Wafer low-temperature test equipment

Abstract

The invention relates to wafer low-temperature test equipment which comprises a pick-and-place box, a test box communicated with the pick-and-place box and a storage box door arranged on the pick-and-place box, a low-temperature test cabinet is fixedly communicated with the top of the test box, and a probe detection plate used for testing wafers is arranged in the low-temperature test cabinet. A sealing cover located in the test box is arranged below the probe detection plate, an insertion port is formed in the bottom of the sealing cover, the sealing cover further communicates with an air inlet one-way valve, a vacuum adsorption plate capable of moving in multiple directions is arranged in the sealing cover, and the vacuum adsorption plate can move downwards to be attached to the sealing cover and seal the insertion port; the sealing cover is communicated with a bearing module capable of moving from the pick-and-place box to the test box, the bearing module can move upwards to be inserted into the insertion port in a sealed mode, wafers are pre-cooled when the bearing module moves, a transfer module is further arranged in the pick-and-place box, and the low-temperature test cabinet is communicated with a compressor. The method has the advantage of being convenient for low-temperature testing.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer testing equipment, and in particular relates to low-temperature wafer testing equipment. Background Art

[0002] With the development of semiconductor technology and the improvement of packaging integration, low-temperature wafer bonding technology is needed to meet the integration requirements between homogeneous or heterogeneous materials with large differences in thermal expansion coefficients. In this process, low-temperature wafer testing is crucial for evaluating bonding effects and material properties. Low-temperature environments can make materials harden, become brittle, and shrink. Through low-temperature wafer testing, we can understand the physical and chemical properties of materials at low temperatures and evaluate whether they are suitable for specific application scenarios. However, existing wafer testing equipment cannot achieve testing at low temperatures. Therefore, there is a need for a low-temperature wafer testing device. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a wafer low-temperature testing device that is convenient for low-temperature testing.

[0004] The technical solutions of the present invention are as follows:

[0005] A wafer low-temperature testing device comprises a pick-and-place box, a test box connected to the pick-and-place box, and a storage box door provided on the pick-and-place box; the top of the test box is fixedly connected to a low-temperature test cabinet; a probe detection plate for testing wafers is provided inside the low-temperature test cabinet; a closing cover located inside the test box is provided below the probe detection plate; a plug interface is provided at the bottom of the closing cover; the closing cover is also connected to an air intake one-way valve; a vacuum adsorption plate capable of multi-directional displacement is provided inside the closing cover; the vacuum adsorption plate can be moved downward to fit the closing cover and seal the plug interface;

[0006] The closure cover is connected to a carrying module that can be moved from the pick-up box to the test box, the carrying module can be moved upward and sealed to be inserted into the plug interface, and the carrying module pre-cools the wafer when it moves;

[0007] A transfer module is also provided inside the pick-and-place box, and the low-temperature test cabinet is connected to a compressor.

[0008] Furthermore, the side walls of the low-temperature test cabinet are each provided with a flow cavity, and the flow cavity is connected to the compressor.

[0009] Furthermore, a plurality of lifting cylinders fixed on the test box are provided inside the closing cover, and the plurality of lifting cylinders are connected to displacement components for driving the vacuum adsorption plate to move in a horizontal direction.

[0010] Furthermore, the carrying module includes a carrying plate that can be moved from a pick-up and place box to a test box, a rotating base rotatably connected to the carrying plate, a rotating drive module for driving the rotating base to adjust the angle, a pre-cooling module located inside the rotating base, a displacement connecting module connected to the closing cover and the pre-cooling module, and a fitting component that can be raised and lowered. The pre-cooling module gradually mixes the air in the closing cover and the test box and blows it onto the wafer as the carrying plate moves up and down. The carrying plate can be moved up and down.

[0011] Furthermore, the pre-cooling module includes an extraction cylinder rotatably connected to the interior of the rotating base, a gear fixed to the bottom of the extraction cylinder, an electric telescopic rod rotatably connected to the gear, a slider fixed to the bottom of the electric telescopic rod, and a mixing barrel fixedly connected to the top of the extraction cylinder and rotatably connected to the rotating base. An extraction assembly connected to the rotating base is provided inside the extraction cylinder, and the mixing barrel is used to purge mixed cold air toward the wafer.

[0012] The extraction cylinder is rotatably sealed and connected to a communication channel provided on the rotating base, the communication channel is connected to the bottom of the rotating base, and the communication channel is unidirectionally connected to the extraction cylinder;

[0013] The gear is meshed with a rack, the gear is rotationally sealed and connected to the displacement communication module, and the gear is unidirectionally connected to the extraction cylinder;

[0014] The bottom of the slider is slidably connected to a displacement slide rail, and a busbar is provided on one side of the displacement slide rail. The busbar, displacement slide rail and rack are all fixed in the test box and the pick-and-place box and are arranged along the displacement direction of the load-bearing plate;

[0015] The conductor line is connected to the electric telescopic rod through an electric wire.

[0016] Furthermore, the extraction assembly includes a reciprocating screw rotatably connected to the axis of the extraction cylinder, a one-way exhaust disk connected to the reciprocating screw, and a polygonal sealing cylinder fixed to the one-way exhaust disk and the bottom of the inner side of the extraction cylinder respectively. The two polygonal sealing cylinders fit together and seal to divide the space of the extraction cylinder below the one-way exhaust disk into a low-temperature chamber and a room-temperature chamber. The displacement connecting module is connected to the low-temperature chamber through a gear, and the connecting channel is connected to the room-temperature chamber. The top of the reciprocating screw is fixed on the rotating base.

[0017] Furthermore, a placement groove is provided on the top of the rotating base, a plurality of supporting protrusions are provided in the placement groove, and a clamping plate for clamping the wafer is also provided in the placement groove.

[0018] Furthermore, the displacement communication module includes two side plates, rotating columns that are rotatably connected to the two ends of the side plates, and a sealing fitting belt that is sealed on the two rotating columns. One of the side plates is fixed in the test box and the pick-and-place box. Fitting grooves are provided on the opposite sides of the two side plates. The sealing fitting belts on both sides are sealingly fitted with the groove walls of the fitting grooves. A plurality of support columns that are coaxially arranged with the rotating columns are fixed in the sealing fitting belt. A connecting plate that is sealed and fixedly connected to the sealing fitting belt through a cylinder is fixed at the bottom of the supporting plate. The connecting plate is sealed and fixedly connected to a connecting cylinder that is axially connected to the gear through a rotating seal. The connecting cylinder is connected to the low-temperature chamber through the gear. One of the side plates is connected to the closing cover through a connecting cylinder and a pipeline.

[0019] Furthermore, the bonding assembly includes a lifting plate fixed to the pick-and-place box and the test box through a pneumatic telescopic rod, a contact sliding plate slidably connected to the lifting plate, and an overflow valve fixed on the contact sliding plate. The contact sliding plate is provided with a circular groove for the rotating base to be plugged in and sealed, and the circular groove is provided with an exhaust hole connected to the overflow valve.

[0020] Furthermore, the transfer module includes a storage and access cylinder fixed in the pick-and-place box, a robotic arm fixed on the storage and access cylinder, and a vacuum suction cup fixed on the robotic arm.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. The present invention realizes the adsorption and fixation of wafers through a vacuum adsorption plate, and realizes the detection of wafers through a probe detection plate. During the transfer process of the carrier module, the wafers are pre-cooled to avoid sudden temperature drops that may cause problems with the wafers. Subsequently, the compressor and the low-temperature test cabinet are used to enable the wafers to be tested at a set temperature.

[0023] 2. The present invention realizes pre-cooling of the wafer through the pre-cooling module and closes the top of the rotating base through the bonding component to ensure the stability of the wafer pre-cooling.

[0024] In summary, the present invention has the advantage of being convenient for low temperature testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 For the present invention Figure 1 Schematic diagram of the internal structure;

[0027] Figure 3 For the present invention Figure 2 A schematic structural diagram of a transfer module;

[0028] Figure 4 For the present invention Figure 2 A schematic diagram of the structure of the displacement connection module;

[0029] Figure 5 For the present invention Figure 1 Schematic diagram of the structure of the low temperature test cabinet part;

[0030] Figure 6 For the present invention Figure 2 A schematic structural diagram of a bearing module;

[0031] Figure 7 For the present invention Figure 6 A schematic diagram of the enlarged structure of part A;

[0032] Figure 8 For the present invention Figure 2 Schematic diagram of the structure of the bonding component.

[0033] In the figure, 1. pick-and-place box; 2. test box; 21. infrared detection module; 3. carrying module; 31. carrying plate; 32. connecting plate; 33. connecting pipe; 34. gear; 35. electric telescopic rod; 36. slider; 37. extraction cylinder; 371. room temperature chamber; 372. low temperature chamber; 373. one-way exhaust disk; 38. connecting channel; 39. supporting protrusion; 30. reciprocating screw; 301. rotating base; 302. clamping plate; 303. placement tank; 304. mixing barrel; 4. low temperature test cabinet; 41. flow chamber; 42. lifting cylinder; 43. intake one-way valve ; 44. Vacuum adsorption plate; 45. Probe detection plate; 46. Plug interface; 47. Closing cover; 48. Displacement assembly; 5. Storage box door; 6. Compressor: 7. Connecting cylinder; 8. Rotation drive module; 9. Lifting plate; 91. Overflow valve; 92. Contact sliding plate; 10. Access cylinder; 101. Robotic arm; 102. Vacuum suction cup; 11. Linear module; 12. Rack; 13. Contact line; 14. Displacement slide rail; 15. Displacement connecting module; 151. Side panel; 152. Rotating column; 153. Sealing bonding tape; 154. Bonding groove; 155. Support column. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] like Figures 1 to 8As shown, a wafer low-temperature testing equipment includes a pick-and-place box 1, a test box 2 connected to the pick-and-place box 1, and a storage box door 5 provided on the pick-and-place box 1. The top of the test box 2 is fixedly connected to a low-temperature test cabinet 4. A probe detection board 45 for testing wafers is fixed inside the low-temperature test cabinet 4. A closing cover 47 sealed and fixed inside the test box 2 is provided below the probe detection board 45. A plug interface 46 is provided at the bottom of the closing cover 47. The closing cover 47 is also fixedly connected to an air intake one-way valve 43. A vacuum adsorption plate 44 capable of multi-directional displacement is provided inside the closing cover 47. The vacuum adsorption plate 44 is annular and is connected to a vacuum adsorption device so that the vacuum adsorption plate 44 can adsorb wafers. The vacuum adsorption plate 44 can move downward to fit the closing cover 47 and close the plug interface 46.

[0036] The closing cover 47 is connected to a carrying module 3 that can be moved from the pick-up box 1 to the test box 2. The carrying module 3 can be moved upward and sealed to be inserted into the insertion port 46. The carrying module 3 pre-cools the wafer when it moves.

[0037] A transfer module is also provided inside the pick-and-place box 1 , and the low-temperature test cabinet 4 is connected to a compressor 6 .

[0038] When in use, the personnel opens the storage box door 5 and places the wafers in the storage box through the wafer boat box. At this time, the compressor 6 is turned on. The compressor 6 reduces the coolant (electronic fluorine liquid) to the set temperature and transmits it to the low-temperature test cabinet 4, so that the low-temperature test cabinet 4 is reduced to the set temperature. Then the transfer module takes out the wafers in the wafer boat box and transfers them to the carrier module 3. The carrier module 3 drives the wafer to move. During the displacement process, the air in the low-temperature test cabinet 4 enters the carrier module 3 and mixes with the air in the test box 2 to form pre-cooled air and pre-cool the wafers. When the wafers are moved When it moves to the bottom of the plug-in port 46, the carrier module 3 moves up and is inserted into the plug-in port 46, so that the plug-in port 46 is closed. Then the vacuum adsorption plate 44 adsorbs the wafer and moves up and down, left and right, and front and back, so that the probe detection plate 45 can detect the wafer. When the wafer detection is completed, the vacuum adsorption plate 44 no longer adsorbs the wafer, so that the wafer falls on the carrier module 3, the carrier module 3 is separated from the plug-in port 46, and the wafer is transferred and reset. The transfer module adsorbs the detected wafer and puts it into the wafer boat box, and puts another wafer into the carrier module 3. The test can be repeated in this way.

[0039] After the carrier module 3 is separated from the plug-in port 46 , the vacuum adsorption plate 44 moves downward to fit the inner wall of the closing cover 47 , so that the closing cover 47 is closed.

[0040] It should be noted that a temperature sensor for detecting temperature values may be provided in the low-temperature test cabinet 4 to monitor the test temperature in real time so that the cavity temperature is stabilized at ±0.5°C of the desired temperature;

[0041] Preferably, the wafers are no longer pre-cooled when the carrying module 3 moves from the test box 2 to the storage box, so as to reduce the operating frequency of the compressor 6 .

[0042] In this embodiment, the side walls of the low-temperature test cabinet 4 are each provided with a flow cavity 41 , and the flow cavity 41 is connected to the compressor 6 ;

[0043] When in use, the compressor 6 injects the coolant into the flow cavity 41 and the coolant flows back from the flow cavity 41 into the compressor 6 , thereby ensuring a low temperature environment.

[0044] In this embodiment, a plurality of lifting cylinders 42 fixed to the test box 2 are provided inside the closing cover 47. The plurality of lifting cylinders 42 are connected to a displacement assembly 48 for driving the vacuum adsorption plate 44 to move horizontally. The displacement assembly 48 includes two groups of linear modules 11. Each group of linear modules 11 has two and the displacement directions of the two groups of linear modules 11 are front-to-back and left-to-right. One group of linear modules 11 is connected to the lifting cylinder 42 and the other group of linear modules 11 respectively.

[0045] When in use, the two sets of linear modules 11 and the plurality of lifting cylinders 42 are used to achieve multi-directional displacement of the vacuum adsorption plate 44 , thereby ensuring the testing of the wafer.

[0046] In this embodiment, the carrying module 3 includes a carrying plate 31 that is displaced from the pick-up and placement box 1 to the test box 2 through the linear module 11, a rotating base 301 rotatably connected to the carrying plate 31, a rotating drive module 8 for driving the rotating base 301 to adjust the angle, a pre-cooling module located inside the rotating base 301, a displacement connecting module 15 connected to the closing cover 47 and the pre-cooling module, and a fitting component that can be raised and lowered. The pre-cooling module gradually mixes the air in the closing cover 47 and the test box 2 with the displacement of the carrying plate 31 and blows it onto the wafer. The carrying plate 31 is fixed to the linear module 11 by a telescopic rod. The rotating drive module 8 adopts the patent publication number CN218647890U, and the patent name is: A rotating drive module 8 in a chip taping machine carrying platform mechanism. Other mechanisms that can drive the rotating base 301 to be precisely adjusted can also be used.

[0047] During use, the rotating base 301 is driven to rotate the inclination angle by the rotary drive module 8 according to the angle that the wafer needs to be adjusted. After the adjustment is completed, the linear module 11 drives the carrier plate 31 to move. During the displacement of the carrier plate 31, the pre-cooling module is connected to the closing cover 47 through the displacement connecting module 15, so that the cold air in the closing cover 47 enters the pre-cooling module and mixes with the air in the test chamber 2. During the movement of the carrier plate 31, the bonding component moves downward with the movement position of the carrier plate 31 and is bonded to the top of the rotating base 301, so that the top of the rotating base 301 is closed. After that, the mixed air enters the rotating base 301, thereby achieving pre-cooling of the wafer;

[0048] When the rotating base 301 is about to reach the test position, the base 301 is gradually moved upward and reset, so that the rotating base 301 can be moved upward and inserted into the insertion port 46. When the wafer test is completed, the rotating base 301 is reset and then reset under the action of the linear module 11.

[0049] The positioning of the rotating base 301 and the carrying plate 31 is achieved by two sets of infrared detection modules 21 set in the test box 2 to ensure accurate position detection;

[0050] The adjustment of the wafer angle needs to be confirmed according to the position of the wafer notch, and the detection of the wafer notch position is achieved by taking a picture with an imaging device and then performing a visual scan, and then confirming the adjusted angle based on the notch position obtained by the scan.

[0051] In this embodiment, the pre-cooling module includes an extraction cylinder 37 rotatably connected to the interior of the rotating base 301, a gear 34 fixed to the bottom of the extraction cylinder 37, an electric telescopic rod 35 rotatably connected to the gear 34, a slider 36 fixed to the bottom of the electric telescopic rod 35, and a mixing barrel 304 fixedly connected to the top of the extraction cylinder 37 and rotatably connected to the rotating base 301. The extraction cylinder 37 is provided with an extraction assembly connected to the rotating base 301. The mixing barrel 304 is used to purge mixed cold air toward the wafers.

[0052] The extraction cylinder 37 is rotatably sealed and connected to a communication channel 38 provided on the rotating base 301. The communication channel 38 is connected to the bottom of the rotating base 301 and is connected to the extraction cylinder 37 in a one-way manner.

[0053] The gear 34 is meshed with the rack 12, and the gear 34 rotates and seals to connect to the displacement communication module 15. An axial hole is opened in the gear 34 along the axial direction, and the axial hole is connected to the displacement communication module 15. The axial hole is connected to the extraction cylinder 37 in one direction through a one-way valve.

[0054] The bottom of the slider 36 is slidably connected to a displacement rail 14, and a busbar 13 is provided on one side of the displacement rail 14. The busbar 13, the displacement rail 14 and the rack 12 are all fixed in the test box 2 and the pick-and-place box 1 and are arranged along the displacement direction of the carrying plate 31;

[0055] The busbar 13 is connected to the electric telescopic rod 35 via an electric wire;

[0056] During use, as the carrier plate 31 moves, the gear 34 gradually rotates under the action of the rack 12, and drives the extraction cylinder 37 to rotate. The rotation of the extraction cylinder 37 drives the extraction component to work and extract the air in the displacement communication module 15 and the communication channel 38 respectively, and discharge the extracted air into the mixing barrel 304. The mixing barrel 304 mixes the air and then purges the wafers;

[0057] When the rotating base 301 needs to be moved upward, it can be driven upward by the electric telescopic rod 35;

[0058] Preferably, the gear 34 is rotatably connected to the extraction cylinder 37 via a ratchet pawl, and the corresponding shaft hole is connected to the extraction cylinder 37 via a rotating seal, so that when the carrier plate 31 is reset, the gear 34 does not drive the extraction cylinder 37 to rotate;

[0059] The mixing barrel 304 is provided with a plurality of plates for mixing air.

[0060] In this embodiment, the extraction assembly includes a reciprocating screw 30 rotatably connected to the axis of the extraction cylinder 37, a one-way exhaust disk 373 connected to the reciprocating screw 30, and a polygonal sealing cylinder fixed to the one-way exhaust disk 373 and the inner bottom of the extraction cylinder 37. The two polygonal sealing cylinders fit together and seal to divide the space below the one-way exhaust disk 373 of the extraction cylinder 37 into a low-temperature chamber 372 and a room-temperature chamber 371. The displacement communication module 15 is connected to the low-temperature chamber 372 via a gear 34, and the communication channel 38 is connected to the room-temperature chamber 371. The top of the reciprocating screw 30 is fixed to the rotating base 301.

[0061] During use, the extraction cylinder 37 rotates and drives the one-way exhaust disk 373 to rotate through the polygonal sealing cylinder. Under the action of the reciprocating screw 30, the one-way exhaust disk 373 moves up and down and extracts the air in the displacement connecting module 15 and the connecting channel 38 and transports it to the mixing barrel 304.

[0062] In this embodiment, a placement groove 303 is provided on the top of the rotating base 301, and a plurality of supporting protrusions 39 are provided in the placement groove 303. A clamping plate 302 for clamping the wafer is also provided in the placement groove 303. The placement groove 303 is connected to the mixing barrel 304 through a connecting hole, and the reciprocating screw 30 is fixed in the connecting hole through a plurality of rods.

[0063] When in use, the wafer is placed in the placement groove 303. Under the action of the support protrusion 39, the wafer does not contact the bottom of the placement groove 303, so as to ensure that the air in the mixing barrel 304 can normally enter the placement groove 303. Then, the wafer can be clamped and positioned by the clamping plate 302.

[0064] The displacement of the clamping plate 302 can be driven by a structure capable of achieving displacement, such as an electric telescopic rod 35 and a cylinder in the prior art.

[0065] In this embodiment, the displacement communication module 15 includes two side plates 151, rotating columns 152 at both ends of the two side plates 151, and a sealing fitting belt 153 sealed on the two rotating columns 152. One of the side plates 151 is fixed in the test box 2 and the pick-and-place box 1. Fitting grooves 154 are provided on the opposite sides of the two side plates 151. The sealing fitting belt 153 seals and fits the groove walls of the fitting grooves 154 on both sides. A plurality of support columns 155 coaxially arranged with the rotating columns 152 are fixed in the sealing fitting belt 153. A connecting plate 32 is fixed to the bottom of the supporting plate 31, which is sealed and fixedly connected to the sealing fitting belt 153 through a cylinder. The connecting plate 32 is sealed and fixedly connected to a connecting pipe 33 with an axial hole of a rotating sealing connecting gear 34. The connecting pipe 33 is connected to the low-temperature chamber 372 through the gear 34. One of the side plates 151 is connected to the closing cover 47 through the connecting cylinder 7 and the pipeline.

[0066] During use, the sealing tape 153, the rotating column 152, and the two side plates 151 form a chamber, preventing air from leaking out of the closure cover 47. The connecting plate 32 moves along with the supporting plate 31, driving the sealing tape 153 to move, thereby ensuring communication between the low-temperature chamber 372 and the closure cover 47.

[0067] The support column 155 ensures that the sealing tape 153 is always located in the bonding groove 154 , thereby preventing the sealing tape 153 from being separated from the bonding groove 154 when the sealing tape 153 is displaced.

[0068] In this embodiment, the laminating assembly includes a lifting plate 9 fixed to the pick-and-place box 1 and the test box 2 via a pneumatic telescopic rod, a contact sliding plate 92 slidably connected to the lifting plate 9, and a relief valve 91 fixed to the contact sliding plate 92. The contact sliding plate 92 has a circular groove for the rotary base 301 to be inserted and sealed, and the circular groove has an exhaust hole connected to the relief valve 91.

[0069] During use, the lifting plate 9 moves downward so that the circular groove is inserted into the rotating base 301. When the air in the mixing barrel 304 enters the placement groove 303, the excess air is discharged through the exhaust hole and the overflow valve 91, so that the temperature in the circular groove and the placement groove 303 gradually decreases, thereby ensuring pre-cooling.

[0070] In this embodiment, the transfer module includes a storage and access cylinder 10 fixed in the pick-and-place box 1, a robotic arm 101 fixed on the storage and access cylinder 10, and a vacuum suction cup 102 fixed on the robotic arm 101. The vacuum suction cup 102 controls air extraction through a vacuum suction device. When in use, the storage cylinder drives the robotic arm 101 to move up and down, and the robotic arm 101 drives the vacuum suction cup 102 to be located above the wafer and absorb the wafer. The wafer is then transferred to the placement slot 303 by the robotic arm 101.

[0071] It should be noted that if the rotation angle of the robot arm 101 is limited, additional equipment or structures such as a rotating motor can be added to ensure the storage of the wafers.

[0072] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer low-temperature testing device, comprising a pick-and-place box, a test box connected to the pick-and-place box, and a storage box door provided on the pick-and-place box, characterized in that: The top of the test box is fixedly connected to a low-temperature test cabinet, and a probe detection board for testing wafers is provided inside the low-temperature test cabinet. A closing cover located inside the test box is provided below the probe detection board. A plug interface is provided at the bottom of the closing cover, and the closing cover is also connected to an air intake one-way valve. A vacuum adsorption plate capable of multi-directional displacement is provided inside the closing cover, and the vacuum adsorption plate can be moved downward to fit the closing cover and seal the plug interface. The closure cover is connected to a carrying module that can be moved from the pick-up box to the test box, the carrying module can be moved upward and sealed to be inserted into the plug interface, and the carrying module pre-cools the wafer when it moves; A transfer module is also provided inside the pick-and-place box, and the low-temperature test cabinet is connected to a compressor.

2. The wafer low temperature testing equipment according to claim 1, characterized in that: The side walls of the low-temperature test cabinet are each provided with a flow cavity, and the flow cavity is connected to a compressor.

3. The wafer low temperature testing equipment according to claim 2, characterized in that: A plurality of lifting cylinders fixed on the test box are arranged inside the closing cover, and the plurality of lifting cylinders are connected with displacement components for driving the vacuum adsorption plate to move in the horizontal direction.

4. The wafer low temperature testing equipment according to claim 3, characterized in that: The carrying module includes a carrying plate that can be moved from a pick-up and place box to a test box, a rotating base rotatably connected to the carrying plate, a rotating drive module for driving the rotating base to adjust the angle, a pre-cooling module located inside the rotating base, a displacement connecting module connected to the closing cover and the pre-cooling module, and a fitting component that can be adjusted up and down. The pre-cooling module gradually mixes the air in the closing cover and the test box as the carrying plate moves and blows it onto the wafer. The carrying plate can be moved up and down.

5. The wafer low temperature testing equipment according to claim 4, characterized in that: The pre-cooling module includes an extraction cylinder rotatably connected to the interior of a rotating base, a gear fixed to the bottom of the extraction cylinder, an electric telescopic rod rotatably connected to the gear, a slider fixed to the bottom of the electric telescopic rod, and a mixing barrel fixedly connected to the top of the extraction cylinder and rotatably connected to the rotating base. An extraction assembly connected to the rotating base is provided inside the extraction cylinder. The mixing barrel is used to purge mixed cold air toward the wafers. The extraction cylinder is rotatably sealed and connected to a communication channel provided on the rotating base, the communication channel is connected to the bottom of the rotating base, and the communication channel is unidirectionally connected to the extraction cylinder; The gear is meshed with a rack, the gear is rotationally sealed and connected to the displacement communication module, and the gear is unidirectionally connected to the extraction cylinder; The bottom of the slider is slidably connected to a displacement slide rail, and a busbar is provided on one side of the displacement slide rail. The busbar, displacement slide rail and rack are all fixed in the test box and the pick-and-place box and are arranged along the displacement direction of the load-bearing plate; The conductor line is connected to the electric telescopic rod through an electric wire.

6. The wafer low temperature testing equipment according to claim 5, characterized in that: The extraction assembly includes a reciprocating screw rotatably connected to the axis of the extraction cylinder, a one-way exhaust disk connected to the reciprocating screw, and a polygonal sealing cylinder fixed to the one-way exhaust disk and the bottom of the inner side of the extraction cylinder respectively. The two polygonal sealing cylinders fit together and seal to divide the space of the extraction cylinder below the one-way exhaust disk into a low-temperature chamber and a room-temperature chamber. The displacement connecting module is connected to the low-temperature chamber through a gear, and the connecting channel is connected to the room-temperature chamber. The top of the reciprocating screw is fixed on the rotating base.

7. The wafer low temperature testing equipment according to claim 6, characterized in that: A placement groove is provided on the top of the rotating base, a plurality of supporting protrusions are provided in the placement groove, and a clamping plate for clamping the wafer is also provided in the placement groove.

8. The wafer low temperature testing equipment according to claim 7, characterized in that: The displacement communication module includes two side plates, rotating columns at both ends of the two side plates that are rotatably sealed and connected, and a sealing fitting belt provided on the two rotating columns. One of the side plates is fixed in the test box and the pick-and-place box, and fitting grooves are provided on the opposite sides of the two side plates. The sealing fitting belts on both sides are sealingly fitted with the groove walls of the fitting grooves. A plurality of support columns coaxially arranged with the rotating columns are fixed in the sealing fitting belt. A connecting plate that is sealed and fixedly connected to the sealing fitting belt through a cylinder is fixed at the bottom of the supporting plate. The connecting plate is sealed and fixedly connected to a connecting cylinder axially lower than the gear with a rotating seal. The connecting cylinder is connected to the low-temperature chamber through the gear, and one of the side plates is connected to the closing cover through a connecting cylinder and a pipeline.

9. The wafer low temperature testing equipment according to claim 8, characterized in that: The bonding assembly includes a lifting plate fixed to the pick-and-place box and the test box through a pneumatic telescopic rod, a contact sliding plate slidably connected to the lifting plate, and an overflow valve fixed on the contact sliding plate. The contact sliding plate is provided with a circular groove for the rotating base to be plugged in and sealed, and an exhaust hole connected to the overflow valve is provided in the circular groove.

10. The wafer low temperature testing equipment according to claim 1, characterized in that: The transfer module comprises a storage and access cylinder fixed in the pick-and-place box, a mechanical arm fixed on the storage and access cylinder, and a vacuum suction cup fixed on the mechanical arm.

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