Cartridge module and multi-wafer testing apparatus using same

Abstract

The present invention relates to a cartridge module in which a probe card and a wafer are modularized to maintain their own positions, and a multi-wafer test device capable of testing a plurality of wafers by performing a test using the cartridge module, the multi-wafer test device comprising: at least two chambers (120) connected to a tester (110) and provided with test heads (121) for electrically connecting the probe card and the tester; a cassette module (200) comprising a first main body part (210) provided with a probe card (211) and a second main body part (220) provided with a wafer chuck (221) on which the wafer (10) is placed and detachably assembled with the first main body part; a wafer loading part (130) for releasing the first main body part and the second main body part to perform a detachment operation of the first main body part and the second main body part, loading the wafer on the second main body part, and performing a clamping operation of the first main body part and the second main body part to perform assembly; and a transfer unit (150) that transfers and transfers the cassette module between the wafer loading unit and the chamber.

Description

Technical Field

[0001] The present invention relates to a box module that modularizes a probe card and a wafer so as to maintain their own positions, and a multi-wafer testing device that can test a plurality of wafers by performing a single test using the box module. Background Art

[0002] Semiconductor devices are typically formed by repeatedly applying a series of processing steps to a wafer. For example, a semiconductor device can be formed on a wafer by repeatedly performing the following steps: a vapor deposition step to form a film on the wafer; an etching step to form a pattern with electrical characteristics on the vapor-deposited wafer; an ion implantation step or diffusion step to inject or diffuse impurities into the pattern; and a washing and rinsing step to remove impurities from the wafer with the pattern formed.

[0003] The semiconductor device manufactured through this series of processes can undergo a wafer inspection process for inspecting electrical characteristics. This inspection process is performed using a probe station including a probe card having a plurality of probes and a tester connected to the probe card to provide an electrical signal.

[0004] A probe station typically includes an inspection chamber; a chuck disposed within the inspection chamber and supporting a wafer; a chuck transfer device that drives the chuck; a probe card having multiple probes configured to contact semiconductor elements formed on the wafer; and a tester connected to the probe card and performing testing.

[0005] In this existing technology, a chuck with a wafer placed thereon is transported to an inspection room by a chuck transfer device, and the positions of the contact electrodes on the wafer and the probes of the probe card are grasped using visual sensors such as CCD cameras. Based on the grasped position information, the chuck transfer device is controlled so that the contact electrodes of the wafer come into contact with the probes and are electrically connected.

[0006] Typically, this type of wafer testing is a single probe test that tests only one wafer at a time. The present invention has developed a box module that can effectively inspect multiple wafers and a multi-wafer testing device using the box module, which has broken away from the wafer inspection process of the existing single probe test and has applied for a patent.

[0007] Prior art literature

[0008] Patent Literature

[0009] Patent Document 1: Korean Patent Publication No. 10-2010-0130540 (Published on December 13, 2010) Summary of the Invention

[0010] The present invention provides a box module which can modularize a probe card and a wafer into one body for wafer inspection and can maintain the positions of the probe card and the wafer, and a multi-wafer testing device using the box module.

[0011] In order to achieve the above-mentioned purpose, the multi-wafer testing device according to an embodiment of the present invention includes: at least two chambers, which are connected to the tester and are provided with a test head that electrically connects the probe card and the above-mentioned tester; a box module, including a first main body part provided with a probe card and a second main body part provided with a wafer chuck for placing the wafer and detachably assembled with the above-mentioned first main body part; a wafer loading part, which loosens the above-mentioned first main body part and the above-mentioned second main body part and performs a disassembly operation of the above-mentioned first main body part and the above-mentioned second main body part, loads the wafer on the above-mentioned second main body part, and performs a clamping operation of the above-mentioned first main body part and the above-mentioned second main body part for assembly; and a transfer part, which transfers the above-mentioned box module between the above-mentioned wafer loading part and the above-mentioned chamber for delivery.

[0012] Preferably, the above-mentioned chamber includes: a guide rail for positioning the above-mentioned box module; a temperature regulating device arranged at the lower end of the box module placed on the above-mentioned guide rail and used for temperature regulation; a lifting unit for lifting and lowering the above-mentioned temperature regulating device; and a driving source supply part for supplying a driving source to the box module placed on the above-mentioned guide rail.

[0013] Preferably, it further comprises a box module stacking station capable of accommodating at least two of the above-mentioned box modules.

[0014] Preferably, the box module is provided with a magnet bracket on the second main body, and the magnet bracket corresponds to the guide hole formed through the first main body. The box module includes: a weight ring, provided with a magnet chuck which is inserted into the guide hole and can be fixed to the magnet bracket by magnetic force, thereby being assembled with the second main body at the upper part of the first main body; and a clamping part, provided between the first main body and the weight ring, fixing the distance between the first main body and the weight ring.

[0015] Then, the box module according to an embodiment of the present invention is a box module provided with a probe card for inspecting wafers and capable of modularizing the wafers and the probe card for transportation, including: a first main body, provided with a probe card, and formed with a guide hole formed vertically through; a second main body, provided with a wafer chuck for placing the wafer, and a magnet bracket is provided corresponding to the above-mentioned guide hole, and is detachably assembled with the above-mentioned first main body in a manner that the above-mentioned probe card is electrically connected to the above-mentioned wafer; a weight ring, provided with a magnet chuck that is inserted into the above-mentioned guide hole and can be fixed to the above-mentioned magnet bracket by magnetic force, thereby being assembled with the above-mentioned second main body on the upper part of the above-mentioned first main body; and a clamping member that clamps / loosens the above-mentioned first main body and the above-mentioned second main body, and fixes / disassembles the above-mentioned first main body and the above-mentioned second main body.

[0016] Preferably, the magnet chuck further comprises a friction pad provided between the contact surfaces with the magnet bracket.

[0017] Preferably, the clamping portion includes: a shaft having one end fixed to either the weight ring or the first main body; and a pneumatic drive portion fixed to the other of the weight ring and the first main body and fixed to the shaft via a pneumatic signal.

[0018] More preferably, the pneumatic drive unit is normally closed.

[0019] Preferably, the second main body includes a saddle body of a heat conductor connected to the wafer chuck, and the saddle body is divided by a heat insulating member and includes an inner saddle body directly in contact with the wafer chuck and an outer saddle body surrounding the inner saddle body.

[0020] More preferably, the inner saddle body further includes a plurality of heat conducting members formed vertically through the saddle body and having a higher heat conductivity than that of the saddle body.

[0021] Preferably, at least two of the magnetic chucks are provided at the lower portion of the weight ring. More preferably, at least two of the clamping parts are provided between the first main body and the weight ring.

[0022] More preferably, at least one of the clamping portions is provided between the magnet chucks adjacent to each other.

[0023] Preferably, the invention further comprises a guide member which is interposed between the first main body and the weight ring and is used to guide the assembly position of the first main body and the weight ring.

[0024] The multi-wafer testing device of the present invention includes: at least two chambers; a box module including a first main body 210 provided with a probe card and a second main body provided with a wafer chuck for placing wafers and detachably assembled with the first main body; a wafer loading part for loosening the first main body and the second main body to perform a disassembly operation of the first main body and the second main body, loading the wafer on the second main body, and performing a clamping operation of the first main body and the second main body to assemble; and a transfer part for transferring the box module between the wafer loading part and the chamber, so that multiple wafers can be tested in one test, which has the effect of maximizing the test efficiency.

[0025] In addition, the box module of the present invention is a box module that is provided with a probe card for inspecting wafers and can modularize the wafers and the probe card for transportation, including: a first main body, provided with a probe card, and formed with a guide hole formed vertically through; a second main body, provided with a wafer chuck for placing the wafer, and a magnet bracket is provided corresponding to the guide hole, and is detachably assembled with the first main body in a manner that electrically connects the probe card to the wafer; a weight ring, provided with a magnet chuck that is inserted into the guide hole and can be fixed to the magnet bracket by magnetic force, thereby being assembled with the second main body on the upper part of the first main body; and a clamping member that clamps / loosens the first main body and the second main body, and fixes / disassembles the first main body and the second main body, thereby modularizing the wafer and the probe card into one, thereby having the effect of maintaining the precise self-position of the probe card and the wafer during the transfer of the box module. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 FIG. 1 is a top view of the configuration of a multi-wafer testing device according to an embodiment of the present invention.

[0027] Figure 2 3D is a perspective view of a cartridge module according to an embodiment of the present invention.

[0028] Figure 3 1 is a perspective structural diagram showing a disassembled state of a cartridge module according to an embodiment of the present invention.

[0029] Figure 4 1 is an exploded perspective view of a cartridge module according to an embodiment of the present invention.

[0030] Figure 5 1 is a top view of a cartridge module according to an embodiment of the present invention.

[0031] Figure 6 (a) and (b) are respectively a front view and a side view of a box module according to an embodiment of the present invention.

[0032] Figure 7 yes Figure 2 The cross-sectional structure diagram of the AA line.

[0033] Figure 8 yes Figure 5 The cross-sectional structure diagram of the BB line.

[0034] Figure 9 (a) and (b) are a cross-sectional view showing another embodiment of the cartridge module according to the embodiment of the present invention and a cross-sectional view taken along line CC.

[0035] Figure 10 1 is a cross-sectional structural diagram showing another modified example of the second main body portion in the cartridge module according to the embodiment of the present invention.

[0036] Figure 11 FIG. 1 is a front view of a multi-chamber structure of a multi-wafer testing apparatus according to an embodiment of the present invention.

[0037] Figure 12 This is a front structural diagram showing an enlarged portion of a multi-chamber in a multi-wafer test apparatus according to an embodiment of the present invention.

[0038] Figure 13 FIG. 1 is a diagram showing the configuration of a cassette module stacking table in a multi-wafer testing apparatus according to an embodiment of the present invention. DETAILED DESCRIPTION

[0039] The specific structures and functional descriptions provided in the embodiments of the present invention are merely illustrative for the purpose of illustrating the embodiments of the present invention. The embodiments of the present invention can be implemented in various forms. Furthermore, the present invention is not limited to the embodiments described in this specification, and should be understood to include all modifications, equivalents, and alternatives within the spirit and technical scope of the present invention.

[0040] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0041] Figure 1 FIG. 1 is a top view of a multi-wafer test apparatus according to an embodiment of the present invention. Figure 2 1 is a perspective view of a box module according to an embodiment of the present invention. Figure 3 It is a perspective structural diagram showing a disassembled state of the cartridge module according to the embodiment of the present invention.

[0042] refer to Figures 1 to 3 The multi-wafer testing apparatus according to the embodiment of the present invention includes a tester 110 , a chamber 120 , a wafer loader 130 , an aligner 140 , a transfer device 150 , and a box module 200 .

[0043] The box module 200 includes a first main body 210 provided with a probe card 211, and a second main body 220 provided with a wafer chuck 221 and detachably assembled with the first main body 210. A clamping member is provided between the first main body 210 and the second main body 220. By clamping / relaxing the clamping member, the first main body 210 and the second main body 220 are clamped or released, thereby being fixed to or removed from each other. In this embodiment, the clamping member can be provided by a clamping mechanism that performs a clamping action through magnetic force and pneumatic signals. The first main body 210 and the second main body 220 of this box module 200 are structurally detachably assembled, and can maintain the precise self-position between the probe card and the wafer through the clamping member, so that multiple wafers can be inspected at one time. The specific embodiment of this box module is again described in the relevant figures.

[0044] The chamber 120 is a multi-chamber structure consisting of at least two chambers, providing a test space for wafers 10 and optionally housing supporting equipment for generating test temperature and other conditions. Each chamber 120 is equipped with a test head 121 electrically connected to the tester 110. This test head 121 interfaces with the probe card 211 of the cassette module 200 to test the wafers 10 loaded into the cassette module 200. The tester 110 generates test signals, which are then transmitted to the wafers 10 via the test head 121 and the probe card 211.

[0045] The wafer 10 to be inspected is accumulated in the wafer loading unit 130 , and the wafer 10 is loaded on the cassette module 200 . Specifically, the wafer 10 to be inspected is loaded on the second main body 220 separated from the cassette module 200 .

[0046] The alignment machine 140 positions the cassette module 200. First, the first and second main bodies 210, 220 of the cassette module 200 are unclamped, disassembled from each other, and the second main body 220 is transferred to the wafer loader 130. Within the second main body 220 transferred to the wafer loader 130, the wafer 10 to be inspected is loaded onto the wafer chuck 221. The second main body 220 loaded with the wafer 10 is then returned to the alignment machine 140. The second main body 220 returned to the alignment machine 140 is assembled with the first main body 210, with the wafer 10 placed thereon. The first and second main bodies 210, 220 are then assembled by a clamping operation using clamping members. The assembled cassette module 200 is then transferred to the chamber 120 by the transfer unit 150 for testing. While not shown, a loader may be further included to stack inspected wafers.

[0047] On the other hand, in this embodiment, the wafer loading process of the box module 200 is divided into the wafer loading part 130 and the aligner 140, but the two processes may not be separate processes, but a continuous process. In order to perform this process, it may include supporting equipment such as a well-known robot arm, an aligner, a visual inspection device or a conveying device for disassembling or assembling the first main body 210 and the second main body 220 of the box module 200.

[0048] Preferably, the box module 200 is provided with a practical supply unit for supplying a driving source (power / air) for clamping / unclamping drive, and the box module 200 placed in the wafer loading unit 130 and the alignment machine 140 receives the driving source from the outside through the practical supply unit, so that clamping / unclamping operations can be performed.

[0049] Preferably, a box module stacking station 160 that can accommodate multiple box modules 200 is also included. The box module stacking station 160 accommodates probe cards or box modules that need to be replaced, or accommodates redundant box modules such as new (repaired) probe cards or box modules for replacement.

[0050] Hereinafter, each of the above-mentioned configurations will be described in detail with reference to the relevant drawings.

[0051] Figure 4 1 is an exploded perspective view of a cartridge module according to an embodiment of the present invention. Figure 5 1 is a top view of a cartridge module according to an embodiment of the present invention. Figure 6 (a) and (b) are respectively a front view and a side view of the box module involved in the embodiment of the present invention. Figure 7 yes Figure 2 The cross-sectional structure diagram of the AA line.

[0052] refer to Figures 4 to 7 The box module 200 of this embodiment includes a first main body 210 , a second main body 220 , a weight ring 230 and a clamping portion 240 .

[0053] A probe card 211 is centrally mounted on the first body 210, and guide holes 212 are vertically formed around the periphery of the probe card 211. In this embodiment, the first body 210 is a roughly four-sided square member, with guide holes 212 positioned at each of the four corners of the first body 210. However, the shape of the first body and the number and location of the guide holes can be varied. Preferably, the first body 210 has at least two guide holes 212.

[0054] The first body 210 may be provided with a plurality of freely rotatable rollers 213 at both ends for conveying. The rollers 213 may be provided by cam followers having a low friction coefficient and excellent rotation performance, but are not limited thereto.

[0055] For the clamping / loosening action of the box module 200, the first main body 210 also includes a practical supply part 215 for receiving a driving source from the outside. In this embodiment, the practical supply part 215 shows a brush 215a for supplying power and an auto coupler 215a for supplying compressed air (clean dry air, CDA).

[0056] The second main body 220 is provided with a wafer chuck 221 for placing the wafer in the center, and a magnet bracket 222 is provided corresponding to the guide hole 212 of the first main body 210. The magnet bracket 222 can be provided by a known material (for example, a ferromagnetic body) that generates an attractive force through magnetic force with the magnet chuck 231 provided on the weight ring 230. In this embodiment, a case where four magnet brackets 222 are provided at positions corresponding to the guide holes 212 is shown. The wafer chuck 221 can be provided with an air fitting for vacuum adsorption of the wafer to fix it.

[0057] The weight ring 230 is a square ring with a magnet chuck 231 provided at the bottom. The magnet chuck 231 is provided in the same number as the magnet bracket 222 of the second body 220. The magnet chuck 231 can be provided by a permanent magnet or an electromagnet, preferably a permanent magnet.

[0058] Preferably, the magnet chuck 231 further includes a friction pad 233 that can provide friction between the contact surface with the magnet bracket 222. Figure 7 As shown, the magnet chuck 231 and the magnet holder 222 are fixed by magnetic force, and are strongly fixed in the vertical direction (z-axis direction). In contrast, the fixation in the horizontal direction (xy plane) is relatively weak. The friction pad 233 is compressed between the magnet chuck 231 and the magnet holder 222 to provide horizontal friction, thereby maintaining the precise position of the cartridge module 200 even under external horizontal forces during movement. The friction pad 233 can be provided by a material with a high friction coefficient, such as a silicone pad, but is not limited thereto.

[0059] Preferably, a plurality of guide pins 232 may be provided at the lower portion of the weight ring 230, and holes 214 may be formed on the upper surface of the first body portion 210 corresponding to the guide pins 232. Thus, during the assembly process of the weight ring 230 and the first body portion 210, the weight ring 230 and the first body portion 210 are aligned in their assembled positions as the guide pins 232 are inserted into the holes 214. Meanwhile, although the guide pins 232 are provided on the weight ring 230 in this embodiment, a plurality of guide pins may be provided on the first body portion, and a plurality of holes may be formed on the weight ring corresponding to the guide pins, thereby providing a guide member for guiding the assembly position of the first body portion 210 and the weight ring 230.

[0060] The clamping portion 240 is disposed between the first body portion 210 and the weight ring 230 to fix the distance between the first body portion 210 and the weight ring 230 . Preferably, a plurality of clamping portions 240 are disposed between the first body portion 210 and the weight ring 230 .

[0061] The clamping part 240 includes a shaft whose upper end is fixed to the lower part of the weight ring 230 and a pneumatic drive part fixed to the first body 210 and fixed by an external pneumatic signal. Reference numeral 243 is a pneumatic connector for supplying pneumatic pressure to the clamping part 240.

[0062] Figure 8 yes Figure 5 The cross-sectional structure diagram along the BB line shows the cross-sectional structure of the clamping portion. To facilitate understanding, only the first main body portion, the weight ring and the clamping portion are shown, and the sizes and proportions of the constituent elements are exaggerated.

[0063] refer to Figure 8 The clamping part 240 includes: a shaft 241 whose upper end is fixed by a weight ring 230 and a first bolt 244, and a pneumatic drive part 242 whose lower end is fixed by a first main body 210 and a second bolt 245 to fix the shaft 241. According to the pneumatic signal applied to the pneumatic drive part 242, the shaft 241 moves up and down in the pneumatic drive part 242 or is fixed in position (height).

[0064] Preferably, the pneumatic drive unit 242 is a clamping mechanism driven by a normally closed (NC) pneumatic signal. When pneumatic pressure is applied to the pneumatic drive unit 242, the shaft 241 can move up and down within the pneumatic drive unit 242. Conversely, if no pneumatic pressure is applied to the pneumatic drive unit 242, the shaft 241 is clamped and fixed by the pneumatic drive unit 242, thereby fixing the distance between the first body 210 and the weight ring 230.

[0065] The clamping portion 240 may be provided by a clamping mechanism of the RBPS series sold as a “clamping and braking element” by Zimmer, but is not limited thereto.

[0066] In the thus constructed cassette module 200, a wafer is placed on the wafer chuck 221, and the first body 210 and weight ring 230 are stacked on top of the second body 220 to be assembled. With the magnet chuck 231 and magnet holder 222 magnetically secured, the first body 210, second body 220, and weight ring 230 are fixed to each other. Meanwhile, during the assembly process of the first body 210, second body 220, and weight ring 230, pneumatic pressure is applied to the clamping portion 240, thereby allowing the shaft 241 to move up and down on the pneumatic drive portion 242. Then, when the pneumatic pressure applied to the clamping portion 240 is finally interrupted, the gap between the first body 210 and weight ring 230 is fixed by the clamping portion 240, thereby fixing the position of the wafer and probe card.

[0067] As described above, the probe card and the wafer may be transported by precisely maintaining their positions through the cassette module 200 and transferred to a chamber for inspection.

[0068] exist Figure 5 In the figure, arrows indicate the distances H1-H4 at various locations between the first main body 210 and the weight ring 230, which are secured by the four clamping parts. The distances H1-H4 at various locations are exaggerated to facilitate understanding. This demonstrates that the present invention, employing a magnetic chuck and a clamping part utilizing a pneumatic signal, can maintain its position within a precision range of less than 10 μm, not only in a horizontal state but also when inclined.

[0069] On the other hand, in the embodiment of the present invention, a probe card holder using four magnetic chucks and four clamping parts is exemplified, but the arrangement and number of the magnetic chucks and clamping parts can be changed according to the size of the wafer.

[0070] Figure 9 (a) and (b) are cross-sectional views and CC line cross-sectional views showing another embodiment of the box module of the present invention. Repetitive descriptions of the same structures as the previous embodiments are omitted, and the description focuses on the differences.

[0071] refer to Figure 9(a) and (b) of FIG. 1 . In this embodiment, the second main body 320 includes a wafer chuck 321 on which the wafer 10 is placed, and saddles 322 and 323 that are in contact with the wafer chuck 321 and transfer heat generated from the temperature control device 400. Preferably, the saddles 322 and 323 include an inner saddle 322 and an outer saddle 323 separated by a heat insulating member 324. The saddles 322 and 323 are provided by a heat conductor such as aluminum (Al), which transfers heat generated from the temperature control device 400 to the wafer chuck 321. In particular, by separating the area directly in contact with the wafer chuck 321 with the heat insulating member 324 and conducting heat through the inner saddle 322, the temperature control of the wafer can be performed more quickly.

[0072] Preferably, the inner saddle body 322 further includes a plurality of heat conducting members 322a that penetrate vertically, and the heat conducting members 322a may be made of a material having a higher thermal conductivity than the saddle body 322. For example, such heat conducting members may be silver (Ag), copper (Cu), or an alloy.

[0073] As described above, in this embodiment, second body 320 is provided with inner saddle 322, which is directly connected to wafer chuck 321, by separating saddles 322 and 323 with thermal insulation member 324. Furthermore, inner saddle 322 is provided with multiple heat-conducting members 322a extending therethrough. This allows for more rapid transfer of conductive heat for controlling the temperature of wafer 10 compared to saddles made of a single material. Furthermore, this configuration allows for rapid heat dissipation through outer saddle 323, preventing heat from concentrating on wafer 10 and maintaining a uniform temperature distribution across wafer 10.

[0074] Figure 10 1 is a cross-sectional structural diagram showing another modified example of the second main body portion in the cartridge module according to the embodiment of the present invention.

[0075] The second main body 420 of this embodiment includes a wafer chuck 421 on which the wafer 10 is placed, and saddles 422 and 423 that are connected to the wafer chuck 421 and transfer heat generated from the temperature adjustment device 400 .

[0076] In particular, the saddle bodies 422 and 423 include an inner saddle body 422 and an outer saddle body 423 separated by a heat insulating member 424. The inner saddle body 422 directly connected to the wafer chuck 421 includes a plurality of heat conduction members 422a that pass through vertically. Such heat conduction members 322a use a material with a higher thermal conductivity than the saddle body 322, so that as described above, the temperature of the wafer can be quickly controlled and a uniform temperature distribution can be maintained.

[0077] Figure 11 1 is a front view of a multi-chamber structure of a multi-wafer testing device according to an embodiment of the present invention. Figure 12This is a front structural diagram showing an enlarged portion of a multi-chamber in a multi-wafer test apparatus according to an embodiment of the present invention.

[0078] refer to Figure 11 The chamber 120 of this embodiment is provided by a multi-chamber composed of at least two chambers. The box module 200 can be placed in the chamber 120 through the transfer part and automatically connected to the tester. The practical supply part of the box module 200 can be connected to the driving source supply part provided in the chamber to supply power and air.

[0079] Figure 12 The chamber 120 is shown with the cassette module 200 positioned within it. The rollers 213 of the cassette module 200 are positioned along the guide rails 122. A temperature control device consisting of a heating block 123 and a cooling block 124 is provided at the lower end of the second main body 220. The heating block 123 and the cooling block 124 heat or cool the wafer to a target temperature. Reference numeral 124a denotes a cooling manifold for supplying refrigerant for cooling, and reference numeral 126 denotes an air manifold (CDA manifold) for supplying compressed air to the cassette module 200. A lifting unit 216 for height adjustment can be provided at the lower end of the cooling block 124. The cassette module 200 is placed within the chamber, and the heating / cooling blocks 123 and 124 are in contact with the second main body 220 via the lifting unit 216. Temperature control of the wafer to be inspected is performed by conduction.

[0080] Figure 13 FIG. 1 is a diagram showing the configuration of a cassette module stacking table in a multi-wafer testing apparatus according to an embodiment of the present invention.

[0081] refer to Figure 13 , the box module stacking station 160 can accommodate at least two box modules 200 and can be configured to be adjacent to the chamber.

[0082] The cassette module stacking station 160 accommodates probe cards or cassette modules that need to be replaced, so as to be replaced with new (repaired) probe cards or cassette modules.

[0083] For example, a probe card or cassette module 200A having a fault is transferred by the transfer unit 150 to the cassette module stacking station 160 to be transported to the outside for repair. A probe card or cassette module 200B that has been repaired outside is stored in the cassette module stacking station 160 by the transfer vehicle 170 .

[0084] This box module stacking table 160 can store normal probe cards and box modules that can be used when replacement is needed. The figure mark "200C" shows a normal box module, and the figure mark "200D" shows an assembly of a first main body 210 and a second main body 230 provided with a probe card in addition to a second main body 220 provided with a wafer chuck in a normal box module.

[0085] The present invention described above is not limited to the above embodiments and drawings, and it is obvious to those skilled in the art that various substitutions, modifications, and changes can be made without departing from the technical concept of the present invention.

[0086] Description of Reference Numerals

[0087] 110: Tester 120: Room

[0088] 130: Wafer loading unit 140: Alignment machine

[0089] 150: Transfer unit 160: Cartridge module stacking station

[0090] 200: Box module 210: First main body

[0091] 211: Probe card 112: Guide hole

[0092] 220, 320, 420: Second main body

[0093] 221: Wafer chuck 222: Magnetic support

[0094] 230: Weight ring 240: Clamping part

[0095] 231: Magnetic chuck 232: Friction pad.

Claims

1. A multi-wafer testing device, in, include: at least two chambers connected to a tester and provided with a test head for electrically connecting a probe card to the tester; The box module includes a first main body and a second main body, wherein the first main body is provided with a probe card, and the second main body is provided with a wafer chuck for placing a wafer and is detachably assembled with the first main body; a wafer loading unit for disassembling the first and second main bodies by releasing the first and second main bodies, loading a wafer on the second main body, and assembling the first and second main bodies by clamping the first and second main bodies; and The transfer unit transfers and delivers the cassette module between the wafer loading unit and the chamber.

2. The multi-wafer testing device according to claim 1, wherein: The chamber comprises: A guide rail for positioning the box module; a temperature regulating device, provided at the lower end of the box module placed on the guide rail, for regulating temperature; a lifting unit, configured to lift and lower the temperature regulating device; and The driving source supply unit is used to supply the driving source to the cartridge module placed on the guide rail.

3. The multi-wafer testing apparatus according to claim 1, wherein: Also included is a box module stacking station capable of accommodating at least two of the box modules.

4. The multi-wafer testing apparatus according to claim 1, wherein: The box module is provided with a magnet bracket on the second main body, and the magnet bracket corresponds to the guide hole formed through the first main body. The box module includes: a weight ring provided with a magnet chuck inserted into the guide hole and fixed to the magnet holder by magnetic force, thereby being assembled with the second main body on the upper part of the first main body; and The clamping portion is provided between the first main body portion and the weight ring, and fixes the distance between the first main body portion and the weight ring.

5. The multi-wafer testing device according to claim 4, wherein: The magnet chuck further includes a friction pad disposed between a contact surface with the magnet bracket.

6. The multi-wafer testing device according to claim 4, wherein: At least two magnetic chucks are provided at the lower part of the weight ring.

7. The multi-wafer testing device according to claim 6, wherein: At least two clamping parts are provided between the first main body and the weight ring.

8. The multi-wafer testing device according to claim 7, wherein: At least one of the clamping parts is provided between the magnet chucks adjacent to each other.

9. The multi-wafer testing apparatus according to claim 4, wherein: The clamping portion comprises: a shaft having one end fixed to either the weight ring or the first main body; and The pneumatic driving unit is fixed to the other of the weight ring and the first main body, and is fixed to the shaft through a pneumatic signal.

10. The multi-wafer testing device according to claim 9, wherein: The pneumatic drive unit is normally closed.

11. The multi-wafer testing apparatus according to claim 4, wherein: A guide member is further included. The guide member is interposed between the first body portion and the weight ring and is used to guide an assembly position of the first body portion and the weight ring.

12. A box module provided with a probe card for inspecting a wafer, capable of transporting the wafer and the probe card in a modular manner. in, include: The first main body is provided with a probe card and is formed with a guide hole formed vertically through it; The second main body is provided with a wafer chuck for placing the wafer, is provided with a magnet bracket corresponding to the guide hole, and is detachably assembled with the first main body in a manner that the probe card is electrically connected to the wafer; a weight ring provided with a magnet chuck inserted into the guide hole and fixed to the magnet holder by magnetic force, thereby being assembled with the second main body on the upper part of the first main body; and The clamping member clamps / unclamps the first main body portion and the second main body portion, thereby fixing / detaching the first main body portion and the second main body portion.

13. The cartridge module according to claim 12, wherein: The magnet chuck further includes a friction pad disposed between a contact surface with the magnet bracket.

14. The cartridge module according to claim 12, wherein: The clamping portion comprises: a shaft having one end fixed to either the weight ring or the first main body; and The pneumatic driving unit is fixed to the other of the weight ring and the first main body, and is fixed to the shaft through a pneumatic signal.

15. The cartridge module according to claim 14, wherein: The pneumatic drive unit is normally closed.

16. The cartridge module according to claim 12, wherein: The second main body includes a saddle body of a heat conductor connected to the wafer chuck, The saddle body is divided by a heat insulating member and includes an inner saddle body directly contacting the wafer chuck and an outer saddle body surrounding the inner saddle body.

17. The cartridge module according to claim 16, wherein: The inner saddle body includes a plurality of heat-conducting members formed vertically therethrough and having a heat conductivity greater than that of the saddle body.

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