System and method for resistor temperature rise test

Abstract

The invention relates to the field of resistance measurement, in particular to a system and a method for a resistor temperature rise test. The system comprises a control unit, a power supply unit, a signal processing unit and a data processing unit, one end of the control unit is connected with the power supply unit, the other end of the control unit is connected with the data processing unit, the power supply unit is connected with the signal processing unit, and the signal processing unit is connected with the data processing unit; the problems of large voltage measurement error, high potential safety hazard of manual operation, inconvenience in temperature measurement and the like in the prior art are effectively solved, the high-voltage probe is directly connected with the wire inlet and outlet ends of the tested resistor, and the voltage of the tested resistor is directly measured by combining optical fiber transmission, so that the measurement accuracy is improved. Errors caused by indirect measurement of the secondary side voltage of a traditional voltage regulator are avoided.

Description

Technical Field

[0001] The present invention relates to the field of resistance measurement, and in particular to a system and method for a resistor temperature rise test. Background Art

[0002] The resistors used in filters and neutral point grounding resistors are generally composed of several identical resistor units connected in series. The existing technology generally performs the following steps for the temperature rise test of resistors: one of the identical resistor units is selected for testing, and the voltage required by the standard is applied to the resistor unit under test so that the voltage value or current value on the resistor unit or the power value of the resistor element meets the specified requirements. During the test, the temperature of different parts of the resistor is measured. If the temperature rise does not exceed the specified value after the test time is reached, and the resistance value during the test is converted to the normal temperature within the specified range, the resistor temperature rise test passes; otherwise, the test fails.

[0003] However, the temperature rise test of the prior art has the following problems: 1. The test voltage is at the kilovolt level, and needs to be applied directly using the voltage regulator of the power frequency test transformer. The voltage divider of the transformer specifically for measuring voltage is generally installed together with the protective resistor and the transformer, which is inconvenient to disassemble, and the rated voltage of the voltage divider is much larger than the applied voltage. Therefore, the applied voltage cannot be read using the voltage divider, and only the secondary voltage of the voltage regulator on the voltage regulator can be read. There is a cable between the voltage regulator and the test piece, so the voltage on the test piece is not read directly, which will cause errors; 2. The current is measured by clamping one of the cables connected to the resistor unit with a clamp ammeter to read the current value. It is necessary for people to enter the high-voltage test area during the pressurization process, which poses a safety hazard. In addition, if it is specified as 1. In order to measure the current value, the pressurizing personnel need to add the current value repeatedly reported by the current personnel in the test area to the specified value, which affects the test efficiency; 2. Infrared thermometers are generally used to measure the resistance temperature, so the resistor shell needs to be opened in advance so that the measured infrared light can be irradiated on the measured part, and the resistor shell carries voltage during the test, and the temperature will be relatively high as the pressurization time increases. Therefore, it is inconvenient to open the resistor shell for measurement during the test, and the test can only be carried out with the shell opened, which is different from the actual operating state of the resistor, and will cause the measurement results to deviate from the actual operating conditions; 3. The existing technology for measuring the resistance temperature requires measurement personnel to frequently enter the test area during the pressurization process, which causes safety hazards. In addition, errors are prone to occur during manual measurement. Summary of the Invention

[0004] In view of the problems mentioned in the prior art, the present invention proposes a system and method for a resistor temperature rise test to overcome the problems in the background art.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: The present invention provides a system for a resistor temperature rise test, comprising a control unit, a power supply unit, a signal processing unit, and a data processing unit. One end of the control unit is connected to the power supply unit, and the other end is connected to the data processing unit. The power supply unit is connected to the signal processing unit, and the signal processing unit is connected to the data processing unit. The power supply unit includes a connected voltage regulator and a power supply, wherein the voltage regulator is used to apply a preset voltage, current or power to the resistor unit under test via a cable; A signal processing unit includes a high-voltage probe, a current coil, a thermocouple, and a photoelectric conversion device; the high-voltage probe is connected to the input and output terminals of the tested resistor unit and can directly measure the voltage of the tested resistor unit; the current coil is installed on the cable; the thermocouple is embedded in multiple temperature measurement points of the tested resistor unit; the photoelectric conversion device is used to convert the electrical signals collected by the high-voltage probe, current coil, and thermocouple into optical signals and transmit them to the data processing unit via optical fiber; The data processing unit includes an electro-optical conversion device, a data acquisition device, and a host computer. The electro-optical conversion device is used to convert the optical signal into an electrical signal. The electrical signal is collected by the data acquisition device and input into the host computer for analysis. The control unit includes a PLC and a control cable; the PLC is used to control the power supply unit to adjust the voltage or current through the cable according to preset parameters.

[0006] As a further improvement of the present invention, the high-voltage probe and the photoelectric conversion device for collecting high-voltage probe signals are all insulated from the thermocouple and the photoelectric conversion device for collecting thermocouple signals.

[0007] As a further improvement of the present invention, the data processing unit further includes: Preset parameter module, used to input test parameters; The abnormality judgment module is used to compare the measured value with the preset parameter threshold in real time and trigger an alarm when the limit is exceeded.

[0008] As a further improvement of the present invention, the control unit can automatically adjust the output of the power supply unit to maintain the stability of the test parameters by comparing the deviation between the measured value and the preset parameters. As a further improvement of the present invention, the data processing unit can measure the voltage, current and temperature values during the test in real time, and can draw them into curves for real-time display.

[0009] As a further improvement of the present invention, the data processing unit can calculate the hot resistance value and power value of the tested resistor unit during the test in real time.

[0010] As a further improvement of the present invention, the optical signal transmitted by the optical fiber includes voltage, current and temperature signals, and the data processing unit supports multi-channel recording and display.

[0011] The present invention proposes a method for a resistor temperature rise test, based on the above system, comprising the following steps: Connect the resistor unit under test to the cable, high-voltage probe, current coil and thermocouple, and install the photoelectric conversion device; inputting preset parameters into the data processing unit; Start the test, the control unit controls the power supply unit; Confirm the system wiring status and safety device status; The system records the initial data and controls the power supply unit to rise to the preset value. Collect voltage, current and temperature data in real time, and calculate the thermal resistance and power value of the resistor; When the voltage, current and temperature data of the detection data exceed the threshold, an alarm is triggered; After the test is completed, a test report containing data and curves is generated.

[0012] As a further improvement of the present invention, when collecting voltage, current, and temperature data in real time and calculating the hot resistance and power value of the resistor, the voltage regulator is controlled by PLC feedback to automatically correct the voltage or current based on the deviation between the collected measurement value and the preset parameters.

[0013] As a further improvement of the present invention, the thermocouple, the photoelectric conversion device and the data processing unit are calibrated before the test.

[0014] Compared with the prior art, the present invention has achieved the following technical effects: The present invention effectively solves the problems of large voltage measurement errors, high safety risks of manual operation and inconvenient temperature measurement in the prior art by integrating the control unit, power unit, signal processing unit and data processing unit. The present invention adopts a high-voltage probe to directly connect the input and output terminals of the tested resistor, combined with optical fiber transmission, to achieve direct measurement of the tested resistor voltage, avoiding the error caused by indirect measurement of the secondary voltage of the traditional voltage regulator. The installation of the current coil and cable and the buried design of the thermocouple can collect current and temperature signals in real time without manual entry into the high-voltage area, significantly improving the safety of the test. At the same time, the photoelectric conversion device transmits the optical signal to the data processing unit via optical fiber, combined with the multi-channel recording and analysis function of the host computer, to achieve synchronous high-precision collection and processing of voltage, current and temperature data. The control unit automatically adjusts the output of the power unit according to preset parameters, ensuring the stability of the test parameters, further improving the test efficiency and automation level. In addition, the system supports closed-loop feedback control, which can dynamically correct the voltage or current based on real-time data, avoiding the delay and error of manual intervention and improving the test accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1Schematic diagram of the structure of the system of the present invention; Figure 2 A circuit wiring diagram of the system of the present invention; Figure 3 Schematic diagram of the process of the present invention.

[0016] Figure numerals: 1. Photoelectric conversion device; 2. Optical fiber; 3. Housing; 4. Thermocouple; 5. Insulation support structure; 6. Cable; 7. Current coil; 8. High-voltage probe; 9. Heat dissipation window. DETAILED DESCRIPTION

[0017] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are to be considered as illustrative in nature and not restrictive.

[0018] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0020] In the present invention, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0021] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0022] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0023] It should also be understood that the terms used in the present specification are only for the purpose of describing particular embodiments and are not intended to limit the present invention. As used in the present specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0024] It should be further understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0025] The accompanying drawings illustrate various schematic diagrams of structures according to embodiments disclosed herein. These figures are not drawn to scale; for clarity, some details are exaggerated and some details may be omitted. The shapes of the various regions and layers shown in the figures, as well as their relative sizes and positional relationships, are merely exemplary and may deviate in practice due to manufacturing tolerances or technical limitations. Those skilled in the art may design regions / layers with different shapes, sizes, and relative positions as needed.

[0026] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0027] like Figure 1 As shown, the present invention proposes a system for resistor temperature rise test, comprising a control unit, a power supply unit, a signal processing unit and a data processing unit connected in sequence. The power supply unit includes a voltage regulator and a cable 6, wherein the voltage regulator applies a preset voltage, current or power to the resistor unit under test through the cable 6; The signal processing unit includes a high-voltage probe 8, a current coil 7, a thermocouple 4, and a photoelectric conversion device 1; the high-voltage probe 8 is connected to the input and output terminals of the tested resistor unit, the current coil 7 is installed on the cable 6, and the thermocouple 4 is buried at multiple temperature measurement points of the tested resistor unit. The photoelectric conversion device 1 transmits the optical signals collected by the high-voltage probe 8, the current coil 7, and the thermocouple 4 to the data processing unit via the optical fiber 2; The data processing unit includes an electro-optical conversion device, a data acquisition device, and a host computer. The electro-optical conversion device converts the optical signal into an electrical signal, which is collected by the data acquisition device and input into the host computer for analysis. The control unit includes a PLC and a control cable; the PLC controls the power supply unit to adjust the voltage or current through the cable according to preset parameters.

[0028] Implementation example Figure 1 As shown, the power supply unit consists of a voltage regulator, a power supply, and a cable 6. One end of the voltage regulator is connected to the cable 6, and the other end is connected to the power supply. The voltage regulator applies a preset voltage, current, or power to the resistor unit under test through the cable 6. The cable 6 is connected to the input and output terminals of the resistor unit under test, respectively.

[0029] Unlike traditional voltage regulators that directly output voltage, the present invention controls the voltage regulator through the PLC (programmable logic controller) of the control unit to ensure that the output parameters are consistent with the preset values. In the embodiment, the cable 6 adopts a high-voltage and low-impedance design, in which the tested resistor unit is connected to the power cable 6 through the outlet bushing.

[0030] In the embodiment, the signal processing unit is responsible for collecting the voltage, current and temperature signals of the tested resistor unit and converting them into optical signals to transmit to the data processing unit. Specifically, it includes the following components: High-voltage probe 8: Directly connected to the input and output terminals of the resistor under test, it measures the actual voltage across the resistor in real time, avoiding the error of indirect measurement through the secondary side voltage of the voltage regulator in the traditional method. Current coil 7: It does not need to be in contact with the resistor unit under test. The current coil 7 is installed on the surface of the cable 6 and collects the current signal through the electromagnetic principle. This arrangement can avoid disconnecting the circuit or frequent manual intervention in the high-voltage area.

[0031] Thermocouple 4: multiple temperature measuring points embedded in the resistor under test. The temperature measuring points in the embodiment include the surface of the resistor chip, the connection point and the vicinity of the heat dissipation window 9, but are not limited to these. The number of temperature measuring points can be increased or decreased according to actual measurement requirements. The temperature distribution of the resistor unit under test can be directly monitored through the temperature measuring points.

[0032] Photoelectric conversion device 1: In the embodiment, there are multiple photoelectric conversion devices 1, which can convert the voltage signal collected by the high-voltage probe 8, the current signal collected by the current coil 7, and the temperature signal collected by the thermocouple 4 into optical signals and transmit them to the data processing unit through the optical fiber 2. In the embodiment, since the two input ends of the high-voltage probe 8 are connected to the test resistor and are not grounded, the output end as a whole will have high voltage, and the photoelectric conversion device 1 needs to be insulated from the ground as a whole to prevent it from being damaged by the voltage; and the current coil 7 is connected to the cable 6 through which the measurement passes. Since the outer and inner conductors of the cable 6 are insulated and grounded by a grounding layer, the current coil 7 as a whole does not carry high voltage, so the photoelectric conversion device 1 connected to it does not need to be insulated from the ground; in addition to the electromotive force generated by heat, the two conductors of the thermocouple 4 both carry the same high voltage, so the connected photoelectric conversion device 1 needs to be insulated from the ground as a whole. The above arrangement can ensure signal isolation and safety in a high-voltage environment.

[0033] The data processing unit consists of an electro-optical conversion device, a data acquisition device and a host computer, and is responsible for signal parsing, storage and analysis: Electro-optical conversion device: restores the optical signal transmitted by optical fiber 2 into an electrical signal for subsequent processing.

[0034] Data acquisition devices: Sample electrical signals at high speed, supporting multi-channel simultaneous recording (e.g., voltage, current, and temperature). The host computer includes a built-in preset parameter module, an anomaly detection module, and data analysis software. The preset parameter module allows the user to enter test target values (e.g., rated voltage, current threshold, and temperature rise limit). The anomaly detection module compares measured data with thresholds in real time, triggering audible and visual alarms when the thresholds are exceeded. The data analysis software automatically calculates the resistor's hot resistance and power values and generates a test report.

[0035] In this embodiment, the control unit is centered around a PLC, which is linked to the power supply unit and data processing unit via control cables. Based on test parameters preset by the host computer, the PLC receives real-time feedback signals from the data processing unit (such as voltage deviation and current fluctuations) and outputs control commands to the voltage regulator, dynamically adjusting the output voltage or current. For example, if the current changes due to a resistor's temperature rise, the PLC can automatically increase the voltage to maintain a stable current.

[0036] In the embodiment, the tested resistor unit is arranged in a housing 3, which is made of metal and has a shape of a rectangular parallelepiped, with four sides and a top made of metal plates, a bottom made of metal mesh, and a heat dissipation window 9 for heat dissipation near the top of the side. The heat dissipation window 9 uses a metal mesh with a certain mesh size and some inclined waterproof metal sheets; there are many resistor elements inside the housing 3 that are connected in series and parallel to form the total resistance of the resistor unit, and the midpoint of the resistance of some resistor units is connected to the housing 3 through a voltage-equalizing connection, wherein insulators are used for insulation between the resistor elements and the housing 3, or between the housings 3 of the resistor units in the next layer, and the housing 3 and the ground are insulated by an insulating support structure 5.

[0037] like Figure 2 As shown in the circuit diagram of the present invention, U represents the power supply voltage, AT represents the voltage regulator, R represents the resistor unit under test, the dashed box HVP represents the high-voltage probe 8, C1 and C2 represent the high-voltage and low-voltage arms of the high-voltage probe 8, respectively, CC represents the current coil 7, and DAP represents the data processing unit. The input end of the voltage regulator AT is connected to the power supply, and the output end is connected to one end of the cable 6. The other end of the cable 6 is connected to the input and output terminals of the resistor unit under test R. The two ends of the high-voltage probe 8 HVP are connected to the input and output terminals of R, respectively, to directly measure the voltage applied to R.

[0038] CC is a current coil 7, which passes through the power cable 6 near the input or output of R. It directly measures the current flowing into R and converts the current value into a voltage value. The high-voltage probe 8HVP and the current coil 7CC convert the optical signal into an optical signal through a photoelectric conversion device, which is then transmitted via optical fiber 2 to the data processing unit DAP. The DAP converts the optical signal into an electrical signal and collects the data. The collected voltage value and the converted current value are stored and recorded, and their real-time waveforms and effective values are displayed on the display program of the processing software. In addition, the DAP can also calculate the real-time hot resistance value and power of the tested resistor unit R, record the data, and display the curve and real-time calculated value on the screen.

[0039] like Figure 3As shown, the present invention proposes a method for resistor temperature rise testing. Since the present invention uses a thermocouple 4 for temperature measurement, the thermocouple 4, the photoelectric conversion device 1 connected to the thermocouple 4, the optical fiber 2, and the data processing unit must be calibrated in advance and compared with a standard measurement system. The initial calibration can be performed by obtaining a corresponding relationship based on the temperature value of the standard measurement system and the electromotive force value of the thermocouple 4 measured at that temperature. Then, according to the conversion relationship between thermocouple 4 temperature and electromotive force specified in GB / T 16839.1-2018 "Thermocouples 4 - Part 1: Electromotive Force Specifications and Tolerances," the coefficients in the function are solved by solving a system of equations. This can then be verified at multiple calibration temperature points. Alternatively, after obtaining this relationship, a least squares fit can be performed to obtain a functional relationship between temperature and electromotive force. In subsequent calibrations, the temperature measured by the standard measurement system can be compared with the temperature obtained by the conversion using the aforementioned temperature measurement system to determine whether the error is within the specified range.

[0040] Before the test, first connect the thermocouple 4 to the position where the tested resistor unit needs to be measured, and connect the tested resistor unit to the cable 6, high-voltage probe 8, and current coil 7 respectively. At the same time, connect one end of multiple photoelectric conversion devices 1 to the thermocouple 4, high-voltage probe 8, and current coil 7 respectively, and the other end to the data processing unit to complete the connection work.

[0041] Open the host computer, enter the measurement software, click New, enter the test number and atmospheric conditions, set each channel on the software, and the current channel restores the measured voltage to the current value by inputting the transformation ratio formula of the current coil 7. Each thermocouple 4 also directly restores the measured electromotive force to the temperature value by inputting the relationship determined during calibration. At the same time, set the maximum value of the resistance in each test stage, the maximum value of the temperature at each temperature measuring point, and the preset value of the voltage, current or power applied in each test stage and the application time in the setting interface, and start the test.

[0042] During the test, the parameters before the test are measured first. The host computer will display the curves of voltage, current, resistance, power, temperature at each point, etc. changing with time, and will display their real-time values in numbers and save them. After recording the temperature of each measurement point before the test, the pressure is applied according to the preset value. By comparing the preset value and the measured value, the voltage and current can be applied to the test preset value, and the timing is started. During the timing process, if the voltage and current change with the change of external load or resistance value, they can be adjusted in time according to the deviation of the preset value through the control unit. When the test is carried out, if the calculated resistance value or the measured temperature data exceeds the threshold, an alarm will be sent to the test personnel, waiting for personnel to handle it. If the test data is normal, then after the time is up, if there is a next stage test, the applied voltage and current values will be automatically adjusted to carry out the next stage test, or the voltage will be automatically reduced and the power will be turned off to complete the test. After clicking to complete the test, the system automatically generates the original record according to the record template and the test data and curve chart, and automatically saves it as a document named the commissioned test number.

[0043] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, from all points of view, the embodiments should be regarded as illustrative and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and range of equivalents of the claims are included in the present invention. Any reference signs in the claims should not be construed as limiting the claim to which they relate.

[0044] In addition, it should be understood that although this specification describes the embodiments, not every embodiment contains only one independent technical solution. This description is for clarity only. Those skilled in the art should consider the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art. The above content is only for the purpose of illustrating the technical concept of the present invention and cannot be used to limit the scope of protection of the present invention. Any changes made based on the technical solution in accordance with the technical concept proposed by the present invention fall within the scope of protection of the claims of the present invention.

Claims

1. A system for resistor temperature rise test, characterized in that: It includes a control unit, a power supply unit, a signal processing unit and a data processing unit, wherein one end of the control unit is connected to the power supply unit and the other end is connected to the data processing unit, the power supply unit is connected to the signal processing unit, and the signal processing unit is connected to the data processing unit; The power supply unit includes a connected voltage regulator and a power supply, wherein the voltage regulator is used to apply a preset voltage, current or power to the resistor unit under test via a cable; A signal processing unit includes a high-voltage probe, a current coil, a thermocouple, and a photoelectric conversion device; the high-voltage probe is connected to the input and output terminals of the tested resistor unit and can directly measure the voltage of the tested resistor unit; the current coil is installed on the cable; the thermocouple is embedded in multiple temperature measurement points of the tested resistor unit; the photoelectric conversion device is used to convert the electrical signals collected by the high-voltage probe, current coil, and thermocouple into optical signals and transmit them to the data processing unit via optical fiber; The data processing unit includes an electro-optical conversion device, a data acquisition device, and a host computer. The electro-optical conversion device is used to convert the optical signal into an electrical signal. The electrical signal is collected by the data acquisition device and input into the host computer for analysis. The control unit includes PLC and control cables; The PLC is used to control the power supply unit to adjust the voltage or current through the cable according to preset parameters.

2. A system for resistor temperature rise test according to claim 1, characterized in that: The high-voltage probe and the photoelectric conversion device for collecting high-voltage probe signals are all insulated from the ground as are the thermocouple and the photoelectric conversion device for collecting thermocouple signals.

3. A system for resistor temperature rise test according to claim 1, characterized in that: The data processing unit also includes: Preset parameter module, used to input test parameters; The abnormality judgment module is used to compare the measured value with the preset parameter threshold in real time and trigger an alarm when the limit is exceeded.

4. A system for resistor temperature rise test according to claim 3, characterized in that: The control unit can automatically adjust the output of the power supply unit to maintain the stability of the test parameters by comparing the deviation between the measured value and the preset parameters.

5. A system for resistor temperature rise test according to claim 1, characterized in that: The data processing unit can measure the voltage, current and temperature values during the test in real time, and can draw them into curves for real-time display.

6. A system for resistor temperature rise test according to claim 5, characterized in that: The data processing unit can calculate the hot resistance value and power value of the tested resistor unit during the test in real time.

7. A system for resistor temperature rise test according to claim 1, characterized in that: The optical signal transmitted by the optical fiber includes voltage, current and temperature signals, and the data processing unit supports multi-channel recording and display.

8. A method for a resistor temperature rise test, characterized in that: The system according to any one of claims 1 to 7 comprises the following steps: Connect the resistor unit under test to the cable, high-voltage probe, current coil and thermocouple, and install the photoelectric conversion device; inputting preset parameters into the data processing unit; Start the test, the control unit controls the power supply unit; Confirm the system wiring status and safety device status; The system records the initial data and controls the power supply unit to rise to the preset value. Collect voltage, current and temperature data in real time, and calculate the thermal resistance and power value of the resistor; When the voltage, current and temperature data of the detection data exceed the threshold, an alarm is triggered; After the test is completed, a test report containing data and curves is generated.

9. A method for resistor temperature rise test according to claim 8, characterized in that: When collecting voltage, current, and temperature data in real time and calculating the hot resistance and power value of the resistor, the voltage regulator is controlled through PLC feedback to automatically correct the voltage or current based on the deviation between the collected measurement value and the preset parameters.

10. A method for resistor temperature rise test according to claim 8, characterized in that: Before the test, the thermocouple, photoelectric conversion device and data processing unit were calibrated.

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