Probe performance test method

Abstract

The application discloses a kind of probe performance test methods, it is related to semiconductor test technical field, discloses probe performance test method, including: the horn joint of probe card test motherboard is connected with testing machine, to conduct the resource of testing machine to horn joint, then open the cover of probe card test motherboard, the probe card to be measured is placed on the probe card fixing plate of probe card test motherboard, and the cover is pressed to the probe card fixing plate, so that the conductive connecting piece of cover and probe electrical connection;Finally, the performance test of probe on probe card is carried out by probe testing device.The embodiment can realize the quick connection between probe and testing machine, so that probe test can be smoothly, efficiently carried out, greatly improve the probe performance test efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor testing, and in particular to a probe performance testing method. BACKGROUND

[0002] In the electronic core industry, a probe card is a core consumable in the wafer testing link, and mainly functions to realize electrical connection between chips on a wafer and a tester, to transmit test signals of the tester to the chips, and to transmit response signals of the chips back to the tester, so as to complete electrical performance and function testing of the chips.

[0003] In a related technical solution, when the probe card is connected with the tester, each pin on the probe card is connected to an interface socket or a terminal row of the tester by using a cable, which is low in connection efficiency and prone to errors, and thus the probe testing cannot be efficiently performed. SUMMARY

[0004] The present application provides a probe performance testing method, which can realize fast and stable connection between a probe and a tester, so that the probe testing can be smoothly and efficiently performed.

[0005] To achieve the above object, the present application provides a probe performance testing method, comprising:

[0006] connecting a horn joint of a probe card test motherboard with a tester;

[0007] opening a cover plate of the probe card test motherboard, and placing a probe card to be tested on a probe card fixing plate of the probe card test motherboard, wherein the probe card fixing plate is rotatably connected with the cover plate;

[0008] pressing the cover plate to the probe card fixing plate, so that a conductive connecting piece of the cover plate is electrically connected with the probe card;

[0009] performing performance testing on probes on the probe card by a probe testing device.

[0010] In an embodiment, the opening of the cover plate of the probe card test motherboard comprises:

[0011] if a locking device of the probe card test motherboard is in an unlocked state, the cover plate is opened, and the locking device is used to lock the cover plate and the probe card fixing plate.

[0012] In an embodiment, the method further comprises:

[0013] if the locking device is in a locked state, the locking device is unlocked, and the cover plate is opened.

[0014] In an embodiment, the method further comprises, before placing the probe card to be tested on the probe card fixing plate of the probe card test motherboard, the following steps:

[0015] Calibrating the probe card fixing plate horizontally.

[0016] In an embodiment, the step of calibrating the probe card fixing plate horizontally comprises the following steps:

[0017] Placing a calibration jig on the probe card fixing plate, the calibration jig comprising a glass plate with a plurality of target points designed thereon;

[0018] Tracking and measuring each of the target points by a laser ranging module to obtain a measurement value of each of the target points;

[0019] If the difference between the measurement values of each of the target points exceeds a preset error range, adjusting the horizontal state of the probe card fixing plate by a leveling mechanism until the difference between the measurement values of each of the target points is within the preset error range.

[0020] In an embodiment, the method further comprises, the step of pressing the cover plate to the probe card fixing plate comprises the following steps:

[0021] Closing the cover plate and locking a locking device of the probe card test motherboard, the locking device being used to lock the cover plate and the probe card fixing plate.

[0022] In an embodiment, the method further comprises the following steps:

[0023] When the cover plate and the probe card fixing plate are being pressed, performing a vacuum suction operation by a vacuum suction device arranged on the probe card fixing plate.

[0024] In an embodiment, the method further comprises, the step of testing the communication of the line between the test machine and the probe card comprises the following steps:

[0025] Providing a test matrix, and connecting each test channel of the test matrix to the test machine and the horn joint respectively;

[0026] Providing a source measurement unit, and connecting the source measurement unit to the test matrix;

[0027] Applying a preset current value to each test channel by the source measurement unit;

[0028] Determining whether the line between the test machine and the probe card is in communication according to the measurement values of each test channel measured by the source measurement unit.

[0029] In an embodiment, the method further comprises the following steps:

[0030] After the performance test of the probe card is completed, the cover plate is opened, and a new probe card is placed on the probe card fixing plate;

[0031] The cover plate is pressed onto the probe card fixing plate, and the new probe card is subjected to a performance test by the probe test device.

[0032] The probe performance test method provided in the application has at least the following technical effects:

[0033] By connecting the horn joint of the probe card test motherboard with the test machine, the resources of the test machine are transmitted to the horn joint, then the cover plate of the probe card test motherboard is opened, the probe card to be tested is placed on the probe card fixing plate of the probe card test motherboard, and the cover plate is pressed onto the probe card fixing plate, so that the conductive connecting piece of the cover plate and the probe are electrically connected; finally, the performance of the probe on the probe card is tested by the probe test device. The probe card test motherboard of the embodiment integrates the horn joint and the conductive connecting piece, and transmits the resources of the test machine to the probe through the horn joint and the conductive connecting piece, without connecting each pin on the probe card to the corresponding resource port of the test machine one by one through a cable, so that fast and stable connection between the probe and the test machine can be realized, thereby enabling the probe test to be smoothly and efficiently carried out, and greatly improving the probe performance test efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0034] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the application and, together with the specification, serve to explain the principles of the application.

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the accompanying drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, those skilled in the art can obtain other drawings according to these drawings without any creative effort.

[0036] Figure 1 A structural schematic diagram of a probe performance test system to which the probe performance test method of the application is applied;

[0037] Figure 2 A structural schematic diagram of one embodiment of a probe card test motherboard to which the probe performance test method of the application is applied;

[0038] Figure 3 An exploded schematic diagram of a cover plate of a probe card test motherboard provided in the application;

[0039] Figure 4 A Figure 3 A local enlarged view of position A in FIG. 8;

[0040] Figure 5 This is a schematic diagram of the cover plate in one embodiment of the probe card test structure provided in this application;

[0041] Figure 6 This is a schematic diagram showing the positional relationship between the through hole and the step in the probe card test structure provided in this application.

[0042] Figure 7 A schematic diagram of the probe card fixing plate in one embodiment of the probe card test structure provided in this application;

[0043] Figure 8 This is a flowchart illustrating one embodiment of the probe performance testing method of this application;

[0044] Figure 9 This is a structural block diagram of the line connectivity testing system provided in this application. Detailed Implementation

[0045] It should be understood that the specific embodiments described herein are merely illustrative of the technical solutions of this application and are not intended to limit this application.

[0046] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0047] In related technical solutions, when connecting the probe card to the testing machine, each pin on the probe card must be connected to the corresponding interface or terminal of the testing machine via cables. If the probe card needs to be replaced, the operator must strictly follow the pin definitions and reconnect all cables, which is a cumbersome process.

[0048] To address the aforementioned problems, this application provides a probe card test motherboard. This probe test motherboard can be applied to a probe testing system. Please refer to... Figure 1 , Figure 1 A structural diagram of the probe testing system is shown. This probe testing system includes a probe card test motherboard M1 ( Figure 1 Only the probe card fixing plate on the probe card test motherboard is shown (see related content below for the specific structure of the probe card test motherboard), leveling mechanism M2, probe testing device M3, and testing device positioning mechanism M4 are shown. The probe card test motherboard M1 is used to place and fix the probe card.

[0049] The leveling mechanism M2 is used to adjust and position the probe card fixing plate in the probe card test motherboard M1.

[0050] The probe testing device M3 is used for testing mechanical performance and electrical performance of the probe, and comprises a testing platform, an electrical performance testing mechanism and a pressure testing mechanism arranged on the testing platform, and a visual detection mechanism, the testing platform is used for contacting with the probe to be tested, so that the electrical performance testing mechanism and the pressure testing mechanism test the probe to be tested, and the visual detection mechanism is used for visually detecting the probe to be tested.

[0051] Preferably, the leveling mechanism M2 comprises a vertical sliding rail M21, an extension arm M22, a fixed plate lifting mechanism M23, a fixed plate overturning mechanism M24 and a plurality of fixed plate positioning assemblies, the vertical sliding rail M21 is provided with a movable part, the extension arm M22 is fixedly connected to the movable part, and the fixed plate lifting mechanism M23 drives the movable part to move up and down along the vertical sliding rail M21; the fixed plate overturning mechanism M24 is arranged at the end of the extension arm M22, the extension arm M22 is connected to the probe card fixed plate through the fixed plate overturning mechanism M24, and the fixed plate overturning mechanism M24 drives the probe card fixed plate to overturn up and down; each fixed plate positioning assembly comprises one fixed plate vacuum chuck M25 and one positioning tower vacuum lock, the plurality of fixed plate vacuum chucks M25 are uniformly arranged at the edges of the probe card fixed plate, and the positioning tower vacuum lock is fixedly arranged on the equipment support; during testing, the positioning tower vacuum lock locks the fixed plate vacuum chuck M25 to fix the probe card fixed plate.

[0052] Specifically, the probe card is mounted on the probe card testing motherboard M1, the fixed plate overturning mechanism M24 rotates the probe card fixed plate, so that the probes on the probe card are downward and face the probe testing device M3; the fixed plate lifting mechanism M23 is used for adjusting the height of the probe card fixed plate, and the plurality of fixed plate positioning assemblies are used for fixing the probe card fixed plate.

[0053] Preferably, the probe testing device M3 is installed above the testing device positioning mechanism M4 and moves with the testing device positioning mechanism M4; the testing device positioning mechanism M4 comprises a Y-axis module M41, an X-axis module M42 and a Z-axis module M43 arranged in sequence from bottom to top, wherein the X-axis module M42 and the Y-axis module M41 drive the probe testing module M43 to move in the horizontal direction, and the Z-axis module M43 drives the probe testing device M3 to move in the vertical direction.

[0054] Preferably, the Z-axis module M43 comprises an upper sliding block, a lower sliding block and an L-shaped support, the upper sliding block and the lower sliding block are in contact through a slope with a predetermined inclination; the L-shaped support comprises a vertical guide plate and a horizontal guide plate arranged perpendicularly to each other, the upper sliding block and the lower sliding block move along the guide rails on the vertical guide plate and the horizontal guide plate respectively, and when the lower sliding block moves along the horizontal guide plate, the upper sliding block is driven to move up and down along the vertical guide plate.

[0055] Specifically, the Z-axis module M43 converts the vertical lifting movement into horizontal movement by two sliding assemblies in contact with each other on an inclined surface, and increases the accuracy of the vertical movement of the probe test module.

[0056] The contact surface between the upper sliding block and the lower sliding block is an inclined surface, and the inclination angle and length of the inclined surface determine the ratio of the displacement distance between the upper sliding block and the lower sliding block. The width of the lower sliding block is smaller than the width of the upper sliding block, so that the lower sliding block can move below the upper sliding block.

[0057] Specifically, the Z-axis module M43 further includes a Z-axis lifting motor and a Z-axis lifting screw, and the Z-axis lifting motor drives the lower sliding block to move horizontally through the Z-axis lifting screw. The inclined surface of the bottom surface of the upper sliding block has a first end and a second end, wherein the distance between the first end and the horizontal guide plate is greater than the distance between the second end and the horizontal guide plate. When the lower sliding block moves from the first end to the second end of the upper sliding block, the lower sliding block pushes the upper sliding block to move upwards, and when the lower sliding block moves from the second end to the first end of the upper sliding block, the lower sliding block drives the upper sliding block to move downwards.

[0058] Preferably, the visual detection mechanism includes a camera and an optical element, the camera adopts a telecentric lens, and the optical element is arranged corresponding to the telecentric lens to change the light reflected by the needle tip of the probe card, so that the telecentric lens obtains the image of the needle tip of the probe card.

[0059] Preferably, a needle pressure sensor and an electrical performance test sensor are arranged below the test platform for collecting needle pressure and electrical performance data of the probe.

[0060] The specific implementation of the probe card test motherboard of the embodiment of the present application will be described in detail below with reference to the accompanying drawings.

[0061] Please refer to Figures 2-5 The probe card test motherboard M1 of the embodiment includes a cover plate 1 and a probe card fixing plate 2 rotatably connected to the cover plate 1. The probe card fixing plate 2 is used to fix the probe card to be tested, and the cover plate 1 is provided with a horn joint 11 and a conductive connecting piece 15. The horn joint 11 is used to connect the test machine, and the horn joint 11 is electrically connected with the conductive connecting piece 15. Specifically, the conductive connecting piece 15 is provided with a plurality of conductive connecting pieces 15, and each conductive connecting piece 15 is arranged on the side of the cover plate 1 facing the probe card fixing plate 2. When the cover plate 1 is pressed to the probe card fixing plate 2, the conductive connecting piece 15 is electrically connected with the probe of the probe card.

[0062] In some embodiments, the cover plate 1 is rotatably connected to the probe card fixing plate 2 through a rotating seat 4.

[0063] Specifically, the horn connector 11 is a connector for crimping a ribbon cable. In this embodiment, the wire harness end of the horn connector 11 is used to connect to a test machine, and the plug-in end is used to electrically connect to the conductive connector 15. The plug-in end of the horn connector 11 can be implemented by a metal terminal. In some embodiments, the plug-in end can include an array of pins (i.e., surface gold-plated straight pins / bent pins).

[0064] In this embodiment, the horn connector 11 serves as an interface unit at the test machine end, and can access various resources of the test machine (including test signals, control signals, etc.). The plug-in end of the horn connector 11 is electrically connected to the conductive connector 15, so that the signals output by the test machine can be transmitted to the conductive connector 15 and, through the pressing operation of the cover plate 1, the mechanical pressure is used to form electrical contact between the conductive connector 15 and the tail end of the probe, so that the signals of the test machine are transmitted to the probe. The tail end of the probe refers to the area where the probe tail contacts the pad on the probe card. The flow direction of the test signal in the entire process is: test machine → horn connector → conductive connector → probe tail → probe tip.

[0065] Through the probe card test motherboard provided in this embodiment, the operator does not need to connect each pin on the probe card to each resource port of the test machine one by one through a cable, solving the problem of complicated connection between the probe card and the test machine in the traditional scheme, reducing the operation difficulty and the probability of error, and through the cooperation of the horn connector and the conductive connector, the signals of the test machine are switched to the conductive connector. When the cover plate is pressed to the probe card fixing plate, the conductive connector is electrically connected to the probe, so that the resources or signals of the test machine are transmitted to the probe, realizing the line communication between the probe and the test machine. At the same time, when the operator replaces the probe card, it is not necessary to reconnect the test machine cable. Only by opening the cover plate and placing the new probe card on the probe card fixing plate, and then closing the cover plate, the electrical connection between the new probe card and the test machine can be realized, the probe card can be replaced and tested faster, the test period is greatly shortened, and the test efficiency is improved.

[0066] In some embodiments, the probe card fixing plate 2 is provided with a positioning pin 25 for positioning the probe card to be placed.

[0067] In some embodiments, the cover plate 1 adopts a composite multi-layer structure. Specifically, please refer to Figures 2-4 , the cover plate 1 includes a top layer 12, an intermediate interconnection layer 13, and a connector mounting layer 14. The top layer 12 is provided with the horn connector 11, the wire harness end of the horn connector 11 is used to connect to the test machine, the plug-in end of the horn connector 11 penetrates through the top layer 12 and is welded on the intermediate interconnection layer 13, the connector mounting layer 14 is electrically connected to the intermediate interconnection layer 13, and the side of the connector mounting layer 14 facing the probe card fixing plate 2 is provided with the conductive connector 15.

[0068] Specifically, the upper surface of the top layer 12 is provided with an array of mounting slots, each of which is used to mount a horn joint 11. The middle interconnection layer 13 is a printed circuit board, and the plug-in end of the horn joint 11 is welded to the printed circuit board through a solder pad to achieve electrical connection between the plug-in end of the horn joint 11 and the middle interconnection layer 13. The middle interconnection layer 13 is electrically connected to the connector mounting layer 14 through a wiring structure and via design. The connector mounting layer 14 is provided with a needle plate 141, and the needle plate 141 is provided with a plurality of through holes 16 arranged and distributed in a row. The size of the through holes 16 matches the conductive connectors 15. The conductive connectors 15 are mounted on the through holes 16, and the electrical connection part of the conductive connectors 15 protrudes from the surface of the connector mounting layer 14. The surface of the electrical connection part of the conductive connectors 15 is treated by gold plating or silver plating process to improve the electrical conductivity and corrosion resistance of the conductive connectors 15, so as to ensure stable electrical connection during long-term use.

[0069] In some embodiments, the conductive connectors 15 are provided in a plurality, and the plurality of conductive connectors 15 match the arrangement of the probes on the probe card to ensure that, during the process of pressing the cover plate 1 to the probe card fixing plate 2 in the vertical direction, each conductive connector 15 can be in one-to-one contact with the tail connection end of the corresponding probe to form a stable electrical connection, thereby ensuring the complete transmission of the test signal between the probe and the test machine.

[0070] In some embodiments, the conductive connectors 15 are elastic conductive connectors. During the pressing operation of the cover plate 1, the spring structure built-in the elastic conductive connector is compressed under the action of the pressing force. Through this compression deformation design, a continuous and uniform pressure can be generated in the direction from the cover plate 1 to the probe card fixing plate 2, which can make the elastic conductive connector tightly fit the surface of the probe card, effectively eliminating the small gap and mechanical vibration influence of the contact surface. Through the synergistic effect of the mechanical positioning structure and the elastic compensation mechanism, each conductive connector 15 can be in contact with the tail connection end of the probe, not only ensuring the stable electrical contact between the conductive connector 15 and the probe, but also dynamically adapting to the small displacement caused by mechanical vibration, thereby ensuring the continuity and stability of signal transmission.

[0071] Preferably, the conductive connectors 15 are spring needles. A spring needle is a kind of connection terminal that realizes elastic expansion and contraction contact by using a built-in spring. The spring needle is composed of a needle tube, a needle head and a spring. The elastic force generated by the spring ensures that the needle head and the tail connection end of the probe maintain reliable and low-resistance electrical connection. After the pressure is released, the spring pushes the needle head back to the original position.

[0072] Please refer to Figure 7In some preferred embodiments, a boss 7 is arranged at the position of each through hole 16 of the needle plate 141, the boss 7 is in the shape of a truncated cone as a whole and is arranged around the through hole 16, coaxial with the through hole 16, the inner diameter of the upper surface of the boss 7 is slightly larger than the outer diameter of the conductive connecting piece 15 to form a certain guiding gap. Taking the conductive connecting piece 15 as a spring needle for example, when the spring needle is inserted into the through hole 16, the boss 7 can guide the spring needle to accurately enter the predetermined position, avoiding the inclination or position deviation of the spring needle due to installation deviation. At the same time, the boss 7 can also play a certain limiting role. During the pressing process of the cover plate 1, the spring needle will be subjected to a certain pressure and there is a risk of excessive movement in the vertical direction. Through the design of the boss 7, when the spring needle moves downward to a certain extent, the spring needle can be limited to avoid the misalignment of the tail end of the spring needle and the probe due to the angle deviation of the spring needle, which ensures that the contact between the spring needle and the probe always remains in the correct position and angle, ensuring the stability and reliability of signal transmission.

[0073] Please refer to Figure 2 In some embodiments, the probe card test motherboard further comprises a locking device 3 for locking the cover plate 1 and the probe card fixing plate 2.

[0074] Specifically, please refer to Figure 2 The locking device 3 comprises a handle assembly 31 arranged on the cover plate 1 and an embedded hole 32 arranged on the upper surface of the probe card fixing plate 2. In some embodiments, the handle assembly 31 comprises a handle and a connecting rod, the handle is provided with anti-slip texture, and the connecting rod penetrates the upper cover plate 1 and extends downward. The bottom of the connecting rod is provided with a protruding block for cooperating with the corresponding embedded hole on the probe card fixing plate 2. The handle assembly 31 and the embedded hole 32 can comprise a plurality of, and the position of the protruding block of each handle assembly 31 corresponds to the position of the embedded hole 32, so that the protruding block can be clamped on the embedded hole 32. Preferably, the number of handle assemblies 31 and embedded holes 32 is 2, and the two handle assemblies 31 are symmetrically arranged at the edges of the upper surface of the cover plate 1, and the two embedded holes 32 are symmetrically arranged at the edges of the probe card fixing plate 2.

[0075] In some embodiments, the handle assembly 31 comprises a handle and a threaded connecting rod, the handle is provided with a non-slip texture, and the threaded connecting rod penetrates through the cover plate 1 and extends downward. The threaded connecting rod is provided with threads matched with the corresponding screw holes on the probe card fixing plate 2. The specifications and pitches of the threads are matched with the corresponding screw holes on the probe card fixing plate 2, which ensures that the threads can be smoothly screwed into the screw holes and achieve reliable locking connection. When locking the cover plate 1 and the probe card fixing plate 2, the operator places the cover plate 1 on the probe card fixing plate 2, aligns the threaded connecting rod with the corresponding screw holes. Then, rotate the handle, the threaded connecting rod gradually screws into the screw hole with the rotation of the handle, as the screwing depth increases, the gap between the cover plate 1 and the probe card fixing plate 2 gradually decreases, until they are tightly fitted, achieving locking.

[0076] In some embodiments, the probe card fixing plate 2 is provided with a vacuum suction device for suctioning the cover plate 1 by vacuum suction when the cover plate 1 and the probe card fixing plate 2 are pressed together.

[0077] Please refer to Figure 7 , the vacuum suction device comprises a pipeline interface 21, a suction hole 22, a vacuum pipeline (not shown in the figure) and a sealing ring (not shown in the figure). Among them, the pipeline interface 21 is used to connect the vacuum pump; the suction hole 22 is arranged on the surface of the probe card fixing plate 2, the vacuum pipeline is arranged inside the probe card fixing plate 2, and the vacuum pipeline is in communication with the pipeline interface 21 and the suction hole 22, and the sealing ring is arranged around the suction hole 22.

[0078] Specifically, the pipeline interface 21 is arranged at the edge, side or bottom of the upper surface of the probe card fixing plate 2, and the inner diameter size is matched with the outer diameter of the vacuum pump output pipeline, so as to ensure tight connection and no leakage, and ensure stable operation of the vacuum suction device.

[0079] The suction hole 22 is arranged in the contact area of the surface of the probe card fixing plate 2 and the cover plate 1. The number of suction holes 22 can be designed according to the specific size of the probe card fixing plate 2. For example, for small probe card fixing plate 2, 2-4 suction holes 22 can be arranged, and for large probe card fixing plate, the number of suction holes 22 can be designed to be 6-10 or even more.

[0080] Further, in order to ensure that the cover plate 1 is uniformly stressed during pressing, and to avoid poor sealing due to uneven local stress, two suction holes 22 are symmetrically designed on the probe card fixing plate 2. Through this symmetrical layout, the vacuum suction force can be uniformly distributed on the contact surface between the cover plate 1 and the probe card fixing plate 2, improving the stability and reliability of the suction. Preferably, the suction holes 22 can be symmetrically designed around the placement area of the probe card.

[0081] Preferably, the suction hole 22 is designed in a circular shape, which can reduce air resistance.

[0082] The sealing ring corresponds to the adsorption hole 22 and is arranged on the surface of the probe card fixing plate 2 around the adsorption hole 22. By designing the sealing ring around the adsorption hole 22, the small gap between the cover plate 1 and the probe card fixing plate 2 can be filled to prevent vacuum leakage. The sealing ring can be made of rubber materials such as silicone rubber, fluorine rubber, etc.

[0083] Further, to optimize the performance of the sealing ring, reduce the friction coefficient between the sealing ring and the cover plate 1, and reduce the wear caused by friction, the surface of the sealing ring can be coated with silicone oil or fluorine lubricant. Silicone oil has good lubricity and chemical stability, and fluorine lubricant has higher temperature resistance and chemical corrosion resistance.

[0084] Through the symmetrical layout of the adsorption holes and the optimized design of the sealing ring, the cover plate can be uniformly stressed and tightly attached to the probe card fixing plate during the cover plate pressing process. At the same time, the vacuum pump provides a stable vacuum source to the vacuum pipeline through the pipeline interface, so that a negative pressure is formed at the adsorption hole, and the cover plate is firmly adsorbed on the fixing plate. This design enables the contact surface of the cover plate to be tightly attached to the probe card, ensuring that the signal of the conductive connector can be reliably transmitted to the tail end of the probe, realizing reliable electrical connection between the probe and the test machine.

[0085] Please refer to Figure 8 , Figure 8 is a flowchart of the probe performance test method provided in this embodiment. The probe performance test method of this embodiment includes steps S10-S40:

[0086] Step S10, connect the horn joint of the probe card test motherboard to the test machine.

[0087] Specifically, the wire harness end of the horn joint is connected to the port of the test machine through the test machine cable.

[0088] Step S20, open the cover plate of the probe card test motherboard, and place the probe card to be tested on the probe card fixing plate of the probe card test motherboard.

[0089] The probe card test motherboard in this embodiment includes a locking device for locking the cover plate and the probe card fixing plate. Specifically, if the locking device of the probe card test motherboard is in the unlocked state, the cover plate is opened; if the locking device of the cover plate is in the locked state, the locking device is unlocked and the cover plate is opened.

[0090] Step S30, press the cover plate to the probe card fixing plate, so that the conductive connector of the cover plate and the probe card are electrically connected.

[0091] In the embodiment, the probe card fixing plate is further provided with a vacuum suction device. When the cover plate is pressed against the probe card fixing plate, the vacuum suction device on the probe card fixing plate is used to perform a vacuum suction operation. After the vacuum suction operation, the cover plate and the probe card fixing plate are locked by the locking device.

[0092] Further, the probe card fixing plate is provided with pressure sensors. The number of the pressure sensors is at least two. Preferably, the number of the pressure sensors is four. The four pressure sensors are symmetrically arranged at the four corners of the probe card fixing plate with the center of the probe card fixing plate as the reference. When the cover plate is pressed, the pressure values detected by the four pressure sensors on the probe card fixing plate can intuitively reflect the distribution of the pressure on the probe card fixing plate.

[0093] In some embodiments, the pressing process of the cover plate against the probe card fixing plate can include:

[0094] In step a1, the pipeline interface of the vacuum suction device is connected to the vacuum pump through a conduit, and the zero point of each pressure sensor on the probe card fixing plate is calibrated.

[0095] In step a2, the cover plate is closed, and the threaded connecting rod of the locking device is inserted into the corresponding screw hole on the probe card fixing plate.

[0096] In the embodiment, the locking device includes a handle and a threaded connecting rod. The threaded connecting rod extends downward through the cover plate. The threaded connecting rod is provided with threads for cooperating with the corresponding screw hole on the probe card fixing plate. When the cover plate is closed, the tail of the threaded connecting rod is inserted into the corresponding screw hole, thereby achieving the clamping of the cover plate against the probe card fixing plate.

[0097] In step a3, the vacuum pump is started to perform a vacuum suction operation. The pressure values detected by the pressure sensors are monitored. If the difference between the pressure values is within the preset pressure error range, the vacuum suction operation is stopped. If the difference between the pressure values is not within the preset pressure error range, the handle is rotated to adjust the depth of the threaded connecting rod inserted into the screw hole until the difference between the pressure values is within the preset pressure error range, and the vacuum suction operation is stopped.

[0098] Specifically, if the difference between the pressure values is within the preset pressure error range, it indicates that the pressure distribution between the cover plate and the probe card fixing plate is uniform, at which time the vacuum adsorption operation can be stopped. If the difference between the pressure values is not within the preset pressure error range, it indicates that the pressure distribution is not uniform, the handle of the handle assembly is then rotated to adjust the screwing depth between the threaded connecting rod and the screw hole, thereby changing the contact pressure between the connecting rod and the screw hole, and further adjusting the pressure applied to the probe card fixing plate, until the difference between the pressure values detected by the respective pressure sensors is relatively small, to ensure that the pressure between the cover plate and the probe card fixing plate is uniformly distributed, avoid affecting the electrical connection performance of the spring needle and the probe contact due to uneven pressure, and thereby cause the signal transmitted to the probe by the test machine to be unstable.

[0099] Step S40, performance testing of the probes of the probe card is performed by the probe testing device.

[0100] Specifically, the probe card testing device includes a test platform and an electrical performance testing mechanism and a pressure testing mechanism and a visual detection mechanism arranged on the test platform. During testing, the test platform is moved by the testing device positioning device to contact the probes on the probe card, the visual detection structure is used to obtain the needle tip image of the probe card, and the probe position and needle tip diameter are obtained by analyzing the needle tip image, thereby completing the position and needle tip diameter testing of the probe. In addition, a certain pressure value can be applied to the probe by the pressure testing mechanism arranged on the test platform to complete the pressure testing of the probe.

[0101] The embodiment transmits the resources of the test machine to the probe through the horn joint and the conductive connecting piece, without connecting each pin of the probe card to the corresponding resource port of the test machine one by one through a cable, so that the probe and the test machine can be quickly connected, thereby enabling the probe testing to be smoothly and efficiently carried out, and greatly improving the probe performance testing efficiency.

[0102] In a preferred embodiment, before placing the probe card to be tested on the probe card fixing plate of the probe card test motherboard, the method further comprises:

[0103] The probe card fixing plate is horizontally calibrated.

[0104] Specifically, before testing, a calibration jig is placed on the probe card fixing plate, the calibration jig includes a glass plate, and a plurality of target points are designed on the glass plate; each target point is tracked and measured by a laser ranging module to obtain a measurement value of each target point; if the difference between the measurement values of each target point exceeds a preset error range, the horizontal state of the probe card fixing plate is adjusted by a leveling mechanism until the difference between the measurement values of each target point is within the preset error range.

[0105] In an alternative embodiment, the method further comprises, before testing the performance of the probe card by the probe testing device:

[0106] testing the continuity of the lines between the tester and the probe card.

[0107] The execution steps of the line continuity test may include, for example:

[0108] providing a test matrix, and connecting each test channel of the test matrix to the tester and the horn connector of the probe card test motherboard respectively;

[0109] providing a source measurement unit, and connecting the source measurement unit to the test matrix;

[0110] applying a preset current value to each test channel by the source measurement unit;

[0111] determining whether the lines between the tester and the probe card are continuous according to the measurement values of each test channel measured by the source measurement unit.

[0112] Please refer to Figure 9 , Figure 9 The structure diagram of the line continuity test system is shown. The line continuity test system includes a test matrix and a source measurement unit, and the test matrix is connected to the tester and the horn connector of the probe card test motherboard respectively. The positive and negative poles of the source measurement unit are connected to the test matrix, and the source measurement unit is connected to the tester. The test matrix includes a plurality of test channels, and each test channel corresponds to the channel of each probe on the probe card and the corresponding resource port of the tester.

[0113] In specific implementation, the tester sends a control instruction to the test matrix to control the opening of the channel switch of the corresponding test channel. Each test channel is equipped with an independent channel switch. After selecting a test channel, the tester further controls the source measurement unit to output a preset current value. The source measurement unit outputs the preset current to the selected test channel according to the instruction of the tester. The source measurement unit accurately measures the current flowing through the test channel and feeds back the measured measurement value to the tester. The tester analyzes and judges according to the received measurement value: if the measurement value is within the preset range, it means that the line between the probe corresponding to the test channel and the corresponding resource port of the tester is in good continuity, and the signal can be normally transmitted. If the measurement value exceeds the preset range, for example, the current value is too small or almost zero, it means that there is a line continuity problem in the test channel.

[0114] Through the above scheme, the continuity of the lines between the tester and the probe card can be comprehensively detected, and potential connection problems can be found and located in time.

[0115] In an alternative embodiment, the probe performance testing method may further include:

[0116] After the performance test of the probe card is completed, the cover plate is opened, and a new probe card is placed on the probe card fixing plate;

[0117] The cover plate is pressed onto the probe card fixing plate, and the new probe card is subjected to a performance test by the probe test device.

[0118] In an alternative embodiment, the probe performance test method can further include:

[0119] When the probe card is subjected to a performance test by the probe test device, the test data of each probe on the probe card is synchronously collected and stored in the cloud server;

[0120] Based on the test data stored in the cloud server, a performance test report of the probe card is generated, and the performance test report includes the performance parameters of each probe, test result analysis, and comparison with historical test data.

[0121] The performance test report is evaluated by a preset data analysis algorithm to determine whether the probe card has a performance anomaly;

[0122] If there is a performance anomaly, a corresponding anomaly diagnosis report is generated and sent to a designated terminal device.

[0123] Specifically, during the performance test of the probe card by the probe test device, the performance parameter data of each probe, such as the contact resistance, on-off time, and signal transmission delay of the probe, is obtained in real time by means of the data acquisition module. The data acquisition module is connected to each test point of the probe card and can collect data at high frequency and high precision. The collected data is transmitted to the cloud server in real time through an encrypted network transmission protocol, such as the SSL / TLS protocol. The cloud server uses a distributed storage architecture to store data on multiple physical nodes to ensure the security and reliability of the data. At the same time, time stamp, probe identification, and other metadata information are added to each data during storage to facilitate subsequent queries and analysis.

[0124] Based on the test data stored in the cloud server, the system calls the report generation module. This module first cleans and preprocesses the data, removing duplicate data and outliers. Then, according to the pre-set report template, it performs statistical analysis on the performance parameters of each probe, calculates the mean, standard deviation, and other statistical quantities, and visually displays the stability of the probe performance. In terms of test result analysis, by comparing with the standard performance indicators, it judges whether each probe is qualified or not, and presents the results in the form of charts (such as bar charts, line charts) and text. At the same time, it compares the current test data with the historical test data, analyzes the trend of probe performance, such as by comparing the contact resistance changes of the same probe in different batches of tests, to judge whether its performance has declined. Finally, it integrates all the analysis results to generate a complete performance test report containing the performance parameters of each probe, test result analysis, and comparison with historical test data.

[0125] After generating the performance test report, the system starts the pre-set data analysis algorithms to evaluate the report. These algorithms are based on machine learning or statistical principles, such as using trained classification models (such as support vector machines, random forests) to judge whether the probe card has performance abnormalities, or calculating the confidence interval of the data to identify abnormal data points. If the algorithm judges that there is a performance abnormality, the anomaly diagnosis module will further analyze the abnormal reason, such as through association analysis to find the relationship between the performance abnormal probe and other related factors (such as test environment temperature, probe usage frequency), and generate a detailed abnormal diagnosis report. This report contains abnormal phenomenon description, possible cause analysis, and recommended solutions. Finally, the system sends the abnormal diagnosis report to the designated terminal device, such as the engineer's computer, mobile phone APP, through email, message push, etc., so that relevant personnel can handle it in time.

[0126] Among them, the data acquisition module can include a signal acquisition front end, a signal conditioning circuit, a data processing unit, and a data transmission interface. The signal acquisition front end is connected to each probe of the probe card, used to acquire the electrical signal in real time during the probe performance test process; the acquired signal is transmitted to the signal conditioning circuit, which amplifies, filters, and processes the signal to improve the signal quality; the processed signal enters the data processing unit, which performs preliminary analysis and processing on the signal and adds metadata information such as time stamp and probe identification; finally, the processed data is transmitted to the cloud server in an encrypted manner through the data transmission interface, realizing real-time storage of test data. The data acquisition module adopts modular design, and each component cooperates with each other to ensure accurate acquisition and efficient transmission of test data.

[0127] The traditional scheme needs to be pulled out and reconnected when replacing the probe card, which is not only complicated to operate, but also easy to cause connection error or signal interference due to human error. The probe performance test method provided by the embodiment does not need to be pulled out and reconnected, and the operator only needs to simply open the cover, place the new probe card, and close the cover, so as to quickly realize the signal connection between the new probe and the tester. This convenient operation mode greatly shortens the probe card replacement time, improves the test efficiency, reduces the test failure risk caused by the cable connection problem, and guarantees the stability and reliability of the probe performance test.

[0128] The above is only part of the embodiments of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation, direct / indirect application in other related technical fields, or direct / indirect application in other related technical fields based on the technical concept of the present application, and the contents of the specification and drawings are included in the patent protection scope of the present application.

Claims

1. A probe performance test method characterized by, The utility model relates to a probe card test motherboard and a test machine are connected through the horn joint of probe card test motherboard, Open the cover plate of the probe card test motherboard, place the calibration jig on the probe card fixing plate, the calibration jig comprises a glass plate, and a plurality of target points are designed on the glass plate, Track and measure each target point through the laser ranging module to obtain the measurement value of each target point, If the difference between the measurement values of each target point exceeds the preset error range, adjust the level of the probe card fixing plate through the leveling mechanism until the difference between the measurement values of each target point is within the preset error range, Place the probe card to be tested on the probe card fixing plate of the probe card test motherboard, wherein the probe card fixing plate is rotatably connected with the cover plate, Connect the pipeline interface of the vacuum suction device with the vacuum pump through the catheter, and calibrate the zero point of each pressure sensor arranged on the probe card fixing plate, Close the cover plate and insert the threaded connecting rod of the locking device into the corresponding screw hole on the probe card fixing plate; the locking device comprises a handle and a threaded connecting rod, the threaded connecting rod penetrates through the cover plate and extends downward, and the threaded connecting rod is provided with threads for matching with the corresponding screw hole on the probe card fixing plate; when the cover plate is closed, the tail of the threaded connecting rod is embedded in the corresponding screw hole to realize the clamping of the cover plate and the probe card fixing plate; Start the vacuum pump, perform vacuum suction, and monitor the pressure values detected by each pressure sensor; if the difference between the pressure values is within the preset pressure error range, stop the vacuum suction operation; If the difference between the pressure values is not within the preset pressure error range, rotate the handle to adjust the screwing depth between the threaded connecting rod and the screw hole until the difference between the pressure values is within the preset pressure error range, and stop the vacuum suction operation; Lock the cover plate and the probe card fixing plate through the locking device to make the conductive connecting piece of the cover plate and the probe card electrically connected; Test the performance of the probes on the probe card through the probe testing device. The cover plate of the probe card test motherboard is opened, including:

2. The probe performance test method of claim 1, wherein, If the locking device of the probe card test motherboard is in the unlocked state, open the cover plate, and the locking device is used to lock the cover plate and the probe card fixing plate. The method further comprises:

3. The probe performance test method of claim 2, wherein, If the locking device is in the locked state, unlock the locking device and open the cover plate. Before the performance of the probe card is tested through the probe testing device, further comprising:

4. The probe performance test method according to any one of claims 1 to 3, wherein, Test the communication between the test machine and the probe card. The communication between the test machine and the probe card is tested, including:

5. The probe performance test method of claim 4, wherein, Provide a test matrix, and connect each test channel of the test matrix with the test machine and the horn joint respectively; Provide a source measurement unit, and connect the source measurement unit with the test matrix; Apply a preset current value to each test channel through the source measurement unit; Determine whether the communication between the test machine and the probe card is connected according to the measurement values of each test channel measured by the source measurement unit. The method further comprises:

6. The probe performance test method of claim 1, wherein, ​ After the performance test of the probe card is completed, the cover plate is opened, and a new probe card is placed on the probe card fixing plate; The cover plate is pressed to the probe card fixing plate, and the new probe card is tested for performance by the probe test device.

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