emitting element 110 (such as an LED) is turned on, the light it emits passes through the illumination lens group, the film assembly and the imaging lens group in sequence. The imaging lens group refracts the light so that the originally tiny pattern on the film assembly can be focused and form a clear and magnified real image at a certain distance. Finally, this real image is projected onto the ground or other target surface.

[0041] To ensure that image quality is not affected by temperature changes, an effective thermal conductive layer is established between the lens module (especially the junction area between the illumination lens barrel 200 and the imaging lens barrel 300) and the first circuit board 100 to form a heat transfer path. The heat accumulated in the lens barrel module 900 can be transferred to the first circuit board 100 through the thermal conductive layer, thereby reducing the temperature inside the illumination lens barrel module 900 and reducing the problem of lens deformation caused by local overheating.

[0042] It should be noted that the main cause of heat generation in the lens barrel module 900 is that the film in the film assembly generally includes a transparent light-transmitting portion and a black light-shielding portion. Light emitted by the light-emitting element 110 passes through the film, with some of the light passing through the light-transmitting portion ultimately forming a projection pattern on the projected surface, while some of the light strikes the light-shielding portion, which absorbs this light and converts it into heat. Because the film assembly is generally located in the junction area between the illumination lens barrel 200 and the imaging lens barrel 300, the main heat generation area of the lens barrel module 900 is concentrated in the junction area between the illumination lens barrel 200 and the imaging lens barrel 300. Therefore, this solution specifically provides a thermally conductive layer in the junction area between the lens barrel and the illumination lens barrel 200. Heat is transferred to the metal heat sink 600 via the first circuit board 100, effectively solving the heat dissipation problem and ensuring system stability and projection quality.

[0043] The thermally conductive layer directs heat accumulated within lens barrel module 900 (particularly in the area surrounding the film assembly and imaging lens assembly) to first circuit board 100, releasing the heat trapped within lens barrel module 900 and reducing the internal temperature of lens barrel module 900, thereby mitigating thermal deformation of the imaging lens assembly. Because deformation of the imaging lens assembly is effectively controlled, the focus of the projected image is more stable, resulting in a clearer image. Even during long periods of continuous operation, high projection quality can be maintained, avoiding the problem of blurred projection patterns over time that occurs in traditional designs.

[0044] Example 1:

[0045] like Figure 1 、 Figure 2 As shown, the heat conducting layer is set as a heat conducting foil 400, which is a cylindrical surrounding structure and is attached to the outer wall of the lens barrel module 900, and the heat conducting foil 400 is attached to or in contact with the top surface of the first circuit board 100.

[0046] The heat conductive foil 400 is usually made of a material with high thermal conductivity, such as metal materials such as aluminum or copper. Such materials have good flexibility and thermal conductivity and can effectively transfer heat from one area to another.

[0047] In this example, the thermal conductive foil 400 is designed to fit tightly against the junction area between the imaging lens barrel 300 and the illumination lens barrel 200. Most of the heat generated by the light-emitting element 110 is refracted by the lens group and concentrated in this area. By directly covering this critical area with the thermal conductive foil 400, the accumulated heat can be quickly absorbed and conducted.

[0048] In addition, the heat-conducting foil 400 can also be attached to most of the circumference area of the imaging lens barrel 300 and most of the circumference area of the lighting lens barrel 200 to further increase the heat conduction area.

[0049] The heat-conducting foil 400 is designed to be cylindrical so as to completely surround the outer wall surface of the lens barrel module 900 , thereby significantly improving the heat dissipation efficiency.

[0050] On the basis of the above embodiment, a plurality of heat dissipation ribs 320 are provided on the outer wall surface of the imaging lens barrel 300 .

[0051] like Figures 1 to 4 As shown, based on the above embodiment, the lens barrel module 900 includes an illumination lens barrel 200 and an imaging lens barrel 300, the illumination lens barrel 200 is mounted on the first circuit board 100, and the imaging lens barrel 300 is mounted on the illumination lens barrel 200;

[0052] The illumination barrel 200 is provided with one of the internal thread 310 and the external thread 210 , and the imaging barrel 300 is provided with the other of the internal thread 310 and the external thread 210 . The imaging barrel 300 is threadedly connected to the illumination barrel 200 via the internal thread 310 and the external thread 210 .

[0053] The joining area of the imaging lens barrel 300 and the lighting lens barrel 200 is a threaded connection area. In the example, the lighting lens barrel 200 is provided with an external thread 210, and the imaging lens barrel 300 is provided with an internal thread 310. This layout can increase the contact area between the imaging lens barrel 300 and the heat-conducting layer, thereby improving the heat dissipation effect.

[0054] Example 2:

[0055] like Figure 2 、 Figure 3 As shown, the heat-conducting layer is a metal coating covering the outer surface of the lens barrel module 900 .

[0056] The metal plating layer includes a first metal plating layer 510 and a second metal plating layer 520. The first metal plating layer 510 is located on the outer wall of the lighting lens barrel 200 and one of the internal thread 310 and the external thread 210. The second metal plating layer 520 is located on the outer wall of the imaging lens barrel 300 and the other of the internal thread 310 and the external thread 210. The first metal plating layer 510 contacts the first circuit board 100, and the second metal plating layer 520 contacts the first metal plating layer 510 through the cooperation of the internal thread 310 and the external thread 210.

[0057] In the second embodiment, a metal coating with high thermal conductivity is used as the heat conducting layer. When the two lighting lens barrels 200 and the imaging lens barrel 300 are connected by threads, the second metal coating 520 is in close contact with the first metal coating 510, forming a continuous heat conducting layer. The first metal coating 510 is in direct contact with the first circuit board 100, thereby establishing an effective heat conduction path. Heat from the lighting lens barrel 200, the imaging lens barrel 300, and the threaded connection area between the two can be transferred to the first circuit board 100.

[0058] In the second embodiment, the use of metal plating as the heat conductive layer can make the overall structure more simple and compact, without the need for additional heat conductive parts. The metal plating itself can be attached to the surface of the lighting lens barrel 200 and the imaging lens barrel 300 by electroplating, which simplifies the production process and improves assembly efficiency.

[0059] Based on the second embodiment, the gap between the internal thread 310 and the external thread 210 is filled with thermally conductive adhesive or thermal grease. Although the metal coating provides a good heat conduction path, there may be small gaps or incomplete contact at the threaded connection. These gaps will affect the thermal conductivity. By applying an appropriate amount of thermally conductive adhesive between the internal thread 310 and the external thread 210, these gaps can be effectively filled, ensuring the thermal conductivity of the metal coating at the threaded connection.

[0060] like Figures 1 to 4 As shown, the first circuit board 100 is configured as an aluminum substrate.

[0061] First circuit board 100 utilizes an aluminum substrate, which offers excellent thermal conductivity and rapidly transfers heat generated by light-emitting elements 110 and heat conducted from the thermally conductive layer to metal heat sink 600. The aluminum substrate consists of three layers: a circuit layer, an insulating layer, and an aluminum base layer. The circuit layer is used to mount electronic components, the insulating layer ensures electrical isolation, and the aluminum base layer serves as the primary heat dissipation path, bonded to metal heat sink 600.

[0062] Due to the excellent thermal conductivity of the aluminum substrate, it is suitable for mounting components that generate a large amount of heat, such as the light-emitting element 110 (e.g., LED), the illumination lens barrel 200, and the imaging lens barrel 300. The heat generated by these high-heat-generating components is quickly transferred through the aluminum substrate to the metal heat sink base 600 in close contact with it, thereby effectively reducing the operating temperature of the components and avoiding performance degradation or damage due to overheating.

[0063] like Figures 1 to 4 As shown, it also includes a second circuit board 800 arranged in the shell and electrically connected to the first circuit board 100. The bottom surface of the second circuit board 800 is not in contact with the surface of the metal heat dissipation base 600 and there is a gap; the first circuit board 100 is set as an aluminum substrate.

[0064] The second circuit board 800 is mainly used to install electronic components with lower heat generation, so that selective layout can be performed according to the heat generation of the components, which helps to balance the temperature distribution of the entire system and improve space utilization and wiring efficiency.

[0065] The bottom surface of the second circuit board 800 does not fit the surface of the metal heat dissipation base 600, which can prevent heat from being transferred to the second circuit board 800 through the metal heat dissipation base 600 and prevent the electronic components on the second circuit board 800 from being overheated.

[0066] like Figure 1 、 Figure 3 、 Figure 5 、 Figure 6As shown, based on the above embodiment, the other side of the metal heat dissipation base 600 is provided with heat dissipation fins 610 , and the heat dissipation fins 610 correspond to the area where the first circuit board 100 is located.

[0067] The heat sink fins 610 are primarily located in the area corresponding to the first circuit board 100. This is because high-heat generating components are concentrated in this area, requiring more efficient heat dissipation to maintain a suitable operating temperature. The heat sink fins 610 are designed to increase the heat dissipation area, thereby improving the ability of air circulation to remove heat.

[0068] like Figures 1 to 6 As shown, a vehicle includes a projection lamp assembly and a housing 700 . A metal heat dissipation base 600 is connected to the housing 700 . A first circuit board 100 , an illumination lens barrel 200 , and an imaging lens barrel 300 are all located in the housing 700 .

[0069] In a vehicle, the primary source of heat is the light-emitting element 110 (such as an LED). When the LED is operating, it generates a significant amount of heat, some of which is transferred to the metal heat sink 600 via the first circuit board 100 (aluminum substrate). After the light generated by the light-emitting element 110 passes through the film, heat is generated within the lens barrel due to the film's ability to absorb light and generate heat. This heat accumulates in the junction area between the illumination lens barrel 200 and the imaging lens barrel 300. The thermal conductive layer directs this heat to the first circuit board 100 (aluminum substrate), and then to the metal heat sink 600, thereby reducing the heat inside the lens barrel and preventing deformation of the lens assembly due to overheating, which could reduce projection clarity.

[0070] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship and movement status of the various components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0071] In addition, terms such as "first," "second," and "an" in the present invention are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one of such features.

[0072] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixed", etc. should be understood in a broad sense. For example, "fixed" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly specified and limited.

[0073] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

Claims

1. A projection lamp assembly, characterized in that: include: A housing, comprising an outer shell (700) and a metal heat dissipation base (600) that cooperate with each other; a first circuit board (100), the first circuit board (100) being arranged in the housing, the bottom surface of the first circuit board (100) being in contact with a surface of the metal heat dissipation base (600), and a light-emitting element (110) being mounted on the top surface; A projection assembly, the projection assembly being fixedly arranged on the first circuit board (100), the projection assembly comprising a lens barrel module (900) located on the optical axis path of the light-emitting element (110), and an illumination lens group, a film assembly, and an imaging lens group arranged inside the lens barrel module (900) and along the optical axis direction of the light-emitting element (110); A heat-conducting layer is provided outside the lens barrel module (900) and is in contact with the outer wall surface of the lens barrel module (900); along the axial direction of the lens barrel module, the heat-conducting layer covers the outer wall surface of the lens barrel module at the location of the film assembly and extends to be in contact with or in contact with the top surface of the first circuit board (100); the thermal conductivity of the heat-conducting layer is greater than the thermal conductivity of the lens barrel module (900).

2. The projection lamp assembly according to claim 1, wherein: The heat-conducting layer is configured as a heat-conducting foil (400), the heat-conducting foil (400) is in a cylindrical surrounding structure and is adhered to the outer wall surface of the lens barrel module (900), and the heat-conducting foil (400) is adhered to or in contact with the top surface of the first circuit board (100).

3. The projection lamp assembly according to claim 1, wherein: The heat-conducting layer is a metal plating layer covering the outer surface of the lens barrel module (900).

4. A projection lamp assembly according to claim 1 or 2, characterized in that: The outer wall surface of the imaging lens barrel (300) is provided with a plurality of heat dissipation ribs (320).

5. A projection lamp assembly according to claim 1 or 2, characterized in that: The lens barrel module (900) comprises an illumination lens barrel (200) and an imaging lens barrel (300), wherein the illumination lens barrel (200) is mounted on the first circuit board (100), and the imaging lens barrel (300) is mounted on the illumination lens barrel (200); The lighting lens barrel (200) is provided with one of an internal thread (310) and an external thread (210), and the imaging lens barrel (300) is provided with the other of an internal thread (310) and an external thread (210). The imaging lens barrel (300) is threadedly connected to the lighting lens barrel (200) via the internal thread (310) and the external thread (210).

6. The projection lamp assembly according to claim 5, wherein: The outer wall surface of the lighting lens barrel (200) and one of the internal thread (310) and the external thread (210) are provided with a continuous first metal plating layer (510); the outer wall surface of the imaging lens barrel (300) and the other of the internal thread (310) and the external thread (210) are provided with a continuous second metal plating layer (520); the first metal plating layer (510) is in contact with the first circuit board (100); and the second metal plating layer (520) is in contact with the first metal plating layer (510) through the cooperation of the internal thread (310) and the external thread (210).

7. The projection lamp assembly according to claim 6, wherein: The gap between the internal thread (310) and the external thread (210) is filled with thermal conductive glue or thermal conductive silicone grease.

8. The projection lamp assembly according to claim 1, wherein: It also includes a second circuit board (800) disposed in the housing and electrically connected to the first circuit board (100), wherein the bottom surface of the second circuit board (800) is not in contact with the surface of the metal heat dissipation base (600) and a gap exists therebetween; the first circuit board (100) is configured as an aluminum substrate.

9. A projection lamp assembly according to claim 1 or 8, characterized in that: The other surface of the metal heat dissipation base (600) is provided with heat dissipation fins (610), and the heat dissipation fins (610) correspond to the area where the first circuit board (100) is located.

10. A vehicle, characterized in that: The invention comprises the projection lamp assembly according to any one of claims 1 to 9.

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